INFINEON IRL7833SPBF Datasheet

Applications
Absolute Maximum Ratings
V
Conti n uous Drai n Cur r e nt, V
@ 10V
Pulsed Drain Current
Maximum Power Dissipation
Maximum Power Dissipation
Thermal Resistance
Case-to-Sin k , Fl at, Greas ed Surfac e
Junction-t o- Ambien t (P CB Mount)
l High Frequency Synchronous Buck
Converters for Computer Processor Power
l High Frequency Isolated DC-DC
Converters with Synchronous Rectification for Telecom and Consumer Use
l Lead-Free
Benefits
V
DSS
30V
PD - 95270
IRL7833PbF
IRL7833SPbF
IRL7833LPbF
HEXFET® Power MOSFET
R
DS(on)
3.8m
max
:
Qg
32nC
l Very Low RDS(on) at 4.5V V l Ultra-Low Gate Impedance l Fully Characterized Avalanche Voltage
GS
and Current
Parameter Units
DS
V
GS
@ TC = 25°C
I
D
ID @ TC = 100°C I
DM
PD @TC = 25°C
@TC = 100°C
P
D
T
J
T
STG
R
JC
θ
R
CS
θ
R
JA
θ
R
JA
θ
Drain-to-Sour ce Voltage V Gate-to-Source Volt age
GS
Conti n uous Drai n Cur r e nt, V
c
Linear D er ating Factor W/°C Operating Junction and °C
Stor ag e Temperat ur e Ra ng e Mount ing Torque, 6-32 or M 3 s c r ew
@ 10V
GS
g g
Parameter Typ. Max. Units
Junction-to-Case ––– 1.04
Junction-to-Ambient
h
g
TO-220AB
IRL7833
D2Pak
IRL7833S
TO-262
IRL7833L
Max.
30
± 20
f
150
f
110
600 140
72
0.96
-55 to + 175
y
in (1.1Nym)
10 lbf
h
0.50 ––– °C/W ––– 62 ––– 40
A
W
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IRL7833/S/LPbF
S
D
G
BV
V
/∆T
R
m
V
V
/∆T
I
I
Q
Q
Q
Q
Q
QswSwitch Charge (Q
+ Qgd)
Q
t
t
t
t
C
C
C
Avalanche Characteristics
EASSingle Pul se Av a la nc h e Energ y
IARAvalanche Current
EARRepeti ti ve Avalanche Energy
Diode Characterist ics
I
I
V
t
Q
Static @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units
DSS
∆Β
DSS
DS(on)
GS(th)
GS(th)
DSS
GSS
gfs Forward Tra nsconductance 150 ––– ––– S
g
gs1 gs2 gd godr
oss d(on) r d(off) f
iss
oss
rss
Drain-to-Sou r c e Br eakdown V ol t a ge 30 ––– ––– V Breakdown Voltag e Temp. Coefficient ––– 18 ––– mV/°C
J
Stat ic D r ai n- to-Sou rce On-Res i s tance ––– 3.1 3.8
––– 3.7 4.5 Gate Threshold Voltage 1.4 ––– 2.3 V Gate Th res hold Voltage Coe fficien t ––– -11 – –– mV/°C
J
Drain-to-Sou r c e Le akage Cur rent ––– ––– 1.0 µA
––– ––– 150 Gate-to-Sour c e Forward Lea k age ––– ––– 100 nA Gate-to-Sou rce Rever s e Le akage ––– ––– -100
Total Gate Charge ––– 32 47 Pre-Vth Gate-to-Source Charge ––– 8.7 ––– Post-Vth Gate-to-Source Charge ––– 5.1 ––– nC Gate-to-Drain Charge ––– 13 ––– Gate Cha r ge Ov e r dr i v e ––– 5.3 ––– See Fig. 16
gs2
––– 18 ––– Output Charge ––– 22 ––– nC Turn-On Delay Time ––– 18 ––– Rise Time ––– 50 ––– ns Turn-Off Delay Time ––– 21 ––– Fall Tim e ––– 6.9 –– – Input Capacitance ––– 4170 ––– Output Capacitance ––– 950 ––– pF Reverse Transfer Capacitance ––– 470 –––
Conditions
VGS = 0V, ID = 250µA Referen c e to 25°C, I
V
= 10V, ID = 38A
GS
V
= 4.5V, ID = 30A
GS
VDS = VGS, ID = 250µA
V
= 24V, VGS = 0V
DS
= 24V, VGS = 0V, TJ = 125°C
V
DS
V
= 20V
GS
= -20V
V
GS
= 15V, ID = 30A
V
DS
V
= 16V
DS
V
= 4.5V
GS
I
= 30A
D
= 16V, VGS = 0V
V
DS
= 15V, VGS = 4.5V
V
DD
ID = 26A Clampe d I n ductiv e Load
= 0V
V
GS
= 15V
V
DS
ƒ = 1.0MHz
= 1mA
D
f
f
f
S
SM
SD
rr
rr
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Parameter Units
dh
c
c
Typ.
––– ––– –––
Paramet e r Min. Typ . Max. Units
Contin uous Source Current ––– ––– (Body Diode) A
Pulsed Source Current ––– ––– 600 (Body Diode)
ch
Diode Forward Voltage ––– ––– 1.2 V Reverse Recovery Time ––– 42 63 ns Reverse Recovery Charge ––– 34 51 nC
150
f
Max.
560
30 14
mJ
A
mJ
Conditions
MOSFET symbol showing the
integral reverse p-n junct ion diode.
TJ = 25°C, IS = 30A, VGS = 0V
= 25°C, IF = 30A, VDD = 15V
T
J
di/dt = 100A/µs
f
f
IRL7833/S/LPbF
1000
) A
(
t
n
e
r
100
r
u C e
c
r
u
o S
-
o
t
-
n
10
i
a
r D
,
D
I
2.7V
20µs PULSE WIDTH Tj = 25°C
1
0.1 1 10 100 1000
VDS, Drain-to-Source Voltage (V)
1000
)
Α
(
t
n
e
r
r
u C e
c
r
100
u
o S
-
o
t
-
n
i
a
r D
,
D
I
TJ = 25°C
TJ = 175°C
V
= 15V
DS
20µs PULSE WIDTH
10
2.0 3.0 4.0 5.0 6.0 7.0 8.0
VGS, Gate-t o-Source Vol tage (V)
TOP 10V
BOTTOM 2.7V
VGS
7.0V
4.5V
3.7V
3.5V
3.3V
3.0V
1000
) A
(
t
n
e
r
100
r
u C e
c
r
u
o S
-
o
t
-
n
10
i
a
r D
,
D
I
2.7V
20µs PULSE WIDTH Tj = 175°C
1
0.1 1 10 100 1000
VDS, Drain-to-Source Voltage (V)
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
2.0
e
c
n
a
t
s
i
s
e R n O e
c
r
u
o S
-
o
t
-
n
i
a
r D
,
)
n
o
( S D
R
ID = 75A V
= 10V
GS
1.5
)
d
e
z
i
l
a m
r
o N
(
1.0
0.5
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
TJ , Junction Temperature (°C)
TOP 10V
BOTTOM 2.7V
VGS
7.0V
4.5V
3.7V
3.5V
3.3V
3.0V
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
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IRL7833/S/LPbF
100000
) F
10000
p
(
e
c
n
a
t
i
c
a
p
a C
,
1000
C
100
V
= 0V, f = 1 MHZ
GS
C
= C
= C
= C
+ Cgd, C
gs
gd
+ C
ds
iss
C
rss
C
oss
C
iss
C
oss
C
rss
1 10 100
VDS, Drain-to-Source Voltage (V)
SHORTED
ds
gd
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
1000.00
) A
(
100.00
t
n
e
r
r
u C n
i
a
r
10.00
D e
s
r
e
v
e R
,
1.00
D S
I
0.10
0.0 0.5 1.0 1.5 2.0 2.5 3.0
TJ = 25°C
VSD, Source-to-Drain Voltage (V)
TJ = 175°C
V
GS
= 0V
12.0 ID= 30A
)
10.0
V
( e
g
a
t
l
8.0
o V
e
c
r
u
6.0
o S
-
o
t
-
e
t
4.0
a G
,
S G
2.0
V
0.0 0 5 10 15 20 25 30 35 40
VDS= 24V VDS= 15V
Q
Total G ate Charge (nC)
G
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
1000
) A
(
t
100
n
e
r
r
u C e
c
r
10
u
o S
-
o
t
-
n
i
a
r
1
D ,
Tc = 25°C
D
I
Tj = 175°C Single Pulse
0.1 1 10 100
OPERATION IN THIS AREA LIMITED BY RDS(on)
100µsec
1msec
10msec
VDS, Drain-to-Source Voltage (V)
Fig 7. Typical Source-Drain Diode
Fig 8. Maximum Safe Operating Area
Forward Voltage
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