Infineon BSM75GD60DLC Data Sheet

Technische Information / Technical Information
IGBT-Module IGBT-Modules
BSM 75 GD 60 DLC
Höchstzulässige Werte / Maximum rated values
Elektrische Eigenschaften / Electrical properties
Kollektor-Emitter-Sperrspannung collector-emitter voltage
Kollektor-Dauergleichstrom DC-collector current
Periodischer Kollektor Spitzenstrom repetitive peak collector current
Gesamt-Verlustleistung total power dissipation
Gate-Emitter-Spitzenspannung gate-emitter peak voltage
Dauergleichstrom DC forward current
Periodischer Spitzenstrom repetitive peak forw. current
Grenzlastintegral der Diode
2
t - value, Diode
I
TC = 70° C I T
= 25 °C I
C
t
= 1 ms, TC = 70°C I
P
=25°C, Transistor P
T
C
= 1 ms I
t
P
VR = 0V, tp = 10ms, TVj = 125°C
V
CES
C,nom.
C
CRM
tot
V
GES
I
F
FRM
2
I
600 V
75 A 95 A
150 A
330 W
+/- 20V V
75 A
150 A
t
1.200
A2s
Isolations-Prüfspannung insulation test voltage
RMS, f = 50 Hz, t = 1 min.
Charakteristische Werte / Characteristic values
Transistor / Transistor
I
= 75A, VGE = 15V, Tvj = 25°C
Kollektor-Emitter Sättigungsspannung collector-emitter saturation voltage
Gate-Schwellenspannung gate threshold voltage
Eingangskapazität input capacitance
Rückwirkungskapazität reverse transfer capacitance
Kollektor-Emitter Reststrom collector-emitter cut-off current
Gate-Emitter Reststrom gate-emitter leakage current
C
IC = 75A, VGE = 15V, Tvj = 125°C
= 1,5 mA, VCE = VGE, Tvj = 25°C V
I
C
f = 1MHz,T
f = 1MHz,T
= 25°C,VCE = 25V, VGE = 0V C
vj
= 25°C,VCE = 25V, VGE = 0V C
vj
VCE = 600V, VGE = 0V, Tvj = 25°C VCE = 600V, VGE = 0V, Tvj = 125°C
= 0V, VGE = 20V, Tvj = 25°C I
V
CE
V
V
CE sat
GE(th)
I
GES
ISOL
min. typ. max.
- 1,95 2,45 V
- 2,20 - V
4,5 5,5 6,5 V
ies
res
CES
- 3,3 - nF
- 0,3 - nF
- 1 500 µA
-1-mA
- - 400 nA
2,5 kV
prepared by: Andreas Vetter date of publication: 2006-01-31
approved by: Michael Hornkamp revision: 3
1 (8)
BSM 75 GD 60 DLC
Technische Information / Technical Information
IGBT-Module IGBT-Modules
BSM 75 GD 60 DLC
Charakteristische Werte / Characteristic values
Transistor / Transistor
I
= 75 A, VCC = 300V
Einschaltverzögerungszeit (ind. Last) turn on delay time (inductive load)
Anstiegszeit (induktive Last) rise time (inductive load)
Abschaltverzögerungszeit (ind. Last) turn off delay time (inductive load)
Fallzeit (induktive Last) fall time (inductive load)
Einschaltverlustenergie pro Puls turn-on energy loss per pulse
Abschaltverlustenergie pro Puls turn-off energy loss per pulse
Kurzschlußverhalten SC Data
Modulinduktivität stray inductance module
C
V
= ±15V, RG = 3,0 , Tvj = 25°C t
GE
VGE = ±15V, RG = 3,0 , Tvj = 125°C I
= 75 A, VCC = 300V
C
V
= ±15V, RG = 3,0 , Tvj = 25°C t
GE
VGE = ±15V, RG = 3,0 , Tvj = 125°C I
= 75 A, VCC = 300V
C
V
= ±15V, RG = 3,0 , Tvj = 25°C t
GE
VGE = ±15V, RG = 3,0 , Tvj = 125°C I
= 75 A, VCC = 300V
C
V
= ±15V, RG = 3,0 , Tvj = 25°C t
GE
VGE = ±15V, RG = 3,0 , Tvj = 125°C I
= 75 A, VCC = 300V, VGE = 15V
C
= 3,0 , Tvj = 125°C, Lσ = 15 nH
R
G
I
= 75 A, VCC = 300V, VGE = 15V
C
= 3,0 , Tvj = 125°C, Lσ = 15 nH
R
G
t
10µsec, VGE 15V
P
125°C, VCC=360V, V
T
Vj
CEmax
= V
CES -LσCE
·di/dt
min. typ. max.
d,on
r
d,off
f
E
on
E
off
I
SC
L
σCE
-63-ns
-65-ns
-22-ns
-25-ns
- 155 - ns
- 170 - ns
-20-ns
-35-ns
mJ
0,7-
-
- 2,4 - mJ
- 340 - A
- 55 - nH
Modul-Leitungswiderstand, Anschlüsse - Chip lead resistance, terminals - chip
= 25°C R
T
c
Charakteristische Werte / Characteristic values
Diode / Diode
I
= 75 A, VGE = 0V, Tvj = 25°C
Durchlaßspannung forward voltage
Rückstromspitze peak reverse recovery current
Sperrverzögerungsladung recovered charge
Abschaltenergie pro Puls reverse recovery energy
F
I
= 75 A, VGE = 0V, Tvj = 125°C
F
I
= 75 A, - diF/dt = 3000 A/µsec
F
= 300V, VGE = -10V, Tvj = 25°C I
V
R
V
= 300V, VGE = -10V, Tvj = 125°C
R
I
= 75 A, - diF/dt = 3000 A/µsec
F
= 300V, VGE = -10V, Tvj = 25°C Q
V
R
VR = 300V, VGE = -10V, Tvj = 125°C I
= 75 A, - diF/dt = 3000 A/µsec
F
= 300V, VGE = -10V, Tvj = 25°C E
V
R
VR = 300V, VGE = -10V, Tvj = 125°C
CC'+EE'
- 4,4 -
min. typ. max.
V
F
RM
r
rec
- 1,25 1,6 V
- 1,20 - V
-95-A
- 115 - A
- 5,1 - µC
- 7,9 - µC
---mJ
- 2,3 - mJ
m
2 (8)
BSM 75 GD 60 DLC
Technische Information / Technical Information
IGBT-Module IGBT-Modules
BSM 75 GD 60 DLC
Thermische Eigenschaften / Thermal properties
Innerer Wärmewiderstand thermal resistance, junction to case
Übergangs-Wärmewiderstand thermal resistance, case to heatsink
Höchstzulässige Sperrschichttemperatur maximum junction temperature
Betriebstemperatur operation temperature
Lagertemperatur storage temperature
Transistor / transistor, DC - - 0,37 K/W Diode/Diode, DC - - 0,73 K/W
pro Modul / per module
λ
= 1 W/m*K / λ
Paste
grease
= 1 W/m*K
min. typ. max.
R
thJC
R
thCK
T
vj
T
op
T
stg
- 0,02 - K/W
- - 150 °C
-40 - 125 °C
-40 - 125 °C
Mechanische Eigenschaften / Mechanical properties
Gehäuse, siehe Anlage case, see appendix
Innere Isolation internal insulation
CTI comperative tracking index
Anzugsdrehmoment f. mech. Befestigung mounting torque
Anzugsdrehmoment f. elektr. Anschlüsse terminal connection torque
Gewicht weight
Schraube M5 screw M5
Al2O
3
225
M1
G 180 g
-15 15 %
4Nm
-Nm
-Nm
Mit dieser technischen Information werden Halbleiterbauelemente spezifiziert, jedoch keine Eigenschaften zugesichert. Sie gilt in Verbindung mit den zugehörigen Technischen Erläuterungen.
This technical information specifies semiconductor devices but promises no characteristics. It is valid in combination with the belonging technical notes.
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BSM 75 GD 60 DLC
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