IEI Technology WAFER-LX, WAFER-LX-800-R10, WAFER-LX-WINXPE, WAFER-LX-CLIENT-CENET050, WAFER-LX-CENET050 User Manual

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REVISION HISTORY
Title
WAFER-LX AMD Geode LX 800
Revision Number Description Date of Issue
1.0 Initial release September 2006
1.1 Modified Section 2.4 December 2006
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event is the manufacturer liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
IBM PC is a registered trademark of International Business Machines Corporation. INTEL
is a registered trademark of INTEL Corporation. AMI is registered trademarks of American
Megatrends Inc. Other product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.
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Table of Contents
1 INTRODUCTION................................................................................................... 15
1.1 WAFER-LX OVERVIEW .......................................................................................... 16
1.1.1 WAFER-LX Models .......................................................................................... 16
1.1.2 WAFER-LX Applications.................................................................................. 17
1.1.3 WAFER-LX Benefits ......................................................................................... 17
1.1.4 WAFER-LX Features........................................................................................ 17
1.2 WAFER-LX O
1.2.1 WAFER-LX Connectors ................................................................................... 19
1.2.2 Technical Specifications................................................................................... 21
1.3 O
PERATING SYSTEM PACKAGES ............................................................................... 22
1.3.1 Windows XPE SP2 (350MB image size stored in a 512MB CF card) ............. 22
1.3.2 Windows CE 5.0 (around 22Mbyte, CF must > 32Mbyte)............................... 23
2 DETAILED SPECIFICATIONS ........................................................................... 25
2.1 OVERVIEW ............................................................................................................... 26
2.2 DIMENSIONS ............................................................................................................ 26
2.2.1 Board Dimensions............................................................................................ 26
2.2.2 External Interface Panel Dimensions .............................................................. 27
2.3 CPU SUPPORT.......................................................................................................... 27
2.3.1 AMD Geode™ LX 800 500MHz Specifications............................................. 27
2.3.2 AMD
2.4 SYSTEM CHIPSET ..................................................................................................... 28
2.5 DATA FLOW.............................................................................................................. 29
VERVIEW .......................................................................................... 18
Geode™ LX 800 500MHz Power Management................................... 28
2.6 GRAPHICS SUPPORT ................................................................................................. 30
2.7 MEMORY SUPPORT................................................................................................... 32
2.8 PCI BUS INTERFACE SUPPORT ................................................................................. 32
2.9 ETHERNET CONTROLLER SPECIFICATIONS ............................................................... 32
2.9.1 Overview .......................................................................................................... 32
2.9.2 Features ........................................................................................................... 32
2.10 D
RIVE INTERFACES ................................................................................................ 33
2.10.1 SATA Drives ................................................................................................... 33
2.10.2 IDE HDD Interfaces ...................................................................................... 33
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2.10.3 Floppy Disk Drive (FDD).............................................................................. 34
2.10.4 Compact Flash Support ................................................................................. 34
2.11 SERIAL PORTS ........................................................................................................ 34
2.12 REAL TIME CLOCK................................................................................................. 34
2.13 SYSTEM MONITORING............................................................................................ 34
2.14 USB INTERFACES................................................................................................... 35
2.15 BIOS ..................................................................................................................... 35
2.16 OPERATING TEMPERATURE AND TEMPERATURE CONTROL..................................... 35
2.17 AUDIO CODEC ........................................................................................................ 35
2.18 POWER CONSUMPTION........................................................................................... 37
2.19 PACKAGED CONTENTS AND OPTIONAL ACCESSORY ITEMS..................................... 37
2.19.1 Package Contents........................................................................................... 37
2.19.2 Optional Accessory Items............................................................................... 38
3 CONNECTORS AND JUMPERS ......................................................................... 39
3.1 PERIPHERAL INTERFACE CONNECTORS .................................................................... 40
3.1.1 WAFER-LX Layout........................................................................................... 40
3.1.2 Peripheral Interface Connectors ..................................................................... 41
3.1.3 External Interface Panel Connectors............................................................... 42
3.1.4 On-board Jumpers ........................................................................................... 43
3.2 INTERNAL PERIPHERAL CONNECTORS ...................................................................... 44
3.2.1 AT Power Connector........................................................................................ 44
3.2.2 ATX Power Connector ..................................................................................... 45
3.2.3 ATX Power Button Connector.......................................................................... 46
3.2.4 Audio Connector .............................................................................................. 47
3.2.5 Battery Connector............................................................................................ 48
3.2.6 Compact Flash Connector ............................................................................... 49
3.2.7 Fan Connector ................................................................................................. 50
3.2.8 Floppy Disk Connector .................................................................................... 52
3.2.9 GPIO Connector .............................................................................................. 53
3.2.10 IDE Connector ............................................................................................... 54
3.2.11 Inverter Power Connector.............................................................................. 56
3.2.12 Keyboard/Mouse Connector .......................................................................... 57
3.2.13 LED Connector .............................................................................................. 58
3.2.14 Print Port Connector ..................................................................................... 60
3.2.15 PC/104 Power Input Connector..................................................................... 61
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3.2.16 PC/104 Slot .................................................................................................... 62
3.2.17 Reset Button Connector ................................................................................. 64
3.2.18 RS-232/422/485 Cable Connectors................................................................ 65
3.2.19 SATA Drive Connectors ................................................................................. 66
3.2.20 TFT LCD LVDS Connector............................................................................ 68
3.2.21 TFT LCD TTL Connector............................................................................... 69
3.2.22 Internal USB Connectors............................................................................... 70
3.3 E
XTERNAL INTERFACE CONNECTORS....................................................................... 71
3.3.1 External Interface Connector Overview .......................................................... 71
3.3.2 USB Combo Port.............................................................................................. 72
3.3.3 Ethernet Connector.......................................................................................... 72
3.3.4 Serial Communications COM 1 and COM2 Connector .................................. 73
3.3.5 VGA Connector ................................................................................................ 74
4 INSTALLATION AND CONFIGURATION ....................................................... 77
4.1 ANTI-STATIC PRECAUTIONS ...................................................................................... 78
4.2 INSTALLATION CONSIDERATIONS ............................................................................. 78
4.2.1 Installation Notices .......................................................................................... 78
4.3 UNPACKING.............................................................................................................. 79
4.3.1 Unpacking Precautions.................................................................................... 79
4.3.2 Checklist........................................................................................................... 80
4.4 WAFER-LX MOTHERBOARD INSTALLATION........................................................... 80
4.4.1 DIMM Module Installation .............................................................................. 82
4.4.1.1 Purchasing the Memory Module............................................................... 82
4.4.1.2 DIMM Module Installation....................................................................... 82
4.4.2 Peripheral Device Connection......................................................................... 83
4.4.2.1 IDE Disk Drive Connector (IDE1) ........................................................... 83
UMPER SETTINGS .................................................................................................... 84
4.5 J
4.5.1 Clear CMOS Jumper........................................................................................ 85
4.5.2 AT Power Select Jumper Settings..................................................................... 86
4.5.3 COM3 Setup Jumper Settings .......................................................................... 87
4.6 C
HASSIS INSTALLATION ........................................................................................... 87
4.7 REAR PANEL CONNECTORS ...................................................................................... 87
4.7.1 LCD Panel Connection .................................................................................... 87
4.7.2 Ethernet Connection ........................................................................................ 88
4.7.3 USB Connection............................................................................................... 88
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4.7.4 Keyboard and Mouse Connection.................................................................... 88
5 AWARD BIOS SETUP ........................................................................................... 89
5.1 INTRODUCTION ........................................................................................................ 90
5.1.1 Starting Setup................................................................................................... 90
5.1.2 Using Setup ...................................................................................................... 90
5.1.3 Getting Help..................................................................................................... 91
5.1.4 Unable to Reboot After Configuration Changes.............................................. 91
5.1.5 Main BIOS Menu ............................................................................................. 91
5.2 STANDARD CMOS FEATURES.................................................................................. 94
5.2.1 IDE Primary Master/Slave .............................................................................. 96
5.3 ADVANCED BIOS FEATURES.................................................................................... 98
5.4 ADVANCED CHIPSET FEATURES.............................................................................. 105
5.4.1 Flat Panel Configuration............................................................................... 108
5.5 INTEGRATED PERIPHERALS .....................................................................................110
5.5.1 IT8888 ISA Decode IO....................................................................................116
5.5.2 IT8888 ISA Decode Memory...........................................................................119
5.6 POWER MANAGEMENT SETUP................................................................................ 121
5.7 PNP/PCI CONFIGURATIONS ................................................................................... 124
5.8 PC HEALTH STATUS ............................................................................................... 128
6 SOFTWARE DRIVERS ....................................................................................... 131
6.1 AVAILABLE SOFTWARE DRIVERS ............................................................................ 132
6.2 VGA DRIVER......................................................................................................... 134
6.3 AUDIO DRIVER INSTALLATION ............................................................................... 143
6.4 LAN D
RIVER ......................................................................................................... 148
6.5 SATA/RAID DRIVER............................................................................................. 152
6.6 ISA DRIVER ........................................................................................................... 157
A BIOS CONFIGURATION OPTIONS ................................................................ 165
A.1 BIOS CONFIGURATION OPTIONS........................................................................... 166
B WATCHDOG TIMER .......................................................................................... 171
C ADDRESS MAPPING.......................................................................................... 175
C.1 IO ADDRESS MAP ................................................................................................. 176
C.2 1ST MB MEMORY ADDRESS MAP ......................................................................... 176
C.3 IRQ MAPPING TABLE ............................................................................................ 177
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C.4 DMA C
HANNEL ASSIGNMENTS ............................................................................. 177
D EXTERNAL AC’97 AUDIO CODEC ................................................................. 179
D.1 INTRODUCTION ..................................................................................................... 180
D.1.1 Accessing the AC’97 CODEC ....................................................................... 180
D.1.2 Driver Installation......................................................................................... 180
D.2 SOUND EFFECT CONFIGURATION........................................................................... 181
D.2.1 Accessing the Sound Effects Manager .......................................................... 181
D.2.2 Sound Effect Manager Configuration Options ............................................. 182
E ALI RAID .............................................................................................................. 185
6.7 INTRODUCTION ...................................................................................................... 186
A.1.1 Precautions.................................................................................................... 186
A.2 FEATURES AND BENEFITS ...................................................................................... 187
A.3 ACCESSING THE ALI RAID UTILITY ..................................................................... 187
A.4 RAID OPTIONS:.................................................................................................... 189
A.4.1 Create RAID 0 Striping for Performance ...................................................... 189
A.4.2 Create RAID 1 Mirroring for Reliability....................................................... 190
A.4.3 Create JBOD for Integrated Capacity........................................................... 192
A.4.4 Stripe Size ...................................................................................................... 193
A.4.5 Delete RAID Setting & Partition................................................................... 193
A.4.6 Delete All RAID Setting & Partition ............................................................. 194
A.4.7 Rebuild RAID Array ...................................................................................... 194
A.4.8 Select Boot Drive........................................................................................... 195
B INDEX.................................................................................................................... 197
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List of Figures
Figure 1-1: WAFER-LX Overview...............................................................................18
Figure 1-2: WAFER-LX Solder Side Overview..........................................................19
Figure 2-1: WAFER-LX Dimensions (mm).................................................................26
Figure 2-2: External Interface Panel Dimensions (mm)...........................................27
Figure 2-3: Data Flow Block Diagram........................................................................30
Figure 3-1: Connector and Jumper Locations .........................................................40
Figure 3-2: Connector and Jumper Locations (Solder Side)..................................41
Figure 3-3: AT Power Connector Location ...............................................................44
Figure 3-4: ATX Power Connector Location.............................................................45
Figure 3-5: ATX Power Button Connector ................................................................46
Figure 3-6: Audio Connector Location......................................................................47
Figure 3-7: Battery Connector Location ...................................................................48
Figure 3-8: Compact Flash Connector Location (Solder Side) ..............................49
Figure 3-9: Fan Connector Location .........................................................................51
Figure 3-10: FDD Connector Location ......................................................................52
Figure 3-11: GPIO Connector Location.....................................................................54
Figure 3-12: IDE Device Connector Locations .........................................................55
Figure 3-13: Inverter Connector Locations ..............................................................56
Figure 3-14: Keyboard/Mouse Connector Location.................................................57
Figure 3-15: LED Connector Locations.....................................................................59
Figure 3-16:Print Port Connector Location ..............................................................60
Figure 3-17: PC/104 Power Input Connector Pinouts..............................................62
Figure 3-18: PC/104 Slot Location .............................................................................63
Figure 3-19: Reset Button Connector Locations .....................................................65
Figure 3-20: RS-232 Serial Port Connector Locations ............................................66
Figure 3-21: SATA Drive Connector Locations........................................................67
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Figure 3-22: TFT LCD LVDS Connector Pinout Locations......................................68
Figure 3-23: TFT LCD TTL Connector Pinout Locations.........................................69
Figure 3-24: USB Connector Pinout Locations........................................................71
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Figure 3-25: WAFER-LX On-board External Interface Connectors ........................72
Figure 3-26: J7 Connector..........................................................................................73
Figure 3-27: COM1 Pinout Locations ........................................................................74
Figure 3-28: VGA1 Connector ....................................................................................75
Figure 4-1: SO-DIMM Module Installation .................................................................82
Figure 4-2: Jumper Locations....................................................................................85
Figure 6-1: AMD LX/GX CD Main Menu.................................................................. 133
Figure 6-2: AMD LX/GX CD Driver Menu................................................................ 134
Figure 6-3: Access Windows Control Panel.......................................................... 135
Figure 6-4: Double Click the System Icon ............................................................. 136
Figure 6-5: Double Click the Device Manager Tab................................................ 136
Figure 6-6: Device Manager List ............................................................................. 137
Figure 6-7: Expand the Display Adapters Category ............................................. 138
Figure 6-8: Update Driver ........................................................................................ 139
Figure 6-9: Upgrade Device Driver Wizard ............................................................ 140
Figure 6-10: Search for Suitable Driver.................................................................. 141
Figure 6-11: Locate Driver Files.............................................................................. 142
Figure 6-12: Location Browsing Window............................................................... 142
Figure 6-13: Access Windows Control Panel........................................................ 143
Figure 6-14: Double Click the System Icon ........................................................... 144
Figure 6-15: Double Click the Device Manager Tab.............................................. 144
Figure 6-16: Device Manager List........................................................................... 145
Figure 6-17: Search for Suitable Driver.................................................................. 146
Figure 6-18: Locate Driver Files.............................................................................. 147
Figure 6-19: Location Browsing Window............................................................... 148
Figure 6-20: Locate the Setup Program Icon ........................................................ 149
Figure 6-21: Preparing Setup Screen..................................................................... 149
Figure 6-22: Install Wizard Welcome Screen......................................................... 150
Figure 6-23: Installing Screen ................................................................................. 151
Figure 6-24: Restart the Computer......................................................................... 152
Figure 6-25: Locate the Setup Program Icon ........................................................ 153
Figure 6-26: Preparing Setup Screen..................................................................... 153
Figure 6-27: Install Wizard Welcome Screen......................................................... 154
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Figure 6-28: Installing Screen ................................................................................. 155
Figure 6-29: RAID Driver Digital Signal.................................................................. 156
Figure 6-30: InstallShield Wizard Complete Screen ............................................. 157
Figure 6-31: Access Windows Control Panel........................................................ 158
Figure 6-32: Double Click the System Icon ........................................................... 159
Figure 6-33: Double Click the Device Manager Tab.............................................. 159
Figure 6-34: Device Manager List........................................................................... 160
Figure 6-35: Search for Suitable Driver.................................................................. 161
Figure 6-36: Locate Driver Files.............................................................................. 162
Figure 6-37: Location Browsing Window............................................................... 163
FigureeD-1: Sound Effect Manager Control Panel................................................ 180
FigureeD-2: Sound Effect Manager Icon [Task Bar] ............................................. 181
FigureeD-3: Sound Effect Manager Icon [Control Panel]..................................... 181
FigureeD-4: Sound Effects Manager (ALC655) ..................................................... 182
FigureeE-1: Accessing ALi RAID BIOS Utility....................................................... 188
FigureeE-2: RAID BIOS Setup Utility...................................................................... 188
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List of Tables
Table 1-1: WAFER-LX Model Specifications ............................................................16
Table 1-2: Technical Specifications ..........................................................................22
Table 2-1: Geode LX Graphics Features...................................................................32
Table 2-2: Power Consumption .................................................................................37
Table 3-1: Peripheral Interface Connectors..............................................................42
Table 3-2: Rear Panel Connectors.............................................................................43
Table 3-3: On-board Jumpers ....................................................................................43
Table 3-4: AT Power Connector Pinouts ..................................................................45
Table 3-5: ATX Power Connector Pinouts ................................................................46
Table 3-6: ATX Power Button Connector Pinouts ...................................................47
Table 3-7: Audio Connector Pinouts.........................................................................48
Table 3-8: Battery Connector Pinouts.......................................................................49
Table 3-9: Compact Flash Connector Pinouts .........................................................50
Table 3-10: Fan Connector Pinouts...........................................................................51
Table 3-11: FDD Connector Pinouts..........................................................................53
Table 3-12: GPIO Connector Pinouts ........................................................................54
Table 3-13: Secondary IDE Connector Pinouts........................................................56
Table 3-14: Inverter Power Connector Pinouts ........................................................57
Table 3-15: Keyboard/Mouse Connector Pinouts....................................................58
Table 3-16: LED Connector Pinouts ..........................................................................59
Table 3-17: Parallel Port Connector Pinouts ............................................................61
Table 3-18: PC/104 Power Input Connector Pinouts ...............................................62
Table 3-19: PC/104 Slot Connector Pinouts .............................................................64
Table 3-20: Reset Button Connector Pinouts...........................................................65
Table 3-21: RS-232/422/485 Serial Port Connector Pinouts....................................66
Table 3-22: SATA Drive Connector Pinouts .............................................................67
Table 3-23: TFT LCD LVDS Port Connector Pinouts ...............................................69
Table 3-24: TFT LCD TTL Port Connector Pinouts ..................................................70
Table 3-25: USB Port Connector Pinouts .................................................................71
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Table 3-26: J6 Connector Pinouts .............................................................................72
Table 3-27: J7 Connector Pinouts .............................................................................73
Table 3-28: J7 Connector LEDs .................................................................................73
Table 3-29: COM1 Pinouts..........................................................................................74
Table 3-30: VGA1 Connector Pinouts .......................................................................75
Table 4-1: IEI Provided Cables...................................................................................83
Table 4-2: Jumpers ....................................................................................................84
Table 4-3: Clear CMOS Jumper Settings ..................................................................86
Table 4-4: AT Power Select Jumper Settings...........................................................87
Table 4-5: COM2 Setup Jumper Settings..................................................................87
Table 5-1: BIOS Navigation Keys...............................................................................91
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List of BIOS Menus
BIOS Menu 1: Award BIOS CMOS Setup Utility .......................................................92
BIOS Menu 2: Standard CMOS Features ..................................................................94
BIOS Menu 3: Advanced BIOS Features...................................................................99
BIOS Menu 4: Advanced Chipset Features ........................................................... 106
BIOS Menu 5: Flat Panel Configuration ................................................................. 108
BIOS Menu 6: Integrated Peripherals..................................................................... 111
BIOS Menu 7: IT8888 ISA Decode IO...................................................................... 117
BIOS Menu 8: IT8888 ISA Decode Memory............................................................ 119
BIOS Menu 9: Power Management Setup.............................................................. 121
BIOS Menu 10: PnP/PCI Configurations ................................................................ 124
BIOS Menu 11: IRQ Resources ............................................................................... 126
BIOS Menu 12: Memory Resources........................................................................ 127
BIOS Menu 13: PC Health Status............................................................................ 129
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Glossary
AC ’97 Audio Codec 97
ACPI Advanced Configuration and
Power Interface
APM Advanced Power Management
ARMD ATAPI Removable Media Device
ASKIR Shift Keyed Infrared
ATA Advanced Technology
Attachments
BIOS Basic Input/Output System
CFII Compact Flash Type 2
CMOS Complementary Metal Oxide
Semiconductor
CPU Central Processing Unit
Codec Compressor/Decompressor
COM Serial Port
DAC Digital to Analog Converter
DDR Double Data Rate
HDD Hard Disk Drive
IDE Integrated Data Electronics
I/O Input/Output
ICH4 I/O Controller Hub 4
L1 Cache Level 1 Cache
L2 Cache Level 2 Cache
LCD Liquid Crystal Display
LPT Parallel Port Connector
LVDS Low Voltage Differential Signaling
MAC Media Access Controller
OS Operating System
PCI Peripheral Connect Interface
PIO Programmed Input Output
PnP Plug and Play
POST Power On Self Test
RAM Random Access Memory
SATA Serial ATA
DIMM Dual Inline Memory Module
DIO Digital Input/Output
DMA Direct Memory Access
EIDE Enhanced IDE
EIST Enhanced Intel SpeedStep
Technology
FDD Floppy Disk Drive
FDC Floppy Disk Connector
FFIO Flexible File Input/Output
FIFO First In/First Out
FSB Front Side Bus
IrDA Infrared Data Association
S.M.A.R.T Self Monitoring Analysis and
Reporting Technology
SPD Serial Presence Detect
S/PDI Sony/Philips Digital Interface
SDRAM Synchronous Dynamic Random
Access Memory
SIR Serial Infrared
UART Universal Asynchronous
Receiver-transmitter
USB Universal Serial Bus
VGA Video Graphics Adapter
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Chapter
1

1 Introduction

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1.1 WAFER-LX Overview
The 3.5” WAFER-LX AMD LX-800 low power single board computer (SBC) is fully
equipped with advanced multi-mode I/Os. The WAFER-LX is designed for system
manufacturers, integrators, and VARs that want performance, reliability, and quality at a
reasonable price.
1.1.1 WAFER-LX Models
The WAFER-LX series has five models:
WAFER-LX-800-R10
WAFER-LX-WINXPE
WAFER-L
WAFER-LX-CENET050
WAFER-LX-CLIENT-XPE
WAFER-LX-CLIENT-CENET050
The specifications for the four models are show in Table 1-1.
WAFER-LX- 800-R10 WINXPE CENET050 CLIENT-XPE CLIENT-CENET050
AMD LX-800 CPU YES YES YES YES YES
SO-DIMM Memory* NO YES YES YES YES
CRT YES YES YES YES YES
LCD/LVDS YES YES YES YES YES
Dual LAN YES YES YES YES YES
SATA YES YES YES YES YES
Audio YES YES YES YES YES
IFM NO 512MB 32MB 512MB 64MB
WinXPE Image NO YES NO YES NO
WinCE Image NO NO YES NO YES
Thin Client Package NO NO NO YES YES
Table 1-1: WAFER-LX Model Specifications
*
The preinstalled memory is a 256MB DDR SO-DIMM memory module.
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1.1.2 WAFER-LX Applications
The WAFER-LX is designed for applications in the following areas:
Kiosks and Point of Sales
Restaurants
Human Machine Interface (HMI) applications
Marine, GPS and transportation applications
Financial, retail and kiosk applications
1.1.3 WAFER-LX Benefits
Some of the WAFER-LX benefits include:
Reduced hardware costs
WAFER-L
Reduced software costs
Reduced maintenance costs
Client crash prevention
Central resource control
Security protection
1.1.4 WAFER-LX Features
Some of the WAFER-LX features are listed below:
3.5” form factor
RoHS compliant
AMD LX-800 processor installed
Dual-independent display functionality
Low power consumption (6 Watts)
Two high performance 10/100 megabit Ethernet controllers on-board
Two SATA channels with transfer rates up to 150MB/s on-board
Four USB 2.0 devices on-board
Integrated audio
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1.2 WAFER-LX Overview
WAFER-L
Figure 1-1: WAFER-LX Overview
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Figure 1-2: WAFER-LX Solder Side Overview
1.2.1 WAFER-LX Connectors
The WAFER-LX has the following connectors on-board:
1 x AT power connector
1 x ATX power function connector
1 x Audio connector
1 x Battery connector
1 x Compact Flash (CF) connector (solder side)
1 x External LED connector
1 x Fan connector
1 x Floppy disk drive (FDD) connector
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1 x General purpose input/output (GPIO) connector
1 x IDE Interface connectors (44-pin)
1 x Inverter power connector
1 x Keyboard/mouse connector
1 x Parallel port connector
1 x PC/104 slot
1 x PC/104 power connector
1 x Reset button connector
1 x RS-232/422/485 serial port connector
2 x SATA connectors
1 x Suspend power input connector
1 x TFT LCD LVDS interface connector
1 x TFT LCD TFT interface connector
1 x USB connector
1 x SO-DIMM socket
The WAFER-LX has the following connectors on the board rear panel:
2 x Ethernet connectors
1 x Dual USB connector
1 x Serial port connector
1 x VGA connector
The WAFER-LX has the following on-board jumpers:
AT power select jumper
COM3 function select jumper
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1.2.2 Technical Specifications
WAFER-LX technical specifications are listed in Table 1-2. Detailed descriptions of each
specification can be found in Chapter 2 Detailed Specifications.
Specification WAFER-LX
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Form Factor
CPU
Southbridge Chipset
Display
TTL/LVDS
Memory
BIOS
SSD
Super I/O
Audio
3.5” form factor
AMD Geode™ LX 800 500Mhz
AMD Geode™ CS5536
CRT integrated in AMD Geode™ LX800
18-bit single channel TFT LCD
Supports one 1GB DDR 333/400 200-pin SO-DIMM
SDRAM module
Award BIOS
Compact Flash (CF)
W83627EHG
AC'97 Codec Realtek ALC203
LAN
COM
USB2.0
IDE
Floppy
Parallel Port
SATA
10/100 Base-T dual RTL8100C
Two RS-232
One RS-422/485
Four USB 1.1 or USB 2.0 devices supported
One 44-pin IDE connects to two Ultra ATA33/66/100
devices
One floppy disk drive connector
One LPT port connector
Two SATA connectors with transfer rates up to 150Mb/sec
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KB/MS
Watchdog Timer
Digital I/O
Fan connector
Expansion
Power Supply
Temperature
Humidity (operating)
Dimensions
Weight (GW/NW)
Table 1-2: Technical Specifications
One on-board keyboard/mouse connector
Software programmable 1-255 sec. by supper I/O
One GPIO connector
One CPU fan connector
One PC/104 slot
+5V ± 5% AT/ATX power support
0ºC - 60ºC
5%~95% non-condensing
145mm x 102mm
670g/230g
1.3 Operating System Packages
1.3.1 Windows XPE SP2 (350MB image size stored in a 512MB CF card)
1. Advance Set Top Box: The package includes the components required to
create the advanced Set-Top Box (ASTB). The package provides the
functionality of the basic set-top box and also supports DVD playback, DVR,
Web browsing, networking, universal serial bus (USB), terminal services, and
Windows Media Player.
2. Internet Explorer.
3. Net Framework 1.1.
4. EWF (Enhanced Write Filter).
5. CMD - Windows Command Processor.
6. Device Manager and Task Manager.
7. Video / audio and other board chipset drivers.
8. PS/2 keyboard / mouse drivers.
9. IDE Compact Flash/HDD/Flash Disk/CD-ROM support0.
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1.3.2 Windows CE 5.0 (around 22Mbyte, CF must > 32Mbyte)
1. Enterprise Web Pad (provides the starting point for a range of Web
Pad-based devices.)
2. IE 6.0, Media Player, Excel Viewer, Image Viewer, PDF viewer, PowerPoint
viewer, Word viewer, and WordPad.
3. Support hive-based registry.
4. SIP (Software-based Input Panel): SIP for Large Screens.
5. Microsoft Foundation Classes (MFC).
6. NET Compact Framework 2.0.
7. Standard SDK for Windows CE.
8. Transaction-Safe FAT File System (TFAT).
9. PCL Printer Driver.
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10. Devices drivers: IDE, CF card, CD-ROM, USB host, USB keyboard/ mouse
/storage, Ethernet, and serial ports. 0.
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Chapter
2

2 Detailed Specifications

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2.1 Overview
This chapter describes the specifications and on-board features of the WAFER-LX in
detail.
2.2 Dimensions
2.2.1 Board Dimensions
The dimensions of the board are listed below:
Length: 146.06mm
Width: 102mm
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Figure 2-1: WAFER-LX Dimensions (mm)
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2.2.2 External Interface Panel Dimensions
External interface panel dimensions are shown in Figure 2-2.
Figure 2-2: External Interface Panel Dimensions (mm)
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2.3 CPU Support
The WAFER-LX series motherboards all come with a preinstalled AMD Geode™ LX 800
500MHz CPU.
2.3.1 AMD Geode™ LX 800 500MHz Specifications
The specifications for the 500MHz AMD Geode™ LX 800 are listed below
x86/x87-compatible core
Processor frequency up to 500 MHZ
64K I/64K D L1 cache and 128K L2 cache
Split I/D cache/TLB (Translation Look-Aside Buffer)
64-bit DDR Memory interface up to 400MHz (LX 800), up to 333MHz (LX 700)
Integrated FPU that supports the Intel MMX® and AMD 3DNow!™
Technology instruction sets
9 GB/s internal GeodeLink™ Interface Unit (GLIU)
Security Block
o 128-bit AES (CBC/ECB) o True Random Number Generator
High-resolution CRT and TFT outputs (simultaneous operation)
o Support for High Definition (HD) and Standard Definition (SD) standards o Support 1920x1440 in CRT mode and 1600x1200 in TFT mode
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VESA 1.1 and 2.0 VIP/VDA support
0.13 micron process
481-terminal PBGA (Plastic Ball Grid Array) with internal heatspreader
2.3.2 AMD Geode™ LX 800 500MHz Power Management
The power management for the 500MHz AMD Geode™ LX 800 is listed below:
1.8W Typical (3.9W TDP) @ 500MHz
GeodeLink active hardware power management
Hardware support for standard ACPI software power management
I/O companion SUSP#/SUSPA# power controls
Lower power I/O
Wakeup on SMI/INTR
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2.4 System Chipset
The WAFER-LX series motherboards all have a preinstalled AMD Geode™ CS5536
system chipset. The system chipset features are listed below.
GeodeLink™ Interface Unit
o 64-bit, 66MHz operation o PCI VSM (Virtual System Module) that makes the interface transparent to
applications software and BIOS
o Programmable routing descriptors, use and activity monitors, and SSMI
(Synchronous System Management Interrupt)
ATA-6 Controller
o 100 MB/second IDE Controller in UDMA mode per the ATA-6
specification
o 5V interface
Flash Interface
o Multiplexed with IDE interface Connects to an array of industry standard
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NAND Flash and/or NOR Flash
USB Controller
o 4 USB ports o Supports both USB 1.1 and USB 2.0
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Audio Codec 97 (AC97) Controller
o AC97 specification v2.3 compliant interface to multiple audio codecs:
Serial In, Serial Out, Sync Out, Bit Clock In
o Legacy “PC Beep” support
Diverse Device
o 82xx Legacy Devices o IR Communication Port o System Management Bus (SMB) Controller o LPC (Low Pin Count) Port o General Purpose I/Os (GPIOs) o 8 Multi-Function General Purpose Timers (MFGPTs) o Real-Time Clock (RTC) with CMOS RAM
2.5 Data Flow
Figure 2-3 shows the data flow between the two on-board chipsets and other components
installed on the motherboard and described in the following sections of this chapter.
o Power Management Controller o ACPI v2.0 compliant
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Figure 2-3: Data Flow Block Diagram
2.6 Graphics Support
The Geode LX processor’s Graphics Processor is a BitBLT/vector engine that supports
pattern generation, source expansion, pattern/source transparency, 256 ternary raster
operations, alpha blenders to support alpha- BLTs, incorporated BLT FIFOs, a GeodeLink
interface and the ability to throttle BLTs according to video timing. New features added to
the Graphics Processor include:
Command buffer interface
Hardware accelerated rotation BLTs
Color depth conversion
Paletized color
Full 8x8 color pattern buffer
Separate base addresses for all channels
Monochrome inversion
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Table 2-1: Geode LX Graphics Features lists a complete list of Geode LX graphics
features. For more details, please refer to the AMD website or the Geode LX series data
book available from AMD.
Feature AMD Geode™ LX Processor
Color Depth 8, 16, 32 bpp (A) RGB 4 and 8-bit indexed
ROPs 256 (2-src, dest and pattern)
BLT Buffers FIFOs in Graphics Processor
BLT Splitting Managed by hardware
Video Synchronized BLT/Vector Throttle by VBLANK
Bresenham Lines Yes
Patterned (stippled) Lines Yes
Screen to Screen BLT Yes
Screen to Screen BLT with mono expansion Yes
Memory to Screen BLT Yes (throttled rep movs writes)
Accelerated Text No
Pattern Size (Mono) 8x8 pixels
Pattern Size (Color) 8x8 pixels
Monochrome Pattern Yes (with inversion)
Dithered Pattern (4 color) No
Color Pattern 8, 16, 32 bpp
Transparent Pattern Monochrome
Solid Fill Yes
Pattern Fill Yes
Transparent Source Monochrome
Color Key Source Transparency Y with mask
Variable Source Stride Yes
Variable Destination Stride Yes
Destination Write Bursting Yes
Selectable BLT Direction Vertical and Horizontal
Alpha BLT
VGA Support Decodes VGA Register
Pipeline Depth Unlimited
Accelerated Rotation BLT 8, 16, 32 bpp
Yes (constant α, α/pix, or sep. α channel)
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Color Depth Conversion 5:6:5, 1:5:5:5, 4:4:4:4, 8:8:8:8
Table 2-1: Geode LX Graphics Features
2.7 Memory Support
The WAFER-LX has one 200-pin DDR SO-DIMM SDRAM socket that supports one 333
MHz or 400MHz DDR SO-DIMM memory module with a maximum capacity of 1GB.
2.8 PCI Bus Interface Support
The PCI bridge on the WAFER-LX has the following features:
33MHz Revision 2.2 is implemented
Maximum throughput: 133MB/sec
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PCI and GLIU interface control
Read and write FIFOs
PCI
2.9 Ethernet Controller Specifications
2.9.1 Overview
The Realtek RTL8100C(L) is a highly integrated and cost-effective single-chip Fast
Ethernet controller. It is enhanced with an ACPI (Advanced Configuration Power Interface)
management function for PCI in order to provide efficient power management for
advanced operating systems with OSPM (Operating System Directed Power
Management).
The RTL8100C(L) also supports remote wake-up (including AMD Magic Packet™ and
Microsoft® Wake-up frame) to increase cost-efficiency in network maintenance and
management. It is an ideal solution for notebook/motherboard-embedded network
designs.
2.9.2 Features
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Integrates Fast Ethernet MAC, physical chip, and transceiver onto a single
chip
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10Mbps and 100Mbps operation
Supports 10Mbps and 100Mbps N-way auto-negotiation
Supports 25MHz Crystal or 25MHz OSC as the internal clock source
Complies with PC99/PC2001 standards
Supports ACPI power management
Provides PCI bus master data transfer
Provides PCI memory space or I/O space mapped data transfer
Supports PCI clock speed of 16.75MHz-40MHz
Advanced power saving mode
Supports Wake-on-LAN and remote wake-up (AMD Magic Packet™, Link
Change, and Microsoft® Wake-up frame)
Half/Full duplex capability
Supports Full Duplex Flow Control (IEEE 802.3x)
Provides interface to 93C46 EEPROM to store resource configuration and ID
parameters
Provides PCI clock run pin
Provides LED pins for network operation status indication
2.5/3.3V power supply with 5V tolerant I/Os
2.10 Drive Interfaces
The WAFER-LX can support the following drive interfaces.
2 x SATA drives
2 x IDE devices
1 x FDD
1 x CF I or CF II card
2.10.1 SATA Drives
The WAFER-LX supports two, first generation SATA drives with transfer rates of up to
150Mb/s
2.10.2 IDE HDD Interfaces
The WAFER-LX system chipset IDE controller supports up to two HDDs with the following
specifications:
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Supports PIO IDE transfers up to 16MB/s
Supports the following Ultra ATA devices:
o Ultra ATA/100, with data transfer rates up to 100MB/s o Ultra ATA/66, with data transfer rates up to 66MB/s o Ultra ATA/33, with data transfer rates up to 33MB/s
2.10.3 Floppy Disk Drive (FDD)
The WAFER-LX supports a single FDD. The following FDD formats are compatible with
the board.
5.25”: 360KB and 1.2MB
3.5”: 720KB, 1.44MB and 2.88MB
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2.10.4 Compact Flash Support
A standard CF I or CF II card can be inserted into the compact flash slot on the solder side
of the WAFER-LX PCB.
2.11 Serial Ports
The WAFER-LX has two high-speed UART serial ports, configured as COM1 and COM2.
The serial ports have the following specifications.
16C550 UART with 16-byte FIFO buffer
115.2Kbps transmission rate
COM2 can be configured as RS-232, RS-422 or RS-485.
2.12 Real Time Clock
256-byte battery backed CMOS RAM
2.13 System Monitoring
The WAFER-LX is capable of self-monitoring various aspects of its operating status
including:
CPU, chipset, and battery voltage, +3.3V, +5V, and +12V
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RPM of cooling fans
CPU and board temperatures (by the corresponding embedded sensors)
2.14 USB Interfaces
The WAFER-LX has four USB interfaces, two internal (on one pin header connector) and
two external. The USB interfaces support USB 2.0.
2.15 BIOS
The WAFER-LX uses a licensed copy of AWARD BIOS. The features of the flash BIOS
used are listed below:
SMIBIOS (DMI) compliant
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Console redirection function support
PXE (Pre-Boot Execution Environment) support
USB booting support
2.16 Operating Temperature and Temperature Control
The maximum and minimum operating temperatures for the WAFER-LX are listed below.
Minimum Operating Temperature: 0ºC (32°F)
Maximum Operating Temperature: 60°C (140°F)
A cooling fan and heat sink must be installed on the CPU. Thermal paste must be
smeared on the lower side of the heat sink before it is mounted on the CPU. Heat sinks
are also mounted on the northbridge and southbridge chipsets to ensure the operating
temperature of these chips remain low.
2.17 Audio Codec
The WAFER-LX has an integrated RealTek ALC203 codec. The RealTek ALC203 is a
20-bit DAC and 18-bit ADC full-duplex AC'97 2.3 compatible stereo audio CODEC
designed for PC multimedia systems, including host/soft audio, and AMR/CNR based
designs. The codec meets performance requirements for audio on PC99/2001 systems
Single chip with high S/N ratio (>100 dB)
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Meets performance requirements for audio on PC2001 systems
Meets Microsoft WHQL/WLP 2.0 audio requirements
20-bit DAC and 18-bit ADC resolution
18-bit Stereo full-duplex CODEC with independent and variable sampling rate
Complies with AC'97 2.3 specifications
o LINE/HP-OUT, MIC-IN and LINE-IN sensing o 14.318MHz -> 24.576MHz PLL saves crystal o 12.288MHz BITCLK input can be consumed o Integrated PCBEEP generator to save buzzer o Interrupt capability o Page registers and Analog Plug & Play
Support of S/PDIF out is fully compliant with AC'97 rev2.3 specifications
Three analog line-level stereo inputs with 5-bit volume control: LINE_IN, CD,
AUX
High quality differential CD input
Two analog line-level mono input: PCBEEP, PHONE-IN
Supports double sampling rate (96KHz) of DVD audio playback
Two software selectable MIC inputs
+6/12/20/30dB boost preamplifier for MIC input
Stereo output with 6-bit volume control
Mono output with 5-bit volume control
Headphone output with 50mW/20Ohm amplifier
3D Stereo Enhancement
Multiple CODEC extension capability
External Amplifier Power Down (EAPD) capability
Power management and enhanced power saving features
Stereo MIC record for AEC/BF application
DC Voltage volume control
Auxiliary power to support Power Off CD
Adjustable VREFOUT control
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2 GPIO pins with smart GPIO volume control
2 Universal Audio Jacks (UAJ)® for front panel
Supports 32K/44.1K/48K/96KHz S/PDIF output
Supports 32K/44.1K/48KHz S/PDIF input
Power support: Digital: 3.3V; Analog: 3.3V/5V
Standard 48-Pin LQFP Package
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EAX™ 1.0 & 2.0 compatible
Direct Sound 3D™ compatible
A3D™ compatible
I3DL2 compatible
HRTF 3D Positional Audio
Sensaura™ 3D Enhancement (optional)
10 Bands of Software Equalizer
Voice Cancellation and Key Shifting in Kareoke mode
AVRack® Media Player
2.18 Power Consumption
Table 2-2 shows the power consumption parameters for the WAFER-LX when an AMD
Geode LX 800 processor is running with one 1GB DDR400 memory module and running
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3D Mark.
Voltage Current
+5V 2.5A
Table 2-2: Power Consumption
2.19 Packaged Contents and Optional Accessory Items
2.19.1 Package Contents
The WAFER-LX is shipped with the following components.
1x WAFER-LX800 single board computer
1 x Mini jumper pack
1 x IDE flat cable 44P/44P
2 x SATA cables
1 x SATA power cable
1 x Audio cable
1 x KB/MS cable
1 x USB cable
1 x RS-232 cable
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1x Utility CD
1x Quick Installation Guide
2.19.2 Optional Accessory Items
The items shown in the list below are optional accessory items are purchased separately.
LPT cable
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Chapter
3
3 Connectors and
Jumpers
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3.1 Peripheral Interface Connectors
Section 3.1.2 shows peripheral interface connector locations. Section 3.1.2 lists all the
peripheral interface connectors seen in Section 3.1.2.
3.1.1 WAFER-LX Layout
Figure 3-1 shows the on-board peripheral connectors, rear panel peripheral connectors
and on-board jumpers.
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Figure 3-1: Connector and Jumper Locations
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Figure 3-2: Connector and Jumper Locations (Solder Side)
3.1.2 Peripheral Interface Connectors
Table 3-1 shows a list of the peripheral interface connectors on the WAFER-LX. Detailed
descriptions of these connectors can be found in Section 0 on page 43.
Connector Type Label
AT power connector 4-pin header CN1
ATX power function connector 3-pin header CN2
ATX power button connector 2-pin header CN13
Audio connector 10-pin header CN8
Battery connector 2-pin header CN7
Compact Flash (CF) connector 50-pin header CN32
Fan connector 3-pin header CN4
Floppy Disk connector 26-pin header CN31
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GPIO connector 10-pin header CN14
IDE Interface connector 44-pin header CN30
Inverter power connector 5-pin header CN3
Keyboard/Mouse connector 6-pin header CN17
LED connector 6-pin header CN5
Parallel port connector 26-pin header CN15
PC/104 power input connector 3-pin header CN11
PC/104 slot 104-pin slot CN10
Reset button connector 2-pin header CN12
RS-232/422/485 serial port connector 14-pin header CN16
SATA drive connector (150MB/s) 7-pin SATA connector CN23
SATA drive connector (150MB/s) 7-pin SATA connector CN25
TFTLCD LVDS connector 20-pin header CN29
TFT LCD TTL connector 40-pin header CN28
USB connector (USB 1.1 and USB 2.0) 8-pin header CN24
Table 3-1: Peripheral Interface Connectors
3.1.3 External Interface Panel Connectors
Table 3-2 lists the rear panel connectors on the WAFER-LX. Detailed descriptions of
these connectors can be found in Section 3.3 on page 71.
Connector Type Label
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Ethernet connector RJ-45 CN20
Ethernet connector RJ-45 CN21
RS-232 serial port connector 9-pin male CN22
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USB port USB port CN19
VGA port connector 15-pin female CN26
Table 3-2: Rear Panel Connectors
3.1.4 On-board Jumpers
NOTE:
A jumper is a metal bridge that is used to
close an electrical circuit. It consists of
two metal pins and a small metal clip
(often protected by a plastic cover) that
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slides over the pins to connect them.
To CLOSE/SHORT a jumper mean
connecting the pins of the jumper with
the plastic clip and to OPEN a jumper
means removing the plastic clip from a
jumper.
Table 3-3 lists the on-board jumpers. Detailed descriptions of these jumpers can be found
in Section 4.5 on page 84.
Description Label Type
AT power select JP1 2-pin header
COM 2 mode setup JP2 3-pin header
Clear CMOS CN7 2-pin header
s
Jumper
Table 3-3: On-board Jumpers
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3.2 Internal Peripheral Connectors
Internal peripheral connectors are found on the motherboard and are only accessible
when the motherboard is outside of the chassis. This section has complete descriptions of
all the internal, peripheral connectors on the WAFER-LX.
3.2.1 AT Power Connector
CN Label: CN1
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CN Type:
CN Location: See Figure 3-3
CN Pinouts: See Table 3-4
The AT power connector is connected to an AT power source that powers the system.
4-pin AT power connector (1x4)
Figure 3-3: AT Power Connector Location
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PIN NO. DESCRIPTION
1 +5V
2 GND
3 GND
4 +12V
Table 3-4: AT Power Connector Pinouts
3.2.2 ATX Power Connector
CN Label: CN2
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CN Type:
3-pin header (1x3)
CN Location: See Figure 3-4
CN Pinouts: See Table 3-5
The ATX Power connector (CN2) connects an ATX or AT power supply connector.
Figure 3-4: ATX Power Connector Location
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PIN NO. DESCRIPTION
1 +5V_SB
2 NC (v1.10)
3 PS_ON
Table 3-5: ATX Power Connector Pinouts
3.2.3 ATX Power Button Connector
CN Label: CN13
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CN Type:
1-pin header (1x2)
CN Location: See Figure 3-5
CN Pinouts: See Table 3-6
The ATX power button connector to a power switch installed on the system chassis.
Figure 3-5: ATX Power Button Connector
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PIN NO. DESCRIPTION
1 PWRBTN#
2 GND
Table 3-6: ATX Power Button Connector Pinouts
3.2.4 Audio Connector
CN Label: CN8
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CN Type:
CN Location: See Figure 3-6
CN Pinouts: See Table 3-7
The audio connector is connected to an on-board codec. An external audio connector kit
can be connected to the connector to provide sound input and output.
10-pin header (2x5)
Figure 3-6: Audio Connector Location
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PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 Line Out Right 2 Line In Right
3 GND 4 GND
5 Line Out Left 6 Line In Left
7 GND 8 GND
9 MIC In 10 N/C
Table 3-7: Audio Connector Pinouts
3.2.5 Battery Connector
CN Label: CN7
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CN Type:
CN Location: See Figure 3-7
CN Pinouts: See Table 3-8
The battery connector is connected to a backup battery. The battery connector is also
used to reset the CMOS memory if the incorrect BIOS settings have been made and the
system cannot boot up.
2-pin header (1x2)
Figure 3-7: Battery Connector Location
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PIN NO. DESCRIPTION
1 Battery+
2 Ground
Table 3-8: Battery Connector Pinouts
3.2.6 Compact Flash Connector
CN Label: CN32 (solder side)
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CN Type:
50-pin header (2x25)
CN Location: See Figure 3-8
CN Pinouts: See Table 3-9
A compact flash memory module is inserted to the Compact Flash 2 connector (J2).
Jumper 2 (JP2) configures the compact flash drive as either a slave or master device.
Figure 3-8: Compact Flash Connector Location (Solder Side)
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PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GROUND 26 VCC-IN CHECK1
2 DATA 3 27 DATA 11
3 DATA 4 28 DATA 12
4 DATA 5 29 DATA 13
5 DATA 6 30 DATA 14
6 DATA 7 31 DATA 15
7 HDC_CS0# 32 HDC_CS1
8 N/C 33 N/C
9 GROUND 34 IOR#
10 N/C 35 IOW#
11 N/C 36 VCC_COM
12 N/C 37 IRQ15
13 VCC_COM 38 VCC_COM
14 N/C 39 CSEL
15 N/C 40 N/C
16 N/C 41 HDD_RESET
17 N/C 42 IORDY
18 SA2 43 SDREQ
19 SA1 44 SDACK#
20 SA0 45 HDD_ACTIVE#
21 DATA 0 46 66DET
22 DATA 1 47 DATA 8
23 DATA 2 48 DATA 9
24 N/C 49 DATA 10
25 VCC-IN CHECK2 50 GROUND
Table 3-9: Compact Flash Connector Pinouts
3.2.7 Fan Connector
CN Label: CN4
CN Type:
CN Location: See Figure 3-9
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3-pin header
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CN Pinouts: See Table 3-10
The cooling fan connector provides a 12V, 500mA current to a system cooling fan. The
connector has a "rotation" pin to get rotation signals from fans and notify the system so the
system BIOS can recognize the fan speed. Please note that only specified fans can issue
the rotation signals.
Figure 3-9: Fan Connector Location
PIN NO. DESCRIPTION
1 Fan Speed Detect
2 +5V
3 GND
Table 3-10: Fan Connector Pinouts
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3.2.8 Floppy Disk Connector
CN Label: CN31 (solder side)
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CN Type:
CN Location: See Figure 3-10
CN Pinouts: See Table 3-11
The floppy disk connector (FDD1) is connected to a floppy disk drive.
26-pin header (1 x 26)
Figure 3-10: FDD Connector Location
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PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 +5V 14 STEP#
2 INDEX# 15 GND
3 +5V 16 WDATA#
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4 DSA# 17 GND
5 +5V 18 WGATE#
6 DSKCHG# 19 GND
7 NC 20 TRACK0#
8 NC 21 GND
9 NC 22 WP#
10 MOTO0# 23 GND
11 NC 24 RDATA#
12 DIR# 25 GND
13 NC 26 HEAD#
Table 3-11: FDD Connector Pinouts
3.2.9 GPIO Connector
CN Label: CN14
CN Type:
CN Location: See Figure 3-11
CN Pinouts: See Table 3-12
The General Purpose Input Output (GPIO) connector can be connected to external I/O
control devices including sensors, lights, alarms and switches.
10-pin header (2x5)
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Figure 3-11: GPIO Connector Location
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GND 2 5V
3 GPO0 4 GPO1
5 GPO2 6 GPO3
7 GPI0 8 GPI1
9 GPI2 10 GPI3
Table 3-12: GPIO Connector Pinouts
3.2.10 IDE Connector
CN Label: CN30
CN Type:
CN Location: See Figure 3-12
44pin header (2x22)
One 44-pin IDE device connector on the WAFER-LX motherboard supports connectivity to
Ultra ATA/33/66/100 IDE devices with data transfer rates up to 100MB/s.
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CN Pinouts: See Table 3-13
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Figure 3-12: IDE Device Connector Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 RESET# 2 GROUND
3 DATA 7 4 DATA 8
5 DATA 6 6 DATA 9
7 DATA 5 8 DATA 10
9 DATA 4 10 DATA 11
11 DATA 3 12 DATA 12
13 DATA 2 14 DATA 13
15 DATA 1 16 DATA 14
17 DATA 0 18 DATA 15
19 GROUND 20 N/C
21 IDE DRQ 22 GROUND
23 IOW# 24 GROUND
25 IOR# 26 GROUND
27 IDE CHRDY 28 GROUND
29 IDE DACK 30 GROUND–DEFAULT
31 INTERRUPT 32 N/C
33 SA1 34 N/C
35 SA0 36 SA2
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37 HDC CS0# 38 HDC CS1#
39 HDD ACTIVE# 40 GROUND
41 VCC 42 VCC
43 GROUND 44 N/C
Table 3-13: Secondary IDE Connector Pinouts
3.2.11 Inverter Power Connector
CN Label: CN3
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CN Type:
5-pin header (1x5)
CN Location: See Figure 3-13
CN Pinouts: See Table 3-14
The inverter connector is connected to the LCD backlight.
Figure 3-13: Inverter Connector Locations
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PIN NO. DESCRIPTION
1 ADJ (Def: GND)
2 GND
3 12V
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4 GND
5 BL_EN
Table 3-14: Inverter Power Connector Pinouts
3.2.12 Keyboard/Mouse Connector
CN Label: CN17
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CN Type:
6-pin header (1x6)
CN Location: See Figure 3-14
CN Pinouts: See Table 3-15
The keyboard and mouse connector can be connected to a standard PS/2 cable or PS/2
Y-cable to add keyboard and mouse functionality to the system.
Figure 3-14: Keyboard/Mouse Connector Location
PIN NO. DESCRIPTION
1 +5V
2 MS DATA
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3 MS CLK
4 KB DATA
5 KB CLK
6 GND
Table 3-15: Keyboard/Mouse Connector Pinouts
3.2.13 LED Connector
CN Label: CN5
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CN Type:
CN Location: See Figure 3-15
CN Pinouts: See Table 3-16
The LED connector (CN5) connects to an HDD indicator LED and a power LED on the
system chassis to inform the user about HDD activity and the power on/off status of the
system.
6-pin header (1x6)
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Figure 3-15: LED Connector Locations
PIN NO. DESCRIPTION
1 +5V
2 GND
3 Power LED+
4 Power LED-
5 HDD LED+
6 HDD LED-
Table 3-16: LED Connector Pinouts
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3.2.14 Print Port Connector
CN Label: CN15
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CN Type:
26-pin header (2 x 13)
CN Location: See Figure 3-16
CN Pinouts: See Table 3-17
The WAFER-LX has one print port connector that can be connected directly to a printer.
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Figure 3-16:Print Port Connector Location
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 STB# 2 AFD#
3 PD0 4 ERR#
5 PD1 6 INIT#
7 PD2 8 SLIN#
9 PD3 10 GND
11 PD4 12 GND
13 PD5 14 GND
15 PD6 16 GND
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17 PD7 18 GND
19 ACK# 20 GND
21 BUSY 22 GND
23 PE 24 GND
25 SLCT 26 N/C
Table 3-17: Parallel Port Connector Pinouts
3.2.15 PC/104 Power Input Connector
CN Label: CN11
WAFER-L
CN Type:
CN Location: See Figure 3-17
CN Pinouts: See Table 3-18
The PC/104 power input connector provides power to the PC/104 expansion module
installed on the PC/104 slot.
3-pin header (1x3)
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Figure 3-17: PC/104 Power Input Connector Pinouts
PIN NO. DESCRIPTION
1 -5V
2 GND
3 -12V
Table 3-18: PC/104 Power Input Connector Pinouts
3.2.16 PC/104 Slot
CN Label: CN10
CN Type:
CN Location: See Figure 3-18
104-pin PC/104 slot
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CN Pinouts: See Table 3-19
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The PC/104 slot enables a PC/104 compatible expansion module to be connected to the
board.
Figure 3-18: PC/104 Slot Location
Pin No. Column A Column B Column C Column D
1
2
3
4
5
6
7
8
9
10
IOCHK- GROUND GROUND GROUND
SD7 RSTDRV SBHE- MCS16-
SD6 +5V SA23 IOCS16-
SD5 IRQ9 SA22 IRQ10
SD4 -5V SA21 IRQ11
SD3 DREQ2 SA20 IRQ12
SD2 -12V SA19 IRQ15
SD1 ZWS- SA18 IRQ14
SD0 +12V SA17 DACK0-
IOCHRDY GROUND MEMR- DREQ0
11
12
13
AEN SMEMW- MEMW- DACK5-
SA19 SMEMR- SD8 DRREQ5
SA18 IOW- SD9 DACK6-
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14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
SA17 IOR-
SA16 DACK3- SD11 DACK7-
SA15 DREQ3 SD12 DREQ7
SA14 DACK1- SD13 +5V
SA13 DREQ1 SD14 MASTER-
SA12 REFRESH- SD15 GROUND
SA11 ISACLK NC GROUND
SA10 IRQ7
SA9 IRQ6
SA8 IRQ5
SA7 IRQ4
SA6 IRQ3
SA5 DACK2-
SA4 TC
SA3 BALE
SD10
DREQ6
29
30
31 SA0 GROUND
32 GROUND GROUND
SA2 +5V
SA1 ISA_OSC
Table 3-19: PC/104 Slot Connector Pinouts
3.2.17 Reset Button Connector
CN Label: CN12
CN Type:
CN Location: See Figure 3-19
CN Pinouts: See Table 3-20
The reset button connector is connected to the reset button on the external chassis.
2-pin header (1x2)
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Figure 3-19: Reset Button Connector Locations
PIN NO. DESCRIPTION
1 Reset+
2 Ground
Table 3-20: Reset Button Connector Pinouts
3.2.18 RS-232/422/485 Cable Connectors
CN Label: CN16
CN Type:
CN Location: See Figure 3-20
CN Pinouts: See Table 3-21
14-pin header (2x7)
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The COM2/COM3 serial port combination connectors connect to RS-232 serial port
devices. The COM2 port is located on pin 1 to pin 10 and the COM3 is located on pin 11 to
pin 14 of CN16.
Figure 3-20: RS-232 Serial Port Connector Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 DCD# 2 DSR#
3 RXD 4 RTS#
5 TXD 6 CTS#
7 DTR# 8 RI#/Vout
9 GND 10 GND
11 TxD485+ 12 TxD485-
13 RxD485+ 14 RxD485-
Table 3-21: RS-232/422/485 Serial Port Connector Pinouts
3.2.19 SATA Drive Connectors
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CN Label: CN23 and CN25
CN Type:
7-pin SATA drive connectors
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CN Location: See Figure 3-24
CN Pinouts: See Table 3-25
The two SATA drive connectors are connected to two first generation SATA drives. First
generation SATA drives transfer data at speeds as high as 150MB/s.
Figure 3-21: SATA Drive Connector Locations
PIN NO. DESCRIPTION
1 GND
2 TX+
3 TX-
4 GND
5 RX-
6 RX+
7 GND
Table 3-22: SATA Drive Connector Pinouts
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3.2.20 TFT LCD LVDS Connector
CN Label: CN29
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CN Type:
CN Location: See Figure 3-22
CN Pinouts: See Table 3-23
The TFT LCD LVDS can be connected to a TFT LCD screen directly.
20-pin header (2x10)
Figure 3-22: TFT LCD LVDS Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GND 2 GND
3 D0+ 4 D0-
5 D1+ 6 D1-
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7 D2+ 8 D2-
9 CLK+ 10
11 NC 12 NC
13 GND 14 GND
15 NC 16 NC
17 LCD_Vcc 18 LCD_Vcc
19 LCD_Vcc 20 LCD_Vcc
CLK-
Table 3-23: TFT LCD LVDS Port Connector Pinouts
3.2.21 TFT LCD TTL Connector
CN Label: CN28
CN Type:
CN Location: See Figure 3-23
CN Pinouts: See Table 3-24
40-pin header (2x20)
The TFT LCD LVDS can be connected to a TFT LCD screen directly.
Figure 3-23: TFT LCD TTL Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 LCD_Vcc 2 LCD_Vcc
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3 GND 4 GND
5 LCD_Vcc 6 LCD_Vcc
7 NC 8 GND
9 B0 10 B1
11 B2 12 B3
13 B4 14 B5
15 B6 16 B7
17 G0 18 G1
19 G2 20 G3
21 G4 22 G5
23 G6 24 G7
25 R0 26 R1
26 R2 28 R3
29 R4 30 R5
31 R6 32 R7
33 GND 34 GND
35 CLK 36 VSYNC
37 LCD_EN 38 HSYNC
39 NC 40 DISP_EN
Table 3-24: TFT LCD TTL Port Connector Pinouts
3.2.22 Internal USB Connectors
CN Label: CN24
CN Type:
CN Location: See Figure 3-24
CN Pinouts: See Table 3-25
8-pin header (2x4)
The 2x4 USB pin connector provides connectivity to two USB 2.0 devices. The USB ports
are used for I/O bus expansion.
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Figure 3-24: USB Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 VCC_USB 2 GND
3 DATA3- 4 DATA4+
5 DATA3+ 6 DATA4-
7 GND 8 VCC_USB
Table 3-25: USB Port Connector Pinouts
3.3 External Interface Connectors
3.3.1 External Interface Connector Overview
Figure 3-25 shows the WAFER-LX motherboard external interface connectors. The
WAFER-LX on-board external interface connectors are listed below and shown in Figure
3-25:
1 x USB combo port
2 x Ethernet connector
1 x Serial communications port
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1 x VGA port
Figure 3-25: WAFER-LX On-board External Interface Connectors
3.3.2 USB Combo Port
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CN Label:
CN Type:
CN Location: See Figure 3-25
CN Pinouts:
The USB combo port provides connectivity to additional USB devices through an adapter
cable. Various adapters may come with USB ports on a slot bracket or ports that can be
attached to D-SUB openings on a chassis. USB devices connect directly to the USB
connectors on the rear panel.
PIN DESCRIPTION PIN DESCRIPTION
1 VCC_USB 5 VCC_USB
2 DATA1- 6 DATA2-
3 DATA1+ 7 DATA2+
4 GND 8 GND
CN19

USB Combo port

See Table 3-26
Table 3-26: CN19 Connector Pinouts
3.3.3 Ethernet Connector
CN Label: CN20 and CN 21
CN Type:
CN Location: See Figure 3-25
CN Pinouts:
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RJ-45
See Table 3-27
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A 10/100 Megabit connection can be made between the Ethernet connector and a Local
Area Network (LAN) through a network hub.
PIN DESCRIPTION PIN DESCRIPTION
1 TX+ 2 TX-
3 RX+ 4 NC
5 NC 6 RX-
7 NC 8 NC
Table 3-27: J7 Connector Pinouts
Figure 3-26: J7 Connector
The RJ-45 Ethernet connector has two status LEDs, one green and one yellow. The green
LED indicates activity on the port and the yellow LED indicates the port is linked.
SPEED LED LINK LED
Status Description Status Description
GREEN ON: 100MB
OFF: 10MB
Table 3-28: J7 Connector LEDs
YELLOW ON: Linked
Flashing: Activity
3.3.4 Serial Communications COM 1 and COM2 Connector
CN Label:
CN Type:
CN22
RS-232 serial connector
CN Location: See Figure 3-25
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CN Pinouts: See Table 3-29 and Figure 3-27
The RS-232 serial connector provides serial connection in the RS-232 mode.
PIN DESCRIPTION PIN DESCRIPTION
1 DCD1 2 RXD1
3 TXD1 4 DTR1
5 GND 6 DSR1
7 RTS1 8 CTS1
9 COM_RI1
Table 3-29: COM1 Pinouts
Figure 3-27: COM1 Pinout Locations
3.3.5 VGA Connector
CN Label: CN26
CN Type:
CN Location: See Figure 3-25
CN Pinouts: See Figure 3-28 and Table 3-30
The standard 15-pin female VGA connector connects to a CRT or LCD monitor.
See VGA Connector
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PIN DESCRIPTION PIN DESCRIPTION PIN DESCRIPTION
1 RED 6 GROUND 11 NC
2 GREEN 7 GROUND 12 DDCDAT
3 BLUE 8 GROUND 13 HSYNC
4 NC 9 NC 14 VSYNC
5 GROUND 10 GROUND 15 DDCCLK
Table 3-30: VGA1 Connector Pinouts
Figure 3-28: VGA1 Connector
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THIS PAGE IS INTENTIONALLY LEFT BLANK
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Chapter
4
4 Installation and
Configuration
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4.1 Anti-static Precautions
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER-LX. (Dry climates are especially susceptible to ESD.) It is therefore
critical that whenever the WAFER-LX (or any other electrical component) is handled, the
following anti-static precautions are strictly adhered to.
Wear an anti-static wrist band: - Wearing a simple anti-static wrist band can
help to prevent ESD from damaging the board.
Self-grounding:- Before handling the board touch any grounded conducting
material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.
4.2 Installation Considerations
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NOTE:
The following installation notices and installation considerations should be
read and understood before the motherboard is installed. All installation
notices pertaining to the installation of the motherboard should be strictly
adhered to. Failing to adhere to these precautions may lead to severe
damage of the motherboard and injury to the person installing the
motherboard.
4.2.1 Installation Notices
Before and during the installation of the WAFER-LX, please do the following:
Read the user manual:
o The user manual provides a complete description of the WAFER-LX,
installation instructions and configuration options.
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Wear an electrostatic discharge cuff (ESD):
o Electronic components are easily damaged by ESD. Wearing an ESD cuff
removes ESD from the body and helps prevent ESD damage.
Place the motherboard on an antistatic pad:
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o When installing or configuring the motherboard, place it on an antistatic
pad. This helps to prevent potential ESD damage.
Turn off all power to the WAFER-LX:
o When working with the motherboard, make sure that it is disconnected
from all power supplies and that no electricity is being fed into the system.
Before and during the installation of the WAFER-LX DO NOT:
remove any of the stickers on the PCB board. These stickers are required for
warranty validation.
use the product before verifying all the cables and power connectors are
properly connected.
allow screws to come in contact with the PCB circuit, connector pins, or its
components.
4.3 Unpacking
NOTE:
If any of the items listed below are missing when the WAFER-LX is
unpacked, do not proceed with the installation and contact the WAFER-LX
reseller or vendor.
4.3.1 Unpacking Precautions
Before installing the WAFER-LX, unpack the motherboard. Some components on
WAFER-LX are very sensitive to static electricity and can be damaged by a sudden rush
of power. To protect it from being damaged, follow these precautions:
The user should ground them self to remove any static charge before
touching the WAFER-LX. To do so wear a grounded wrist strap at all times or
frequently touch any conducting materials that is connected to the ground.
Handle the WAFER-LX by its edges. Do not touch the IC chips, leads or
circuitry if not necessary.
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Do not place a PCB on top of an anti-static bag. Only the inside of the bag is safe from
static discharge.
4.3.2 Checklist
When unpacking the WAFER-LX, please make sure that the package contains the
following items.
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1x WAFER-LX800 single board computer
1 x Mini jumper pack
1 x IDE flat cable 44P/44P
2 x SATA cables
1 x SATA power cable
1 x Audio cable
1 x KB/MS cable
1 x USB cable
1 x RS-232 cable
1x Utility CD
1x Quick Installation GuideIf one or more of these items are missing, please
contact the reseller or vendor the WAFER-LX was purchased from and do not proceed
any further with the installation.
4.4 WAFER-LX Motherboard Installation
WARNING!
1. Never run the motherboard without an appropriate heatsink and cooler
that can be ordered from IEI Technology or purchased separately.
2. Be sure to use the CPU 12V power connector (CN10007) for the CPU
power.
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WARNING!
Please note that the installation instructions described in this manual should
be carefully followed in order to avoid damage to the motherboard components
and injury to the user.
WARNING!
When installing electronic components onto the motherboard always take the
anti-static precautions listed above in order to prevent ESD damage to the
motherboard and other electronic components like the CPU and DIMM
modules
The following components must be installed onto the motherboard or connected to the
motherboard during the installation process.
NOTE:
Some WAFER-LX models already have preinstalled CPUs. If the
motherboard has a preinstalled CPU then the following section on CPU
installation can be skipped.
DIMM modules
Peripheral device connection
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4.4.1 DIMM Module Installation
4.4.1.1 Purchasing the Memory Module
When purchasing SO-DIMM modules, the following considerations should be taken into
account:
The SO-DIMM socket can support a memory chip with a maximum size of
1GB
The SO-DIMM socket supports SDRAM DIMM speeds of 333MHz and
400MHz
4.4.1.2 DIMM Module Installation
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The WAFER-LX motherboard has two DDR SDRAM DIMM sockets. To install the DIMM
modules, follow the instructions below.
Step 1:
Step 2:
Step 3:
Step 4:
Locate the SO-DIMM module connector.
Push the SO-DIMM chip into the socket at an angle. (See Figure 4-1)
Gently pull the arms of the SO-DIMM socket out and push the rear of the
SO-DIMM module down. (See Figure 4-1)
Release the arms on the SO-DIMM socket. They clip into place and secure the
SO-DIMM module in the socket. Step 0:
Figure 4-1: SO-DIMM Module Installation
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4.4.2 Peripheral Device Connection
Cables provided by IEI that connect peripheral devices to the motherboard are listed in
Table 4-1. Cables not included in the kit must be separately purchased.
Quantity Type
1 Audio cable
1 IDE flat cable 44P/44P
2 SATA cables
1 SATA power cable
1 RS-232 cable
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1 USB cable
Table 4-1: IEI Provided Cables
4.4.2.1 IDE Disk Drive Connector (IDE1)
The cable used to connect the ,otherboard to the IDE HDD is a standard 44-pin ATA
66/100 flat cable. To connect an IDE HDD to the motherboard, follow the instructions
below.
Step 1:
Step 2:
Step 3:
Find the ATA 66/100 flat cable in the kit that came with the motherboard.
Connect one end of the cable to the PIDE1 connector on the motherboard. A
keyed pin on the IDE connectors prevents it from being connected incorrectly.
Locate the red wire on the other side of the cable that corresponds to the pin 1
connector.
Step 4:
Connect the other side of the cable to the HDD making sure that the pin 1 cable
corresponds to pin 1 on the connector.Step 0:
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NOTE:
When two EIDE disk drives are connected together, back-end jumpers on
the drives must be used to configure one drive as a master and the other as
a slave.
4.5 Jumper Settings
NOTE:
A jumper is a metal bridge that is used to
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close an electrical circuit. It consists of
two metal pins and a small metal clip
(often protected by a plastic cover) that
slides over the pins to connect them.
To CLOSE/SHORT a jumper mean
connecting the pins of the jumper with
the plastic clip and to OPEN a jumper
means removing the plastic clip from a
jumper.
Before the WAFER-LX is installed in the system, the jumpers must be set in accordance
with the desired configuration. The WAFER-LX motherboard has six on-board jumpers.
The jumpers are described in Table 4-2 and shown in Figure 4-2.
Description Label Type
s
Jumper
Table 4-2: Jumpers
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AT Power Select JP1 2-pin header
COM 2 mode setup JP2 3-pin header
Clear CMOS Memory CN7 2pin header
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Figure 4-2: Jumper Locations
4.5.1 Clear CMOS Jumper
NOTE:
The battery connector (CN7) is used as the clear CMOS jumper on the
WAFER-LX.
Jumper Label: CN7
Jumper Type:
Jumper Settings: See Table 4-3
Jumper Location: See Figure 4-2
2-pin header
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If the WAFER-LX fails to boot due to improper BIOS settings, use this connector to clear
the CMOS data and reset the system BIOS information. To do this, disconnect CN7 and
keep it disconnected for at least five seconds. After five seconds has elapsed, reinsert the
connector.
If the “CMOS Settings Wrong” message is displayed during the boot up process, the fault
may be corrected by pressing the F1 to enter the CMOS Setup menu. Do one of the
following:
Enter the correct CMOS setting
Load Optimal Defaults
Load Failsafe Defaults.
After having done one of the above, save the changes and exit the CMOS Setup menu.
Clear CMOS DESCRIPTION
Closed Keep CMOS Setup
Open Clear CMOS Setup
Table 4-3: Clear CMOS Jumper Settings
4.5.2 AT Power Select Jumper Settings
Jumper Label: JP1
Jumper Type:
Jumper Settings: See Table 4-4
Jumper Location: See Figure 4-2
The AT/ATX Power Mode Select jumper specifies the systems power mode. Jumper
2-pin header
settings are shown in Figure 4-2.
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AT Power Select Description
Short Use AT power Default
Open Use ATX power
Table 4-4: AT Power Select Jumper Settings
4.5.3 COM3 Setup Jumper Settings
Jumper Label: JP2
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Jumper Type:
Jumper Settings: See Table 4-5
Jumper Location: See Figure 4-2
The WAFER-LX COM3 serial port setup jumper settings are shown in Figure 4-2. The
COM3 port can be configured as an RS-422 serial port or as an RS-485 serial port.
COM 2 Setup Description
Short Pin 1 ~ Pin 2 RS-422 Default
Short Pin 2 ~ Pin 3 RS-485
Table 4-5: COM3 Setup Jumper Settings
4.6 Chassis Installation
After the CPU, the cooling kit, and the DIMM modules have been installed and after the
internal peripheral connectors have been connected to the peripheral devices and the
3-pin header
jumpers have been configure, the motherboard can be mounted into chassis.
To mount the motherboard into a chassis please refer to the chassis user guide that came
with the product.
4.7 Rear Panel Connectors
4.7.1 LCD Panel Connection
The conventional CRT monitor connector, VGA1, is a 15-pin, female D-SUB connector.
Pin assignments can be seen in that can be connected to external monitors.
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4.7.2 Ethernet Connection
The rear panel RJ-45 connectors can be connected to an external LAN and communicate
with data transfer rates up to 1Gb/s.
4.7.3 USB Connection
The rear panel USB connectors provide easier and quicker access to external USB
devices. The rear panel USB connector is a standard connector and can easily be
connected to other USB devices.
4.7.4 Keyboard and Mouse Connection
A PS/2 keyboard and a PS/2 mouse can be connected to the appropriate PS/2 connector
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on the rear panel.
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Chapter
5

5 Award BIOS Setup

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5.1 Introduction
A licensed copy of Phoenix Award BIOS is preprogrammed into the ROM BIOS. The BIOS
setup program allows users to modify the basic system configuration. This chapter
describes how to access the BIOS setup program and the configuration options that may
be changed.
5.1.1 Starting Setup
The Phoenix Award BIOS is activated when the computer is turned on. The setup program
can be activated in one of two ways.
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1. Press the D
2. Press the DELETE key when the “Press Del to enter SETUP” message
appears on the screen.
If the message disappears, restart the computer and try again.
ELETE key as soon as the system is turned on or
5.1.2 Using Setup
Use the arrow keys to highlight items, press ENTER to select, use the PAGEUP and
P
AGEDOWN keys to change entries, press F1 for help and press ESC to quit. Navigation
keys are shown below.
Key Function
Up arrow Move to the item above
Down arrow Move to the item below
Left arrow Move to the item on the left hand side
Right arrow Move to the item on the right hand side
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+/Page up Increase the numeric value or make changes
-/Page down Decrease the numeric value or make changes
Esc Main Menu – Quit and do not save changes into CMOS
Status Page Setup Menu and Option Page Setup Menu --
Exit current page and return to Main Menu
F1 General help, only for Status Page Setup Menu and Option
Page Setup Menu
F2 Item help
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F5 Previous values for the page menu items
F6 Fail-safe defaults for the current page menu items
F7 Optimized defaults for the current page menu items
F9 Menu in BIOS
F10 Save changes and Exit BIOS
Table 5-1: BIOS Navigation Keys
5.1.3 Getting Help
When F1 is pressed a small help window describing the appropriate keys to use and the
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possible selections for the highlighted item appears. To exit the Help Window press E
the F1 key again.
SC or
5.1.4 Unable to Reboot After Configuration Changes
If the system cannot be booted after changes are made, restore the CMOS defaults. The
CPU card should come with a restore CMOS settings jumper. Refer to Section ?? for
more information.
5.1.5 Main BIOS Menu
Once the BIOS opens, the main menu (BIOS Menu 1) appears.
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BIOS Menu 1: Award BIOS CMOS Setup Utility
NOTE:
The following sections will completely describe the menus listed below and
the configuration options available to users.
The following menu options are seen in BIOS Menu 1.
Standard CMOS Features: Changes the basic system configuration.
Advanced BIOS Features: Changes the advanced system settings.
Advanced Chipset Features: Changes the chipset configuration features.
Integrated Peripherals: Changes the settings for integrated peripherals.
Power Management Setup: Configures power saving options.
PnP/PCI Configurations: Changes the advanced PCI/PnP settings.
PC Health Status: Monitors essential system parameters.
The following user configurable options are also available in BIOS Menu 1:
Load Fail-Safe Defaults
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Use the Load Fail-Safe Defaults option to load failsafe default values for each BIOS
parameter in the setup menus. Press F6 for this operation on any page.
Load Optimized Defaults
Use the Load Optimized Defaults option to load optimal default values for each BIOS
parameter in the setup menus. Press F7 for this operation on any page.
Set Supervisor Password
Use the Set Supervisor Password option to set the supervisor password. By default, no
supervisor password is set. To install a supervisor password, select this field and enter the
password. After this option is selected, a red dialogue box appears with “Enter
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Password: ”. Type the password and press E
Confirm Password: ” dialogue box and press E
press E
Password Disabled !!!” dialogue box.
Set User Password
Use the Set User Password option to set the user password. By default no user
password is set. To install a user password, select this field and enter the password. After
this option is selected, a red dialogue box appears with “Enter Password: ”. Type the
password and press E
dialogue box and press E
Password: ” dialogue box, then press any key in the “Password Disabled !!!” dialogue
box.
Save & Exit Setup
NTER in the “Enter Password: ” dialogue box, then press any key in the
NTER. Retype the original password into the “Confirm Password: ”
NTER. To disable the password, simply press ENTER in the “Enter
NTER. Retype the original password into the
NTER. To disable the password, simply
Use the Save & Exit Setup option to save any configuration changes made and exit the
BIOS menus.
Exit Without Saving
Use the Exit Without Saving option to exit the BIOS menus without saving any
configuration changes.
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5.2 Standard CMOS Features
Use the Standard CMOS Features BIOS menu (BIOS Menu 2) to set basic BIOS
configuration options.
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BIOS Menu 2: Standard CMOS Features
Date [Day mm:dd:yyyy]
Use the Date option to set the system date.
Time [hh/mm/ss]
Use the Time option to set the system time.
IDE Master and IDE Slave
When entering setup, BIOS auto detects the presence of IDE devices. The Standard
CMOS Features menu shows the status of the auto detected IDE devices. The following

IDE devices are detected and shown in the Standard CMOS Features menu:

IDE Primary Master
IDE Primary Slave
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IDE Secondary Master
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IDE device configurations are changed or set in the IDE Configuration menu. If an IDE
device is detected, and one of the above listed two BIOS configuration options is selected,
the IDE configuration options shown in Section 5.2.1 appear.
Drive A [None]
Use the Drive A/B configuration to specify the floppy drive type installed in the system.
The floppy drive configuration options are:
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IDE Secondary Slave
None
360K, 5.25 in.
1.2M, 5.25 in.
720K, 3.5 in.
1.44M, 3.5in (Default)
2.88M, 3.5 in.
Halt On [All, But Keyboard]
Use the Halt On option to specify what errors detected during the power up process stop
the system.
All Errors
No Errors
All, But Keyboard
Whenever BIOS detects a non-fatal error the
system is stopped and the user prompted.
The system boot is not stopped for any errors
that may be detected.
(Default) The system boot does not stop for a keyboard
error; it stops for all other errors.
All, But Diskette
All, But Disk/Key
The system boot does not stop for a disk
error; it stops for all other errors.
The system boot does not stop for a keyboard
or a disk error; it stops for all other errors.
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Base Memory:
The Base Memory is NOT user configurable. The POST determines the amount of base
(or conventional) memory installed in the system. The value of the base memory is
typically 512K for systems with 512K memory installed, or 640K for systems with 640K or
more memory installed.
Extended Memory
The Extended Memory is NOT user configurable. The BIOS determines how much
extended memory is present during the POST. This is the amount of memory above 1MB
located in the memory address map of the CPU.
Total Memory
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The Total Memory is NOT user configurable.
5.2.1 IDE Primary Master/Slave
Use the IDE Primary Master/Slave menu to set or change the master/slave IDE
configurations.
IDE HDD Auto-Detection [Press Enter]
Use the IDE HDD Auto-Detection option to enable BIOS to automatically detect the IDE
settings. Select IDE HDD Auto-Detection and press E
the HDD type. Do not set this option manually.
IDE Primary Master [Auto]
Use the IDE Primary Master option to activate or deactivate the following drive channels:
Channel 0 Master
NTER. BIOS automatically detects
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Channel 0 Slave
Channel 1 Master
Channel 0 Slave
None
If no drives are connected to the IDE channel select this
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option. Once set, this IDE channel becomes
inaccessible and any drives attached to it are
undetected.
Auto
Manual
Access Mode [Auto]
The Access Mode option can only be configured if the BIOS configuration option is set to
either Manual or Auto.. Use the Access Mode option to determine the hard disk BIOS
translation modes. Most systems now use hard drives with large capacities and therefore
either the LBA translation mode or auto mode should be selected.
CHS
LBA
(Default) Setting this option allows the device to be automatically
detected by the BIOS.
Selecting this option allows manual configuration of the
device on the IDE channel in BIOS.
Select this mode if the HDD capacity is less than
504MB.
Select this mode if the HDD capacity is more than
Capacity
The Capacity specification indicates the storage capacity of the HDD installed in the
system.
Cylinder
Large
Auto
8.4GB.
This mode is an extended ECHS mode and while it
supports HDDs larger than 504MB, it is not
recommended.
(Default) If you are unsure of what access mode to set, select this
option.
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The Cylinder specification indicates how many cylinders (tracks) are on the HDD installed
in the system.
Head
The Head specification indicates how many logical heads are on the HDD installed in the
system.
Precomp
The Precomp specification indicates on what track the write precompensation begins.
Landing Zone
The Landing Zone specification indicates where the disk head will park itself after the
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system powers off.
Sector
The Sector specification indicates how many logical sectors the HDD has been divided
into.
5.3 Advanced BIOS Features

Use the Advanced BIOS Features menu (BIOS Menu 3) to configure the CPU and

peripheral device configuration options.
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BIOS Menu 3: Advanced BIOS Features
Virus Warning [Disabled]
NOTE:
Many disk diagnostic programs can cause the above warning message to
appear when the program attempts to access the boot sector table. If you
are running such a program, it is recommended that the virus protection
function be disabled beforehand.
Use the Virus Warning option to enable BIOS to monitor the boot sector and partition
table of the HDD for any attempted modification. If a modification attempt is made, the
BIOS halts the system and an error message appears. If necessary, an anti-virus program
can then be run to locate and remove the virus before any damage is done.
Enabled
Activates automatically when the system boots up
causing a warning message to appear when anything
attempts to access the boot sector or HDD partition table.
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Disabled
CPU Internal Cache [Enabled]
Use the CPU Internal Cache option to enable or disable the internal CPU cache.
Disabled
Enabled
Quick Power On Self Test [Enabled]
Use the Quick Power On Self Test option to speed up the POST after the computer is
turned on. If enabled, BIOS shortens or skips some POST check items.
Disabled Normal POST occurs after the computer is turned on.
(Default) No warning message appears when there is an attempt
to access the boot sector or HDD partition table.
The internal CPU cache is disabled.
(Default) The internal CPU cache is enabled.
Enabled (Default) Quick POST occurs after the computer is turned on.
Boot From LAN Control [Disabled]
Use the BOOT From LAN Control option to enable the system to be booted from a
remote system.
Disabled
Enabled
SATA Boot ROM Control [Disabled]
Use the SATA Boot ROM Control option to configure SATA IDE use in DOS mode.
(Default) The system cannot be booted from a remote system
through the LAN.
The system can be booted from a remote system
through the LAN.
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Disabled
Enabled
(Default) Disables SATA IDE use in DOS mode.
Enables SATA IDE use in DOS mode.
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