• All types of resistive, inductive and capacitive loads
• µC compatible power switch for 12 V and 24 V DC applications
• Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input,
monolithically integrated in Smart SIPMOS technology.
Providing embedded protective functions.
Page 1
2004-01-27
Block Diagram
IN
ESD
Voltage
source
V
Logic
Logic
Overvoltage
protection
Charge pump
Level shifter
Rectifier
Current
limit
Gate
protection
Limit for
unclamped
ind. loads
Temperature
sensor
+ V
BTS 462 T
bb
OUT
Load
GND
Signal GND
miniPROFET
PinSymbolFunction
1
2
3
4
5
GNDLogic ground
INInput, activates the power switch in case of logic high signal
VbbPositive power supply voltage
NCnot connected
OUTOutput to the load
TABVbbPositive power supply voltage
Pin configuration
Top view
Load GND
Tab = V
BB
1 2 (3) 4 5
GND IN NC OUT
Page 2
2004-01-27
BTS 462 T
)
)
Maximum Ratings at Tj = 25°C, unless otherwise specified
ParameterSymbolValueUnit
Supply voltageV
Supply voltage for full short circuit protection
T
= -40...+150 °C
j
V
Continuous input voltageV
Load current (Short - circuit current, see page 5)I
Current through input pin (DC)I
Operating temperatureT
Storage temperatureT
Power dissipation
1)
Inductive load switch-off energy dissipation
1)2)
P
E
single pulse, (see page 8)
Tj =150 °C, Vbb = 13.5 V, IL = 1 A
Load dump protection2) V
R
=2Ω, t
I
R
= 13.5 Ω
L
=400ms, VIN= low or high, VA=13,5V
d
LoadDump
3)
= VA + V
V
S
bb
bb(SC)
IN
L
IN
j
stg
tot
AS
Loaddump
40V
32
-10 ... +16
self limitedA
± 5
-40 ...+150
-55 ... +150
41.6W
4.4J
75
mA
°C
V
Electrostatic discharge voltage (Human Body Model)
V
ESD
according to ANSI EOS/ESD - S5.1 - 1993
ESD STM5.1 - 1998
Input pin
all other pins
Thermal Characteristics
junction - case:
Thermal resistance @ min. footprintR
Thermal resistance @ 6 cm2 cooling area
1
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain
connection. PCB is vertical without blown air. (see page 16)
2
not subject to production test, specified by design
3
V
Loaddump
Supply voltages higher than V
150Ω resistor in GND connection. A resistor for the protection of the input is integrated.
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 .
require an external current limit for the GND pin, e.g. with a
bb(AZ)
1)
R
R
thJC
th(JA
th(JA
--3K/W
-80-K/W
-4560
kV
± 1
± 5
Page 3
2004-01-27
BTS 462 T
j
)
p)
Electrical Characteristics
Parameter and ConditionsSymbolValuesUnit
at T
= -40...+150°C, V
= 13,5V, unless otherwise specifiedmin.typ.max.
bb
Load Switching Capabilities and Characteristics
On-state resistance
T
= 25 °C, IL = 2 A, Vbb = 9...40 V
j
T
= 150 °C
j
Nominal load current; Device on PCB 1)
T
= 85 °C, VON = 0.5 V
C
Turn-on time to 90% V
R
= 47 Ω
L
Turn-off time to 10% V
R
= 47 Ω
L
Slew rate on 10 to 30% V
R
= 47 Ω
L
Slew rate off 70 to 40% V
R
= 47 Ω
L
OUT
OUT
OUT
OUT
,
,
Operating Parameters
R
ON
I
L(ISO)
t
on
t
off
dV/dt
-dV/dt
on
off
-
-
70
140
100
200
mΩ
3.54.4-A
-90170
µs
-90230
-0.81.7
V/µs
-0.81.7
Operating voltageV
Undervoltage shutdown of charge pump
T
= -40...+85 °C
j
T
= 150 °C
j
Undervoltage restart of charge pumpV
Standby current
T
= -40...+85 °C, VIN = 0 V
j
Tj = 150 °C2) , VIN = 0 V
Leakage output current (included in I
bb(off)
)
bb(on
V
bb(under)
bb(u c
I
bb(off)
I
L(off)
5-34V
-
-
-45.5
-
-
--5
VIN = 0 V
Operating current
I
GND
-0.51.3mA
VIN = 5 V
1
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain
connection. PCB is vertical without blown air. (see page 16)
2
higher current due temperature sensor
-
-
-
-
4
5.5
10
15
µA
Page 4
2004-01-27
BTS 462 T
j
j
j
Electrical Characteristics
Parameter and ConditionsSymbolValuesUnit
at T
= -40...+150°C, V
Protection Functions
= 13,5V, unless otherwise specifiedmin.typ.max.
bb
1)
Initial peak short circuit current limit (pin 3 to 5)
T
= -40 °C, Vbb = 20 V, tm = 150 µs
j
T
= 25 °C
j
T
= 150 °C
j
Repetitive short circuit current limit
I
L(SCp)
I
L(SCr)
Tj = Tjt (see timing diagrams)
Output clamp (inductive load switch off)
at V
= Vbb - V
OUT
ON(CL)
,
V
Ibb = 4 mA
Overvoltage protection 2)
V
Ibb = 4 mA
Thermal overload trip temperatureT
Thermal hysteresis∆T
Reverse Battery
Reverse battery
Drain-source diode voltage (V
3)
> Vbb)-V
OUT
-V
ON(CL)
bb(AZ)
t
t
bb
ON
-
-
7
-
14
-
20
A
-
-
-10-
4147-V
41--
150--°C
-10-K
--32V
-600-mV
1
Integrated protection functions are designed to prevent IC destruction under fault conditions
described in the data sheet. Fault conditions are considered as "outside" normal operating range.
Protection functions are not designed for continuous repetitive operation .
2
see also V
3
Requires a 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source diode has
to be limited by the connected load. Power dissipation is higher compared to normal operating conditions due to the
voltage drop across the drain-source diode. The temperature protection is not active during reverse current operation!
Input current has to be limited (see max. ratings page 3).
in circuit diagram on page 7
ON(CL)
Page 5
2004-01-27
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