Datasheet BSP 76 E6433 INF Datasheet

)
)
A
Smart Low Side Power Switch
HITFET BSP 76
Features
· Logic Level Input
· Input Protection (ESD)
· Thermal shutdown with auto restart
Green product (RoHS compliant)
Product Summary
Drain source voltage
On-state resistance R
Nominal load current I
Clamping energy E
· Overload protection
· Short circuit protection
· Overvoltage protection
· Current limitation
· Analog driving possible
Application
· All kinds of resistive, inductive and capacitive loads in switching or linear applications
· µC compatible power switch for 12 V DC applications
· Replaces electromechanical relays and discrete circuits
General Description
V
DS
DS(on
D(Nom
S
4
42 V
200 mW
1.4 A
150 mJ
3
2
1
VPS05163
N channel vertical power FET in Smart SIPMOSÒ technology. Fully protected by embedded protection functions.
Vbb
M
Drain
Pin 2 and 4 (TAB)
Pin 3
Source
Pin 1
HITFET
In
ESD
â
Gate-Driving
Unit
Overload Protection
Current Limitation
Over­temperature Protection
Overvoltage­Protection
Short circuit Protection
Complete product spectrum and additional information http://www.infineon.com/hitfet
Datasheet 1 Rev. 1.3, 2008-04-14
)
j
g
A
Maximum Ratings at Tj = 25°C, unless otherwise specified
Smart Low Side Power Switch
HITFET BSP 76
Parameter
Drain source voltage V
Supply voltage for full short circuit protection V
Continuous input voltage
Continuous input current
1)
2)
-0.2V £ VIN£ 10V
V
< -0.2V or VIN > 10V
IN
Operating temperature T
Storage temperature T
Power dissipation
5)
TC = 85 °C
Unclamped single pulse inductive energy
Load dump protection V
LoadDump
2)3)
2)
= VA + V
S
VIN = 0 and 10 V, td = 400 ms, RI = 2 W,
= 9 W, VA = 13.5 V
R
L
Electrostatic discharge voltage
2)
(Human Body Model)
according to Jedec norm
EIA/JESD22-A114-B, Section 4
Symbol Value Unit
DS
bb(SC
V
IN
I
IN
42 V
42
-0.22) ... +10
mA
self limited
| I
| £ 2
IN
°C
mJ
P
E
V
V
st
tot
S
LD
ESD
-40 ...+150
-55 ... +150
3.8 W
150
50 V
2 kV
Thermal resistance
junction - ambient:
@ min. footprint
@ 6 cm
2
cooling area
4)
junction-soldering point: R
1
For input voltages beyond these limits I
2
not subject to production test, specified by design
3
V
Loaddump
4
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
connection. PCB mounted vertical without blown air.
5
not subject to production test, calculated by R
Datasheet 2 Rev. 1.3, 2008-04-14
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
has to be limited.
IN
and R
thJA
R
thJA
125
72
thJS
2 (one layer, 70µm thick) copper area for drain
ds(on)
17 K/W
K/W
)
a
Electrical Characteristics
Smart Low Side Power Switch
HITFET BSP 76
Parameter
Symbol Values Unit
at Tj = 25°C, unless otherwise specified min. typ. max.
Characteristics
Drain source clamp voltage
T
= - 40 ...+ 150, ID = 10 mA
j
Off-state drain current
= -40...+85 °C, Vbb = 32 V, VIN = 0 V
T
j
= 150 °C
T
j
Input threshold voltage
= 0.3 mA, Tj= 25 °C
I
D
= 0.3 mA, Tj= 150 °C
I
D
On state input current I
On-state resistance
= 5 V, ID = 1.4 A, Tj = 25 °C
V
IN
= 5 V, ID = 1.4 A, Tj = 150 °C
V
IN
On-state resistance
= 10 V, ID = 1.4 A, Tj = 25 °C
V
IN
= 10 V, ID = 1.4 A, Tj = 150 °C
V
IN
Nominal load current
5)
V
DS(AZ)
I
DSS
V
IN(th)
IN(on
R
DS(on)
R
DS(on)
I
D(Nom)
42 - 55 V
-
-
1.3
0.8
1.5
4
1.7
-
8
10
2.2
-
- 10 30 µA
-
-
-
-
190
350
150
280
240
480
200
400
1.4 1.8 - A
VDS = 0.5 V, Tj < 150°C, VIN = 10 V, TA = 85 °C
Current limit (active if VDS>2.5 V)
1)
I
D(lim)
5 7.5 10
VIN = 10 V, VDS = 12 V, tm = 200 µs
µA
V
mW
1
Device switched on into existing short circuit (see diagram Determination of I
nd a short circuit occurs, these values might be exceeded for max. 50 µs.
5
not subject to production test, calculated by R
Datasheet 3 Rev. 1.3, 2008-04-14
thJA
and R
ds(on)
). If the device is in on condit
D(lim)
j
j
Electrical Characteristics
Smart Low Side Power Switch
HITFET BSP 76
Parameter
Symbol Values Unit
at Tj = 25°C, unless otherwise specified min. typ. max.
Dynamic Characteristics
Turn-on time V
= 4.7 W, VIN = 0 to 10 V, Vbb = 12 V
R
L
to 90% ID:
IN
Turn-off time VIN to 10% ID:
R
= 4.7 W, VIN = 10 to 0 V, Vbb = 12 V
L
Slew rate on 70 to 50% Vbb:
R
= 4.7 W, VIN = 0 to 10 V, Vbb = 12 V
L
Slew rate off 50 to 70% Vbb:
R
= 4.7 W, VIN = 10 to 0 V, Vbb = 12 V
L
Protection Functions
1)
Thermal overload trip temperature T
Thermal hysteresis
Input current protection mode
T
= 150 °C
j
Unclamped single pulse inductive energy
= 1.4 A, Tj = 25 °C, Vbb = 12 V
I
D
2)
2)
t
on
t
off
-dVDS/dt
dVDS/dt
t
DT
t
I
IN(Prot)
E
AS
on
off
- 45 100
- 60 100
- 0.4 1.5
- 0.6 1.5
150 175 - °C
- 10 - K
- 40 300 µA
150 - - mJ
µs
V/µs
Inverse Diode
Inverse diode forward voltage
I
= 7 A, tm = 250 µs, VIN = 0 V,
F
t
= 300 µs
P
1
Integrated protection functions are designed to prevent IC destruction under fault conditions
described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation. 2
not subject to production test, specified by design
Datasheet 4 Rev. 1.3, 2008-04-14
V
SD
- 1 1.5
V
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