This Addendum and PCN-Datasheet refers to the PCN 2004-018-A:
“Minor datasheet adaption for BTS 5240 L, BTS 5240 G, BTS 5440 G “.
The PCN-datasheet attached will be valid starting from August 2004.
There are the following changes in the datasheet (on page 7):
Old:
Symbol min typ max Unit
Current limit adjustment threshold voltage V
- - 3.6
New:
Symbol min typ max Unit
Current limit adjustment threshold voltage V
- - 4.0
2.6 - - V
CLA(T-)
2.0 - - V
CLA(T-)
Smart High-Side Power Switch
)
)
Four Channels: 4 x 25mΩ
IntelliSense
PCN 2004-018-A: BTS 5440G
Product Summary
Operating voltageV
bb(on)
4,5...28
V
Package
( Loaddump: 40 V )
Active channelsonefour parallel
On-state resistanceR
Nominal load currentI
L(nom
Current limitation LowI
ON
L(SCr
256.5mΩ
6.213.9A
10A
P-DSO-28-19
High40
General Description
• N channel vertical power MOSFET with charge pump, ground referenced CMOS compatible input and
diagnostic feedback, monolithically integrated in Smart SIPMOS
technology.
• Providing embedded protective functions.
• Extern adjustable current limitation.
Application
• All types of resistive, inductive and capacitive loads
• µC compatible high-side power switch with diagnostic feedback for 12 V grounded loads
• Due to the adjustable current limitation best suitable for loads with high inrush currents, so as lamps
• Replaces electromechanical relays, fuses and discrete circuits
Basic Functions
• Very low standby current
• CMOS compatible input
• Improved electromagnetic compatibility (EMC)
• Stable behaviour at low battery voltage
Protection Functions
• Reverse battery protection with external resistor
• Short circuit protection
• Overload protection
• Current limitation
• Thermal Shutdown
• Overvoltage protection with external resistor
• Loss of GND and loss of V
• Electrostatic discharge Protection (ESD)
protection
bb
Block Diagram
IN1
IS1
IS2
IN2
CLA 1/2
IN3
IS3
IS4
IN4
CLA 3/4
Vbb
Logic
Channel 1
Channel 2
Logic
Channel 3
Channel 4
GND
Diagnostic Functions: IntelliSense
• Proportional load current sense ( with defined fault signal during thermal shutdown and overload )
• Additional open load detection in OFF - state
• Suppressed thermal toggling of fault signal
Load 1
Load 2
Load 3
Load 4
Page 1
2004-Mar-08
Functional diagram
PCN 2004-018-A: BTS 5440G
IN1
IS1
CLA 1/2
IN2
IS2
GND1/2
IN3
IS3
CLA 3/4
overvoltage
protection
internal
voltage
supply
ESD
gate
control
+
charge
logic
pump
temperature
sensor
openload
dedection
control and protection circuit
of
channel 2
control and protection circuit
of
channel 3
current limit
clamp for
inductive load
Current
sense
VBB
OUT1
LOAD
OUT2
OUT3
IN4
IS4
GND3/4
control and protection circuit
of
channel 4
Page 2
OUT4
2004-Mar-08
Pin definition and function
PCN 2004-018-A: BTS 5440G
Pin
1,14,
15,28
3
6
9
12
25,26,27
22,23,24
19,20,21
16,17,18
4
5
10
Symbol
V
bb
IN1
IN2
IN3
IN4
OUT1
OUT2
OUT3
OUT4
IS1
IS2
IS3
Function
Positive power supply voltage. Design the wiring for the
simultaneous max. short circuit currents from channel 1 to 4
and also for low thermal resistance
Input 1,2,3,4 activates channel 1,2,3,4 in case of logic high signal
Output 1,2,3,4 protected high-side power output of channel 1,2,3,4.
Design the wiring for the max. short circuit current
Diagnostic feedback 1...4 of channel 1 to 4
On state: advanced current sense with defined signal in case
of overload or short circuit
11
7
13
2
8
IS4
CLA 1/2
CLA 3/4
GND 1/2
GND 3/4
Off state: High on failure
Current limit adjust; the current limit for channels 1/2 and 3/4 can
be chosen as high ( potential < 2,6V ) or low ( potential > 3,6V ).
Ground of chip 1 ( channel 1,2 )
Ground of chip 2 ( channel 3,4 )
Pin configuration
(top view)
V
1
bb
GND ½227 OUT1
IN1 326 OUT1
IS1425 OU T1
IS2524 O U T2
IN2 623 O U T 2
CLA ½ 722 OUT2
GND ¾ 821 OUT3
IN3 920 O U T 3
IS3 1 019 O U T 3
IS4 1 118 O U T 4
IN4 1217 O U T 4
CLA ¾ 1316 OUT4
V
bb
•
1415
28 V
bb
V
bb
Page 3
2004-Mar-08
PCN 2004-018-A: BTS 5440G
)
)
g
A
A
A
Maximum Ratings at Tj=25°C, unless otherwise specified
ParameterSymbolValueUnit
Supply voltage (overvoltage protection see page 6)V
Supply voltage for full short circuit protection;Tj = -40...150°CV
Maximum voltage across DMOSV
Load dump protection3) V
LoadDump
In = low or high; td = 400 ms; R
R
= 2.25 Ω
L
R
= 6.8 Ω
L
4)
= VA + VS; VA = 13,5 V
4)
= 2 Ω
I
V
Load current (Short - circuit current, see page 7)I
Operating temperature rangeT
Storage temperature rangeT
bb
bb(SC
ON
Loaddump
L
j
st
1)
28
2)
28
52
40
53
5)
I
L(lim
-40...+150
-55...+150
Dynamical temperature rise at switchingdT60K
V
A
°C
Power dissipation6) (DC), all channels active TA = 85 °C
Maximal switchable inductance, single pulse
Vbb=12V, T
IL = 6 A, EAS = 0.319 J, R
IL = 12 A, E
=150°C; (see diagrams on page 12)
jstart
= 0 Ω, one channel:
L
= 0.679 J, R
S
= 0 Ω, two parallel channels:
L
Electrostatic discharge voltage IN:
(Human Body Model) IS:
according to ANSI EOS/ESD - S5.1 - 1993 , ESD STM5.1 - 1998 OUT:
Continuous input voltageV
Voltage at current limit adjustment pinV
Current through current limit adjustment pinI
Current through input pin (DC)I
Current through sense pin (DC) (see page 11)I
1
18...28 V for 100 hours
2
only single pulse, R
line, contact and generator impedances.
3
Supply voltage higher than V
4
RI = internal resistance of the load dump test pulse generator.
5
Current limit is a protection function. Operation in current limitation is considered as "outside" normal operating
range. Protection functions are not designed for continuous repetitive operation.
6
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for Vbb
connection. PCB is vertical without blown air.
= 200 mΩ ; L = 8 µH ; R and L are describing the complete circuit impedance including
L
bb(AZ)
require an external current limit for the GND (150Ω resistor) and sense pin.
P
Z
V
CL
IN
IS
tot
L(s)
ESD
IN
CL
1,6
9.8
5.2
1,0
2,0
4,0
-10...16V
-10...16
±5.0
±5.0
-5...+10
W
mH
kV
mA
Page 4
2004-Mar-08
PCN 2004-018-A: BTS 5440G
Electrical Characteristics
Parameter and Conditions, each of the four channelsSymbolValuesUnit
at Tj = -40...+150 °C, Vbb = 9...16 V, unless otherwise specifiedmin.typ.max.
Thermal Resistance
junction - soldering point1) each channel:
junction - ambient2) one channel active:
all channels active:
Load Switching Capabilities and Characteristics
On-state resistance (Vbb to OUT), (see page 13)
T
= 25 °C, IL = 5 A, each channel:
j
T
= 150 °C, each channel:
j
T
= 25 °C, two parallel channels:
j
T
= 25 °C, four parallel channels:
j
Nominal load current2)
Ta = 85°C, T
≤ 150°C , one channel active:
j
two channels active, per channel:
four channels active, per channel:
Output voltage drop limitation at small load currents
IL = 0.5 A
R
thJS
R
thJA
R
ON
I
L(nom)
V
ON(NL)
--25K/W
-
40
-K/W
32
-
-
-
-
5.7
4.0
3.1
21
42
11
5.5
6.2
4.4
3.4
25
50
13
6.5
-
-
-
mΩ
A
-40-mV
Output current while GND disconnected
( see diagram page 12 )
3)
I
L(GNDhigh)
--2mA
VIN = 0 V
1
Soldering point is measured at Vbb-pin
2
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for Vbb
connection. PCB is vertical without blown air.
3
not subject to production test, specified by design
Page 5
2004-Mar-08
PCN 2004-018-A: BTS 5440G
)
Electrical Characteristics
Parameter and Conditions, each of the four channelsSymbolValuesUnit
at Tj = -40...+150 °C, Vbb = 9...16 V, unless otherwise specifiedmin.typ.max.
Load Switching Capabilities and Characteristics
Turn-on time1) to 90% V
R
= 12 Ω, V
L
= 12 V
bb
Turn-off time1) to 10% V
R
= 12 Ω, V
L
= 12 V
bb
Slew rate on1) 10 to 30% V
R
= 12 Ω, V
L
= 12 V
bb
Slew rate off1) 70 to 40% V
R
= 12 Ω, V
L
= 12 V
bb
Operating Parameters
Operating voltage
2)
Overvoltage protection3)
Ibb = 40 mA
Standby current
(see diagram on page 13)
4)
OUT
OUT
OUT
OUT
,
,
t
on
t
off
dV/dt
-dV/dt
V
bb(on
V
bb(AZ)
I
bb(off)
on
off
-90200
-100220
0.10.250.45
0.090.250.4
4.5-28V
414752
µs
V/µs
µA
T
= -40...+25 °C, VIN = 0 V
j
T
= 150 °C
j
1
See timing diagram on page 14.
2
18V...28V for 100 hours
3
Supply voltages higher than V
See also V
4
Measured with load; for the whole device; all channels off.
Out(CL)
in table of protection functions and circuit diagram on page 11.
bb(AZ)
require an external current limit for the status pin and GND pin (e.g. 150Ω).
-
-
10
15
-
40
Page 6
2004-Mar-08
PCN 2004-018-A: BTS 5440G
j
j
Electrical Characteristics
Parameter and Conditions, each of the four channelsSymbolValuesUnit
at Tj = -40...+150 °C, Vbb = 9...16 V, unless otherwise specifiedmin.typ.max.
Operating Parameters
Off-State output current (included in I
bb(off)
)
VIN = 0 V, each channel
Operating current1)
VIN = 5 V, per active channel
Protection Functions
2)
Current limit, ( see timing diagrams, page 15 )
Low level; if potential at CLA = high
High level; if potential at CLA = low
Current limit adjustment threshold voltageV
Repetitive short circuit current limit
Tj = T
(see timing diagrams on page 15)
jt
High level one active channel:
two active channels3):
Low level one active channel:
I
L(off)
I
GND
I
L(LIM)
CLA(T-)
V
CLA(T+)
I
L(SCr)
-1.58µA
-1.64mA
7
40
2.0
-
-
-
-
11
50
40
40
7
14
60
-
-
-
4.0
-
-
-
A
V
A
two active channels3):
Initial short circuit shutdown time low level:
T
Output clamp (inductive load switch off)
= 25°C ; Vbb = 13,5 V high level:
j,start
4)
t
off(SC)
V
Out(CL)
-
-
-
7
3.5
0.75
--15-V
IL = 40 mA
Thermal overload trip temperatureT
Thermal hysteresis∆T
1
Add IIS, if IIS > 0
2
Integrated protection functions are designed to prevent IC destruction under fault conditions
described in the data sheet. Fault conditions are considered as "outside" normal operating range.
Protection functions are not designed for continuous repetitive operation.
3
At the beginning of the short circuit the double current is possible for a short time.
4
If channels are connected in parallel, output clamp is usually accomplished by the
channel with the lowest V
Out(CL)
.
Page 7
t
t
150170-°C
-10-K
2004-Mar-08
-
ms
-
-
PCN 2004-018-A: BTS 5440G
)
)
Electrical Characteristics
Parameter and Conditions, each of the four channelsSymbolValuesUnit
at Tj = -40...+150 °C, Vbb = 9...16 V, unless otherwise specifiedmin.typ.max.
Diagnostic Characteristics
Open load detection voltageV
Internal output pull down1)
V
OUT
= 13.5 V
Current sense ratio, static on-condition
k
ILIS
= IL:I
IS
IL = 0.5 A
IL = 3 A
IL = 6 A
Sense signal in case of fault-conditions
2)
in off-state
Current saturation of sense fault signalI
Sense signal delay after thermal shutdown
3)
Current sense output voltage limitation
IIS = 0 , IL = 5 A
Current sense leakage/offset current
VIN = 5 V, IL = 0 , VIS = 0
OUT(OL
R
OUT(PD)
k
ILIS
V
fault
fault
t
delay(fault
V
IS(lim)
I
IS(LH)
23.24.4V
112335
4640
4900
4900
5800
5400
5350
6960
5900
5800
56.27.5V
4--mA
--1.2ms
5.46.57.3V
--5µA
kΩ
Current sense settling time to I
static ±10%
IS
t
son(IS)
after positive input slope4) , IL = 0 to 5A
Current sense settling time to I
static ±10%
IS
t
slc(IS)
after change of load current4), IL = 2.5 to 5A
1
In case of floating output, the status doesn´t show open load.
2
Fault condition means output voltage exceeds open load detection voltage V
3
In the case of thermal shutdown the V
than the restart of the switch ( see diagram on page 16 ).
4
not subject to production test, specified by design
signal remains for t
fault
Page 8
delay(fault)
--400
--300
OUT(OL)
longer
µs
2004-Mar-08
PCN 2004-018-A: BTS 5440G
)
)
)
)
Electrical Characteristics
ParameterSymbolValuesUnit
at Tj = -40...+150 °C, Vbb = 9...16 V, unless otherwise specifiedmin.typ.max.
Diagnostic Characteristics
Status invalid after negative input slopet
Status invalid after positive input slope
d(SToff
t
d(STOL)
with open load
Input Feedback
1)
Input resistance (see circuit page 11)R
Input turn-on threshold voltageV
Input turn-off threshold voltageV
Input threshold hysteresis∆V
Off state input current
I
IN(off)
VIN = 0.4 V
On state input current
I
IN(on)
VIN = 5 V
Reverse Battery
2)
Reverse battery voltage-V
Drain-source diode voltage (V
T
= 150 °C, Ibb = -10 mA
j
OUT
> Vbb)
-V
I
IN(T+
IN(T-
IN(T
bb
ON
--1.2ms
--20
2.03.55.5
--2.4V
1.0--
-0.5-
3-40µA
205090
--27V
-330-mV
µs
kΩ
1
If ground resistors R
2
Requires a 150Ω resistor in GND connection. The reverse load current through the intrinsic drain-source diode
has to be limited by the connected load. Power dissipation is higher compared to normal operating conditions
due to the voltage drop across the drain-source diode. The temperature protection is not active during reverse
current operation! Input and status currents have to be limited. (see max. ratings page 4 )
are used, add the voltage drop across these resistor.
GND
Page 9
2004-Mar-08
Truth Table - for each of the four channels
PCN 2004-018-A: BTS 5440G
Normal
Operation
Input
level
L
H
Output
level
L
V
bb
Diagnostic
output
1)
Z
IIS = IL / kilis
Current
Limitation
2)
HV
Short circuit
to GND
H
OvertemperatureL
H
Short circuit
to V
bb
H
Open loadL
H
L
L
>V
bb
L
L
L
L
V
bb
V
bb
out(OL)
V
bb
L = " Low" Level Z = high impedance, potential depends on external circuit
H = "High" Level V
= 5V typ., constant voltage independent of external sense resistor.
fault
V
fault
1)
Z
V
fault
1)
Z
V
fault
V
fault
< IIS = IL / kilis
V
fault
1)
Z
3)
Parallel switching of channels is possible by connecting the inputs and outputs parallel.
The current sense ouputs have to be connected with a single sense resistor.
Terms
I
bb
V
bb
V
IN1
I
IN1
3
I
IN2
6
I
4
IS1
V
I
IN2
V
5
IS2
7
V
IS2
IS1
V
CLA1/2
IN1
IN2
IS1
IS2
CLA1/2
Leadframe
V
bb
PROFET
GND1/2
2
I
GND
OUT1
OUT2
25
26
27
22
23
24
V
V
ON2
OUT2
V
ON1
V
bb
I
L1
I
L2
V
OUT1
V
IN3
I
IN3
9
I
IN4
12
I
10
IS3
V
I
IN4
11
IS4
13
V
V
IS4
IS3
V
CLA3/4
IN3
IN4
IS3
IS4
CLA3/4
V
bb
PROFET
GND3/4
8
Leadframe
I
GND
OUT3
OUT4
19
20
21
16
17
18
Leadframe (Vbb) is connected to pin 1, 14, 15, 28
1
L-potential by using a sense resistor
2
Current limitation is only possible while the device is switched on.
3
Low ohmic short to Vbb may reduce the output current IL and therefore also the sense current IIS.
V
ON3
V
ON4
I
L3
I
L4
V
OUT3
V
OUT4
Page 10
2004-Mar-08
PCN 2004-018-A: BTS 5440G
g
f
S
Input circuit ( ESD protection ), IN1...IN4
R
IN
I
ESD-ZD
I
GND
I
I
The use of ESD zener diodes as voltage clamp
at DC conditions is not recommended.
Sense-Status output, IS1...IS4
ON-State: Normal operation: IS = IL /
VIS = IS * RIS; R
R
I
IS
V
f
ESD-ZD
= 1kΩ nominal
IS
IS
Sense output
lo
ic
GND
> 500Ω
V
IS
R
IS
IS
kILIS
Inductive and overvoltage output clamp,
OUT1...OUT4
+V
+V
bb
bb
V
V
Z
Z
OUT
OUT
V
V
OUT
OUT
V
clamped to V
Out
GND
GND
Power GND
Power GND
Out(CL)
= -15 V typ.
Overvolt. Protection of logic part
OUT1...OUT4
+ V
bb
V
R
I
IN
IS
R
IS
Logic
V
Z1
Z2
PROFET
GND
R
GND
Signal GND
ESD zener diode: V
= 6,1 V typ., max. 14 mA ;
ESD
ON-State: Fault condition so as thermal shut down
or current limitation
Sense output
V
logic
fault
V
fault
V
R
V
fault
ESD-ZD
= 6 V typ ; V
GND
fault
< V
IS
under all conditions
ESD
OFF-State diagnostic condition:
Open Load, if V
Int. 5V
GND
ESD-Zener diode: 6,1V typ., max. 5mA; R
> 3 V typ.; IN low
OUT
IS - ST
ESD-
ZD
R
I
ST(ON)
< 375Ω
at 1,6mA.. The use of ESD zener diodes as voltage clamp
at DC conditions is not recommended.
VZ1 = 6,1V typ., VZ2 = 47V typ., R
R
= 1kΩ , RI = 3,5kΩ typ.
IS
GND
= 150Ω ,
Page 11
2004-Mar-08
PCN 2004-018-A: BTS 5440G
Reverse battery protection
OUT1...OUT4
- V
bb
V
GND
-I
Z2
OUT
GND
Load GND
R
Load
= 150Ω
GND
R
I
IN
IS
V
PROFET
R
IS
Logic
Z1
R
Signal GND
VZ1 = 6,1V typ., VZ2 = 47V typ., R
R
= 1kΩ, RI = 3,5kΩ typ.
IS
In case of reverse battery the load current has to
be limited by the load. Protection functions are
not active.
Open load detection, OUT1...OUT4
Off-state diagnostic condition:
Open load, if V
OFF
Logic
unit
Open load
detection
> 3 V typ.; IN = low
OUT
Signal GND
V
bb
R
EXT
V
OUT
Vbb disconnect with energized inductive
load
V
high
high
V
VbbV
bb
bb
V
bb
bb
IN
IN
OUT
GND
GND
OUT
PROFET
PROFET
IS
IS
For inductive load currents up to the limits defined
by ZL each switch is protected against loss of Vbb.
(max. ratings and diagram on page 12)
Consider at your PCB layout that in the case of Vbb
disconnection with energized inductive load all the
load current flows through the GND connection.
Inductive load switch-off energy
dissipation
E
bb
E
AS
E
V
bb
IN
GND
OUT
Z
L
{
=
PROFET
IS
Load
L
E
L
E
R
R
L
GND disconnect
IN
PROFET
IS
GND
V
V
V
bb
IN
IS
Any kind of load.
Energy stored in load inductance: EL = ½ * L * I
2
L
While demagnetizing load inductance,
the enérgy dissipated in PROFET is
E
= Ebb + EL - E
V
bb
OUT
V
GND
AS
with an approximate solution for R
L
IL
E
AS
*
=++
2
*(|)*ln(
L
R
*
Page 12
= V
R
VV
bbOUT CL
ON(CL)
()|
* iL(t) dt,
> 0Ω:
L
LL
IR
1
*
OUT CL
V
||
2004-Mar-08
()
)
PCN 2004-018-A: BTS 5440G
Maximum allowable load inductance
for a single switch off (one channel)
L =f(IL); T
1000
100
10
[mH]
L(s)
Z
1
0,1
= 150°C, Vbb = 12V, R
jstart
05101520
I
[A]
L
L
= 0Ω
Typ. standby current
I
bb(off)
= f(Tj) ; V
16
14
12
10
[µA]
8
bb(off)
I
6
4
2
0
-40 -20 0 20 40 60 80 100 120 140 160
= 16 V ; V
bb
T
[°C]
j
IN1...4
= low
Typ. on-state resistance
R
= f(Vbb,Tj); IL = 5 A ; V
ON
30
28
26
24
22
[mOhm]
20
on
R
18
16
14
12
05101520253035
[V]
V
bb
= high
in
Page 13
2004-Mar-08
PCN 2004-018-A: BTS 5440G
IN
IN
Timing diagrams
All channels are symmetric and consequently the diagrams are valid for channel 1 to channel 4.
Figure 1a: Switching a resistive load,
change of load current in on-condition
V
OUT
t
on
I
L
IS,V
S
tt
Load 1
t
son(IS)
Load 2
The sense signal is not valid during settling time after
turn on or change of load current. tslc(IS) = 300 µs typ.
t
off
slc(IS)slc(IS)
t
Figure 1c: Behaviour of sense output:
Sense current (IS) and sense voltage (VS)
as function of load current dependent on
the sense resistor.
Shown is VS and IS for three different
sense resistors. Curve 1 refers to a low
resistor, curve 2 to a medium-sized
resistor and curve 3 to a big resistor.
Note, that the sense resistor may not falls
short of a minimum value of 500Ω.
V
S
V
ESD
V
fault
I
S
3
2
1
I
L
1
Figure 1b:Vbb turn on
V
bb
I
L
IS,V
S
proper turn on under all conditions
IS = IL / k
ILIS
VIS = IS * RIS; R
R
= 1kΩ nominal
IS
> 500Ω
IS
I
L(lim)
2
3
I
L
Page 14
2004-Mar-08
PCN 2004-018-A: BTS 5440G
Figure 2a: Switching a lampFigure 3a: Short circuit:
IN
Shut down by overtemperature,
reset by cooling
IS
V
OUT
I
L
t
Figure 2b: Switching a lamp with current limit:
The behaviour of I
and VS is shown for a
S
resistor, which refers to curve 1 in figure 1c
IN
IN
V
V
OUT
OUT
I
I
L
L
IN
I
L
V
S
I
L(lim)
I
L(SCr)
V
fault
t
delay
fault
Heating up may require several milliseconds,
depending on external conditions.
I
= 50A typ. increases with
L(lim)
decreasing temperature.
Figure 3a: Turn on into short circuit,
shut down by overtemperature, restart by cooling
( channel 1 and 2 switched parallel )
V
V
V
V
I
I
S
S
S
S
fault
fault
t
t
Page 15
IN1/2
2 x I
VS1, V
L(lim)
IL1 + I
2 x I
L(lim )
t
off(S C )
S2
L2
V
fault
I
L(SCr)
t
delay
fau lt
2004-Mar-08
PCN 2004-018-A: BTS 5440G
Figure 4a: Overtemperature
Reset if T
The behaviour of
which refers to curve 1 in figure 1c.
IN
I
L
I
S
T
J
T
<
j
jt
t
delay(fault)
I
S
and
V
is shown for a resistor,
S
t
Figure 5a:Open-load: detection in OFF-state,
turn on/off to open load.
Open load of channel 1; other channels normal
opertaion.
Figure 6a: Current sense ratio
7000
6000
5000
4000
k
ILIS
012345678910111213
1)
[A]
I
L
IN1
V
OUT1
I
L1
IS
V
fault
t
= 250µs max.;
off
t
off
t
ST delay
t
ST delay
= 500µs max.
t
off
t
ST delay
with pull up resistor at output
1
This range for the current sense ratio refers to all devices. The accuracy of the
The information herein is given to describe certain
components and shall not be considered as
a guarantee of characteristics.
Terms of delivery and rights to technical change
reserved.
We hereby disclaim any and all warranties, including
but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC
manufacturer.
Information
For further information on technology, delivery
terms and conditions and prices please contact
your nearest Infineon Technologies Office in
Germany or our Infineon Technologies
Representatives worldwide (see address list).
Warnings
Due to technical requirements components may
contain dangerous substances. For information
on the types in question please contact your
nearest Infineon Technologies Office.
Infineon Technologies Components may only be
used in life-support devices or systems with the
express written approval of Infineon Technologies,
if a failure of such components can reasonably be
expected to cause the failure of that life-support
device or system, or to affect the safety or
effectiveness of that device or system. Life support
devices or systems are intended to be implanted in
the human body, or to support and/or maintain and
sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or
other persons may be endangered.
Page 17
2004-Mar-08
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