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For further information on te ch nology, delivery terms and conditions and prices please contact your nearest
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Infineon Technologies Components may only be used in life-support devices or systems with the express written
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of that life - su ppo rt de vi ce o r system, or to aff ec t th e sa fety or effectiveness of that devi ce o r system. Life supp ort
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Data Sheet, V2.0, Dec. 2000
C165
16-Bit Single-Chip Microcontroller
Microcontrollers
Never stop thinking.
C165
Revision History:2000-12V2.0
Previous Version:1998-12Update 0.5µ technology
01.963 Volt Addendum
07.9525 MHz Addendum
09.94Data Sheet
PageSubjects (major changes since last revision)
AllConverted to Infineon layout
2ROM derivatives removed, 25-MHz derivatives and 3 V derivatives
included
6ffPin numbers for TQFP added
14Address window arbitration and master/slave mode introduced
32New standard layout for section “Absolute Maximum Ratings”
33Section “Operating Condition s” added
34fParameter “RSTIN
pullup” replaced by “RSTIN current”
36fDC Characteristics for reduced supply voltage added
38fSeparate specification for power consumption with greatly improved values
40ffDescription of clock generation improved
45, 55, 65Timing adapted to 25 MHz
48, 58, 66Timing for reduced supply voltage added
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C166 Family
C165
• High Performance 16-bit CPU with 4-Stage Pipeline
– 80 ns Instruction Cycle Time at 25 MHz CPU Clock
– 400 ns Multiplication (16 × 16 bit), 800 ns Division (32 / 16 bit)
– Enhanced Boolean Bit Manipulation Facilities
– Additional Instructions to Support HLL and Operating Systems
– Register-Based Design with Multiple Variable Register Banks
– Single-Cycle Context Switching Support
– 16 MBytes Total Linear Address Space for Code and Data
– 1024 Bytes On-Chip Special Function Register Area
• 16-Priority-Level Interrupt System with 28 Sources, Sample-Rate down to 40 ns
• 8-Channel Interrupt-Driven Single-Cycle Data Transfer Facilities via
Peripheral Event Controller (PEC)
• Clock Generation via prescaler or via direct clock input
• On-Chip Peripheral Modules
– Two Multi-Functional General Purpose Timer Units with 5 Timers
– Two Serial Channels (Synchronous/Asynchronous and High-Speed-Synchronous)
• Up to 16 MBytes External Address Space for Code and Data
– Programmable External Bus Characteristics for Different Address Ranges
– Multiplexed or Demultiplexed External Address/Data Buses with 8-Bit or 16-Bit
Data Bus Width
– Five Programmable Chip-Select Signals
– Hold- and Hold-Acknowledge Bus Arbitration Support
• Idle and Power Down Modes
• Programmable Watchdog Timer
• Up to 77 General Purpose I/O Lines,
partly with Selectable Input Thresholds and Hysteresis
• Power Supply: the C165 can operate from a 5 V or a 3 V power supply
• Supported by a Large Range of Development Tools like C-Compilers,
Macro-Assembler Packages, Emulators, Evaluation Boards, HLL-Debuggers,
Simulators, Logic Analyzer Disassemblers, Programming Boards
• On-Chip Bootstrap Loader
• 100-Pin MQFP Package (0.65 mm pitch)
• 100-Pin TQFP Package (0.5 mm pitch)
C16516-Bit Single-Chip Microcontroller
Data Sheet1V2.0, 2000-12
C165
This document describes several derivatives of the C165 grou p. Table 1 enumerates
these derivatives and summarizes the differences. As this document refers to all of these
derivatives, some descriptions may not apply to a specific product.
Table 1C165 Derivative Synopsis
Derivative
1)
SAF-C165-LM20 MHz4.5 to 5.5 VMQFP-100
SAB-C165-LM20 MHz4.5 to 5.5 VMQFP-100
SAF-C165-L25M25 MHz4.5 to 5.5 VMQFP-100
SAB-C165-L25M25 MHz4.5 to 5.5 VMQFP-100
SAF-C165-LF20 MHz4.5 to 5.5 VTQFP-100
Max. Operating
Frequency
Operating
Voltage
Package
SAB-C165-LF20 MHz4.5 to 5.5 VTQFP-100
SAF-C165-L25F25 MHz4.5 to 5.5 VTQFP-100
SAB-C165-L25F25 MHz4.5 to 5.5 VTQFP-100
SAF-C165-LM3V20 MHz3.0 to 3.6 VMQFP-100
SAB-C165-LM3V20 MHz3.0 to 3.6 VMQFP-100
SAF-C165-LF3V20 MHz3.0 to 3.6 VTQFP-100
SAB-C165-LF3V20 MHz3.0 to 3.6 VTQFP-100
1)
This Data Sheet is valid for devic es start ing with and including design st ep H A.
For simplicity all versions are referred to by the term C165 throughout this document.
Ordering Information
The ordering code for Infineon microcontrollers provides an exact reference to the
required product. This ordering code identifies:
• the derivative itself, i.e. its function set, the temperature range, and the supply voltage
• the package and the type of delivery.
For the available ordering codes for the C165 please refer to the “Product CatalogMicrocontrollers”, which summarizes all available microcontroller variants.
Note: The ordering codes for Mask-ROM versions are defined for each product after
verification of the respective ROM code.
Data Sheet2V2.0, 2000-12
C165
Introduction
The C165 is a derivativ e of the Infineon C1 66 Family of full featured si ngle -chi p CMOS
microcontrollers. It combin es high CPU perfo rman ce (up to 12 .5 mi llion instructions per
second) with peripheral functionality and enhanced IO-capabilities. The C165 is
especially suited for cost sensitive applications.
to the internal clock generator
XTAL2:Output of the oscillator amplifier circuit.
To clock the device from an external source, drive
XTAL1, while leaving XTAL2 unconnected.
Minimum and maximum high/low and rise/fall times
specified in the AC Characteristics must be
observed.
Port 3 is a 15-bit bidirectional I/O port. It is bit-wise
programmable for input or output via direction bits.
For a pin configured as input, the output driver is put
into high-impedance state. Port 3 outputs can be
configured as push/pull or open drain drivers. The
Port 3 pins serve for following alternate functions:
Output/Input
TxD0ASC0 Clock/Data Output (Asyn./Sync.)
RxD0ASC0 Data Inp. (Asyn.) or In/Out (Sync)
BHE
WRH
Ext. Memory High Byte Enable Signal,
Ext. Memory High Byte Write Strobe
SCLKSSC Master Cl. Output / Slave Cl. Input
CLKOUTSystem Clock Output (= CPU Clock)
Data Sheet6V2.0, 2000-12
Table 2Pin Definitions and Functions (cont’d)
C165
Symbol Pin Nr
TQFP
P4
P4.0
P4.1
P4.2
P4.3
P4.4
P4.5
P4.6
P4.7
RD
WR
/
23
24
25
26
29
30
31
32
3335OExternal Memory Read Strobe. RD is activated for
3436OExternal Memory Write Strobe. In WR-mode this pin
WRL
Pin Nr
MQFP
25
26
27
28
31
32
33
34
Input
Outp.
IO
O
O
O
O
O
O
O
O
Function
Port 4 is an 8-bit bidirectional I/O port. It is bit-wise
programmable for input or output via direction bits.
For a pin configured as input, the output driver is put
into high-impedance state. Port 4 can be used to
output the segment address lines:
A16Least Significant Segment Address Line
A17Segment Address Line
A18Segment Address Line
A19Segment Address Line
A20Segment Address Line
A21Segment Address Line
A22Segment Address Line
A23Most Significant Segment Address Line
every external instruction or data read access.
is activated for every external data write access. In
-mode this pin is activated for low byte data
WRL
write accesses on a 16-bit bus, and for every data
write access on an 8-bit bus. See WRCFG in register
SYSCON for mode selection.
READY
3537IReady Input. When the Ready function is enabled, a
high level at this pin during an external memory
access will force the insertion of memory cycle
waitstates until the pin returns to a low level.
An internal pullup device holds this pin high when
nothing is driving it.
ALE3638OAddress Latch Enable Output. Can be used for
latching the address into external memory or an
address latch in the multiplexed bus modes.
EA
3739IExternal Access Enable pin. A low level at this pin
during and after Reset forces the C165 to begin
instruction execution out of external memory. A high
level forces execution out of the internal program
memory.
“ROMless” versions must have this pin tied to ‘0’.
Data Sheet7V2.0, 2000-12
Table 2Pin Definitions and Functions (cont’d)
C165
Symbol Pin Nr
TQFP
Pin Nr
MQFP
Input
Outp.
Function
NC4042–This pin is not connected in the C165.
No connection to the PCB is required.
PORT0
P0L.0-7
41-48
43-50
IOPORT0 consists of the two 8-bit bidirectional I/O
ports P0L and P0H. It is bit-wise programmable for
input or output via direction bits. For a pin configured
P0H.0-7
51-58
53-60
as input, the output driver is put into high-impedance
state. In case of an external bus configuration,
PORT0 serves as the address (A) and address/data
(AD) bus in multiplexed bus modes and as the data
(D) bus in demultiplexed bus modes.
IOPORT1 consists of the two 8-bit bidirectional I/O
ports P1L and P1H. It is bit-wise programmable for
input or output via direction bits. For a pin configured
as input, the output driver is put into high-impedance
state. PORT1 is used as the 16-bit address bus (A)
in demultiplexed bus modes and also after switching
from a demultiplexed bus mode to a multiplexed bus
mode.
Data Sheet8V2.0, 2000-12
Table 2Pin Definitions and Functions (cont’d)
C165
Symbol Pin Nr
TQFP
Pin Nr
MQFP
Input
Outp.
Function
RSTIN7981I/OReset Input with Schmitt-Trigger characteristics. A
low level at this pin while the oscillator is running
resets the C165. An internal pullup resistor permits
power-on reset using only a capacitor connected to
V
. A spike filter suppresses input pulses < 10 ns.
SS
Input pulses >100 ns safely pass the filter. The
minimum duration for a safe recognition should be
100 ns + 2 CPU clock cycles.
In bidirectional reset mode (enabled by setting bit
BDRSTEN in register SYSCON) the RSTIN
line is
internally pulled low for the duration of the internal
reset sequence upon any reset (HW, SW, WDT).
See note below this table.
Note: To let the reset configuration of PORT0 settle
a reset duration of ca. 1 ms is recommended.
RST
OUT
8082OInternal Reset Indication Output. This pin is set to a
low level when the part is executing either a
hardware-, a software- or a watchdog timer reset.
RSTOUT
remains low until the EINIT (end of
initialization) instruction is executed.
NMI
8183IN on-Maskable Interrupt Input. A high to low
transition at this pin causes the CPU to vector to the
NMI trap routine. When the PWRDN (power down)
instruction is executed, the NMI
pin must be low in
order to force the C165 to go into power down mode.
If NMI
is high, when PWRDN is exec uted, the part
will continue to run in normal mode.
If not used, pin NMI
should be pulled high externally.
Data Sheet9V2.0, 2000-12
Table 2Pin Definitions and Functions (cont’d)
C165
Symbol Pin Nr
TQFP
P6
P6.0
P6.1
P6.2
P6.3
P6.4
P6.5
P6.6
P6.7
82
83
84
85
86
87
88
89
P2
P2.8
P2.9
P2.10
P2.11
P2.12
P2.13
P2.14
P2.15
90
91
92
93
94
95
96
97
Pin Nr
MQFP
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
Input
Outp.
IO
O
O
O
O
O
I
I/O
O
IO
I
I
I
I
I
I
I
I
Function
Port 6 is an 8-bit bidirectional I/O port. It is bit-wise
programmable for input or output via direction bits.
For a pin configured as input, the output driver is put
into high-impedance state. Port 6 outputs can be
configured as push/pull or open drain drivers.
The Port 6 pins also serve for alternate functions:
CS0
CS1
CS2
CS3
CS4
HOLD
HLDA
Port 2 is an 8-bit bidirectional I/O port. It is bit-wise
programmable for input or output via direction bits.
For a pin configured as input, the output driver is put
into high-impedance state. Port 2 outputs can be
configured as push/pull or open drain drivers. The
following Port 2 pins serve for alternate functions:
EX0INFast External Interrupt 0 Input
EX1INFast External Interrupt 1 Input
EX2INFast External Interrupt 2 Input
EX3INFast External Interrupt 3 Input
EX4INFast External Interrupt 4 Input
EX5INFast External Interrupt 5 Input
EX6INFast External Interrupt 6 Input
EX7INFast External Interrupt 7 Input
P5
I
Port 5 is a 6-bit input-only port with Schmitt-Trigger
char. The pins of Port 5 also serve as timer inputs:
+ 5 V or + 3 V during normal operation and idle
mode.
2.5 V during power down mode.
≥
–Digital Ground.
70, 77
Note: The following behavioural differences must be observed when the bidirectional
reset is active:
• Bit BDRSTEN in register SYSCON cannot be changed after EINIT and is cleared
automatically after a reset.
• The reset indication flags always indicate a long hardware reset.
• The PORT0 c onfig uration is tr eated l ike on a hardw are res et. Espe ciall y the bo otstra p
loader may be activated when P0L.4 is low.
•Pin RSTIN
may only be connected to external reset devices with an open drain output
driver.
• A short hardware reset is extended to the duration of the internal reset sequence.
Data Sheet11V2.0, 2000-12
C165
Functional Description
The architecture of the C165 combines advantages of both RISC and CISC processors
and of advanced peripheral subsystems in a very well-balanced way. In addition the
on-chip memory blocks allow the design of compact systems with maximum
performance.
The following block diagram gives an overview of the different on-chip components and
of the advanced, high bandwidth internal bus structure of the C165.
Note: All time specifications refer to a CPU clock of 25 MHz
(see definition in the AC Characteristics section).
8
8
ProgMem
Internal
ROM
Area
XBUS Control
Port 4
External Bus
Control
Port 6
Port 0
EBC
16
32
Instr. / Data
16
16
On-Chip XBUS (16-Bit Demux)
Port 1
16
External Instr. / Data
Interrupt Controller
ASC0
(USART)
BRGen
C166-Core
CPU
SSC
(SPI)
BRGen
15
PEC
16-Level
Priority
GPT
T2
T3
T4
T5
T6
Interrupt Bus
Peripheral Data Bus
Data
Data
16
16
IRAM
Internal
Dual Port
2 KByte
Osc
RAM
XTAL
WDT
16
8
Port 2
Port 5Port 3
6
Figure 4Block Diagram
The program memory, the internal R AM (IRAM) and the set of generic peripherals are
connected to the CPU via separate buses. A fourt h bus, the XBUS, connects ext ernal
resources as well as additional on-chip resoures, the X-Peripherals (see Figure 4).
Data Sheet12V2.0, 2000-12
C165
Memory Organization
The memory space of the C165 is configured in a Von Neumann architecture which
means that code memory, data memory, registers and I/O ports are organized within the
same linear address space which includes 16 MBytes. The entire memory space can be
accessed bytewise or wordwise. Particular portions of the on-chip memory have
additionally been made directly bitaddressable.
The C165 is prepared to incorporate on-chip program memory (not in the ROM-less
derivatives, of course) for code or constant data. The internal ROM area can be mapped
either to segment 0 or segment 1.
2 KBytes of on-chip Internal RAM (IRAM) are provided as a storage for user defined
variables, for th e system stack, general purpo se register banks and even for code. A
register bank can consist of up to 16 wordwide (R0 to R15) and/or bytewide (RL0, RH0,
…, RL7, RH7) so-called General Purpose Registers (GPRs).
1024 bytes (2×512 bytes) of the address space are reserved for the Special Func tion
Register areas (SFR space and ESFR sp ace). SFRs are w ordwide registers which are
used for controlling and monitoring functions of the different on-chip units. Unused SFR
addresses are reserved for future members of the C166 Family.
In order to meet the n eed s of d esi gns w he re m ore m emo ry is required than is provi ded
on chip, up to 16 MBytes of external RAM and/or ROM can be connected to the
microcontroller.
Data Sheet13V2.0, 2000-12
C165
External Bus Controller
All of the external memory accesses are performed by a particular on-chip External Bus
Controller (EBC). It can be programmed either to Single Chi p Mode when no external
memory is required, or to one of four different external memory access modes, which are
as follows:
In the demultiplexed bus modes, addresses are output on PORT1 and data is input/
output on PORT0 or P0L, respectively. In the mul tiplexed bus modes both addresses
and data use PORT0 for input/output.
Important timing characteristics of the external bus interface (Memory Cycle Time,
Memory Tri-State Time, Length of ALE and Read Write Delay) have been made
programmable to allow the user the adaption of a wide range of different types of
memories and external peripherals.
In addition, up to 4 indepen dent address windows may be defined (via register pairs
ADDRSELx / BUSCONx) which co ntrol the access to diff erent resources with different
bus characteristics. These address windows are arranged hierarchically where
BUSCON4 overrides BUSCON3 and BUSCON2 overrides BUSCON1. All accesses to
locations not covered by these 4 address windows are controlled by BUSCON0.
Up to 5 external CS
external glue logic. The C165 offers the possibility to switch the CS
unlatched mode. In this m ode the intern al filter logic is switched o ff and the CS
are directly genera ted from the address . The u nlatch ed CS
signals (4 windows plus de fault) can be generated in order to save
outputs to an
signals
mode is enabled by setting
CSCFG (SYSCON.6).
Access to very sl ow m emories or me morie s wi th va ry ing a ccess times i s sup ported via
a particular ‘Ready’ function.
A HOLD
/HLDA protocol is available for bus arbitration and allows to share external
resources with other bus ma sters. The bus arbitration is en abled by setting bit HLDEN
in register PSW. After setting HLDEN once, pins P6.7 … P6.5 (BREQ
, HLDA, HOLD)
are automatically controlled by the EBC. In Master M ode (def ault after reset) the HLDA
pin is an output. By setti ng bit DP6.7 to ‘1’ th e Sla ve Mod e is s elec ted w here pin HLD A
is switched to input. This allows to directly connect the slave controller to another master
controller without gl ue logic.
For applications which require less than 16 MBytes of external memory space, this
address space can be restricted to 1 MByte, 256 KByte, or to 64 KByte. In this case
Port 4 ou tputs four, two, or no address lines at all. It outputs all 8 address lines, if an
address space of 16 MBytes is used.
Data Sheet14V2.0, 2000-12
C165
Central Processing Unit (CPU)
The main core of the C PU consis ts of a 4 -stage inst ructi on pipelin e, a 16-b it arithmetic
and logic unit (ALU) and dedicated SFRs. Additional hardware has been spent for a
separate multiply and divide unit, a bit-mask generator and a barrel shifter.
Based on these hardware prov isions, most of the C165’s instructions c an be executed
in just one machine cycle which requires 80 ns at 25 MHz CPU clock. For example, shift
and rotate instructions are al ways proce ssed du ring one m achine c ycle in dep endent of
the number of bits to be shifted. All multiple-cycle instructio ns have been optimized so
that they can be executed very fast as well: branches in 2 cycles, a 16×16 bit
multiplication in 5 cycles and a 32-/16 bit division in 10 cycles. Another pipeline
optimization, the so-called ‘Jump Cache’, allows reducing the execution time of
repeatedly performed jumps in a loop from 2 cycles to 1 cycle.
The CPU has a regis ter context consis ting of up to 16 wordwide GPRs at its disposal.
These 16 GPRs are physically allocated within the on-chip RAM area. A Context Pointer
(CP) register determines the base address of the active register bank to be accessed by
the CPU at any time. The number of register banks is only rest ricted by the available
internal RAM space. For easy parameter passing, a register bank may overlap others.
A system stack of up to 1024 words is provided as a storage for temporary data. The
system stack is allocated in the on-chip RAM area, and it is accessed by the CPU via the
stack pointer (SP) register. Two separate SFRs, STKOV and STKUN, are implicitly
compared against the stack pointer value upon each stack access for the detection of a
stack overflow or underflow.
The high performance offered by the hardware implementation of the CPU can efficiently
be utilized by a programme r via the high ly efficient C165 instru ction set whic h includes
the following instruction classes:
– Arithmetic Instructions
– Logical Instructions
– Boolean Bit Manipulation Instructions
– Compare and Loop Control Instructions
– Shift and Rotate Instructions
– Prioritize Instruction
– Data Movement Instructions
– System Stack Instructions
– Jump and Call Instructions
– Return Instructions
– System Control Instructions
– Miscellaneous Instructions
The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes
and words. A variety of direc t, indirect or i mmediate ad dressing mod es are provid ed to
specify the required operands.
Data Sheet16V2.0, 2000-12
C165
Interrupt System
With an interrupt response tim e within a ran ge fro m just 5 to 12 CPU cl ock s (in case of
internal program execution), the C165 is capable of reacting very fast to the occurrence
of non-deterministic events.
The architecture of the C165 supports several mechanisms for fast and flexible response
to service requests that can be generated from various sources internal or external to the
microcontroller. Any of these interrupt requests can be programmed to being serviced by
the Interrupt Controller or by the Peripheral Event Controller (PEC).
In contrast to a standard interrupt service where the current program execution is
suspended and a branch to the interrupt vector table is performed, just one cycle is
‘stolen’ from the current CPU activity to perform a PEC service. A PEC service implies a
single byte or word data transfer be tween any two memory location s with an additio nal
increment of either the PEC source or the destination pointer. An individual PEC transfer
counter is implici ty decremented for each PEC service except when performing in the
continuous transfer mode. When this counter reaches zero, a standard interrupt is
performed to the correspon ding source related vector loc ation. PEC services are very
well suited, for example, for sup porting the transmissi on or reception of blocks of data.
The C165 has 8 PEC channels each of which offers such fast interrupt-driven data
transfer capabilities.
A separate control register which con tains an interrupt requ est flag, an interrupt ena ble
flag and an interrupt priority bitfield exists for each of the possible interrupt sources. Via
its related register, each sou rce can be progra mmed to one of six teen interrupt pri ority
levels. Once having been accepted by the CPU, an interrupt service can only be
interrupted by a higher prioritized service request. For the standard interrupt processing,
each of the possible interrupt sources has a dedicated vector location.
Fast external interrupt inputs are provided to service external interrupts with high
precision requirements. These fast interrupt inputs feature programmable edge
detection (rising edge, falling edge or both edges).
Software interrupts are supported by means of the ‘TRAP’ instruction in combination with
an individual trap (interrupt) number.
Table 3 shows all of the possible C165 interrupt sources and the corresponding
hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers.
Note: Interrupt nodes which are not used by associated peripherals, may be used to
generate software controlled interrupt requests by setting the respective interrupt
request bit (xIR).
The C165 also provide s an excellen t mechanis m to identif y and to proces s exceptions
or error conditions that arise during run-time, so-called ‘Hardware Traps’. Hardware
traps cause immediate non-maskable system reaction which is similar to a standard
interrupt service (b ranching to a dedicated vector table location). The occurence of a
hardware trap is additio nally signified by a n i ndi vid ual bit in the trap fla g regis ter (TFR ).
Except when another higher prioritized trap service is in progress, a hardware trap will
interrupt any actual program execution. In turn, hardware trap services can normally not
be interrupted by standard or PEC interrupts.
Table 4 shows all of the possible exceptions or error conditions that can arise during run-
Class A Hardware Traps:
– Non-Maskable Interrupt
– Stack Overflow
– Stack Underflow
NMI
STKOF
STKUF
Class B Hardware Traps:
– Undefined Opcode
– Protected Instruction
UNDOPC
PRTFLT
Fault
– Illegal Word Operand
ILLOPA
Access
– Illegal Instruction
ILLINA
Access
– Illegal External Bus
ILLBUS
Access
Trap
Vector
RESET
RESET
RESET
NMITRAP
STOTRAP
STUTRAP
BTRAP
BTRAP
BTRAP
BTRAP
BTRAP
Vector
Location
00’0000
00’0000
00’0000
00’0008
00’0010
00’0018
00’0028
00’0028
00’0028
00’0028
00’0028
H
H
H
H
H
H
H
H
H
H
H
Trap
Number
00
H
00
H
00
H
02
H
04
H
06
H
0A
H
0A
H
0A
H
0A
H
0A
H
Trap
Priority
III
III
III
II
II
II
I
I
I
I
I
Reserved––[2C
3C
Software Traps
– TRAP Instruction
––Any
[00’0000
00’01FC
H
H
–
]
[0B
–
H
]
0F
H
Any
–
H
]
H
[00
7F
–
H
]
H
–
Current
CPU
Priority
in steps
of 4
H
Data Sheet19V2.0, 2000-12
C165
General Purpose Timer (GPT) Unit
The GPT unit represents a very flexible multifunctional timer/counter structure which
may be used for many different tim e related tasks such as event timi ng and counting,
pulse width and duty cycle measurements, pulse generation, or pulse multiplication.
The GPT unit incorporates five 16-bit timers which are organized in two separate
modules, GPT1 and GPT2. Each timer in eac h mod ule may op erate inde pend ently in a
number of different modes, or may be concatenated with another timer of the same
module.
Each of the three timers T2 , T3, T4 o f module G PT1 c an be c onfigu red i ndiv iduall y for
one of four basic modes of operation, which are Timer, Gated Timer, Counter, and
Incremental Interface Mode. In Timer Mode, the input clock for a ti mer is derived from
the CPU clock, divided by a programmable prescaler, while Counter Mode allows a timer
to be clocked in reference to external events.
Pulse width or duty cycle measurement is supporte d in Gated Timer Mode, where the
operation of a timer is controlled by the ‘g ate’ level on an external input pi n. For these
purposes, each timer h as one a ssocia ted p ort pin (TxIN ) whic h serves as gate or clo ck
input. The maximum resolution of the timers in module GPT1 is 16 TCL.
The count direction (up/down) for each timer is programmable by software or may
additionally be altered dynamically by an external signal on a port pin (TxEUD) to
facilitate e.g. position tracking.
In Incremental Interface Mod e the GPT1 timers (T2, T3, T4 ) can be directly co nnected
to the incremental posi tion senso r signal s A and B via their respectiv e inputs Tx IN and
TxEUD. Direction and count si gnals are internally derived from these two in put signa ls,
so the contents of the re spe ctiv e ti mer Tx co rresp onds to the s en sor p osi tion . The third
position sensor signal TOP0 can be connected to an interrupt input.
Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer overflow/underflow. The state of this latch may be output on pin T3OUT e.g. for time out
monitoring of external hardware com ponents, or may be used interna lly to clock ti mers
T2 and T4 for measuring long time periods with high resolution.
In addition to their basic operating modes, timers T2 and T4 may be configured as reload
or capture registers for timer T3. When used as capture or re load registers, timers T2
and T4 are stopped. The contents of timer T3 is captured into T2 or T4 in response to a
signal at their associated input pins (TxIN). Timer T3 is reloaded with the contents of T2
or T4 triggered either by an external signal or by a selectable state transition of its toggle
latch T3OTL. When bot h T2 a nd T 4 are configured to alternate ly re loa d T3 on opposite
state transitions of T3OT L with the low and hig h tim es of a PWM sign al, th is signa l can
be constantly generated without software intervention.
Data Sheet20V2.0, 2000-12
C165
T2EUD
T2IN
T3IN
T3EUD
T4IN
CPU
CPU
CPU
U/D
2n : 1f
2n : 1f
2n : 1f
T2
Mode
Control
T3
Mode
Control
T4
Mode
Control
GPT1 Timer T2
Reload
Capture
Toggle FF
GPT1 Timer T3T3OTL
U/D
Capture
Reload
GPT1 Timer T4
Interrupt
Request
Interrupt
Request
T3OUT
Other
Timers
Interrupt
Request
T4EUD
U/D
MCT02141
n = 3 … 10
Figure 6Block Diagram of GPT1
With its maximum resolution of 8 TCL, the GPT2 module provides precise event control
and time measurement. It includes two timers (T5, T6) and a capture/reload register
(CAPREL). Both timers can be clocked with an input clock which is derived from the CPU
clock. The count direction (up/down) for each timer is programmable by software.
Concatenation of the timers is supported via the output toggle latch (T6OTL) of timer T6,
which changes its state on each timer overflow/underflow.
The state of this latch may be us ed to clock timer T5 and/or it may be output on pin
T6OUT. The overflows/underflows of timer T6 can cause a reload from the CAPREL
register. The CAPREL register may capture the contents of timer T5 based on an
external signal transition on the corresponding port pin (CAPIN), and timer T5 may
optionally be cleared after the capture procedure. This allows the C165 to measure
absolute time differences or to perform pulse multiplication without software overhead.
Data Sheet21V2.0, 2000-12
C165
The capture trigger (timer T5 to CAPREL) may also be generated upon tran sitions of
GPT1 timer T3’s inputs T3IN and/or T3EUD . This is es pecially a dvantageou s when T3
operates in Incremental Interface Mode.
T5EUD
T5IN
CAPIN
T6IN
CPU
T3
CPU
2n : 1f
2n : 1f
T5
Mode
Control
MUX
CT3
T6
Mode
Control
Clear
Capture
U/D
GPT2 Timer T5
GPT2 CAPREL
GPT2 Timer T6
U/D
T6OTL
Interrupt
Request
Interrupt
Request
Interrupt
Request
T6OUT
Other
Timers
T6EUD
MCB03999
n = 2 … 9
Figure 7Block Diagram of GPT2
Data Sheet22V2.0, 2000-12
C165
Serial Channels
Serial communication with other microcontrollers, processors, terminals or external
peripheral components is provided by two serial interfaces with different functionality, an
Asynchronous/Synchronous Serial Channel (ASC0) and a High-Speed Synchronous
Serial Channel (SSC).
The ASC0 is upward compatible with the serial ports of the Infineon 8-bit microcontroller
families and supports full-duplex asynchronous communication at up to 781 KBaud and
half-duplex synchronous communication at up to 3.1 MBaud (@ 25 MHz CPU clock).
A dedicated baud rate generator allows to set up all standard baud rates without
oscillator tuning. For transmission, reception and error handling 4 separate interrupt
vectors are provided . In asyn chro nou s mode, 8- or 9- bit data f rame s are trans mit ted or
received, preceded by a start bit and terminated by one or two stop bits. For
multiprocessor communication, a mechanism to distinguish address from data bytes has
been included (8-bit data plus wake up bit mode).
In synchronous mode, the ASC0 transmits or receives bytes (8 bits) synchronously to a
shift clock which is generated by the ASC0. The ASC0 always shifts the LSB first. A loop
back option is available for testing purposes.
A number of optional hardware error detection capabilities has been included to increase
the reliability of data transfers. A parity bit can automatically be generated on
transmission or be checked on rec eption. Framing error detection allows to recogn ize
data frames with missing stop bits. An overrun error will be generated, if the last
character received ha s not been read out of the receive buffe r register at the time the
reception of a new character is complete.
The SSC supports full-duplex synchronous communication at up to 6.25 MBaud
(@ 25 MHz CPU clock). It may be configured so it interfaces with serially linked
peripheral components. A d edicated baud rate generator al lows to set up all standard
baud rates without oscillator tuning. For transmission, reception, and error handling three
separate interrupt vectors are provided.
The SSC transmits or receives characters of 2 … 16 bits length synchronously to a shift
clock which can be generated by the SSC (master mode) or by an external master (slave
mode). The SSC can start shifting with the LSB or with the MSB and allows the selection
of shifting and latching clock edges as well as the clock polarity.
A number of optional hardware error detection capabilities has been included to increase
the reliability of data transfers. Transmit and receive error supervise the correct handling
of the data buffer. Phase and baudrate error detect incorrect serial data.
Data Sheet23V2.0, 2000-12
C165
Watchdog Timer
The Watchdog Timer represents one of the fail-safe mechanisms which have been
implemented to prevent the controller from malfunctioning for longer periods of time.
The Watchdog Timer is always enabled after a reset of the chip, and can only be
disabled in the time int erval until the EINIT (end of initializat ion) instruction has been
executed. Thus, the chip’s start-up procedure is always monitored. The software has to
be designed to service the Watchdog Timer before it overflows. If, due to hardware or
software related failures, the software fails to do so, the Watchdog Timer overflows and
generates an internal hardw are reset and pulls the RSTOUT
external hardware components to be reset.
The Watchdog Timer is a 16-bit timer, c locked with th e system cloc k divided b y 2/128.
The high byte of the Watchdog Timer register ca n b e s et to a p r esp eci fied rel oad va lue
(stored in WDTREL) in order to al low further variation of the monitored time interval.
Each time it is serviced by the application software, the high byte of the Watchdog Timer
is reloaded. Thus, time intervals between 20µs and 336 ms can be monitored
(@ 25 MHz).
The default Watchdog Timer interval after reset is 5.24 ms (@ 25 MHz).
pin low in order to allow
Parallel Ports
The C165 provides up to 77 I/O lines which are organized into six input/output ports and
one input port. All port lines are bit-addressable, and all input/output lines are individually
(bit-wise) programmable as inputs or outp uts via direction registers. The I/O ports are
true bidirectional ports which are switched to high impedance state w hen con figu re d as
inputs. The output drivers of thre e I/O ports can be con figured (pin by pin) for pu sh/p ull
operation or open-drain operation via control registers. During the internal reset, all port
pins are configured as inputs.
All port lines have programmable alternate input or output functions associated with
them. All port lines that are not used for these alternate functions may be used as general
purpose IO lines.
PORT0 and PORT1 may be used as address and data lines when acc essing external
memory, while Port 4 outputs the additional se gment addre ss bits A23 /19/17 … A16 in
systems where segmentation is enabled to access more than 64 KBytes of memory.
Port 6 provides optional chip select signals.
Port 3 includ es alternate functions of time rs, serial interfaces, the optional bus control
signal BHE
/WRH, and the system clock output CLKOUT.
Port 5 is used for timer control signals.
Data Sheet24V2.0, 2000-12
C165
Instruction Set Summary
Table 5 lists the instructions of the C165 in a condensed way.
The various addressing modes that can be used with a specific instruction, the operation
of the instructions, parameters for conditional execution of instructions, and the opcodes
for each instruction can be found in the “C166 Family Instruction Set Manual”.
This document also provides a detailed description of each instruction.
Table 5Instruction Set Summary
MnemonicDescriptionBytes
ADD(B)Add word (byte) operands2 / 4
ADDC(B)Add word (byte) operands with Carry2 / 4
SUB(B)Subtract word (byte) operands2 / 4
SUBC(B)Subtract word (byte) operands with Carry2 / 4
MUL(U)(Un)Signed multiply direct GPR by direct GPR (16-16-bit) 2
DIV(U)(Un)Signed divide register MDL by direct GPR (16-/16-bit) 2
DIVL(U)(Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2
CPL(B)Complement direct word (byte) GPR2
NEG(B)Negate direct word (byte) GPR2
AND(B)Bitwise AND, (word/byte operands)2 / 4
OR(B)Bitwise OR, (word/byte operands)2 / 4
XOR(B)Bitwise XOR, (word/byte operands)2 / 4
BCLRClear direct bit2
BSETSet direct bit2
BMOV(N)Move (negated) direct bit to direct bit4
BAND, BOR,
AND/OR/XOR direct bit with direct bit4
BXOR
BCMPCompare direct bit to direct bit4
BFLDH/LBitwise modify masked high/low byte of bit-addressable
4
direct word memory with immediate data
CMP(B)Compare word (byte) operands2 / 4
CMPD1/2Compare word data to GPR and decrement GPR by 1/22 / 4
CMPI1/2Compare word data to GPR and increment GPR by 1/22 / 4
PRIORDetermine number of shift cycles to normalize direct
2
word GPR and store result in direct word GPR
SHL / SHRShift left/right direct word GPR2
ROL / RORRotate left/right direct word GPR2
ASHRArithmetic (sign bit) shift right direct word GPR2
Data Sheet25V2.0, 2000-12
C165
Table 5Instruction Set Summary (cont’d)
MnemonicDescriptionBytes
MOV(B)Move word (byte) data2 / 4
MOVBSMove byte operand to word operand with sign extension2 / 4
MOVBZMove byte operand to word operand. with zero extension2 / 4
JMPA, JMPI,
Jump absolute/indirect/relative if condition is met4
JMPR
JMPSJump absolute to a code segment4
J(N)BJump relative if direct bit is (not) set4
JBCJump relative and clear bit if direct bit is set4
JNBSJump relative and set bit if direct bit is not set4
CALLA, CALLI,
Call absolute/indirect/relative subroutine if condition is met 4
CALLR
CALLSCall absolute subroutine in any code segment4
PCALLPush direct word register onto system stack and call
absolute subroutine
TRAPCall interrupt service routine via immediate trap number2
PUSH, POPPush/pop direct word register onto/from system stack2
SCXTPush direct word register onto system stack und update
register with word operand
RETReturn from intra-segment subroutine2
RETSReturn from inter-segment subroutine2
4
4
RETPReturn from intra-segment subroutine and pop direct
2
word register from system stack
RETIReturn from interrupt service subroutine2
SRSTSoftware Reset4
IDLEEnter Idle Mode4
PWRDNEnter Power Down Mode (supposes NMI
The following table lists all SFRs which are implemented in the C165 in alphabeti cal
order.
Bit-addressable SFRs are marked with the letter “b” in column “Name”. SFRs within the
Extended SFR-Space (ESFRs) are marked with the letter “E” in column “Physical
Address”. Registers within on-chip X-peripherals are marked with the letter “X” in column
“Physical Address”.
An SFR can be specified via its in div idual mnemonic name. Depending on the selected
addressing mode, an SFR can be accessed via its p hysical address (using the Data
Page Pointers), or via its short 8-bit address (without using the Data Page Pointers).
Table 6C165 Registers, Ordered by Name
NamePhysical
CPU Context Pointer RegisterFC00
GPT2 CAPREL Interrupt Ctrl. Reg.0000
H
CPU Code Seg. Pointer Reg. (read only)0000
P0H Direction Control Register00
P0L Direction Control Register00
P1H Direction Control Register00
P1L Direction Control Register00
Port 2 Direction Control Register0000
H
Port 3 Direction Control Register0000
H
Port 4 Direction Control Register00
H
Port 6 Direction Control Register00
H
CPU Data Page Pointer 0 Reg. (10 bits)0000
CPU Data Page Pointer 1 Reg. (10 bits)0001
Port 1 High Reg. (Upper half of PORT1)00
Port 1 Low Reg.(Lower half of PORT1)00
Port 2 Register0000
Port 3 Register0000
Port 4 Register (8 bits)00
Port 5 Register (read only)XXXX
Port 6 Register (8 bits)00
PEC Channel 0 Control Register0000
PEC Channel 1 Control Register0000
PEC Channel 2 Control Register0000
PEC Channel 3 Control Register0000
PEC Channel 4 Control Register0000
PEC Channel 5 Control Register0000
H
H
H
H
H
H
H
H
H
H
H
H
H
PECC6FECC
PECC7FECE
PSWbFF10
RP0Hb F108
S0BGFEB4
S0CONbFFB0
S0EICbFF70
S0RBUFFEB2
S0RICbFF6E
H
H
H
H
H
H
H
H
H
66
67
88
E 84
5A
D8
B8
59
B7
S0TBICbF19CHE CE
S0TBUFFEB0
H
58
H
H
H
H
PEC Channel 6 Control Register0000
PEC Channel 7 Control Register0000
CPU Program Status Word0000
System Startup Config. Reg. (Rd. only)XX
Serial Channel 0 Baud Rate Generator
H
0000
H
H
H
H
H
Reload Regis ter
Serial Channel 0 Control Register0000
GPT1 Timer 3 Register0000
GPT1 Timer 3 Control Register0000
H
GPT1 Timer 3 Interrupt Control Register0000
H
GPT1 Timer 4 Register0000
GPT1 Timer 4 Control Register0000
H
GPT1 Timer 4 Interrupt Control Register0000
H
GPT2 Timer 5 Register0000
GPT2 Timer 5 Control Register0000
H
GPT2 Timer 5 Interrupt Control Register0000
H
GPT2 Timer 6 Register0000
GPT2 Timer 6 Control Register0000
H
GPT2 Timer 6 Interrupt Control Register0000
H
Trap Flag Register0000
H
Watchdog Timer Register (read only)0000
Watchdog Timer Control Register
H
2)
00XX
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
XP0ICbF186
Data Sheet30V2.0, 2000-12
H
E C3
Software Interrupt Control Register0000
H
H
Table 6C165 Registers, Ordered by Name (cont’d)
C165
NamePhysical
Address
XP1ICbF18E
XP2ICbF196
XP3ICbF19E
ZEROSbFF1C
1)
The system configuration is selected during reset.
2)
The reset value depends on th e indicated reset source.
H
H
H
H
8-Bit
Addr.
E C7
E CB
E CF
8E
DescriptionReset
Software Interrupt Control Register0000
H
Software Interrupt Control Register0000
H
Software Interrupt Control Register0000
H
Constant Value 0’s Register (read only )000 0
H
Value
H
H
H
H
Data Sheet31V2.0, 2000-12
Absolute Maximum Ratings
Table 7Absolute Maximum Rating Parameters
ParameterSymbolLimit ValuesUnitNotes
min.max.
C165
Storage temperature
Junction temperature
V
Voltage on
respect to ground (
pins with
DD
V
SS
Voltage on any pin with
respect to ground (
V
SS
Input current on any pin
T
ST
T
J
V
DD
)
V
IN
)
–- 1010mA–
- 65150
- 40150
C–
°
C under bias
°
-0.56.5V–
-0.5VDD+0.5 V–
during overload condition
Absolute sum of all input
–– |100|mA–
currents during overload
condition
Power dissipation
P
DISS
–1.5W–
Note: Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of th e dev ice a t t hese or any ot her con diti ons a bove those ind icated in
the operational s ections o f this s pecificati on is n ot implied . Exposure to abso lute
maximum rating conditions for extended periods may affect device reliability.
V
>
V
or
V
<
V
During absolute maximum rating overload conditions (
V
voltage on
pins with respect to ground (
DD
V
) must not exceed the values
SS
IN
DD
IN
SS
) the
defined by the absolute maximum ratings.
Data Sheet32V2.0, 2000-12
C165
Operating Conditions
The following operating conditions must not be exceeded in order to ensure correct
operation of the C165. All parameters specified in the following sections refer to th ese
operating conditions, unless otherwise noticed.
Digital ground voltage
Overload current
Absolute sum of overload
V
DD
V
DD
V
SS
I
OV
|IOV|–50mA
Σ
4.55.5VActive mode,
2.5
1)
f
CPUmax
5.5VPowerDown mode
= 25 MHz
3.03.6VActive mode,
2.5
1)
f
CPUmax
3.6VPowerDown mode
= 20 MHz
0VReference voltage
–
5mAPer pin
±
3)
2)3)
currents
External Load
C
L
–100pF–
Capacitance
Ambient temperature
T
A
070°CSAB-C165 …
-4085°CSAF-C165 …
- 40125°CSAK-C165 …
1)
Output voltages and outpu t currents will be reduced when VDD leaves the range defined for activ e mo de.
2)
Overload conditions occ ur if the standard operatings conditions are exceed ed, i.e. the voltage on any pin
V
exceeds the specified range (i.e.
currents on all pins may not exc eed 50 mA. The supply voltage must remain within the s pec if ied limits.
Proper operation is not guaran teed if overload c onditions occur on f unctional pins suc h as XTAL1, RD
etc.
3)
Not 100% tested, guaranteed by design and characteriz at ion.
> VDD + 0.5 V or VOV< VSS– 0.5 V). The absolute sum of input overload
OV
, WR,
Data Sheet33V2.0, 2000-12
C165
Parameter Interpretation
The parameters listed in the fo llowing partly represent the characte ristics of the C165
and partly its demands on the system . To aid in inte rpretin g the parame ters rig ht, w hen
evaluating them for a design, they are marked in column “Symbol”:
CC (Controller Characteristics):
The logic of the C165 will provide signals with the respective timing characteristics.
SR (System Requirement):
The external system must provide signals with the respective timing chara cteristics to
the C165.
DC Characteristics (Standard Supply Voltage Range)
(Operating Conditions apply)
ParameterSymbolLimit ValuesUnit Test Condition
1)
Input low voltage (TTL,
all except XTAL1)
Input low voltage XTAL1
Input high voltage (TTL,
all except RSTIN
and XTAL1)
Input high voltage RSTIN
(when operated as input)
Input high voltage XTAL1
Output low voltage
(PORT0, PORT1, Port 4, ALE,
, WR, BHE, RSTOUT,
RD
2)
RSTIN
)
Output low voltage
(all other outputs)
Output high voltage
3)
(PORT0, PORT1, Port 4, ALE,
, WR, BHE, RSTOUT)
RD
Output high voltage
3)
(all other outputs)
V
V
V
V
V
V
V
V
V
min.max.
SR – 0.50.2 V
IL
V–
DD
– 0.1
SR – 0.50.3 V
IL2
SR 0.2 V
IH
+ 0.9
SR 0.6 V
IH1
V
DD
DD
0.5
DDVDD
DD
+
+
V–
V–
V–
0.5
SR 0.7 V
IH2
DDVDD
+
V–
0.5
CC –0.45VIOL = 2.4 mA
OL
CC –0.45VIOL = 1.6 mA
OL1
CC 2.4–VIOH = - 2.4 mA
OH
V
0.9
CC 2.4–VIOH = - 1.6 mA
OH1
0.9
–VIOH = - 0.5 mA
DD
V
–VIOH = - 0.5 mA
DD
Input leakage current (Port 5)
I
Input leakage current (all other)I
RSTIN inactive current
Data Sheet34V2.0, 2000-12
4)
I
CC –± 200nA0 V < VIN < V
OZ1
CC –± 500nA0.45 V < VIN < V
OZ2
5)
RSTH
–-10µAVIN = V
DD
DD
IH1
C165
DC Characteristics (Standard Supply Voltage Range) (cont’d)
(Operating Conditions apply)
ParameterSymbolLimit ValuesUnit Test Condition
RSTIN
active current
4)
READY/RD/WR inact. current
READY
ALE inactive current
ALE active current
Port 6 inactive current
Port 6 active current
/RD/WR active current
7)
7)
7)
7)
PORT0 configuration current
1)
8)
7)
7)
I
RSTL
I
RWH
I
RWL
I
ALEL
I
ALEH
I
P6H
I
P6L
I
P0H
I
P0L
6)
6)
5)
5)
6)
min.max.
6)
-100–
5)
–-40µAV
-500–
5)
–40µAV
6)
500–
AVIN = V
µ
AV
µ
AV
µ
–-40µAV
-500–
AV
µ
–-10µAVIN = V
-100–
AVIN = V
µ
OUT
OUT
OUT
OUT
OUT
OUT
IL
= 2.4 V
= V
OLmax
= V
OLmax
= 2.4 V
= 2.4 V
= V
OL1max
IHmin
ILmax
XTAL1 input currentI
Pin capacitance
9)
(digital inputs/outputs)
1)
Keeping signal levels w ithin the leve ls specified in t his table, ensure s operation without overload conditions.
For signal levels outside thes e sp ec if ic at ions als o ref er to the specification of the over load current
2)
Valid in bidirectional reset mode only.
3)
This specification is not valid for out puts which are switche d to open drain mod e. In this case the respec tive
output will float and the voltag e res ult s fro m the ex t ernal circuitry.
4)
These parameters describe the RSTIN pullup, which equals a res is ta nc e of ca . 50 to 25 0 kΩ.
5)
The maximum current may be drawn while the respective signal line remains inactive.
6)
The minimum current mu st be drawn in order to drive the respective s ignal line active.
7)
This specification is valid during Re set and during H old-mode or Ad apt-mode. During Hold-m ode Port 6 pins
are only affected, if the y are use d (conf igured ) for C S
READY
8)
This specification is valid during Reset and during Adapt-mode.
9)
Not 100% tested, guaranteed by design and characteriz at ion.
-pullup is always active, exce pt for Po w erdown mode.
CC–
IL
C
CC–10pFf = 1 MHz
IO
output and the open drain func tion is no t enab led. T he
20
±
A0 V < VIN < V
µ
T
= 25 °C
A
I
OV
DD
.
Data Sheet35V2.0, 2000-12
C165
DC Characteristics (Reduced Supply Voltage Range)
(Operating Conditions apply)
ParameterSymbolLimit ValuesUnit Test Condition
1)
min.max.
Input low voltage (TTL,
all except XTAL1)
Input low voltage XTAL1
Input high voltage (TTL,
all except RSTIN
and XTAL1)
Input high voltage RSTIN
(when operated as input)
Input high voltage XTAL1
Output low voltage
(PORT0, PORT1, Port 4, ALE,
, WR, BHE, RSTOUT,
RD
2)
RSTIN
)
Output low voltage
(all other outputs)
Output high voltage
3)
(PORT0, PORT1, Port 4, ALE,
, WR, BHE, RSTOUT)
RD
Output high voltage
3)
(all other outputs)
V
V
V
V
V
V
V
V
V
SR - 0.50.8V–
IL
SR - 0.50.3 V
IL2
SR 1.8VDD +
IH
V–
DD
V–
0.5
IH1
SR 0.6 V
DDVDD
+
V–
0.5
IH2
SR 0.7 V
DDVDD
+
V–
0.5
CC –0.45VIOL = 1.6 mA
OL
CC –0.45VIOL = 1.0 mA
OL1
CC 0.9 V
OH
CC 0.9 V
OH1
–VIOH = - 0.5 mA
DD
–VIOH = - 0.25 mA
DD
Input leakage current (Port 5)
I
Input leakage current (all other) I
7)
7)
7)
4)
7)
4)
7)
7)
I
I
I
I
I
I
I
I
RSTIN inactive current
RSTIN active current
READY/RD/WR inact. current
READY
/RD/WR active current
ALE inactive current
ALE active current
Port 6 inactive current
Port 6 active current
Data Sheet36V2.0, 2000-12
CC –± 200nA0 V < VIN < V
OZ1
CC –± 500nA0.45 V < VIN < V
OZ2
5)
RSTH
RSTL
RWH
6)
RWL
ALEL
ALEH
5)
P6H
6)
P6L
–- 10µAVIN = V
6)
- 100–µAVIN = V
5)
–-10µAV
- 500–µAV
5)
–20µAV
6)
500–µAV
–-10µAV
- 500–µAV
OUT
OUT
OUT
OUT
OUT
OUT
= 2.4 V
= V
= V
= 2.4 V
= 2.4 V
= V
DD
DD
IH1
IL
OLmax
OLmax
OL1max
C165
DC Characteristics (Reduced Supply Voltage Range) (cont’d)
(Operating Conditions apply)
ParameterSymbolLimit ValuesUnit Test Condition
PORT0 configuration current
1)
8)
I
P0H
I
P0L
6)
5)
min.max.
–-5µAVIN = V
- 100–
AVIN = V
µ
IHmin
ILmax
XTAL1 input currentI
Pin capacitance
9)
C
(digital inputs/outputs)
1)
Keeping signal levels w ithin the leve ls specified in t his table, ensure s operation without overload conditions.
For signal levels outside thes e sp ec if ic at ions als o ref er to the specification of the over load current
2)
Valid in bidirectional reset mode only.
3)
This specification is not valid for out puts which are switche d to open drain mod e. In this case the respec tive
output will float and the voltag e res ult s fro m the ex t ernal circuitry.
4)
These parameters describe the RSTIN pullup, which equals a res is ta nc e of ca . 50 to 25 0 kΩ.
5)
The maximum current may be drawn while the respective signal line remains inactive.
6)
The minimum current mu st be drawn in order to drive the respective s ignal line active.
7)
This specification is valid during Re set and during H old-mode or Ad apt-mode. During Hold-m ode Port 6 pins
are only affected, if the y are use d (conf igured ) for C S
READY
8)
This specification is valid during Reset and during Adapt-mode.
9)
Not 100% tested, guaranteed by design and characteriz at ion.
-pullup is always active, exce pt for Po w erdown mode.
CC –
IL
CC –10pFf = 1 MHz
IO
output and the open drain func tion is no t enab led. T he
20
±
A0 V < VIN < V
µ
T
= 25 °C
A
I
OV
DD
.
Data Sheet37V2.0, 2000-12
C165
Power Consumption C165 (Standard Supply Voltage Range)
(Operating Conditions apply)
ParameterSymbolLimit ValuesUnit Test Condition
min.max.
Power supply current (active)
with all peripherals active
Idle mode supply current
with all peripherals active
Power-down mode supply
I
DD5
I
IDX5
I
PDO5
–15 +
1.8 ×
f
CPU
–2 +
0.4
f
×
CPU
–50
mARSTIN = V
f
in [MHz]
CPU
mARSTIN = V
f
in [MHz]
CPU
AVDD = V
µ
DDmax
IL
IH1
1)
1)
2)
current
1)
The supply current is a function of th e operating frequency. This dependency is illustrated in Figure 8.
These parameters are tested at
V
or VIH.
at
IL
2)
This parameter is tested including leakage currents . All inputs (including pins configured as inputs ) at 0 V to
V
0.1 V or at
– 0.1 V to VDD, all outputs (including pins configured as outputs) disconnected.
DD
V
and maximum CPU clock with all outputs disconnected and all inputs
DDmax
Power Consumption C165 (Reduced Supply Voltage Range)
(Operating Conditions apply)
ParameterSymbolLimit ValuesUnit Test Condition
min.max.
Power supply current (active)
with all peripherals active
I
DD3
–3 +
1.3
mARSTIN = V
f
×
CPU
f
CPU
in [MHz]
IL
1)
Idle mode supply current
with all peripherals active
Power-down mode supply
I
IDX3
I
PDO3
–1 +
0.4 ×
f
CPU
mARSTIN = V
f
in [MHz]
CPU
–30µAVDD = V
IH1
DDmax
1)
2)
current
1)
The supply current is a function of th e operating frequency. This dependency is illustrated in Figure 8.
These parameters are tested at
V
or VIH.
at
IL
2)
This parameter is tested includ ing leakage cur rents. All inputs (includ ing pins confi gured as inputs) at 0 V to
V
0.1 V or at
Data Sheet38V2.0, 2000-12
– 0.1 V to VDD, all outputs (including pins configured as outputs) disconnected.
DD
V
and maximum CPU clock with all outputs disconnected and all inputs
DDmax
I [mA]
100
C165
I
DD5max
80
60
40
20
10203040
f
CPU
I
I
DD3max
I
DD3typ
I
IDX5max
I
IDX3max
I
IDX5typ
I
IDX3typ
[MHz]
DD5typ
Figure 8Supply/Idle Current as a Function of Operating Frequency
Data Sheet39V2.0, 2000-12
C165
AC Characteristics
Definition of Internal Timing
f
The internal operation of the C 165 is controlled by the internal CPU clock
edges of the CPU clock can trigger internal (e.g. pip eline) or external (e.g. bus cycles)
operations.
The specification of t he external timing (AC Chara cteristics) therefore depends on the
time between two consecutive edges of the CPU clock, called “TCL” (see Figure 9).
Direct Clock Drive
f
OSC
TCL
CPU
. Both
f
CPU
TCL
Prescaler Operation
f
OSC
TCL
f
CPU
TCL
MCT04826
Figure 9Generation Mechanisms for the CPU Clock
The CPU clock signal
can be generated from the oscillato r clock signal f
CPU
OSC
via
f
different mechanisms. The duration of TCL s and their variation (and also the derived
f
external timing) depends on the used mechanism to generate
. This influence must
CPU
be regarded when calculating the timings for the C165.
The used mechanism to generate the basic C PU clock is selected by bitfield C LKCFG
in register RP0H.7-5. Upon a long hardware reset register RP0H is loaded with the logic
levels present on the upper ha lf of PORT0 (P0H), i.e. bitfield C LKCFG represents the
logic levels on pins P0.15-13 (P0H.7-5).
Table 9 associates the combinations of these three bits with the respective clock
generation mode.
Data Sheet40V2.0, 2000-12
Table 9C165 Clock Generation Modes
C165
CLKCFG
(P0H.7-5)
0XX
1XXf
1)
The external clock input range refers to a CPU clock range of 10 … 25 M H z (P LL operation).
2)
The maximum frequency depends on the duty cycle of the external clock signal.
CPU Frequency
f
= f
CPU
f
× 11 to 25 MHzDirect drive
OSC
/ 22 to 50 MHzCPU clock via prescaler
OSC
OSC
× F
External Clock
Input Range
1)
Notes
2)
Prescaler Operation
When prescaler operation is configured (CLKCFG = 1XX
) the CPU clock is derived
B
from the internal oscillator (input clock signal) by a 2:1 prescaler.
f
The frequency of
is half the frequency of f
CPU
the duration of an individual TCL) is defined by the period of the input clock
and the high and low time of f
OSC
f
OSC
CPU
.
(i.e.
The timings listed in the AC Characteristics that refer to TCLs therefore can be
f
calculated using the period of
for any TCL.
OSC
Direct Drive
When direct drive is configured (CLKCFG = 0XX
) the on-chip phase locked loop is
B
disabled and the CPU clock is directl y driven from the internal oscillator with the input
clock signal.
f
The frequency of
f
(i.e. the duration of an individual TCL) is defined by the duty cycle of the input clock
CPU
f
.
OSC
directly follows the frequency of f
CPU
so the high and low time of
OSC
The timings listed below that refer to TCLs therefore must be calculated using the
minimum TCL that is possible under the respective circumstances. This minimum value
can be calculated via the following formula:
min
= 1/f
TCL
For two consecutive TCLs the deviation caused by the duty cycle of
so the duration of 2TCL i s always 1/
OSC
× DC
min
(DC = duty cycle)
f
. The minimum value TCL
OSC
f
is compensated
OSC
therefore has to
min
be used only once for timings that require an odd number of TCLs (1, 3, …). Timings that
f
require an even number of TCLs (2, 4, …) may use the formula 2TCL = 1/
Data Sheet41V2.0, 2000-12
OSC
.
AC Characteristics
Table 10External Clock Drive XTAL1 (Standard Supply Voltage Range)
(Operating Conditions apply)
C165
ParameterSymbolDirect Drive
1:1
Prescaler
2:1
min.max.min.max.
Oscillator period
High time
Low time
Rise time
Fall time
1)
The clock input signal must reac h t he defined levels V
2)
The minimum high and low time refers to a dut y cycle of 50% . The maximum operating freq uency (f
direct drive mode depends on t he duty cycle of the clock input signa l.
1)
1)
1)
1)
t
t
t
t
t
SR 40–20–ns
OSC
SR 20
1
SR 20
2
SR–10–6ns
3
SR–10–6ns
4
2)
2)
–6–ns
–6–ns
IL2
and V
IH2
.
Table 11External Clock Drive XTAL1 (Reduced Supply Voltage Range)
(Operating Conditions apply)
ParameterSymbolDirect Drive
1:1
Prescaler
2:1
Unit
CPU
Unit
) in
min.max.min.max.
Oscillator period
High time
Low time
Rise time
Fall time
1)
The clock input signal must reac h t he defined levels V
2)
The minimum high and low time refers to a dut y cycle of 50% . The maximum operating freq uency (f
direct drive mode depends on t he duty cycle of the clock input signa l.
1)
1)
1)
1)
t
t
t
t
t
SR 50–25–ns
OSC
SR 25
1
SR 25
2
SR–10–6ns
3
SR–10–6ns
4
2)
2)
–8–ns
–8–ns
IL2
and V
IH2
.
CPU
) in
Data Sheet42V2.0, 2000-12
C165
0.5
t
1
V
DD
t
2
t
t
3
OSC
t
4
MCT02534
V
IH2
V
IL
Figure 10External Clock Drive XTAL1
Note: If the on-chip oscillato r is used together wi th a crystal, the osc illator frequency is
limited to a range of 4 MHz to 40 MHz.
It is strongly recommended to measure the oscillation allowance (or margin) in the
final target system (layout) to determine the optimum parameters for the oscillator
operation. Please refer to the limits specified by the crystal supplier.
When driven by an external clock signal it will accept the specified frequency
range. Operation at lower input frequencies is possible but is guaranteed by
design only (not 100% tested).
Data Sheet43V2.0, 2000-12
Testing Waveforms
C165
2.4 V
1.8 V
0.8 V
0.45 V
AC inputs during testing are driven at 2.4 V for a logic 1’ and 0.45 V for a logic 0’.
V
Timing measurements are made at
min for a logic 1’ and
IH
Figure 11Input Output Waveforms
+ 0.1 V
V
Load
V
- 0.1 V
Load
Test Points
’
’’
Timing
Reference
Points
1.8 V
0.8 V
V
max for a logic 0’.
IL
V
OH
V
OL
’
MCA04414
- 0.1 V
+ 0.1 V
For timing purposes a port pin is no longer floating when a 100 mV change from load voltage occurs,
V
/
V
but begins to float when a 100 mV change from the loaded
OH
level occurs (
OL
I
I
/= 20 mA).
OHOL
MCA00763
Figure 12Float Waveforms
Data Sheet44V2.0, 2000-12
C165
Memory Cycle Variables
The timing tables below use three variables which are derived from the BUSCONx
registers and represent the speci al characteristics of the programmed memory cycle.
The following table describes, how these variables are to be computed.
Note: Please respect the maximum operating frequency of the respective derivative.
AC Characteristics
Multiplexed Bus (Standard Supply Voltage Range)
(Operating Conditions apply)
t
ALE cycle ti me = 6 TCL + 2
ParameterSymbolMax. CPU Clock
+ tC + tF (120 ns at 25 MHz CPU clock without waitstates)
A
= 25 MHz
Variable CPU Clock
1 / 2TCL = 1 to 25 MHz
Unit
min.max.min.max.
t
ALE high time
Address setup to ALE
CC10 + t
5
t
CC4 + t
6
A
–TCL - 10
A
t
+
A
–TCL - 16
t
+
A
–ns
–ns
t
Address hold after ALE
ALE falling edge to RD
(with RW-delay)
WR
ALE falling edge to RD
(no RW-delay)
WR
Address float after RD
(with RW-delay)
WR
Address float after RD
(no RW-delay)
WR
, WR low time
RD
,
,
,
,
CC10 + t
7
t
CC10 + t
8
t
CC- 10 + tA–- 10 + t
9
t
CC–6–6ns
10
t
CC–26–TCL + 6ns
11
t
CC30 + t
12
(with RW-delay)
Data Sheet45V2.0, 2000-12
–TCL - 10
A
t
+
A
–TCL - 10
A
t
+
A
A
–2TCL - 10
C
t
+
C
–ns
–ns
–ns
–ns
Multiplexed Bus (Standard Supply Voltage Range) (cont’d)
(Operating Conditions apply)
ALE cycle ti me = 6 TCL + 2
t
+ tC + tF (120 ns at 25 MHz CPU clock without waitstates)
A
C165
ParameterSymbolMax. CPU Clock
= 25 MHz
min.max.min.max.
RD, WR low time
t
CC50 + t
13
–3TCL - 10
C
(no RW-delay)
to valid data in
RD
t
SR–20 + t
14
C
(with RW-delay)
to valid data in
RD
t
SR–40 + t
15
C
(no RW-delay)
t
ALE low to valid data in
Address to valid data in
Data hold after RD
SR–40 + t
16
+ t
t
SR–50 + 2t
17
+ t
t
SR0–0–ns
18
A
C
C
rising edge
t
Data float after RD
SR–26 + t
19
F
Variable CPU Clock
Unit
1 / 2TCL = 1 to 25 MHz
–ns
t
+
C
–2TCL - 20
t
+
C
–3TCL - 20
t
+
C
–3TCL - 20
t
+ t
+
A
C
–4TCL - 30
A
2t
+ t
+
A
–2TCL - 14
t
+
F
ns
ns
ns
ns
C
ns
Data valid to WR
Data hold after WR
ALE rising edge after RD
WR
Address hold after RD
,
WR
ALE falling edge to CS
low to Valid Data In
CS
hold after RD, WR
CS
1)
1)
ALE fall. edge to RdCS
WrCS
(with RW delay)
ALE fall. edge to RdCS
WrCS
(no RW delay)
1)
,
,
t
CC20 + t
22
t
CC26 + t
23
,
t
CC26 + t
25
t
CC26 + t
27
t
CC- 4 - t
38
t
SR–40
39
t
CC46 + t
40
t
CC16 + t
42
t
CC- 4 + t
43
–2TCL - 20
C
+
–2TCL - 14
F
+
–2TCL - 14
F
+
–2TCL - 14
F
+
10 - t
A
-4 - t
A
–3TCL - 20
t
+2t
+
C
A
–3TCL - 14
F
+
–TCL - 4
A
+
–-4
A
+
–ns
t
C
–ns
t
F
–ns
t
F
–ns
t
F
A
10 - t
A
ns
ns
t
+ 2t
+
C
A
–ns
t
F
–ns
t
A
–ns
t
A
Data Sheet46V2.0, 2000-12
Multiplexed Bus (Standard Supply Voltage Range) (cont’d)
(Operating Conditions apply)
t
ALE cycle ti me = 6 TCL + 2
+ tC + tF (120 ns at 25 MHz CPU clock without waitstates)
A
C165
ParameterSymbolMax. CPU Clock
= 25 MHz
min.max.min.max.
Address float after RdCS,
WrCS
(with RW delay)
Address float after RdCS
WrCS
RdCS
(no RW delay)
to Valid Data In
t
CC–0–0ns
44
,
t
CC–20–TCLns
45
t
SR–16 + t
46
C
(with RW delay)
RdCS
to Valid Data In
t
SR–36 + t
47
C
(no RW delay)
RdCS
, WrCS Low T ime
t
CC30 + t
48
–2TCL - 10
C
(with RW delay)
RdCS
, WrCS Low T ime
t
CC50 + t
49
–3TCL - 10
C
(no RW delay)
t
Data valid to WrCS
CC26 + t
50
–2TCL - 14
C
Variable CPU Clock
Unit
1 / 2TCL = 1 to 25 MHz
–2TCL - 24
t
+
C
–3TCL - 24
t
+
C
ns
ns
–ns
t
+
C
–ns
t
+
C
–ns
t
+
C
t
Data hold after RdCS
Data float after RdCS
Address hold after
RdCS
, WrCS
Data hold after WrCS
1)
These parameters refer to the latched chip select signals (C SxL). The early chip select signals (CS xE) are
specified together with the address and signal BHE
SR0–0–ns
51
t
SR–20 + t
52
t
CC20 + t
54
t
CC20 + t
56
–2TCL - 20
F
–2TCL - 20
F
(see figures below).
–2TCL - 20
F
t
+
F
–ns
t
+
F
–ns
t
+
F
ns
Data Sheet47V2.0, 2000-12
AC Characteristics
Multiplexed Bus (Reduced Supply Voltage Range)
(Operating Conditions apply)
t
ALE cycle ti me = 6 TCL + 2
+ tC + tF (150 ns at 20 MHz CPU clock without waitstates)
A
C165
ParameterSymbolMax. CPU Clock
= 20 MHz
min.max.min.max.
t
ALE high time
Address setup to ALE
Address hold after ALE
ALE falling edge to RD
(with RW-delay)
WR
ALE falling edge to RD
(no RW-delay)
WR
Address float after RD
(with RW-delay)
WR
Address float after RD
(no RW-delay)
WR
CC11 + t
5
t
CC5 + t
6
t
CC15 + t
7
,
t
CC15 + t
8
,
t
CC- 10 + tA–-10 + t
9
,
t
CC–6–6ns
10
,
t
CC–31–TCL + 6ns
11
A
–TCL - 14
A
–TCL - 20
–TCL - 10
A
–TCL - 10
A
Variable CPU Clock
1 / 2TCL = 1 to 20 MHz
–ns
t
+
A
–ns
t
+
A
–ns
t
+
A
–ns
t
+
A
A
–ns
Unit
, WR low time
RD
(with RW-delay)
, WR low time
RD
(no RW-delay)
to valid data in
RD
(with RW-delay)
to valid data in
RD
(no RW-delay)
ALE low to valid data in
Address to valid data in
Data hold after RD
t
CC34 + t
12
t
CC59 + t
13
t
SR–22 + t
14
t
SR–47 + t
15
t
SR–45 + t
16
t
SR–57 + 2t
17
t
SR0–0–ns
18
–2TCL - 16
C
+
–3TCL - 16
C
+
–2TCL - 28
C
–3TCL - 28
C
–3TCL - 30
A
+ t
C
–4TCL - 43
A
+ t
C
–ns
t
C
–ns
t
C
ns
t
+
C
ns
t
+
C
ns
t
+ t
+
A
C
ns
2t
+ t
+
A
C
rising edge
Data Sheet48V2.0, 2000-12
Multiplexed Bus (Reduced Supply Voltage Range) (cont’d)
(Operating Conditions apply)
ALE cycle ti me = 6 TCL + 2
t
+ tC + tF (150 ns at 20 MHz CPU clock without waitstates)
A
C165
ParameterSymbolMax. CPU Clock
= 20 MHz
min.max.min.max.
Data float after RDt
Data valid to WR
Data hold after WR
ALE rising edge after RD
,
SR–36 + t
19
t
CC24 + t
22
t
CC36 + t
23
t
CC36 + t
25
F
–2TCL - 26
C
–2TCL - 14
F
–2TCL - 14
F
WR
Address hold after RD
CC36 + t
27
–2TCL - 14
F
,
t
WR
1)
t
ALE falling edge to CS
low to Valid Data In
CS
hold after RD, WR
CS
1)
1)
CC- 8 - t
38
t
SR–47+ t
39
t
CC57 + t
40
10 - t
A
F
A
C
+ 2t
A
–3TCL - 18
Variable CPU Clock
Unit
1 / 2TCL = 1 to 20 MHz
–2TCL - 14
t
+
F
ns
–ns
t
+
C
–ns
t
+
F
–ns
t
+
F
–ns
t
+
F
- 8 - t
A
–3TCL - 28
10 - t
t
+
C
A
+ 2t
ns
ns
A
–ns
t
+
F
ALE fall. edge to RdCS
WrCS
(with RW delay)
ALE fall. edge to RdCS
WrCS
(no RW delay)
Address float after RdCS
WrCS
(with RW delay)
Address float after RdCS
WrCS
RdCS
(no RW delay)
to Valid Data In
(with RW delay)
RdCS
to Valid Data In
(no RW delay)
RdCS
, WrCS Low T ime
(with RW delay)
RdCS
, WrCS Low T ime
(no RW delay)
,
t
CC19 + t
42
,
t
CC- 6 + t
43
,
t
CC–0–0ns
44
,
t
CC–25–TCLns
45
t
SR–20 + t
46
t
SR–45 + t
47
t
CC38 + t
48
t
CC63 + t
49
–TCL - 6
A
t
+
–- 6
A
t
+
–2TCL - 30
C
–3TCL - 30
C
–2TCL - 12
C
t
+
–3TCL - 12
C
t
+
–ns
A
–ns
A
ns
t
+
C
ns
t
+
C
–ns
C
–ns
C
Data Sheet49V2.0, 2000-12
Multiplexed Bus (Reduced Supply Voltage Range) (cont’d)
(Operating Conditions apply)
t
ALE cycle ti me = 6 TCL + 2
+ tC + tF (150 ns at 20 MHz CPU clock without waitstates)
A
C165
ParameterSymbolMax. CPU Clock
= 20 MHz
Variable CPU Clock
1 / 2TCL = 1 to 20 MHz
min.max.min.max.
Data valid to WrCSt
Data hold after RdCS
Data float after RdCS
Address hold after
RdCS
, WrCS
Data hold after WrCS
1)
These parameters refer to the latched chip select signals (C SxL). The early chip select signals (CS xE) are
specified together with the address and signal BHE
CC28 + t
50
t
SR0–0–ns
51
t
SR–30 + t
52
t
CC30 + t
54
t
CC30 + t
56
–2TCL - 22
C
F
–2TCL - 20
F
–2TCL - 20
F
(see figures below).
–ns
t
+
C
–2TCL - 20
t
+
F
–ns
t
+
F
–ns
t
+
F
Unit
ns
Data Sheet50V2.0, 2000-12
C165
ALE
CSxL
A23-A16
(A15-A8)
, CSxE
BHE
Read Cycle
BUS
RD
t
5
t
6
Address
t
16
t
38
t
39
t
17
t
25
t
40
t
27
Address
t
7
t
54
t
19
t
18
Data In
t
t
8
10
t
14
RdCSx
Write Cycle
BUS
WR,
,
WRL
WRH
WrCSx
t
44
12
t
46
t
48
t
t
42
t
51
t
52
t
23
Data OutAddress
t
t
t
8
t
42
10
t
44
t
22
t
12
t
50
t
48
56
Figure 13External Memory Cycle:
Multiplexed Bus, With Read/Write Delay, Normal ALE
Data Sheet51V2.0, 2000-12
C165
ALE
CSxL
A23-A16
(A15-A8)
, CSxE
BHE
Read Cycle
BUS
RD
t
5
t
38
t
16
t
39
t
17
t
25
t
40
t
27
Address
t
6
t
7
t
54
t
19
t
18
Data InAddress
t
t
8
10
t
14
RdCSx
Write Cycle
BUS
WR,
,
WRL
WRH
WrCSx
t
t
t
42
12
4
t
46
t
48
t
51
t
52
t
23
Data OutAddress
t
t
t
8
t
42
10
t
44
t
22
t
12
t
50
t
48
56
Figure 14External Memory Cycle:
Multiplexed Bus, With Read/Write Delay, Extended ALE
Data Sheet52V2.0, 2000-12
C165
ALE
CSxL
A23-A16
(A15-A8)
, CSxE
BHE
Read Cycle
BUS
RD
t
5
t
38
t
17
t
t
16
39
Address
t
6
t
7
AddressData In
t
9
t
11
t
15
t
25
t
40
t
27
t
54
t
19
t
18
RdCSx
Write Cycle
BUS
WR,
,
WRL
WRH
WrCSx
t
t
43
t
45
13
t
47
t
49
t
51
t
52
t
23
Data OutAddress
t
t
9
t
43
t
11
t
45
t
22
t
13
t
50
t
49
56
Figure 15External Memory Cycle:
Multiplexed Bus, No Read/Write Delay, Normal ALE
Data Sheet53V2.0, 2000-12
C165
ALE
CSxL
A23-A16
(A15-A8)
, CSxE
BHE
Read Cycle
BUS
RD
t
5
t
38
t
16
t
39
t
17
t
25
t
40
t
27
Address
t
6
t
7
t
54
t
19
t
18
Data InAddress
t
9
t
11
t
15
RdCSx
Write Cycle
BUS
WR,
,
WRL
WRH
WrCSx
t
13
t
43
t
45
t
47
t
49
t
51
t
52
t
23
Data OutAddress
t
56
t
9
t
43
t
11
t
45
t
22
t
13
t
50
t
49
Figure 16External Memory Cycle:
Multiplexed Bus, No Read/Write Delay, Extended ALE
Data Sheet54V2.0, 2000-12
AC Characteristics
Demultiplexed Bus (Standard Supply Voltage Range)
(Operating Conditions apply)
t
ALE cycle time = 4 TCL + 2
+ tC + tF (80 ns at 25 MHz CPU clock without waitstates)
A
C165
ParameterSymbolMax. CPU Clock
= 25 MHz
min.max.min.max.
ALE high time
Address setup to ALE
ALE falling edge to RD
(with RW-delay)
WR
ALE falling edge to RD
(no RW-delay)
WR
, WR low time
RD
CC10 + t
5
t
CC4 + t
6
,
t
CC10 + t
8
,
t
CC- 10 + tA–- 10
9
t
CC30 + t
12
A
–TCL - 10
A
–TCL - 16
–TCL - 10
A
–2TCL - 10
C
t
(with RW-delay)
, WR low time
RD
t
CC50 + t
13
–3TCL - 10
C
(no RW-delay)
to valid data in
RD
t
SR–20 + t
14
C
(with RW-delay)
Variable CPU Clock
Unit
1 / 2TCL = 1 to 25 MHz
–ns
t
+
A
–ns
t
+
A
–ns
t
+
A
–ns
t
+
A
–ns
t
+
C
–ns
t
+
C
–2TCL - 20
t
+
C
ns
to valid data in
RD
(no RW-delay)
ALE low to valid data in
Address to valid data in
Data hold after RD
t
SR–40 + t
15
t
SR–40 +
16
t
t
SR–50 +
17
2
t
SR0–0–ns
18
A
t
+ t
+ t
A
C
C
–3TCL - 20
t
+
C
–3TCL - 20
t
+ t
+
A
–4TCL - 30
2t
C
+
A
+ t
ns
ns
C
ns
C
rising edge
Data float after RD
rising
edge (with RW-delay
Data float after RD
edge (no RW-delay
Data Sheet55V2.0, 2000-12
rising
1)
1)
t
SR–26 +
20
)
t
SR–10 +
21
)
t
+ t
2
A
t
+ t
2
A
–2TCL - 14
1)
F
+
+
22t
t
F
1)
A
–TCL - 10
1)
F
+
+
22t
t
F
1)
A
ns
ns
Demultiplexed Bus (Standard Supply Voltage Range) (cont’d)
(Operating Conditions apply)
ALE cycle time = 4 TCL + 2
t
+ tC + tF (80 ns at 25 MHz CPU clock without waitstates)
A
C165
ParameterSymbolMax. CPU Clock
= 25 MHz
min.max.min.max.
Data valid to WRt
Data hold after WR
ALE rising edge after
, WR
RD
Address hold after WR
ALE falling edge to CS
low to Valid Data In
CS
hold after RD, WR
CS
2)
3)
3)
3)
ALE falling edge to
RdCS
, WrCS (with RW-
CC20 + t
22
t
CC10 + t
24
t
CC- 10 + tF–-10 + t
26
t
CC0 + t
28
t
CC- 4 - t
38
t
SR–40 +
39
t
CC6 + t
41
t
CC16 + t
42
F
F
–2TCL - 20
C
–TCL - 10
F
–0 + t
10 - t
A
tC +2t
A
A
–TCL - 14
–TCL - 4
A
delay)
Variable CPU Clock
Unit
1 / 2TCL = 1 to 25 MHz
–ns
t
+
C
–ns
t
+
F
–ns
F
F
-4 - t
A
–3TCL - 20
–ns
10 - t
A
ns
ns
t
+ 2t
+
C
A
–ns
t
+
F
–ns
t
+
A
ALE falling edge to
RdCS
, WrCS (no RW-
delay)
RdCS
to Valid Data In
(with RW-delay)
RdCS
to Valid Data In
(no RW-delay)
RdCS
, WrCS Low T ime
(with RW-delay)
RdCS
, WrCS Low T ime
(no RW-delay)
Data valid to WrCS
Data hold after RdCS
t
CC- 4 + t
43
t
SR–16 + t
46
t
SR–36 + t
47
t
CC30 + t
48
t
CC50 + t
49
t
CC26 + t
50
t
SR0–0–ns
51
–-4
A
t
+
A
C
C
–2TCL - 10
C
–3TCL - 10
C
–2TCL - 14
C
–2TCL - 24
–3TCL
t
+
C
t
+
C
t
+
C
–ns
t
+
C
t
+
C
–ns
–ns
–ns
- 24
ns
ns
Data Sheet56V2.0, 2000-12
Demultiplexed Bus (Standard Supply Voltage Range) (cont’d)
(Operating Conditions apply)
t
ALE cycle time = 4 TCL + 2
+ tC + tF (80 ns at 25 MHz CPU clock without waitstates)
A
C165
ParameterSymbolMax. CPU Clock
= 25 MHz
Variable CPU Clock
1 / 2TCL = 1 to 25 MHz
min.max.min.max.
Data float after RdCS
(with RW-delay)
1)
Data float after RdCS
(no RW-delay)
1)
Address hold after
RdCS
, WrCS
Data hold after WrCS
1)
RW-delay and tA refer to the next following bus cycle (including an access to an on-chip X-Peripheral).
2)
Read data are latched with the sa me clock edge that triggers the address change and the rising RD edge.
Therefore address changes before the end of RD
3)
These parameters refer to the latched chip select signals (C SxL). The early chip select signals (CS xE) are
specified together with the address and signal BHE
t
SR–20 + t
53
t
SR–0 + t
68
t
CC- 6 + t
55
t
CC6 + t
57
F
have no impact on read cycles.
F
F
–-6 + t
F
–2TCL - 20
–TCL - 20
F
–TCL - 14
t
+
F
(see figures below).
2t
+ tF
+
A
1)
2t
+ tF
+
A
1)
–ns
–ns
Unit
ns
ns
Data Sheet57V2.0, 2000-12
AC Characteristics
Demultiplexed Bus (Reduced Supply Voltage Range)
(Operating Conditions apply)
t
ALE cycle time = 4 TCL + 2
+ tC + tF (100 ns at 20 MHz CPU clock without waitstates)
A
C165
ParameterSymbolMax. CPU Clock
= 20 MHz
min.max.min.max.
ALE high time
Address setup to ALE
ALE falling edge to RD
(with RW-delay)
WR
ALE falling edge to RD
(no RW-delay)
WR
, WR low time
RD
CC11 + t
5
t
CC5 + t
6
,
t
CC15 + t
8
,
t
CC- 10 + tA–- 10
9
t
CC34 + t
12
A
–TCL - 14
A
–TCL - 20
–TCL - 10
A
–2TCL - 16
C
t
(with RW-delay)
, WR low time
RD
t
CC59 + t
13
–3TCL - 16
C
(no RW-delay)
to valid data in
RD
t
SR–22 + t
14
C
(with RW-delay)
Variable CPU Clock
Unit
1 / 2TCL = 1 to 20 MHz
–ns
t
+
A
–ns
t
+
A
–ns
t
+
A
–ns
t
+
A
–ns
t
+
C
–ns
t
+
C
–2TCL - 28
t
+
C
ns
to valid data in
RD
(no RW-delay)
ALE low to valid data in
Address to valid data in
Data hold after RD
t
SR–47 + t
15
t
SR–45 +
16
t
t
SR–57 +
17
2
t
SR0–0–ns
18
A
t
+ t
+ t
A
C
C
–3TCL - 28
t
+
C
–3TCL - 30
t
+ t
+
A
–4TCL - 43
2t
C
+
A
+ t
ns
ns
C
ns
C
rising edge
Data float after RD
rising
edge (with RW-delay
Data float after RD
edge (no RW-delay
Data Sheet58V2.0, 2000-12
rising
1)
1)
t
SR–36 +
20
)
t
SR–15 +
21
)
t
+ t
2
A
t
+ t
2
A
–2TCL - 14
1)
F
+
+
22t
t
F
1)
A
–TCL - 10
1)
F
+
+
22t
t
F
1)
A
ns
ns
Demultiplexed Bus (Reduced Supply Voltage Range) (cont’d)
(Operating Conditions apply)
ALE cycle time = 4 TCL + 2
t
+ tC + tF (100 ns at 20 MHz CPU clock without waitstates)
A
C165
ParameterSymbolMax. CPU Clock
= 20 MHz
min.max.min.max.
Data valid to WRt
Data hold after WR
ALE rising edge after
, WR
RD
Address hold after WR
ALE falling edge to CS
low to Valid Data In
CS
hold after RD, WR
CS
2)
3)
3)
3)
ALE falling edge to
RdCS
, WrCS (with RW-
CC24 + t
22
t
CC15 + t
24
t
CC- 12 + tF–-12 + t
26
t
CC0 + t
28
t
CC- 8 - t
38
t
SR–47 +
39
t
CC9 + t
41
t
CC19 + t
42
F
F
–2TCL - 26
C
–TCL - 10
F
–0 + t
10 - t
A
tC +2t
A
A
–TCL - 16
–TCL - 6
A
delay)
Variable CPU Clock
Unit
1 / 2TCL = 1 to 20 MHz
–ns
t
+
C
–ns
t
+
F
–ns
F
F
-8 - t
A
–3TCL - 28
–ns
10 - t
A
ns
ns
t
+ 2t
+
C
A
–ns
t
+
F
–ns
t
+
A
ALE falling edge to
RdCS
, WrCS (no RW-
delay)
RdCS
to Valid Data In
(with RW-delay)
RdCS
to Valid Data In
(no RW-delay)
RdCS
, WrCS Low T ime
(with RW-delay)
RdCS
, WrCS Low T ime
(no RW-delay)
Data valid to WrCS
Data hold after RdCS
t
CC- 6 + t
43
t
SR–20 + t
46
t
SR–45 + t
47
t
CC38 + t
48
t
CC63 + t
49
t
CC28 + t
50
t
SR0–0–ns
51
–-6
A
t
+
A
C
C
–2TCL - 12
C
–3TCL - 12
C
–2TCL - 22
C
–2TCL - 30
–3TCL
t
+
C
t
+
C
t
+
C
–ns
t
+
C
t
+
C
–ns
–ns
–ns
- 30
ns
ns
Data Sheet59V2.0, 2000-12
Demultiplexed Bus (Reduced Supply Voltage Range) (cont’d)
(Operating Conditions apply)
t
ALE cycle time = 4 TCL + 2
+ tC + tF (100 ns at 20 MHz CPU clock without waitstates)
A
C165
ParameterSymbolMax. CPU Clock
= 20 MHz
Variable CPU Clock
1 / 2TCL = 1 to 20 MHz
min.max.min.max.
Data float after RdCS
(with RW-delay)
1)
Data float after RdCS
(no RW-delay)
1)
Address hold after
RdCS
, WrCS
Data hold after WrCS
1)
RW-delay and tA refer to the next following bus cycle (inc luding an access to an on-chip X-P eripheral).
2)
Read data are latched with the sa me clock edge that triggers the address change and the rising RD edge.
Therefore address changes before the end of RD
3)
These parameters refer to the latched chip select signals (C SxL). The early chip select signals (CS xE) are
specified together with the address and signal BHE
t
SR–30 + t
53
t
SR–5 + t
68
t
CC- 16 + tF–- 16 + t
55
t
CC9 + t
57
F
–TCL - 16
have no impact on read cycles.
(see figures below).
F
F
–2TCL - 20
2t
+ tF
+
A
1)
–TCL - 20
2t
+ tF
+
A
1)
–ns
F
–ns
t
+
F
Unit
ns
ns
Data Sheet60V2.0, 2000-12
C165
ALE
CSxL
A23-A16
A15-A0
, CSxE
BHE
Read Cycle
BUS
(D15-D8)
D7-D0
RD
t
5
t
38
t
16
t
39
t
17
t
26
t
41
t
28
Address
t
6
t
55
t
20
t
18
Data In
t
8
t
14
RdCSx
Write Cycle
BUS
(D15-D8)
D7-D0
WR,
WRL
WRH
WrCSx
t
12
t
42
t
46
t
48
t
51
t
53
t
24
Data Out
t
57
t
8
t
22
,
t
12
t
42
t
50
t
48
Figure 17External Memory Cycle:
Demultiplexed Bus, With Read/Write Delay, Normal ALE
Data Sheet61V2.0, 2000-12
C165
ALE
CSxL
A23-A16
A15-A0
,
BHE
CSxE
Read Cycle
BUS
(D15-D8)
D7-D0
RD
t
5
t
38
t
16
t
39
t
17
t
26
t
41
t
28
Address
t
6
t
55
t
20
t
18
Data In
t
8
t
14
RdCSx
Write Cycle
BUS
(D15-D8)
D7-D0
WR,
,
WRL
WRH
WrCSx
t
12
t
42
t
46
t
48
t
51
t
53
t
24
Data Out
t
57
t
8
t
42
t
22
t
12
t
50
t
48
Figure 18External Memory Cycle:
Demultiplexed Bus, With Read/Write Delay, Extended ALE
Data Sheet62V2.0, 2000-12
C165
ALE
CSxL
A23-A16
A15-A0
, CSxE
BHE
Read Cycle
BUS
(D15-D8)
D7-D0
RD
t
5
t
38
t
17
t
16
t
39
t
26
t
41
t
28
Address
t
6
t
55
t
21
t
18
Data In
t
9
t
15
RdCSx
Write Cycle
BUS
(D15-D8)
D7-D0
WR,
,WRH
WRL
WrCSx
t
t
43
13
t
47
t
49
t
51
t
68
t
24
Data Out
t
t
9
t
43
t
22
t
13
t
50
t
49
57
Figure 19External Memory Cycle:
Demultiplexed Bus, No Read/Write Delay, Normal ALE
Data Sheet63V2.0, 2000-12
C165
ALE
CSxL
A23-A16
A15-A0
,CSxE
BHE
Read Cycle
BUS
(D15-D8)
D7-D0
RD
t
5
t
38
t
t
t
16
39
17
t
26
t
41
t
28
Address
t
6
t
55
t
21
t
18
Data In
t
9
t
15
RdCSx
Write Cycle
BUS
(D15-D8)
D7-D0
WR,
, WRH
WRL
WrCSx
t
13
t
43
t
47
t
49
t
51
t
68
t
24
Data Out
t
57
t
9
t
43
t
22
t
13
t
50
t
49
Figure 20External Memory Cycle:
Demultiplexed Bus, No Read/Write Delay, Extended ALE
Data Sheet64V2.0, 2000-12
AC Characteristics
C165
CLKOUT and READY
(Standard Supply Voltage)
(Operating Conditions apply)
ParameterSymbolMax. CPU Clock
= 25 MHz
min.max.min.max.
t
CLKOUT cycle time
CLKOUT high time
CLKOUT low time
CLKOUT rise time
CLKOUT fall time
CLKOUT rising edge to
CC40402TCL2TCLns
29
t
CC14–TCL - 6–ns
30
t
CC10–TCL - 10–ns
31
t
CC–4–4ns
32
t
CC–4–4ns
33
t
CC0 + t
34
A
10 + t
A
ALE falling edge
t
Synchronous READY
SR14–14–ns
35
setup time to CLKOUT
t
Synchronous READY
SR4–4–ns
36
hold time after CLKOUT
Variable CPU Clock
1 / 2TCL = 1 to 25 MHz
0 + t
A
10 + t
A
Unit
ns
Asynchronous READY
SR54–2TCL + t
37
–ns
58
t
low time
t
Asynchronous READY
setup time
1)
Asynchronous READY
hold time
Async. READY
after RD
(Demultiplexed Bus)
1)
These timings are given for test purposes only, in order to assure rec ognition at a specific clock edge.
2)
Demultiplexed bus is the worst case. For multiplexed bus 2TCL are to be added to the maximum values. This
adds even more time for deactivating READY
The 2
The maximum limit for
1)
hold time
, WR high
2)
t
and tC refer to the next following bus cycle, tF refers to the current bus cycle.
A
t
must be fulfilled if the next following bus cycle is READY controlled.
60
SR14–14–ns
58
t
SR4–4–ns
59
t
SR00
60
.
+ 2
t
C
+
t
A
2)
t
F
0TCL - 20
+
+ 2
+
t
F
t
+ tC
A
2)
ns
Data Sheet65V2.0, 2000-12
AC Characteristics
C165
CLKOUT and READY
(Reduced Supply Voltage)
(Operating Conditions apply)
ParameterSymbolMax. CPU Clock
= 20 MHz
min.max.min.max.
t
CLKOUT cycle time
CLKOUT high time
CLKOUT low time
CLKOUT rise time
CLKOUT fall time
CLKOUT rising edge to
CC50502TCL2TCLns
29
t
CC15–TCL - 10–ns
30
t
CC13–TCL - 12–ns
31
t
CC–12–12ns
32
t
CC–8–8ns
33
t
CC0 + t
34
A
8 + t
A
ALE falling edge
t
Synchronous READY
SR18–18–ns
35
setup time to CLKOUT
t
Synchronous READY
SR4–4–ns
36
hold time after CLKOUT
Variable CPU Clock
1 / 2TCL = 1 to 20 MHz
0 + t
A
8 + t
A
Unit
ns
Asynchronous READY
SR68–2TCL + t
37
–ns
58
t
low time
t
Asynchronous READY
setup time
1)
Asynchronous READY
hold time
Async. READY
after RD
(Demultiplexed Bus)
1)
These timings are given for test purposes only, in order to assure rec ognition at a specific clock edge.
2)
Demultiplexed bus is the worst case. For multiplexed bus 2TCL are to be added to the maximum values. This
adds even more time for deactivating READY
The 2
The maximum limit for
1)
hold time
, WR high
2)
t
and tC refer to the next following bus cycle, tF refers to the current bus cycle.
A
t
must be fulfilled if the next following bus cycle is READY controlled.
60
SR18–18–ns
58
t
SR4–4–ns
59
t
SR00
60
.
+ 2
t
C
+
t
A
2)
t
F
0TCL – 25
+
+ 2
+
t
F
t
+ tC
A
2)
ns
Data Sheet66V2.0, 2000-12
C165
CLKOUT
ALE
Command
RD, WR
Sync
READY
Async
READY
Running Cycle
t
t
58
3)
t
29
READY
Waitstate
t
35
3)
MUX/Tristate
t
36
4)
t
60
see
1)
t
32
t
33
t
30
t
31
34
2)
t
36
t
35
3)
t
59
t
58
t
59
3)
5)
t
37
6)
7)
6)
MCT04447
Figure 21CLKO UT and READY
Notes
1)
Cycle as programmed, including MCTC waitstates (Example shows 0 MCTC WS).
2)
The leading edge of the respe ctiv e c om m and depends on RW-delay.
3)
READY sampled HIGH at this sa mp ling point generates a READY cont rolled waitstate,
READY
4)
READY may be dea ctivated in response t o the trailing (rising) edge of the correspond ing command (RD or
WR
5)
If the Asynchronous READY signal does not fulfill the indicated setup and hold times with respect to CLKOUT
(e.g. because CLKOUT is not enabled), it must fulfill
if READY
6)
Multiplexed bus modes have a MUX waitstate added after a bus cycle, and an additional MTTC waitstate may
be inserted here.
For a multiplexed bus with MTTC waitstate this delay is 2 CLKOUT cycles, for a demultiplexed bus without
MTTC waitstate this delay is zero.
7)
The next external bus cycle ma y start here.
Data Sheet67V2.0, 2000-12
sampled LOW at this sampling point te rminates the currently running bus cycle.
).
t
in order to be safely synchronized. This is guaranteed,
37
is removed in response to the command (see Note 4)).
AC Characteristics
External Bus Arbitration (Standard Supply Voltage)
(Operating Conditions apply)
C165
ParameterSymbolMax. CPU Clock
= 25 MHz
min.max.min.max.
HOLD
input setup time
t
SR20–20 –ns
61
to CLKOUT
CLKOUT to HLDA
or BREQ
low delay
CLKOUT to HLDA
or BREQ
CSx
CSx
high delay
releaset
drivet
high
low
Other signals release
Other signals drive
t
CC–20–20ns
62
t
CC–20–20ns
63
CC–20–20ns
64
CC- 424- 424ns
65
t
CC–20–20ns
66
t
CC- 424- 424ns
67
External Bus Arbitration (Reduced Supply Voltage)
(Operating Conditions apply)
Variable CPU Clock
1 / 2TCL = 1 to 25 MHz
Unit
ParameterSymbolMax. CPU Clock
= 20 MHz
min.max.min.max.
HOLD
input setup time
t
SR30–30–ns
61
to CLKOUT
CLKOUT to HLDA
or BREQ
low delay
CLKOUT to HLDA
or BREQ
CSx
CSx
high delay
releaset
drivet
high
low
Other signals release
Other signals drive
t
CC–20–20ns
62
t
CC–20–20ns
63
CC–20–20ns
64
CC- 430- 430ns
65
t
CC–20–20ns
66
t
CC- 430- 430ns
67
Variable CPU Clock
1 / 2TCL = 1 to 20 MHz
Unit
Data Sheet68V2.0, 2000-12
CLKOUT
HOLD
HLDA
C165
t
61
t
63
1)
see
t
62
BREQ
2)
t
64
CSx
(On P6.x)
t
66
Other
Signals
1)
Figure 22External Bus Arbitration, Releasing the Bus
Notes
1)
The C165 will complete the currently running bus cycle before granting bus access.
2)
This is the first possibility for BREQ to get active.
3)
The CS outputs will be resistive high (pullup) after t64.
3)
MCT04448
Data Sheet69V2.0, 2000-12
C165
CLKOUT
HOLD
HLDA
BREQ
CSx
(On P6.x)
Other
Signals
2)
t
61
t
62
t
62
t
62
1)
t
63
t
65
t
67
MCT04449
Figure 23External Bus Arbitration, (Regaining the Bus)
Notes
1)
This is the last chance for BREQ to trigg er th e indicated regain-sequence.
Even if BREQ
Please note that HOLD
2)
The next C165 driven bus cycle m ay s ta rt he re.
is activated earlier, the regain-s equence is initiated by HOLD goin g high.
may also be deactivated without the C165 requesting the bus.
Data Sheet70V2.0, 2000-12
Package Outlines
P-MQFP-100 (SMD)
(Plastic Metric Quad Flat Package)
C165
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”.
SMD = Surface Mounted Device
Data Sheet71V2.0, 2000-12
Dimensions in mm
GPR05365
P-TQFP-100 (SMD)
(Plastic Thin Metric Quad Flat Package)
C165
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”.
SMD = Surface Mounted Device
GPP05614
Dimensions in mm
Data Sheet72V2.0, 2000-12
Infineon goes for Business Excellence
“Business excellence means intelligent approaches and clearly
defined processes, which are both constantly under review and
ultimately lead to good operating results.
Better operating results and business excellence mean less
idleness and wastefulness for all of us, more professional
success, more accurate information, a better overview and,
thereby, less frustration and more satisfaction.”
Dr. Ulrich Schumacher
http://www.infineon.com
Published by Infineon Technologies AG
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