The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are
Copyright
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.
Page iii
Page 4
WAFER-CX700M 3.5" SBC
THIS PAGE IS INTENTIONALLY LEFT BLANK
Page iv
Page 5
WAFER-CX700M 3.5" SBC
Manual Conventions
WARNING!
Warnings appear where overlooked details may cause damage to the equipment or result
in personal injury. Warnings should be taken seriously. Warnings are easy to recognize.
The word “warning” is written as “WARNING,” both capitalized and bold and is followed by
text. The text is the warning message. A warning message is shown below:
WARNING:
This is an example of a warning message. Failure to adhere to warning
messages may result in permanent damage to the WAFER-CX700M or
personal injury to the user. Please take warning messages seriously.
CAUTION!
Cautionary messages should also be heeded to help reduce the chance of losing data or
damaging the WAFER-CX700M. Cautions are easy to recognize. The word “caution” is
written as “CAUTION,” both capitalized and bold and is followed. The text is the cautionary
message. A caution message is shown below:
CAUTION:
This is an example of a caution message. Failure to adhere to cautions
messages may result in permanent damage to the WAFER-CX700M.
Please take caution messages seriously.
Page v
Page 6
WAFER-CX700M 3.5" SBC
NOTE:
These messages inform the reader of essential but non-critical information. These
messages should be read carefully as any directions or instructions contained therein can
help avoid making mistakes. Notes are easy to recognize. The word “note” is written as
“NOTE,” both capitalized and bold and is followed by text. The text is the cautionary
message. A note message is shown below:
NOTE:
This is an example of a note message. Notes should always be read.
Notes contain critical information about the WAFER-CX700M. Please
take note messages seriously.
Page vi
Page 7
WAFER-CX700M 3.5" SBC
NOTE:
If any of the components listed in the checklist below are missing,
please do not proceed with the installation. Contact the IEI reseller or
vendor you purchased the WAFER-CX700M from or contact an IEI
sales representative directly. To contact an IEI sales representative,
Packing List
please send an email to
The items listed below should all be included in the WAFER-CX700M package.
1 x WAFER-CX700M single board computer
1 x Mini jumper pack
1 x IDE flat cable 44-pin
2 x SATA cables
1 x SATA power cable
3 x RS-232 cable
1 x Keyboard/Mouse cable
2 x USB cable
1 x Audio cable
1 x Utility CD
1 x QIG (quick installation guide)
BIOS Menu 1: Main.......................................................................................................................88
BIOS Menu 2: Advanced..............................................................................................................90
BIOS Menu 3: CPU Configuration...............................................................................................91
BIOS Menu 4: IDE Configuration.................................................................................................92
BIOS Menu 5: IDE Master and IDE Slave Configuration...........................................................94
BIOS Menu 6: Super IO Configuration........................................................................................98
BIOS Menu 7: ACPI Configuration [Advanced Power Configuration].................................. 101
BIOS Menu 8:Advanced Power Management Configuration ................................................ 102
BIOS Menu 9: Remote Access Configuration [Advanced].................................................... 105
BIOS Menu 10: USB Configuration.......................................................................................... 108
BIOS Menu 11: USB Mass Storage Device Configuration..................................................... 110
BIOS Menu 12: PCI/PnP Configuration.................................................................................... 113
BIOS Menu 13: Boot.................................................................................................................. 115
BIOS Menu 14: Boot Settings Configuration.......................................................................... 116
BIOS Menu 15: Boot Device Priority Settings ........................................................................ 119
BIOS Menu 16: Removable Drives........................................................................................... 120
BIOS Menu 17: Security............................................................................................................ 121
BIOS Menu 18: Chipset............................................................................................................. 122
BIOS Menu 19:Northbridge Chipset Configuration................................................................ 123
BIOS Menu 20:Southbridge Chipset Configuration............................................................... 126
BIOS Menu 21: Exit.................................................................................................................... 127
Page xxi
Page 22
WAFER-CX700M 3.5" SBC
THIS PAGE IS INTENTIONALLY LEFT BLANK
Page xxii
Page 23
WAFER-CX700M 3.5" SBC
Chapter
1
1 Introduction
Page 1
Page 24
1.1 Introduction
WAFER-CX700M 3.5" SBC
Figure 1-1: WAFER-CX700M
The WAFER-CX700M 3.5” motherboard is a VIA® Eden or VIA® C7 processor platform.
The WAFER-CX700M features a VIA® CX700M system chipset, which combines both
Southbridge and Northbridge into a single package fitting the size of a standard
Northbridge. Support for VGA, LVDS and DVI displays provides diversified display
functionalities. Two Realtek RTL8110SC Gigabit Ethernet controllers ensure secure
network connectivity. Storage capabilities are provided by two SATA ports, an IDE port
and a CompactFlash® slot. A Mini PCI expansion card is easily connected to the system
through a Mini PCI expansion slot. Four USB 2.0 connectors, four serial ports provides
additional expansion options to the system ensuring a variety of USB 2.0 devices can be
connected to the WAFER-CX700M.
1.2 Benefits
Some of the benefits of the WAFER-CX700M include:
Ultra-low power consumption
Page 2
High data throughput and high-speed DDR2
Network connectivity
Video outputs suitable for different applications
Page 25
WAFER-CX700M 3.5" SBC
1.3 Features
Some of the features of the WAFER-CX700M are listed below.
3.5” form factor
VIA® Eden or VIA® C7 CPU
VIA® CX700M system chipset
Multiple display options including
o VGA
o DVI
o 24-bit dual-channel LVDS
Multiple serial port connectors including:
o Three RS-232
o One RS-232/422/485
Multiple storage options including:
o IDE hard drive slot
o CompactFlash® type I/II slot
o Two SATA II ports
Page 3
Page 26
1.4 Overview
The WAFER-CX700M has a wide variety of peripheral interface connectors. Below is a
labeled photo of the peripheral interface connectors on the front side of the
WAFER-CX700M.
WAFER-CX700M 3.5" SBC
Page 4
Figure 1-2: WAFER-CX700M Overview (Front)
Below is a photo of the peripheral interface connectors on the solder side of the
WAFER-CX700M.
Page 27
WAFER-CX700M 3.5" SBC
Figure 1-3: WAFER-CX700M Overview (Solder Side)
1.5 Peripheral Connectors and Jumpers
The WAFER-CX700M has the following connectors on-board:
1 x Audio connector
1 x Backlight inverter connector
1 x Battery connector
1 x CD audio input connector
1 x CompactFlash® Card socket (solder side)
1 x DDR2 SO-DIMM socket (solder side)
1 x Digital I/O connector
1 x DVI connector
1 x Fan connector
1 x Front panel connector
Page 5
Page 28
1 x IDE connector
1 x LVDS LCD connector
1 x Mini PCI
1 x Power connector
1 x PS_ON connector
1 x Reset button connector
2 x RS-232 serial port connector
1 x RS-232/422/485 serial port connector
2 x SATA connector
2 x USB 2.0 connector
WAFER-CX700M 3.5" SBC
The WAFER-CX700M has the following external peripheral interface connectors on the
board rear panel.
2 x RJ-45 Ethernet connectors
1 x RS-232 serial port connector
1 x PS-2 connector
1 x VGA connector
The WAFER-CX700M has the following on-board jumpers:
The diagram below shows the data flow between the onboard CPU, system chipset and
other components installed on the motherboard and described in the following sections of
this chapter.
WAFER-CX700M 3.5" SBC
Figure 2-3: Data Flow Block Diagram
Page 12
Page 35
WAFER-CX700M 3.5" SBC
2.3 VIA® C7 CPU
The WAFER-CX700M has a VIA® C7 processor preinstalled.
Figure 2-4: VIA® C7 Processor
Some of the main specifications of the VIA® C7 CPU are listed below.
Full x86/x87 operating system and software application compatibili ty
Processor frequencies up to 2.0 GHz
VIA® V4 bus up to 800 MHz FSB
128 KB L2 cache
Sophisticated branch prediction mechanism
MMX, SSE, SSE2 and SSE3 instruction sets
NX execute protection
Two quantum -based random number generators
2.4 VIA® CX700M System Chipset
The VIA® CX700M combines a feature rich Southbridge and Northbridge into a single
package the same size as a typical Northbridge. The VIA® CX700M offers a full
multimedia experience with three different choices of graphical output including VGA, DVI
and LVDS, audio output and dedicated decoding of MPEG-2/4 and WMV9.
Page 13
Page 36
2.4.1 Graphics
WAFER-CX700M 3.5" SBC
Figure 2-5: Graphics
The following video outputs are implemented on the WAFER-CX700M.
The VIA® CX700M chipset supports RGB video output through a DB-15 connector on the
external peripheral connector interface. The VGA port supports RGB output and HDTV
output.
Page 14
Page 37
WAFER-CX700M 3.5" SBC
2.4.1.2 DVI
The VIA® CX700M chipset supports DVI video output via pin header on the
WAFER-CX700M. The DVI and LVDS video outputs share a video channel so only one
can be used at a time.
2.4.1.3 LVDS
The VIA® CX700M chipset supports LVDS video output via a 15-pin crimp header on the
WAFER-CX700M. The LVDS and DVI video outputs share a video channel so only one
can be used at a time.
2.4.2 Memory
The VIA® CX700M system chipset on the WAFER-CX700M supports one 200-pin DDR2
SO-DIMM with the following features:
One 200-pin SO-DIMM
DDR2 only (DO NOT install a DDR DIMM)
Capacities of 256MB, 512MB or 1GB
Transfer speeds of 400MHz or 533MHz
64-bit wide channel
The memory socket is shown below.
Figure 2-6: 200-pin DDR2 SO-DIMM Sockets
Page 15
Page 38
2.4.3 SATA
WAFER-CX700M 3.5" SBC
The SATA controller supports two full duplex 3.0 Gbps dual channel SATA drives. The two
SATA drive connectors are shown below.
Figure 2-7: 1.5Gbps SATA Drive Connectors
2.4.4 IDE Controller
Up to two IDE devices are supported on the IDE bus. A single IDE hard drive and
CompactFlash® card can be installed on the system.
2.4.4.1 CompactFlash® Slot
The CompactFlash® socket supports standard CF Type I and CF Type II cards. The
chipset flash interface is multiplexed with an IDE interface and can be connected to an
array of industry standard NAND Flash or NOR Flash devices. The CompactFlash® card
is connected to the IDE bus.
Page 16
Page 39
WAFER-CX700M 3.5" SBC
Figure 2-8: CompactFlash® Slot
2.4.4.2 IDE Slot
The single IDE connector supports two ATA-6 HDDs. An ATA-6 (Ultra ATA/100) compliant
IDE controller has a maximum transfer rate of 100MB/s. ATA-6 includes advancements in
error checking and ATA-6 drives are compatible with future interface additions.
Figure 2-9: IDE Slot
The onboard ATA-6 controller is able to support the following IDE HDDs:
Ultra A T A/10 0, with data transfer rates up to 100MB/s
Ultra A T A/66, with data transfer rates up to 66MB/s
Ultra A T A/33, with data transfer rates up to 33MB/s
Specification Ultra ATA/100 Ultra ATA/66 Ultra ATA/33
IDE devices
Four USB pin headers on the WAFER-CX700M board are interfaced to the system chipset
USB controller. Four USB 1.1 or USB 2.0 devices can be connected simultaneously to the
WAFER-CX700M.
Page 18
Figure 2-10: USB Ports
The chipset USB controller has the following specifications:
o 4 USB ports
Page 41
WAFER-CX700M 3.5" SBC
o USB 1.1 and USB 2.0 compliant
o 3 host ports
o 1 host/device
2.4.6 PCI Bus
The PCI bus is connected to the components listed below:
The PCI bus complies with PCI Local Bus Specification, Revision 2.2 and supports 33MHz
PCI operations.
2.4.6.1 Realtek RTL8110SC GbE Controller
Two PCI lanes are connected to two Realtek RTL8110SC GbE controllers shown below.
Figure 2-11: Realtek PCI GbE Controllers
The Realtek RTL8110SC PCI GbE controllers combine a triple-speed IEEE 802.3
compliant Media Access Controller (MAC) with a triple-speed Ethernet transceiver, 32-bit
Page 19
Page 42
WAFER-CX700M 3.5" SBC
PCI bus controller, and embedded memory. With state-of-the-art DSP technology and
mixed-mode signal technology, they offer high-speed transmission over CAT 5 UTP cable
or CAT 3 UTP (10Mbps only) cable. Functions such as Crossover Detection &
Auto-Correction, polarity correction, adaptive equalization, cross-talk cancellation, echo
cancellation, timing recovery, and error correction are implemented to provide robust
transmission and reception capability at high speeds.
Some of the features of the Realtek RTL8110SC PCI GbE controllers are listed below.
Integrated 10/100/1000 transceiver
Auto-Negotiation with Next Page capability
Supports PCI rev.2.3, 32-bit, 33/66MHz
Supports pair swap/polarity/skew correction
Crossover Detection & Auto-Correction
Wake-on-LAN and remote wake-up support
Microsoft® NDIS5 Checksum Offload (IP, TCP, UDP) and largesend of fload
support
Supports Full Duplex flow control (IEEE 802.3x)
Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Supports IEEE 802.1P Layer 2 Priority Encoding
Supports IEEE 802.1Q VLAN tagging
Serial EEPROM
3.3/1.8/1.5 V signaling, 5 V PCI I/O tolerant
0.15µm CMOS process
Transmit/Receive FIFO (8K/64K) support
Supports power down/link down power saving
Supports PCI Message Signaled Interrupt (MSI)
2.4.7 Keyboard/Mouse
The keyboard/mouse controller can execute the 8042 instruction set. Some of the
keyboard controller features are listed below:
Page 20
The 8042 instruction is compatible with a PS/2 keyboard and PS/2 mouse
Gate A20 and Keyboard reset output
Supports multiple keyboard power on events
Page 43
WAFER-CX700M 3.5" SBC
Supports mouse double-click and/or mouse move power on events
2.4.8 LPC Bus
The LPC bus is connected to components listed below:
Lattice Semiconductor LC4032V Digital I/O Chipset ...............22
Fintek F81216DG Serial Port Chipset......................................22
2.4.8.1 BIOS Chipset
The BIOS chipset has a licensed copy of AMI BIOS installed on the chipset.
Figure 2-12: BIOS Chipset
Some of the BIOS features are listed below:
AMI Flash BIOS
SMIBIOS (DMI) compliant
Console redirection function support
PXE (Pre-boot Execution Environment) support
USB booting support
Page 21
Page 44
WAFER-CX700M 3.5" SBC
2.4.8.2 Lattice Semiconductor LC4032V Digital I/O Chipset
The Lattice Semiconductor digital I/O chipset enables a 24-bit Digital I/O. The LC4032V
chipset consists of multiple 36-input, 16 macrocell Generic Logic Blocks interconnecte d by
a Global Routing Pool. Output Routing Pools (ORPs) connect the GLBs to the I/O Blocks
that contain multiple I/O cells.
Figure 2-13: Lattice Semiconductor LC4064V Digital I/O Chipset
Some of the features of the Lattice Semiconductor LC4032V chipset are listed below:
Up to four global clock pins with programmable clock polarity control
400MHz maximum operating frequency
Operates with 3.3 V, 2.5 V or 1.8 V power
2.4.8.3 Fintek F81216DG LPC Serial Port Chipset
The Fintek F81216DG chipset enables the addition of four additional UART serial ports
(COM1, COM2, COM3 and COM4). UART includes 16-byte send/receive FIFO. The
Fintek serial port chipset is interfaced to the system chipset through the LPC bus.
Page 22
Page 45
WAFER-CX700M 3.5" SBC
Figure 2-14: Fintek F81216DG LPC Serial Port Chipset
Some of the features of the Fintek chipset are listed below:
One Watch dog timer with WDTOUT# signal
One Frequency input 24/48 MHz
Powered by 3 Vcc
2.4.9 Audio
The High Definition Audio is interfaced to the onboard audio connector through the VIA®
VT1708A audio chipset.
Page 23
Page 46
WAFER-CX700M 3.5" SBC
2.4.9.1 VIA® VT1708A Audio Chipset
The VIA® VT1708A High Definition Audio chipset supports 8-channel, 24-bit, 192 KHz
audio content. The audio chipset features a 100dB S/N ratio and complies with the Intel®
High Definition Audio Rev. 1.0 specification. VIA® HD Audio codecs include a high quality
headphone amplifier, enhanced recording support, and advanced power management
features, ideal for mobile devices.
Figure 2-15: VIA® VT1708A High Definition Audio Chipset
Some of the features of the audio chipset are listed below:
Built-in headphone amplifier
4 stereo DACs support 24-bit, 192 KHz samples
DAC with 100dB S/N ratio
2 stereo ADCs suppo rt 24-bit, 192KHz samples
ADC with 95dB S/N Ratio
High quality differential CD input
HPF in ADC path for DC removal
Analog CD input path for compatibility
Supports EAPD (External Amplifier Power Down)
Power management and enhanced power saving features
Page 24
Digital: 3.3 V; Analog: 3.3 V / 5.0 V
Page 47
WAFER-CX700M 3.5" SBC
2.5 Environmental and Power Specifications
2.5.1 System Monitoring
The thermal inputs on the WAFER-CX700M monitor the following temperatures:
System temperature
Power temperature
CPU temperature
The voltage inputs on the WAFER-CX700M monitor the following voltages:
A cooling fan and heat sink must be installed on the system. Thermal paste must be
smeared on the lower side of the heat sink before it is mounted. The stock heat sink and
fan cover both the system chipset and CPU.
2.5.3 Power Consumption
The table below shows the power consumption parameters for the WAFER-CX700M
running with a 1.5 GHz VIA® C7 and 1.0 GB of 533 MHz DDR2 memory.
Voltage Current
+5V 4.1 A
+12V 0.55 A
5 VSB 0.07 A
Table 2-2: Power Consumption
WAFER-CX700M 3.5" SBC
Page 26
Page 49
WAFER-CX700M 3.5" SBC
Chapter
3
3 Unpacking
Page 27
Page 50
3.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during the installation of the
WAFER-CX700M may result in permanent damage to the
WAFER-CX700M and severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER-CX700M. Dry climates are particularly susceptible to ESD. It is
therefore critical that whenever the WAFER-CX700M or any other electronic component is
handled, the following anti-static precautions are strictly adhered to:
Wear and anti-static wristband: - Wea ring a simple anti-st atic wristband can
WAFER-CX700M 3.5" SBC
help to prevent ESD from damaging the WAFER-CX700M.
Self-grounding: - Before handling the WAFER-CX700M touch any grounded
conducting material. During the time of handling, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad : - When configuring the WAFER-CX700M, place it on
an anti-static pad. This reduces the possibility of ESD damaging the
WAFER-CX700M.
Only handle the PCB by the edges: - When handling the PCB, hold the PCB
by it’s edges.
3.2 Unpacking Precautions
When the WAFER-CX700M is unpacked, please do the following:
Follow the anti-static precautions outline in Section 3.1.
Make sure the packing box if facing upwards so the WAFER-CX700M does
not fall out of the box.
Make sure all of the components shown in the next section are present.
Page 28
Page 51
WAFER-CX700M 3.5" SBC
3.3 Package Contents
NOTE:
If any of the components listed in the checklist below are missing, do
not proceed with the installation. Contact the IEI reseller or vendor that
the WAFER-CX700M was purchased from, or contact and IEI sales
representative directly by sending an email to
The WAFER-CX700M is shipped with the following components.
Quantity Item and Part Number Image
1 WAFER-CX700M
1 Audio cable
(P/N: 32000-072100-RS)
2 SATA cable
(P/N: 32000-062800-RS)
1 SATA power cable
(P/N: 32100-088600-RS)
sales@iei.com.tw.
2 Dual USB cable (wo bracket)
(P/N: 32000-070300-RS)
1 HDD cable (44-pin)
(P/N: 32200-000009-RS)
3 Single COM port (w/o bracket)
(P/N: 32200-000049-RS)
1 KB/MS PS/2 Y-cable
(P/N: 32000-000138-RS)
Page 29
Page 52
Quantity Item and Part Number Image
1 Utility CD
1 Quick Installation Guide
1 Mini jumper pack (2.0mm)
(P/N: 33100-000033-RS)
Table 3-1: Packing List Items
WAFER-CX700M 3.5" SBC
Page 30
Page 53
WAFER-CX700M 3.5" SBC
4 Connector Pinouts
Chapter
4
Page 31
Page 54
4.1 Peripheral Interface Connectors
Section 4.1.1 shows peripheral interface connector locations. Section 0 lists all the
WAFER-CX700M 3.5" SBC
peripheral interface connectors seen in Section
4.1.1.
4.1.1 Layout
The figures below show the on-board peripheral connectors, rear panel peripheral
connectors and on-board jumpers.
Page 32
Figure 4-1: Connector and Jumper Locations
Page 55
WAFER-CX700M 3.5" SBC
Figure 4-2: Connector and Jumper Locations (Solder Side)
4.1.2 Peripheral Interface Connectors
Table 4-1 shows a list of the peripheral interface connectors on the WAFER-CX700M.
IDE Interface connector 40-pin header CN6
LVDS connector 30-pin crimp header LVDS1
Mini PCI connector Mini PCI connector MINIPCI1
Power connector 4-pin Molex connector CN7
PS_ON connector 3-pin wafer CN9
Reset button connector 2-pin wafer CN13
Serial ATA drive connector 7-pin SATA SATA1
Serial ATA drive connector 7-pin SATA SATA2
Serial port connector 10-pin header CN10
Serial port connector 10-pin header CN11
Serial port connector 10-pin header CN12
WAFER-CX700M 3.5" SBC
USB connectors 8-pin header USB1
USB connectors 8-pin header USB2
Table 4-1: Peripheral Interface Connectors
4.1.3 External Interface Panel Connectors
Table 4-2 lists the rear panel connectors on the WAFER-CX700M.
Internal peripheral connectors are found on the motherboard and are only accessible
when the motherboard is outside of the chassis. T his se ction h as complet e d esc ription s of
all the internal peripheral connectors on the WAFER-CX700M.
4.2.1 Audio Connector
CN Label: CN3
CN Type:
CN Location:
CN Pinouts:
The 10-pin audio header is connected to external audio devices. The audio pin header
provides a connection for microphone input, line level stereo input and amplified stereo
output.
10-pin header (2 x 5)
Figure 4-3
See
Table 4-3
See
Figure 4-3: Audio Connector Location (10-pin)
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 AUDIO OUT RIGHT 2 AUDIO OUT LEFT
3 GROUND 4 GROUND
5 LINE IN RIGHT 6 LINE IN LEFT
7 MIC IN RIGHT 8 MIC IN LEFT
9 GROUND 10 GROUND
Table 4-3: Audio Connector Pinouts (10-pin)
Page 35
Page 58
4.2.2 Backlight Inverter Connector
CN Label: CN1
WAFER-CX700M 3.5" SBC
CN Type:
CN Location:
CN Pinouts:
The backlight inverter connector provides the backlight on the LCD display connected to
the WAFER-CX700M with +12V of power.
1 12 V
2 12 V
3 BACKLIGHT ON
4 BACKLIGHT ADJUST
5 GROUND
6 GROUND
Table 4-4: Panel Backlight Connector Pinouts
Page 59
WAFER-CX700M 3.5" SBC
4.2.3 Battery Connector
CN Label: CN5
CN Type:
CN Location:
CN Pinouts:
The battery connector is connected to a backup battery. The battery connector is also
used to reset the CMOS memory if the incorrect BIOS settings have been made and the
system cannot boot up.
2-pin box header (1x2)
Figure 4-5
See
Table 4-5
See
Figure 4-5: Battery Connector Location
PIN NO. DESCRIPTION
1 Battery+
2 Ground
Table 4-5: Battery Connector Pinouts
4.2.4 CompactFlash® Slot
CN Label: CN18
CN Type:
CN Location:
CN Pinouts:
50-pin header (2x25)
Figure 4-6
See
Table 4-6
See
Page 37
Page 60
WAFER-CX700M 3.5" SBC
A CF Type I or Type II memory card is inserted to the CF socket on the solder side of the
WAFER-CX700M.
Figure 4-6: CF Card Socket Location
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GROUND 26 CD1#
2 DATA 3 27 DATA 11
3 DATA 4 28 DATA 12
4 DATA 5 29 DATA 13
5 DATA 6 30 DATA 14
6 DATA 7 31 DATA 15
7 CE# 32 CE2#
8 N/C 33 VS1#
9 OE# 34 IOR#
10 A9 35 IOW#
11 A8 36 WE#
12 A7 37 IRQ
Page 38
13 VCC1 38 VCC2
14 A6 39 CSEL#
Page 61
WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
15 A5 40 VS2#
16 A4 41 RESET#
17 A3 42 WAIT#
18 A2 43 INPACK#
19 A1 44 REG#
20 A0 45 BVD2
21 DATA 0 46 BVD1
22 DATA 1 47 DATA 8
23 DATA 2 48 DATA 9
24 IOCS16# 49 DATA 10
25 CD2# 50 GROUND
Table 4-6: CF Card Socket Pinouts
4.2.5 CD Audio Connector
CN Label: CN2
CN Type:
CN Location:
CN Pinouts:
4-pin header (1 x 4)
Figure 4-7
See
Table 4-7
See
The 4-pin audio CD in connector is connected to an external audio CD device for the input
and output of audio signals from a CD player to the system.
Figure 4-7: Audio CD In Connector Pinouts (4-pin)
Page 39
Page 62
PIN NO. DESCRIPTION
1 CD Signal (Right)
2 Ground
3 Ground
4 CD Signal (Left)
Table 4-7: Audio CD In Connector Pinouts
4.2.6 Digital Input/Output Connector
CN Label: CN8
WAFER-CX700M 3.5" SBC
CN Type:
CN Location:
CN Pinouts:
The digital input/output connector is managed through a Super I/O chip. The DIO
connector pins are user programmable.
10-pin header (2x5)
Figure 4-8
See
Table 4-8
See
Page 40
Figure 4-8: DIO Connector Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GND 2 VCC
3 Output 3 4 Output 2
5 Output 1 6 Output 0
Page 63
WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
7 Input 3 8 Input 2
9 Input 1 10 Input 0
Table 4-8: DIO Connector Pinouts
4.2.7 DVI Connector
CN Label: DVI1
CN Type:
CN Location:
CN Pinouts:
26-pin header (2 x 13)
Figure 4-9
See
Table 4-9
See
The DVI connects to a monitor that is accepts DVI input signals.
The cooling fan connector provides a 12V, 500mA current to a system cooling fan. The
connector has a "rotation" pin to get rotation signals from fans and notify the system so the
system BIOS can recognize the fan speed. Please note that only specified fans can issue
the rotation signals.
3-pin wafer (1 x 3)
Figure 4-10
See
Table 4-10
See
Page 42
Figure 4-10: Fan Connector Location
Page 65
WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION
1 Rotation Signal
2 +12V
3 GND
Table 4-10: +12V Fan Connector Pinouts
4.2.9 Front Panel Connector
CN Label: CN4
CN Type:
CN Location:
CN Pinouts:
The front panel connector connects to external switches and indicators to monitor and
controls the motherboard. These indicators and switches include:
Power button
Reset button
Power LED
HDD LED
8-pin header (2 x 4)
Figure 4-11
See
Table 4-11
See
Figure 4-11: Front Panel Connector Location
Page 43
Page 66
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GND 2 PW_BN
3 GND 4 -EXTSMI
5 BUZZER- 6 BUZZER+
7 GND 8 AT_FUNCTION
Table 4-11: Front Panel Connector Pinouts
4.2.10 IDE Connector
CN Label: CN6
WAFER-CX700M 3.5" SBC
CN Type:
CN Location:
CN Pinouts:
One 40-pin IDE device connector on the WAFER-CX700M supports connectivity to two
hard disk drives.
44-pin header (2 x 22)
Figure 4-12
See
Table 4-12
See
Page 44
Page 67
WAFER-CX700M 3.5" SBC
Figure 4-12: IDE Device Connector Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 RESET# 2 GROUND
3 DATA 7 4 DATA 8
5 DATA 6 6 DATA 9
7 DATA 5 8 DATA 10
9 DATA 4 10 DATA 11
11 DATA 3 12 DATA 12
13 DATA 2 14 DATA 13
15 DATA 1 16 DATA 14
17 DATA 0 18 DATA 15
19 GROUND 20 N/C
21 IDE DRQ 22 GROUND
23 IOW# 24 GROUND
25 IOR# 26 GROUND
27 IDE CHRDY 28 GROUND
29 IDE DACK 30 GROUND–DEFAULT
31 INTERRUPT 32 N/C
33 SA1 34 N/C
Page 45
Page 68
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
35 SA0 36 SA2
37 HDC CS0# 38 HDC CS1#
39 HDD ACTIVE# 40 GROUND
41 VCC 42 VCC
43 GROUND 44 N/C
Table 4-12: IDE Connector Pinouts
4.2.11 LVDS Connector
CN Label: LVDS1
WAFER-CX700M 3.5" SBC
CN Type:
CN Location:
CN Pinouts:
The 30-pin LVDS LCD connector can be connected to single channel or dual channel,
18-bit or 36-bit LVDS panel.
The Mini PCI slot enables a Mini PCI expansion module to be connected to the board.
124-pin Mini PCI Slot
Figure 4-14
See
Table 4-14: Mini PCI Slot Pinouts
See
Page 47
Page 70
WAFER-CX700M 3.5" SBC
Page 48
Figure 4-14: Mini PCI Slot Location
Page 71
WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 NC 2 NC
3 NC 4 NC
5 NC 6 NC
7 NC 8 NC
9 NC 10 NC
11 NC 12 NC
13 NC 14 NC
15 GND 16 NC
17 PINTD# 18 VCC5
19 VCC3 20 PINTC#
21 NC 22 NC
23 GND 24 VCC3SB
25 CLK_MPCI 26 PCI_RST1#
27 GND 28 VCC3
29 PCI_REQ2# 30 PCI_GNT2#
31 VCC3 32 GND
33 PAD31 34 PPME#
35 PAD29 36 NC
37 GND 38 PAD30
39 PAD27 40 VCC3
41 PAD25 42 PAD28
43 NC 44 PAD26
45 PC/BE3# 46 PAD24
47 PAD23 48 PAD29
49 GND 50 GND
51 PAD21 52 PAD22
53 PAD19 54 PAD20
55 GND 56 PPAR
57 PAD17 58 PAD18
59 PC/BE2# 60 PAD16
Page 49
Page 72
WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
61 PIRDY# 62 GND
63 VCC3 64 PFRAME#
65 NC 66 PTRDY#
67 SERR# 68 PSTOP#
69 GND 70 VCC3
71 PERR# 72 PDEVSEL#
73 PC/BE1# 74 GND
75 PAD14 76 PAD15
77 GND 78 PAD13
79 PAD12 80 PAD11
81 PAD10 82 GND
83 GND 84 PAD9
85 PAD8 86 PC/BE0#
87 PAD7 88 VCC3
89 VCC3 90 PAD6
91 PAD5 92 PAD4
93 NC 94 PAD2
95 PAD3 96 PAD0
97 VCC5 98 NC
99 PAD1 100 NC
101 GND 102 GND
103 NC 104 NC
105 NC 106 NC
107 NC 108 NC
109 NC 110 NC
111 NC 112 NC
113 NC 114 GND
115 NC 116 NC
Page 50
117 NC 118 NC
119 NC 120 NC
121 NC 122 NC
Page 73
WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
123 NC 124 VCC3SB
Table 4-14: Mini PCI Slot Pinouts
4.2.13 Power Connector
CN Label: CN7
CN Type:
CN Location:
CN Pinouts:
The 4-pin AT power connector is connected to an AT power supply.
Figure 4-15: AT Power Connector Location
4-pin AT power connector (1x4)
Figure 4-15
See
Table 4-15
See
PIN NO. DESCRIPTION
1 +12 V
2 GND
3 GND
4 +5 V
Table 4-15: Power Connector Pinouts
4.2.14 PS_ON Connector
CN Label: CN9
Page 51
Page 74
WAFER-CX700M 3.5" SBC
CN Type:
CN Location:
CN Pinouts:
The ATX power supply enable connector enables the WAFER-CX700M to be connected
to an ATX power supply. In default mode, the WAFER-CX700M can only us an AT power
supply. To enable an ATX power supply the AT Power Select jumper must also be
configured. Please refer to Chapter 3 for more details.
3-pin wafer (1x3)
Figure 4-16
See
Table 4-16
See
Figure 4-16: ATX Power Supply Enable Connector Location
PIN NO. DESCRIPTION
1 +5V Standby
2 GND
3 PS-ON
Table 4-16: ATX Power Supply Enable Connector Pinouts
4.2.15 Reset Button Connector
CN Label: CN13
CN Type:
CN Location:
CN Pinouts:
2-pin wafer (1x2)
Figure 4-17
See
Table 4-17
See
Page 52
The reset button connector is connected to a reset switch o n the syst em chassi s to enabl e
users to reboot the system when the system is turned on.
Page 75
WAFER-CX700M 3.5" SBC
Figure 4-17: Reset Button Connector Locations
PIN NO. DESCRIPTION
1 Reset Switch
2 GND
Table 4-17: Reset Button Connector Pinouts
4.2.16 SATA Drive Connectors
CN Label:
CN Type:
CN Location:
CN Pinouts:
The SATA drive connectors are each connected to second generation SATA drives.
Second generation SATA drives transfer data at speeds as high as 3.0 Gb/s. The SATA
drives can be configured in a RAID configuration.
SA TA1 and SATA2
7-pin SATA drive connectors
Figure 4-18
See
Table 4-18
See
Page 53
Page 76
WAFER-CX700M 3.5" SBC
Figure 4-18: SATA Drive Connector Locations
PIN NO. DESCRIPTION
1 GND
2 TX+
3 TX4 GND
5 RX6 RX+
7 GND
Table 4-18: SATA Drive Connector Pinouts
4.2.17 Serial Port Connectors
CN Label:
CN Type:
CN Location:
CN Pinouts:
CN10, CN11 and CN12
10-pin header (2x5)
Figure 4-19
See
Table 4-19
See
Page 54
The 10-pin serial port connectors provide RS-232 serial communications channels. The
serial port connector can be connected to external RS-232 serial port devices.
Page 77
WAFER-CX700M 3.5" SBC
Figure 4-19: COM Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 Data Carrier Direct (DCD) 2 Data Set Ready (DSR)
3 Receive Data (RXD) 4 Request To Send (RTS)
5 Transmit Data (TXD) 6 Clear To Send (CTS)
7 Data Terminal Ready (DTR) 8 Ring Indicator (RI)
9 Ground (GND)
Table 4-19: COM Connector Pinouts
4.2.18 USB Connectors
CN Label:
CN Type:
CN Location:
CN Pinouts:
The 2x4 USB pin connectors each provide connectivity to two USB 1.1 or two USB 2.0
ports. Each USB connector can support two USB devices. Additional external USB ports
USB1 and USB2
8-pin header (2x4)
Figure 4-20
See
Table 4-20
See
are found on the rear panel. The USB ports are used for I/O bus expansion.
The WAFER-CX700M is equipped with two built-in RJ-45 Ethernet controllers. The
controllers can connect to the LAN through two RJ-45 LAN connectors. There are two
LEDs on the connector indicating the status of LAN. The pin assignments are listed in the
following table:
PIN DESCRIPTION PIN DESCRIPTION
1 TXA+ 5 TXC2 TXA- 6 TXB-
3 TXB+ 7 TXD+
4 TXC+ 8 TXD-
Table 4-21: LAN Pinouts
LAN1 and LAN2
RJ-45
Figure 4-21
See
Table 4-21
See
Figure 4-22: RJ-45 Ethernet Connector
Page 57
Page 80
WAFER-CX700M 3.5" SBC
The RJ-45 Ethernet connector has two status LEDs, one green and one yello w. The green
LED indicates activity on the port and the yellow LED indicates the port is linked. See
Table 4-22.
STATUS
GREEN Activity YELLOW Linked
DESCRIPTION STATUS DESCRIPTION
Table 4-22: RJ-45 Ethernet Connector LEDs
4.3.2 Keyboard/Mouse Connector
CN Label: CN16
CN Type:
CN Location:
CN Pinouts:
The keyboard and mouse connector is a standard PS/2 connector.
PS/2
Figure 4-21
See
Table 4-23
See
Page 58
Figure 4-23: PS/2 Pinout and Configuration
PIN DESCRIPTION
1 KB DATA
2 MS DATA
3 GND
4 VCC
5 KB CLOCK
6 MS CLOCK
Table 4-23: Keyboard Connector Pinouts
Page 81
WAFER-CX700M 3.5" SBC
4.3.3 Serial Port Connectors
CN Label: CN16
CN Type:
CN Location:
CN Pinouts:
The 9-pin DB-9 CN16 serial port connector is connected to RS-23 2 serial com munications
devices.
The WAFER-CX700M has a single 15-pin female connector for connectivity to standard
display devices.
WAFER-CX700M 3.5" SBC
Figure 4-25: VGA Connector
PIN DESCRIPTION PIN DESCRIPTION
1 RED 2 GREEN
3 BLUE 4 NC
5 GND 6 GND
7 GND 8 GND
9 VCC / NC 10 GND
11 NC 12 DDC DAT
13 HSYNC 14 VSYNC
15 DDCCLK
Table 4-25: VGA Connector Pinouts
Page 60
Page 83
WAFER-CX700M 3.5" SBC
Chapter
5
5 Installation
Page 61
Page 84
5.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during the installation of the
WAFER-CX700M may result in permanent damage to the
WAFER-CX700M and severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER-CX700M. Dry climates are particularly susceptible to ESD. It is
therefore critical that whenever the WAFER-CX700M or any other electronic component is
handled, the following anti-static precautions are strictly adhered to:
Wear and anti-static wristband: - Wea ring a simple anti-st atic wristband can
WAFER-CX700M 3.5" SBC
help to prevent ESD from damaging the WAFER-CX700M.
Self-grounding: - Before handling the WAFER-CX700M touch any grounded
conducting material. During the time of handling, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad : - When configuring the WAFER-CX700M, place it on
an anti-static pad. This reduces the possibility of ESD damaging the
WAFER-CX700M.
Only handle the PCB by the edges: - When handling the PCB, hold the PCB
by it’s edges.
Page 62
Page 85
WAFER-CX700M 3.5" SBC
5.2 Installation Considerations
NOTE:
The following installation notices and installation considerations should
be read and understood before the WAFER-CX700M in installed. All
installation notices pertaining to the installation of the WAFER-CX700M
should be strictly adhered to. Failing to adhere to these precautions
may lead to severe damage of the WAFER-CX700M and injury to the
person installing the motherboard.
5.2.1 Installation Notices
WARNING:
The installation instructions described in this manual should be
carefully followed in order to prevent damage to the WAFER-CX700M
and its accessories, and prevent injury to the user.
Before and during the installation please DO the following:
Read the user manual:
o The user manual provides a complete description of the
WAFER-CX700M installation instructions and configuration options.
Wear an electrostatic discharge cuff (ESD):
o Electronic components are easily damaged by ESD. Wearing an ESD cuff
removes ESD from the body and helps prevent ESD damage.
Place the WAFER-CX700M on an antistatic pad:
o When installing or configuring the motherboard, place it on an antistatic
pad. This helps to prevent potential ESD damage.
Turn all power to the WAFER-CX700M off:
Page 63
Page 86
o When working with the WAFER-CX700M, make sure that it is
disconnected from all power supplies and that no electricity is being fed
into the system.
Before and during the installation of the WAFER-CX700M DO NOT do the following:
DO NOT remove any of the stickers on the PCB board. These stickers are
required for warranty validation.
DO NOT use the product before verifying all the cables and power con nectors
are properly connected.
DO NOT allow screws to come in contact with the PCB circuit, con nector pins,
or its components.
5.2.2 Installation Checklist
The following checklist is provided to ensure the WAFER-CX700M is properly installed.
WAFER-CX700M 3.5" SBC
All the items in the packing list are present
The CPU is installed
The CPU cooling kit is properly installed
A compatible memory module is properly inserted into the slot
The jumpers have been properly configured
The WAFER-CX700M is inserted into a chassis with adequate ventilation
The correct power supply is being used
The following devices are properly connected
o Primary and secondary IDE device
o SATA drives
o Keyboard and mouse cable
o Audio kit
o Power supply
o USB cable
o Serial port cable
o Parallel port cable
The following external peripheral devices are properly connected to the
Page 64
chassis:
o DVI screen
Page 87
WAFER-CX700M 3.5" SBC
o Keyboard
o Mouse
o LAN
5.2.3 Airflow
WARNING:
Airflow is critical to the cooling of the CPU and other onboard
components. The chassis in which the WAFER-CX700M is installed
must have air vents to allow cool air into the system and hot air to move
out.
The WAFER-CX700M must be installed in a chassis with ventilation holes on the sides
allowing airflow to travel through the heat sink surface. In a system with an individual
power supply unit, the cooling fan of a power supply can also help generate airflow
through the board surface.
5.3 Unpacking Precautions
When the WAFER-CX700M is unpacked, please do the following:
Follow the anti-static precautions outlined above.
Make sure the packing box is facing upwards so the WAFER-CX700M does
not fall out of the box.
Make sure all the components in the checklist shown in Chapter 3 are
present.
Page 65
Page 88
WAFER-CX700M 3.5" SBC
NOTE:
If some of the components listed in the checklist in Chapter 3 are
missing, please do not proceed with the installation. Contact the IEI
reseller or vendor you purchased the WAFER-CX700M from or contact
an IEI sales representative directly. To contact an IEI sales
representative, please send an email to
5.4 Cooling Kit and DIMM Installation
WARNING:
A CPU should never be turned on without the specified cooling kit
being installed. If the cooling kit (heat sink and fan) is not properly
installed and the system turned on, permanent damage to the CPU,
WAFER-CX700M and other electronic components attached to the
system may be incurred. Running a CPU without a cooling kit may also
result in injury to the user.
The CPU, CPU cooling kit and DIMM are the most critical components of the
WAFER-CX700M. If one of these component is not installed the WAFER-CX700M cannot
sales@iei.com.tw.
run.
5.4.1 Cooling Kit Installation
The WAFER-CX700M comes with a cooling kit preinstalled. The cooling kit is attached to
the WAFER-CX700M with three screws. The cooling fan is attached to the heatsink with
two metal clips. Three wires attach the cooling fan to the cooling fan power connector on
the board. The cooling kit is custom designed for the WAFER-CX700M and should not be
replaced with an alternate cooling kit.
Page 66
Page 89
WAFER-CX700M 3.5" SBC
5.4.2 SO-DIMM Installation
WARNING:
Using incorrectly specified SO-DIMM may cause permanent damage to
the WAFER-CX700M. Please make sure the purchased SO-DIMM
complies with the memory specifications of the WAFER-CX700M.
SO-DIMM specifications compliant with the WAFER-CX700M are listed
in Chapter 2.
To install a SO-DIMM into a SO-DIMM socket, please follow the steps below and refer to
Figure 5-1.
Figure 5-1: SO-DIMM Installation
Step 1: Locate the SO-DIMM socket. Place the WAFER-CX700M on an anti-static pad
with the solder side facing up.
Step 2: Align the SO-DIMM with the socket. The SO-DIMM must be oriented in such a
way that the notch in the middle of the SO-DIMM must be aligned with the
plastic bridge in the socket.
Step 3: Insert the SO-DIMM. Push the SO-DIMM chip into the socket at an angle. (See
Figure 5-1)
Step 4: Open the SO-DIMM socket arms. Gently pull the arms of the SO-DIMM socket
out and push the rear of the SO-DIMM down. (See
Figure 5-1)
Page 67
Page 90
Step 5: Secure the SO-DIMM. Release the arms on the SO-DIMM socket. They clip into
place and secure the SO-DIMM in the socket.Step 0:
5.4.3 CF Card Installation
NOTE:
The WAFER-CX700M can support both CF Type I cards and CF Type
II cards. For the complete specifications of the supported CF cards
please refer to Chapter 2.
To install the a CF card (Type 1 or Type 2) onto the WAFER-CX700M, please follow the
steps below:
WAFER-CX700M 3.5" SBC
Step 1: Locate the CF card socket. Place the WAFER-CX700M on an anti-static pa d
with the solder side facing up. Locate the CF card slot.
Step 2: Align the CF card. Make sure the CF card is properly aligned with the CF cards
slot.
Step 3: Insert the CF card. Gently insert the CF card into the socket making sure the
socket pins are properly inserted into the socket. See
Figure 5-2. Step 0:
Page 68
Page 91
WAFER-CX700M 3.5" SBC
Figure 5-2: CF Card Installation
5.5 Jumper Settings
NOTE:
A jumper is a metal bridge used to close an
electrical circuit. It consists of two or three metal
pins and a small metal clip (often protected by a
plastic cover) that slides over the pins to connect
them. To CLOSE/SHORT a jumper means
connecting the pins of the jumper with the plastic
clip and to OPEN a jumper means removing the
plastic clip from a jumper.
Figure 5-3: Jumper Locations
Before the WAFER-CX700M is installed in the system, the jumpers must be set in
accordance with the desired configuration. The jumpers on the WAFER-CX700M are
listed below.
The AT/ATX Power Supply Selector switch chooses whether an AT or ATX power supply
is used. ATX power supplies allow the motherboard to turn the computer off and offer
power management features. AT power supplies are turned off directly at the power
source
The AT/ATX Power Supply Selector jumper location is shown in Figure 5-4 below.
If the WAFER-CX700M fails to boot due to improper BIOS settings, the clear CMOS
jumper clears the CMOS data and resets the system BIOS information. To do this, use the
jumper cap to close pins 2 and 3 for a few seconds then reinstall the jumper clip back to
pins 1 and 2.
If the “CMOS Settings Wrong” message is displayed during the boot up process, the fault
may be corrected by pressing the F1 to enter the CMOS Setup menu. Do one of the
following:
Enter the correct CMOS setting
Load Optimal Defaults
Load Failsafe Defaults.
3-pin header
Table 5-3
See
Figure 5-5
See
After having done one of the above, save the changes and exit the CMOS Setup menu.
The clear CMOS jumper settings are shown in Table 5-3.
Page 71
Page 94
AT Power Select Description
Short 1 - 2 Keep CMOS Setup Default
Short 2 - 3 Clear CMOS Setup
Table 5-3: Clear CMOS Jumper Settings
The location of the clear CMOS jumper is shown in Figure 5-5 below.
WAFER-CX700M 3.5" SBC
Figure 5-5: Clear CMOS Jumper
5.5.3 LVDS Voltage Selection
WARNING:
Permanent damage to the screen and WAFER-CX700M may occur if the
wrong voltage is selected with this jumper. Please refer to the user guide
that cam with the monitor to select the correct voltage.
Jumper Label: JP2
Jumper Type:
Jumper Settings:
3-pin header
Table 5-4
See
Page 72
Jumper Location:
Figure 5-6
See
Page 95
WAFER-CX700M 3.5" SBC
The LVDS Voltage Selection jumper allows the LVDS screen voltage to be set. The
LVDS Voltage Selection jumper settings are shown in
LVDS Voltage Select Description
Short 1-2 +3.3V LVDS
Short 2-3 +5V LVDS Default
Table 5-4.
Table 5-4: LVDS Voltage Selection Jumper Settings
The LVDS Voltage Selection jumper location is shown in Figure 5-6.
Figure 5-6: LVDS Voltage Selection Jumper Pinout Locations
The RS-232/422/485 Selection Jumper location is shown in Figure 5-6.
WAFER-CX700M 3.5" SBC
Figure 5-7: RS-232/422/485 Selection Jumper
5.6 Internal Peripheral Device Connections
The cables listed in Table 5-6 are shipped with the WAFER-CX700M.
Quantity Type
1 Audio cable
1 IDE cable (44-pin)
1 Keyboard/Mouse Y-cable
3 RS-232 cable
2 SATA drive cable
1 SATA drive power cable
2 USB cable
Page 74
Table 5-6: IEI Provided Cables
Page 97
WAFER-CX700M 3.5" SBC
5.6.1 Audio Cable Installation
The Audio Kit that came with the WAFER-CX700M connects to the 10-pin audio
connector on the WAFER-CX700M. The audio kit consists of three audio jacks. One audio
jack, Mic In, connects to a microphone. The remaining two audio jacks, Line-In and
Line-Out, connect to two speakers. To install the audio kit, please refer to the steps b elow:
Step 1: Locate the audio connector. The location of the 10-pin audio connector is
shown in Chapter 3.
Step 2: Align pin 1. Align pin 1 on the on-board connector with pin 1 on the audio kit
connector. Pin 1 on the audio kit connector is indicated with a white dot. See
Figure 5-8.
Figure 5-8: Audio Cable Connection
Step 3: Connect the audio devices. Connect one speaker to the line-in audio jack, one
speaker to the line-out audio jack and a microphone to the mic-in audio jack.Step 0:
5.6.2 HDD Cable Connection
The 44-pin flat IDE cable connects the WAFER-CX700M to an IDE device. To connect an
IDE HDD to the WAFER-CX700M please follow the instructions below.
Page 75
Page 98
Step 1: Locate the IDE connector. The location/s of the IDE device connector/s is/are
shown in Chapter 3.
Step 2: Insert the connector. Connect the IDE cable connector to the on-board
WAFER-CX700M 3.5" SBC
connector. See
can only be inserted in one direction.
Figure 5-9. A key on the front of the cable connector ensures it
Figure 5-9: IDE Cable Connection
Step 3: Connect the cable to an IDE device. Connect the two connectors on the other
side of the cable to one or two IDE devices. Make sure that pin 1 on the cable
corresponds to pin 1 on the connector.Step 0:
5.6.3 Serial Port Cable Connection
The RS-232/422/485 cable consists of a D-sub 9-pin male connector attached to a single
board connector. To install the RS-232/422/485 cable, please follow the steps below.
Step 1: Locate the connectors. The locations of the RS-232 connectors are shown in
Chapter 3.
Page 76
Page 99
WAFER-CX700M 3.5" SBC
Step 2: Insert the cable connectors. Insert one connector into each serial port box
headers. A key on the front of the cable connectors ensures the connector can
only be installed in one direction.
Figure 5-10: Single RS-232 Cable Installation
Step 3: Secure the connectors. Both single RS-232 connectors have two retention
screws that must be secured to a chassis or bracket.
Step 4: Connect the serial device. Once the single RS-232 connectors are connected
to a chassis or bracket, a serial communications device can be connecte d to the
system.Step 0:
5.6.4 SATA Drive Connection
The WAFER-CX700M is shipped with two SATA drive cables and one SATA drive power
cable. To connect the SATA drives to the connectors, please follow the steps below.
Step 1: Locate the connectors. The locations of the SATA drive connectors are shown
in Chapter 3.
Page 77
Page 100
Step 2: Insert the cable connector. Press the clip on the connector at the end of the
SATA cable and insert the cable connector into the onboard SATA drive
WAFER-CX700M 3.5" SBC
connector. See
Figure 5-11.
Figure 5-11: SATA Drive Cable Connection
Step 3: Connect the cable to the SATA disk. Connect the connector on the other end
of the cable to the connector at the back of the SATA drive. See
Step 4: Connect the SATA power cable. Connect the SATA power connector to the
back of the SATA drive.Step 0:
Figure 5-12.
Page 78
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.