INFINEON IDW40G65C5 Datasheet

SiC
Silicon Carbide Diode
5th Generation thinQ!
650V SiC Schottky Diode
TM
IDW40G65C5
Final Datasheet
Rev. 2.2, 2013-01-15
Power Management & Multimarket
IDW40G65C55th Generation thinQ!™ SiC Schottky Diode
1 Description
ThinQ!™ Generation 5 represents Infineon leading edge technology for the SiC Schottky Barrier diodes. Thanks to the more compact design and thin-wafer technology, the new family of products shows improved efficiency over all load conditions, resulting from both the improved thermal characteristics and a lower figure of merit (Qc x Vf).
The new thinQ!™ Generation 5 has been designed to complement our 650V CoolMOS™ families: this ensures meeting the most stringent application requirements in this voltage range.
Features
Revolutionary semiconductor material - Silicon Carbide  Benchmark switching behavior  No reverse recovery/ No forward recovery  Temperature independent switching behavior  High surge current capability  Pb-free lead plating; RoHS compliant  Qualified according to JEDEC  Breakdown voltage tested at 88 mA
1)
for target applications
2)
Optimized for high temperature operation
Benefits
System efficiency improvement over Si diodes  System cost / size savings due to reduced cooling requirements  Enabling higher frequency / increased power density solutions  Higher system reliability due to lower operating temperatures  Reduced EMI
Applications
Switch mode power supply  Power factor correction  Solar inverter  Uninterruptible power supply
Table 1 Key Performance Parameters
Parameter Value Unit
VDC QC; VR=400V 55 nC EC; VR=400V 12.8 µJ IF @ TC < 110°C 40 A
Table 2 Pin Definition
Pin 1 Pin 2 Pin 3
n.c. C A
Type / ordering Code Package Marking Related links
IDW40G65C5 PG-TO247-3 D4065C5 www.infineon.com/sic
650 V
1
2
3
1
2
3
CASE
1) J-STD20 and JESD22
2) All devices tested under avalanche conditions for a time periode of 10ms
Final Data Sheet 2 Rev. 2.2, 2013-01-15
5
th
Generation thinQ!TM SiC Schottky Diode
IDW40G65C5
Table of contents
Table of Contents
1 Description .......................................................................................................................................... 2
2 Maximum ratings ................................................................................................................................ 4
3 Thermal characteristics ..................................................................................................................... 4
4 Electrical characteristics ................................................................................................................... 5
5 Electrical characteristics diagrams .................................................................................................. 6
6 Simplified Forward Characteristics Model ...................................................................................... 8
7 Package outlines ................................................................................................................................ 9
8 Revision History ............................................................................................................................... 10
Final Data Sheet 3 Rev. 2.2, 2013-01-15
5
th
Generation thinQ!TM SiC Schottky Diode
IDW40G65C5
Maximum ratings
2 Maximum ratings
Table 3 Maximum ratings Parameter Symbol Values Unit Note/Test Condition
Min. Typ. Max.
Continuous forward current IF – –
Surge non-repetitive forward current, sine halfwave
Non-repetitive peak forward current I
i²t value
I
F,SM
– –
F,max
i²dt
– –
– –
– –
– –
Repetitive peak reverse voltage V
Diode dv/dt ruggedness
Power dissipation P
Operating and storage temperature Tj;T
Mounting torque
– –
RRM
dv/dt
– –
tot
-55 –
stg
– –
– 50
40
182
153
1432
166
118
650
100
183
175
70
TC < 110°C, D=1
= 25°C, tp=10 ms
T
A
C
TC = 150°C, tp=10 ms
TC = 25°C, tp=10 µs
A²s TC = 25°C, tp=10 ms
TC = 150°C, tp=10 ms
V
V/ns VR=0..480 V
W TC = 25°C
°C
Ncm M3 and M4 screws
3 Thermal characteristics
Table 4 Thermal characteristics TO-247-3 Parameter Symbol Values Unit Note/Test Condition
Min. Typ. Max.
Thermal resistance, junction-case R
Thermal resistance, junction­ambient
Soldering temperature, wavesoldering only allowed at leads
thJC
R
thJA
T
sold
– –
– –
0.6 0.8
K/W
62
260
°C
leaded
1.6mm (0.063 in.) from case for 10 s
Final Data Sheet 4 Rev. 2.2, 2013-01-15
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