INFINEON IDH03G65C5 Datasheet

SiC
Silicon Carbide Diode
5th Generation thinQ!
650V SiC Schottky Diode
TM
IDH03G65C5
Final Datasheet
Rev. 2.2, 2012-12-10
Power Management & Multimarket
q
IDH03G65C55th Generation thinQ!™ SiC Schottky Diode
1 Description
ThinQ!™ Generation 5 represents Infineon leading edge technology for the SiC Schottky Barrier diodes. The Infineon proprietary diffusion soldering process, already introduced with G3 is now combined with a new, more compact design and thin-wafer technology. The result is a new family of products showing improved efficiency over all load conditions, resulting from both the improved thermal characteristics and a lower figure of merit (Qc x Vf). The new thinQ!™ Generation 5 has been designed to complement our 650V CoolMOS™ families: this ensures meeting the most stringent application re
uirements in this voltage range.
Features
Revolutionary semiconductor material - Silicon Carbide  Benchmark switching behavior  No reverse recovery/ No forward recovery  Temperature independent switching behavior  High surge current capability  Pb-free lead plating; RoHS compliant  Qualified according to JEDEC  Breakdown voltage tested at 6.8 mA  Optimized for high temperature operation
1)
for target applications
2)
Benefits
System efficiency improvement over Si diodes  System cost / size savings due to reduced cooling requirements  Enabling higher frequency / increased power density solutions  Higher system reliability due to lower operating temperatures  Reduced EMI
Applications
Switch mode power supply  Power factor correction  Solar inverter  Uninterruptible power supply
Table 1 Key Performance Parameters
Parameter Value Unit
VDC QC; VR=400V 5 nC EC; VR=400V 1.1 µJ IF @ TC < 155°C
Table 2 Pin Definition
Pin 1 Pin 2 Pin 3
C A n.a.
Type / ordering Code Package Marking Related links
IDH03G65C5 PG-TO220-2 D0365C5 www.infineon.com/sic
650 V
3 A
1
2
1) J-STD20 and JESD22
2) All devices tested under avalanche conditions for a time periode of 10ms
Final Data Sheet 2 Rev. 2.2, 2012-12-10
5
th
Generation thinQ!TM SiC Schottky Diode
IDH03G65C5
Table of contents
Table of Contents
1 Description .......................................................................................................................................... 2
2 Maximum ratings ................................................................................................................................ 4
3 Thermal characteristics ..................................................................................................................... 4
4 Electrical characteristics ................................................................................................................... 5
5 Electrical characteristics diagrams .................................................................................................. 6
6 Simplified Forward Characteristics Model ...................................................................................... 8
7 Package outlines ................................................................................................................................ 9
8 Revision History ............................................................................................................................... 10
Final Data Sheet 3 Rev. 2.2, 2012-12-10
5
th
Generation thinQ!TM SiC Schottky Diode
IDH03G65C5
Maximum ratings
2 Maximum ratings
Table 3 Maximum ratings Parameter Symbol Values Unit Note/Test Condition
Min. Typ. Max.
Continuous forward current IF – –
Surge non-repetitive forward current, sine halfwave
Non-repetitive peak forward current I
i²t value
I
F,SM
– –
– –
F,max
i²dt
– –
– –
Repetitive peak reverse voltage V
Diode dv/dt ruggedness
Power dissipation P
Operating and storage temperature Tj;T
Mounting torque
– –
RRM
dv/dt
– –
tot
-55 –
stg
– –
– –
3
31
29
178
4.7
4.2
650
100
42
175
70
TC < 155°C, D=1
A
TC = 25°C, tp=10 ms
TC = 150°C, tp=10 ms
TC = 25°C, tp=10 µs
A²s TC = 25°C, tp=10 ms
TC = 150°C, tp=10 ms
V Tj = 25°C
V/ns VR=0..480 V
W TC = 25°C
°C
Ncm M3 screws
3 Thermal characteristics
Table 4 Thermal characteristics TO-220-2 Parameter Symbol Values Unit Note/Test Condition
Min. Typ. Max.
Thermal resistance, junction-case R
Thermal resistance, junction­ambient
Soldering temperature, wavesoldering only allowed at leads
thJC
R
thJA
T
sold
– –
– –
2.2 3.6
K/W
62
260
°C
leaded
1.6mm (0.063 in.) from case for 10 s
Final Data Sheet 4 Rev. 2.2, 2012-12-10
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