T e c h n i s c h e I n f o r m a t i o n / t e c h n i c a l i n f o r m a t i o n
I G B T - M o d u l e
F S3 5 R1 2 W 1 T 4
E a s y P A C K M o d u l m i t T r e n c h / F e l d s t o p p I G B T 4 u n d E m i t t e r C o n t r o l l e d 4 D i o d e u n d N T C
E a s y P A C K m o d u l e w i t h T r e n c h / F i e l d s t o p I G B T 4 a n d E m i t t e r C o n t r o l l e d 4 d i o d e a n d N T C
Vorläufige Daten / preliminary data
Vorläufige Daten / preliminary data
Vorläufige Daten / preliminary data Vorläufige Daten / preliminary data
V†Š» = 1200V
V†Š» = 1200V
V†Š» = 1200V V†Š» = 1200V
I† ÒÓÑ = 35A / I†ç¢ = 70A
I† ÒÓÑ = 35A / I†ç¢ = 70A
I† ÒÓÑ = 35A / I†ç¢ = 70A I† ÒÓÑ = 35A / I†ç¢ = 70A
Typische Anwendungen
Typische Anwendungen Typical Applications
Typische Anwendungen Typische Anwendungen
Klimaanlagen Airconditions
••
Motorantriebe Motor Drives
••
Servoumrichter Servo Drives
••
USV-Systeme UPS Systems
••
Typical Applications
Typical Applications Typical Applications
Elektrische Eigenschaften
Elektrische Eigenschaften Electrical Features
Elektrische Eigenschaften Elektrische Eigenschaften
Niedrige Schaltverluste Low Switching Losses
••
Trench IGBT 4 Trench IGBT 4
••
V†ŠÙÈÚ mit positivem Temperaturkoeffizienten V†ŠÙÈÚ with positive Temperature Coefficient
••
niedriges V†ŠÙÈÚ Low V†ŠÙÈÚ
••
Mechanische Eigenschaften
Mechanische Eigenschaften Mechanical Features
Mechanische Eigenschaften Mechanische Eigenschaften
AlèOé Substrat für kleinen thermischen
••
Widerstand
Kompaktes Design Compact Design
••
Lötverbindungs Technologie Solder Contact Technology
••
Robuste Montage durch integrierte
••
Befestigungsklammern
Module Label Code
Module Label Code
Module Label Code Module Label Code
Barcode Code 128
Barcode Code 128
Barcode Code 128 Barcode Code 128
DMX - Code
DMX - Code
DMX - Code DMX - Code
Electrical Features
Electrical Features Electrical Features
Mechanical Features
Mechanical Features Mechanical Features
AlèOé Substrate for Low Thermal Resistance
Rugged mounting due to integrated mounting
clamps
Content of the Code
Content of the Code Digit
Content of the Code Content of the Code
Module Serial Number 1 - 5
Module Material Number 6 - 11
Production Order Number 12 - 19
Datecode (Production Year) 20 - 21
Datecode (Production Week) 22 - 23
Digit
Digit Digit
prepared by: DK
approved by: MB
date of publication: 2009-10-30
revision: 2.1
1
material no: 29267
UL approved (E83335)
T e c h n i s c h e I n f o r m a t i o n / t e c h n i c a l i n f o r m a t i o n
I G B T - M o d u l e
F S3 5 R1 2 W 1 T 4
I G B T - W e c h s e l r i c h t e r / I G B T - i n v e r t e r
H ö c h s t z u l ä s s i g e W e r t e / m a x i m u m r a t e d v a l u e s
Kollektor-Emitter-Sperrspannung
collector-emitter voltage
Kollektor-Dauergleichstrom
DC-collector current
Periodischer Kollektor Spitzenstrom
repetitive peak collector current
Gesamt-Verlustleistung
total power dissipation
Gate-Emitter-Spitzenspannung
gate-emitter peak voltage
TÝÎ = 25°C V†Š» 1200 V
T† = 100°C, TÝÎ = 175°C
T† = 25°C, TÝÎ = 175°C
t« = 1 ms I†ç¢ 70 A
T† = 25°C, TÝÎ = 175°C PÚÓÚ 225 W
V•Š» +/-20 V
V o r l ä u f i g e D a t e n
p r e l i m i n a r y d a t a
I† ÒÓÑ
I†
35
65
A
A
C h a r a k t e r i s t i s c h e W e r t e / c h a r a c t e r i s t i c v a l u e s
Kollektor-Emitter Sättigungsspannung
collector-emitter saturation voltage
Gate-Schwellenspannung
gate threshold voltage
Gateladung
gate charge
Interner Gatewiderstand
internal gate resistor
Eingangskapazität
input capacitance
Rückwirkungskapazität
reverse transfer capacitance
Kollektor-Emitter Reststrom
collector-emitter cut-off current
Gate-Emitter Reststrom
gate-emitter leakage current
Einschaltverzögerungszeit (ind. Last)
turn-on delay time (inductive load)
Anstiegszeit (induktive Last)
rise time (inductive load)
Abschaltverzögerungszeit (ind. Last)
turn-off delay time (inductive load)
Fallzeit (induktive Last)
fall time (inductive load)
Einschaltverlustenergie pro Puls
turn-on energy loss per pulse
Abschaltverlustenergie pro Puls
turn-off energy loss per pulse
Kurzschlussverhalten
SC data
Innerer Wärmewiderstand
thermal resistance, junction to case
Übergangs-Wärmewiderstand
thermal resistance, case to heatsink
I† = 35 A, V•Š = 15 V
I† = 35 A, V•Š = 15 V
I† = 35 A, V•Š = 15 V
I† = 1,20 mA, V†Š = V•Š, TÝÎ = 25°C V•ŠÚÌ 5,0 5,8 6,5 V
V•Š = -15 V ... +15 V Q• 0,27 µC
TÝÎ = 25°C R•ÍÒÚ 0,0 Â
f = 1 MHz, TÝÎ = 25°C, V†Š = 25 V, V•Š = 0 V CÍþÙ 2,00 nF
f = 1 MHz, TÝÎ = 25°C, V†Š = 25 V, V•Š = 0 V CØþÙ 0,07 nF
V†Š = 1200 V, V•Š = 0 V, TÝÎ = 25°C I†Š» 1,0 mA
V†Š = 0 V, V•Š = 20 V, TÝÎ = 25°C I•Š» 400 nA
I† = 35 A, V†Š = 600 V
V•Š = ±15 V
R•ÓÒ = 12 Â
I† = 35 A, V†Š = 600 V
V•Š = ±15 V
R•ÓÒ = 12 Â
I† = 35 A, V†Š = 600 V
V•Š = ±15 V
R•ÓËË = 12 Â
I† = 35 A, V†Š = 600 V
V•Š = ±15 V
R•ÓËË = 12 Â
I† = 35 A, V†Š = 600 V, L» = 60 nH
V•Š = ±15 V, di/dt = 1850 A/µs (TÝÎ=150°C)
R•ÓÒ = 12 Â
I† = 35 A, V†Š = 600 V, L» = 60 nH
V•Š = ±15 V, du/dt = 3500 V/µs (TÝÎ=150°C)
R•ÓËË = 12 Â
V•Š ù 15 V, V†† = 800 V
V†ŠÑÈà = V†Š» -LÙ†Š ·di/dt
pro IGBT / per IGBT RÚÌœ† 0,60 0,66 K/W
pro IGBT / per IGBT
р«ИЩЪю = 1 W/(m·K) / рГШюИЩю = 1 W/(m·K)
t« ù 10 µs,
TÝÎ = 25°C
TÝÎ = 125°C
TÝÎ = 150°C
TÝÎ = 25°C
TÝÎ = 125°C
TÝÎ = 150°C
TÝÎ = 25°C
TÝÎ = 125°C
TÝÎ = 150°C
TÝÎ = 25°C
TÝÎ = 125°C
TÝÎ = 150°C
TÝÎ = 25°C
TÝÎ = 125°C
TÝÎ = 150°C
TÝÎ = 25°C
TÝÎ = 125°C
TÝÎ = 150°C
TÝÎ = 25°C
TÝÎ = 125°C
TÝÎ = 150°C
TÝÎ = 150°C
min. typ. max.
2,25 V
V†Š ÙÈÚ
tÁ ÓÒ
tØ
tÁ ÓËË
tË
EÓÒ
EÓËË
IȠ
RÚ̆™ 0,75 K/W
1,85
2,15
2,25
0,025
0,025
0,025
0,028
0,031
0,032
0,24
0,30
0,315
0,115
0,185
0,205
2,55
3,60
3,90
2,05
3,05
3,35
130
µsµs
µsµs
µsµs
µsµs
mJmJ
mJ
mJmJ
mJ
V
V
µs
µs
µs
µs
A
prepared by: DK
approved by: MB
date of publication: 2009-10-30
revision: 2.1
2
T e c h n i s c h e I n f o r m a t i o n / t e c h n i c a l i n f o r m a t i o n
I G B T - M o d u l e
F S3 5 R1 2 W 1 T 4
D i o d e - W e c h s e l r i c h t e r / d i o d e - i n v e r t e r
H ö c h s t z u l ä s s i g e W e r t e / m a x i m u m r a t e d v a l u e s
Periodische Spitzensperrspannung
repetitive peak reverse voltage
Dauergleichstrom
DC forward current
Periodischer Spitzenstrom
repetitive peak forward current
Grenzlastintegral
I²t - value
C h a r a k t e r i s t i s c h e W e r t e / c h a r a c t e r i s t i c v a l u e s
Durchlassspannung
forward voltage
Rückstromspitze
peak reverse recovery current
Sperrverzögerungsladung
recovered charge
Abschaltenergie pro Puls
reverse recovery energy
Innerer Wärmewiderstand
thermal resistance, junction to case
Übergangs-Wärmewiderstand
thermal resistance, case to heatsink
TÝÎ = 25°C Vçç¢ 1200 V
IŒ 35 A
t« = 1 ms IŒç¢ 70 A
Vç = 0 V, t« = 10 ms, TÝÎ = 125°C
Vç = 0 V, t« = 10 ms, TÝÎ = 150°C
IŒ = 35 A, V•Š = 0 V
IŒ = 35 A, V•Š = 0 V
IŒ = 35 A, V•Š = 0 V
IŒ = 35 A, - diŒ/dt = 1850 A/µs (TÝÎ=150°C)
Vç = 600 V
V•Š = -15 V
IŒ = 35 A, - diŒ/dt = 1850 A/µs (TÝÎ=150°C)
Vç = 600 V
V•Š = -15 V
IŒ = 35 A, - diŒ/dt = 1850 A/µs (TÝÎ=150°C)
Vç = 600 V
V•Š = -15 V
pro Diode / per diode RÚÌœ† 0,80 0,90 K/W
pro Diode / per diode
р«ИЩЪю = 1 W/(m·K) / рГШюИЩю = 1 W/(m·K)
TÝÎ = 25°C
TÝÎ = 125°C
TÝÎ = 150°C
TÝÎ = 25°C
TÝÎ = 125°C
TÝÎ = 150°C
TÝÎ = 25°C
TÝÎ = 125°C
TÝÎ = 150°C
TÝÎ = 25°C
TÝÎ = 125°C
TÝÎ = 150°C
V o r l ä u f i g e D a t e n
p r e l i m i n a r y d a t a
I²t
VŒ
Iç¢
QØ
EØþÊ
RÚ̆™ 0,82 K/W
250
220
1,65
1,65
1,65
60,0
66,0
70,0
3,50
5,60
6,40
1,35
2,30
2,60
A²s
A²s
2,15 V
AA
µCµC
mJmJ
V
V
A
µC
mJ
N T C - W i d e r s t a n d / N T C - t h e r m i s t o r
C h a r a k t e r i s t i s c h e W e r t e / c h a r a c t e r i s t i c v a l u e s
Nennwiderstand
rated resistance
Abweichung von Ræåå
deviation of Ræåå
Verlustleistung
power dissipation
B-Wert
B-value
B-Wert
B-value
B-Wert
B-value
A n g a b e n g e m ä ß g ü l t i g e r A p p l i c a t i o n N o t e .
S p e c i f i c a t i o n a c c o r d i n g t o t h e v a l i d a p p l i c a t i o n n o t e .
T† = 25°C Rèë 5,00 kÂ
T† = 100°C, Ræåå = 493 Â ÆR/R -5 5%
T† = 25°C Pèë 20,0 mW
Rи = Rил exp [Bилхле(1/Tи - 1/(298,15 K))] Bилхле 3375 K
Rи = Rил exp [Bилхое(1/Tи - 1/(298,15 K))] Bилхое 3411 K
Rи = Rил exp [Bилхжее(1/Tи - 1/(298,15 K))] Bилхжее 3433 K
min. typ. max.
prepared by: DK
approved by: MB
date of publication: 2009-10-30
revision: 2.1
3
T e c h n i s c h e I n f o r m a t i o n / t e c h n i c a l i n f o r m a t i o n
I G B T - M o d u l e
F S3 5 R1 2 W 1 T 4
M o d u l / m o d u l e
Isolations-Prüfspannung
insulation test voltage
Material für innere Isolation
material for internal insulation
Kriechstrecke
creepage distance
Luftstrecke
clearance distance
Vergleichszahl der Kriechwegbildung
comparative tracking index
Modulinduktivität
stray inductance module
Modulleitungswiderstand,
Anschlüsse - Chip
module lead resistance,
terminals - chip
Höchstzulässige Sperrschichttemperatur
maximum junction temperature
Temperatur im Schaltbetrieb
temperature under switching conditions
Lagertemperatur
storage temperature
Gewicht
weight
RMS, f = 50 Hz, t = 1 min. V𻥡 2,5 kV
AlèOé
Kontakt - Kühlkörper / terminal to heatsink
Kontakt - Kontakt / terminal to terminal
Kontakt - Kühlkörper / terminal to heatsink
Kontakt - Kontakt / terminal to terminal
CTI > 200
LÙ†Š 25 nH
T† = 25°C, pro Schalter / per switch R††óôŠŠó 4,50 mÂ
Wechselrichter, Brems-Chopper / Inverter, Brake-Chopper TÝÎ ÑÈà 175 °C
Wechselrichter, Brems-Chopper / Inverter, Brake-Chopper TÝÎ ÓÔ -40 150 °C
TÙÚÃ -40 125 °C
G 24 g
V o r l ä u f i g e D a t e n
p r e l i m i n a r y d a t a
11,5
6,3
10,0
5,0
min. typ. max.
mm
mm
D e r S t r o m i m D a u e r b e t r i e b i s t a u f 3 0 A e f f e k t i v p r o A n s c h l u s s p i n b e g r e n z t .
T h e c u r r e n t u n d e r c o n t i n u o u s o p e r a t i o n i s l i m i t e d t o 3 0 A r m s p e r c o n n e c t o r p i n .
prepared by: DK
approved by: MB
date of publication: 2009-10-30
revision: 2.1
4
T e c h n i s c h e I n f o r m a t i o n / t e c h n i c a l i n f o r m a t i o n
I G B T - M o d u l e
F S3 5 R1 2 W 1 T 4
Ausgangskennlinie IGBT-Wechselr. (typisch)
Ausgangskennlinie IGBT-Wechselr. (typisch)
Ausgangskennlinie IGBT-Wechselr. (typisch) Ausgangskennlinie IGBT-Wechselr. (typisch)
output characteristic IGBT-inverter (typical)
output characteristic IGBT-inverter (typical)
output characteristic IGBT-inverter (typical) output characteristic IGBT-inverter (typical)
I† = f (V†Š)
I† = f (V†Š)
I† = f (V†Š) I† = f (V†Š)
V•Š = 15 V
V•Š = 15 V
V•Š = 15 V V•Š = 15 V
Ausgangskennlinienfeld IGBT-W echselr. (typisch)
Ausgangskennlinienfeld IGBT-W echselr. (typisch)
Ausgangskennlinienfeld IGBT-W echselr. (typisch) Ausgangskennlinienfeld IGBT-W echselr. (typisch)
output characteristic IGBT-inverter (typical)
output characteristic IGBT-inverter (typical)
output characteristic IGBT-inverter (typical) output characteristic IGBT-inverter (typical)
I† = f (V†Š)
I† = f (V†Š)
I† = f (V†Š) I† = f (V†Š)
TÝÎ = 150°C
TÝÎ = 150°C
TÝÎ = 150°C TÝÎ = 150°C
V o r l ä u f i g e D a t e n
p r e l i m i n a r y d a t a
7 0
TÝÎ = 25°C
6 3
5 6
4 9
4 2
3 5
I† [A]
2 8
2 1
1 4
7
0
0 , 0 0 , 5 1 , 0 1 , 5 2 , 0 2 , 5 3 , 0 3 , 5 4 , 0
TÝÎ = 125°C
TÝÎ = 150°C
V†Š [V]
Übertragungscharakteristik IGBT-Wechselr. (typisch)
Übertragungscharakteristik IGBT-Wechselr. (typisch)
Übertragungscharakteristik IGBT-Wechselr. (typisch) Übertragungscharakteristik IGBT-Wechselr. (typisch)
transfer characteristic IGBT-inverter (typical)
transfer characteristic IGBT-inverter (typical)
transfer characteristic IGBT-inverter (typical) transfer characteristic IGBT-inverter (typical)
I† = f (V•Š)
I† = f (V•Š)
I† = f (V•Š) I† = f (V•Š)
V†Š = 20 V
V†Š = 20 V
V†Š = 20 V V†Š = 20 V
7 0
V•Š = 19V
6 3
5 6
4 9
4 2
3 5
I† [A]
2 8
2 1
1 4
7
0
0 , 0 0 , 5 1 , 0 1 , 5 2 , 0 2 , 5 3 , 0 3 , 5 4 , 0 4 , 5 5 , 0
V•Š = 17V
V•Š = 15V
V•Š = 13V
V•Š = 11V
V•Š = 9V
V†Š [V]
Schaltverluste IGBT-W echselr. (typisch)
Schaltverluste IGBT-W echselr. (typisch)
Schaltverluste IGBT-W echselr. (typisch) Schaltverluste IGBT-W echselr. (typisch)
switching losses IGBT-inverter (typical)
switching losses IGBT-inverter (typical)
switching losses IGBT-inverter (typical) switching losses IGBT-inverter (typical)
EÓÒ = f (I†), EÓËË = f (I†)
EÓÒ = f (I†), EÓËË = f (I†)
EÓÒ = f (I†), EÓËË = f (I†) EÓÒ = f (I†), EÓËË = f (I†)
V•Š = ±15 V, R•ÓÒ = 12 Â, R•ÓËË = 12 Â, V†Š = 600 V
V•Š = ±15 V, R•ÓÒ = 12 Â, R•ÓËË = 12 Â, V†Š = 600 V
V•Š = ±15 V, R•ÓÒ = 12 Â, R•ÓËË = 12 Â, V†Š = 600 V V•Š = ±15 V, R•ÓÒ = 12 Â, R•ÓËË = 12 Â, V†Š = 600 V
7 0
6 3
5 6
4 9
4 2
3 5
I† [A]
2 8
2 1
1 4
7
0
5 6 7 8 9 1 0 1 1 1 2 1 3
prepared by: DK
approved by: MB
TÝÎ = 25°C
TÝÎ = 125°C
TÝÎ = 150°C
V•Š [V]
E [mJ]
date of publication: 2009-10-30
revision: 2.1
1 3
1 2
1 1
1 0
9
8
7
6
5
4
3
2
1
0
EÓÒ, TÝÎ = 125°C
EÓËË, TÝÎ = 125°C
EÓÒ, TÝÎ = 150°C
EÓËË, TÝÎ = 150°C
0 7 1 4 2 1 2 8 3 5 4 2 4 9 5 6 6 3 7 0
I† [A]
5
T e c h n i s c h e I n f o r m a t i o n / t e c h n i c a l i n f o r m a t i o n
I G B T - M o d u l e
F S3 5 R1 2 W 1 T 4
Schaltverluste IGBT-W echselr. (typisch)
Schaltverluste IGBT-W echselr. (typisch)
Schaltverluste IGBT-W echselr. (typisch) Schaltverluste IGBT-W echselr. (typisch)
switching losses IGBT-Inverter (typical)
switching losses IGBT-Inverter (typical)
switching losses IGBT-Inverter (typical) switching losses IGBT-Inverter (typical)
EÓÒ = f (R•), EÓËË = f (R•)
EÓÒ = f (R•), EÓËË = f (R•)
EÓÒ = f (R•), EÓËË = f (R•) EÓÒ = f (R•), EÓËË = f (R•)
V•Š = ±15 V, I† = 35 A, V†Š = 600 V
V•Š = ±15 V, I† = 35 A, V†Š = 600 V
V•Š = ±15 V, I† = 35 A, V†Š = 600 V V•Š = ±15 V, I† = 35 A, V†Š = 600 V
Transienter Wärmewiderstand IGBT-Wechselr.
Transienter Wärmewiderstand IGBT-Wechselr.
Transienter Wärmewiderstand IGBT-Wechselr. Transienter Wärmewiderstand IGBT-Wechselr.
transient thermal impedance IGBT-inverter
transient thermal impedance IGBT-inverter
transient thermal impedance IGBT-inverter transient thermal impedance IGBT-inverter
ZÚÌœ™ = f (t)
ZÚÌœ™ = f (t)
ZÚÌœ™ = f (t) ZÚÌœ™ = f (t)
V o r l ä u f i g e D a t e n
p r e l i m i n a r y d a t a
1 6
EÓÒ, TÝÎ = 125°C
1 4
1 2
1 0
8
EÓËË, TÝÎ = 125°C
EÓÒ, TÝÎ = 150°C
E [mJ]
6
4
2
0
0 1 0 2 0 3 0 4 0 5 0 6 0 7 0 8 0 9 0 1 0 0 1 1 0 1 2 0 1 3 0
R• [Â]
Sicherer Rückwärts-Arbeitsbereich IGBT-W r. (RBSOA)
Sicherer Rückwärts-Arbeitsbereich IGBT-W r. (RBSOA)
Sicherer Rückwärts-Arbeitsbereich IGBT-W r. (RBSOA) Sicherer Rückwärts-Arbeitsbereich IGBT-W r. (RBSOA)
reverse bias safe operating area IGBT-inv. (RBSOA)
reverse bias safe operating area IGBT-inv. (RBSOA)
reverse bias safe operating area IGBT-inv. (RBSOA) reverse bias safe operating area IGBT-inv. (RBSOA)
I† = f (V†Š)
I† = f (V†Š)
I† = f (V†Š) I† = f (V†Š)
V•Š = ±15 V, R•ÓËË = 12 Â, TÝÎ = 150°C
V•Š = ±15 V, R•ÓËË = 12 Â, TÝÎ = 150°C
V•Š = ±15 V, R•ÓËË = 12 Â, TÝÎ = 150°C V•Š = ±15 V, R•ÓËË = 12 Â, TÝÎ = 150°C
1 0
ZÚÌœ™ : IGBT
1
ZÚÌœ™ [K/W]
0,065
rÍ[K/W]:
τ
0,0005
Í[s]:
0 , 1
0 , 0 0 1 0 , 0 1 0 , 1 1 1 0
0,152
0,005
0,529
0,05
3
2
1
i:
t [s]
Durchlasskennlinie der Diode-Wechselr. (typisch)
Durchlasskennlinie der Diode-Wechselr. (typisch)
Durchlasskennlinie der Diode-Wechselr. (typisch) Durchlasskennlinie der Diode-Wechselr. (typisch)
forward characteristic of diode-inverter (typical)
forward characteristic of diode-inverter (typical)
forward characteristic of diode-inverter (typical) forward characteristic of diode-inverter (typical)
IŒ = f (VŒ)
IŒ = f (VŒ)
IŒ = f (VŒ) IŒ = f (VŒ)
4
0,604
0,2
8 0
7 0
6 0
5 0
4 0
I† [A]
3 0
2 0
1 0
0
0 2 0 0 4 0 0 6 0 0 8 0 0 1 0 0 0 1 2 0 0 1 4 0 0
prepared by: DK
approved by: MB
I†, Modul
I†, Chip
V†Š [V]
IŒ [A]
date of publication: 2009-10-30
revision: 2.1
7 0
TÝÎ = 25°C
6 3
5 6
4 9
4 2
3 5
2 8
2 1
1 4
7
0
0 , 0 0 , 4 0 , 8 1 , 2 1 , 6 2 , 0 2 , 4 2 , 8
TÝÎ = 125°C
TÝÎ = 150°C
VŒ [V]
6
T e c h n i s c h e I n f o r m a t i o n / t e c h n i c a l i n f o r m a t i o n
I G B T - M o d u l e
F S3 5 R1 2 W 1 T 4
Schaltverluste Diode-Wechselr. (typisch)
Schaltverluste Diode-Wechselr. (typisch)
Schaltverluste Diode-Wechselr. (typisch) Schaltverluste Diode-Wechselr. (typisch)
switching losses diode-inverter (typical)
switching losses diode-inverter (typical)
switching losses diode-inverter (typical) switching losses diode-inverter (typical)
EØþÊ = f (IŒ)
EØþÊ = f (IŒ)
EØþÊ = f (IŒ) EØþÊ = f (IŒ)
R•ÓÒ = 12 Â, V†Š = 600 V
R•ÓÒ = 12 Â, V†Š = 600 V
R•ÓÒ = 12 Â, V†Š = 600 V R•ÓÒ = 12 Â, V†Š = 600 V
Schaltverluste Diode-Wechselr. (typisch)
Schaltverluste Diode-Wechselr. (typisch)
Schaltverluste Diode-Wechselr. (typisch) Schaltverluste Diode-Wechselr. (typisch)
switching losses diode-inverter (typical)
switching losses diode-inverter (typical)
switching losses diode-inverter (typical) switching losses diode-inverter (typical)
EØþÊ = f (R•)
EØþÊ = f (R•)
EØþÊ = f (R•) EØþÊ = f (R•)
IŒ = 35 A, V†Š = 600 V
IŒ = 35 A, V†Š = 600 V
IŒ = 35 A, V†Š = 600 V IŒ = 35 A, V†Š = 600 V
V o r l ä u f i g e D a t e n
p r e l i m i n a r y d a t a
5 , 0
EØþÊ, TÝÎ = 125°C
4 , 5
4 , 0
3 , 5
3 , 0
2 , 5
EØþÊ, TÝÎ = 150°C
E [mJ]
2 , 0
1 , 5
1 , 0
0 , 5
0 , 0
0 7 1 4 2 1 2 8 3 5 4 2 4 9 5 6 6 3 7 0
IŒ [A]
Transienter Wärmewiderstand Diode-Wechselr.
Transienter Wärmewiderstand Diode-Wechselr.
Transienter Wärmewiderstand Diode-Wechselr. Transienter Wärmewiderstand Diode-Wechselr.
transient thermal impedance diode-inverter
transient thermal impedance diode-inverter
transient thermal impedance diode-inverter transient thermal impedance diode-inverter
ZÚÌœ™ = f (t)
ZÚÌœ™ = f (t)
ZÚÌœ™ = f (t) ZÚÌœ™ = f (t)
3 , 5
EØþÊ, TÝÎ = 125°C
EØþÊ, TÝÎ = 150°C
3 , 0
2 , 5
2 , 0
E [mJ]
1 , 5
1 , 0
0 , 5
0 , 0
0 1 0 2 0 3 0 4 0 5 0 6 0 7 0 8 0 9 0 1 0 0 1 1 0 1 2 0 1 3 0
R• [Â]
NTC-Temperaturkennlinie (typisch)
NTC-Temperaturkennlinie (typisch)
NTC-Temperaturkennlinie (typisch) NTC-Temperaturkennlinie (typisch)
NTC-temperature characteristic (typical)
NTC-temperature characteristic (typical)
NTC-temperature characteristic (typical) NTC-temperature characteristic (typical)
R = f (T)
R = f (T)
R = f (T) R = f (T)
1 0
1
ZÚÌœ™ [K/W]
0,108
rÍ[K/W]:
τ
0,0005
Í[s]:
0 , 1
0 , 0 0 1 0 , 0 1 0 , 1 1 1 0
0,247
0,005
0,665
0,05
3
2
1
i:
t [s]
prepared by: DK
approved by: MB
date of publication: 2009-10-30
revision: 2.1
4
0,599
0,2
1 0 0 0 0 0
1 0 0 0 0
R[Â]
1 0 0 0
1 0 0
0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 1 4 0 1 6 0
T† [°C]
7
T e c h n i s c h e I n f o r m a t i o n / t e c h n i c a l i n f o r m a t i o n
I G B T - M o d u l e
F S3 5 R1 2 W 1 T 4
S c h a l t p l a n / c i r c u i t d i a g r a m
ϑ
G e h ä u s e a b m e s s u n g e n / p a c k a g e o u t l i n e s
V o r l ä u f i g e D a t e n
p r e l i m i n a r y d a t a
I n f i n e o n
prepared by: DK
approved by: MB
date of publication: 2009-10-30
revision: 2.1
8
T e c h n i s c h e I n f o r m a t i o n / t e c h n i c a l i n f o r m a t i o n
I G B T - M o d u l e
F S3 5 R1 2 W 1 T 4
V o r l ä u f i g e D a t e n
p r e l i m i n a r y d a t a
N u t z u n g s b e d i n g u n g e n
D i e i n d i e s e m P r o d u k t d a t e n b l a t t e n t h a l t e n e n D a t e n s i n d a u s s c h l i e ß l i c h f ü r t e c h n i s c h g e s c h u l t e s F a c h p e r s o n a l b e s t i m m t . D i e
B e u r t e i l u n g d e r E i g n u n g d i e s e s P r o d u k t e s f ü r I h r e A n w e n d u n g s o w i e d i e B e u r t e i l u n g d e r V o l l s t ä n d i g k e i t d e r b e r e i t g e s t e l l t e n
P r o d u k t d a t e n f ü r d i e s e A n w e n d u n g o b l i e g t I h n e n b z w . I h r e n t e c h n i s c h e n A b t e i l u n g e n .
I n d i e s e m P r o d u k t d a t e n b l a t t w e r d e n d i e j e n i g e n M e r k m a l e b e s c h r i e b e n , f ü r d i e w i r e i n e l i e f e r v e r t r a g l i c h e G e w ä h r l e i s t u n g
ü b e r n e h m e n . E i n e s o l c h e G e w ä h r l e i s t u n g r i c h t e t s i c h a u s s c h l i e ß l i c h n a c h M a ß g a b e d e r i m j e w e i l i g e n L i e f e r v e r t r a g e n t h a l t e n e n
B e s t i m m u n g e n . G a r a n t i e n j e g l i c h e r A r t w e r d e n f ü r d a s P r o d u k t u n d d e s s e n E i g e n s c h a f t e n k e i n e s f a l l s ü b e r n o m m e n .
S o l l t e n S i e v o n u n s P r o d u k t i n f o r m a t i o n e n b e n ö t i g e n , d i e ü b e r d e n I n h a l t d i e s e s P r o d u k t d a t e n b l a t t s h i n a u s g e h e n u n d
i n s b e s o n d e r e e i n e s p e z i f i s c h e V e r w e n d u n g u n d d e n E i n s a t z d i e s e s P r o d u k t e s b e t r e f f e n , s e t z e n S i e s i c h b i t t e m i t d e m f ü r S i e
z u s t ä n d i g e n V e r t r i e b s b ü r o i n V e r b i n d u n g ( s i e h e w w w . i n f i n e o n . c o m , V e r t r i e b & K o n t a k t ) . F ü r I n t e r e s s e n t e n h a l t e n w i r A p p l i c a t i o n
N o t e s b e r e i t .
A u f g r u n d d e r t e c h n i s c h e n A n f o r d e r u n g e n k ö n n t e u n s e r P r o d u k t g e s u n d h e i t s g e f ä h r d e n d e S u b s t a n z e n e n t h a l t e n . B e i R ü c k f r a g e n
z u d e n i n d i e s e m P r o d u k t j e w e i l s e n t h a l t e n e n S u b s t a n z e n s e t z e n S i e s i c h b i t t e e b e n f a l l s m i t d e m f ü r S i e z u s t ä n d i g e n V e r t r i e b s b ü r o
i n V e r b i n d u n g .
S o l l t e n S i e b e a b s i c h t i g e n , d a s P r o d u k t i n A n w e n d u n g e n d e r L u f t f a h r t , i n g e s u n d h e i t s - o d e r l e b e n s g e f ä h r d e n d e n o d e r
l e b e n s e r h a l t e n d e n A n w e n d u n g s b e r e i c h e n e i n z u s e t z e n , b i t t e n w i r u m M i t t e i l u n g . W i r w e i s e n d a r a u f h i n , d a s s w i r f ü r d i e s e F ä l l e
- d i e g e m e i n s a m e D u r c h f ü h r u n g e i n e s R i s i k o - u n d Q u a l i t ä t s a s s e s s m e n t s ;
- d e n A b s c h l u s s v o n s p e z i e l l e n Q u a l i t ä t s s i c h e r u n g s v e r e i n b a r u n g e n ;
- d i e g e m e i n s a m e E i n f ü h r u n g v o n M a ß n a h m e n z u e i n e r l a u f e n d e n P r o d u k t b e o b a c h t u n g d r i n g e n d e m p f e h l e n u n d
g e g e b e n e n f a l l s d i e B e l i e f e r u n g v o n d e r U m s e t z u n g s o l c h e r M a ß n a h m e n a b h ä n g i g m a c h e n .
S o w e i t e r f o r d e r l i c h , b i t t e n w i r S i e , e n t s p r e c h e n d e H i n w e i s e a n I h r e K u n d e n z u g e b e n .
I n h a l t l i c h e Ä n d e r u n g e n d i e s e s P r o d u k t d a t e n b l a t t s b l e i b e n v o r b e h a l t e n .
T e r m s & C o n d i t i o n s o f u s a g e
T h e d a t a c o n t a i n e d i n t h i s p r o d u c t d a t a s h e e t i s e x c l u s i v e l y i n t e n d e d f o r t e c h n i c a l l y t r a i n e d s t a f f . Y o u a n d y o u r t e c h n i c a l
d e p a r t m e n t s w i l l h a v e t o e v a l u a t e t h e s u i t a b i l i t y o f t h e p r o d u c t f o r t h e i n t e n d e d a p p l i c a t i o n a n d t h e c o m p l e t e n e s s o f t h e p r o d u c t
d a t a w i t h r e s p e c t t o s u c h a p p l i c a t i o n .
T h i s p r o d u c t d a t a s h e e t i s d e s c r i b i n g t h e c h a r a c t e r i s t i c s o f t h i s p r o d u c t f o r w h i c h a w a r r a n t y i s g r a n t e d . A n y s u c h w a r r a n t y i s
g r a n t e d e x c l u s i v e l y p u r s u a n t t h e t e r m s a n d c o n d i t i o n s o f t h e s u p p l y a g r e e m e n t . T h e r e w i l l b e n o g u a r a n t e e o f a n y k i n d f o r t h e
p r o d u c t a n d i t s c h a r a c t e r i s t i c s .
S h o u l d y o u r e q u i r e p r o d u c t i n f o r m a t i o n i n e x c e s s o f t h e d a t a g i v e n i n t h i s p r o d u c t d a t a s h e e t o r w h i c h c o n c e r n s t h e s p e c i f i c
a p p l i c a t i o n o f o u r p r o d u c t , p l e a s e c o n t a c t t h e s a l e s o f f i c e , w h i c h i s r e s p o n s i b l e f o r y o u ( s e e w w w . i n f i n e o n . c o m , s a l e s & c o n t a c t ) .
F o r t h o s e t h a t a r e s p e c i f i c a l l y i n t e r e s t e d w e m a y p r o v i d e a p p l i c a t i o n n o t e s .
D u e t o t e c h n i c a l r e q u i r e m e n t s o u r p r o d u c t m a y c o n t a i n d a n g e r o u s s u b s t a n c e s . F o r i n f o r m a t i o n o n t h e t y p e s i n q u e s t i o n p l e a s e
c o n t a c t t h e s a l e s o f f i c e , w h i c h i s r e s p o n s i b l e f o r y o u .
S h o u l d y o u i n t e n d t o u s e t h e P r o d u c t i n a v i a t i o n a p p l i c a t i o n s , i n h e a l t h o r l i v e e n d a n g e r i n g o r l i f e s u p p o r t a p p l i c a t i o n s , p l e a s e
n o t i f y . P l e a s e n o t e , t h a t f o r a n y s u c h a p p l i c a t i o n s w e u r g e n t l y r e c o m m e n d
- t o p e r f o r m j o i n t R i s k a n d Q u a l i t y A s s e s s m e n t s ;
- t h e c o n c l u s i o n o f Q u a l i t y A g r e e m e n t s ;
- t o e s t a b l i s h j o i n t m e a s u r e s o f a n o n g o i n g p r o d u c t s u r v e y ,
a n d t h a t w e m a y m a k e d e l i v e r y d e p e n d e d o n t h e r e a l i z a t i o n
o f a n y s u c h m e a s u r e s .
I f a n d t o t h e e x t e n t n e c e s s a r y , p l e a s e f o r w a r d e q u i v a l e n t n o t i c e s t o y o u r c u s t o m e r s .
C h a n g e s o f t h i s p r o d u c t d a t a s h e e t a r e r e s e r v e d .
prepared by: DK
approved by: MB
date of publication: 2009-10-30
revision: 2.1
9