The INFINEON HYS72T32000GR, HYS72T64020GR and HYS72T64001 are low profile
Registered DIMM modules with 30,00 mm height based on DDR2 technology. DIMMs are available
in 32M x 72 (256 MByte), 2 x 32M x 72 (512 MByte) and 64M x 72 (512 MByte) organisation and
density, intended for mounting into 240 pin connector sockets.
The memory array is designed with 256Mbit Double Data Rate (DDR2) Synchronous DRAMs for
ECC applications. All control and address signals are re-driven on the DIMM using register devices
and a PLL for the clock distribution. This reduces capacitive loading to the system bus, but adds one
cycle to the SDRAM timing. Decoupling capacitors are mounted on the PCB board, which pr ovide
a proper voltage supply impedance over the whole frequency range of operations as number and
values are accordant to the JEDEC specification. The DIMMs feature serial presence detect based
on a serial E
configuration data and the second 128 bytes are available to the customer.
2
PROM device using the 2-pin I2C protocol. The first 128 bytes are programmed with
Latencies (3, 4 & 5),
• Re-drive for all input signals using register
and PLL devices.
• OCD (Off-Chip Driver Impedance
Adjustment) and ODT (On-Die Termination)
• Serial Presence Detect with E
• Low Profile Modules form factor:
133.35 mm x 30,00 mm (MO-237)
• Based on JEDEC standard reference card
designs Raw Card “A”, “B” and “C”.
1. All part numbers end with a place code, designating the silicon die revision. Example: HYS72T32000GR-5-A, indicating
Rev. A dies are used for DDR2 SDRAM components. For all INFINEON DDR2 module and component nomenclature see
section 8 of this datasheet.
2. The Compliance Code is printed on the module label and describes the speed grade, f.e. “PC2-4200R-44410-C”, where
4200R means Registered DIMM modules with 4.26 GB/sec Module Bandwidth and “44410” means CAS latency = 4, trcd
latency = 4 and trp latency = 4 using the latest JEDEC SPD Revision 1.0 and produced on the Raw Card “C”.
Note: CS1, ODT1 and CKE1 are used on dual rank modules only.
Type PolarityFunction
The system clock inputs. All address and command lines are sampled on the cross point of
0
Input Cross point
Active High
Input
Active Low
Input
Active High On-Die Termination control signals
Input
Active Low
WE
Input
Active High Masks write data when high, issued concurrently with input data.
Input
Input
Input
I/O-Data and Check Bit Input /Output pins.
I/O
[17:0]
REF
Cross point
Input
I/O-
Input
Input
Supply-Power and ground for the DDR SDRAM input buffers and core logic.
Supply-Reference voltage for the SSTL-18 inputs.
Supply-
the rising edge of CK and the falling edge of CK. An on-board DLL circuit is driven from the
clock inputs and output timing for read operations is synchronized to the input clock.
CKE high activates and CKE low deactivates internal clock signals and device input buffers
and output drivers of the SDRAMs. Taking CKE low provides Precharge Power-Down and
Self-Refresh operation (all banks idle), or Active Power-Down (row Active in any bank).
Enables the associated SDRAM command decoder when low and disables decoder when
high. When decoder is disabled, new commands are ignored and previous operations continue. The input signals also disable all outputs (except CKE and ODT) of the register(s) on
the DIMM when both inputs are high. When both CS[1:0] are high, all register outputs (except
CK, ODT and Chip select) remain in the previous state.
When sampled at the positive edge of the clock, RAS, CAS and WE define the operation to
be executed by the SDRAM.
-Selects which internal SDRAM memory bank is activated
During Bank Activate command cycle, Address defines the row address. During a Read or
Write command cycle, Address defines the column address. In addition to the column
address, A10(=AP) is used to invoke Auto-Precharge operation at the end of the burst read
or write cycle. If AP is high, Auto Precharge is selected and BA[1:0] defines the bank to be
precharged. If AP is low, Auto-Precharge is disabled. During a Precharge command cycle,
AP is used in conjunction with BA[1:0] to control which bank(s) to precharge. If AP is high, all
banks will be precharged regardless of the state of BA[1:0]. If AP is low, BA[1:0] are used to
define which bank to precharge.
The data strobes, associated with one data byte, source with data transfer. In Write mode,
the data strobe is sourced by the controller and is centered in the data window. In Read
mode the data strobe is sources by the DDR2 SDRAM and is sent at the leading edge of the
data window. DQS signals are complements, and timing is relative to the crosspoint of
respective DQS and DQS. If the module is to be operated in single ended strobe mode, all
DQS signals must be tied on the system board to VSS and DDR2 SDRAM mode registers
programmed appropriately.
These signals are tied at the system planar to either VSS or VDDSPD to configure the serial
SPD EEPROM address range
This bidirectional pin is used to transfer data into and out of the SPD EEPROM. A resistor
maybe connected from the SDA bus line to VDDSPD on the system planar to act as a pullup.
This signal is used to clock data into the SPD EEPROM. A resistor maybe connected from
the SCL bus line to VDDSPD on the system planar to act as a pull-up.
The RESET
-
When low, all register outputs will be driven low and the PLL clocks to the DRAMs and the
register(s) will be set to low level. The PLL will remain synchronized with the input clock.
Serial EEPROM positive power supply, wired to a separated power pin at the connector
which supports from 1.7 Volt to 3.6 Volt.
pin is connected to the RST pin on the register and to the OE pin on the PLL.
HYS72Txx0xxGR
INFINEON Technologies72.04
HYS72Txx0xxGR
Registered DDR2 SDRAM-Modules
2.0 Block Diagrams (cont’d)
2.1 One Rank 32M x 72 (256 MByte) DDR2 SDRAM DIMM Module (x8 components)
HYS72T32000GR on Raw Card A
RS0
DQS0
DQS0
CS0 *
BA0-BA1
A0 -A12
RAS
CAS
WE
CKE0
ODT0
RESET
PCK7
PCK 7
DM0/DQS9
DQS9
DQS1
DQS1
DM1/DQS10
DQS10
DQS2
DQS0
DM2/DQS11
DQS11
DQS3
DQS3
DM3/DQS12
DQS12
DQS8
DQS8
DM8/DQS17
DQS17
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
RST
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
1:1
R
E
G
I
S
T
E
R
DM/
NU/
CS DQS
RDQS
RDQS
I/O 0
I/O 1
D0
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DM/
NU/
CS DQS
RDQS
RDQS
I/O 0
I/O 1
D1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DM/
NU/
DQS
CS
RDQS
RDQS
I/O 0
I/O 1
D2
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
NU/
DM/
CS DQS
RDQS
RDQS
I/O 0
I/O 1
D3
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DM/
NU/
CS DQS DQS
RDQS
RDQS
I/O 0
I/O 1
D8
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
0 -> CS : SDRAMs D0-D8
RS
RBA0-RBA1
RA0 -RA12-> A0 -A 12: SDRA Ms D0-D 8
RRA S -> RAS : SDR AMs D0- D8
RCAS -> C A S: SD RAMs D0-D8
RW E -> WE : SDRAMs D0-D8
RCKE0 -> CKE : SDRA D0-D8
RODT0 - > ODT 0: SDRAMs D0-D8
A0-BA1: SDRAMs D0-D8
-> B
*) CS0 connects to DCS and VDD connects to CSR on the Reg isters
DQS4
DQS4
DM4/DQS13
DQS
DQS
DQS
DQS
DQS13
DQS5
DQS5
DM5/DQS14
DQS14
DQS6
DQS6
DM6/DQS15
DQS15
DQS7
DQS7
DM7/DQS16
DQS16
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
Serial PD
SCL
A0
WP
A1 A2
SA0 SA1
SA2
CK0
CK 0
RESET
DM/
NU/
CS DQS DQS
RDQS
RDQS
I/O 0
I/O 1
D4
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DM/
NU/
RDQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
NU/
RDQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
NU/
RDQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
SDA
PCK0-PCK6,PCK 8,PCK9
P
PCK0-PCK6,
L
L
PCK7
OE
PCK7
Notes:
1. DQ-to-I/O wiring may be changed within a byte
2. Unless otherwise noted, resistor values are 22 Ohms
CS DQS
RDQS
D5
DM/
DQS
CS
RDQS
D6
DM/
CS DQS
RDQS
D7
V
VREF
-> CK : Register
> CK : Register
DQS
DQS
DQS
DDSPD
V
V
DD,
DDQ
V
SS
PCK8,PCK9
CK : SDRAMs D0-D8
CK : SDRAMs D0-D8
Serial PD
D0 - D8
D0 - D8
D0 - D8
INFINEON Technologies82.04
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