High voltage MOSFETs for consumer applications
500 V, 600 V, 650 V, 700 V and 800 V
www.infineon.com/ce
Powering a green world with CoolMOS™ CE
2
Content
CoolMOS™ CE – overview
CoolMOS™ CE – smartphone and tablet chargers
CoolMOS™ CE – notebook adapters
CoolMOS™ CE – TV sets
CoolMOS™ CE for lighting applications
CoolMOS™ CE – demonstrator boards
CoolMOS™ CE – target topologies
CoolMOS™ CE – product portfolio
CoolMOS™ CE portfolio package overview
CoolMOS™ CE – cross reference
3
Ictam quodita dolorepCoolMOS™ CE
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
CoolMOS™ comes with a DPM of less than 0.1 and FIT rate of less than 0.15
DPM (data code related)
80
10-2014
11-2014
12-2014
01-2015
02-2015
03-2015
04-2015
05-2015
06-2015
07-2015
08-2015
09-2015
82
84
86
88
90
92
94
96
98
Wish date
10%
Wish date
Longer
CoolMOS™ CE – overview
CoolMOS™ CE is a product family launched by Infineon to address consumer and lighting applications. It oers
benefits in eiciency and thermal behavior versus standard MOSFETs and has been optimized for ease-of-use and costcompetitiveness, while at the same time delivering state-of-the-art performance and Infineon quality and supply security.
Powered by Infineon multi-source program, CoolMOS™ CE is determined to support customers’ success in various consumer
markets by full FAE (field application engineer) support, short lead time and fast quote response.
CoolMOS™ quality - benchmark in short term and long
Potentially additional
defects reported in 2016
based on 130 million
0
20112012201320142015
+
FIT rate < 0.15
device hours
term reliability
CoolMOS™ technology is legendary in the industry
dierentiated for its high quality, which has been proven
over the past years across billions of devices shipped with
continuous improved DPM down to less than 0.10 DPM.
Infineon has implemented firm and proven measures
from the beginning with design-for-quality program
and continuous improvement in production. There is
a constant proactive collaboration among technology,
design, quality, reliability and manufacturing teams to
achieve this result. This eort is above and beyond the
fact that all Infineon sites are ISO/TS16949 certified.
CoolMOS™ supply chain – delivery reliability, flexibility and supply security
Our customers value CoolMOS™ not only for its technical merits but also for the outstanding delivery reliability: once a
CoolMOS™ order date is committed, more than 96 percent of orders are shipped at or before the committed date. And
CoolMOS™ orders are committed to more than 80 percent to the date that the customers request. Security of supply and
flexibility to demand changes are focus targets and enabled by a well balanced production network. For example more than
90 percent of our products are qualified for production in at least two back end locations and more than 80 percent of the
volumes in two wafer fabs. This enables CoolMOS™ supply chain to react fast to changes in customer and market requirements.
Delivery reliability: ship date = committed dateDelivery capability: confirm customers’ wish date
≥ 96% of CoolMOS™ orders are shipped by the committed date and ≥ 80% of wish dates can be met
4
Wish date
+1 week
+2 weeks
6%
4%
80%
www.infineon.com/ce
Voltage range
This selection guide takes you to explore the advantages of CoolMOS™ CE in charger, adapter, TV and lighting applications
Soloreiust cone pratendeCoolMOS™ CE
CoolMOS™ CE
Charger
500 V
Product family and R
0.19 Ω – 3 Ω
600 V650 V
range
DS(on)
0.19 Ω – 3.4 Ω0.4 Ω – 1.5 Ω
Power supply topology and market segment
Adapter/charger
Quasi-resonant flyback
PC power
PFC/TTF 80+; PFC/LLC 90+
LCD TV
LLC half-bridge
LED retrofit/LED drivers
PFC/LLC/Non-isolated bulk
700 V
0.6 Ω – 2.1 Ω
LCD TV adapter
Quasi-resonant flyback
LED retrofit/LED drivers
Quasi-resonant flyback
800 V
0.31 Ω – 2.8 Ω
Reasons to choose CoolMOS™ CE
Non-technical benefits provided by CoolMOS™ CE
Product portfolio We own a broad portfolio covering five voltage classes in both through-hole and surface-mount packages.
Capacity We own the world’s largest capacity for power devices, with three dedicated frontends and four backends.
Thanks to factors such as the continued investment in our production facilities, we ensure a secure supply during a market
upswing.
Lead time We understand consumer and lighting market dynamics and oer a lead time for middle-sized orders of 4-6 weeks.
Delivery performance Our supply chain performance is constantly greater than or equal to 96 percent
(adhering to the customer committed date).
Quality Our field failure rates are as low as 0.1 PPM.
Design-in support We have a large field application engineering team dedicated to providing professional and flexible support for your design.
www.infineon.com/ce
5
Ictam quodita dolorepChargers
10 W design: IPS65R1K5CE
15 W design: IPS65R1K0CE
Level [dBµV/m]
1G
Horizontal directionVertical directionHorizontal directionVertical direction
CoolMOS™ CE – smartphone and tablet chargers
Chargers for smartphones and tablets as well as other mobile applications demand for a growing output power at same
or smaller form factors, leading to increasing power density, and stringent requirements on thermal management, EMI
emissions and overall system cost. For example, many OEMs request a device temperature less than 90°C with an open
case and close case temperature less than 50°C.
Infineon recommends its series of 700 V CoolMOS™ CE superjunction MOSFETs for this application, which are used by
leading charger OEMs and design houses in their charger applications. Compared to planar MOSFETs the 700 V CoolMOS™
CE oers reduced switching and thus higher eiciency while passing EMI standards and ringing requirements. Several
reference designs have been developed by Infineon to help customers to simplify charger design and thus providing fast
time-to-market (see reference design selection table at end of section).
Value proposition of 700 V CoolMOS™ CE:
›
High eiciency, meeting application requirements
›
More than enough safety margin in thermals, for 10 W-25 W chargers
›
Good EMI performance – meets the EMI EN55022B standard without extra design-in eort
›
Easy-to-use product due to good controllability via gate resistor
›
Large breakdown voltage of nominal 700 V (and additional guard band typical) for safety on voltage spikes
Infineon recommends CoolMOS™ CE in 700 V for charger applications to secure suicient margin for voltage spikes.
CoolMOS™ CE products are also available in 650 V and 600 V for use in less sensitive designs.
EN 55022 B radiated HF-field
30 MHz – 1 GHz position
40
30
20
10
0
-10
30M50 60 80 100M
EN 55022 B RE 10 m OPEN 55022 B RE 10 m OP
200 300400 500 800 1G
Frequency [Hz]
40
30
20
10
Level [dBµV/m]
0
-10
30M50 60 80 100M200 300 400 500 800
EN 55022 B radiated HF-field
30 MHz – 1 GHz position
Frequency [Hz]
This figure shows the CoolMOS™ CE EMI performance in 10 W and 15 W charger applications. Maximum EMI limits are
indicated in the figure. CoolMOS™ CE could meet the EMI requirement thus oering design in flexibilities.
6
www.infineon.com/ce
15 W QC 2.0 charger powered by IPS70R2K0CEIPS70R2K0CE
86
100
IPS70R2K0CE
Competitor 700 V, 1.6 Ω
Eiciency [%]
92
100
Eiciency [%]
5 V9 V12 V
Soloreiust cone pratendeChargers
85.19
84.98
85.22
84.80
84
82.32
82
81.73
Competitor 700 V, 1.6
80
25 50 75
Load [%]
Infineon CoolMOS™ CE oers higher eiciency and better thermals than planar MOSFETs: When replacing a 1.6 Ω planar
MOSFET with an Infineon 2.0 Ω CoolMOS™ CE in a 15 W QC 2.0 charger we measured ≥0.2 percent eiciency improvement. At the
same time, the MOSFET temperature was 7°C cooler, showing a clear benefit of using CoolMOS™ CE for charger applications.
Infineon’s 24 W QC 2.0 charger powered by IPS70R950CEInfineon’s 24 W quick charger
90
88
86
84
82
80
Also for 24 W quick chargers CoolMOS™ CE oers excellent eiciency, e.g., with the IPS70R950CE. Besides eiciency it
passes other spec requirements. The board is orderable through Infineon’s sample center.
www.infineon.com/ce
25 50 75
Load \[%]
DEMO_24W_QUICKCHARGER
7
Ictam quodita dolorepChargers
CoolMOS™ CE – package options for charger application
IPAK Short Lead and DPAK
Standard packages used in chargers
today with excellent reliability and
wide usage in the industry
SOT-223
Highly cost optimized surface-mount
package with small footprint. The
SOT-223 shows slightly worse thermal
performance than DPAK, however this
can be compensated with little eort
by oering a slightly larger copper
area (~15 mm²) around the package
for heatsinking on the PCB (see
page 14, lighting application)
IPAK Short Lead with
Isolation Stando:
Innovative package for charger
applications providing a defined
stando between package and PBC
ThinPAK 5x6
Very flat package (0.8 mm height)
package targeting slim charger
solutions. Bottom side cooling is
applied by many customers, but heat
sinking through the top side is also
possible
I2PAK
Larger package with better thermal
performance than IPAK short lead for
more than 20 W charger application.
The package carries higher cost yet
saves eorts in heat sinking
www.infineon.com/ce
8
Soloreiust cone pratendeChargers
IPAK Short Lead with Isolation Stando
The new IPAK Short Lead with Mold Stopper will provide a defined stando
between package body and PCB for proper cleaning aer wave soldering to
avoid leakage current on board level. Mold bumps at the bottom of the package
body allow to fully insert the MOSFET into the PCB leaving a well-defined
isolation distance of 0.3 mm between the PCB and package body. Creepage
distance is increased and production yield is improved as area between
package and PCB can eectively be cleaned.
CoolMOS™ CE solutions for charger application
CoolMOS™ CE portfolio for charger – 700 V recommended for most designs
The CoolMOS™ CE series has been widely chosen by leading OEMs in notebook adapters. With ease-of-use, cost
competitiveness and short lead time as well as corresponding reference designs, customers can easily design CoolMOS™ CE
products in their adapters and have a faster time-to-market.
Value proposition of 600 V and 650 V CoolMOS™ CE for adapters
›
High eiciency exceeding values achieved with planar MOSFETs
›
Good thermals, especially for high density, small form factor designs
›
High breakdown voltage corridor – typical breakdown voltage by far exceeds specified max. value and is higher than
typical MOSFETs from other vendors
›
Easy-to-use product due to good controllability via gate resistor
Infineon’s 35 W adapter powered by IPD60R650CE:
Active-mode eiciency versus AC line input voltage
Infineon’s 35 W adapter reference design has been powered by IPD60R650CE, which oers an eiciency of more than
87 percent and a peak power of 45 W for 2 ms. The dynamic load response is only ±2 percent and standby power is below
100 mW. Customers could modify this board according to their requirements, gaining time-to-market. The board is
orderable through Infineon’s sample center.
89.0
88.5
88.0
87.5
87.0
86.5
86.0
R
G,ext
Oscillation due to di/dt
88.72
Oscillation due to dV/dt
C
par
R
88.45
88.06
87.70
90 115 230 264
AC line input voltage [VAC]
Optimization for EMI and eiciency/thermals
EMI and eiciency/thermals need a careful trade-o in notebook adapters
DS
– better eiciency/thermals require faster switching, which leads to worse
EMI, e.g., due to the oscillations triggered by a high dV/dt (di/dt). With a small
L
C
GD
G
G,in
C
GS
par
D
S
L
source
adjustment this challenge can be overcome. We recommend our customers to
optimize EMI when designing-in high voltage superjunction MOSFETs by:
Optimizing PCB layout for short path from controller to MOSFET gate and a
small loop inductance
›
Adjusting EMI filter (only if other measures are insuicient)
27 mm
35 mm89 mm
REF-35W Adapter
10
www.infineon.com/ce
Soloreiust cone pratendeNotebook adapters
Standard adapter
T
Narrow Lead
EMI optimization for a 45 W adapter
Radiation (db) in vertical direction
115 V
AC
IPA60R800CE-2.18*187.78-1.67*186.22
Competitor A (planar MOS)-7.74*120.13-8.72161.13
IPA60R800CE C
* Quasi-peak
: 100 pF-8.17*182.24-8.80*183.28
DS
Frequency [MHz]230 V
AC
Frequency [MHz]
The figure above shows a typical
Semi-slim adapter
example of adjusting EMI. It has been
done on a common 45 W adapter from
Slim adapter
the market, using a planar MOSFET.
Simply replacing the planar MOSFET
with IPA60R800CE leads to a worse
EMI performance. However, adding a
100 pF CDS significantly improves the
O-220 FullPAKTO-220 FullPAK
DPAK
EMI while meeting other specifications
such as eiciency, temperature, etc.
CoolMOS™ CE – Package options for notebook adapter application (35 W-65 W)
TO-220 FullPAK
Standard package used in
adapters today
TO-220 FullPAK Narrow Lead
Package for semi-slim adapter solution,
where height is smaller compared to
standard adapters. The legs of the
TO-220 FullPAK Narrow Lead package
have been modified with stando
height reduced from about 3.3 mm to
approximately 1.8 mm such that the
leads can be fully inserted into the PCB
without any production concerns. As a
result, MOSFET height is reduced while
creepage distance is preserved
DPAK
The DPAK solution has no concerns on
the package height for semi-slim and
slim adapter solutions, as its height
is far below the allowed height, and
it is on the other side of the package,
meaning space saving and power
density increasing, however better
thermal management is required
For standard adapterFor slim adapterFor semi-slim adapter
TO-220 FullPAKTO-252 DPAKTO-220 FullPAK Narrow Lead
www.infineon.com/ce
11
Ictam quodita dolorep
95
Eiciency [%]
TV sets
CoolMOS™ CE – TV sets
CoolMOS™ CE oers a wide range of products for the TV SMPS application and is selected by the world’s leading TV manufacturers
due to high quality, reliability and ease-of-use. Together with XDP™ digital power, OptiMOS™, EiceDRIVER™ and other components
from Infineon, we oer system solutions as demonstrated by a wide range of reference designs. Our dedication for TV application has
been further demonstrated by developing 600 V CoolMOS™ CE in TO-220 FullPAK Wide Creepage products mainly for TV application.
Value proposition of 500 V, 600 V, 650 V and 700 V CoolMOS™ CE for TV applications:
For the AC-DC power supply in TV applications, CoolMOS™ CE devices come in dierent voltage classes of 500 V, 600 V, 650 V
and 700 V so as to be used in both PFC and LLC stages. The CoolMOS™ CE devices are oered in dierent packages such as TO-220
FullPAK, TO-220 FullPAK Wide Creepage, DPAK and SOT-223. This variety enables customer to use these packages in dierent stages
of the power supply to ease the PCB layout design and manufacturing. As an example, the TO-220 FullPAK can be used in the topside PFC stage and the DPAK or SOT-223 can be used in the bottom side LLC stage making the layout simpler, and eiciently meeting
the thermal and EMI requirements. When CoolMOS™ CE devices are driven with optimal gate driving techniques, they exhibit low
temperature rise and provide high eiciency performance. These devices are robust and are capable of withstanding higher stress
under fault conditions. This high reliability feature makes them suitable for operation in environments which have unstable power
conditions. As an example, the stress on the PFC MOSFETs can be high under input line transient or faulty load conditions. The
CoolMOS™ CE devices safely carry high peak currents until the PWM controller responds to the transient condition.
Infineon’s 120 W TV SMPS design powered by IPD60R400CE and IPD60R1K5CE
Infineon oers a reference design for a 120 W TV SMPS which combines the advantages of XDP™ digital power and
CoolMOS™ CE to oer the state-of-the-art performance, where IDP2302 is used to control system, and IPD60R400CE and
IPD60R1K5CE are used in the PFC and LLC stages respectively. It is a slim design and cost optimized for customers.
New TO-220 FullPAK Wide Creepage package for CoolMOS™
TO-220 FullPAK
standard
3.3
2.54
Wider creepage for applications
susceptible to pollution
TO-220 FullPAK
The
to increase creepage distance: the application of potting, the usage of sleeves, pre-bending of leads and other
workarounds come at an extra cost of estimated 2-5 USD cents. This cost and the additional process steps can be
removed with the Wide Creepage package.
Wide Creepage reduces system cost by oering an alternative to frequently used approaches
TO-220 FullPAK
Wide Creepage
16.313.2
4.25
The TO-220 FullPAK Wide Creepage increases the creepage distance
to 4.25 mm compared to 2.54 mm for a standard TO-220 package. It
fully meets requirements of the EN60664-1 standard that requires
at least 3.6 mm for open frame electrical power supplies which are
oen found in LED TV, PC power or industrial power supplies: in these
applications, air vents in the external casing to allow some air flow
which will assist in cooling the internal components. This makes
the inside susceptible to pollutants such as dust particles. These
pollutants reduce the eective creepage between pins. High voltage
arcing can destroy the MOSFET used in SMPS when the pollutants
reduce the eective creepage distance.
Benefits
›
Wide creepage of 4.25 mm to avoid arcing even in polluted environment
›
Cost savings of 2-5 USD cent in creepage protection by removing additional process steps
›
Fully automated PCB assembly eliminating process variation
›
FullPAK benefit of isolation, lower package capacitances, lower EMI
CoolMOS™ CE oers 500 V, 600 V, 650 V and 700 V products in TO-220 FullPAK, TO-252 (DPAK) and TO-220 FullPAK Wide
Creepage for TV SMPS solutions. For the PFC section 500 V/600 V products with an R
preferred. We recommend 400 mΩ to 1500 mΩ 500 V/600 V products in the LLC section. For flyback 400 mΩ to 1500 mΩ
600 V/ 650 V parts are recommended for customer design.
www.infineon.com/ce
between 190 mΩ and 600 mΩ are
DS(on)
13
Ictam quodita dolorepLighting
3.5
6.5
CoolMOS™ CE for lighting applications
Good eiciency, ease-of-use and EMI performance at an attractive cost position make the CoolMOS™ CE series the product of choice for LED drivers or LED tubes in buck, flyback, PFC and LLC topology. Its benefits include an improvement in
eiciency and thermal behavior compared to standard MOSFETs.
CoolMOS™ products aimed at lighting bring the benefits of highest quality and delivery reliability as outlined in the overview section for the CoolMOS™ portfolio. However, the CoolMOS™ CE series has been defined with a particular focus on the
customers’ needs, for an attractive price and fastest supply availability.
CoolMOS™ CE in SOT-223 package
With the rapid conversion from CFL to LED lighting, customer requirements are rapidly changing: On the one hand, power
levels are further decreasing, while on the other hand, increasing cost pressure compels power designers to optimize designs to a fraction of a cent. The completion of the CoolMOS™ CE portfolio with the SOT-223 package is Infineon’s answer to
this challenge: It facilitates a further reduction in BOM cost – and additional footprint optimization in some designs – with
only a minor compromise in terms of thermal behavior.
SOT-223 as drop-in replacement for DPAK at a lower cost
The SOT-223 package with a decapped middle pin is fully compatible with the footprint of a DPAK, therefore allowing
one-on-one drop-in replacements and second sourcing.
DPAKSOT-223
6.2
6.7
6.5
3.5
14
www.infineon.com/sot-223
Soloreiust cone pratendeLighting
T [°C]
P
= 250 mW
Thermal behavior – on a par with DPAK
The thermal behavior of the SOT-223 primarily depends on the layout of the board where the package is used and on the
power consumed. We have measured the thermals in a test environment and compared them with a simulation. Compared to a DPAK positioned on a typical DPAK footprint, the SOT-223 displays the following thermal behavior:
70
65
60
55
57.8
DPAK on DPAK
footprint (reference)
loss
68.0
+10°C
SOT-223 on SOT-223
footprint
Good for low
›
power levels
Footprint savings
›
vs. DPAK
62.8
+5°C
SOT-223 on DPAK
footprint
Drop-in replacement
›
for DPAK
Good for designs
›
with thermal margin
Recommended use case
59.8
+2°C
SOT-223 on footprint
of DPAK + 20 mm
Replacement for DPAK
›
Good for designs
›
with suicient
cooling area
2
Cu
›
Same footprint as DPAK – when mounted on a standard DPAK footprint, the SOT-223 package shows a temperature
elevated by 4–5 K. This behavior makes the SOT-223 suitable for designs with a thermal margin
›
Footprint of DPAK plus ~20 mm2 additional copper area – in many designs, the MOSFET is mounted on a larger
Cu area which serves as a heatsink embedded in the PCB. As soon as 20 mm2 Cu or more is available in addition to the DPAK
footprint, the temperature increase is no more than 2–3 K above DPAK and the SOT-223 can be used as a drop-in replacement
›
SOT-223 on SOT-223 footprint – when mounted on the SOT-223 footprint without an additional surrounding Cu area, the
package leads to a 10 °C temperature increase compared to a DPAK. This means that the option of space savings via the
SOT-223 is only useful for very low power applications
www.infineon.com/sot-223
15
Ictam quodita dolorepLighting
footprint ~40 mm
Min. SO
footprint
350
Simulation result: P
= 250 mW, T
= 70°C, board 76 x 114 mm
Thermal behavior – on a par with DPAK
100
B
95
90
85
[°C]
j
T
80
75
70
65
T-223
loss
98°C
C
A
85°C
0
D
50100
Standard DPAK
amb
SOT-223 slightly higher temperature on
DPAK standard footprint – ∆T ~ 4–5°C
Same thermal performance of SOT-223 as
DPAK with a Cu footprint of ~60 mm
(increase of ~20 mm2 board space)
+4°C
150200
2
Cu area [mm
2
SOT-223
DPAK
2
]
250300
The laboratory findings on thermal behavior are confirmed by a thermal simulation with T
= 70°C and P
ambient
= 250 mW.
loss
The size of the copper area in the footprint is shown on the x-axis, while the y-axis displays the temperature of the package top side. In the case of an SOT-223 on DPAK footprint, the 4–5 K temperature increase over DPAK is confirmed. But
when used in conjunction with an enlarged copper area of ~20 mm2, a temperature increase of 2–3 K is measured.
Output power7.5 W
Input voltage90 V
Frequency50 Hz/60 Hz
Power factor> 0.95 at low line
THD< 20% at low line
Eiciency85%
Output voltage33 V
Output current180 mA
Infineon order code
1)
–265 V
AC
AC
> 0.80 at high line
< 30% at high line
–47 V
DC
DC
EVALLEDICL8201F1 / SP001339448
ICL5101 demoboard with 600 V CoolMOS™
2)
End applications: indoor and outdoor high power LED lighting,
high-bay and low-bay lighting, street lighting, parking garages
and area lighting, oice panel and shop lighting
ParameterValue
Output power110 W
Input voltage85 V
Output voltage54 V
Output current2060 mA
Eiciency~ 94%
Power factor> 99%
THD< 10%
TAmbient80°C–100°C
Infineon order code
1)
–305 V
AC
AC
DC
EVALLEDICL5101E1 / SP001296078
ICL8201 demoboard with 650 V CoolMOS™
End application: Single end cap T8 form factor LED lamp
ParameterValue
Output power18 W
Input voltage170 V
Frequency50 Hz
Power factor> 0.95
THD< 20%
Eiciency> 90%
Output voltage55 V
Output current270 mA
Infineon order code
1)
Go to our website for more specific information about the demoboard
2)
Also suitable for 500 V due to excellent V
3)
Launch in 09/2016, higher eiciency and lower price
1)
–277 V
AC
AC
–75 V
DC
DC
EVALLEDICL8201F2 / SP001339450
regulation and error protection
bulk
ICL8105 demoboard with 800 V CoolMOS™
End application: Electronic control gear
for LED luminaires (20 W–80 W)
ParameterValue
Output power40 W
Nominal input voltage90 V–300 V~
Input overvoltage310 V~
Output voltage15 V–45 V
Output overvoltage threshold50 V
Output current880 mA
Eiciency<91%
Power factor>0.95
THD
Infineon order code:
20 W-80 W version:
1)
<16%
EVALLEDICL8105F2 / SP001296076
EVALLEDICL8105E1 / SP001296074
3)
www.infineon.com/ce
17
Ictam quodita dolorepTarget topologies
CoolMOS™ CE – target topologies
Single switch topologies – boost/PFC
Typically used in high power adapters, PC power, TV power supplies front-end
PFC stage
MOSFET driver
Digital/analog controller
Design equations for MOSFET selection
= V
V
DS
out
ID = I
* 1 / (1-D)
out
= 1.5 * VDS (with derating for all variables on board)
V
DS_FET
max. 25°C for acceptable power dissipation in MOSFET package
R
DS(on)
= (1.5 * P
case operation conditions. Ipk = 1.5 * I
P
device
) / (Ipk² * D). Ipk is derated value of ID to cover all worst
device
= (Tj – Ta) / R
thJA
D
400 V at 0.5 A
18
* Two in parallel
Output power
[W]
20085 V
15085 V
10085 V
7585 V
Input voltage
[V]
…265 V
AC
…265 V
AC
…265 V
AC
…265 V
AC
PFC output load current at 400 V
output voltage
CoolMOS™ CE
device options
[A]
AC
AC
AC
AC
0.60IPx60R400CE*
0.40IPx60R460CE
0.30IPx60R650CE
0.20IPx60R800CE
www.infineon.com/ce
CoolMOS™ CE – target topologies
Quasi-resonant flyback topologies
Typically used in chargers, adapters, auxiliary power supplies
Soloreiust cone pratendeTarget topologies
PFC stage
MOSFET driver
Digital/analog controller
Design equations for MOSFET selection
= Vin + VR, where VR = (0.8 * V
V
DS
= Vin * ton / L
I
D
V
DS_FET
R
DS(on)
= (1.5 * P
case operation conditions. Ipk = 1.5 * I
P
= (Tj – Ta) / R
device
p
= 1.5 * VDS (with derating for all variables on board)
max. 25°C for acceptable power dissipation in MOSFET package
) / (Ipk² * D). Ipk is derated value of ID to cover all worst
device
thJA
* (NP / NS))
out
D
Snubber/
active clamp
MOSFET driver
PWM/QR stage - flyback
12 V at 3 A
Isolation
Selection is based for 85 V
to 265 VAC input voltage,
AC
100 kHz switching frequency. Reflected voltage (VR) design greatly aects MOSFET VDS selection criteria. Mode
of operation – CCM (continuous conduction mode) or
DCM (discontinuous conduction mode) also aects
MOSFET R
selection criteria.
DS(on)/ID
Output
power
[W]
12019671143IPx65R650CEIPx65R650CE
100245107214IPx65R650CEIPx65R1k0CE
75196107214IPx65R650CEIPx65R1k0CE
501210107214IPx65R650CEIPx65R1k0CE
361210143286IPx70R600CEIPx70R1K4CE
25913143286IPx70R950CEIPx70R1K4CE
15524143286IPx70R950CEIPx70R1K4CE
10524214429IPx70R1K4CEIPx70R1K4CE
5524429857IPx70R2K0CEIPx70R1K4CE
www.infineon.com/ce
Output
voltage
[V]
Turns ratio
NP/NS
Primary
inductance
DCM
[uH]
Primary
inductance
CCM
[uH]
CoolMOS™ CE
device options
DCM
CoolMOS™ CE
device options
CCM
19
Ictam quodita dolorepTarget topologies
CoolMOS™ CE – target topologies
Wide input range flyback topologies
Typically used in LED drivers and adapters
90 Vto 300 V
ACAC
Bridge rectifier
Digital/analog controller
Design equations for MOSFET selection
= V
+ VR, where VR = (0.8 * V
V
DS
in
= Vin * ton / L
I
D
V
DS_FET
max. 25°C for acceptable power dissipation in MOSFET pack-
R
DS(on)
age = (1.5 * P
case operation conditions. Ipk = 1.5 * I
P
= (Tj – Ta) / R
device
p
= 1.5 * VDS (with derating for all variables on board)
) / (Ipk² * D). Ipk is derated value of ID to cover all worst
device
thJA
* (NP / NS))
out
D
Snubber/
active clamp
MOSFET driver
PWM/QR stage - flyback
Isolation
Selection is based for 85 VAC to 300 VAC input voltage,
100 kHz switching frequency. Reflected voltage (VR) design
aects MOSFET VDS selection criteria. 800 V devices allow
greater VR range. Mode of operation – CCM (continuous
conduction mode) or DCM (discontinuous conduction
mode) also aects MOSFET R
selection criteria.
DS(on)/ID
5 V at 3 A
20
Output
power
[W]
Output
voltage
[V]
Turns ratio
NP/NS
Primary
inductance
DCM
[uH]
Primary
inductance
CCM
[uH]
CoolMOS™ CE
device options
DCM
CoolMOS™ CE
device options
CCM
15024571143IPA80R310CEIPA80R460CE
100245107214IPA80R310CEIPA80R650CE
501210107214IPA80R310CEIPA80R650CE
361210143286IPA80R460CEIPA80R1K0CE
25913143286IPA80R460CEIPA80R1K0CE
15524143286IPA80R460CEIPA80R1K0CE
10524214429IPA80R650CEIPA80R1K4CE
5524429857IPA80R1K0CEIPx80R2K8CE
www.infineon.com/ce
CoolMOS™ CE – target topologies
Single switch topologies – buck
Typically used in LED drivers, motor controllers, high power adapters, TV power supplies front-end
Buck
to 265 V
85 V
ACAC
24 V at 2 A
Soloreiust cone pratendeTarget topologies
Design equations for MOSFET selection
= V
V
DS
in
ID = I
out
V
= 1.5 * VDS (with derating for all variables on board)
DS_FET
max. 25°C for acceptable power dissipation in MOSFET package
R
DS(on)
= (1.5 * P
case operation conditions
) / (Ipk² * D). Ipk is derated value of ID to cover all worst
device
Input voltage
Output load current
[V]
110 V
AC
110 V
AC
85 V
…265 V
85 V
85 V
85 V
85 V
85 V
85 V
85 V
AC
AC
AC
AC
AC
AC
AC
AC
…265 V
…265 V
…265 V
…265 V
…265 V
…265 V
…265 V
AC
AC
AC
AC
AC
AC
AC
AC
[A]
Driver
Microcontroller
Output power
[W]
CoolMOS™ CE
device options
7200IPx50R190CE*
6180IPx50R280CE*
5150IPx60R400CE
4120IPx60R460CE
4100IPx60R650CE
375IPx60R650CE
350IPx60R1k0CE
225IPx60R1k5CE
210IPx60R2k1CE
15IPx60R3k4CE
* Two in parallel
www.infineon.com/ce
21
Ictam quodita dolorepTarget topologies
CoolMOS™ CE – target topologies
Two switch topologies – half-bridge LLC
Typically used in PC power and TV power supplies
The ideal MOSFET for the LLC converter would allow for zero dead time (maximum power transfer) and no conduction
loss. Hence selecting a lower R
appropriate MOSFET QG, Q
caused by E
can be considered negligible, and to this extent, E
oss
oss
MOSFET will help lower condition losses. Since LLC operates fully in ZVS-mode (given
DS(on)
, selected Q
and m-values – and ample pre-programmed deadtime), switching loss
max
is not a critical MOSFET parameter for LLC.
oss
From PFC
output
Half-bridge driver
Digital/
analog controller
Design equations for MOSFET selection
= V
V
DS
in
ID = I
* (NS / NP)
out
= 1.5* VDS (with derating for all
V
DS_FET
variables on board)
max. 25°C for acceptable power
R
DS(on)
dissipation in MOSFET package = (1.5 * P
(Ipk² * D). Ipk is derated value of ID to cover all
worst case operation conditions
device
LLC half-bridge
Isolation
12 V at 10 A
In LLC topology, the MOSFET body diode could potentially experience hard
current commutation in abnormal conditions, if steps are not taken specifically to avoid this either by a good control scheme or additional circuitry in the
topology. The CoolMOS™ CE addresses the potential issue of reverse recovery of
body diode by employing a self-snubbing scheme causing the channel to partial-
) /
ly turn on at high dV/dt (induced by C
voltage divider) in order to prevent
GD/CGS
avalanche breakdown, thus providing the extra measure of protection during
hard body diode commutation.
Order number: B152-I0298-V1-7600-EU-EC-P
Date: 11 / 2016
Please note!
THIS DOCUMENT IS FOR INFORMATION PURPOSES ONLY AND
ANY INFORMATION GIVEN HEREIN SHALL IN NO EVENT BE
REGARDED AS A WARRANTY, GUARANTEE OR DESCRIPTION OF
ANY FUNCTIONALITY, CONDITIONS AND/OR QUALITY OF OUR
PRODUCTS OR ANY SUITABILITY FOR A PARTICULAR PURPOSE.
WITH REGARD TO THE TECHNICAL SPECIFICATIONS OF OUR
PRODUCTS, WE KINDLY ASK YOU TO REFER TO THE RELEVANT
PRODUCT DATA SHEETS PROVIDED BY US. OUR CUSTOMERS AND
THEIR TECHNICAL DEPARTMENTS ARE REQUIRED TO EVALUATE
THE SUITABILITY OF OUR PRODUCTS FOR THE INTENDED
APPLICATION.
WE RESERVE THE RIGHT TO CHANGE THIS DOCUMENT AND/OR
THE INFORMATION GIVEN HEREIN AT ANY TIME.
Additional information
For further information on technologies, our products, the
application of our products, delivery terms and conditions
and/or prices, please contact your nearest Infineon Technologies
oice (www.infineon.com).
Warnings
Due to technical requirements, our products may contain
dangerous substances. For information on the types in question,
please contact your nearest Infineon Technologies oice.
Except as otherwise explicitly approved by us in a written
document signed by authorized representatives of Infineon
Technologies, our products may not be used in any
life-endangering applications, including but not limited to medical, nuclear, military, life-critical or any other applications where
a failure of the product or any consequences of the use thereof
can result in personal injury.
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