INFINEON IPP15N03L, IPB15N03L User Manual

DS
DS(on)
D
DS(on)
DS(on)
jmax
AR
GS
j
stg
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OptiMOSBuck converter series
Feature
N-Channel
Logic Level
Low On-Resistance R
Excellent Gate Charge x R
Superior thermal resistance
175°C operating temperature
Avalanche rated
product (FOM)
IPP15N03L
IPB15N03L
Product Summary
max. SMD version 12.6 m
I
P- TO263 -3-2 P- TO220 -3-1
30 V
42 A
dv/dt rated
Ideal for fast switching buck converters
Type Package Ordering Code
IPP15N03L P- TO220 -3-1 Q67042-S4039 IPB15N03L P- TO263 -3-2 Q67040-S4344
Marking
15N03L 15N03L
Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter Symbol Value Unit
Continuous drain current
TC=25°C
1)
I
D
42
42
Pulsed drain current
TC=25°C
Avalanche energy, single pulse
ID=20A, VDD=25V, RGS=25
I
D puls
AS
168
20 mJ
Repetitive avalanche energy, limited by T Reverse diode dv/dt
IS=42A, VDS=-V, di/dt=200A/µs, T
jmax
=175°C
2)
dv/dt
Gate source voltage V Power dissipation
TC=25°C
Operating and storage temperature T
tot
, T
8 6 kV/µs
±20
83 W
-55... +175
IEC climatic category; DIN IEC 68-1 55/175/56
Page 1
°C
2003-01-17
IPP15N03L
thJC
IPB15N03L
Thermal Characteristics Parameter Symbol Values Unit
min. typ. max.
Characteristics
Thermal resistance, junction - case R SMD version, device on PCB:
@ min. footprint @ 6 cm2 cooling area
3)
R
thJA
- 1.2 1.8 K/W
-
-
-
-
62 40
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
VGS=0V, ID=1mA
Gate threshold voltage, VGS = V
ID=40µA
Zero gate voltage drain current
VDS=30V, VGS=0V, Tj=25°C VDS=30V, VGS=0V, Tj=125°C
DS
(BR)DSS
GS(th)
I
DSS
30 - - V
1.2 1.6 2
-
-
0.01 10
1
100
µA
Gate-source leakage current
VGS=20V, VDS=0V
Drain-source on-state resistance
VGS=4.5V, ID=21A VGS=4.5V, ID=21A, SMD version
Drain-source on-state resistance
VGS=10V, ID=21A VGS=10V, ID=21A, SMD version
1
Current limited by bondwire ; with an R
information see app.-note ANPS071E available at www.infineon.com/optimos 2
Defined by design. Not subject to production test.
3
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
= 1.8K/W the chip is able to carry ID= 64A at 25°C, for detailed
thJC
I
GSS
R
DS(on)
R
DS(on)
- 1 100 nA
-
-
-
-
14.9
14.5
10.3
9.9
19.9
19.6
12.9
12.6
m
Page 2
2003-01-17
IPP15N03L
iss
oss
rss
G
d(on)
r
d(off)
f
gs
gd
(plateau)
SM
SD
rr
rr
IPB15N03L
Electrical Characteristics Parameter Symbol Conditions Values Unit
min. typ. max.
Dynamic Characteristics
Transconductance g
Input capacitance C Output capacitance C Reverse transfer capacitance C Gate resistance R Turn-on delay time t Rise time t Turn-off delay time t Fall time t
Gate Charge Characteristics
Gate to source charge Q Gate to drain charge Q Gate charge total Q
VDS≥2*ID*R ID=42A
VGS=0V, VDS=25V, f=1MHz
DS(on)max
,
21 42 - S
- 850 1130 pF
- 330 330
- 90 130
- 1 -
VDD=15V, VGS=10V, ID=21A, RG=7.8
- 6.5 9.8 ns
- 20 30
- 24 36
- 14.5 21.8
VDD=15V, ID=21A - 2.7 3.6 nC
- 7.4 9.3
g
VDD=15V, ID=21A, VGS=0 to 5V
- 12.7 15.9
Output charge Q
Gate plateau voltage V
Reverse Diode
Inverse diode continuous
I
forward current Inv. diode direct current, pulsed I Inverse diode forward voltage V Reverse recovery time t Reverse recovery charge Q
oss
S
VDS=15V, ID=21A, VGS=0V
VDD=15V, ID=21A - 3.5 - V
TC=25°C - - 42 A
- 12.2 15.3 nC
- - 168
VGS=0V, IF=42A - 0.95 1.25 V VR=-V, I
diF/dt=100A/µs
F=lS
,
- 24 31 ns
- 18 23 nC
Page 3
2003-01-17
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