IKW25T120
TrenchStop Series
Low Loss DuoPack : IGBT in TrenchStop and Fieldstop
with soft, fast recovery anti-parallel EmCon HE diode
• Approx. 1.0V reduced V
and 0.5V reduced V
• Short circuit withstand time – 10µs
• Designed for :
- Frequency Converters
- Uninterrupted Power Supply
• TrenchStop and Fieldstop technology for 1200 V applications
®
offers :
- very tight parameter distribution
- high ruggedness, temperature stable behavior
• NPT technology offers easy parallel switching capability due to
positive temperature coefficient in V
• Low EMI
• Low Gate Charge
• Very soft, fast recovery anti-parallel EmCon HE diode
• Qualified according to JEDEC
• Pb-free lead plating; RoHS compliant
• Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/
Type
IC V
V
CE
CE(sat)
compared to BUP314D
F
CE(sat)
1
for target applications
CE(sat),Tj=25°C
T
Marking Code Package
j,max
technology
C
G
E
PG-TO-247-3-21
IKW25T120 1200V 25A 1.7V
150°C
K25T120 PG-TO-247-3-21
Maximum Ratings
Parameter Symbol Value Unit
V
Collector-emitter voltage
DC collector current
= 25°C
T
C
= 100°C
T
C
Pulsed collector current, tp limited by T
Turn off safe operating area
V
≤ 1200V, Tj ≤ 150°C
CE
Diode forward current
= 25°C
T
C
= 100°C
T
C
Diode pulsed current, tp limited by T
jmax
Gate-emitter voltage
Short circuit withstand time2)
VGE = 15V, V
≤ 1200V, Tj ≤ 150°C
CC
Power dissipation
= 25°C
T
C
Operating junction temperature
Storage temperature
I
jmax
I
CE
I
C
Cpuls
-
I
F
Fpuls
V
GE
t
SC
P
tot
T
j
T
stg
1200 V
50
25
A
75
75
50
25
75
±20
10
V
µs
190 W
-40...+150
°C
-55...+150
1
J-STD-020 and JESD-022
2)
Allowed number of short circuits: <1000; time between short circuits: >1s.
Power Semiconductors
1 Rev. 2.1 May 06
IKW25T120
TrenchStop Series
Soldering temperature, 1.6mm (0.063 in.) from case for 10s - 260
Power Semiconductors
2 Rev. 2.1 May 06
IKW25T120
TrenchStop Series
Thermal Resistance
Parameter Symbol Conditions Max. Value Unit
Characteristic
IGBT thermal resistance,
junction – case
Diode thermal resistance,
R
R
thJC
thJCD
0.65
K/W
1.0
junction – case
Thermal resistance,
R
thJA
40
junction – ambient
Electrical Characteristic, at T
Parameter Symbol Conditions
= 25 °C, unless otherwise specified
j
Value
Unit
min. typ. max.
Static Characteristic
Collector-emitter breakdown voltage
Collector-emitter saturation voltage
Diode forward voltage
Gate-emitter threshold voltage
Zero gate voltage collector current
Gate-emitter leakage current
Transconductance
Integrated gate resistor
V
(BR)CES
V
CE(sat)
V
VGE=0V, IF=25A
F
V
GE(th)
I
CES
VGE=0V, IC=500µA
VGE = 15V, IC=25A
T
=25°C
j
T
=125°C
j
T
=150°C
j
T
=25°C
j
T
=125°C
j
=150°C
T
j
IC=1mA,
V
CE=VGE
VCE=1200V,
VGE=0V
=25°C
T
j
=150°C
T
j
VCE=0V,VGE=20V
I
GES
VCE=20V, IC=25A
g
fs
R
Gint
1200 - -
-
-
-
-
-
-
1.7
2.0
2.2
1.7
1.7
1.7
2.2
2.2
5.0 5.8 6.5
-
-
-
-
0.25
2.5
- - 600 nA
- 16 - S
8
V
-
-
-
-
mA
Dynamic Characteristic
Input capacitance
Output capacitance
Reverse transfer capacitance
Gate charge
Internal emitter inductance
C
C
C
Q
L
iss
oss
rss
Gate
E
V
=25V,
CE
=0V,
V
GE
f=1MHz
VCC=960V, IC=25A
V
=15V
GE
- 1860 -
- 96 -
- 82 -
- 155 - nC
pF
- 13 - nH
measured 5mm (0.197 in.) from case
Short circuit collector current1)
1)
Allowed number of short circuits: <1000; time between short circuits: >1s.
I
C(SC)
=15V,tSC≤10µs
V
GE
= 600V,
V
CC
T
= 25°C
j
- 150 - A
Power Semiconductors
3 Rev. 2.1 May 06
IKW25T120
TrenchStop Series
Switching Characteristic, Inductive Load, at T
Parameter Symbol Conditions
=25 °C
j
Value
Unit
min. typ. max.
IGBT Characteristic
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Turn-on energy
Turn-off energy
Total switching energy
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
ts
T
=25°C,
j
V
=600V,IC=25A
CC
V
=0/15V,
GE
=22Ω,
R
G
2)
L
=180nH,
σ
2)
C
=39pF
σ
Energy losses include
“tail” and diode
reverse recovery.
- 50 -
ns
- 30 -
- 560 -
- 70 -
- 2.0 -
mJ
- 2.2 -
- 4.2 -
Anti-Parallel Diode Characteristic
t
Q
I
di
rr
rr
rrm
rr
/dt
T
=25°C,
j
V
=600V, IF=25A,
R
di
/dt=800A/µs
F
- 200 - ns
- 2.3 µC
- 21 A
- 390 -
A/µs
Diode reverse recovery time
Diode reverse recovery charge
Diode peak reverse recovery current
Diode peak rate of fall of reverse
recovery current during t
b
2)
Leakage inductance L
Power Semiconductors
an d Stray capacity Cσ due to dynamic test circuit in Figure E.
σ
4 Rev. 2.1 May 06
IKW25T120
TrenchStop Series
Switching Characteristic, Inductive Load, at Tj=150 °C
Parameter Symbol Conditions
Value
Unit
min. typ. max.
IGBT Characteristic
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Turn-on energy
Turn-off energy
Total switching energy
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
ts
T
=150°C
j
=600V,IC=25A,
V
CC
V
=0/15V,
GE
= 22Ω,
R
G
1)
L
=180nH,
σ
1)
C
=39pF
σ
Energy losses include
“tail” and diode
reverse recovery.
- 50 -
ns
- 32 -
- 660 -
- 130 -
- 3.0 -
mJ
- 4.0 -
- 7.0 -
Anti-Parallel Diode Characteristic
Diode reverse recovery time
Diode reverse recovery charge
Diode peak reverse recovery current
Diode peak rate of fall of reverse
recovery current during t
b
t
Q
I
di
rr
rr
rrm
rr
/dt
T
=150°C
j
=600V, IF=25A,
V
R
di
/dt=800A/µs
F
- 320 - ns
- 5.2 - µC
- 29 - A
- 320
A/µs
1)
Leakage inductance L
Power Semiconductors
an d Stray capacity Cσ due to dynamic test circuit in Figure E.
σ
5 Rev. 2.1 May 06