Silicon Schottky Diode
• General-purpose diode for high-speed switching
• Circuit protection
• Voltage clamping
• High-level detecting and mixing
• BAS70-04S: For orientation in reel see
package information below
BAS70... / BAS170W
BAS170W
BAS70-02L
BAS70-04W
BAS70-04SBAS70 BAS70-04
BAS70-02W
"
#$
, "
, !
,
,
!
BAS70-06
BAS70-06W
!
BAS70-07
BAS70-07W
!
,
,
BAS70-07L4
!
,
,
!"
,
,
Type Package Configuration L
BAS170W
BAS70
BAS70-02L
SOD323
SOT23
TSLP-2-1
single
single
single, leadless
BAS70-05
BAS70-05W
,
(nH) Marking
1.8
1.8
0.4
white 7
73s
F
!
,
BAS70-02W
BAS70-04
BAS70-04S
BAS70-04W
BAS70-05
BAS70-05W
BAS70-06
BAS70-06W
BAS70-07
BAS70-07L4
BAS70-07W
SCD80
SOT23
SOT363
SOT323
SOT23
SOT323
SOT23
SOT323
SOT143
TSLP-4-4
SOT343
single
series
dual series
series
common cathode
common cathode
common anode
common anode
parallel pair
parallel pair, leadless
parallel pair
1
0.6
1.8
1.6
1.4
1.8
1.4
1.8
1.4
2
0.4
1.8
73
74s
74s
74s
75s
75s
76s
76s
77s
E
77s
2006-01-19
Maximum Ratings at TA = 25°C, unless otherwise specified
BAS70... / BAS170W
Parameter
Symbol Value Unit
Diode reverse voltage V
Forward current I
Non-repetitive peak surge forward current
I
t ≤ 10ms
Total power dissipation
BAS70, BAS70-07, T
BAS70-02L, BAS70-07L4, T
BAS70-02W, T
≤ 107 °C
S
BAS70-04, BAS70-06, T
≤ 72 °C
S
≤ 48 °C
S
≤ 117 °C
S
BAS70-04S/W/-06W, BAS170W, T
BAS70-05, T
BAS70-05W, T
BAS70-07W, T
≤ 22 °C
S
≤ 90 °C
S
≤ 114 °C
S
≤ 97 °C
S
P
Junction temperature T
R
F
FSM
tot
j
70 V
70 mA
100
mW
250
250
250
250
250
250
250
250
150 °C
Operating temperature range T
Storage temperature T
Thermal Resistance
Parameter
Junction - soldering point1)
BAS70, BAS70-07
BAS70-02L, BAS70-07L4
BAS70-02W
BAS70-04, BAS70-06
BAS70-04S/W, BAS70-06W
BAS70-05
BAS70-05W
BAS70-07W
BAS170W
1
For calculation of R
please refer to Application Note Thermal Resistance
thJA
op
stg
-55 ... 125
-55 ... 150
Symbol Value Unit
R
thJS
K/W
≤ 310
≤ 130
≤ 170
≤ 410
≤ 210
≤ 510
≤ 240
≤ 145
≤ 190
2
2006-01-19
BAS70... / BAS170W
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
DC Characteristics
Breakdown voltage
I
= 10 µA
(BR)
Reverse current
V
= 50 V
R
Forward voltage
I
= 1 mA
F
I
= 10 mA
F
I
= 15 mA
F
Forward voltage matching1)
I
= 10 mA
F
AC Characteristics
Diode capacitance
V
= 0 , f = 1 MHz
R
Symbol Values Unit
min. typ. max.
V
I
R
V
∆ V
C
(BR)
F
F
T
70 - - V
- - 0.1
300
600
720
375
705
880
410
750
1000
- - 20
- 1.5 2 pF
µA
mV
Forward resistance
= 10 mA, f = 10 kHz
I
F
Charge carrier life time
I
= 25 mA
F
1
∆V
is the difference between lowest and highest VF in a multiple diode component.
F
r
τ
f
rr
- 34 -
Ω
- - 100 ps
3
2006-01-19
BAS70... / BAS170W
Diode capacitance CT = ƒ (VR)
f = 1MHz
BAS 70W/BAS 170W
2.0
pF
C
T
1.5
1.0
0.5
0.0
0
20 40 60 V 80
EHB00044
V
R
Forward resistance rf = ƒ (IF)
f = 10 kHz
BAS 70W/BAS 170W
3
10
Ω
r
f
2
10
1
10
0
10
0.1
1
EHB00045
10 mA
Ι
100
F
Reverse current IR = ƒ(VR)
= Parameter
T
A
BAS 70W/BAS 170W
2
10
µ
A
Ι
R
1
10
0
10
-1
10
-2
10
-3
10
0
20 40 60 V 80
T
A
EHB00043
= 150 C
85 C
25 C
V
R
Forward current IF = ƒ (VF)
= Parameter
T
A
2
10
mA
Ι
F
1
10
0
10
-1
10
-2
10
0.0
0.5 1.0 V 1.5
TA= -40 C
25 C
85 C
150 C
EHB00042BAS 70W/BAS 170W
V
F
4
2006-01-19
BAS70... / BAS170W
Forward current IF = ƒ (TS)
BAS70, BAS70-07
80
mA
60
F
50
I
40
30
20
10
0
0 15 30 45 60 75 90 105 120
°C
T
Forward current IF = ƒ (TS)
BAS70-02L, BAS70-07L4
80
mA
60
F
50
I
40
30
20
10
150
S
0
0 15 30 45 60 75 90 105 120
°C
150
T
S
Forward current IF = ƒ (TS)
BAS70-02W
80
mA
60
50
F
I
40
30
20
10
0
0 15 30 45 60 75 90 105 120
°C
T
Forward current IF = ƒ (TS)
BAS70-04, BAS70-06
80
mA
60
50
F
I
40
30
20
10
150
S
0
0 15 30 45 60 75 90 105 120
°C
150
T
S
5
2006-01-19
BAS70... / BAS170W
Forward current IF = ƒ (TS)
BAS70-04S/W, BAS70-06W, BAS170W
80
mA
60
F
50
I
40
30
20
10
0
0 15 30 45 60 75 90 105 120
°C
T
S
150
Forward current IF = ƒ (TS)
BAS70-05
80
mA
60
F
50
I
40
30
20
10
0
0 15 30 45 60 75 90 105 120
°C
150
T
S
Forward current IF = ƒ (TS)
BAS70-05W
80
mA
60
50
F
I
40
30
20
10
0
0 15 30 45 60 75 90 105 120
°C
T
Forward current IF = ƒ (TS)
BAS70-07W
80
mA
60
50
F
I
40
30
20
10
150
S
0
0 15 30 45 60 75 90 105 120
T
°C
150
S
6
2006-01-19
BAS70... / BAS170W
Forward current IF = ƒ (TS)
BAS170W
80
mA
60
F
50
I
40
30
20
10
0
0 15 30 45 60 75 90 105 120
°C
T
Permissible Puls Load R
thJS
= ƒ (tp)
BAS70
3
10
K/W
2
10
thJS
R
0.5
0.2
0.1
0.05
10
-4
0.02
0.01
0.005
D = 0
10
-3
10
-2
s
t
0
10
p
1
10
0
10
150
10
-6
10
-5
S
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAS70
2
10
-
FDC
/I
Fmax
I
10
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-4
10
10
10
1
0
10
-6
10
-5
Permissible Puls Load R
thJS
= ƒ (tp)
BAS70-02L, BAS70-07L4
3
10
K/W
2
10
thJS
R
0.5
10
-4
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
10
-3
10
-2
s
t
0
10
p
1
10
0
-3
10
-2
s
t
0
10
p
10
10
-6
10
-5
7
2006-01-19
BAS70... / BAS170W
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAS70-02L, BAS70-07L4
1
10
FDC
/I
10
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-4
10
Fmax
I
10
-
0
10
-6
10
-5
Permissible Puls Load R
thJS
= ƒ (tp)
BAS70-02W
3
10
K/W
2
10
thJS
R
D=0.5
0.2
0.1
0.05
1
10
0
-3
10
-2
s
t
0
10
p
10
10
-6
10
-5
10
0.02
0.01
0.005
0
-4
10
-3
10
-2
s
t
0
10
p
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAS70-02W
1
10
FDC
/I
Fmax
I
0
10
10
-6
10
-5
10
-4
10
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-3
10
Permissible Puls Load R
thJS
= ƒ (tp)
BAS70-04, BAS70-06
3
10
K/W
2
10
thJS
R
0.5
0.2
10
0.1
0.05
0.02
0.01
0.005
D = 0
-4
10
-3
10
-2
s
t
0
10
P
1
10
0
-2
s
t
0
10
p
10
10
-6
10
-5
8
2006-01-19
BAS70... / BAS170W
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAS70-04, BAS70-06
2
10
-
FDC
/I
Fmax
I
10
10
1
0
10
-6
10
-5
10
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-4
10
Permissible Puls Load R
thJS
= ƒ (tp)
BAS70-04S
3
10
K/W
2
10
thJS
R
0.5
1
10
0
-3
10
-2
s
t
0
10
P
10
10
-6
10
-5
10
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
-4
10
-3
10
-2
s
t
0
10
p
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAS70-04S
2
10
-
FDC
/I
Fmax
I
1
10
0
10
10
-6
10
-5
10
-4
10
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-3
10
Permissible Puls Load R
thJS
= ƒ (tp)
BAS70-04W, BAS70-06W
3
10
K/W
2
10
thJS
R
0.5
10
-4
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
10
-3
10
-2
s
t
0
10
p
1
10
0
-2
s
t
0
10
p
10
10
-6
10
-5
9
2006-01-19
BAS70... / BAS170W
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAS70-04W, BAS70-06W
1
10
FDC
/I
Fmax
I
10
-
0
10
-6
10
-5
10
-4
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10
Permissible Puls Load R
thJS
= ƒ (tp)
BAS70-05
3
10
K/W
2
10
thJS
R
0.5
0.2
0.1
10
-4
0.05
0.02
0.01
0.005
D = 0
10
-3
10
-2
s
t
0
10
p
1
10
0
-3
10
-2
s
t
0
10
p
10
10
-6
10
-5
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAS70-05
2
10
-
FDC
/I
10
-4
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10
Fmax
I
10
10
1
0
10
-6
10
-5
Permissible Puls Load R
thJS
= ƒ (tp)
BAS70-05W
3
10
K/W
2
10
thJS
R
0.5
0.2
0.1
0.05
10
-4
0.02
0.01
0.005
D = 0
10
-3
10
-2
s
t
0
10
p
1
10
0
-3
10
-2
s
t
0
10
p
10
10
-6
10
-5
10
2006-01-19
BAS70... / BAS170W
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAS70-05W
1
10
10
-4
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10
FDC
/I
Fmax
I
10
-
0
10
-6
10
-5
Permissible Puls Load R
thJS
= ƒ (tp)
BAS70-07W
3
10
K/W
2
10
thJS
R
0.5
0.2
10
0.1
0.05
0.02
0.01
0.005
D = 0
-4
10
-3
10
-2
s
t
0
10
p
1
10
0
-3
10
-2
s
t
0
10
p
10
10
-6
10
-5
Permissible Pulse Load
I
Fmax
/ I
FDC
= ƒ (tp)
BAS70-07W
2
10
-
FDC
/I
Fmax
I
10
10
1
0
10
-6
10
-5
10
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-4
10
Permissible Puls Load R
thJS
= ƒ (tp)
BAS170W
3
10
2
10
thJS
R
0.5
0.2
1
10
0
-3
10
-2
s
t
0
10
p
10
10
-7
-6
10
-5
10
10
0.1
0.05
0.02
0.01
0.005
D = 0
-4
-3
10
10
-2
t
0
s
10
p
11
2006-01-19
Permissible Pulse Load
BAS70... / BAS170W
/ I
I
Fmax
FDC
BAS170W
1
10
FDC
/I
Fmax
I
0
10
-6
10
= ƒ (tp)
-5
10
10
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-4
10
-3
10
-2
s
t
0
10
p
12
2006-01-19
Package Outline
Foot Print
Cathode
marking
Package SCD80
0.2MA
±0.1
0.8
2
MAX.
˚
±0.1
10
1.7
1
±0.05
0.3
0.7
0.13
±0.1
+0.05
-0.03
˚
±1.5
˚
7
BAS70... / BAS170W
A
±0.1
1.3
±0.05
0.2
1.45
Marking Layout
Date code
Type code
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
0.35
0.35
2003, July
BAR63-02W
Cathode marking
Example
Cathode
marking
Standard Reel with 2 mm Pitch
4
1.45
8
2.5
0.4
0.9
Cathode
marking
2
13
0.2
0.7
2006-01-19
BAS70... / BAS170W
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC75
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP
02bqBQbqBQbqBQ
03crCRcrCRcrCR
04dsDSd sDSd sDS
05et ETe t ETet ET
06fuFUfuFUfuFU
07g v GVg v GVg vGV
08hxHXhxHXhxHX
09 j y J Y j y J Y j y J Y
10kzKZkzKZkzKZ
11l 2L4 l 2L4 l 2L4
12n3N5n3N5n3N5
1)
) CES-Code
1) New Marking Layout for SC75, implemented at October 2005.
.
14
2006-01-19
Package Outline
Foot Print
Package SOD323
+0.2
1.25
-0.1
2
1
0.3
+0.1
-0.05
M
A
Cathode
marking
±0.2
2.5
0.25
0
±0.05
±0.15
0.45
0.9
+0.2
-0.1
0.15
BAS70... / BAS170W
A
+0.2
-0.1
1.7
+0.05
0.3
-0.2
+0.1
-0.06
Marking Layout
Standard Packing
Type code
Laser marking
0.80.8
1.7
0.6
BAR63-03W
Cathode marking
Example
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
Cathode
marking
4
8
2
2.9
0.65
0.2
1
1.35
15
2006-01-19
Package Outline
Foot Print
Package SOT143
±0.1
0.8
0.2
+0.1
-0.05
2.9
1.9
12
1.7
34
0.4
0.8 0.81.2
B
+0.1
-0.05
0.25MB
0.15 MIN.
±0.15
2.4
0.2
BAS70... / BAS170W
±0.1
1
0.1 MAX.
±0.1
1.3
10˚ MAX.
0.08...0.15
0...8˚
M
A
10˚ MAX.
A
Marking Layout
12
Pin 1
s
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.2
0.8
Manufacturer
Date code (Year/Month)
Type code
4
0.8
0.9 1.1 0.9
RFs
Example
0.2
2005, June
56
BFP181
Pin 1
3.15
16
8
2.6
1.15
2006-01-19
Package Outline
Foot Print
Package SOT23
±0.1
2.9
12
1)
+0.1
0.4
-0.05
1.9
0.25MBC
1) Lead width can be 0.6 max. in dambar area
B
3
C
0.95
0.8
0.15 MIN.
±0.15
2.4
0.2
±0.1
1
0.1 MAX.
10˚ MAX.
0.08...0.15
0...8˚
M
A
BAS70... / BAS170W
±0.1
1.3
10˚ MAX.
A
Marking Layout
12
Pin 1
s
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.8 1.2
Manufacturer
Date code (Year/Month)
Type code
4
0.9
0.9 0.91.3
EH
Example
0.2
s
2003, July
37
BCW66
Pin 1
3.15
2.13
17
2.65
8
1.15
2006-01-19
Package Outline
Package SOT323
±0.2
2
0.3
+0.1
-0.05
3x
M
0.1
3
0.1 MAX.
0.1
0.9
BAS70... / BAS170W
±0.1
A
Foot Print
Marking Layout
12
0.650.65
0.6
1.6
0.8
0.65
0.65
±0.1
2.1
0.1 MIN.
M
0.2 A
0.15
+0.1
-0.05
±0.1
1.25
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
Pin 1
Manufacturer
Date code (Year/Month)
Type code
4
2.15
2005, June
BCR108W
Example
0.2
8
2.3
1.1
18
2006-01-19
Package SOT343
BAS70... / BAS170W
Package Outline
Foot Print
0.3
±0.1
0.1
0.1 MIN.
M
0.2
0.9
A
±0.1
1.25
+0.1
0.15
-0.05
A
±0.2
2
1.3
34
0.15
12
+0.1
-0.05
4x
M
0.1
0.8
0.6
0.6
+0.1
-0.05
0.1 MAX.
±0.1
2.1
1.6
Marking Layout
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.15
0.9
Manufacturer
Date code (Year/Month)
Type code
4
2005, June
BGA420
Example
0.2
Pin 1
2.15
2.3
8
19
1.1
2006-01-19
Package Outline
Package SOT363
±0.2
2
0.2
+0.1
-0.05
5 4
6x
M
0.1
0.1 MAX.
0.1
0.9
BAS70... / BAS170W
±0.1
A
Pin 1
marking
1623
Foot Print
Marking Layout (Example)
+0.1
-0.05
±0.1
1.25
±0.1
2.1
0.1 MIN.
M
0.2 A
0.15
0.650.65
0.3
0.70.9
1.6
0.65
0.65
Small variations in positioning of
Date code, Type code and Manufacture are possible.
Pin 1 marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
For symmetric types no defined Pin 1 orientation in reel.
4
Pin 1
marking
2.15
Manufacturer
2005, June
Date code (Year/Month)
BCR108S
Type code
0.2
8
2.3
1.1
20
2006-01-19
Package Outline
Package TSLP-2-1
BAS70... / BAS170W
Top view Bottom view
0.05 MAX.
2
1
Cathode
marking
1) Dimension applies to plated terminal
0.4
+0.1
0.5
±0.05
0.65
±0.035
±0.05
0.6
2
1
1)
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.6
1
Copper Solder mask Stencil apertures
0.35
0.3
0.35
0.45
0.275
0.925
0.375
0.275
1)
±0.035
0.25
±0.05
1
Marking Layout
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Cathode
marking
Type code
Laser marking
0.76
BAS16-02L
Cathode marking
Example
4
1.16
8
0.5
21
2006-01-19
Package TSLP-4-4
Package Outline
Bottom viewTop view
+0.01
0.4
1)
±0.035
4x
0.05 MAX.
3
4
2
1
Pin 1 marking
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.8
0.25
0.45
±0.05
0.75
±0.05
0.78
2
1
BAS70... / BAS170W
1)
±0.05
0.8
3
4
±0.035
4x0.35
±0.05
1.2
Marking Layout
Standard Packing
1.2
0.3
0.3
0.2
Copper Solder mask
Type code
Laser marking
0.4
0.4
0.4
1.18
0.28
0.22
Stencil apertures
Example
0.38
0.42
0.38
0.28
BAR90-07L4
Pin 1 marking
Reel ø180 mm = 15.000 Pieces/Reel
Pin 1
marking
4
1.05
1.45
22
0.5
8
2006-01-19
BAS70... / BAS170W
Published by Infineon Technologies AG,
81726 München
© Infineon Technologies AG 2006.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be
considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of
non-infringement, regarding circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.Infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon
Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body, or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be endangered.
23
2006-01-19
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