The information given in this data sheet shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device, Infineon Technologies
hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office or representatives (http://www.infineon.com). Warnings
Due to technical requirements components may contain dangerous substances. For information on the types
in question please contact your nearest Infineon Technologies Office or representatives.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or
system. Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
®
TrenchStop
CIPOS™, CoolMOS™, CoolSET™, DuoPack™, EmCon™ and thinQ!™ are trademarks of Infineon
Technologies AG.
is a registered trademark of Infineon Technologies AG.
Preliminary Data Sheet2/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
Table of Contents
CiPoS™ Control integrated Power System ..................................................................................................4
IGBT and Diode Section .............................................................................................................................8
Control Section............................................................................................................................................9
Circuit of a Typical Application.....................................................................................................................12
Test Circuits....................................................................................................................................................14
Preliminary Data Sheet3/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
CIPOS™
Control integrated Power System
Single In-Line Intelligent Power Module
3Φ-bridge 600V / 12A @ 25°C
Features
• Fully isolated Single In-Line molded module
®
• TrenchStop
• Optimal adapted EmCon™ diode for low EMI
• Integrated bootstrap diode and capacitor
• Rugged SOI gate driver technology with
stability against transient and negative voltage
• Temperature monitor and over temperature
shutdown
• Overcurrent shutdown
• Undervoltage lockout at all channels
• Matched propagation delay for all channels
• Low side emitter pins accessible for all phase
current monitoring (open emitter)
• Cross-conduction prevention
• Lead-free terminal plating; RoHS compliant
• Qualified according to JEDEC
temperature stress tests for 500h) for target
applications
IGBTs with lowest V
CE(sat)
1
(high
Target Applications
• Washing machines
• Consumer Fans and Consumer Compressors
Description
The CiPoS™ module family offers the chance for
integrating various power and control components
to increase reliability, optimize PCB size and
system costs.
This SIL-IPM is designed to control AC motors in
variable speed drives for applications like air
conditioning, compressors and washing
machines. The package concept is specially
adapted to power applications, which need
extremely good thermal conduction and electrical
isolation, but also EMI-save control and overload
protection. The features of Infineon TrenchStop
IGBTs and EmCon™ diodes are combined with a
new optimized Infineon SOI gate driver for
excellent electrical performance.
®
System Configuration
• 3 halfbridges with TrenchStop® IGBT & FW-
EmCon™ diodes
• 3Φ SOI gate driver
• Bootstrap diodes for high side supply
• Integrated 100nF bootstrap capacitance
• Temperature sensor, passive components for
adaptions
• Isolated heatsink
• Creepage distance 3.1mm
1
J-STD-020 and JESD-022
Preliminary Data Sheet4/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
Internal Electrical Schematic
V+ (10)
Tr1, U-HS
D1
Tr3, V-HS
D3
Tr5, W-HS
D5
VRU (12)
VRV (13)
VRW (14)
U, VS1 (8)
V, VS2 (5)
W, VS3 (2)
VB3 (1)
VB2 (4)
VB1 (7)
Dbs1-
Dbs3
Rbs
Tr2, U-LS
D2
RH1RL1RL2RH2RL3RH3
CbsH1CbsH2CbsH3
Tr4, V-LS
D4
Tr6, W-LS
D6
VDD (22)
/HIN1 (15)
/HIN2 (16)
/HIN3 (17)
/LIN1 (18)
/LIN2 (19)
/LIN3 (20)
ITRIP (21)
EN (24)
VSS (23)
Figure 1: Internal Schematic
VCC
/HIN1
/HIN2
/HIN3
/LIN1
/LIN2
/LIN3
R
Driver-IC
RTS
C2C1
For integrated
components see
Table
Preliminary Data Sheet5/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
Pin Assignment
Pin Number Pin NamePin Description
1 VB3 high side floating IC supply voltage
2 W,VS3 motor output W, high side floating IC supply offset voltage
3 n.a. None
4 VB2 high side floating IC supply voltage
5 V,VS2 motor output V, high side floating IC supply offset voltage
6 n.a. None
7 VB1 high side floating IC supply voltage
8 U,VS1 motor output U, high side floating IC supply offset voltage
9 n.a. None
10 V+ positive bus input voltage
11 n.a. None
12 VRU low side emitter
13 VRV low side emitter
14 VRW low side emitter
15 /HIN1 input gate driver high side 1/U
16 /HIN2 input gate driver high side 2/V
17 /HIN3 input gate driver high side 3/W
18 /LIN1 input gate driver low side 1/U
19 /LIN2 input gate driver low side 2/V
20 /LIN3 input gate driver low side 3/W
21 ITRIP input overcurrent shutdown
22 VDD module control supply
23 VSS module negative supply
24 EN input logic enable, output temperature monitoring
Pin Description
/HIN1,2,3 and /LIN1,2,3 (Low side and high
side control pins, Pin 15 - 20)
These pins are active low and they are
responsible for the control of the integrated IGBT
The Schmitt-trigger input threshold of them are
such to guarantee LSTTL and CMOS compatibility
down to 3.3V controller outputs. Pull-up resistor of
about 75 kOhm is internally provided to pre-bias
inputs during supply start-up and a zener clamp is
provided for pin protection purposes. Input
schmitt-trigger and noise filter provide beneficial
noise rejection to short input pulses.
It is recommended for proper work of CiPoS™ not
to provide input pulse-width lower than 1us.
The integrated gate drive provides additionally a
shoot through prevention capability which avoids
the simultaneous on-state of two gate drivers of
the same leg (i.e. HO1 and LO1, HO2 and LO2,
HO3 and LO3).
Figure 2: Input pin structure
Preliminary Data Sheet6/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
A minimum deadtime insertion of typ 325ns is also
provided, in order to reduce cross-conduction of
the external power switches.
EN (enable, Pin 24)
The signal applied to pin EN controls directly the
output stages. All outputs are set to LOW, if EN is
at LOW logic level. The internal structure of the
pin is the same as Figure 1 made exception of the
switching levels of the Schmitt-Trigger, which are
here V
typical propagation delay time is t
= 2.1 V and V
EN,TH+
= 1.32 V. The
EN,TH-
= 700 ns.
EN
Figure 3: Internal Circuit at pin EN
This pin may also be used for reading out the
temperature close to the gate drive IC. Please
refer to section “Integrated Components” for the
specification of the integrated parts.
ITRIP (Over-current detection function, Pin 21)
CiPoS™ provides an over-current detection
function by connecting the ITRIP input with the
motor current feedback. The ITRIP comparator
threshold (typ 0.45V) is referenced to VSS
ground. A input noise filter (typ: t
ITRIPMIN
= 225ns)
prevents the driver to detect false over-current
events.
Over-current detection generates a hard shut
down of all outputs of the gate driver after the
shutdown propagation delay of typically 690ns.
The fault-clear time is set to typically to 2ms.
VDD, VSS (control side supply and reference,
Pin 22, 23)
VDD is the low side supply and it provides power
both to input logic and to low side output power
stage. Input logic is referenced to VSS ground as
well as the under-voltage detection circuit.
The under-voltage circuit enables the device to
operate at power on when a supply voltage of at
least a typical voltage of V
= 11.9 V is at
DDUV+
least present.
The IC shuts down all the gate drivers power
outputs, when the VCC supply voltage is below
= 10.3 V. This prevents the external power
V
DDUV-
switches from critically low gate voltage levels
during on-state and therefore from excessive
power dissipation.
VB1,2,3 and VS1,2,3 (High side supplies, Pin 1,
2, 4, 5, 7, 8)
VB to VS is the high side supply voltage. The high
side circuit can float with respect to VSS following
the external high side power device
emitter/source voltage.
Due to the low power consumption, the floating
driver stage is supplied by an integrated bootstrap
circuit connected to VDD. This includes also
Figure 4: Input filter timing diagram
integrated bootstrap capacitors of 100 nF at each
floating supply, which are located very close to the
gate drive circuit.
The under-voltage detection operates with a rising
supply threshold of typical V
falling threshold of V
= 10.3 V according to
DDUV-
= 11.9 V and a
BSUV+
Figure 4.
VS1,2,3 provide a high robustness against
negative voltage in respect of VSS of -50 V. This
ensures very stable designs even under rough
conditions.
VRU, VRV, VRW (low side emitter, Pin 12, 13,
14)
The low side emitters are available for current
measurements of each phase leg. It is
recommended to keep the connection to pin VSS
as short as possible in order to avoid unnecessary
inductive voltage drops.
V+ (positive bus input voltage, Pin 10)
The high side IGBT are connected to the bus
voltage. It is recommended, that the bus voltage
does not exceed 500 V.
Preliminary Data Sheet7/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
Absolute Maximum Ratings
(Tc = 25°C, if not stated otherwise)
Module Section
Description Condition Symbol
Storage temperature range
Operating temperature control PCB1
Solder temperature
Insulation test voltage
Mounting torque
Mounting pressure on surface
Creepage distance
External bootstrap capacitor
IGBT and Diode Section
Description Condition Symbol
Wave soldering,
1.6mm (0.063in.)
from case for 10s
RMS, f=50Hz, t
=1min
M3 screw and washer
Package flat on
mounting surface
single capacitor
charging, VDD = 20V
T
stg
T
PCB
T
sol
V
ISOL
MS
N
MC
dS
C
bs,ext
Value Unit
Min max
-40 125 °C
- 125 °C
- 260 °C
2500 - V
- 0.6 Nm
- 150 N/mm²
3.1 - mm
2 µF
Value Unit
Collector-Emitter breakdown voltage2 VGE=0V, IC = 0.25mA,
t
< 250ns
p
DC output current Tc = 25°C,T
vJ
<
V
(BR)CES
I
, Iv, Iw -12
u
150°C
= 80°C,T
T
c
vJ
<
150°C
Repetitive peak collector current tp limited by T
Short circuit withstand time3
VDD = 15V,VDC≤ 400V,
T
j ≤ 150°C
Power dissipation per IGBT Tc = 25°C P
Operating junction temperature
range
IGBT
Diode
I
vJmax
, Iv, Iw -18 18 A
u
t
- 5 µs
sc
- 35 W
tot
T
vjI
T
vjD
1
Monitored by pin 24
2
For static operation with biased High-Side VS is reduced by 50V.
3
Allowed number of short circuits: <1000; time between short circuits: >1s.
min max
600 - V
-6
-40
-40
12
6
150
150
A
°C
Preliminary Data Sheet8/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
Description Condition Symbol
Value
Unit
min typ max
Single IGBT thermal resistance,
R
- - 3.0
thJC
K/W
junction-case
Single diode thermal resistance,
R
- - 4.2
thJCD
junction-case
Control Section
Description Condition Symbol
Value
Unit
min max
Module supply voltage VDD -1 20 V
High side floating supply voltage
V
-1 20
BS
(VB vs. VS)
High side floating IC supply offset
voltage
tp < 250ns
t
≥ 250ns
p
t
< 500ns
p
t
≥ 500ns
p
-
V
S1,2,3
VDD-VBS-50
VDD-VBS-6
600
-
550
V
-
-
Input voltage LIN, HIN, EN, ITRIP Vin -1 10 V
Operating junction temperature1 T
Max. switching frequency f
- 125
J,IC
- 20 kHz
PWM
Recommended Operation Conditions
All voltages are absolute voltages referenced to VSS -Potential unless otherwise specified.
Description Symbol
Value
min max
High side floating supply offset voltage VS -3 500
High side floating supply voltage (VB vs. VS) VBS 12.5 17.5
High side output voltage (VHO vs. VS) VHO 0 V
BS
Low side power supply VDD 12.5 17.5
Logic input voltages LIN,HIN,EN,ITRIP VIN 0 5
Unit
V
1
Monitored by pin 24
Preliminary Data Sheet9/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
Static Parameters
(Tc = 25°C, if not stated otherwise)
Description Condition Symbol
Value
Unit
min typ max
Collector-Emitter saturation voltage V
Diode forward voltage V
Zero gate voltage collector current1 V
Short circuit collector current1 V
= 15V, I
DD
out
25°C
150°C
DD
= 0V, I
= +/- 6A
out
25°C
150°C
= 600V, VGE = 0V
CE
t
< 250ns
p
T
= 25°C
j
T
= 150°C
j
= 15V, t
DD
V
= 300V, Tj ≤ 150°C
CC
SC
= +/- 6A
≤ 5µs
V
CE(sat)
-
-
VF
-
-
I
CES
-
-
1.7
1.9
1.6
1.6
-
-
2.15
2.05
40
1000
- 35 - A
I
C(SC)
V
V
µA
Logic "0" input voltage (LIN,HIN) VIH 1.7 2.1 2.4 V
Logic "1" input voltage (LIN,HIN) VIL 0.7 0.9 1.1 V
EN positive going threshold V
EN negative going threshold V
ITRIP positive going threshold V
ITRIP input hysteresis V
VDD and VBS supply undervoltage
V
positive going threshold
VDD and VBS supply undervoltage
V
negative going threshold
VCC and VBS supply undervoltage
V
lockout hysteresis
Input clamp voltage (/HIN, /LIN, EN,
V
1.9 2.1 2.3 V
EN,TH+
1.1 1.32 1.5 V
EN,TH-
360 450 540 mV
IT,TH+
60 85 - mV
IT,HYS
DDUV+
V
BSUV+
DDUV-
V
BSUV-
DDUVH
V
BSUVH
INCLAMP
11.0 12.0 12.8 V
9.5 10.3 11.0 V
1.2 1.6 - V
9.0 10.1 13.0 V
ITRIP)
Quiescent VB
supply current (VBx
x
V
= low IQB - 300 550 µA
IN
only)
Quiescent VDD supply current
V
= float I
IN
- 2.1 3.0 mA
QDD
(VDD only)
Input bias current V
Input bias current V
ITRIP Input bias current V
EN Input bias current VEN = 5V I
Leakage current of high side
= 5V I
IN
= 0V
IN
= 5V I
ITRIP
V
= 550V, T
S
= 125°C
j,IC
- 43 100 µA
IN+
I
IN-
- 62 120 µA
ITRIP+
- 62 120 µA
EN+
- 30 - µA
I
LVS
- 100 200 µA
1
Allowed number of short circuits: <1000; time between short circuits: >1s.
Preliminary Data Sheet10/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
Dynamic Parameters
(Tc = 25°C, if not stated otherwise)
Description Condition Symbol
Turn-on propagation delay
High side or low side
Turn-on rise time
High side or low side
Turn-off propagation delay
High side or low side
Turn-off fall time
High side or low side
Shutdown propagation delay
V
V
I
V
V
V
I
V
LIN,HIN
= 300V
DC
= 6A, V
out
LIN,HIN
LIN,HIN
= 300V
DC
= 6A, V
out
LIN,HIN
= 0V; I
DC
= 5V
= 5V; I
DC
= 0V
= 6A,
out
= 300V
= 6A,
out
= 300V
VEN = 0V, Iu, Iv, Iw = 6A tEN - 900 - ns
ENABLE
Shutdown propagation delay ITRIP V
Input filter time ITRIP V
Input filter time at LIN for turn on
= 1V, Iu, Iv, Iw = 6A t
ITRIP
= 1V t
ITRIP
V
= 0 V & 5V t
LIN,HIN
and off and input filter time at HIN
for turn on only
Input filter time at HIN for turn off V
Input filter time at HIN for turn off V
= 5V t
HIN
= 5 V t
HIN
Input filter time EN t
Fault clear time after ITRIP-fault V
Min. deadtime between low side
V
DT
LIN,HIN
ITRIP
= 0 V & 5V
= 0 V
and high side
Value
Unit
min typ max
- 617 - ns
t
d(on)
- 21 - ns
t
r
- 832 - ns
t
d(off)
- 29 - ns
t
f
- 900 - ns
ITRIP
155 225 380 ns
ITRIPmin
120 270 - ns
FILIN
- 200 - ns
FILIN1
- 350 - ns
FILIN2
300 430 - ns
FILEN
- 4 - ms
t
FLTCLR
1 - - µs
PWM
Deadtime of gate drive circuit DTIC 325 ns
IGBT Turn-on Energy (includes
reverse recovery of diode)
IGBT Turn-off Energy I
Diode recovery Energy I
I
= 6A, V
out
T
= 25°C
vj
= 150°C
T
vj
= 6A, V
out
T
= 25°C
vj
T
= 150°C
vj
= 6A, V
out
T
= 25°C
vj
T
= 150°C
vj
= 300V
DC
= 300V
DC
= 300V
DC
E
on
-
-
E
off
-
-
E
rec
-
-
145
195
122
160
31
81
µJ
-
-
µJ
-
-
µJ
-
-
Preliminary Data Sheet11/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
Integrated Components
Resistor (0.25 W)
Resistor
Resistor
B-Constant of NTC (Negative
Temperature Coefficient)
Bootstrap diode forward voltage
Capacitor
Capacitor
Bootstrap Capacitor
Circuit of a Typical Application
Value Description Condition Symbol1
min typ max
= 25°C
T
NTC
T
= 25°C B25 - 4250 - K
NTC
I
= 100mA
FDbs
Rbs
R
RTS
- 1.9 2.05 V
V
FDbs
C1
C2
CbsH
x
- 10 -
- 24
- 100 -
- 100 -
- 2.2 -
- 100 -
Unit
Ω
kΩ
nF
1
Symbols according to Figure 1
Preliminary Data Sheet12/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
Characteristics
1000ns
100ns
t, SWITCHING TIMES
10ns
0A5A10A15A
IC, COLLECTOR CURRENT
Figure 5. Typical switching times as a
function of collector current
(inductive load, T
V
= 300V, V
CE
DD
= 15V
=150°C,
J
Dynamic test circuit in Figure A)
t
t
d(on)
r
t
t
f
d(off)
1000ns
100ns
t, SWITCHING TIMES
10ns
25°C50°C75°C100°C125°C
TvJ, JUNCTION TEMPERATURE
Figure 6. Typical switching times as a
function of junction temperature
(inductive load, V
V
= 0/15V, IC = 6A
GE
= 300V,
CE
Dynamic test circuit in Figure A)
t
d(off)
t
d(on)
t
f
t
r
1.25mJ
1.00mJ
0.75mJ
0.50mJ
E, SWITCHING ENERGY LOSSES
0.25mJ
0.00mJ
0A5A10A15A
IC, COLLECTOR CURRENT
Figure 7. Typical switching energy losses
E
on
E
off
0.15mJ
0.10mJ
0.05mJ
E, SWITCHING ENERGY LOSSES
E
rec
0.00mJ
Figure 8. Typical switching energy losses
as a function of collector current
(inductive load, T
V
= 300V, V
CE
J
= 0/15V
GE
= 150°C,
Dynamic test circuit in Figure A)
25°C50°C75°C100°C125°C
TvJ, JUNCTION TEMPERATURE
as a function of junction
temperature
(inductive load, V
= 0/15V, IC = 6A
V
GE
= 300V,
CE
Dynamic test circuit in Figure A)
E
on
E
off
E
rec
Preliminary Data Sheet13/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
F
12V
10V
8V
6V
4V
, VOLTAGE AT PIN EN
EN
V
Vdd =10.3V
15V
2V
0V
25°C50°C75°C100°C
20V
TC, CASE TEMPERATURE
Figure 9. Typical voltage at pin EN as a
15A
12A
9A
6A
, COLLECTOR CURRENT
C
I
3A
0A
Figure 10. Typical output characteristic of
function of case temperature
VGE=25°C
125°C
150°C
0V1V2V3V
VCE, COLLECTOR EMITTER VOLTAGE
IGBT as a function of collector
emitter voltage (V
= 15V)
DD
15A
12A
9A
6A
, forward CURRENT
I
VGE=25°C
3A
0A
0V1V2V
125°C
150°C
VF, forward VOLTAGE
Figure 11. Typical diode forward current as
a function of forward voltage
Single Pulse
IGBT
Diode
0
10
K/W
-1
K/W
10
, TRANSIENT THERMAL RESISTANCE
thJC
Z
-2
10
K/W
100ns 1µs10µs 100µs 1ms 10ms 100ms 1s
tP, PULSE WIDTH
Figure 24. Diode transient thermal
impedance as a function of pulse
width
/T)
(D=t
P
Preliminary Data Sheet14/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
Test Circuits and Parameter Definiton
Figure A: Dynamic test circuit
Leakage inductance L
Stray capacitance C
=180nH
σ
=39pF
σ
Figure B: Definition of diodes switching characteristics
t
Erec
⋅=
dtivErec
FD
∫
0
Figure C: Definition of Enable and ITIRP propagation delay
LIN1,2,3
HIN1,2,3
iCU, iCV, i
, v
CEU
CEV
CW
, v
CEW
2.1V
t
d(off)
90%
10%
0.9V
t
f
10%
t
Eoff
t
Eoff
⋅=
∫
0
2%
dtivEoff
CxCEx
Figure D: Switching times definition and switching energy definition
t
d(on)
t
r
90%
10%v
t
Eon
t
Eon
∫
0
2%
⋅=
dtivEon
CxCEx
Preliminary Data Sheet15/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
LIN
LO
t
FILIN
high
t
FILIN
on
HIN
LIN
HO
LO
offonoff
low
Figure E: Short Pulse suppression
Preliminary Data Sheet16/17 Rev. 1.4, Dec. 2007
CIPOS™ IKCS12F60AA
Package Outline IKCS12F60AA
Description Condition Symbol
Value
Unit
min typ max
Weight
m
P
- 17 - g
Preliminary Data Sheet17/17 Rev. 1.4, Dec. 2007
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