Infineon Automotiv Division Call User Manual

Automotive Division Call
hosted by Liberum
Peter Schiefer, Division President Automotive (ATV) 5 October 2020
Market position and
short- and mid-term outlook
Infineon’s automotive semiconductor revenue (in USD for CY; based on market figures by Strategy Analytics)
740
1818
1307
2270
2890
4210
4987
2000 2002 2004 2006 2008 2010 2012 2014 2016 2018
0
1000
2000
3000
4000
5000
6000
revenue
Infineon International Rectifier Cypress
[USD m]
Source: Strategy Analytics: Automotive Semiconductor Vendor Market Shares. 2001 through 2020
CAGR
(00-18)
: +10.1%
4157
830
#2
#1
13.4%
7.9% − 11.2%
#3
6.7%
market position
market share
3
2020-10-05 Copyright © Infineon Technologies AG 2020. All rights reserved.
Infineon’s top market position is built on system competence based on an industry-leading product portfolio
New #1 in the total market post acquisition of CypressSolid #1 in power despite xEV subsidies cut in China in H2 CY19
Undisputed #1 in automotive NOR Flash memory
Fostering #2 in sensors (from 10.4%
CY12
to 13.5%
CY19
)
Significant market share gain in microcontroller – both organically
(strong demand for AURIX™) and via Cypress acquisition
13.4%
11.3%
8.7%
8.1%
7.6%
Infineon
NXP
Renesas
TI
STMicro
Automotive semiconductors (2019 total market: $37.2bn)
6.7%
7.0%
8.0%
13.5%
14.1%
Melexis
NXP
ON Semi
Infineon
Bosch
Sensors
Source: Strategy Analytics: Automotive Semiconductor Vendor Market Shares v2. May 2020. The market shares shown here are the combined market shares of Infineon and Cypress based on their individual figures.
6.6%
9.8%
27.0%
27.2%
Microchip
TI
Infineon
Renesas
NXP
16.2%
Microcontrollers
Power semiconductors
5.4%
8.2%
9.1%
13.9%
25.5%
ON Semi
TI
Bosch
STMicro
Infineon
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2020-10-05 Copyright © Infineon Technologies AG 2020. All rights reserved.
Market recovery expected to continue across all regions; high demand for xEV in Europe; L1/L2/L2+ penetration on schedule
Market Outlook for Q4 CY20 Market Outlook for CY21
Car units
xEV
ADAS/AD
Continued recovery of car sales and production Y-Y recovery with unit growth at mid-teens %
Strong momentum in Europe Some recovery in the US and China
No major change in OEMs’ plans in near-term L2 growth to continue
Further increase in L2 penetration expected L2+ shipments at low volumes
Incentives and CO2regulations should keep
demand high; especially in Europe
Improving consumer sentiment around
sustainability theme
Steady investments in EV charging infra-structure
further lowering reservation towards EVs
Source: Infineon; based on or includes content supplied by IHS Markit, Automotive Group: Light Vehicle Production Forecast. September 2020.
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After nearly 20% y-y decline globally in CY20 due to COVID-19, all regions are forecast to snap back in CY21
Light vehicle production (year-over-year growth)
North America (16.3m units in 2019) Europe (21.1m units in 2019)
Greater China (24.7m units in 2019)
2019 2020 2021 2021-2025
RoW (13.7m units in 2019)
World (88.9m units in 2019)
Japan / Korea (13.1m units in 2019)
2019 2020 2021 2021-2025 2019 2020 2021 2021-2025
2019 2020 2021 2021-2025
2019 2020 2021 2021-2025
2019 2020 2021 2021-2025
Source: Based on or includes content supplied by IHS Markit, Automotive Group: Light Vehicle Production Forecast. September 2020.
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-3.8%
-20.9%
17.6%
1.8% p.a.
-3.8%
-24.1%
16.7%
2.5% p.a.
-8.1%
-9.1%
6.3%
4.7% p.a.
-0.7%
-17.1%
7.2%
1.5% p.a.
-9.6%
-31.2%
24.5%
8.1% p.a.
-5.6%
-19.4%
13.2%
3.8% p.a.
Electro-mobility
Trends toward electrification of cars remain unchanged; driven by more stringent legal guidelines
Passenger car CO2emission development and regional regulations CO2emission by degree of electrification
120
102
84
28
0 0
ICE 48 V
MHEV
FHEV PHEV BEV FCEV
CO
2
emission (g/km
)
-15%
-30% -77%
-100% -100%
EU continues towards stringent emission
standards
Recently, the governor of California signed an
executive order mandating that all new cars to be sold in California from 2035 must be zero-emission vehicles
Source: The International Council on Clean Transportation (ICCT): Passenger vehicle fuel economy. May 2020.
0
50
100
150
200
2010 2015 2020 2025 2030
US Japan China EU
enacted target
historical performance
-15% vs 2021
-37.5% vs 2021
US (2026): 108g/km
Japan (2030):
73.5g/km
EU (2030): 59g/km
China (2025): 93.4g/km
CO
2
emission values (g/km; normalized to NEDC
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CO2emission: Tank-to-wheel
The longer-term trend towards xEV is unchanged; most likely even accelerating due to incentive programs and green deals
Car production by fuel type
0%
25%
50%
75%
100%
2016 2018 2020 2022 2024 2026 2028 2030 2032
ICE Mild Hybrids Full & Plug-in Hybrids and BEVs Fuel Cell
Source: Based on or includes content supplied by IHS Markit, Automotive Group: Alternative propulsion forecast. July 2020.
xEV penetration: >25% by 2023
xEV penetration: >50% by 2027
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The incremental content of power semiconductors in xEV is a significant opportunity for Infineon
2020 average xEV semiconductor content by degree of electrification
48 V / Mild Hybrids Full & Plug-in Hybrids and Battery Electric Vehicles
* Non-Powertrain: average semiconductor content in body, chassis, safety and infotainment application segments ** "power" includes voltage regulators and ASIC; "others" include opto, small signal discretes, memory
Source: Infineon; based on or includes content supplied by IHS Markit, Automotive Group: Alternative Propulsion Forecast. July 2020;
Strategy Analytics: Automotive Semiconductor Demand Forecast 2018-2027 and Automotive Sensor Demand 2018-2027. July 2020
$7
$0
$396
$61
$17
$90
$572
Non-
Power-
train*
ICE
Power-
train
xEV
Sensors
xEV
MCUs
xEV
Power**
xEV
Others**
Total semi
BoM
$396
$38
$14
$23
$330
$32
$834
Non-
Power-
train*
ICE
Power-
train
xEV
Sensors
xEV
MCUs
xEV
Power**
xEV
Others**
Total semi
BoM
2020 2.1m vehicles 5.8m vehicles
2022 5.8m vehicles 12.2m vehicles
2025 18.8m vehicles 21.0m vehicles
2030 27.3m vehicles 32.0m vehicles
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Infineon offers full system solutions addressing all xEV segments: pure EV and all types of hybrid EVs
Infineon offers full portfolio for the control loop of an electric car
SiC and IGBT
for high-voltage battery
electric vehicles, plug-in
and full hybrids
MOSFETs
for 48 V mild hybrids
bare-die
discretes
modules
bare-die
discretes
chip embedding
Power semisDriversMicrocontrollersSensors
AURIX
driver ICs
high-voltage
EiceDRIVER
Power supply and communication
OPTIREG™
board network transceivers
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current sensor
...and more
rotor position sensor
Key package innovations complement Infineon’s leading position in
chip technologies for 48 V systems
Key package innovations driving growth for the xEV business
Technology
Customer benefits
Success
Chip embedding technology
(jointly with Schweizer Electronic):
Infineon MOSFET integrated within the PCB
top side cooling pad
top-side view bottom-side view transparent view
MOSFET soldered traditionally on the PCB
but more efficient cooling from the top
Top-side cooling package Power chip embedding
Significantly improved thermal management
Increase of power density, energy efficiency and
reliability: up to 60% performance improvement
compared to traditionally designed system
Major European tier-1 awarded Infineon with
a triple-digit million Euro design-win
Vitesco first player to adopt the technology
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Besides main inverter and on-board charger, battery management is a good example for Infineon’s system solution competence
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2020-10-05
Infineon offers basically all components of a complete battery management system (BMS)
b a t t e r y c e l l
IC #1
IC #2 IC #3
IC #4
IC #5
IC #6 IC #7
IC #8
MCU
current
sensor
pressure
sensor
gas
sensor
PMIC
CAN
transceiver
CAN bus
auxiliaries
security IC
motor control IC
pump fan etc.
MOSFET
multi-channel battery monitoring and balancing system ICs
covering cell charge balancing, cell voltage and temperature measurement
wireless controll ICs PMIC CAN transceivers for robust communication between cells
and battery main controller
MCU with scalable processing performance, connectivity and
embedded hardware security
F-RAM for data logging and mission profile high-voltage power MOSFET replacing relay and pyro fuse low-power pressure sensors
gas sensor (H2or HCO3)
current sensor; type depending on cell topology trusted security solutions to support battery identification,
functional safety and IP protection
embedded motor control ICs for various motor types standard power MOSFETs
total BoM for 48 V BMS: $30 – $70 total BoM for high-voltage BMS: $50 – $160
8x..12x
1x..2x
1x..2x
1x
1x..3x
8x
1x
1x..3x
1x
1x..4x
wireless
connection
F-RAM
power switch
wireless
connection
wireless
connection
wireless
connection
wireless
connection
wireless
connection
wireless
connection
wireless
connection
8x..12x
1x
1x
available today pre market intro-
duction phase
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14
To meet best cost-performance ratio in xEV drivetrain, IGBT and SiC technologies will co-exist
2020-10-05
Selected examples of IGBT versus SiC
Technology and market development
Example: All-wheel drive BEV
Axle 2Axle 1
Focus on
Range: SiC
Cost
Large battery: SiC Small battery: IGBT
Focus on cost only: IGBT
Example: Axle split PHEV
Axle 2Axle 1
Focus on range: Internal
Combustion Engine
Focus on cost only: IGBT
Choice of power semiconductor technology in main inverter
More and more OEMs are considering SiC as an
alternative to IGBTs
OEMs’ choice of main inverter technology depends on
the choice of
range versus cost, andsize/cost of the battery
Market development
Higher-volume platforms to be launched in ~2025 are
being awarded over the next quarters
To address range anxiety, OEMs shift focus to sufficient
reach (for mid- to high-end cars preferably)
To improve their CO2footprint online retailers need to
operate fully electrified delivery vehicles
Source: Infineon
When OEMs will introduce SiC-based car models to increase their fleet offering, Infineon can leverage its huge IGBT customer base
Infineon offers a seamless and cost-effective upgrade path across the entire power range
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Scalability: Same package for
all power ranges
Same driver ICs for all power ranges
> 200 kW
SiC MOSFET-based
CoolSiC™ HybridPACK™
100 – 150 kW
Si IGBT-based
HybridPACK™
150 – 200 kW
Si IGBT-based
HybridPACK™
EiceDRIVER™ family
IGBT
SiC
higher-power IGBT
Infineon has an excellent position to win upcoming SiC-based xEV platforms
Infineon’s leverage in SiC
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Infineon is addressing the xEV market with its growing portfolio of SiC-based components
optimized for automotive applications
Infineon’s large IGBT customer base is an essential asset for the transition to SiC
Scalable portfolio of Infineon allows for easy and seamless upgrade from IGBT-based
inverters to SiC-based inverters
Existing customers can beef-up their platform performance while sticking to the same
module form factor
Leverage of
customer
base
Technology
leverage
Scalability
Automated Driving
The growth of L1/L2/L2+ is the main driver of ADAS semi content until 2030; low near-term impact from L3/L4/L5
Source: Strategy Analytics: Metrix Live. December 2019; L2 includes L2 and L2+
89%
52%
26%
13%
5%
11%
40%
46%
28%
16%
7%
27%
53%
59%
4%
10%
11%
0%
25%
50%
75%
100%
2015 2020 2025 2030 2035
Level 0 Level 1 Level 2 Level 3 Level 4 Level 5
Car production by degree of automation
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2020-10-05 Copyright © Infineon Technologies AG 2020. All rights reserved.
73%
81%
47%
Radar/Lidar modules and sensor fusion will grab the lion’s share of
semiconductor BoM in ADAS/AD-equipped cars
Incremental average semiconductor content per car by level of automation at the given years
$160 - $180
Level 4/L5
L4/L5 vehicles in 2030: ~2.5m
Level 2
L2 vehicles in 2020: ~5m
Level 2+
L2+ in 2025: ~2.5m
$280 - $350 $1,150 - $1,250
Bill-of-materials
Camera modules
Radar & Lidar modules
Sensor fusion
Others (e.g. actuators)
40 - 50% of BoM
~30%
20 - 30%
5 - 10%
40 - 50% of BoM
~30%
20 - 30%
5 - 10%
15 - 20% of BoM
30 - 45%
30 - 45%
5 - 10%
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Source: Strategy Analytics: Automated Driving Semiconductor Market Estimate. August 2020; Infineon BoM contains all type of semiconductors (e.g. radar modules include µC); sensor fusion does not include memory. BoM are projected figures for the respective time frame.
Copyright © Infineon Technologies AG 2020. All rights reserved.
20
Infineon will roughly double its BoM content in upcoming high­volume radar systems by offering an optimized system portfolio
2020-10-05
Infineon’s increasing offering in 77 GHz radar system solutions
Current UpcomingPast
53.3%
24.6%
8.3%
7.7%
3.1%
Infineon
NXP
STMicro
UMS
Denso
Source: Yole Developpement: Status of the Radar Industry. May 2020.
2019 automotive radar sensor IC market (77 / 24 GHz)
Dedicated AURIX™
microcontrollers with
hardware-coded radar
signal preprocessing will
roughly double Infineon’s
semiconductor content
System-level offering combining
radar sensor ICs, micro­controllers and power supply
Major advantages for
customers:
- interoperability
- shorter development time
- faster time-to-market
Radar sensor
(SiGe)
Radar sensor
(SiGe)
Radar sensor
(28nm CMOS,
SiGe)
AURIX™ 2G
(2ndgen)
Microcontroller
AURIX™ 3G
(3rdgen)
Microcontroller
Power supply
Higher levels of automated driving require trust via solutions that one can depend on
…requires dependable systems
Dependable
Sensing
Dependable
Computing
Secure
Communication
Dependable
Actuation
Dependable
Memory
+ + + +
= Infineon’s field of competence
Dependable
Power Supply
+
Increasing degree of automation…
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driver’s task machine’s task
Level 0
No System
Eyes-off
Level 3
Brains-off
Level 4
No Driver
Level 5
Hands-off
Level 2
Feet-off
Level 1
“Fail safe” “Fail operational”
The need for dependable systems per degree of automation
Copyright © Infineon Technologies AG 2020. All rights reserved.
22
The need for dependability will drive demand for semiconductors; example: intelligent power switches
2020-10-05
Example: Power distribution architecture in a car by degree of automation
Number of intelligent power switches
Level 2Level 2 Level 3 Level 4/5
Sophisticated “dependability” conceptRedundancy for critical loadsDedicated protected
branches for critical loads
Today’s
reference architecture
Level 2+
1x 1.3x 2x >3x
Source: Infineon
Infineon’s NOR Flash business is another beneficiary of the need for dependability
increasing system complexity drives demand for higher off-chip code storage
growing number of applications based on high-performance processing units:
code and parameter storage for MCUs, GPUs, MPUs, and other SoCsconfiguration data for FPGAs
Infineon’s unique offering: Semper™ Secure NOR Flash
Infineon Semper™ Secure NOR Flash is the first memory solution to
combine security and functional safety in a single NOR Flash device
Infineon Semper™ Secure NOR Flash delivers the security, safety, and
reliability required for the most advanced connected automotive systems
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Automotive applications of NOR Flash
ADAS/ADinstrument clustersnavigation systemsSoftware-over-the-air (SOTA) updates
Structural growth drivers for NOR Flash in general
The Infineon AURIX™ µC family has become the first-choice auto­motive architecture for high-growth and safety-critical applications
FY10 FY20e FY25e
powertrain
ICE engine management ICE transmission
xEV motor control
classical safety
power steering braking
airbag
ADAS/AD
camera host control
sensor fusion host control
radar signal pre-processing
domain and zone control
drive domain body & convenience domain
zone control
CAGR
(FY10-FY25)
= 11.5%
CAGR
(FY20-FY25)
= 50%
CAGR
(FY20-FY25)
= 34%
[indexed: FY10 = 100]
CAGR
(FY10-FY25)
= 5.7%
TAM:
€1.6bn
TAM:
€4.8bn
Source: Infineon; Strategy Analytics: Automotive Semiconductor Demand Forecast. February 2020. Covering Infineon target markets; excl. body, comfort, infotainment.
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Infineon AURIX™ revenue development over time
Strong microcontroller footprint in next-generation high-volume platforms
14 MCUs (+ NOR Flash + Wi-Fi)
start of production: end of CY20
20 MCUs
start of production: CY22
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OEM platform #2:OEM platform #1:
Engine control module
AURIX™ TC38x
Drivetrain control module
AURIX™ TC23x
Transmission control module
AURIX™ TC27x
Automatic gear shifter module
AURIX™ TC23x
Electronic slip differential
AURIX™ TC23x
Braking
AURIX™ TC39x
Airbag
AURIX™ TC23x
Electric power steering
AURIX™ TC27x
Automatic sway bar
AURIX™ TC23x
Map driver assistance
AURIX™ TC39x
Secure gateway module
AURIX™ TC39x
AD fusion standard
AURIX™ TC39x
AD fusion high-end
AURIX™ TC39x
Central AD decision module
AURIX™ TC39x
Engine management
AURIX™ TC38x
Diesel engine management
AURIX™ TC39x
Transmission control module
AURIX™ TC38x
Inverter PHEV
AURIX™ TC38x
Door module
FR MB91520
Braking
AURIX™ TC38x
Airbag
AURIX™ TC37x
Electric power steering
AURIX™ TC36x
Suspension CVC
AURIX™ TC38x
Alarm system module
FR MB91F520
Digital instrument cluster
Traveo I S6J332
Front camera
AURIX™ TC37x
Radar domain processing
AURIX™ TC39x
AD fusion standard
AURIX™ TC39x
AD fusion high-end
AURIX™ TC39x
Instrument cluster
NOR Flash S26KS512
Infotainment module
89359
(Wi-Fi / Bluetooth)
Central AD module
NOR Flash S70FL01G
S25FL512 S25FS512
8” rear-seat entertainment
TrueTouch TMA78
10” navigation
module
TrueTouch TMA1036
Cluster TFT module
FCR4 MB9DF125
Climate, gearshift MMI
FR CY91xxx
Head light module
FR MB91F525
Infineon heritage Cypress heritage
Take aways
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2020-10-05 Copyright © Infineon Technologies AG 2020. All rights reserved.
In 2021, the automotive market is expected to snap back Growth of xEV is accelerated by incentive programs and green deals
Infineon is very well positioned to win upcoming SiC-based xEV
platforms:
due to its scalable product offering
by leveraging its huge IGBT customer base
For ADAS/AD, dependability is a must and is a key driver of
semiconductor content growth
Infineon offers an unmatched portfolio for dependable systems
AURIX™ has become the first-choice microcontroller for high-growth
applications
Glossary
AC-DC alternating current - direct current
AD automated driving ADAS advanced driver assistance system
BEV battery electric vehicle
BMS battery management system BoM bill of material CAN controller area network CMOS complementary metal-oxid semiconductor CPU central processing unit CVC California vehicle code DC-DC direct current - direct current ECU electronic control unit EPS electric power steering EV electric vehicle FCEV fuel cell electric vehicle FHEV full-hybrid electric vehicle FPGA field programmable gate array GaN gallium nitride GPU graphics processing unit
HSM hardware security module
HV high-voltage HW hardware
IC integrated circuit
ICE internal combustion engine IGBT insulated gate bipolar transistor IVN in-vehicle networking MCU microcontrollerunit µC microcontroller
MHEV, mild­hybrid
mild-hybrid electric vehicle; vehicles using start-stop systems, recuperation, DC­DC conversion, e-motor
micro-hybrid vehicles using start-stop systems and limited recuperation
mild-hybrid vehicles using start-stop systems, recuperation, DC-DC conversion, e-motor MOSFET metal-oxide siliconfield-effect transistor
MPU microprocessor unit
NEDC new European drive cycle
OBC on-board charger OEM original equipment manufacturer PCB printed circuit board PHEV plug-in hybrid electric vehicle
PMIC power management IC
PT powertrain RF radio frequency RoW rest of world Si silicon
SiC silicon carbide
SiGe silicon germanium SoC system-on-chip SOTA software over-the-air SW software
TAM total addressable market
ToF time-of-flight V2X vehicle-to-everything communication xEV all degrees of vehicle electrification (EV, FHEV, HEV, PHEV)
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2020-10-05 Copyright © Infineon Technologies AG 2020. All rights reserved.
Disclaimer
Disclaimer
This presentation contains forward-looking statements about the business, financial condition and earnings performance of the Infineon Group.
These statements are based on assumptions and projections resting upon currently available information and present estimates. They are subject to a multitude of uncertainties and risks. Actual business development may therefore differ materially from what has been expected. Beyond disclosure requirements stipulated by law, Infineon does not undertake any obligation to update forward-looking statements.
Specific disclaimer for IHS Markit – reports, data and information referenced in this document:
The IHS Markit reports, data and information referenced herein (the "IHS Markit Materials") are the copyrighted property of IHS Markit Ltd. and its subsidiaries ("IHS Markit") and represent
data, research, opinions or viewpoints published by IHS Markit, and are not representations of fact. The IHS Markit Materials speak as of the original publication date thereof and not as of the
date of this document. The information and opinions expressed in the IHS Markit Materials are subject to change without notice and neither IHS Markit nor, as a consequence, Infineon have any duty or responsibility to update the IHS Markit Materials or this publication. Moreover, while the IHS Markit Materials reproduced herein are from sources considered reliable, the accuracy and completeness thereof are not warranted, nor are the opinions and analyses which are based upon it. IHS Markit and the trademarks used in the Data, if any, are trademarks of IHS Markit. Other trademarks appearing in the IHS Markit Materials are the property of IHS Markit or their respective owners.
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2020-10-05 Copyright © Infineon Technologies AG 2020. All rights reserved.
Peter Schiefer Division President Automotive
since 2016: Division President Automotive Sep 2012: Head of Infineon worldwide Operations, responsible for chip
production, assembly and testing, as well as process technology
development, supply chain and purchasing
Jan 2012: Division President Power Management & Multimarket since 2018: Member and Vice Chairman of the Board of Directors of the JV
SIAPM (SAIC Infineon Automotive Power Modules (Shanghai) Co. Ltd.)
2013 – 2016: Member of the Supervisory Board of Infineon Technologies
Austria
since 2012: Member of the Supervisory Board of Infineon Technologies
Dresden
Peter Schiefer was born in Munich, Germany, in 1965. He holds a Diploma in
Electrical Engineering from the University of Applied Sciences in Munich.
He joined Infineon (Siemens AG until 1999) in 1990.
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2020-10-05 Copyright © Infineon Technologies AG 2020. All rights reserved.
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