Silicon Switching Diode
• For high-speed switching applications
• Common cathode configuration
• BAV70S / U: For orientation in reel see
package information below
BAV70...
BAV70
BAV70T
BAV70S
BAV70U
BAV70W
"
!
,
,
#$
, "
, !
,
,
!
Type Package Configuration Marking
BAV70
BAV70S
BAV70T
BAV70U
BAV70W
SOT23
SOT363
SC75
SC74
SOT323
common cathode
double common cathode
common cathode
double common cathode
common cathode
A4s
A4s
A4
A4s
A4s
1
2006-01-17
Maximum Ratings at TA = 25°C, unless otherwise specified
BAV70...
Parameter
Symbol Value Unit
Diode reverse voltage V
Peak reverse voltage V
Forward current I
Non-repetitive peak surge forward current
I
t = 1 µs
t = 1 ms
t = 1 s single
t = 1 s double
Total power dissipation
T
BAV70,
BAV70S,
BAV70T,
BAV70U,
BAV70W,
≤ 33°C
S
T
≤ 85°C
S
T
≤ 73°C
S
T
≤ 90°C
S
T
≤ 103°C
S
P
R
RM
F
FSM
tot
80 V
85
200 mA
A
4.5
1
0.5
0.75
mW
250
250
250
250
250
Junction temperature T
Storage temperature T
Thermal Resistance
Parameter
Junction - soldering point1)
BAV70
BAV70S
BAV70T
BAV70U
BAV70W
1
For calculation of R
please refer to Application Note Thermal Resistance
thJA
j
stg
150 °C
-65 ... 150
Symbol Value Unit
R
thJS
K/W
≤ 460
≤ 260
≤ 310
≤ 240
≤ 190
2
2006-01-17
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol Values Unit
min. typ. max.
DC Characteristics
BAV70...
Breakdown voltage
= 100 µA
I
(BR)
Reverse current
= 70 V
V
R
= 25 V, TA = 150 °C
V
R
= 70 V, TA = 150 °C
V
R
Forward voltage
= 1 mA
I
F
= 10 mA
I
F
= 50 mA
I
F
= 100 mA
I
F
= 150 mA
I
F
AC Characteristics
Diode capacitance
V
= 0 V, f = 1 MHz
R
V
I
V
R
C
(BR)
F
T
85 - - V
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.15
30
50
715
855
1000
1200
1250
µA
mV
- - 1.5 pF
Reverse recovery time
I
= 10 mA, IR = 10 mA, measured at IR = 1mA ,
F
R
= 100 Ω
L
t
rr
- - 4 ns
Test circuit for reverse recovery time
D.U.T.
Ι
F
Oscillograph
EHN00019
Pulse generator: tp = 100ns, D = 0.05, tr = 0.6ns,
R
= 50Ω
i
Oscillograph: R = 50Ω, t
= 0.35ns, C = 0.05pF
r
3
2006-01-17
BAV70...
Reverse current IR = ƒ (TA)
V
= Parameter
R
5
10
nA
4
10
R
I
3
10
2
10
1
10
0 25 50 75 100
70 V
25 V
°C
Forward Voltage VF = ƒ (TA)
I
= Parameter
F
BAV 70 EHB00068
1.0
V
V
F
0.5
150
T
A
Ι
= 100 mA
F
10 mA
1 mA
0.1 mA
0
0 50 100 150
T
˚C
A
Forward current IF = ƒ (VF)
T
= 25°C
A
150
Ι
F
mA
100
50
0
0
0.5 1.0 V 1.5
Forward current IF = ƒ (TS)
BAV70
EHB00066BAV 70
maxtyp
V
F
250
mA
200
175
F
I
150
125
100
75
50
25
0
0 15 30 45 60 75 90 105 120
°C
150
T
S
4
2006-01-17
BAV70...
Forward current IF = ƒ (TS)
BAV70S
250
mA
200
175
F
I
150
125
100
75
50
25
0
0 15 30 45 60 75 90 105 120
°C
TS
150
Forward current IF = ƒ (TS)
BAV70T
250
mA
200
175
F
I
150
125
100
75
50
25
0
0 15 30 45 60 75 90 105 120
°C
T
150
S
Forward current IF = ƒ (TS)
BAV70U
250
mA
200
175
F
I
150
125
100
75
50
25
0
0 15 30 45 60 75 90 105 120
T
°C
Forward current IF = ƒ (TS)
BAV70W
250
mA
200
175
F
I
150
125
100
75
50
25
150
S
0
0 15 30 45 60 75 90 105 120
°C
T
150
S
5
2006-01-17
BAV70...
Permissible Puls Load R
BAV70
3
10
2
10
thJS
R
1
10
0
10
-1
10
-7
-6
-5
10
10
10
10
-4
thJS
D = 0,5
0,2
0,1
0,05
0,02
0,01
0,005
0
-3
10
= ƒ (tp)
-2
10
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAV70
2
10
-
FDC
/I
Fmax
I
1
10
0
s
T
0
10
P
10
10
-7
-6
10
10
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-5
-4
-3
10
10
10
-2
T
0
s
10
P
Permissible Puls Load R
BAV70S
3
10
K/W
2
10
thJS
R
1
10
0
10
-6
10
10
-5
10
-4
10
thJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
-3
= ƒ (tp)
-2
10
s
tP
10
Permissible Pulse Load
I
Fmax
/ I
= ƒ (tp)
FDC
BAV70S
2
10
-
FDC
/I
Fmax
I
1
10
0
0
10
10
-6
10
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-5
10
-4
10
-3
10
-2
s
10
0
tP
6
2006-01-17
BAV70...
Permissible Puls Load R
BAV70U
3
10
K/W
2
10
thJS
R
1
10
0
10
-6
10
10
-5
10
-4
10
thJS
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
-3
= ƒ (tp)
-2
10
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAV70U
2
10
K/W
FDC
/I
Fmax
I
1
10
0
10
s
t
0
10
P
10
-6
10
-5
10
-4
10
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-3
10
-2
s
t
0
10
P
Permissible Puls Load R
BAV70W
3
10
K/W
2
10
thJS
R
1
10
0
10
-6
10
10
-5
10
-4
10
thJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
-3
= ƒ (tp)
-2
10
s
tP
10
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAV70W
2
10
-
FDC
/I
Fmax
I
1
10
0
0
10
10
-6
10
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-5
10
-4
10
-3
10
-2
s
10
0
tP
7
2006-01-17
Package Outline
Foot Print
Pin 1
marking
±0.2
2.9
(2.25)
1.9
Package SC74
B
(0.35)
546
321
+0.1
0.35
-0.05
0.95
0.2
M
0.5
BAV70...
1.1 MAX.
+0.1
0.15
-0.06
±0.1
±0.1
2.5
0.25
6x
B
10˚ MAX.
0.1 MAX.
M
A0.2
±0.1
1.6
10˚ MAX.
A
0.95
Marking Layout (Example)
Small variations in positioning of
Date code, Type code and Manufacture are possible.
Pin 1 marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
For symmetric types no defined Pin 1 orientation in reel.
4
1.9
2.9
Manufacturer
2005, June
Date code (Year/Month)
BCW66H
Type code
0.2
Pin 1
marking
3.15
8
2.7
1.15
8
2006-01-17
Package Outline
Foot Print
Package SC75
±0.2
1.6
+0.1
0.2
-0.05
A
0.2
0.10
+0.1
-0.05
0.5
M
3
1 2
0.5
0.4
0.1 MAX.
±0.2
1.6
MAX.
10˚
0.20MA
0.7
0.15
±0.1
±0.1
±0.1
0.8
MAX.
10˚
BAV70...
Marking Layout
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.65
1.15
0.65
Date code 2005, December
Type code BCR108T
0.4
0.50.5
Example
4
0.45
0.2 MAX.
Pin 1
1.75
1.4
9
8
1.8
0.9
2006-01-17
BAV70...
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC75
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP
02bqBQbqBQbqBQ
03crCRcrCRcrCR
04dsDSdsDSdsDS
05etETet ETe t ET
06fuFUfuFUfuFU
07g vGVg v GVgvGV
08hxHXhxHXhxHX
09 j y J Y j y J Y j y J Y
10kzKZk zKZkzKZ
11l 2L4 l 2L4 l 2L4
12n3N5n3N5n3N5
1)
) CES-Code
1) New Marking Layout for SC75, implemented at October 2005.
.
10
2006-01-17
Package Outline
Foot Print
Package SOT23
±0.1
2.9
12
1)
+0.1
0.4
-0.05
1.9
0.25MBC
1) Lead width can be 0.6 max. in dambar area
B
3
C
0.95
0.8
0.15 MIN.
±0.15
2.4
0.2
±0.1
1
0.1 MAX.
10˚ MAX.
0.08...0.15
0...8˚
M
A
±0.1
1.3
10˚ MAX.
A
BAV70...
Marking Layout
12
Pin 1
s
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.8 1.2
Manufacturer
Date code (Year/Month)
Type code
4
0.9
0.9 0.91.3
EH
Example
0.2
s
2003, July
37
BCW66
Pin 1
3.15
2.13
11
2.65
8
1.15
2006-01-17
Package Outline
Package SOT323
±0.2
2
0.3
+0.1
-0.05
3x
M
0.1
3
0.1 MAX.
0.1
0.9
BAV70...
±0.1
A
Foot Print
Marking Layout
12
0.650.65
0.6
1.6
0.8
0.65
0.65
±0.1
2.1
0.1 MIN.
M
0.2 A
0.15
+0.1
-0.05
±0.1
1.25
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
Pin 1
Manufacturer
Date code (Year/Month)
Type code
4
2.15
2005, June
BCR108W
Example
0.2
8
2.3
1.1
12
2006-01-17
Package Outline
Package SOT363
±0.2
2
0.2
+0.1
-0.05
5 4
6x
M
0.1
0.1 MAX.
0.1
0.9
BAV70...
±0.1
A
Pin 1
marking
1623
Foot Print
Marking Layout (Example)
+0.1
-0.05
±0.1
1.25
±0.1
2.1
0.1 MIN.
M
0.2 A
0.15
0.650.65
0.3
0.70.9
1.6
0.65
0.65
Small variations in positioning of
Date code, Type code and Manufacture are possible.
Pin 1 marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
For symmetric types no defined Pin 1 orientation in reel.
4
Pin 1
marking
2.15
Manufacturer
2005, June
Date code (Year/Month)
BCR108S
Type code
0.2
8
2.3
1.1
13
2006-01-17
BAV70...
Published by Infineon Technologies AG,
81726 München
© Infineon Technologies AG 2006.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be
considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of
non-infringement, regarding circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.Infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon
Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body, or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be endangered.
14
2006-01-17
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