IEI Technology WAFER-LX User Manual

WAFER-LX

3.5” Profile WAFER Embedded Board

User Manual

RoHS Compliant

X

Revision History

WAFER-L

Title Revision Number Description Date of Issue

1.0

3.5” Profile WAFER-LX Embedded Boar d

Initial release April, 2006

Copyright Notice

The information in this document is subject to change without prior notice in order to improve reliability, design, and function and does not represent a commitment on the part of the manufacturer.

In no event will the manufacturer be liable for direct, indirect, special, incidental, or con se quential damages arising out of the use or inability to use the product or documentation, even if advised of the possibility of such damages.

This document contains propriet ary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

Trademarks

AMD is the registered trademarks of Advanced Micro Devices, Inc. Geode, GeodeLink, Virtual System Architecture and 3DNow! are also trad emarks of Advanced Micro Devices, Inc. AMI is a registered trademark of American Megatrends Inc. Other product names mentioned herein are used for identification purposes only and may be trademarks and/or registered trademarks of their respective owners.

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Table of Contents

Revision History 2 ·························································································································· Copyright Notice 2 Trademarks 2 Table of Contents 3 List of Tables 6 List of Figures 7 Product Overview 1-2

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CHAPTER ONE INTRODUCTION

1.1 General Information 1-2

Connectivity 1-4 Label 1-4 Function 1-4

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1.2 WAFER-LX Board Overview 1-8

1.3 Technical Specifications 1-9

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Audio Connector 1-10 AC ’97 interface 1-11

Packing List 1-11 System Monitoring 1-11

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CHAPTER TWO UNCTIONAL DESCRIPTION

2.1 CPU, Memory, and VIA Chip sets 2-2

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CPU 2-2 Memory 2-3 VGA/LCD Interface 2-3 Audio 2-3

Block Diagram 2-4 Important Features 2-5

2.2 External Interfaces 2-7

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2.2.1

Internal Connectors 2-11 ······································································································

WAFER-L

2.2.2 Front Panel Connectors 2-31

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CHAPTER THREE INSTALLATION

3.1 Considerations Prior to Installation 3-2

Preparing Your Embedded Board 3-2 Installation Notices 3-2

Airflow Consideration 3-3 Unpacking Precautions 3-3 Memory Module 3-3

3.2 Mechanical Diagrams 3-4

3.3 Jumper Settings 3-5

JP1 (AT/ATX Mode Selector) 3-6 JP1 Pin Configuration 3-6 JP1 3-6 JP2: COM3 Serial Port Operation Mode Selector 3-6

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JP3: COM Ports Power Selector 3-7

3.4 Installation 3-8

IDE Disk Drive and CDROM Connector 3-8 Optional Floppy Drive Connector (CN31) 3-9 Compact Flash Disk 3-9 Parallel Port Connector (CN15) 3-9 Audio Interface 3-10 COM Port Connectors [COM1(CN22), COM2/COM3(CN16)] 3-10 LCD Panel Connection (CN26, CN28, and CN29) 3-10 Ethernet Connection (CN20 & CN21) 3-11 USB Connection (CN24 and CN19) 3-12

Accessories Included in Kit 3-12

Type 3-12

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CHAPTER FOUR AWARD BIOS SETUP

Introduction 4-2

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1.1.1

Starting Setu p 4-2 ············································································································

1.1.2 Using Setup 4-2

1.1.3 Getting Help 4-3

1.1.4 Unable to Reboot After Configuration Changes 4-3

1.1.5 Main BIOS Menu 4-3

Standard CMOS Features 4-5

1.1.6 IDE Channel Master 4-8

Advanced BIOS Features 4-10

1.1.7 CPU Feature 4-17

1.1.8 Hard Disk Boot Priority 4-19

Advanced Chipset Features 4-20 Integrated Peripherals 4-26

1.1.9 OnChip IDE Device 4-27

Power Management Setup 4-31

1.1.10 Onboard Device 4-37

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1.1.11 Super I/O Device 4-39

PnP/PCI Configurations 4-44 PC Health Status 4-47 Frequency/Voltage 4-49

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APPENDIX A WATCHDOG TIMER

APPENDIX B CONNECTING ATX POWER

Power Supply B-1

1.

Using ATX Power Switch B-2

2. Using AT Power Supply B-3

APPENDIX C ALI

1. Introduction C-2

Precautions: C-2

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®

RAID FOR SATA

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2. Features and Benefits C-3

3. SATA-ALi RAID Driver C-4

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4. Accessing the ALi RAID Utility C-6

Safety Notice 8 ESD Precautions 8 Conventions Used in This Manual 9 Software Updates 9

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List of Tables

Table 1-1 Models with Embedded OS Images......................................................6

Table 1-2 Technical Specifications........................................................................9

Table 2-1 Important Features................................................................................5

Table 2-2 Interface Connectors.............................................................................9

Table 2-3 CN1: Power 4P Connector..................................................................11

Table 2-4 CN2 SBVCC: ATX Power Feature Pinout s.........................................12

Table 2-5 CN3 IVTC Inverter Control Pinouts.....................................................12

Table 2-6 CN4 Fan Connector............................................................................13

Table 2-7 CN5 Pinouts........................................................................................13

Table 2-8 CN8 Audio Pinouts..............................................................................15

Table 2-9 PC/104-64 Connector Pinouts ............................................................16

Table 2-10 PC/104-40 Connector Pinouts ............................................................17

Table 2-11 CN11 -VCC PC/104 Supplementary Power........................................18

Table 2-12 CN12 Reset Button Connector Pinouts ..............................................18

Table 2-13 CN13 Power ON/OFF Button Connector Pinouts...............................19

Table 2-14 CN14 Digital I/O Connector Pinouts....................................................19

Table 2-15 Digital Input/Output Definition Options................................................20

Table 2-16 CN15 Parallel Port Pinouts .................................................................21

Table 2-17 CN16: 14 (2x7) Pin 2.0mm Connector Pinouts...................................22

Table 2-18 CN17 Keyboard/Mouse Header Pinouts.............................................23

Table 2-19 Serial ATA Port Pinouts......................................................................24

Table 2-20 CN24 USB Port Pinouts......................................................................25

Table 2-21 CN27 IrDA Interface Port Pinouts .......................................................25

Table 2-22 CN28 Flat Panel Connector Pinouts...................................................26

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Table 2-23

Table 2-24 CN30 IDE Connector Pinouts .............................................................28

Table 2-25 CN31: Optional Floppy Connector......................................................29

Table 2-26 CN32 Pinouts......................................................................................30

Table 2-27 Ethernet Port Pinouts..........................................................................31

Table 2-28 Ethernet Port LED Indications.............................................................32

Table 2-29 Serial Port COM1 Pinouts...................................................................32

Table 2-30 VGA Port Pinout s................................................................................32

Figure B-1 ATX Power Connection.........................................................................2

Figure B-2 ATX Power Adapter Cable...................................................................3

CN29 LVDS Connector Pinouts..........................................................27

List of Figures

Figure 1-1 WAFER-LX Board Layout .....................................................................2

Figure 1-2 WAFER-LX Board Layout (Soldering Side) ..........................................3

Figure 1-3 WAFER-LX Board Overview.................................................................8

Figure 1-4 WAFER-LX Board Overview.................................................................8

Figure 2-1 System Block Diagram..........................................................................4

Figure 2-2 External Interfaces (Component Side)..................................................7

Figure 2-3 External Interfaces (Soldering Side) .....................................................7

Figure 2-4 Locations of Configuration Jumpers .....................................................8

Figure 2-5 Power 4P Connector...........................................................................11

Figure 2-6 CN2 SBVCC ATX Power Feature .......................................................12

Figure 2-7 Inverter Backlight Control....................................................................12

Figure 2-8 CN4 Fan Connector ............................................................................13

Figure 2-9 CN5 Power and HDD LED Connector ................................................13

Figure 2-10 CN8 Audio Port....................................................................................15

Figure 2-11 CN11 –VCC Power..............................................................................18

Figure 2-12 CN12 Reset Button Connector............................................................18

Figure 2-13 CN13 Power ON/OFF Button Connector............................................19

Figure 2-14 CN15 Parallel Port ..............................................................................21

Figure 2-15 COM2 Connector ................................................................................22

Figure 2-16 COM2 Adapter Cable..........................................................................22

Figure 2-17 CN17 Keyboard/Mouse Pin Header....................................................23

Figure 2-18 Serial A T A Port ....................................................................................24

Figure 2-19 CN24 USB (1.1) Port...........................................................................25

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Figure 2-20 CN27 IrDA Interface Port ....................................................................25

Figure 2-21 CN28 TFT Panel Display Connector...................................................26

Figure 2-22 CN29 LVDS Panel Display Connector................................................27

Figure 2-23 IDE Connector.....................................................................................28

Figure 2-24 CN31 Floppy Port................................................................................29

Figure 2-25 Front Panel Connectors......................................................................31

Figure 2-26 10/100BaseT Ethernet (RJ-45) Port....................................................31

Safety Notice

Electrical shock hazards might occur while proceeding with the installation, repair and maintenance of this product. Therefore, the following precaution measures should be carefully observed:

1. All sorts of operations on this product must be carried out by certified technicians.

2. The chassis into which the embedded board and its associated backplane are installed

should provide stable power supply and be properly grounded.

3. Power off the embedded board and unplug its power cord before handling.

4. When handling the embedded board, avoid touching any metal leads or connecto rs.

5. Please verify that the power supply is switched off before unplugging the power supply connector from the embedded board.

ESD Precautions

 Observe all conventional anti-ESD methods while handling the embedded board.  The use of a grounded wrist strap and an anti-static work pad is re commended.  Avoid dust and debris or other static-accumulating materials in your work area.

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Conventions Used in This Manual

WARNING!

Warnings appear where overlooked details may cause damage to the equipment or result in personal injury. Warnings should be taken seriously. Warnings are easy to recognize. The word “warning” is written as “WARNING,” both capitalized and bold and is followed by the warning message.

CAUTION!

Cautionary messages should also be heeded to help you reduce the chance of losin g data or damaging the system. Cautions are easy to recognize. The word “caution” is written as “CAUTION,” both capitalized and bold and is followed by the cautionary message.

NOTE:

These messages inform the reader of essential but non-critical information. These messages should be read carefully as any directions or instructions contained therein can help you avoid making mistakes. Notes are easy to recognize. The word “note” is written as “NOTE,” both capitalized and bold and is followed by the cautionary message.

Lists

Bulleted Lists: Bulleted lists are statements of non-sequential facts that can be read in any order. Each statement is preceded by a square or round black dot.

Numbered Lists: Numbered lists describe sequential steps you sh ould follow in order.

Software Updates

Please contact your system vendor or visit IEI website (www.iei.com.tw) for the latest software or BIOS updates. NOTE that the BIOS version and associated drivers installed on your system should provide the complete functionality listed in the Datasheet/User Manual.

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We provide special revisions for various application purposes. Therefore, DO NOT upgrade your BIOS unless you fully understand what a revision will do.

Problems that occur during the updating process may cause unrecoverable errors and system down time. Always consult qualified technicians before proceeding with any upgrade.

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Chapter

1

Introduction

1-1

WAFER-LX User Manual

Product Overview

1.1 General Information

The WAFER-LX is a highly-integrated embedded computer specifically optimized for multi-media applications requiring minimum installation space. The WAFER-LX is particularly suitable for low power a nd fan-less applications. The WAFER-LEX supports a full range of functionality for an A T/ATX-compatible indu strial computer in a space-saving 3.5” profile. The WAFER-LEX is e quipped with a low-power consumption and high performance AMD Geode LX800 processor on board. It also contains an SDRAM SODIMM socket that supports up to 1GB memory in si ze.

Figure 1-1 WAFER-LX Board Lay out

1-2

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Figure 1-2 WAFER-LX Board Layout (Soldering Side)

1-3

WAFER-LX User Manual

Connectivity

The WAFER-LX provides the following interface connections:

Label Function

CN1 CN2 CN3 CN4 CN5 CN6 CN7 CN8

CN9 CN10 CN11 CN12 CN13 CN14

4P power connector 3-pin PS-ON/ATX feature connector 5-pin Inverter control 3-pin CPU fan connector 5-pin External LED connector (to chassis LED control PCB) 144-pin SDRAM SO-DIMM socket 2-pin connector to the external Lithium 3V coin cell battery10-pin audio connector (to the external adapter cable kit which

should provide phone jacks for Line_out, Line_in, and MIC_in connectivity)

4-pin Audio CD_IN connector PC/104 connector (104-pin ISA bus) 3-pin external VCC (supplementary for PC/104) power connector 2-pin Reset button switch (to the chassis front panel) 2-pin Power switch button (to the chassis front panel) 10-pin general purpose I/Os connector

CN15 CN16 CN17

CN18 CN19 CN20 CN21 CN22 CN23 CN24 CN25

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26-pin parallel port pin header 14-pin internal serial port pin header (COM2) 6-pin keyboard/mouse connector (a 6-pin-to-PS/2 adapter cable is

required) Not implemented External USB1.1 connector (2 ports) 10/100BaseT Ethernet port 10/100BaseT Ethernet port External D-SUB 9 serial port connector (COM1) Serial A T A connector 8-pin internal USB header (an adapter cable required) Serial A T A connector

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CN26 CN27 CN28 CN29

CN30 CN31 CN32

The WAFER-LX is built around an AMD Geode™ chipset which features highest performance per watt, an embedded graphics controller, and full set of functionality through the companion Geode CS5536 Southbridge. The WAFER-LX enables simultaneous dual-display operations by the 32-bit processing power, the 9GB/s bandwidth GeodeLink internal links, and the integrated FPUs operating enhanced Intel MMX and 3Dnow! technologies.

D-SUB 15-pin VGA connector 5-pin IrDA conne ctor 24-bit TFT LCD connector (DF13-40P-1.25V) LCD panel single-channel 18-bit LVDS/TTL connector, 20 (2x10) pin

header 1.25mm (DF13-20P-1.25V) Primary IDE bus connector (44-pin 2.0mm) FDC flat type floppy port (one floppy drive only) Compact flash storage card socket

The built-in graphics controller supports both a CRT and an 18-bit LCD display simultaneously. It offers the resolutions of LCD screen up to 1920 x 1440 (CRT), and 1620 x 1200 (TFT) pixels, with 18-bit DSTN/TFT flat panel interface. The WAFER-LX’s high efficiency design enables its use in a variety of multimedia applications combining the powerful Geode x86 engine, application-specific system-level peripherals, multi-input video processor, video input/output ports, core logic, and a Super I/O block. In addition, the architecture features advanced display interface support for audio, AC’97, and AMC97.

Other distinguished features include: PCI extension bus, USB interface, power management ACPI 1.0 co mpliance, long-term support, and built-in OS integration.

With a specially designed aluminum heatsink, this board can operate without a cooling fan at temperatures up to 60° C (140°F) and typically consumes low power watts while supporting numerous peripherals.

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The embedded support for different OSes is revealed through the table of model options below:

Table 1-1 Models with Embedded OS Images

Part No. Description WAFER-LX-800-R10

WAFER-LX-WINXPE

WAFER-LX-CENET050

WAFER-LX-CLIENT-XPE

WAFER-LX-CLIENT-CENET 050

3.5” SBC with AMD LX 800 processo r, Audio, CRT, LCD/LVDS, dual Ethernet, and SA TA connectors.

3.5” SBC with AMD LX 800 processor, 256MB DDR SO-DIMM memory, audio, CRT, LCD/LVDS, dual Ethernet, SATA, IFM 512MB and Wind ows® XP embedded image.

3.5” SBC with AMD LX 800 processor, 256MB DDR SO-DIMM memory, audio, CRT, LCD/LVDS, dual Ethernet, SATA, IFM 32MB and Windo ws® CE 5.0 image.

3.5” SBC with AMD LX 800 processor, 256MB DDR SO-DIMM memory, audio, CRT, LCD/LVDS, dual Ethernet, SATA, IFM 512MB and Wind ows® XP embedded image and thin client package.

3.5” SBC with AMD LX 800 processor, 256MB DDR SO-DIMM memory, audio, CRT, LCD/LVDS, dual

For a more updated information of supported OSes, please check on IEI website or contact our technical support.

OS Packages:

A. Windows XPE SP2 (350MB image size stored in a 512MB CF card)

1. Advance Set Top Box:

The package includes the components required to create the advanced Set-Top Box (ASTB). The package provides the functionality of the basic set-top box and also supports DVD playback, DVR, Web browsing, networking, universal serial bus (USB), terminal services, and Windows Media Player.

2. Internet Explorer.

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Ethernet, SA TA, IFM 64MB and Windows® CE 5.0 image and thin client package.

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3. Net Framework 1.1.

4. EWF (Enhanced Write Filter).

5. CMD - Windows Command Processor.

6. Device Manager and Task Manager.

7. Video / audio and other board chipset drivers.

8. PS/2 keyboard / mouse drivers.

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9. IDE Compact Flash/HDD/Flash Disk/CD-ROM support

B. Windows CE 5.0 (around 22Mbyte, CF must > 32Mbyte)

1. Enterprise Web Pad (provides the starting point for a range of Web Pad-based devices.)

2. IE 6.0, Media Player, Excel Viewer, Image Viewer, PDF viewer, PowerPoint viewer,

Word viewer, and WordPad.

3. Support hive-based registry.

4. SIP (Software-based Input Panel): SIP for Large Screens.

5. Microsoft Foundation Classes (MFC).

6. NET Compact Framework 2.0.

7. Standard SDK for Windows CE.

8. Transaction-Safe FAT File System (TFAT).

9. PCL Printer Driver.

10. Devices drivers: IDE, CF card, CD-ROM, USB host, USB keyboard/ mouse /storage,

Ethernet, and serial ports.

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1.2 WAFER-LX Board Overview

Component Side

Figure 1-3 WAFER-LX Board Overview

Soldering Side

Figure 1-4 WAFER-LX Board Overview

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1.3 Technical Specifications

Table 1-2 Technical Specifications

Embedded AMD Geode LX800@0.9W processor at 500MHz

CPU



frequency

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Chipset

Memory

Display Controller

PCI Interface

10/100Mbps

Realtek8100C

Ethernet

Controller

 Geode CS5536D as Southbridge

One 64-bit PC 100/133 144-pin SODIMM socket that supports



SDRAM memory up to 512MB

Integrated ProSavage4 w/ 3D/2D/Video controller



Supports AGP 4x performance



Supports single cycle 128-bit 3D architecture



24-bit TTL/single-channel 18-bit DSTN/TFT flat panel interface



Integrated 2-channel 110MHz LVDS interface



Support for all resolutions up to 1024X768 pixels



Hardware Suspend/Standby control



PCI 2.2 compliant, 32-bit 3.3V PCI interface w/ 5V tolerant



inputs Up to 5 PCI masters



PCI to system memory data streaming support



IEEE 802.3 10/100M Base-T standard auto-sensing interface to



10Mbps or 100Mbps networks through an onboard RJ-45 connector.

BIOS

Compact Flash



Disk

IDE Interface

FDD Interface



AMI 256KB Flash memory

Runs in true IDE mode that simulates the operation of a physical IDE hard drive. It can be used with a passive adapter in a Type II socket in DMA mode.

Supports one ATA33/66/100 IDE channel with the connectivity to two hard disk drives

Supports one optional floppy disk drive, 3.5” (720KB or 1.44MB ) by a 26-pin FPC connector cable.

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Two RS-232 ports with 16C550 UART (or compatible) with



Serial Ports

16-byte FIFO buffer. COM2 can support RS-422/485 through jumper setting.

Parallel Port

Audio Connector

USB Interface

Watchdog Timer

PC/104 Interface

E2Key

Power Supply

Hardware Monitor

 One parallel port supports SPP/EPP/ECP mode  One 2x5 pin header supports AC’97 2.3 Line-in, Line-out, and

Mic-in signals.

 Four (4) USB ports, Two external and two internal via pin header;

USB 1.1 compliant.

 Can be Set to 1 to 255 seconds period. Reset or NMI will be

generated when CPU does not periodically trigger the timer.

 Direct ISA DMA mode operation.  A non-volatile 1Kbit EEPROM is provided to retain application

critical read/write data.

 +5V: 2.58A typical, CPU w/ 1x128MB PC-100/133 module  +5V: 2.75A typical, 800MHz CPU w/ 1x128MB PC-100/133

module

 System voltage detection  CPU temperature detection

IrDA Port

Operating

Temperature

Form Factors

Supports Serial Infrared (SIR) and Amplitude Shift Keyed IR



(ASKIR) interface

0° to 60°C



5.75”(L) x 4”(W) x 1”(H)



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 Provides 10 Pin Audio he ader.  16-bit, full-duplex AC'97 Rev. 2.3 compatible six-channel audio

CODEC designed for PC multimedia systems, including host/soft audio and AMR/CNR-based designs.

 Meets performance requirements for audio on

PC99/2001 systems

 Meets Microsoft WHQL/WLP 2.0 audio requirements

AC ’97 interface

 16-bit Stereo full-duplex CODEC with 48KHz

sampling rate

 Compliant with AC'97 Rev 2.3 specifications

 Front-Out, Surround-Out, MIC-In and LINE-In Jack Sensing  14.318MHz -> 24.576MHz PLL to eliminate crystal  12.288MHz BITCLK input  Integrated PCBEEP generator to save buzzer

 Interrupt capability

Packing List

2xSATA cables (P/N: 32000-062800-RS) 1xAudio adapter cable (P/N: 32000-072100-RS) 1x4P-to-SATA power adapter cable (P/N: 32100-088600-RS) 1xIDE flat cable 44p/40p/40p (P/N: 32200-000061-RS) 1xsecond serial port (COM2) cable (P/N: 32200-000009-RS) 1xKeyboard/ PS2 mouse cable (P/N: 32000-000138-RS) 1xMini jumper pack (P/N: 33100-000079-RS) 1xDriver and Utility CD 1xQIG (Quick Installation Guide) (P/N: 51000-001109-RS)

System Monitoring

The WAFER-LX is capable of self-monitoring various aspects of its operating status:

 Vcore voltage, +3.3V, +5V, and +2.5V  RPM of cooling fans (not implemented with this model)  CPU and board temperatures (by the corresponding embedded sensors)

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Chapter

2

Functional Description

2-1

WAFER-LX User Manual

This chapter provides a functional description of the WAFER-LX embedded boa rd designed for the integration into a compact size chassis. This chapter includes information about main processors, interface connectors, implementation options, and signal description.

2.1 CPU, Memory, and VIA Chipsets

CPU

The WAFER-LX comes with a soldered low power AMD Geode LX-800 processor. The AMD Geode design integrates high-performance graphics controller, VGA and Flat Panel display interfaces, with the burst and concurrent GeodeLink pipelining capability for fast data distribution among CPU, DRAM, and PCI buses. CPU and the major functionalities are provided in a single processor package. The CPU is accompanied by the Geode CS5536AD Southbridge featuring full-featured interfaces with integrated UltraDMA-66/100 IDE, USB, and a complete power management feature set. The CS5536AD also provides hardware monitoring and su per I/O functions (floppy disk drive and serial/parallel port s).

The CPU is passively cooled over a heatsink made in aluminum alloy and is ideal for small form factor computing applications with its low power consumption and minimum heat dissipation.

Shown below are some of the key features of the AMD Geode LX processor:

 x86/x87 compatible core.  LX-800 with a processor frequency up to 500MHz.  64K I/64K D L1 cache & 128K L2 cache.  Split I/D cache / TLB (Translation Look-aside Buffer).  64-bit DDR memory up to 400MHz (LX 800).  Integrated FPU that supports the Intel MMX and AMD 3DNow! Technology instruction

sets.

 9GB/s internal GeodeLink Interface Unit (GLIU).  High-resolution CRT and TFT outputs (simultaneous operation)  Support for High Definition (HD) and standard Definition (SD) standards.  0.13 micron process.  1.3W Typical (3.1W TDP) @ 433MHz.  GeodeLink active hardware power management.

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 Hardware support for standard ACPI software power management.  I/O companion SUSP#/SUSPA# power controls  Low power I/O.  Wakeup on SMI/INTR.

Memory

The WAFER-LX provides one (1) 144-pin SDRAM SODIMM socket without ECC support for building a buffer size up to 1GB. The memory is automatically identified. The memory interface supports DDR SODIMM modules at up to 400MHz frequency.

VGA/LCD Interface

Chipset: AMD Geode LX- series CPU with integrated Graphics 2D/3D/Video Accelerator Interface: High-resolution CRT and TFT outputs (simultaneous operation)–Support for High

Definition (HD) and Standard Definition (SD) standards–Support 1920x1440 in CRT mode and 1600x1200 in TFT mode

Audio

The AC’97 capabilities are provided by a Realtek ALC203 chip supporting di gital audio outputs. The onboard ALC203 is a 20-bit DAC and 18-bit ADC supporting full-duplex AC’97 2.3 comp atible stereo audio CODEC for multimedia, including host/soft audio, a nd AMR/CNR based designs. It provides two pairs of stereo outputs with independent volume controls, a mono output, multiple stereo and mono inputs, along with flexible mixing, gain, and mute functions.

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Block Diagram

Figure 2-1 System Block Diagram

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Important Features

Major functionalities provided by the WAFER-LX are li sted below:

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Table 2

 RoHS compliance.

 AMD long term support product; embedded AMD processor.

 PC/104 PCI-to-ISA extension slot for stack-up configurations  CF II socket (CF card behaves as an IDE boot device if no HDD is

-1 Important Features

applied).

 Embedded Graphics Controller with the support for VGA-interface and

LVDS displays (simultaneous operation).

 Supports one dual-channel 18-bit (36-bit ) TFT, and with up to 1920 x 1440

resolutions

 Aluminum alloy heatsink for optimum heat dissipation in fan-le ss

installations.

 Supports dual-channel 18-bit LVDS and/or 24-bit TFT LCD interface  System Memory: one 144-pin SODIMM socket for 64-bit, 400MHz

memory modules ranging from 64MB to 1GB in size.

 64KB I/ 64KB D L1 cache and 128KB L2 cache for fast I/O turnarounds  Two serial po rts, COM1 for RS-232, COM2/3 for RS-232/422/485

 USB compliant with the USB rev. 2.0 standard  System Chipset: AMD Geode LX-800 + Geode CS5536AD Southbridge  Hardware Monitor: built-in to monitor CPU Vcore, VCC, CPU/System fan

speed, and temperature detection functionalities.

 Independent DMA audio engines

 PXE LAN support with ATX power supply

 Realtek

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8100C: Supports 10/100BaseT Ethernet, IEEE 802.3U

compatible full duplex flow control

 Audio: ALC203 AC”97 2.3 CODEC

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 IrDA support: 115kbps, IrDA 1.1 compliant

 Watchdog Timer: 1-255 SEC ICP6629

 Operating temperature: 0 to 60°C

 Humidity: 0 to 95% relative humidity

 Power consumption: +5V @1.2A (AMD Geode LX-800with DDR400 1GB

memory)

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2.2 External Interfaces

For the locations of external interfaces, please refer to the diagram below:

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Figure 2-2 External Interfaces (Component Side)

Figure 2

-3 External Interfaces (Soldering Side)

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NOTE:

1. The configuration options through jumper settings will be discussed in Chapter 3: Installation.

2. On the solder side, there are a CFII card socket and a FPC floppy

connector.

Shown below is a diagram indicating the locations of configuration jumpers.

Figure 2-4 Locations of Configuration Jumpers

NOTE:

1. Only configuration jumpers are shown in the diagram above.

2. For more configuration details on jumper settings, please refer to

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Chapter 3 Installation.

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Table 2-2 Interface Connectors

Label Function

CN1 CN2

4P power connector 3-pin PS-ON/ATX feature connector/selector

WARNING!

A 20-pin-to -4P+3-pin adap ter cable comes a s an option for configu rations using ATX power supply. This adapter cable is different from the similar cables provided with the previous W AFER se ries models. The “Ground” pin is removed from the 3-pin header of this cable; and, if a cable of the previous design is connected to CN2, serious damage to the embedded board will occur.

CN3 CN4 CN5

5-pin Inverter control 3-pin CPU fan connector 5-pin External LED connector (to chassis LED controller boa rd)

CN6 CN7 CN8

CN9 CN10 CN11

CN12 CN13 CN14 CN15

144-pin SDRAM SO-DIMM socket 2-pin connector to the external Lithium 3V coin cell battery10-pin audio connector (to the external adapter cable kit which

should provide phone jacks for Line_out, Line_in, and MIC_in connectivity)

Not implemented. PC/104 connector (104-pin ISA bus) 3-pin external -VCC power connector. It is a peripheral power

connector, provides a -5V and -12V sources as -VCC voltage that are supplementary to the PC/104 (CN10) connector.

2-pin Reset button switch (to the chassis front panel) 2-pin Power switch button (to the chassis front panel) 10-pin general purpose I/Os connector 26-pin parallel port pin header

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CN16 CN17

CN18 CN19 CN20 CN21 CN22 CN23 CN24

CN25 CN26 CN27 CN28 CN29

14-pin 2.0mm internal serial port pin header (COM2) 6-pin keyboard/mouse connector (a 6-pin-to-PS/2 adapter cable is

required) Not implemented External USB2.0 connector (2 ports) 10/100BaseT Ethernet port 10/100BaseT Ethernet port External D-SUB 9 serial port connector (COM1) Serial A T A connector 8-pin internal 2.0mm USB header (2 ports; an adapter cable is

required) Serial A T A connector D-SUB 15-pin VGA connector 5-pin 2.54mm IrDA connector 24-bit TFT LCD connector (DF13-40P-1.25V) LCD panel single-channel 18-bit LVDS/TTL connector, 20 (2x10)

pin header 1.25mm (DF13-20P-1.25V)

CN30 CN31 CN32

Primary IDE bus connector (44-pin 2.0mm) FPC flat type floppy port (one floppy drive only) Compact flash storage card socket (behaves as an IDE device

through BIOS setting)

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2.2.1 Internal Connectors

1. CN1: Power 4P Connector

The WAFER-LX-R10 is equipped with an onboard external power connector, CN1. You can connect power directly to CN1 or mount a PC/104 compact-size power supply module on top of the board through the PC/104 interface.

Table 2

-3 CN1: Power 4P Connector

1 2 GND 3 4 +12V

DESCRIPTION

+5V

GND

Figure 2-5 Power 4P Connector

2. CN2: SBVCC ATX Power Feature Connector

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1x3 WAFER 2mm connector.

Using CN2 as a Power Feature Connector:

The SBVCC connector can support an advanced soft power swit ch function. If an ATX power supply is used, connect an ATX-to-4P power cable between the SBVCC connector and ATX power source. Also connect a power on/off switch to the ATX ON/OFF switch previously mentioned. Note that your ATX power supply should provide a 10mA load on the 5V source standby lead for this function to take effect.

IEI provides an ATX-to-4P adapter cable that comes with a 20-pin ATX connector, a 3-pin connector to the SBVCC (CN2) connector, and a 4P power connector. This board uses an adapter cable different from that provided with the previous WAFER models, please refer to Appendix B for more information.

Using CN2 as a Configuration Jumper:

A jumper cap is installed on pins 1 and 2 as factory default (pin1=+5VSB; pin2=+5V). If the WAFER-LX is connected to an AT power, let the jumper stay on pins 1 and 2. If connected to an ATX power source, remove the jumper cap.

Table 2

-4 CN2 SBVCC: ATX Power Feature Pinouts

DESCRIPTION

1 5VSB 2 +5V 3 GND

Figure 2

-6 CN2 SBVCC ATX Po wer Feature

3. CN3: IVTC LCD Panel Inverter Backlight Control Connector

This connector comes as a 1x5 pin Wafer 2mm connector.

Table 2

-5 CN3 IVTC Inverter Control Pinouts

1 VCC12 2 GROUND 3 VEEON 4 BLADJ

DESCRIPTION PIN DESCRIPTION

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5 VCC5

Figure 2 Inverter Backlight Control

-7

4. CN4: CPU Fan Connector

FAN1 provides acce ss to a +5V power source and a sensor pin for connecting a cooling fan.

Table 2

-6 CN4 Fan Connector

1 2 +5V 3 GND

DESCRIPTION

Fan Speed Detect

Figure 2-8 CN4 Fan Connector

5. CN5: Power and HDD LED Connector

This port provides the connectivity to the power and hard drive activity LEDs on the chassis front panel (may be so through an LED controller board on the chassis). An adapter cable is required.

Table 2

-7 CN5 Pinouts

1 VCC5 2 GROUND 3 POWER LED+ 4 POWER LED-(GND) 5 HDD LED+ 6 HDD LED-

DESCRIPTION

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Figure 2-9 CN5 Power and HDD LED Connector

6. CN6: SDRAM 144-pin SODIMM Socket

This socket receives a DDR 333/400MHz SODIMM module.

7. CN7: Battery Connector

This 2-pin header connects to an externally mounted 3V, Lithium, cell coin battery (VARTA CR2032). The life expectancy of the battery is approximately 7 years. Depending on the working condition, the life expectancy may be shorter.

Replacing a battery is not a user operation.

If the battery starts to weaken and loses voltage, co ntact your vendor or IEI for a replacement module. Dispose of the used battery properly. You may contact your local waste disposal agency for disposal instructions. Do not dispose of a used battery with normal household waste.

WARNING!

1. Keep a used battery away from children.

2. Danger of explosion if the battery is incorrectly replaced. Only certified module from IEI can be used as a replacement.

3. Do not expose the battery to excessive heat or fire.

4. If the battery shows signs of leakage, contact your local vendor or IEI immediately.

8. CN8: 2x5 2.0mm Audio Pin Header

This port connects to AC’97 compatible audio devices through an adapter cable, e.g., that features a 10-pin header to audio phone jacks on a slot bracket.

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Table 2

Figure 2-10 CN8 Audio Port

-8 CN8 Audio Pinouts

PIN DESCRIPTION PIN DESCRIPTION

1 LINE OUT R 2 LINE IN R 3 GROUND 4 GROUND 5 LINE OUT L 6 LINE IN L 7 GROUND 8 GROUND 9 MIC IN 10 N/C

9. CN9: - functionality not implemented

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10. CN10: PC/104 (104-pin ISA bus) Connector

The WAFER-LX features a PC/104 expa nsion bus that let you attach any kind of PC/104 modules. The PC/104 bus has already become the industrial embedded PC bus standard, so you can easily install over thousands of PC/104 modules from hundreds of vendors in the world. There are two PC-104 connectors on this board: PC/104-64 and PC/104-40.

A -5V/-12V (-VCC) connector is provided to supply -VCC voltage that is routed through the PC/104 64-pin connector.

Table 2

-9 PC/104-64 Connector Pinouts

DESCRIPTION

1

IOCHECK# 33 GROUND 2 SD7 34 IRSTDRV 3

SD6 35 VCC 4 SD5 36 IRQ9 5 SD4 37 -5V 6

SD3 38 DRQ2 7 SD2 39 -12V 8

SD1 40 ZWS 9 SD0 41 +12V

10 IOCHRDY 42 GROUND

11 AEN 43 SMEMW# 12 LA19 44 SMEMR# 13 LA18 45 IOW# 14 LA17 46 IOR#

DESCRIPTION

15 SA16 47 DACK3# 16 SA15 48 DRQ3 17 SA14 49 DACK1# 18 SA13 50 DRQ1 19 SA12 51 REFRESH# 20 SA11 52 SYSCLK 21 SA10 53 IRQ7 22 SA9 54 N/C 23 SA8 55 IRQ5

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24 SA7 56 IRQ4 25 SA6 57 IRQ3 26 SA5 58 DACK2 27 SA4 59 TC 28 SA3 60 BALE 29 SA2 61 VCC 30 SA1 62 OSC 31 SA0 63 GROUND 32 GROUND 64 GROUND

Table 2

-10 PC/104-40 Connector Pinouts

DESCRIPTION

1

GROUND 21 GROUND 2 MCS16# 22 SBHE# 3

IOCS16# 23 LA23 4 IRQ10 24 LA22 5 IRQ11 25 LA21 6

IRQ12 26 LA20 7 IRQ15 27 LA19 8

IRQ14 28 LA18 9 DACK0# 29 LA17

10 DRQ0 30 MEMR#

11 DACK5# 31 MEMW# 12 DRQ5 32 SD8 13 DACK6# 33 SD9 14 DRQ6 34 SD10

DESCRIPTION

15 DACK7# 35 SD11 16 DRQ7 36 SD12 17 VCC 37 SD13 18 MASTER# 38 SD14 19 GROUND 39 SD15 20 GROUND 40 GROUND

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11. CN11: External –VCC Power Connector

Table 2-11 CN11 -VCC PC/104 Supplementary Power

Figure 2-11 CN11 –VCC Power

DESCRIPTION

1

-5V 2 GND 3

-12V

12. CN12: Reset Button Connector

This connector connects to an externally implemente d reset button through an adapter cable.

Table 2

-12 CN12 Reset Button Connector Pinouts

Figure 2-12 CN12 Reset Button Connector

DESCRIPTION

1

RST_SW

2 GND

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13. CN13: AT Power ON/OFF Button Connector

This connector is used to connect a chassis power On/Off button using an adapter cable. This connector is closely related to JP1 configuration. The use of this connector is briefed as follows:

1. Using ATX power: CN13 connects to a power switch, and the JP1 jumper should be left open.

2. Using AT power: The pins on JP1 are shorted by a jumper cap. The reason why JP1 should be shorted is because the AMD Southbridge is designed without the consideration for a power button signal and the shorted JP1 provides a hardware feedback to initiate the system.

Table 2

Figure 2-13 CN13 Power ON/OFF Button Connector

-13 CN13 Power ON/OFF Button Connector Pinouts

DESCRIPTION

1

PWR_BTN#

2 GND

14. CN14: Digital I/O Connector

This Digital I/O port is managed through AMD CS5536AD Southbridge. The first table below shows the CN14 port pinouts. The second table shows the Digital I/O port assembly codes.

Table 2

2-19

-14 CN14 Digital I/O Connector Pinouts

DESCRIPTION

1

GND 2 +5V 3 DIO_IN0 4 DIO_OUT0 5

DIO_IIN1 6 DIO_OUT1

DESCRIPTION

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7 DIO_IN2 8 DIO_OUT2 9 DIO_IN3 10 DIO_OUT3

Table 2

-15 Digital Input/Output Definition Options

I/O Address

6F08

6F09 Outputs data to DIO port. The BL contents include output data.

DESCRIPTION

Reads DIO port data, and returns AL DIO input data. The boot-up default input correspondence is DIO –DI3 => Bit0 – Bit3.

Configuration example:

MOV AX, 6F08h INT 15h

When executed, the AL contents include DIO input data. Masking required on user applications for those non-input bits.

The boot-up default correspondence is DO0 – DO3 => Bit4 – Bit7.

Configuration example:

MOV AX, 6F09h MOV BL, 19h INT 15h

If set as the boot-up default, DO0 =1, DO1 – DO3 = 0

6F0A

Defines DIO port (8 bits) as input or output. Each of 8 bits in the BL register represents one DIO signal.

If set to “1,” the DIO becomes input signal. If set to “0,” the DIO port carries output signal. If the boot-up default is set to 0Fh, with 4 inputs and 4 outputs.

Configuration example:

Move AX, 6F0Ah MOV BL, 00h INT 15h When executed, 8 DIO signals become output signals.

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15. CN15: Parallel Port Connector

2x13 pin header 2mm connector

CN15 is an IEEE1284 compatible interface. Usually, the parallel port connects to a printer. This port is provided as a 26-pin 2.0mm pin header.

An adapter cable is required, e.g., IEI’s 32200-000050 (2x13 pin header-to-parallel D-SUB w/ screws for securing to a chassis panel)

Table 2

-16 CN15 Parallel Port Pinouts

PIN DESCRIPTION PIN DESCRIPTION

1 STROBE# 14 AUTO FORM FEED# 2 DATA0 15 ERROR# 3 DATA1 16 INITIALIZE 4 DATA2 17 PRINTER SELECT LN# 5 DATA3 18 GROUND 6 DATA4 19 GROUND 7 DATA5 20 GROUND 8 DATA6 21 GROUND

9 DATA7 22 GROUND 10 ACK- 23 GROUND 11 BUSY 24 GROUND 12 PAPER EMPTY 25 GROUND 13 PRINTER SELECT 26 N/C

Figure 2-14 CN15 Parallel Port

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16. CN16: COM2 RS-232/422/485 Serial Port Header

Table 2-17 CN16: 14 (2x7) Pin 2.0mm Connector Pinouts

1 3 RXD2 4 RTS2 5 7 DTR2 8 COM_RI2 9 GND 10 GND

11

13 RXD485+ 14 RXD485#

DESCRIPTION

DCD1

TXD2 6 CTS2

TXD485+ 12 TXD485#

Figure 2-15 COM2 Connector

2

DESCRIPTION

DSR2

The part number of the IEI COM2 serial port adapter cable is 32200-012100.

Figure

2-16 COM2 Adapter Cable

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NOTE:

1. If you want to use the RS485 mode, just connect to TX2-, TX2+. If you want to use the RS422, please connect to TX2-, TX2+, RX2+, and RX2-.

2. Please refer to Chapter 3 for details on serial port operation modes.

17. CN17: Keyboard/Mouse Pin Header

This port connects to a PS/2 keyboard or mouse using a 6-pin-to-PS/2 adapter cable. An adapter cable, 6-pin-to-two PS/2, is required (IEI part no.: 32200-000052)

Table 2

-18 CN17 Keyboard/Mouse Header Pinouts

1 2 MS_DATA 3 4 KB_DATA 5 KB_CLK 6

DESCRIPTION

+5V

MS_CLK

GND

Figure 2-17 CN17 Keyboard/Mouse Pin Header

18. CN18:

This functionality is not implemented.

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19. CN19, CN20, CN21, CN22, and CN26: Fro nt Panel Connectors

These are front panel connectors. Please refer to the next section for details.

20. CN23 & CN25: Serial ATA Disk Drive Connectors

These 7-pin standard Serial ATA ports connect to SATA I-compatible hard disk drives. SATA drives are managed by the ALi chipset onboard.

Table 2

Figure

-19 Serial ATA Port Pinouts

PIN DESCRIPTION PIN DESCRIPTION

1 GND 2 STXP 3 STXN 4 GND 5 SRXN 6 SRXP 7 GND

2-18 Serial ATA Port

21. CN24: Internal USB Header (Two Ports)

USB2/3: 2x4 8-pin Header.

This header provides the connectivity to additional USB devices through an adapter cable. Various adapters may come with USB ports on a slot bracket or ports that can be attached to D-SUB openings on a chassis.

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Table 2

Figure 2-19 CN24 USB (1.1) Port

-20 CN24 USB Port Pinouts

PIN DESCRIPTION PIN DESCRIPTION

1 +5V 8 GND 2 USBDT2N 7 USBDT3P 3 USBDT2P 6 USBDT3N 4 GND 5 +5V

22. CN27: IrDA Port

This pin header allows you to connect external Infrared devices through an adapter cable.

The IrDA port supports either a Serial Infrared (SIR) or an Amplitude Shift Keyed IR(ASKIR) interface. The header comes as a 1x5 pin 2.54mm pin header.

Table

2-21 CN27 IrDA Interface Port Pinouts

1 +5V 2 N/C 3 IR-RX 4 GROUND 5 IR-TX

DESCRIPTION PIN DESCRIPTION

Figure 2-20 CN27 IrDA Interface Port

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23. CN28: Flat Panel Display Connector

TFT LCD (24-bit one channel; DF13-40DP-1.25V )

2-22 CN28 Flat Panel Connector Pinouts

Table

2 4 GROUND 3 GROUND 6

8 GROUND 7 N/C 10 FPD1 9 FPD0 12 14 FPD5 13 FPD4 16 FPD7 18 FPD9 17 FPD8 20 FPD11 19 FPD10 22 FPD13 21 FPD12 24 FPD15 23 FPD14 26 FPD17 25 FPD16 28 FPD19 27 FPD18 30 FPD21 29 FPD20

DESCRIPTION

LCD5V 1 LCD5V

LCD3V 5 LCD3V

FPD3 11 FPD2

15 FPD6

DESCRIPTION

32 FPD23 31 FPD22 34 GROUND 33 GROUND 36 FPVS 35 FPCLK 38 FPHS 37 FPDEN 40 ENVEE 39 N/C

Figure 2

-21 CN28 TFT Panel Display Connector

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24. CN29: LVDS Panel Display Connector

LVDS LCD (18-bit) 2x15 pin header 1.25mm (DF13-20DP-1.25V)

2-23 CN29 LVDS Connector Pinouts

Table

2

4 LVD0- 3 LVD0+

6

8 LVD2- 7 LVD2+ 10 LVDCK- 9 LVDCK+ 12 14 GROUND 13 GROUND 16 18 LVD_VCC5 17 LVD_VCC5 20 LVD_VCC3 19 LVD_VCC3

DESCRIPTION

GND 1 GND

LVD1- 5 LVD1+

N/C 11 N/C

N/C 15 N/C

DESCRIPTION

Figure 2

-22 CN29 LVDS Panel Display Connector

25. CN30: IDE Connector

One IDE connector can connect to one (1) IDE cable, and the single IDE cable can then connect to two IDE devices. An optional IDE adapter cable from IEI is available; the part number is 32200-008800.

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Table 2

-24 CN30 IDE Connector Pinouts

PIN DESCRIPTION PIN DESCRIPTION

1 RESET# 2 GROUND 3 DATA 7 4 DATA 8 5 DATA 6 6 DATA 9 7 DATA 5 8 DATA 10

9 DATA 4 10 DATA 11 11 DATA 3 12 DATA 1 2 13 DATA 2 14 DATA 13 15 DATA 1 16 DATA 14 17 DATA 0 18 DATA 15 19 SIGNAL GND 20 (KEY) 21 HDD 0 22 GROUND 23 IO WRITE 24 GROUND 25 IO READ 26 GROUND 27 HD READY 28 N/C 29 HDACK 0 30 GROUND 31 IRQ14 32 N/C 33 ADDR 1 34 N/C 35 ADDR 0 36 ADDR 2 37 HDD SELECT 0 38 HDD SELECT 1 39 IDE ACTIVE# 40 GROUND 41 VCC 42 VCC 43 GROUND 44 N/C

Figure 2

-23 IDE Connector

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26. CN31: Optional Floppy Connector (On the Soldering Side)

A 26-pin FPC connector cable is required for connecting to the optional floppy port. You can connect one (1) 3.5”(720 KB, 1.44 MB, and 2.88 MB) drive to this port.

2-25 CN31: Optional Floppy Connector

Table

DESCRIPTION

1

VCC 2 INDEX# 15 GROUND 3

VCC 16 WDATA# 4 DISKSEL0# 17 GROUND 5 VCC 18 WGATE# 6

DSKCHG# 19 GROUND 7 N/C 20 TRAK0# 8

N/C 21 GROUND 9 N/C 22 WRTPRT#

10 MTR0# 23 GROUND

11 N/C 24 RDATA# 12 DIR# 25 GROUND 13 N/C 26 HDSEL#

DESCRIPTION

14

STEP#

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Figure 2-24 CN31 Floppy Port

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27. CN32: Compact Flash Connector)

The CN32 socket allows you to attach a Compact Flash Disk that occupies the secondary IDE channel. The CN32 socket supports both the TYPE II and TYPE I modules.

2-26 CN32 Pinouts

Table

1 2 DATA3 27 DATA11 3 4 DATA5 29 DATA13 5 DATA6 30 DATA14 6 7 HDC_CS0# 32 HDC_CS1 8 9 GROUND 34 IOR#

10

DESCRIPTION

GROUND

DATA4

DATA7

N/C

26

28

31

33

35

DESCRIPTION

VCC-IN CHECK1

DATA12

DATA15

N/C

IOW# 11 N/C 36 VCC_COM 12 N/C 37 IRQ15 13 14 N/C 39 CSEL 15 16 N/C 41 HDD_RESET 17 18 SA2 43 SDREQ 19 SA1 44 SDACK# 20 21 DATA0 46 PDIAG 22 23 DATA2 48 DATA9 24 25 VCC-IN CHECK2 50 GROUND

VCC_COM

N/C

SA0

DATA1

N/C

38

40

42

45

47

49

VCC_COM

N/C

IORDY

HDD_ACTIVE#

DATA8

DATA10

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2.2.2 Front Panel Connectors

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Figure 2

-25 Front Panel Connectors

CN19: USB Combo Connector (2 Ports)

The combo connector provides two USB ports. These two USB ports connect to USB1.1 devices.

CN20 & CN21: 10/100BaseT Ethernet (RJ-45) Ports

These RJ-45 connectors provide 10/100BaseT Ethernet connection to a local or internet network. Refer to the table below for the Ethernet port LED indication.

Figure 2-26 10/100BaseT Ethernet (RJ-45) Port

Table

2-27 Ethernet Port Pinouts

PIN DESCRIPTION PIN DESCRIPTION

1 TX- 5 N/C 2 N/C 6 RX3 TX- 7 N/C 4 RX+ 8 N/C

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Ethernet Port LED Indicators

Table 2-28 Ethernet Port LED Indications

ACTIVITY LED

Status Description Status Description

GREEN Activity YELLOW Linked

LINK LED

CN22: Serial Port COM1

This serial port is defined as COM1 and provides serial connection in the RS-232 mode.

2-29 Serial Port COM1 Pinouts

Table

PIN DESCRIPTION PIN DESCRIPTION

1 NRLSD1 6 NDSR1 2 NRX1 7 NRTS1 3 NTX1 8 NCTS1 4 NDTR1 9 COM_RI1 5 GND

CN26: VGA Port

This 15-pin D-SUB VGA port connects to a CRT or LCD display monitor.

2-30 VGA Port Pinouts

Table

PIN DESCRIPTION PIN DESCRIPTION

1 VGA_R 9 N/C 2 VGA_G 10 GND 3 VGA_B 11 N/C 4 N/C 12 SSDA 5 GND 13 VGA_HS 6 GND 14 VGA_VS 7 GND 15 SSCL 8 GND

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Chapter

3

Installation

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3.1 Considerations Prior to Installation

Preparing Your Embedded Board

The embedded board contains numerous delicate electroni c circuits and components, which can become damaged as a result of electrostatic discharge (ESD). Thus, prior to installation, please follow the instructions below:

1. Please turn off the computer and unplug its power cord.

2. When handling the board, avoid touching any metal leads or connectors.

3. It is best to wear an electrostatic discharge (ESD) cuff when handling electronic components (CPU, RAM).

4. Prior to installing the electronic components, please have these items on top of an anti-static pad or within an electrostatic shielding container.

5. Please verify that the power supply is switched off before unplugging the power supply connector from the motherboard.

Installation Notices

1. Prior to installation, please do not remove the stickers on the system board. These stickers are required for warranty validation.

2. Prior to the installation of the system board or any hardware, please first carefully read the information in the provided manual.

3. Before using the product, please verify that all cables and power connectors are connected.

4. To prevent damage to the PCB board, please do not allow screws to come in contact with the PCB circuit, connector pins, or its components.

5. Please make sure there are no leftover screws or me t al compon ent s place d on the PCB b oard or within the computer casing.

6. Please do not place the computer system on an uneven surface.

7. Turning on the computer power during the installation process can lead to damage to system components as well as physical harm to the user.

8. If you are uncertain about any installation steps or have a problem related to the use of the product, please consult a certified computer technician.

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Airflow Consideration

Although the embedded board can operate without active cooling, it is still necessary to install the board in a chassis with ventilation holes on the sides allowing airflo w to travel through the heatsink surface. In a system with an individual power supply unit, the cooling fan of a power supply can also help generate airflow through the board surface.

Unpacking Precautions

Some components on the WAFER-LX are very sensitive to static electric charges and can be damaged by a sudden rush of power. To protect it from unintended damage, be sure to follow these precautions:

 Ground yourself to remove any static charge before touching your PCB. You can do

so by using a grounded wrist strap at all times or by frequently touching any conducting materials that is connected to the ground.

 Handle your PCB by its edges. Do not touch IC chips, leads or circuitry if not

necessary.

 Do not plug or unplug any connector or jumper while the power is on.  Do not place a PCB on top of an anti-static bag. Only the inside of the bag is safe

from static discharge.

Memory Module

DDR 333/400, 256MB, 512MB, or 1GB, 144-pin SODIMM modules recommended.

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3.2 Mechanical Diagrams

- TBD -

Figure 3-1 Board Dimensions and Mounting Hole Locations

NOTE:

Use the mounting holes on the four corners of the PCB for securing within a chassis. Holes in the middle of the board are used for securing a heatsink.

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3.3 Jumper Settings

NOTE:

A jumper is a metal bridge that is used to close an electrical circuit. It consists of two metal pins and a small metal clip (often protected by a plastic cover) that slides over the ins to connect them. To CLOSE/SHORT a jumper means connecting the pins of the jumper with

WAFER-L

the plastic clip and to OPEN a jumper means removing the plastic clip from a jumper.

Figure 3-2 Jumper

Figure 3-3 Locations of Configuration Jumpers

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JP1 (AT/ATX Mode Selector)

This jumper block controls the way you connect to a power supply

The CN13 connector is used to connect a chassis power On/Off button using an adapter cable. The CN13 connector is configured through the JP1 jumper. The use of this connector is briefed as follows:

1. Using ATX power: CN13 connects to an externally implemented power switch, and the JP1 jumper should be left open.

2. Using AT power: The pins on JP1 are shorted by a jumper cap. The reason why JP1 should be shorted is because the AMD Southbridge is designed without the consideration for a power button signal and the shorted JP1 provides a hardware feedback to initiate the system. The power on/off function is then managed by the AT power switch button.

JP1 Pin Configuration

Table 3-1 JP1 Pin Configuration

JP1

1 AUTO_SW# 2 PWRBTN#

Power Mode Selector

JP2: COM3 Serial Port Operation Mode Selector

This jumper block allows you to select an operation mode for the COM2 serial port (Default: 1-2).

3-2 JP2 Pinouts

Table

COMBINATION

1-2 RS-422 (default) 2-3 RS-485

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DESCRIPTION

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Figure 3-4 JP2 Pinouts

JP3: COM1 and COM Ports Power Selector

Table 3-3 JP3 COM2 Signal Selector

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COM1 Pin-9 Signal Selection COM2 Pin-8 Signal Selection

DESCRIPTION

COMBINATION

1-3 12V 2-4 12V 3-5 5V 4-6 5V 5-7 5V 6-8 5V 7-9 RI1 8-10 RI2

DESCRIPTION

COMBINATION

Figure 3-5 JP3 Pin Configurations

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3.4 Installation

Figure

3-6 Soldering Side Sockets

IDE Disk Drive and CDROM Connector

The WAFER-LX provides 1 IDE channel which allows the connection to two Enhanced Integrated Device Electronics hard disk drives or CD/DVD-ROM. The IDE controller is attached to a PCI interface. The advanced IDE controller supports PIO mode 3, mode 4 and up to UDMA/100 in transfer speed.

Connecting Hard Disk Drives

IDE bus devices are daisy-chained using a standard 44-pin IDE cable. Connection is made by connecting one end of the cable to the CN30 IDE connector. The connector has a keyed pin which prevents you from inserting the connector in a wrong directi on. The read wire corresponds to pin 1 on the connector.

Plug the other end of the cable into the Enhanced IDE hard drive, with pin 1 on the cable corresponding to pin 1 on the hard drive.

Note that when connecting two IDE disk drives you will have to configure one as the master and the other the slave. The configuration is done by setting the jumpers on the disk drives.

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Optional Floppy Drive Connector (CN31)

This connector provides access to one (1) externally mounted floppy drive (3.5”-profile, 720 KB,

1.44 MB, and 2.88 MB types floppy drive).

A 26-pin FPC connector cable is required for the connection to floppy drives. The cable should come with a 26-pin FPC-cable connector and floppy disk drive connector on the other end.

Connecting the Floppy Drive

1. Plug the 26-pin FPC-cable connector into CN31. Make sure that the red wire corresponds to pin one on the connector.

2. Attach the appropriate connector on the other end of the cable to the floppy drive. You can use only one connector in the set.

Compact Flash Disk

When appropriately formatted, a compact Flash disk can serve as a bootable hard drive in applications where installation space is limited. The Compact Flash card occupies a secon dary IDE channel. Configuration options can be found through the BIOS configuration utility.

Parallel Port Connector (CN15)

Parallel port connects to a printer. The WAFER-LX comes with a multi-mode (ECP/EPP/SPP) parallel port. The CN15 parallel port interface features a 26-pin flat-cable connector that requires an adapter cable if a traditional DB-25 connector is preferred. The parallel interface can be re-assigned to LPT2 or LPT3 through the BIOS configuration utility.

The default interrupt channel is IRQ7. Select ECP or EPP DMA mode using the BIOS configuration utility.

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Audio Interface

Audio Connector

AC’97 Audio signals are interfaced through a 10-pin flat-cable connector. These signals include Microphone line-in, line-in stereo, and line-out stereo. An audio 10-pin-to-phone-jack adapter kit is required.

COM Port Connectors [COM1(CN22), COM2/COM3(CN16)]

The WAFER-LX provides two serial ports (COM1: RS-232; COM2: RS-232/422/485) interfaced through one DB-9 connector (COM1) and one 14-pin male header. These serial ports facilitate the connection to serial devices or a communication network, e.g., terminal con sole.

LCD Panel Connection (CN26, CN28, and CN29)

The PCI SVGA interface on the WAFER-LX connects conventional CRT displays and flat panel displays including passive LCD and active LCD displays. There are three (3) connectors onboard for the connection to the three (3) display types:

1. CRT VGA monitors

2. TFT flat panel displays

3. LVDS type LCD panels

One CRT display connector (CN26) is provided as a 15-pin, female D-SUB to connect conventional CRT displays. Pin assignments can be found in Chapter 2 Functional Description.

Flat Panel Display Connector (CN28):

CN28 is a 40-pin connector, Hirose DF13A-40DP-1.25V, which can support a 24-bit LCD panel. A bias control signal, ENVEE, active high on CN28, controls the LCD bias voltage. The LCD bias voltage shall not be applied until the +5V or +3.3V logical supply and panel video signals become stable. When powered on, the control signal remains low until receiving the flat panel signals. CN28 connects up to 24-bit TFT LCD.

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LVDS Connector (CN29):

CN29 is a 20-pin connector, Hirose DF13A-20DP-1.25V. The CN29 connects an 18-bit LCD panel.

Adapter cables are required for connecting the display connectors.

Ethernet Connection (CN20 & CN21)

The onboard 32-bit PCI-bus Ethernet interface is fully compliant with IEEE 802.3U 10/100Mbps CSMA/CD standards. The 10/100BaseT connector connections are made via standard RJ-45 connectors on the front edge.

PXE: Pre-Boot Execution Environment

PXE is an open industry standard developed by a number of software and hardware vendors. IEI BIOS PXE feature allows a workstation to boot from a server on a network by receiving a pre-OS agent prior to booting the operating system on the local hard drive.

Figure 3-7 PXE Central Management

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USB Connection (CN24 and CN19)

The combo USB header (CN24) provides the connectivity of up to two (2) USB (Universal Serial Bus) ports. The USB interface features complete Plug and Play, and hot attach/detach for up to 127 external devices, compliance with USB specification Rev. 1.1. An adapter 10-pin-to-USB cable is required for connecting to CN24. The USB interface is accessed through two 5 x 2-pin connectors, USB01. The adapter cable has one (1) 5x2-pin connector on one end and a standard USB connector on the other.

Accessories Included in Kit

IEI provides the following cables to facilitate connections to your peripheral devices. For more information on the locations of the connectors, please refer to Chapter 2. Cables not included in kit are the user supplied items and should be separately purchased.

Table 3-4 Cables and Accessories Included in Kit

No. Type

1 IDE flat cable 44p/44p (P/N: 32200-000009-RS) 2 SATA cable (P/N: 32000-0628000-RS) 1 SATA power cable (P/N: 32100-086600-RS) 1 PS/2 KB/MS cable (P/N: 32000-000138-RS) 1 Audio adapter cable (P/N: 32000-072100-RS) 1 COM2 serial port cable (RS-232/422/485 compatible; P/N: 32200-000061-RS)

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4

Award BIOS Setup

Chapter

4-1

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Introduction

A licensed copy of Phoenix Award BIOS is preprogrammed into the ROM BIOS. The BIOS setup program allows users to modify the basic system configuration. This chapter describes how to access the BIOS setup program and the configuration options you may change.

1.1.1 Starting Setup

The Phoenix Award BIOS is activated when you turn on the computer. The setup program can be activated in one of two ways.

1. Press the D

2. Press the D appears on the screen.

If the message disappears before you respond, you must restart your computer and try again.

ELETE key as soon as the system is turned on or ELETE key when the “Press Del to enter SETUP” message

1.1.2 Using Setup

Use the arrow keys to highlight items, press ENTER to select, use the PageUp and PageDown keys to change entries, press F1 for help and press E

Key Function

Up arrow Move to the item above Down arrow Move to the item below Left arrow Move to the item on the left hand side Right arrow Move to the item on the right hand side +/Page up Increase the numeric value or make changes

-/Page down Decrease the numeric value or make changes

SC to quit. Navigation keys are shown in.

Esc Main Menu – Quit and not save changes into CMOS

Status Page Setup Menu and Option Page Setup Menu -Exit current page and return to Main Menu

F1 General help, only for Status Page Setup Menu and Option

Page Setup Menu F2 Item help F5 Previous values for the page menu items F6 Fail-safe defaults for the current page menu items F7 Optimized defaults for the current page menu items

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F9 Menu in BIOS F10 Save changes and Exit BIOS

Table 4-1: BIOS Navigation Keys

1.1.3 Getting Help

When you press F1 a small help window describing the appropriate keys to use and the possible selections for the highlighted item appears. To exit the Help Window press E again.

SC or the F1 key

1.1.4 Unable to Reboot After Configuration Changes

If you are unable to boot your computer after you have made changes to the system configuration, you must restore the CMOS defaults. Use the jumper described in Chapter Error! Reference source not found., Section Error! Reference source not found..

1.1.5 Main BIOS Menu

Once the BIOS opens, the main menu in BIOS Menu 1 appears.

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BIOS Menu 1: Award BIOS CMOS Setup Utility

NOTE:

The following sections will completely describe the menus listed below and the configuration options available to users.

The following menu options are seen in BIOS Menu 1.

1. Standard CMOS Features: Changes the basic system configuration.

2. Advanced BIOS Features: Changes the advanced system settings.

3. Advanced Chipset Features: Changes the chipset configuration features

4. Integrated Peripherals: Changes the settings for integrated peripherals

5. Power Management Setup: Allows you to configure power saving options

6. PCIPnP: Changes the advanced PCI/PnP Settings

7. PC Health Status: Menu that monitors essential system parameters

The following user configurable options are also available in the BIOS Main Menu

 Load Fail-Safe Defaults

This option allows you to load failsafe default values for each of the parameters on the Setup menus. F6 key can be used for this operation on any page.

 Load Optimized Defaults

This option allows you to load optimal default values for each of the parameters on the Setup menus. F7 key can be used for this operation on any page.

 Set Supervisor Password

By default no Supervisor Password is set. If you wish to install a supervisor password, select this field and enter the password. After this option has been selected, a red dialogue box with “Enter Password: ” will appear. You will be asked to confirm your password. Retype the original password into the “Confirm Password: ” dialogue box and press enter.

 Change User Password

By default no User Password is set. If you wish to install a user password, select this field and enter the password. After this option has been selected, A red dialogue box with “Enter

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Password: ” will appear. You will be asked to confirm your password. Retype the original password into the “Confirm Password: ” dialogue box and press enter.

 Save & Exit Setup

If you have finished making the configuration changes and wish to save them and exit the BIOS menus, select this option.

 Exit Without Saving

If you have finished making configuration changes but do not want to save them and you want to exit the BIOS menus, select this option.

Standard CMOS Features

When you enter the Standard CMOS Features BIOS menu BIOS Menu 2 appears. The Standard CMOS Features menu allows you to set basic BIOS configuration options.

BIOS Menu 2: Standard CMOS Features

The Standard CMOS Features menu allows you to set both the date and the time field:

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1. Date [mm:dd:yy]: Allows you to set the system date.

2. Time [Day hh/mm/ss]: Allows you to set the system time.

 IDE Master and IDE Slave

When entering setup, BIOS auto detects the presence of IDE devices. This displays the status of the auto detected IDE devices. The following IDE devices will be detected and are shown in the Standard CMOS Features menu:

1. Primary IDE Master

2. Primary IDE Slave

3. Secondary IDE Master

4. Secondary IDE Slave The IDE Configuration menu (BIOS Menu 3) allows you to set or change th e configurations fo r the IDE devices installed in the system. If an IDE device is detected, and one of the above listed four BIOS configuration options are selected, the IDE configuration options shown in Section 1.1.6 appear.

 Drive A [1.44M, 3.5in]

The Drive A configuration option determines the type of floppy drive installed in the system. The floppy drive configuration options are listed below.

1. None

2. 1.44M, 3.5 in (D

EFAULT)

 Halt On

The Halt On category allows users to determine whether the computer will stop if an error is detected during power up.



All Errors



No Errors



All, But Keyboard



All, But Diskette

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(D

EFAULT) Whenever BIOS detects a non-fatal error the

system will be stopped and you will be prompted.

The system boot will not be stopped for any

errors that may be detected

The system boot will not stop for a keyboard

error; it will stop for all other errors.

The system boot will not stop for a disk error;

it will stop for all other errors.

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

All, But Disk/Key

 Base Memory:

The Base Memory is NOT user configurable. The POST will determine the amount of base (or conventional) memory is installed in the system. The value of the base memory is typically 512K for systems with 512K memory installed on the CPU card or 640K for systems with 640K or more memory installed on the motherboard.

 Extended Memory

The Extended Memory is NOT user configurable. The BIOS determines how much extended memory is present during the POST. This is the amount of memory above 1MB located in the memory address map of the CPU.

 Total Memory

The Total Memory is NOT user configurable.

The system boot will not stop for a keyboard

or a disk error; it will stop for all other errors.

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1.1.6 IDE Channel Master

The IDE Channel Master menu (BIOS Menu 3) allows you to set or change the configurations for the master and slave IDE devices for both channel 0 and channel 1.

BIOS Menu 3: IDE Channel Master

 IDE HDD Auto-Detection [Press Enter]

Selecting IDE HDD Auto-Detection option and pressing the “E automatically detect the HDD type. Do not set this option manually.

 IDE Channel 0/1 Master/Slave [Auto]

The IDE Channel option allows you to activate or deactivate the following drive channels:

1. Channel 0 Master

2. Channel 0 Slave

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

None



Auto



Manual

 Access Mode [Auto]

The Access Mode option allows you to determine the hard disk BIOS translation modes. Mo st systems now use hard drives with large capacities and therefore either the LBA translation mode or auto should be selected.



CHS



LBA

If you have no drives connected to the IDE channel

select this option. Once set, this IDE channel will become inaccessible and any drives attached to it undetected.

(D

EFAULT) Setting this option allows the device to be automatically

detected by the BIOS

Selecting this option allows you to manually configure

the device on the IDE channel in BIOS.

Select this mode if the HDD capacity is less than

504MB.

Select this mode if the HDD capacity is more than

8.4GB.



Large



Auto

 Capacity The Capacity specification tells the user the storage capacity of the HDD installed in the system.

 Cylinder

The Cylinder specification tells the user how many cylinders (tracks) are on the HDD installed in the system.

 Head

The Head specification tells the user how many logical heads are on the HDD installed in the system.

This mode is an extended ECHS mode and while it

supports HDDs larger than 504MB, it is not recommended.

(D

EFAULT) If you are unsure of what access mode to set, select this

option

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 Precomp The Precomp specification tells the user on what track the write precompensation begins.

 Landing Zone

The Landing Zone specification tells the user where the disk head will park itself after the system powers off.

 Sector

The Sector specification tells the user how many logical sectors the HDD has been divided into.

Advanced BIOS Features

The Advanced BIOS Features menu (BIOS Menu 4) allows you to access CPU and peripheral device configuration options.

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BIOS Menu 4: Advanced BIOS Features

Once the Advanced BIOS Features menu is selected, two menu options and a host of configuration options are available. The two menu options are:

1. CPU Feature

2. Hard Disk Boot Priority To access these menus, use the arrow keys to select the menu option and press the “E button. The menu will appear. The menus are discussed fully in Section 1.1.7 : CPU Feature and Section 1.1.8 : Hard Disk Boot Priority below.

 Virus Warning [Disabled]

When this item is enabled, the BIOS will monitor the boot sector and partition table of the HDD for any attempt at modification. If an attempt is made, the BIOS will halt the system and an error message will appear. Afterwards, if necessary, you will be able to run an anti-virus program to locate and remove the problem before any damage is done.

NTER”

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

Enabled

Disabled

Activates automatically when the system boots up

causing a warning message to appear when anything attempts to access the boot sector or HDD partition table.

(Default) No warning message will appear when anything attempts

to access the boot sector or HDD partition table.

NOTE:

Many disk diagnostic programs can cause the above warning message to appear when the program attempts to access the boot sector table. If you will be running such a program, it is recommended that you first disable the virus protection function before hand.

 CPU Internal (L1 & L2) Cache [Enabled]

The CPU L1 & L2 Cache option allows users to select whether th e CPU primary cache (L1) and secondary cache (L2) will be turned on or off.



Enabled



Disabled

 Boot From LAN Control

This allows you to utilize the boot-from-LAN feature.

 SATA Boot ROM Control

When enabled, the ALi or ULi SATA ROM management utility will provide the access to RAID configuration utility during the POST stage and allow you to boot from SATA disk drives. You may refer to Appendix C for more details. .

 Boot Device

There are three Boot Device configuration options. They are:

(D

EFAULT) The L1 and L2 CPU caches are both turned on

The L1 and L2 CPU cache s are b oth turned off

1. First Boot Device [D

EFAULT: Floppy]

2. Second Boot Device [D

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3. Third Boot Device [DEFAULT: LS120]

The Boot Device configuration options allow you to select the order of devices the computer will boot from. Using the default values, the system will first look for a FDD to boot from. If it cannot find an FDD it will use an HDD to boot from. If both a FDD and a HDD are unavailable then the system will boot from a LS120 (Super Disk) drive.

Boot Device configuration options are:

1. Floppy

2. LS120

3. HDD-0

4. SCSI

5. CDROM

6. HDD-1

7. ZIP100

8. USB-FDD

9. USB-ZIP

10. USB-CDROM

11. USB-HDD

12. LAN

13. Disabled

 Boot Other Device [Enabled]

The Boot Other Device option determines whether the CPU card will use a second or third boot device if the first boot device is not found.



Enabled

Disabled

(D

EFAULT) The system will look for second and third boot devices if

the first one is not found.

The system will not look for second and third boot device

if the first one is not found.

 Swap Floppy Drive [Disabled]

This option should not avail because FPC interface only allows the connection to one floppy drive.

 Boot Up Floppy Seek [Enabled]

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During the POST, BIOS will determine if the floppy disk drive installed has 40 or 80 tracks. 360K FDDs have 40 tracks while 760K, 1.2M and 1.44M FDDs all have 80 tracks



Enabled

BIOS searches for a FDD to determine if it has 40 or 80

tracks. Note that BIOS cannot tell the difference between 720K, 1.2M or 1.44M drives as they all have 80 tracks.



Disabled

(D

EFAULT) BIOS will not search for the type of FDD drive by track

number. Note that there will not be any warning message if the drive installed is 360K.

 Boot Up Numlock Status [On]

The Boot Up Numlock Status option allows you to determine the default state of the numeric keypad.

 

Off On

The keys on the keypad will be arrow keys (D

EFAULT) The keys on the keypad will be number keys

 Typematic Rate Setting [Disabled]

Disabling the Typematic Rate Setting configuration option only allows one character to appear onto the screen if a key is continuously held down. In other words, the BIOS will only report the key is down. When this option is enabled, the BIOS will report as before, but it will then wait a moment, and, if the key is still down, it will begin to report that the key has been depressed repeate dly. Such a feature would be used to accelerate cursor movements with the arrow keys.

 

Disabled Enabled

(D

EFAULT) Disables the typematic rate

Enables the typematic rate

 x Typematic Rate (Chars/sec) [6]

The Typematic Rate can only be configured if the Typematic Rate Setting is Enabled. The Typematic Rate configuration field determines the rate keys are accelerated.

     

6 8 10 12 15 20

(D

EFAULT) 6 characters per second

8 characters per second 10 characters per second 12 characters per second 15 characters per second 20 characters per second

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 

24 30

24 characters per second 30 characters per second

 x Typematic Delay (Msec) [250]

The Typematic Delay can only be configured if the Typematic Rate Setting is enabled. The Typematic Delay configuration field allows you to select the delay between when the key was first

depressed and when the acceleration begins.



250



500



750



1000

 Gate A20 Option

This option determines the Gate A20 control options. This option only avails in older, DOS, or 16-/32-bit operating systems. For systems running newer, protected or real mode, operating

(D

EFAULT) 250 milliseconds

500 milliseconds 750 milliseconds 1000 milliseconds

systems, this option should never be changed.

 Security Option [Setup]

The Security Option configuration option allows you to limit access to the system and Setup or just to the Setup.



Setup



System

(D

EFAULT) The system will not boot and access to Setup will be

denied if the correct password is not entered at the prompt.

The system will boot, but access to Setup will be de nied if

the correct password is not entered at the prompt.

NOTE:

To disable security, select the password setting in the Main Menu. When asked to enter a password, do not type anything, press, “E security is disabled. Once the security is disabled, the system will boot and

NTER” and the

you can enter Setup freely.

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 OS Select For DRAM > 64MB [Non-OS2]

The OS Select For DRAM > 64MB option allows you to specify the operating system you are using.



Enabled

Disabled

Only select this if you are using the OS/2 operating

system

(D

EFAULT) If you are not using the OS/2 operating system then

disable this function.

 Video BIOS For DRAM [Disabled]

When enabled, the video BIOS is copied to the system RAM for quicker access. Shadowing boosts BIOS turnaround speed for that BIOS is accessed by CPU through the memory bus rather than the original 8-bit X bus.

 Small Logo (EPA) Show [Disabled]

The Small Logo (EPA) Show option determines if the logo will appear during the system boot-up process. If it is enabled then the boot up process may be delayed.



Enabled

EPA logo will appear during the boot up process.

Environmental Protection Agency (EPA)



Disabled

(D

EFAULT) EPA logo will not appear during the boot up process.

 Delay For HDD (Secs) [3]

A large numb er can be applied for slowly-initiated (longer spin-up time) hard drives depending on the specifications provided by your hard drive vendors.

 Cyrix 6x86/MII CPPUID [Enabled]

This option determines whether to use the function of controlling or accessing the Cyrix 6x86/MII CPU ID.

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1.1.7 CPU Feature

The CPU Feature menu (BIOS Menu 5) shows CPU configuration options.

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BIOS Menu 5: CPU Feature

 CPU Frequency [500 MHz]

This option allows you to change the CPU FSB frequency. Setting this value too high may damage your embedded board.

 Memory Frequency [333 MHz]

This option allows you to manually change the operating frequency of your system memory. Setting this value too high may damage your embedded board.

 CAS Latency [Auto]

This controls the time delay (in clock cycles - CLKs) that passes before the SDRAM starts to carry out a read command after receiving it. This also determines the number of CLKs for the completion of the first part of a burst transfer. In other words, the lower the latency, the faster the transaction. Note that some SDRAM modules may not be able to handle the lower latency and will become unstable and lose data.

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 Interleave Select [LOI]

The Interleave Select BIOS feature controls the timing for reading the next bank of data when the DRAM interleave or SDRAM bank interleave is enabled. The lower the option, the faster the DRAM modules can interleave and as the result, the better performance.

 Video Memory Size [8 M]

This option selects the size of the graphics aperture. The aperture is a portion of the PCI memory address range dedicated as graphics memory address space. Host cycles that hit the aperture range are forwarded to the graphics controller without need for translation. This size also determines the maximum amount of system RAM that can be allocated to the graphics card for texture storage.

 Output Display [Panel & CRT]

This option allows you to select either one of the display types (Flat Panel & CRT) or both of the display types connected to the embedded board.

 Flat Panel Configuration [Press Enter]

The Flat Panel configuration provides access to fine-tune the flat panel display characteristics.

The options include:

1. LVDS, TFT, or auto-detect the LCD display connection.

2. Resolutions ranging from 320x420 to 1600x1200.

3. 9-24 bits, 1 ppc or 18, 24 bits, 2ppc.

4. Refresh Rate ranging from 60 to 100Hz.

5. HSYNC Polarity value to High or Low.

6. VSYNC Polarity value to High or Low.

7. SHFCLK Active Period time to Active Only or Free running.

8. LP Active Period time to Active Only or Free Running.

 Onboard Audio [Enabled]

The Onboard Audio configuration option enables or disables the Realtek AC’97 CODEC onboard.

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1.1.8 Hard Disk Boot Priority

The Hard Disk Boot Priority menu (BIOS Menu 6) is shown below.

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BIOS Menu 6: Hard Disk Boot Priority

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Advanced Chipset Features

The Advanced Chipset Features menu (BIOS Menu 7) allows you to change the configuration for the chipset configuration options.

BIOS Menu 7: Advanced Chipset Features

 DRAM Latency Timing [By SPD]

The DRAM Latency Timing configuration option allows you to select whether the manufacturer recommended settings for the following DRAM configuration options are automatically detected by the BIOS or if you manually select the DRAM settings. The DRAM configuration options are:

1. CAS Latency Time [4]

2. DRAM RAS# to CAS# Delay [4]

3. DRAM RAS# Precharge [4]

4. Precharge Delay (tRAS) [12]

5. System Memory Frequency [533MHz]

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 

Manual By SPD

You set the above configuration options manually (D

EFAULT) The BIOS automatically detects the settings

recommended by the manufacturer

 CAS Latency Time [4]

The CAS Latency Time configuration option refers to the Column Address Strobe (CAS) delay time. (To be able to change this configuration option the DRAM Latency Timing configuration option must be set to “Manual”) The following configuration options are available

1. 5 nanoseconds

2. 4 nanoseconds (D

EFAULT)

3. 3 nanoseconds

4. Auto

 DRAM RAS# to CAS# Delay [4]

The DRAM RAS# to CAS# Delay refers to the Row Address Strobe (RAS) to CAS delay time. (To be able to change this configuration option the DRAM Latency Timing configuration option must be set to “Manual”) The following configuration options are available

1. 2 nanoseconds

2. 3 nanoseconds

3. 4 nanoseconds (D

EFAULT)

4. 5 nanoseconds

5. Auto

 DRAM RAS# Precharge [4]

The DRAM RAS# Precharge option indicates how fast your RAM can terminate the access of one row and start accessing another. (To be able to change this configuration optio n the D RAM RAS# Precharge configuration option must be set to “Manual”) The following configuration options are available

1. 2 nanoseconds

2. 3 nanoseconds

3. 4 nanoseconds (D

EFAULT)

4. 5 nanoseconds

5. Auto

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 Precharge dealy (tRAS) [12]

The Precharge Dealy option allows you to set the time it takes for the RAS to start retrieving the

actual data after a request has been issued to the memory module. (To be able to change this

configuration option the DRAM RAS# Precharge configuration option must be set to “Manual”) The following configuration options are available,

1. Auto

2. 2 nanoseconds

3. 3 nanoseconds

4. 4 nanoseconds

5. 5 nanoseconds

6. 6 nanoseconds

7. 7 nanoseconds

8. 8 nanoseconds

9. 9 nanoseconds

10. 10 nanoseconds

11. 11 nanoseconds

12. 12 nanoseconds (D

13. 13 nanoseconds

14. 14 nanoseconds

15. 15 nanoseconds

 System Memory Frequency

The System Memory Frequency configuration option allows you to manually select the speed of the installed memory module. The default value is 533MHz. If you are not certain of what value to select, select “Auto” and the BIOS will automatically detect the speed. (To be ab l e to change this configuration option the DRAM RAS# Precharge configuration option must be set to “Manual”) The following configuration options are available,

1. Auto

2. 333MHz

EFAULT)

3. 400MHz

4. 533MHz (D

 SLP_S4# Assertion Width [4 to 5 sec]

The following configuration options are available,

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1. 4 to 5 sec (DEFAULT)

2. 3 to 4 sec

3. 2 to 3 sec

4. 1 to 2 sec

 System BIOS Cacheable [Enabled]

The System BIOS Cacheable option allows the system BIOS to be cache d in the L2 cache.



Disabled



Enabled

 Video BIOS Cacheable [Disabled] The Video BIOS Cacheable option allows the video BIOS to be cached in the L2 cache.



Disabled



Enabled

 Memory Hole At 15M – 16M [Disabled]

The Memory Hole At 15M – 16M reserves the memory space between 15MB and 16MB for ISA expansion cards that require a specified area of memory to work properly. If you are using old er ISA expansion cards, please refer to the documentation that came with the card to see if it is necessary to reserve the space.



Disabled



Enabled

System BIOS is not cached in the L2 cache (D

EFAULT) System BIOS is cached in the L2 cache

Video BIOS is not cached in the L2 cache (D

EFAULT) Video BIOS is cached in the L2 cache

(D

EFAULT) Memory is not reserved for ISA expansion cards

Memory is reserved for ISA expansion cards

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 PCI Express Root Port Func. [Press Enter] When you select this option the PCI Express Port Functions menu (BIOS Menu 7) appears:

BIOS Menu 8: PCI Express Port Functions

 PEG/Onchip VGA Control [Auto]

The PEG/Onchip VGA Control option is found on motherboards that have a built-in graphics processor as well as a PCI-E port. It allows you to select whether to use the onboard gra phics processor or the PCI-E card.



On-Chip VGA



PEG Port



Auto

The system will boot up using the on-chip graphics

processor regardless of whether or not a PCI graphics card is installed.

The system will boot up using the installed PCI

graphics card.

(D

EFAULT) During the boot process, the BIOS will automatically

detect to see if there is a PCI graphics card

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installed. If no card is installed then the system will automatically boot using the on-chip graphics processor.

 On-Chip Frame Buffer Size [8MB]

The On-Chip Frame Buffer Size option allows you to allocate a predetermined amount of syst em memory to the graphics processor when the system boots up.



1MB

1MB of system memory is allocated to the graphics

processor



8MB

(D

EFAULT) 8MB of system memory is allocated to the graphics

processor

 DVMT Mode [DVMT]

The DVMT Mode option allows you to control Intel's

Dynamic Video Memory Technology (DVMT).

The key idea in DVMT is to improve the efficiency of the memory allocated to either system or



Fixed

A fixed amount of memory is allocated as graphics

memory to ensure that the graphics memory will always be sufficient. Once the memory has been allocated as graphics memory it cannot be accessed by the system.



DVMT

(D

EFAULT) The graphics chip assesses the system and graphics

memory requirement and dynamically allocates memory either as graphics memory or system memory according to the predetermined needs.



Both

 DVMT/FIXED Memory Size [128MB]

The DVMT/FIXED Memory Size option allows you to determine the maximum amount of memory that may be allocated as fixed graphics memory.



64MB



128MB

A fixed amount of memory will be set as graphics

memory but if more graphics memory is required, more memory will be allocated to meet the graphics memory needs.

The maximum amount of fixed memory allocated to

graphics memory is 64MB

(D

EFAULT) The maximum amount of fixed memory allocated to

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graphics memory is 128MB

 Boot Display [Auto]

The Boot Display option allows you to select the display device the system will boot with.



  

Auto

CRT TV EFP

(D

EFAULT) The system will automatically determine the display

device type. The display device type will be set as CRT The display device type will be set as TV The display device type will be set as EFP

Integrated Peripherals

The Integrated Peripherals menu (BIOS Menu 9) allows you to change the configuration option for peripheral devices.

BIOS Menu 9: Integrated Peripherals

The Integrated Peripherals menu (BIOS Menu 9) has three options listed below:

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1. Master Drive PIO Mode

2. Slave Drive PIO Mode

3. IDE Primary Master UDMA

4. IDE Primary Slave UDMA

5. IDE DMA transfer access

6. IDE HDD Block Mode

7. Onboard FDC Controller

8. Onboard Serial Port 1

9. Onboard Serial Port 2

10. Onboard Serial Port 3

11. Onboard Parallel Port

12. Parallel Port Mode

Select the menu you wish to configure.

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The OnChip IDE Device menu (BIOS Menu 10) allows you to change the IDE device configurations.

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BIOS Menu 10: Integrated Peripherals

 Master/Slave Drive PIO Mode [Auto]

PIO means Programmed Input/Output. Instead of constantly issuing BIOS commands to facilitate I/O transfers to and from the hard disk drives, the PIO mode allows the BIOS to issue I/O requests and let CPU and IDE controller to fulfill the requests. Four modes from 0 to 4 are supported.

1. IDE Primary Master PIO

2. IDE Primary Slave PIO

3. IDE Secondary Master PIO

4. IDE Secondary Slave PIO



Auto



0 1 2 3 4

 IDE Primary Master/Slave UDMA [Auto]

The Ultra DMA (UDMA) mode for the following HDDs can all be selected.



Auto



Disabled

EFAULT) Allows the computer to select the correct mode

(D PIO mode 0 selected with a maximum transfer rate of 3.3MBps PIO mode 1 selected with a maximum transfer rate of 5.2MBps PIO mode 2 selected with a maximum transfer rate of 8.3MBps PIO mode 3 selected with a maximum transfer rate of 11.1MBps PIO mode 4 selected with a maximum transfer rate of 16.6MBps

1. IDE Primary Master UDMA

2. IDE Primary Slave UDMA

3. IDE Secondary Master UDMA

4. IDE Secondary Slave UDMA (D

EFAULT) Allows the computer to select the correct UDMA

Disables the UDMA for the HDD device

 IDE DMA transfer access [Enabled]

The IDE DMA transfer access option allows you to determine whether or not the IDE device installed in the system will have a DMA device.



Disabled

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The IDE HDD installed in the system will not have DMA

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

Enabled

(D

EFAULT) The IDE HDD installed in the system will have DMA

transfer access

 IDE HDD Block Mode [Enabled]

The IDE HDD Block Mode option should only be enabled if your IDE HDD device supports block mode. Please refer to the documentation that came with your IDE HDD device to check the compatibility.

 

Disabled Enabled

The BIOS will not detect block data transfers. (D

EFAULT) The optimal number of block read/writes per sector the

drive can support will be automatically detected.

 Onboard FDC Controller [Enabled]

The Onboard FDC Controller option allows you to enable or disable the Floppy Drive controller. .

 Onboard Serial Port # [Auto]

These options are used to select the port address for specific on-board serial po rt. The options a re 3F8H, 2F8H, 3E8H, 2E8H, Auto and Disable. Port 1 is COM1, Port 2 is Com2 and so on. The operating mode of COM2/COM3 can be selected through jumpers on the embedded board.

 Onboard Parallel Port [378/IRQ7]

These options are used to select the port address for specific on-board serial po rt. The options a re 378/IRQ7, 278/IRQ5, 3BC/IRQ7, and Disable.



SPP

EFAULT) The parallel port will operate in the standard parallel

(D

port (SPP) mode. This parallel port mode will work with most parallel port devices but is slow.



EPP

The parallel port will operate in the enhanced parallel

port mode (EPP). The EPP mode supports bi-directional communication between the system and the parallel port device and the transmission rates between the two are much faster than the SPP mode.



ECP

The parallel port will operate in the extended

capabilities port (ECP) mode. The ECP mode supports bi-directional communication between the system and

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the parallel port device and the transmission rates between the two are much faster than the SPP mode.



ECP+EPP



Normal

 Parallel Port Mode [SPP]

These options are used to select the parallel port operating mode. The options are SPP, EPP, ECP, ECP+EPP, and Normal. Two specific options avail when either of the ECP or EPP modes is selected: EPP Mode Select and ECP Mode Use DMA.

If the EPP mode is selected in the Parallel Port Mode configuration option, you will be able to configure the EPP Mode Select option. The EPP parallel port mode has two standards, EPP 1.7 and EP 1.9. This selection allows you to choose the standard the parallel port will operate in. Please refer to the parallel device that your system will be connected to and select the EPP mode accordingly.



EPP1.9

The parallel port will be compatible with both ECP and

EPP devices

EPP 1.9 is selected as the EPP standard



EPP1.7

 x ECP Mode Use DMA [3]

If the ECP mode is selected in the Parallel Port Mode configuration option, you will be able to configure the ECP Mode Use DMA option. This option determines the DMA channel the parallel port uses when it is in the ECP mode.



1 Parallel port uses DMA Channel 1 in the ECP mode



3 (D

(D

EFAULT) EPP 1.7 is selected as the EPP standard

EFAULT) Parallel port uses DMA Channel 3 in the ECP mode

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Power Management Setup

The Power Management Setup menu (BIOS Menu 9) allows you to set the power management and saving features in the BIOS.

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BIOS Menu 11: Power Management Setup

 ACPI Function [Enabled] The ACPI Function option allows you to enable or disable the ACPI function.

 

Disabled Enabled

The ACPI function is enabled (D

EFAULT) The ACPI function is disabled

 ACPI Suspend Type [S1(POS)]

The ACPI Suspend Type option allows you to select the suspend state your computer will go into during the power conservation mode.



S1(POS)

(D

EFAULT) System appears off. The CPU is stopped; RAM is

refreshed; the system is running in a low power mode.

 Power Management [User Define]

The Power Management option allows you to manually define the Suspend Mode and the HDD Power Down options. BIOS has preset minimum and maximum values for the Suspend Mode and the HDD Power Down options.



User Define

(D

EFAULT)

The user defines the Suspend Mode time and the HDD Power Down time.



Min. Saving



Max. Saving

The minimum and maximum power settings are shown below:

Min. Saving Max. Saving

Suspend Mode HDD Power Down

1 hour 15 minutes 1 minute 1 minute

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BIOS automatically sets the Suspend Mode time and the HDD Power Down time for minimum power saving. BIOS automatically sets the Suspend Mode time and the HDD Power Down time for maximum power saving.

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 Standby Mode

Defines the continuous idle time before the system enters Standby Mode. If any item defined is enabled & active Standby timer will be reloaded. The standby mode turns screen and hard drives off

 Suspend Mode

Defines the timeout before the system enters the Suspend Mode. The suspend mode powers down the system and keeps a trickle of power. If an interrupt to RTC reaches, the system wakes up.

 Video Off In Suspend [Yes]

The Video Off In Suspend option allows you to specify whether the display monitor is turned off or remains on when the systems enters a suspend state.



No



Yes

 Suspend Type [Stop Grant]

The Suspend Type option allows you to determine what suspend state the CPU will go into when the system is in the suspend state.



Stop Grant



PwrON Suspend

The display monitor will remain on when the system is in

suspend mode.

(D

EFAULT) The display monitor will be turned off when the system is in

suspend mode.

(D

EFAULT) When the CPU is in the stop grant state the bus

clock (BCLK) continues to run. Snoops and interrupts are also allowed in the stop grant state. Thus, the CPU can operate in a lower power state yet can respond to snoops and interrupts.

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 MODEM Use IRQ [3]

The MODEM Use IRQ option tells the power management which IRQ it should monitor for modem wakeup. The following options can be selected.

1. N/A

2. 3 (DEFAULT)

3. 4

4. 5

5. 7

6. 9

7. 10

8. 11

 Suspend Mode [Disabled]

The Suspend Mode option allows you to specify how long the computer must wait for no activity before it goes into a suspend mode. If you disable this option the system will not go into a suspend mode. Note that if you selected max. or min. as the setting for the Power Management option, you will not be able to configure this setting. The following settings can be made.

1. Disable (D 1 Min 2 Min 3 Min 4 Min

2. 8 Min

3. 12 Min

4. 20 Min

5. 30 Min

EFAULT)

6. 40 Min 1 Hour

 HDD Power Down [Disabled]

The HDD Power Down option allows you to specify how long the computer must wait for no activity before the HDD powers down. If you disable this option the HDD will not power down. Note

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that if you selected max. or min. as the setting for the Power Management option, you will not be able to configure this setting. The following settings can be made.

Disable (D 1 Min 2 Min 3 Min 4 Min 5 Min 6 Min 7 Min 8 Min 9 Min 10 Min 11 Min 12 Min 13 Min 14 Min 15 Min

EFAULT)

 Soft –Off by PWR-BTTN [Instant-Off]

The Soft –Off by PWR-BTTN option allows you to define how the system responds when the power button is pushed. You may choose to allow the system to be either turned off completely or enter into a suspend mode.



Instant-Off



Delay 4 Sec

 Wake-Up by PCI Card [Enabled]

The Wake-Up by PCI Card option allows users to wake a system in a suspended state through a network. A wakeup signal from a network can be routed directly through the PCI card.



Disabled

(D

EFAULT) The system will be turned off as soon as the power

button is pressed.

The power button must be pressed for more than

four seconds before it is turned off. If it is pressed for less than four seconds the system will enter a suspend state.

The system cannot be woken from a suspend state

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