Infineon HybridPACK 2 Mounting Instruction
Application Note AN 2010-08
V2.0, August 2010
HybridPACK™ 2
General Information and Mounting Instruction
IFAG ATV OPEV
2010-03
2009
Application Note AN 2010-08
V2.0,
Aug
ust 2010
Edition 2010-08-10
Published by
Infineon Technologies AG
59568 Warstein, Germany
© Infineon Technologies AG 2010.
All Rights Reserved.
Attention please!
THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE
IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE
REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR
QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION
NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON
TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND
(INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL
PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN
IN THIS APPLICATION NOTE.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types
in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components
may only be used in life-support devices or systems with the express written approval of Infineon
Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-
support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and
sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other
persons may be endangered.
AN 2010-08
Revision History: date (10-08-10) V2.0, Previous Version: V1.0, November 2009
All Pages: Used new template. , Page 4 and 5: Added Chapter ” Proposal for Designing a Driver Board”
Page 7: Changed name of the JST connector from
"09HVD4B-EMGF-SR" to "09HVD6B-EMGF-NR".
Page 9: Added comment ”IFX does not
recommend the usage of a silicon gasket for sealing.”
Page 11: Changed drawing “
A design example of fluid cooling system”
Page 14: Updated
Figure 10
Author: Vase Klandjevski ( IFAG ATV OPEV AE )
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will
help us to continuously improve the quality of this document. Please send your proposal (including a
reference to this document) to: [IGBT.Application@infineon.com]
2010-03
2009
Application Note AN 2010-08
V2.0,
Aug
ust 2010
Table of Contents
1 Introduction ...................................................................................................................................4
2 Proposal for Designing a Driver Board ......................................................................................4
3 Mounting a Driver Board onto the Module .................................................................................6
4 Application of the Liquid Cooling System .................................................................................9
5 Screws to Mount the Module to the Heat Sink.........................................................................12
6 Mounting the Module to the Heat Sink .....................................................................................13
7 Connecting the Bus Bars to the Power Terminals ..................................................................14
7.1 Connecting the Power Terminals with Ideal Strain Relief ......................................................15
8 Storage and Transport ...............................................................................................................16
9 Data Matrix (DMX) Part Marking ................................................................................................17
2010-03
2009
Application Note AN 2010-08
V2.0,
Aug
ust 2010
1 Introduction
The operation of high power modules results in power losses, which have to be dissipated
via a heat sink so that the maximum permissible temperature specified in the data sheet will
not be exceeded. Therefore, the mounting process of power modules is vital, because it
affects the module’s thermal performance and furthermore its reliability, which is critical for
automotive applications.
This application note gives mounting instructions for HybridPACK
TM
2 module with
recommendations how to screw the module, assemble the PCB and mount the module onto
the heat sink.
Please also note that ground straps should be worn while working with the components and
valid ESD safety instructions should be followed at all time, since IGBT modules are
electronic-static sensitive components. In addition, maximum permissible values in the
product datasheet and application notes are absolute limits which generally, even for short
times, may not be exceeded as this may lead to destruction of the component. Moreover, this
application note cannot cover every type of application and condition. Hence, the application
note cannot replace a detailed evaluation and examination by you or your technical divisions
of the suitability for the targeted applications. The application note will, therefore, under no
circumstances become part of any supplier agreed warranty, unless the supply agreement
determines otherwise in writing.
2 Proposal for Designing a Driver Board
Based on the HybridPACK™ 2 dimensions a proposal for designing a driver board can be
offered (see Figure 1). The end-hole diameter for the module solder pin connection should
be
0,0
25,0
35,1
−
+
mm should be taken.
PLEASE NOTE: The drawing below offers a proposal for solder pin connection based driver
board and therefore it is not binding. Detailed evaluation and examination by you or your
technical divisions must be done in order to verify the suitability of this proposal.
When designing a driver board which uses connectors (E.g. JST connector type "09HVD6BEMGF-NR") the geometry and the footprints of the connector must be taken in to account.
2010-03
2009
Application Note AN 2010-08
V2.0,
Aug
ust 2010
mm
0,0
25,0
35,1
−
+
Figure 1 Proposal for designing a driver board for HybridPACK™ 2 module.
2010-03
2009
Application Note AN 2010-08
V2.0,
Aug
ust 2010
3 Mounting a Driver Board onto the Module
The driver board could be mounted in two ways: through connectors (strongly
recommended) or alternative directly soldering on the top of the module.
When a driver board or module adapter board (PCB) is soldered directly on top of the
module, the contact joints (=solder connections) between PCB and module auxiliary contacts
should be mechanically relieved as much as possible. Relieve of the contact points is carried
out by mounting the PCB directly onto the module at the eight mounting stand-offs (Figure 2)
using self-tapping (thread forming) screws or similar assembly material. The length of the
used self-tapping screws is depended on the PCB thickness. Example: For mounting a PCB
with 1.6mm thickness a self-trapping screw with 3 mm diameter and 10mm length should be
used for example type Delta PT 30x10 from EJOT.
Position of the mounting
„self-tapping“ screws
Position of the guidance
holes
1
2
3
4
5
6
7
8
Figure 2 PCB mounting stand-off of HybridPACK™ 2 module.
The screws should be mounted in the sequence showed in Figure 2. The initial 1.5mm of the
mounting stand-off serve as guidance only and cannot take any force. The thread in the
plastics will form itself by driving in the screws. Apart from manually driving the screws into
the mounting stand-offs an electronically controlled or at least slowly turning electric
screwdriver (≤300rpm) is a preferred aid (due to the lack of accuracy we do not recommend
the use of pneumatic screwdrivers). The maximum applied force M
max
is 0.9Nm ±10%. The
effective length of the screw thread entering the mounting stand-off should be of a minimum
length of l
min
≥6mm and a maximum length of l
max
≤9mm giving consideration to the PCB
thickness and the weight of the driver PCB.
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