2008-04-18 1.01 Removed WAFER-LX3-800/W board version 2.0
Changed CN1 pin definitions
2007-08-30 1.00 Initial release
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WAFER-LX3 3.5” Motherboard
Manual Conventions
WARNING!
Warnings appear where overlooked details may cause damage to the equipment or result
in personal injury. Warnings should be taken seriously. Warnings are easy to recognize.
The word “warning” is written as “WARNING,” both capitalized and bold and is followed by
text. The text is the warning message. A warning message is shown below:
WARNING:
This is an example of a warning message. Failure to adhere to warning
messages may result in permanent damage to the WAFER-LX3 or
personal injury to the user. Please take warning messages seriously.
CAUTION!
Cautionary messages should also be heeded to help reduce the chance of losing data or
damaging the WAFER-LX3. Cautions are easy to recognize. The word “caution” is written
as “CAUTION,” both capitalized and bold and is followed. The italicized text is the
cautionary message. A caution message is shown below:
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WAFER-LX3 3.5” Motherboard
CAUTION:
This is an example of a caution message. Failure to adhere to cautions
messages may result in permanent damage to the WAFER-LX3.
Please take caution messages seriously.
NOTE:
These messages inform the reader of essential but non-critical information. These
messages should be read carefully as any directions or instructions contained therein can
help avoid making mistakes. Notes are easy to recognize. The word “note” is written as
“NOTE,” both capitalized and bold and is followed by text. The text is the cautionary
message. A note message is shown below:
NOTE:
This is an example of a note message. Notes should always be read.
Notes contain critical information about the WAFER-LX3. Please take
note messages seriously.
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WAFER-LX3 3.5” Motherboard
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
Copyright
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.
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WAFER-LX3 3.5” Motherboard
Packing List
NOTE:
If any of the components listed in the checklist below are missing,
please do not proceed with the installation. Contact the IEI reseller or
vendor you purchased the WAFER-LX3 from or contact an IEI sales
representative directly. To contact an IEI sales representative, please
send an email to
The items listed below should all be included in the WAFER-LX3 package.
1 x WAFER-LX3 single board computer
1 x IDE 44p/44p flat cable
1 x RS-232/422/485 cable
1 x Keyboard and mouse Y-cable
1 x Audio cable
1 x USB cable
1 x Mini jumper pack
1 x Utility CD
1 x QIG (quick installation guide)
BIOS Menu 1: Award BIOS CMOS Setup Utility .................................................................... 110
BIOS Menu 2: Standard CMOS Features................................................................................ 112
BIOS Menu 3: IDE Primary Master/Slave menu..................................................................... 115
BIOS Menu 4: Advanced BIOS Features................................................................................ 118
BIOS Menu 5: Advanced Chipset Features............................................................................ 121
BIOS Menu 6: Flat Panel Configuration ................................................................................. 124
BIOS Menu 7: Integrated Peripherals..................................................................................... 127
BIOS Menu 8: IT8888 ISA Decode IO...................................................................................... 132
BIOS Menu 9: IT8888 ISA Decode Memory............................................................................ 135
BIOS Menu 10: Power Management Setup............................................................................ 137
BIOS Menu 11: IRQ Wakeup Events....................................................................................... 140
BIOS Menu 12: PnP/PCI Configurations ................................................................................ 141
BIOS Menu 13: IRQ Resources ............................................................................................... 142
BIOS Menu 14: Memory Resources........................................................................................ 143
BIOS Menu 15: PC Health Status............................................................................................ 145
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WAFER-LX3 3.5” Motherboard
THIS PAGE IS INTENTIONALLY LEFT BLANK
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WAFER-LX3 3.5” Motherboard
1 Introduction
Chapter
1
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1.1 Overview
1.1.1 WAFER-LX3 Introduction
WAFER-LX3 3.5” Motherboard
Figure 1-1: WAFER-LX3 3.5” Motherboard
The WAFER-LX3 3.5” motherboard (
platform that comes in both commercial and industrial grade models. Industrial grade
models are able to operate in extreme environmental conditions and in operational
environments with wide ranging ambient temperatures.
Support for VGA, LVDS and TTL displays provides diversified display functionaliti es. Each
WAFER-LX3 has either 256 MB (standard) or 512 MB (optional) DDR memory
preinstalled on the system. Two 10/100 Mbps Intel® 82551ER Ethernet controllers ensure
secure network connectivity.
A compatible PC/104 ISA expansion card is easily connected to the system through an
integrated PC/104 slot. Four USB 2.0 connectors provides additional expansion options to
the system ensuring a variety of USB 2.0 devices can be connected to the WAFER-LX3.
Figure 1-1) is an AMD Geode™ LX 800 processor
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WAFER-LX3 3.5” Motherboard
1.1.2 WAFER-LX3 Models
There are two WAFER-LX3 models. These models are listed below.
WAFER-LX3-800 (board revision 1.0): Operates in a normal range of
ambient temperatures between 0°C ~ +60°C
WAFER-LX3-800W (board revision 1.0): Operates in a wide range of
ambient temperatures between -20°C ~ +80°C
WAFER-LX3-800 (board revision 2.0): Operates in a normal range of
ambient temperatures between 0°C ~ +60°C
The two models are distinguished by the preinstalled heat sinks as shown in
Figure 1-2: WAFER-LX3-800 and WAFER-LX3-800W Heat Sinks
1.1.3 WAFER-LX3 Features
Some of the WAFER-LX3 features are listed below.
Figure 1-2.
3.5” form factor
Integrated 500 MHz AMD Geode™ LX 800 CPU
Onboard 128 MB (standard) or 256 MB (optional) DDR memory
Multiple display options including
o VGA
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o 24-bit TTL
o 18-bit LVDS display interface
Multiple serial port connectors including:
o Two RS-232 serial port connectors
o One RS-422/485 serial port connector
Operates in a wide range of ambient temperatures:
o WAFER-LX3-800 (board revision 1.0): 0°C ~ +60°C
o WAFER-LX3-800W (board revision 1.0):-20°C ~ +80°C
o WAFER-LX3-800 (board revision 2.0): 0°C ~ +60°C
1.2 WAFER-LX3 Overview
1.2.1 WAFER-LX3 Overview Photo
The WAFER-LX3 has a wide variety of peripheral interface connectors. Figure 1-3 is a
WAFER-LX3 3.5” Motherboard
labeled photo of the peripheral interface connectors on the front side of the WAFER-LX3.
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WAFER-LX3 3.5” Motherboard
Figure 1-3: WAFER-LX3Overview [Front View]
Figure 1-4 is a labeled photo of the peripheral interface connectors on the solder side of
the WAFER-LX3.
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WAFER-LX3 3.5” Motherboard
Figure 1-4: WAFER-LX3 Overview [Solder Side]
1.2.2 WAFER-LX3 Peripheral Connectors and Jumpers
The WWAFER-LX3 has the following connectors on-board:
1 x ATX power connector
1 x Audio connector
1 x Backlight inverter connector
1 x Battery connector
1 x CF Card socket (solder side)
1 x Fan connectors
1 x FDD connector
1 x Front panel connector
1 x General purpose input/output (GPIO) connector
1 x IDE connector
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1 x Keyboard/mouse connector
1 x LVDS LCD connector
1 x Parallel port (LPT) connector
1 x PC/104 slot
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WAFER-LX3 3.5” Motherboard
1 x Power button connector
1 x Power input (–5V/-12V) connector
1 x RS-232/RS-422/485 serial port connector
1 x Suspend power input connector
1 x System reset button connector
1 x TTL LCD connector
1 x USB 2.0 connector
The WAFER-LX3 has the following external peripheral interface connectors on the board
rear panel.
2 x RJ-45 Ethernet connectorss
1 x RS-232 serial port connector
2 x USB 2.0 connectors
1 x VGA connector
The WAFER-LX3 has the following on-board jumpers:
AT/ATX power mode select jumper
CF Card mode select jumper
COM1 and COM2 serial RI port and voltage selection jumper
LCD panel shift clock setting jumper
LCD panel voltage select jumper
RS-422/485 mode select jumper
1.2.3 Technical Specifications
WAFER-LX3 technical specifications are listed in Table 1-1. See Chapter 2 for details.
Specification WAFER-LX3
Form Factor
System CPU
3.5”
AMD Geode™ LX 800
CPU Clock Speed
System Chipset
500 MHz
AMD Geode™ CS5536 companion device
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256 MB DDR onboard (standard)
Memory
512 MB DDR onboard (optional)
Analog VGA display through external DB-15 connector
WAFER-LX3 3.5” Motherboard
Display
BIOS
Audio
LAN
COM
USB2.0
Hard Disk Drives
Parallel Port
24-bit TTL through 40-pin crimp connector
18-bit single channel LVDS through 20-pin crimp connector
Figure 2-3 shows the data flow between the two on-board chipsets and other components
installed on the motherboard and described in the following sections of this chapter.
WAFER-LX3 3.5” Motherboard
Figure 2-3: Data Flow Block Diagram
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WAFER-LX3 3.5” Motherboard
2.3 CPU Support
The WAFER-LX3 motherboards all have a 500 MHz AMD® Geode™ LX 800 processor
preinstalled.
2.3.1 AMD® Geode™ LX 800 500MHz Overview
An AMD® Geode™ LX 800 processor is preinstalled on the WAFER-LX3 show in Figure
2-4.
Figure 2-4: AMD® Geode™ LX 800 Processor
®
The specifications for the 500MHz AMD
x86/x87-compatible core
Processor frequency up to 500 MHZ
64K I/64K D L1 cache and 128K L2 cache
Split I/D cache/TLB (Translation Look-Aside Buffer)
Integrated FPU that supports the Intel MMX® and AMD 3DNow!™
The AMD® Geode™ LX 800 DDR memory bus on the WAFER-LX3 is interfaced to four
preinstalled Hynix DDR memory chipsets with a combined memory of 256 MB (standard)
or 512 MB (optional) and 133 MHz clock speeds.
WAFER-LX3 3.5” Motherboard
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Figure 2-5: Four Memory Chipsets
All the Hynix memory modules operate with a 3.3 V current. Some of the features of the
Hynix memory modules are listed below:
Standard SDRAM Protocol
Internal 4bank operation
Power Supply Voltage : VDD = 3.3V, VDDQ = 3.3V
All device pins are compatible with LVTTL interface
Low Voltage interface to reduce I/O power
8,192 Refresh cycles / 64ms
Programmable CAS latency of 2 or 3
Programmable Burst Length and Burst Type
The AMD® Geode™ LX 800 supports both CRT and TFT in a dual-simultaneous display
mode. The following display specifications.
Supported Standards
o High Definition (HD)
o Standard Definition (SD)
Supported Resolution
o 1920x1440 in CRT mode
o 1600x1200 in TFT mode
VESA 1.1 and 2.0 VIP/VDA support
A CRT is connected to a female DB-15 connector and a TFT flat panel display is
connected to the board through a 40-pin crimp connector. These interface connectors are
shown in
Figure 2-6 below.
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WAFER-LX3 3.5” Motherboard
Figure 2-6: TFT and VGA Connector
2.3.4 LVDS Interface
The TTL signals from the AMD Geode™ LX 800 processor are multiplexed to a Flatlink™
LVDS transmitter on the solder side of the WAFER-LX3. The LVDS transmitter is
connected to a 20-pin crimp connector, which in turn can be connected to an LVDS
display. The LVDS connector and transmitter are shown in
Figure 2-7: LVDS Connector and Transmitter
Figure 2-7.
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WAFER-LX3 3.5” Motherboard
Some of the features of the Flatlink™ LVDS transmitter are listed below:
21:3 data channel compression at up to196 million bytes per second
throughput
Suited for SVGA, XGA, or SXGA data transmission from controller to display
with very low EMI
21 data channels plus clock in low-voltage TTL inputs and three data
channels plus clock out low-voltage diff erential signaling (LVDS) Outputs
The AMD® Geode™ LX 800 BitBLT/vector engine graphics processor supports pattern
generation, source expansion, pattern/source transparency, 256 ternary raster operations,
alpha blenders to support alpha- BLTs, incorporated BLT FIFOs, a GeodeLink interface
and the ability to throttle BLTs according to video timing. New features added to the
Graphics Processor include:
Command buffer interface
Hardware accelerated rotation BLTs
Color depth conversion
Paletized color
Full 8x8 color pattern buffer
Separate base addresses for all channels
Monochrome inversion
Table 2-1: Geode LX Graphics Features lists a complete list of Geode LX graphics
features. For more details, please refer to the AMD website or the Geode LX series data
book available from AMD.
Feature AMD Geode™ LX Processor
Color Depth 8, 16, 32 bpp (A) RGB 4 and 8-bit indexed
ROPs 256 (2-src, dest and pattern)
BLT Buffers FIFOs in Graphics Processor
BLT Splitting Managed by hardware
Video Synchronized BLT/Vector Throttle by VBLANK
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Bresenham Lines Yes
Patterned (stippled) Lines Yes
Screen to Screen BLT Yes
Screen to Screen BLT with mono expansion Yes
Memory to Screen BLT Yes (throttled rep movs writes)
Accelerated Text No
Pattern Size (Mono) 8x8 pixels
Pattern Size (Color) 8x8 pixels
Monochrome Pattern Yes (with inversion)
Dithered Pattern (4 color) No
Color Pattern 8, 16, 32 bpp
Transparent Pattern Monochrome
Solid Fill Yes
Pattern Fill Yes
WAFER-LX3 3.5” Motherboard
Transparent Source Monochrome
Color Key Source Transparency Y with mask
Variable Source Stride Yes
Variable Destination Stride Yes
Destination Write Bursting Yes
Selectable BLT Direction Vertical and Horizontal
The power management for the 500MHz AMD® Geode™ LX 800 is listed below:
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1.8W Typical (3.9W TDP) @ 500MHz
GeodeLink active hardware power management
Hardware support for standard ACPI software power management
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WAFER-LX3 3.5” Motherboard
I/O companion SUSP#/SUSPA# power controls
Lower power I/O
Wakeup on SMI/INTR
2.3.7 GeodeLink™ Interface Unit
A proprietary GeodeLink™ interface connects the AMD Geode™ LX 800 to the AMD
Geode™ CS5536 system chipset. Some of the features of the GeodeLink™ interface
are listed below.
64-bit, 66MHz operation
PCI VSM (Virtual System Module) that makes the interface transparent to
applications software and BIOS
Programmable routing descriptors, use and activity monitors, and SSMI
(Synchronous System Management Interrupt)
2.4 AMD® Geode™ CS5536 System Chipset
The WAFER-LX3 series motherboards all have a preinstalled AMD® Geode™ CS5536
system chipset. The system chipset fe atures are listed below.
82xx Legacy Devices
System Management Bus (SMB) Controller
8 Multi-Function General Purpose Timers (MFGPTs)
Power Management Controller
ACPI v2.0 compliant
2.4.1 AMD® Geode™ CS5536 ATA-6 Controller
The single 44-pin WAFER-LX3 IDE connector supports two ATA-6 HDDs. An ATA-6 (Ultra
®
ATA/100) compliant IDE controller on the AMD
transfer rate of 100MB/s. ATA-6 includes advancements in error checking and ATA-6
drives are compatible with future interface additions. The IDE connector is shown in
Geode™ CS5536 has a maximum
Figure 2-8 below.
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WAFER-LX3 3.5” Motherboard
Figure 2-8: IDE Connector
The onboard ATA-6 controller is able to support the following IDE HDDs:
Ultra A T A/10 0, with data transfer rates up to 100MB/s
Ultra A T A/66, with data transfer rates up to 66MB/s
Ultra A T A/33, with data transfer rates up to 33MB/s
Specification Ultra A TA/100 Ultra A T A/66 Ultra A T A/33
The AC’97 specification v2.3 compliant controller on the chipset is interfaced to a 20-bit
DAC and 18-bit ADC full-duplex AC'97 2.3 stereo RealTek ALC203 codec. The ALC203 is
then connected to a 10-pin audio connector to which an audio kit can easily be conne cted.
The codec meets performance requirements for audio on PC99/2001 systems. The audio
connector and codec are shown in
Figure 2-9: Audio Connector and Codec
Figure 2-9 below.
Some of the codec features are listed below.
20-bit DAC and 18-bit ADC resolution
18-bit Stereo full-duplex CODEC with independent and variable sampling rate
Complies with AC'97 2.3 specifications
o LINE/HP-OUT, MIC-IN and LINE-IN sensing
o 14.318MHz -> 24.576MHz PLL saves crystal
o 12.288MHz BITCLK input can be consumed
o Integrated PCBEEP generator to save buzzer
o Interrupt capability
o Page registers and Analog Plug & Play
Three analog line-level stereo inputs with 5-bit volume control: LINE_IN, CD,
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WAFER-LX3 3.5” Motherboard
AUX
High quality differential CD input
Two analog line-level mono input: PCBEEP, PHONE-IN
Supports double sampling rate (96KHz) of DVD audio playback
Two software selectable MIC inputs
+6/12/20/30dB boost preamplifier for MIC input
Stereo output with 6-bit volume control
Mono output with 5-bit volume control
Headphone output with 50mW/20Ohm amplifier
3D Stereo Enhanceme nt
Multiple CODEC extension capability
External Amplifier Power Down (EAPD) capability
Power management and enhanced power saving features
Stereo MIC record for AEC/BF application
DC Voltage volume control
Auxiliary power to support Power Off CD
Adjustable VREFOUT control
2 GPIO pins with smart GPIO volume control
2 Universal Audio Jacks (UAJ)® for front panel
Supports 32K/44.1K/48K/96KHz S/PDIF output
Supports 32K/44.1K/48KHz S/PDIF input
Power support: Digital: 3.3V; Analog: 3.3V/5V
Standard 48-Pin LQFP Package
EAX™ 1.0 & 2.0 compatible
Direct Sound 3D™ compatible
A3D™ compatible
I3DL2 compatible
HRTF 3D Positional Audio
Sensaura™ 3D Enhancement (optional)
10 Bands of Software Equalizer
Voice Can cellation and Key Shifting in Kareoke mode
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AVRack® Media Player
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WAFER-LX3 3.5” Motherboard
2.4.3 AMD® Geode™ CS5536 Flash Interface
The WAFER-LX3 CompactFlash® socket supports standard CF Type I and CF Type II
cards. The chipset flash interface is multiplexed with an IDE interface and can be
connected to an array of industry standard NAND Flash or NOR Flash devices. The CF
Card socket is located on the solder side of the WAFER-LX3.
Figure 2-10: CF Card Socket
2.4.4 AMD® Geode™ CS5536 USB Controller
Two external USB ports and two USB ports on an onboard pin-header on the WAFER-LX3
are interfaced to the chipset USB controller. Four USB 1.1 or USB 2.0 devices can be
connected simultaneously to the WAFER-LX3. The chipset USB controller has the
following specifications:
o 4 USB ports
o USB 1.1 and USB 2.0 compliant
o 4 host ports
The WAFER-LX3 USB connectors are shown in
Figure 2-11.
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WAFER-LX3 3.5” Motherboard
Figure 2-11: USB Connectors
2.4.5 AMD® Geode™ CS5536 Real Time Clock
The system chipset has a battery backed up 256-byte real-time clock (RTC) with CMOS
RAM.
2.5 GeodeLink™ PCI Bridge
2.5.1 Overview
The GeodeLink™ PCI Bridge (GLPCI) module provides a PCI interface for GeodeLink
Interface Unit-based designs. The GLPCI module is composed of six major blocks:
The GeodeLink and PCI Bus Interface blocks provide adaptation to the respective buses.
The Transaction Forwarding block provides bridging logic. Some of the features of the
GeodeLink™ PCI Bridge are listed below:
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WAFER-LX3 3.5” Motherboard
PCI Version 2.2 compliance
32-bit, 66 MHz PCI bus operation
Target support for fast back-to-back transactions
Arbiter support for three external PCI bus masters
Write gathering and write posting for in-bound write requests
Virtual PCI header support
Delayed transactions for in-bound read requests
Zero wait state operation within a PCI burst
Dynamic clock stop/start support for GLIU and PCI clock domains (this is not
CLKRUN support)
Capable of handling out of bound transactions immediately after reset
2.5.2 PCI Bridge Components
The PCI bus on the WAFER-LX3 is connected to the following components:
2 x Intel® 82551ER PCI Ethernet controllers
1 x ITE IT8888G PCI to ISA bridge
2.5.3 Intel® 82551ER PCI Ethernet Controller
Two Intel® 82551ER PCI Ethernet 10/100BASE-T Ethernet LAN controllers are interfaced
to the AMD Geode™ CS5536 through the PCI bus. The Ethernet controllers are t hen b oth
connected to an RJ-45 connector that can be accessed externally. The Intel® 82551ER
controllers and the RJ-45 connectors are shown in
Figure 2-12.
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WAFER-LX3 3.5” Motherboard
Figure 2-12: Ethernet Controller
Some the features of the Intel® 82551ER are listed below:
100BASE-TX and 10BASE-T
Less than 0.5W typical power consumption
Scatter-gather bus mastering capabilities enable high-speed transfers over
the PCI bus
Wake on LAN (WoL) without software configuration
Address Resolution Protocol (ARP) and flexible frame filtering
Complies with Advanced Configuration and Power Interface specifications
Offloads TCP, UDP, and IP checksums from PC processor
Early-receive interrupt processes receive data concurrently
3.3V device
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WAFER-LX3 3.5” Motherboard
2.5.4 PCI to ISA Bridge
An ITE IT8888G PCI to ISA bridge single function device connects the onboard
WAFER-LX3 ISA bus PC/104 connector and the GPIO connector to the GeodeLink™ PCI
bridge. The PCI-to-ISA bridge is shown in
Figure 2-13: PCI-to-ISA Bridge
Figure 2-13.
The IT8888G has a PCI specification v2.1 compliant 32-bit PCI bus interface and supports
both PCI Bus master and slave. The PCI interface supports both programmable positive
and full subtractive decoding schemes. Some of the features of the IT8888G PCI to ISA
bridge are listed below.
PCI Interface
Programmable PCI Address Decoders
PC/PCI DMA Controller
Distributed DMA Controller
ISA Interface
SM Bus
1 analog line-level mono output: MONO_OUT
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Power-on Serial Bus Configuration
Serial IRQ
Versatile power-on strapping options
Supports NOGO function
Single 33 MHz Clock Input
+3.3V PCI I/F with +5V tolerant I/O buffers
+5V ISA I/F and core Power Supply
2.6 LPC Bus Components
2.6.1 LPC Bus Overview
The LPC bus is connected to components listed below:
BIOS chipset
Super I/O chipset
WAFER-LX3 3.5” Motherboard
2.6.2 BIOS Chipset
The BIOS chipset has a licensed copy of AMI BIOS installed on the chipset. Some of the
BIOS features are listed below:
Award Flash BIOS
SMIBIOS (DMI) compliant
Console redirection function support
PXE (Pre-boot Execution Environment) support
USB booting support
The BIOS chipset is shown in
Figure 2-14 below.
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WAFER-LX3 3.5” Motherboard
Figure 2-14: BIOS Chipset
2.6.3 Winbond W83627EHG Super I/O chipset
The Winbond W83627EHG Super I/O chipset is connected to the AMD Geode™ CS5536
companion device through the LPC bus. The Winbond W83627EHG is an LPC
interface-based Super I/O device that comes with Environment Controller integration,
floppy disk controller, and UART controller. Some of the features of the Winbond
W83697HG chipset are listed below:
Some of the Super I/O features are described in more detail below. The super I/O chipset
is shown in
Figure 2-15.
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WAFER-LX3 3.5” Motherboard
Figure 2-15: Super I/O Chipset
2.6.3.1 Super I/O LPC Interface
The LPC interface on the Super I/O complies with the Intel® Low Pin Count Specification
Rev. 1.01. The LPC interface supports both LDRQ# and SERIRQ protocols as well as PCI
PME# interfaces.
2.6.3.2 Super I/O Hardware Monitor Functions
The Super I/O Hardware Monitor monitors internal voltages, system temperature and the
cooling fan speed. All the monitored environmental parameters can be read from the BIOS
Hardware Health Configuration menu.
2.6.3.3 Super I/O UART Controller
There are two high-speed 16550 compatible UART controllers integrated onto the Super
I/O chipset. Both controllers have 16-byte send/receive FIFO. Some of the features of the
UART controllers are listed below:
o 5, 6, 7, or 8-bit characters
o Even, odd or no parity bit generation/detection
o 1, 1.5 or 2 stop bits generation
Internal diagnostic capabilities:
o Loop-back control for communications link fault isolation
o Break, parity, overrun, framing error stimulation
Programmable baud generator allows division of 1.8461 MHz and 24 MHz by
16
1 to (2
Maximum baud rate up to 921 kbps for 14.769 MHz and 1.5 Mbps for 24 MHz
2.6.3.4 Super I/O Parallel Port
The Super I/O parallel port (LPT) is compatible with the following LPT specifications.
IBM parallel port compatible
– 1)
PS/2 compatible bi-directional parallel port
Enhanced Parallel Port (EPP) mode supported. Compatible with IEEE 1284
specifications
Extended Parallel Port (EPP) mode supported. Compatible with IEEE 1284
specifications
Enhanced printer port back-drive current protection
The parallel port controller is connected to an external DB-26 LPT connector.
2.6.3.5 Super I/O Floppy Disk Drive (FDD) Controller
The Super I/O FDD controller is compatible with the following specifications.
IBM PC AT disk drive compatible
Variable write pre-compensation with track selectable capability
Vertical recording format supported
DMA logic enabled
16-byte data FIFOs
Overrun and under run conditions detected
Built-in address mark detection circuitry to simplify the read electronics
FDD anti-virus functions with software write protect and FDD write enable
signal
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Supports 3.5-inch or 5.25-inch FDD
Compatible with industry standard 82077
Supported capacities:
WAFER-LX3 3.5” Motherboard
o 360K
o 720K
o 1.2M
o 1.44M
o 2.88M
Supported transfer rates
o 250Kbps
o 300Kbps
o 500Kbps
o 1Mbps
o 2Mbps
The FDD controller is interfaced to a FDD connected to the backplane through the
board-to-board connectors.
2.6.3.6 Super I/O Keyboard and Mouse Controller
The Super I/O keyboard and mouse controller is compatible with the following
specifications.
8042 compatible
Asynchronous access to two data registers and one status register
Compatible with 8042 software
PS/2 mouse supported
Port 92 supported
Interrupt and polling modes supported
Fast Gate A20 and Hardware Keyboard Reset
8-bit timer/counter
The keyboard and mouse controller controller is interfaced to a keyboard and mouse
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connected to the backplane through the board-to-board connectors.
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WAFER-LX3 3.5” Motherboard
2.6.3.7 Super I/O GPIO Ports
The Super I/O has 22 programmable GPIO ports.
2.6.3.8 Super I/O Fan Speed and Fan Control
The super I/O can both monitor and control the fan speed. The super I/O is interfaced to
the fan on the backplane through the board-to-board connectors.
2.7 Environmental and Power Specifications
2.7.1 Operating Temperature and Temperature Control
The maximum and minimum operating temperatures for the WAFER-LX3 are listed below.
WAFER-LX3-800 (board revision 1): Operates in a normal range of ambient
temperatures between 0°C ~ +60°C
WAFER-LX3-800W (board revision 1): Operates in a wide range of
ambient temperatures between -20°C ~ +80°C
WAFER-LX3-800 (board revision 2): Operates in a normal range of ambient
temperatures between 0°C ~ +60°C
A cooling fan and heat sink must be installed on the CPU. Thermal paste must be
smeared on the lower side of the heat sink before it is mounted on the CPU. Heat sinks
are also mounted on the Northbridge and Southbridge chipsets to ensure the operating
temperature of these chips remain low.
2.7.2 Power Consumption
Table 2-3 shows the power consumption parameters for the WAFER-LX3 running with an
AMD Geode™ LX 800 CPU with 256 MB of onboard memory.
Voltage Current
+5.0V 1.34A
Table 2-3: Power Consumption
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WAFER-LX3 3.5” Motherboard
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WAFER-LX3 3.5” Motherboard
Chapter
3
3 Unpacking
Page 37
Page 58
3.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during the installation of the
WAFER-LX3 may result in permanent damage to the WAFER-LX3 and
severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER-LX3. Dry climates are especially susceptible to ESD. It is therefore
critical that whenever the WAFER-LX3, or any other electrical component is handled, the
following anti-static precautions are strictly adhered to.
WAFER-LX3 3.5” Motherboard
Wear an anti-static wristband: - Wearing a simple anti-static wristband can
help to prevent ESD from damaging the board.
Self-grounding:- Before handling the board touch any grounded conducting
material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad: When configuring the WAFER-LX3, place it on an
antic-static pad. This reduces the possibility of ESD damaging the
WAFER-LX3.
Only handle the edges of the PCB:-: When handling the PCB, hold the PCB
by the edges.
3.2 Unpacking
3.2.1 Unpacking Precautions
When the WAFER-LX3 is unpacked, please do the following:
Follow the anti-static precautions outlined in Section 3.1.
Page 38
Make sure the packing box is facing upward s so the W A FER-LX3 does not fall
out of the box.
Make sure all the components shown in Section 3.3 are present.
Page 59
WAFER-LX3 3.5” Motherboard
3.3 Unpacking Checklist
NOTE:
If some of the components listed in the checklist below are missing,
please do not proceed with the installation. Contact the IEI reseller or
vendor you purchased the WAFER-LX3 from or contact an IEI sales
representative directly. To contact an IEI sales representative, please
send an email to
sales@iei.com.tw.
3.3.1 Package Contents
The WAFER-LX3 is shipped with the following components:
Quantity Item and Part Number Image
1 WAFER-LX3-800
1 IDE 44p/44p flat cable
(P/N: 32200-000009-RS)
1 RS-232/422/485 cable
(P/N:32200-026500-RS)
1 KB/MS PS/2 Y-cable
(P/N: 32000-023800-RS)
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Page 60
4 Dual USB cable (wo bracket)
(P/N: 32000-070300-RS)
1 Audio cable
WAFER-LX3 3.5” Motherboard
(P/N: 32000-072100-RS)
1 Mini jumper pack (2.0mm)
(P/N:33100-000033-RS)
1 Quick Installation Guide
1 Utility CD
Table 3-1: Package List Contents
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WAFER-LX3 3.5” Motherboard
3.4 Optional Items
WAFER-LX3-800W
WAFER-LX3-CE060
Windows CE 6.0 image and board support package (BSP) software CD, Licensed sticker
(without CPU board)
WAFER-LX3-CE050
Windows CE 5.0 image and board support package (BSP) software CD, Licensed sticker
(without CPU board)
WAFER-LX3-XPE
Windows XP Embedded image and board support package (BSP) soft ware CD,
Licensed sticker (without CPU board)
LPT cable (wo bracket)
(P/N: 32200-015100-RS)
Table 3-2: Package List Contents
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WAFER-LX3 3.5” Motherboard
Chapter
4
4 Connector Pinouts
Page 43
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4.1 Peripheral Interface Connectors
Section 0 shows peripheral interface connector locations. Section 0 lists all the peripheral
Figure 4-2: Connector and Jumper Locations (Solder Side)
4.1.2 Peripheral Interface Connectors
Table 4-1 shows a list of the peripheral interface connectors on the WAFER-LX3. Detailed
descriptions of these connectors can be found below.
Connector Type Label
ATX power button connector 2-pin wafer CN13
ATX power connector 4-pin ATX connector CN1
Audio connector 10-pin box-header CN8
ATX power supply enable connector 3-pin wafer CN2
Backlight inverter connector 5-pin wafer CN3
Battery connector 2-pin wafer CN7
CF card connector 50-pin CF card slot CN32
Fan connector 3-pin wafer CN4
FDD connector 26-pin slim type CN31
GPIO connector 10-pin header CN14
Page 45
Page 66
HDD connector 44-pin box-header CN30
Keyboard and mouse connector 6-pin header CN17
LED connector 6-pin wafer CN5
LVDS connector 20-pin crimp CN29
Parallel port connector 26-pin header CN15
PC/104 slot 104-pin PC/104 slot CN10
PC/104 power input connector 3-pin wafer CN11
Reset button connector 2-pin wafer CN12
RS-232/422/485 serial port connector 14-pin header CN16
TTL LCD connector 40-pin crimp CN28
WAFER-LX3 3.5” Motherboard
USB port connector 8-pin header CN24
Table 4-1: Peripheral Interface Connectors
4.1.3 External Interface Panel Connectors
Table 4-2 lists the rear panel connectors on the WAFER-LX3. Detailed descriptions of these connectors can be found in Section
Connector Type Label
Ethernet connector RJ-45 CN33
Ethernet connector RJ-45 CN34
RS-232 serial port connector Male DB-9 CN22
USB connector USB port CN18
USB connector USB port CN19
4.2.17 on page 69.
Page 46
VGA connector Female DB-15 CN26
Table 4-2: Rear Panel Connectors
Page 67
WAFER-LX3 3.5” Motherboard
4.2 Internal Peripheral Connectors
Internal peripheral connectors are found on the motherboard and are only accessible
when the motherboard is outside of the chassis. T his se ction h as complet e d esc ription s of
all the internal, peripheral connectors on the WAFER-LX3.
4.2.1 ATX Power Button Connector
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
The ATX power button connector is connected to a power switch on the system chas sis to
enable users to turn the system on and off.
CN13
2-pin wafer (1x2)
Figure 4-3
Table 4-3
Figure 4-3: ATX Power Button Connector Location
PIN NO. DESCRIPTION
1 Power Switch
2 GND
Table 4-3: ATX Power Button Connector Pinouts
Page 47
Page 68
4.2.2 ATX Power Input Connector
WAFER-LX3 3.5” Motherboard
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
CN1
4-pin power connector (1x4)
Figure 4-4
Table 4-4
The 4-pin ATX power input connector is connected to an ATX or AT power supply, which
provides power to the system. If an ATX power supply is used, the ATX power supply
enable connector (see below) and the ATX power button connector should both be
connected. The AT/ATX mode select jumper should also be configured in ATX mode (see
Chapter 5)
Page 48
Figure 4-4: Main Power Input Connector Location
PIN NO. DESCRIPTION
1 +12V
2 GND
3 GND
4 +5V
Table 4-4: Main Power Input Connector Pinouts
Page 69
WAFER-LX3 3.5” Motherboard
4.2.3 ATX Power Supply Enable Connector
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
CN2
3-pin wafer (1x3)
Figure 4-5
Table 4-5
The ATX power supply enable connector enables the WAFER-LX3 to be connected to an
ATX power supply. In default mode, the WAFER-LX3 can only us an AT power supply. To
enable an ATX power supply the AT Power Select jumper must also be configured. Please
refer to Chapter 5 for more details.
Figure 4-5: ATX Power Supply Enable Connector Location
PIN NO. DESCRIPTION
1 +5VSB
2 NC
3 PSON#
Table 4-5: ATX Power Supply Enable Connector Pinouts
Page 49
Page 70
4.2.4 Audio Connector (10-pin)
WAFER-LX3 3.5” Motherboard
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
CN8
10-pin box-header
Figure 4-6
Table 4-6
The 10-pin audio connector is connected to external audio devices including speakers a nd
microphones for the input and output of audio signals to and from the system.
Page 50
Figure 4-6: Audio Connector Pinouts (10-pin)
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 Line out R 2 Line in R
3 GND 4 GND
5 Line out L 6 Line in L
7 GND 8 GND
9 MIC in 10 NC
Table 4-6: Audio Connector Pinouts (10-pin)
Page 71
WAFER-LX3 3.5” Motherboard
4.2.5 Backlight Inverter Connector
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
CN3
5-pin wafer (1x5)
Figure 4-7
Table 4-7
The backlight inverter connector provides the backlight on the LCD display connected to
the WAFER-LX3 with +12V of power.
The battery connector is connected to a backup battery. The battery connector is also
used to reset the CMOS memory if the incorrect BIOS settings have been made and the
system cannot boot up.
CN7
2-pin wafer (1x2)
Figure 4-8
Table 4-8
Figure 4-8: Battery Connector Location
PIN NO. DESCRIPTION
1 Battery+
2 Ground
Table 4-8: Battery Connector Pinouts
4.2.7 CompactFlash® Socket
CN Label: CN32 (solder side)
Page 52
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WAFER-LX3 3.5” Motherboard
CN Type:
CN Location: See
CN Pinouts: See
A CF Type I or Type II memory card is inserted to the CF socket on the solder side of the
WAFER-LX3.
50-pin header (2x25)
Figure 4-9
Table 4-9
Page 53
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WAFER-LX3 3.5” Motherboard
Figure 4-9: CF Card Socket Location
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GROUND 26 VCC-IN CHECK1
2 DATA 3 27 DATA 11
3 D ATA 4 28 DATA 12
4 D ATA 5 29 DATA 13
5 D ATA 6 30 DATA 14
6 D ATA 7 31 DATA 15
7 HDC_CS0# 32 HDC_CS1
8 N/C 33 N/C
9 GROUND 34 IOR#
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WAFER-LX3 3.5” Motherboard
10 N/C 35 IOW#
11 N/C 36 VCC_COM
12 N/C 37 IRQ15
13 VCC_COM 38 VCC_COM
14 N/C 39 CSEL
15 N/C 40 N/C
16 N/C 41 HDD_RESET
17 N/C 42 IORDY
18 SA2 43 SDREQ
19 SA1 44 SDACK#
20 SA0 45 HDD_ACTIVE#
21 DATA 0 46 66DET
22 DATA 1 47 DATA 8
23 DATA 2 48 DATA 9
24 N/C 49 DATA 10
25 VCC-IN CHECK2 50 GROUND
Table 4-9: CF Card Socket Pinouts
4.2.8 Fan Connector (+12V, 3-pin)
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
The cooling fan connector provides a 12 V, 500 mA current to a system cooling fan. The
connector has a "rotation" pin to get rotation signals from fans and notify the system so the
system BIOS can recognize the fan speed. Please note that only specified fans can issue
the rotation signals.
CN4
3-pin wafer
Figure 4-10
Table 4-10
Page 55
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WAFER-LX3 3.5” Motherboard
Figure 4-10: +5V Fan Connector Location
PIN NO. DESCRIPTION
1 Fan Speed Detect
2 +12V
3 GND
Table 4-10: +5V Fan Connector Pinouts
4.2.9 Floppy Disk Connector (26-pin)
CN Label: CN31 (solder side)
CN Type:
CN Location: See
CN Pinouts: See
The floppy disk connector is connected to a floppy disk drive.
26-pin slim-type (1 x 26)
Figure 4-11
Table 4-11
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WAFER-LX3 3.5” Motherboard
Figure 4-11: 26-Pin FDD Connector Location
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 +5V 14 STEP#
2 INDEX# 15 GND
3 +5V 16 WDATA#
4 DSA# 17 GND
5 +5V 18 WGATE#
6 DSKCHG# 19 GND
7 NC 20 TRACK0#
8 NC 21 GND
9 NC 22 WP#
10 MOTO0# 23 GND
11 NC 24 RDATA#
Page 57
Page 78
12 DIR# 25 GND
13 NC 26 HEAD#
Table 4-11: 26-pin FDD Connector Pinouts
4.2.10 GPIO Connector
WAFER-LX3 3.5” Motherboard
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
CN14
10-pin header (2x5)
Figure 4-12
Table 4-12
The GPIO connector can be connected to external I/O control devices including sensors,
lights, alarms and switches.
Page 58
Figure 4-12: GPIO Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GND 2 VCC5
3 OUT 0 4 OUT 1
5 OUT 2 6 OUT 3
7 IN 0 8 IN 0
9 IN 1 10 IN 3
Table 4-12: GPIO Connector Pinouts
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WAFER-LX3 3.5” Motherboard
4.2.11 HDD Connector(44-pin)
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
One 44-pin IDE device connector on the WAFER-LX3 supports connectivity to two hard
disk drives.
CN30
44-pin header (2x22)
Figure 4-13
Table 4-13
Figure 4-13: Secondary IDE Device Connector Locations
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WAFER-LX3 3.5” Motherboard
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 RESET# 2 GROUND
3 DATA 7 4 DATA 8
5 DATA 6 6 DATA 9
7 DATA 5 8 DATA 10
9 DATA 4 10 DATA 11
11 DATA 3 12 DATA 12
13 DATA 2 14 DATA 13
15 DATA 1 16 DATA 14
17 DATA 0 18 DATA 15
19 GROUND 20 N/C
21 IDE DRQ 22 GROUND
23 IOW# 24 GROUND
25 IOR# 26 GROUND
27 IDE CHRDY 28 GROUND
29 IDE DACK 30 GROUND–DEFAULT
31 INTERRUPT 32 N/C
33 SA1 34 N/C
35 SA0 36 SA2
37 HDC CS0# 38 HDC CS1#
39 HDD ACTIVE# 40 GROUND
41 VCC 42 VCC
43 GROUND 44 N/C
Table 4-13: Secondary IDE Connector Pinouts
4.2.12 Keyboard/Mouse Connector
CN Label:
CN17
Page 60
CN Type:
6-pin header (1x6)
CN Location: See
CN Pinouts: See
Figure 4-14
Table 4-14
Page 81
WAFER-LX3 3.5” Motherboard
The keyboard and mouse connector can be connected to a standard PS/2 cable or PS/2
Y-cable to add keyboard and mouse functionality to the system.
Figure 4-14: Keyboard/Mouse Connector Location
PIN NO. DESCRIPTION
1 +5V KB DATA
2 MS DATA
3 MS CLK
4 KB DATA
5 KB CLK
6 GROUND
Table 4-14: Keyboard/Mouse Connector Pinouts
4.2.13 LCD LVDS Connector
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
CN29
20-pin crimp (2x10)
Figure 4-15
Table 4-15
The 20-pin LCD LVDS can be connected to a single-channel LCD screen.
The LED connector connects to an HDD indicator LED and a power LED on the system
chassis to inform the user about HDD activity and the power on/off status of the system.
Figure 4-16: LED Connector Locations
PIN NO. DESCRIPTION
1 +5V
2 GND
Page 63
Page 84
3 Power LED+
4 Power LED5 HDD LED+
6 HDD LED-
Table 4-16: LED Connector Pinouts
4.2.15 Print Connector
WAFER-LX3 3.5” Motherboard
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
CN15
26-pin box header
Figure 4-17
Table 4-17
The 26-pin print connector connects to a print connector interface or some other parallel
port device such as a printer.
Page 64
Figure 4-17: Parallel Port Connector Location
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 STROBE# 2 AUTO FORM FEED #
3 DATA 0 4 ERROR#
5 DATA 1 6 INITIALIZE
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WAFER-LX3 3.5” Motherboard
7 DATA 2 8 PRINTER SELECT LN#
9 DATA 3 10 GROUND
11 DATA 4 12 GROUND
13 DATA 5 14 GROUND
15 DATA 6 16 GROUND
17 DATA 7 18 GROUND
19 ACKNOWLEDGE 20 GROUND
21 BUSY 22 GROUND
23 PAPER EMPTY 24 GROUND
25 PRINTER SELECT 26 N/C
Table 4-17: Parallel Port Connector Pinouts
4.2.16 PC/104 Slot
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
CN10
104-pin PC/104 slot
Figure 4-18
Table 4-18
The PC/104 slot enables a PC/104 compatible expansion module to be connected to the
board.
The PC/104 power input connector provides power to the PC/104 expansion module
installed on the PC/104 slot.
CN11
3-pin wafer (1x3)
Figure 4-19
Table 4-19
Figure 4-19: PC/104 Power Input Connector Pinouts
Page 69
Page 90
PIN NO. DESCRIPTION
1 -5V
2 GND
3 -12V
Table 4-19: PC/104 Power Input Connector Pinouts
4.2.18 Reset Button Connector
WAFER-LX3 3.5” Motherboard
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
The reset button connector is connected to a reset switch o n the syst em chassi s to enabl e
users to reboot the system when the system is turned on.
CN12
2-pin wafer (1x2)
Figure 4-20
Table 4-20
Page 70
Figure 4-20: Reset Button Connector Locations
PIN NO. DESCRIPTION
1 Reset Switch
2 GND
Table 4-20: Reset Button Connector Pinouts
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WAFER-LX3 3.5” Motherboard
4.2.19 Serial Port Connector (COM 2)(RS-232, RS-422 or RS-485)
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
The 14-pin serial port connector connects to the COM 2 serial communications channels.
COM 2 is a multi function channel. In default mode COM 2 is an RS-232 serial
communication channel but, with the COM 2 function select jumper, can be configured as
either an RS-422 or RS-485 serial communications channel.
CN16
14-pin header (2x7)
Figure 4-21
Table 4-21
Figure 4-21: RS-232/422/485 Serial Port Connector Location
The 2x4 USB pin connector provides connectivity to two USB 1.1 or two USB 2.0 ports.
The USB connector supports two USB devices. Additional external USB ports are found
on the rear panel. The USB ports are used for I/O bus expansion.
The WAFER-LX3 is equipped with two built-in RJ-45 Ethernet controllers. The controllers
can connect to the LAN through two RJ-45 LAN connectors. There are two LEDs on the
connector indicating the status of LAN. The pin assignments are listed in the following
table:
PIN DESCRIPTION PIN DESCRIPTION
1 TXA+ 5 TXC-
2 TXA- 6 TXB3 TXB+ 7 TXD+
4 TXC+ 8 TXD-
CN33 and CN34
RJ-45
Figure 4-24
Table 4-24
Table 4-24: LAN Pinouts
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WAFER-LX3 3.5” Motherboard
Figure 4-25: RJ-45 Ethernet Connector
The RJ-45 Ethernet connector has two status LEDs, one green and one yello w. The green
LED indicates activity on the port and the yellow LED indicates the port is linked. See
Table 4-25.
STATUS
Green Activity YELLOW Linked
Table 4-25: RJ-45 Ethernet Connector LEDs
DESCRIPTION STATUS DESCRIPTION
4.3.2 Serial Port Connectors (COM1, COM3 and COM4)
CN Label:
CN Type:
CN Location: See
CN Pinouts: See
The 9-pin DB-9 COM 1 serial port connector is connected to RS-232 serial
communications devices.