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Product Qualification Report
IDH10SG60C
SIC DIODES
Description
This product qualification report describes the characteristics of the product with respect to quality and reliability.
The qualification sample selection was done on production lots which were manufactured and tested on standard
production processes and meet the defined requirements.
The qualification test results of those products as outlined in this document are based on JEDEC for target
applications and may reference existing qualification results of similar products. Such referencing is justified by the
structural similarity of the products.
Qualification Assessment
Fully qualified according to JEDEC for Industrial Applications and assessed as PASS
For further information about comparable products, please contact the nearest Infineon Technologies office
(www.infineon.com).
Revision 1.0
qualified since March 2010
IDH10SG60C
PG-TO220-2
MSL: NA
Electrical Stress Test Results:
Test Description
Abbr.
Condition
Duration
Lots/SS
Fail/Qty
Result
High Temperature Reverse Bias
JESD22 A108
HTRB*
Ta = 175°C **
VR = V
R,max
1000 h
4 x 77
0 / 308
PASS
High Humidity High Temperature Reverse Bias
JESD22 A101
H3TRB*
Ta = 85°C
RH = 85%
VR = 80% V
R,max
1000 h
4 x 77
0 / 308
PASS
Intermitted Operational Life Test
MIL-STD 750 / Meth.1037
IOL*
Delta T =100K
10000 cyc.
4 x 77
0 / 308
PASS
ESD (HBM)
JESD22-A114
HBM
Class 3B
( > 8000V)
PASS
ESD (CDM)
JESD22-C101
CDM
Class C3
(> 1000V)
PASS
Environmental Stress Test Results:
Test Description
Abbr.
Condition
Duration
Lots/SS
Fail/Qty
Result
Pre-conditioning (SMD device only)
J-STD020 / JESD22 A113
PC MSL and 3x
reflow 260°C
4 x 385
0 / 1540
PASS
Temperature Cycling
JESD22 A104
TC* -55°C to +150°C
1000 cyc.
4 x 77
0 / 308
PASS
Autoclave***
JESD22 A102
or
Unbiased Highly Accelerated Stress Test ***
JESD22 A118
AC*
UHAST*
Ta=121°C
RH=100%
Ta = 130°C
RH = 85%
96 h 4 x 77
0 / 308
PASS
Mechanical Stress Test Results:
Test Description
Abbr.
Condition
Duration
Lots
Fail/Qty
Result
Destructive Physical Analysis
DPA
samples from
AC or UHAST
& TC
4 0 / 4
PASS
Notes:
* For SMD devices reliability stress tests are performed after preconditioning test (PC) according to JESD22
** Specifically used stress temperature is according to product capability documented in the product datasheet
*** Selection of used stress test depending on specific availability of respective reliability stress equipment
Published by
Infineon Technologies AG
81726 München, Germany
© 2021 Infineon Technologies AG.
All Rights Reserved.
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document?
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Document reference
IMPORTANT NOTICE
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”).
With respect to any examples, hints or any typical
values stated herein and/or any information
regarding the application of the product, Infineon
Technologies hereby disclaims any and all
warranties and liabilities of any kind, including
without limitation warranties of non-infringement
of intellectual property rights of any third party.
In addition, any information given in this document
is subject to customer’s compliance with its
obligations stated in this document and any
applicable legal requirements, norms and
standards concerning customer’s products and any
use of the product of Infineon Technologies in
customer’s applications.
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments
to evaluate the suitability of the product for the
intended application and the completeness of the
product information given in this document with
respect to such application.
For further information on the product, technology,
delivery terms and conditions and prices please
contact your nearest Infineon Technologies office
(www.infineon.com).
WARNINGS
Due to technical requirements products may
contain dangerous substances. For information on
the types in question please contact your nearest
Infineon Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized representatives of Infineon
Technologies, Infineon Technologies’ products may
not be used in any applications where a failure of
the product or any consequences of the use thereof
can reasonably be expected to result in personal
injury.
n.a.
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