Infineon IDH10SG60C User Manual

Please read the Important Notice and Warnings at the end of this document Revision 1.0

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Product Qualification Report

IDH10SG60C

SIC DIODES

Description

This product qualification report describes the characteristics of the product with respect to quality and reliability.
The qualification sample selection was done on production lots which were manufactured and tested on standard

production processes and meet the defined requirements.
The qualification test results of those products as outlined in this document are based on JEDEC for target

applications and may reference existing qualification results of similar products. Such referencing is justified by the
structural similarity of the products.

Qualification Assessment

Fully qualified according to JEDEC for Industrial Applications and assessed as PASS

For further information about comparable products, please contact the nearest Infineon Technologies office
(www.infineon.com).

Revision 1.0

qualified since March 2010
IDH10SG60C
PG-TO220-2
MSL: NA

Electrical Stress Test Results:

Test Description

Abbr.

Condition

Duration

Lots/SS

Fail/Qty

Result

High Temperature Reverse Bias
JESD22 A108

HTRB*

Ta = 175°C **
VR = V

R,max

1000 h

4 x 77

0 / 308

PASS

High Humidity High Temperature Reverse Bias
JESD22 A101

H3TRB*

Ta = 85°C
RH = 85%
VR = 80% V

R,max

1000 h

4 x 77

0 / 308

PASS
Intermitted Operational Life Test
MIL-STD 750 / Meth.1037

IOL*

Delta T =100K

10000 cyc.

4 x 77

0 / 308

PASS

ESD (HBM)
JESD22-A114

HBM

Class 3B
( > 8000V)

PASS

ESD (CDM)
JESD22-C101

CDM

Class C3
(> 1000V)

PASS

Environmental Stress Test Results:

Test Description

Abbr.

Condition

Duration

Lots/SS

Fail/Qty

Result

Pre-conditioning (SMD device only)
J-STD020 / JESD22 A113

PC MSL and 3x
reflow 260°C

4 x 385

0 / 1540

PASS

Temperature Cycling
JESD22 A104

TC* -55°C to +150°C

1000 cyc.

4 x 77

0 / 308

PASS

Autoclave***
JESD22 A102

or

Unbiased Highly Accelerated Stress Test ***
JESD22 A118

AC*

UHAST*

Ta=121°C
RH=100%

Ta = 130°C
RH = 85%

96 h 4 x 77

0 / 308

PASS

Mechanical Stress Test Results:

Test Description

Abbr.

Condition

Duration

Lots

Fail/Qty

Result

Destructive Physical Analysis

DPA

samples from
AC or UHAST
& TC

4 0 / 4

PASS

Notes:

* For SMD devices reliability stress tests are performed after preconditioning test (PC) according to JESD22
** Specifically used stress temperature is according to product capability documented in the product datasheet
*** Selection of used stress test depending on specific availability of respective reliability stress equipment