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Previous Version:Rev. 0.52003-11
PageSubjects (major changes since last revision)
6,7Added DDR400
18Updated
I
Currents and added DDR400 Idd Currents
dd
24Updated SPD Code Bytes 99 - 127 to FF and added SPD Codes for DDR400
13,14editorial changes
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200-Pin Small Outline Dual-In-Line Memory Modules
SO-DIMM
HYS64D[32020/16000][H/G]DL–6–C
HYS64D32020[H/G]DL–5–C
1Overview
1.1Features
•Non-parity 200-Pin Small Outline Dual-In-Line Memory Modules
•One rank 16M ×64 and two ranks 32M ×64 organization
•JEDEC standard Double Data Rate Synchronous DRAMs (DDR SDRAM)
•Single +2.5V (± 0.2 V) power supply
•Built with 256 Mbit DDR SDRAMs organised as ×16 in P–TSOPII–66–1 packages
•Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
•Auto Refresh (CBR) and Self Refresh
•All inputs and outputs SSTL_2 compatible
•Serial Presence Detect with E
•Jedec standard form factor: 67.60 mm × 31.75 mm × 2.4 / 3.80 mm
•Jedec standard reference layout Raw Cards A and C
•Gold plated contacts
Table 1Performance
2
PROM
Part Number Speed Code–5–6Unit
Speed GradeComponentDDR400BDDR333B—
ModulePC3200–3033PC2700–2533—
max. Clock Frequency@CL3
@CL2.5
@CL2
f
CK3
f
CK2.5
f
CK2
200166MHz
166166MHz
133133MHz
2Description
The HYS64D32020[H/G]DL–5–C and HYS64D[32020/16000][H/G]DL–6–C are industry standard 200-Pin Small
Outline Dual-In-Line Memory Modules (SO-DIMMs) organized as 32M × 64 and 16M × 64. The memory array is
designed with Double Data Rate Synchronous DRAMs (DDR SDRAM). A variety of decoupling capacitors are
mounted on the PC board. The DIMMs feature serial presence detect based on a serial E
2
2-pin I
available to the customer.
C protocol. The first 128 bytes are programmed with configuration data and the second 128 bytes are
2
PROM device using the
Data Sheet6Rev. 1.0, 2004-03
HYS64D[32020/16000][H/G]DL–[5/6]–C
Small Outline DDR SDRAM Modules
Table 2Ordering Information
Type Compliance CodeDescriptionSDRAM
PC3200 (CL=3.0)
HYS64D32020GDL–5–CPC3200S–3033–1–A1 two ranks 256 MB SO-DIMM256 MBit (×16)
PC2700 (CL=2.5)
HYS64D16000GDL–6–CPC2700S–2533–0–C1 one rank 128 MB SO-DIMM256 MBit (×16)
HYS64D32020GDL–6–CPC2700S–2533–0–A1 two ranks 256 MB SO-DIMM256 MBit (×16)
PC3200 (CL=3.0)
HYS64D32020HDL–5–CPC3200S–3033–1–A1 two ranks 256 MB SO-DIMM256 MBit (×16)
PC2700 (CL=2.5)
HYS64D16000HDL–6–CPC2700S–2533–0–C1 one rank 128 MB SO-DIMM256 MBit (×16)
HYS64D32020HDL–6–CPC2700S–2533–0–A1 two ranks 256 MB SO-DIMM256 MBit (×16)
Notes
1. All part numbers end with a place code designating the silicon-die revision. Reference information available on
request. Example: HYS64D32020GDL-6-B, indicating rev. B dies are used for SDRAM components.
2. The Compliance Code is printed on the module labels describing the speed sort (for example “PC2700”), the
latencies and SPD code definition (for example “2033–0” means CAS latency of 2.0 clocks, RCD
3 clocks, Row Precharge latency of 3 clocks, and JEDEC SPD code definiton version 0), and the Raw Card
used for this module.
Description
Technology
1)
latency of
1) RCD: Row-Column-Delay
Data Sheet7Rev. 1.0, 2004-03
HYS64D[32020/16000][H/G]DL–[5/6]–C
Small Outline DDR SDRAM Modules
3Pin Configuration
The pin configuration of the Unbuffered Small Outline
DDR SDRAM DIMM is listed by function in Table 3
(184 pins). The abbreviations used in columns Pin and
Buffer Type are explained in Table 4 and Table 5
respectively. The pin numbering is depicted in
Figure 1.
Table 3Pin Configuration of SO-DIMM
Pin#NamePin
Type
Clock Signals
35CK0ISSTLClock Signal
160CK1ISSTLClock Signal
89CK2ISSTLClock Signal