Infineon AN2012-05 Application and Assembly Notes
Application Note AN 2012-05
V2.0, February 2013
AN2012-05 - 62mm Modules
Application and Assembly Notes
Application Note AN 2012-05
V2.0, February 2013
Edition 2012-05
Published by
Infineon Technologies AG
59568 Warstein, Germany
© Infineon Technologies AG 2012.
All Rights Reserved.
Attention please!
THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE
IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE
REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR
QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION
NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON
TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND
(INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL
PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN
IN THIS APPLICATION NOTE.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types
in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components
may only be used in life-support devices or systems with the express written approval of Infineon
Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-
support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and
sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other
persons may be endangered.
AN 2012-05
Revision History: date (2013-02) , V2.0
Previous Version: AN2002-08, AN2012-05 V1.0, AN2012-05 V1.1
Page: 3, 21, 25, 26, 27, 28, 29, 30
Author: Wilhelm Rusche - IFAG IPC MP
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will
help us to continuously improve the quality of this document. Please send your proposal (including a
reference to this document) to: [IGBT.Application@infineon.com]
62mm modules
Application and assembly notes
62mm Application and Assembly Note Rev. 2.0 Page 2 / 32
Application Note AN 2012-05
V2.0, February 2013
62mm modules
Application and assembly notes
Table of contents
1. General ................................................................................................................................................ Page 4
2. Supply quality ..................................................................................................................................... Page 4
3. Storage and transport of 62mm modules ........................................................................................ Page 4
4. IGBT modules are electrostatic sensitive devices (ESD) .............................................................. Page 5
5. Module labelling, RoHS & Green Product ....................................................................................... Page 6
6. Module selection ................................................................................................................................ Page 7
6.1 Selecting the module voltage class (V
of modules at elevated heights ...................................................................................................... Page 8
6.2 Climatic conditions during the operation of 62mm Modules ........................................................ Page 9
7. Module creepage and clearance distances .................................................................................. Page 10
7.1 Creepage and clearance distances 62mm halfbridge housing ................................................... Page 10
7.2 Creepage and clearance distances 62mm single switch housing .............................................. Page 11
8. Module assembly and connections ................................................................................................ Page 12
8.1 Condition of the heatsink for module assembly .......................................................................... Page 12
8.2 Thermal interface material ........................................................................................................... Page 13
8.2.1 Infineon thermal interface material - IFX TIM ........................................................................ Page 13
8.2.2 Application of standard thermal paste in a screen printing process ...................................... Page 14
8.2.3 Alternative ways to apply standard thermal paste ................................................................. Page 16
8.3 Module assembly onto the heatsink ............................................................................................ Page 17
8.4 Connection and assembly of the power terminal busbars .......................................................... Page 20
8.5 Example of a low inductive DC-bus ............................................................................................ Page 24
8.6 Connection and assembly of the IGBT driver ............................................................................. Page 25
) and the operation
CES
8.6.1 Mounting the driver onto a 62mm single switch (FZ) module ................................................ Page 25
8.6.2 Auxiliary terminal connection on 62mm (FF, FD, DF) module variants ................................. Page 26
8.6.2.1 Example 1 - Connecting variants of the 62mm (FF, FD, DF) auxiliary terminals
8.6.2.2 Example 2 - Connecting variants of the 62mm (FF, FD, DF) auxiliary terminals
8.6.2.1 Example 3 - Connecting variants of the 62mm (FF, FD, DF) auxiliary terminals
9. Usage under vibration- and/or shock conditions ......................................................................... Page 30
10. Paralellling of IGBT modules ....................................................................................................... Page 30
11. References ...................................................................................................................................... Page 31
62mm Application and Assembly Note Rev. 2.0 Page 3 / 32
Application Note AN 2012-05
V2.0, February 2013
62mm modules
Application and assembly notes
1. General
These notes AN2012-05 Rev.1.2 for the application and assembly of Infineon 62mm modules,
replaces AN2012-05 Rev.1.1., AN2012-05 Rev.1.0 and AN2002-08 Rev. V1.0.
62mm power semiconductors are electrical components.
Important aspects in the construction of the mechanical layout include the application conditions at
which the components are put to use. These application conditions must be observed in the
mechanical as well as the electrical design, the thermal design and the lifetime of the power modules
based on the applied load profiles.
The notes and recommendations in this document cannot cover all and every application and
condition. The assembly and application notes AN2012-05 Rev.1.2, therefore, will in no way replace a
thorough assessment and evaluation of the suitability for the purpose envisaged by the user with the
technical departments. Hence, the application notes do under no circumstances become part of the
supply contractual warranty, unless the supply contract determines any different in writing.
2. Supply qualities
All IGBT modules undergo a final test before delivery according to IEC60747-9 and IEC60747-15.
Inwards goods tests of the components at the recipient’s site are therefore not required.
After an additional and final visual inspection, the components ready for shipping are packaged in an
ESD protected transport box. Concaves and / or elevations of the baseplate in the µm-range are
permissible within valid Infineon specification limits and therefore bear no influence on the thermal,
electrical or reliability characteristics of the power modules.
Once the user has removed the components from the ESD protected shipping box, further processing
should occur in accordance with the directive according to chapter 4.
3. Storage and transportation of 62mm modules
During transportation and storage of the modules, extreme forces such as shock and / or vibration
loads are to be avoided as well as extreme environmental influences outside those storage conditions
recommended by Infineon [1].
Storing the modules at those temperature limits specified by the data sheet is possible but not
recommended.
The storage time at the recommended storage conditions according to [1] should not be exceeded.
A pre-dry process of the module packages before assembly, as is recommended with moulded
components like microcontrollers or TO-packages, is not required with 62mm modules if proper
storage conditions are applied.
62mm Application and Assembly Note Rev. 2.0 Page 4 / 32
Application Note AN 2012-05
V2.0, February 2013
62mm modules
Application and assembly notes
4. IGBT modules are electrostatic sensitive devices (ESD)
IGBT semiconductors are electrostatic sensitive devices which require to be handled according to the
ESD directives. Uncontrolled discharge, voltage from non-earthed operating equipment or personnel
as well as static discharge or similar effects may destroy the devices. The gate-emitter control
terminals are electrostatic sensitive contacts. Take care not to operate or measure IGBT modules with
open circuit gate-emitter terminals.
Electrostatic discharge (ESD) may partially or even completely damage IGBT modules.
The user must observe all precautions in order to avoid electrostatic discharge during handling,
movement and packing of these components.
Important notice:
In order to avoid destruction or pre-damage of the power semiconductor components through
electrostatic discharge the devices are delivered in suitable ESD packaging according to the ESD
directives.
The installation of ESD workstations is required to unpack the modules and thus remove the ESD
protection as well as handling the unprotected modules.
Subsequent work steps are only to be carried out at special work stations complying with the
following requirements
High impedance ground connection
Conductive workstation surface
ESD wrist straps
All transport equipment and PCBs have to be brought to the same potential prior to further
processing of the ESD sensitive components.
Further information can be derived from the standards in their current versions.
IEC 61340-5-2, Electrostatics–protection of electronic devices from electrostatic phenomena –
general requirements
ANSI/ESD S2020
MIL-STD 883C, Method 3015.6 for testing and Classification
DIN VDE 0843 T2, identical with IEC801-2
62mm Application and Assembly Note Rev. 2.0 Page 5 / 32
Application Note AN 2012-05
V2.0, February 2013
A. 62mm halfbridge package B. 62mm single switch package
62mm modules
Application and assembly notes
5. Module labelling, RoHS & Green Product
Infineon 62mm C-series modules comply with the directives according to RoHS and are marked as
>>Green Products<< with a G as part of the module label. Data sheets listing product materials,
Material Datasheet, may be ordered from Infineon.
Fig. 1: Green Product designation on 62mm module
6. Module selections
62mm modules are available in the most varied configurations as well as voltage and current ranges
with differently optimised IGBTs and diodes.
Maximum values in the product datasheets and application notes are absolute values, which - even for
brief periods - must not be exceeded, as this may cause pre-damage or destruction of the
components.
Further information can be obtained from the application notes [2].
62mm Application and Assembly Note Rev. 2.0 Page 6 / 32
Application Note AN 2012-05
V2.0, February 2013
FF DF FD
FZ
FZ _B1
62mm modules
Application and assembly notes
Selecting the most suitable component requires the consideration of various criteria. The overview
below in figure 2 and figure 3 serves as a first illustration and hint.
Fig. 2: Typical 62mm module package variants
Table 1: 62mm module designation overview
62mm Application and Assembly Note Rev. 2.0 Page 7 / 32
Application Note AN 2012-05
V2.0, February 2013
(2)
(1)
62mm modules
Application and assembly notes
6.1 Selecting the module voltage class (V
) and the operation of
CES
modules at elevated heights
When selecting the appropriate voltage class, the IGBT has to exhibit a blocking capability appropriate
to the application conditions.
Table 2 shows possible IGBT voltage classes for different supply voltages. This table can be used for
an initial IGBT module selection. The maximum collector-emitter voltage (V
even for short periods during switching and has to be considered in the selection of a suitable IGBT
voltage class over the entire temperature range.
As a guideline to select a possible IGBT voltage class the following assumption [9] is suitable.
with S = safety margin in %.
) must not be exceeded
CES
Table 2: IGBT blocking capability as a selection criterion of the supply voltage
The Collector-emitter overvoltage shoot (∆UCE) of the IGBT during turning off, affected by the collector
current slope (
class.
Operation of power semiconductor components above normal heights e.g. at heights >2000m above
sea level or operation of power semiconductor components at high DC voltages may necessitate in
limiting the operating range.
Due to the lower air pressure the cooling capability of air cooling systems needs to be evaluated.
The isolation properties, especially the clearance distances need to be adjusted due to the lower
dielectric strength of the air. See also Chapter 7.
Possible statistical failure rates due to the operation of the power semiconductors at elevated
heights (cosmic radiation) and / or at high voltage have to be considered when selecting a suitable
voltage class and generally during the design phase.
With operating temperatures T <25°C, the reduced blocking capability typical for IGBTs and the
switching behaviour of the components at these temperatures in the particular application has to be
kept in mind and should be studied independently in the user’s design. The specification of the
blocking capability in dependence of the temperature T = -40°C to T = +25°C is available upon
request through your sales representative for Infineon power devices.
) and the parasitic inductances (Lσ), must be considered by selecting a proper voltage
62mm Application and Assembly Note Rev. 2.0 Page 8 / 32
Application Note AN 2012-05
V2.0, February 2013
62mm modules
Application and assembly notes
The power cycling capability for the envisaged lifetime needs to be calculated on the basis of the load
profile. Further information on the subject is available on request and in [3].
6.2 Climatic conditions during active, current carrying operation of 62mm
Modules
62mm modules are not hermetically sealed. The housings and the molding compound, used for the
electrical isolation within the housing, are permeable for humidity and gases in both directions.
Therefore humidity differences will be equalized in both directions.
Corrosive gases must be avoided during operation and storage of the devices. The climatic conditions
for Infineon 62mm Modules in active, current carrying operation are specified as per EN60721-3-3
class 3K3 for fixed installations.
The operation of the modules in humid atmosphere caused by condensation and/or the operation in
climatic conditions beyond class 3K3 of EN60721-3-3 must be avoided and additional
countermeasures need to be taken in such cases.
Corrosive gases must be avoided in any case during operation as well as in storage conditions.
62mm Application and Assembly Note Rev. 2.0 Page 9 / 32
Application Note AN 2012-05
V2.0, February 2013
Description
Values
Remark
a. Creepage distance: Contact to
heatsink
29mm
from 4 to module mounting hole,
from 6 to module mounting hole
b. Creepage distance: Contact to
contact
23mm
from 3 to 5,
from 3 to 7
c. Clearance: Contact to heatsink
23mm
from 4 to module mounting hole,
from 6 to module mounting hole
d. Clearance: Contact to contact
11mm
from 3 to 5,
from 3 to 7
62mm modules
Application and assembly notes
7. Module creepage and clearance distances
When calculating the isolation characteristics, consider the application specific standards, particularly
regarding clearance and creepage distances.
The module-specific 62mm C-series package drawings can be taken from the datasheets or can be
acquired in electronic form as a CAD file via your sales partner for Infineon modules.
In particular with the selection of the bolts and washers, clearance and creepage distances must be
considered. Please also note the information in Chapter 6.1. In order to suit the application
requirements here, if necessary, avoid electrically conducting components or plated-through holes or
take isolation measures, e.g. lacquer.
Clearance and creepage distances indicated in the 62mm module datasheets are those specified with
the not assembled and unconnected module. These values are the existing shortest clearance and
creepage distances for pollution degree 2 in accordance with IEC60664-1. The following tables show
an overview of these clearance and creepage distances of the different package variants.
7.1 Clearance and creepage distances 62mm half bridge housing
(FF, FD, DF)
Table 3: Clearance and creepage distances 62mm half bridge housing
Fig. 3: Shortest creepage distances of the not assembled and unconnected 62mm half bridge package
62mm Application and Assembly Note Rev. 2.0 Page 10 / 32
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