IEI Technology Wafer-CX700m User Manual

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Revision

Date Version Changes
February, 2008 1.00 Initial release
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COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to improve reliability, design and function and does not represent a commitment on the part of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use the product or documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are

Copyright

reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification purposes only and may be trademarks and/or registered trademarks of their respective owners.
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Manual Conventions

WARNING!
Warnings appear where overlooked details may cause damage to the equipment or result in personal injury. Warnings should be taken seriously. Warnings are easy to recognize. The word “warning” is written as “WARNING,” both capitalized and bold and is followed by text. The text is the warning message. A warning message is shown below:
WARNING:
This is an example of a warning message. Failure to adhere to warning messages may result in permanent damage to the WAFER-CX700M or personal injury to the user. Please take warning messages seriously.
CAUTION!
Cautionary messages should also be heeded to help reduce the chance of losing data or damaging the WAFER-CX700M. Cautions are easy to recognize. The word “caution” is written as “CAUTION,” both capitalized and bold and is followed. The text is the cautionary message. A caution message is shown below:
CAUTION:
This is an example of a caution message. Failure to adhere to cautions messages may result in permanent damage to the WAFER-CX700M. Please take caution messages seriously.
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NOTE:
These messages inform the reader of essential but non-critical information. These messages should be read carefully as any directions or instructions contained therein can help avoid making mistakes. Notes are easy to recognize. The word “note” is written as “NOTE,” both capitalized and bold and is followed by text. The text is the cautionary message. A note message is shown below:
NOTE:
This is an example of a note message. Notes should always be read. Notes contain critical information about the WAFER-CX700M. Please take note messages seriously.
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NOTE:
If any of the components listed in the checklist below are missing, please do not proceed with the installation. Contact the IEI reseller or vendor you purchased the WAFER-CX700M from or contact an IEI sales representative directly. To contact an IEI sales representative,

Packing List

please send an email to
The items listed below should all be included in the WAFER-CX700M package.
1 x WAFER-CX700M single board computer 1 x Mini jumper pack 1 x IDE flat cable 44-pin 2 x SATA cables 1 x SATA power cable 3 x RS-232 cable 1 x Keyboard/Mouse cable 2 x USB cable 1 x Audio cable 1 x Utility CD 1 x QIG (quick installation guide)
Images of the above items are shown in Chapter 3.
sales@iei.com.tw.
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Table of Contents

1 INTRODUCTION..................................................................................................... 1
1.1 INTRODUCTION .......................................................................................................... 2
1.2 BENEFITS ................................................................................................................... 2
1.3 FEATURES .................................................................................................................. 3
1.4 OVERVIEW ................................................................................................................. 4
1.5 PERIPHERAL CONNECTORS AND JUMPERS .................................................................. 5
1.6 TECHNICAL SPECIFICATIONS ...................................................................................... 6
2 DETAILED SPECIFICATIONS............................................................................. 9
2.1 DIMENSIONS ............................................................................................................ 10
2.1.1 Board Dimensions............................................................................................ 10
2.1.2 External Interface Panel Dimensions...............................................................11
2.2 DATA FLOW.............................................................................................................. 12
2.3 VIA
2.4 VIA
®
C7 CPU ......................................................................................................... 13
®
CX700M SYSTEM CHIPSET ........................................................................... 13
2.4.1 Graphics........................................................................................................... 14
2.4.1.1 VGA.......................................................................................................... 14
2.4.1.2 DVI ........................................................................................................... 15
2.4.1.3 LVDS ........................................................................................................ 15
2.4.2 Memory............................................................................................................ 15
2.4.3 SATA................................................................................................................. 16
2.4.4 IDE Controller................................................................................................. 16
2.4.4.1 CompactFlash® Slot.................................................................................. 16
2.4.4.2 IDE Slot .................................................................................................... 17
2.4.5 USB.................................................................................................................. 18
2.4.6 PCI Bus............................................................................................................ 19
2.4.6.1 Realtek RTL8110SC GbE Controller ....................................................... 19
2.4.7 Keyboard/Mouse.............................................................................................. 20
2.4.8 LPC Bus........................................................................................................... 21
2.4.8.1 BIOS Chipset............................................................................................ 21
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2.4.8.2 Lattice Semiconductor LC4032V Digital I/O Chipset.............................. 22
2.4.8.3 Fintek F81216DG LPC Serial Port Chipset.............................................. 22
2.4.9 Audio................................................................................................................ 23
2.4.9.1 VIA® VT1708A Audio Chipset................................................................. 24
2.5 ENVIRONMENTAL AND POWER SPECIFICATIONS ....................................................... 25
2.5.1 System Monitoring........................................................................................... 25
2.5.2 Operating Temperature and Temperature Control........................................... 25
2.5.3 Power Consumption......................................................................................... 26
3 UNPACKING .......................................................................................................... 27
3.1 ANTI-STATIC PRECAUTIONS...................................................................................... 28
3.2 UNPACKING PRECAUTIONS....................................................................................... 28
3.3 PACKAGE CONTENTS................................................................................................ 29
4 CONNECTOR PINOUTS...................................................................................... 31
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4.1 PERIPHERAL INTERFACE CONNECTORS .................................................................... 32
4.1.1 Layout .............................................................................................................. 32
4.1.2 Peripheral Interface Connectors ..................................................................... 33
4.1.3 External Interface Panel Connectors............................................................... 34
4.2 INTERNAL PERIPHERAL CONNECTORS...................................................................... 35
4.2.1 Audio Connector .............................................................................................. 35
4.2.2 Backlight Inverter Connector .......................................................................... 36
4.2.3 Battery Connector............................................................................................ 37
4.2.4 CompactFlash® Slot........................................................................................ 37
4.2.5 CD Audio Connector........................................................................................ 39
4.2.6 Digital Input/Output Connector....................................................................... 40
4.2.7 DVI Connector................................................................................................. 41
4.2.8 Fan Connector................................................................................................. 42
4.2.9 Front Panel Connector.................................................................................... 43
4.2.10 IDE Connector............................................................................................... 44
4.2.11 LVDS Connector............................................................................................. 46
4.2.12 Mini PCI Slot ................................................................................................. 47
4.2.13 Power Connector........................................................................................... 51
4.2.14 PS_ON Connector.......................................................................................... 51
4.2.15 Reset Button Connector ................................................................................. 52
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4.2.16 SATA Drive Connectors ................................................................................. 53
4.2.17 Serial Port Connectors .................................................................................. 54
4.2.18 USB Connectors............................................................................................. 55
4.3 EXTERNAL PERIPHERAL INTERFACE CONNECTOR PANEL......................................... 56
4.3.1 LAN Connectors............................................................................................... 57
4.3.2 Keyboard/Mouse Connector............................................................................ 58
4.3.3 Serial Port Connectors .................................................................................... 59
4.3.4 VGA Connector................................................................................................ 59
5 INSTALLATION .................................................................................................... 61
5.1 ANTI-STATIC PRECAUTIONS...................................................................................... 62
5.2 INSTALLATION CONSIDERATIONS ............................................................................. 63
5.2.1 Installation Notices.......................................................................................... 63
5.2.2 Installation Checklist....................................................................................... 64
5.2.3 Airflow.............................................................................................................. 65
5.3 UNPACKING PRECAUTIONS....................................................................................... 65
5.4 COOLING KIT AND DIMM INSTALLATION................................................................ 66
5.4.1 Cooling Kit Installation ................................................................................... 66
5.4.2 SO-DIMM Installation..................................................................................... 67
5.4.3 CF Card Installation........................................................................................ 68
5.5 JUMPER SETTINGS.................................................................................................... 69
5.5.1 AT/ATX Power Supply Selector........................................................................ 70
5.5.2 Clear CMOS Jumper........................................................................................ 71
5.5.3 LVDS Voltage Selection.................................................................................... 72
5.5.4 RS-232/422/485 Selection Jumper................................................................... 73
5.6 INTERNAL PERIPHERAL DEVICE CONNECTIONS........................................................ 74
5.6.1 Audio Cable Installation.................................................................................. 75
5.6.2 HDD Cable Connection................................................................................... 75
5.6.3 Serial Port Cable Connection.......................................................................... 76
5.6.4 SATA Drive Connection ................................................................................... 77
5.6.5 USB Cable (Dual Port without Bracket) ......................................................... 79
5.7 EXTERNAL PERIPHERAL INTERFACE CONNECTION ................................................... 80
5.7.1 Keyboard/Mouse Y-Cable Connection............................................................. 81
5.7.2 LAN Connection............................................................................................... 82
5.7.3 Serial Device Connection ................................................................................ 82
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5.7.4 VGA Monitor Connection ................................................................................ 83
6 BIOS SETUP........................................................................................................... 85
6.1 INTRODUCTION ........................................................................................................ 86
6.1.1 Starting Setup................................................................................................... 86
6.1.2 Using Setup...................................................................................................... 86
6.1.3 Getting Help.....................................................................................................87
6.1.4 Unable to Reboot After Configuration Changes.............................................. 87
6.1.5 BIOS Menu Bar................................................................................................ 87
6.2 MAIN ....................................................................................................................... 88
6.3 ADVANCED............................................................................................................... 89
6.3.1 CPU Configuration.......................................................................................... 90
6.3.2 IDE Configuration........................................................................................... 92
6.3.2.1 IDE Master, IDE Slave............................................................................. 94
6.3.3 Super IO Configuration.................................................................................... 98
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6.3.4 ACPI Configuration ....................................................................................... 101
6.3.5 APM Configuration........................................................................................ 102
6.3.6 Remote Access Configuration........................................................................ 104
6.3.7 USB Configuration......................................................................................... 107
6.3.7.1 USB Mass Storage Device Configuration................................................110
6.4 PCI/PNP .................................................................................................................112
6.5 BOOT ......................................................................................................................115
6.5.1 Boot Settings Configuration............................................................................115
6.5.2 Boot Device Priority.......................................................................................119
6.5.3 Removable Drives...........................................................................................119
6.6 SECURITY............................................................................................................... 120
6.7 CHIPSET ................................................................................................................. 122
6.7.1 Northbridge Configuration............................................................................ 123
6.7.2 Southbridge Configuration ............................................................................ 125
6.8 EXIT....................................................................................................................... 127
7 SOFTWARE DRIVERS....................................................................................... 129
7.1 DRIVER CD AUTO-RUN.......................................................................................... 130
7.2 CHIPSET DRIVER INSTALLATION............................................................................. 132
7.3 GRAPHICS DRIVER INSTALLATION.......................................................................... 137
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7.4 NETWORK ADAPTER DRIVER INSTALLATION.......................................................... 141
7.5 AUDIO DRIVER INSTALLATION ............................................................................... 150
A BIOS OPTIONS.................................................................................................... 157
B TERMINOLOGY................................................................................................. 161
C DIGITAL I/O INTERFACE................................................................................. 165
C.1 INTRODUCTION...................................................................................................... 166
C.2 DIO CONNECTOR PINOUTS ................................................................................... 166
C.3 ASSEMBLY LANGUAGE SAMPLES........................................................................... 167
C.3.1 Enable the DIO Input Function..................................................................... 167
C.3.2 Enable the DIO Output Function.................................................................. 167
D WA TCHDOG TIME R.......................................................................................... 169
E ADDRESS MAPPING.......................................................................................... 173
E.1 IO ADDRESS MAP.................................................................................................. 174
ST
E.2 1
MB MEMORY ADDRESS MAP........................................................................... 174
E.3 IRQ MAPPING TABLE ............................................................................................ 175
E.4 DMA CHANNEL ASSIGNMENTS............................................................................. 175
F HAZARDOUS MATERIALS DISCLOSURE................................................... 177
F.1 HAZARDOUS MATERIALS DISCLOSURE TABLE FOR IPB PRODUCTS CERTIFIED AS
ROHS COMPLIANT UNDER 2002/95/EC WITHOUT MERCURY..................................... 178
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List of Figures

Figure 1-1: WAFER-CX700M..........................................................................................................2
Figure 1-2: WAFER-CX700M Overview (Front)............................................................................4
Figure 1-3: WAFER-CX700M Overview (Solder Side) .................................................................5
Figure 2-1: WAFER-CX700M Dimensions (mm) ........................................................................10
Figure 2-2: External Interface Panel Dimensions (mm)............................................................11
Figure 2-3: Data Flow Block Diagram.........................................................................................12
Figure 2-4: VIA® C7 Processor ...................................................................................................13
Figure 2-5: Graphics.....................................................................................................................14
Figure 2-6: 200-pin DDR2 SO-DIMM Sockets.............................................................................15
Figure 2-7: 1.5Gbps SATA Drive Connectors............................................................................16
Figure 2-8: CompactFlash® Slot.................................................................................................17
Figure 2-9: IDE Slot.......................................................................................................................17
Figure 2-10: USB Ports ................................................................................................................18
Figure 2-11: Realtek PCI GbE Controllers..................................................................................19
Figure 2-12: BIOS Chipset...........................................................................................................21
Figure 2-13: Lattice Semiconductor LC4064V Digital I/O Chipset...........................................22
Figure 2-14: Fintek F81216DG LPC Serial Port Chipset ...........................................................23
Figure 2-15: VIA® VT1708A High Definition Audio Chipset.....................................................24
Figure 4-1: Connector and Jumper Locations...........................................................................32
Figure 4-2: Connector and Jumper Locations (Solder Side) ...................................................33
Figure 4-3: Audio Connector Location (10-pin).........................................................................35
Figure 4-4: Panel Backlight Connector Pinout Locations........................................................36
Figure 4-5: Battery Connector Location.....................................................................................37
Figure 4-6: CF Card Socket Location .........................................................................................38
Figure 4-7: Audio CD In Connector Pinouts (4-pin)..................................................................39
Figure 4-8: DIO Connector Locations.........................................................................................40
Figure 4-9: DVI Connector Location...........................................................................................41
Figure 4-10: Fan Connector Location.........................................................................................42
Figure 4-11: Front Panel Connector Location ...........................................................................43
Figure 4-12: IDE Device Connector Locations ..........................................................................45
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Figure 4-13: LVDS LCD Connector Pinout Locations...............................................................46
Figure 4-14: Mini PCI Slot Location............................................................................................48
Figure 4-15: AT Power Connector Location ..............................................................................51
Figure 4-16: ATX Power Supply Enable Connector Location..................................................52
Figure 4-17: Reset Button Connector Locations.......................................................................53
Figure 4-18: SATA Drive Connector Locations.........................................................................54
Figure 4-19: COM Connector Pinout Locations ........................................................................55
Figure 4-20: USB Connector Pinout Locations.........................................................................56
Figure 4-21: WAFER-CX700M External Peripheral Interface Connector.................................57
Figure 4-22: RJ-45 Ethernet Connector......................................................................................57
Figure 4-23: PS/2 Pinout and Configuration..............................................................................58
Figure 4-24: COM1 Pinout Locations..........................................................................................59
Figure 4-25: VGA Connector .......................................................................................................60
Figure 5-1: SO-DIMM Installation................................................................................................67
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Figure 5-2: CF Card Installation..................................................................................................69
Figure 5-3: Jumper Locations.....................................................................................................69
Figure 5-4: AT/ATX Power Supply Selector Location...............................................................71
Figure 5-5: Clear CMOS Jumper .................................................................................................72
Figure 5-6: LVDS Voltage Selection Jumper Pinout Locations...............................................73
Figure 5-7: RS-232/422/485 Selection Jumper...........................................................................74
Figure 5-8: Audio Cable Connection ..........................................................................................75
Figure 5-9: IDE Cable Connection...............................................................................................76
Figure 5-10: Single RS-232 Cable Installation ...........................................................................77
Figure 5-11: SATA Drive Cable Connection...............................................................................78
Figure 5-12: SATA Power Drive Connection..............................................................................79
Figure 5-13: Dual USB Cable Connection..................................................................................80
Figure 5-14: PS/2 Keyboard/Mouse Connector.........................................................................81
Figure 5-15: LAN Connection......................................................................................................82
Figure 5-16: Serial Device Connector.........................................................................................83
Figure 5-17: VGA Connector .......................................................................................................84
Figure 7-1: Introduction Screen............................................................................................... 131
Figure 7-2: Available Drivers.................................................................................................... 131
Figure 7-3: Chipset and Graphics............................................................................................ 132
Figure 7-4: Chipset or Platform Drivers .................................................................................. 133
Figure 7-5: VIA Hyperion........................................................................................................... 133
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Figure 7-6: Setup File................................................................................................................ 134
Figure 7-7: VIA Hyperion Welcome Screen............................................................................. 134
Figure 7-8: License Agreement................................................................................................ 135
Figure 7-9: Select Drivers ......................................................................................................... 135
Figure 7-10: Start Driver Installation........................................................................................ 136
Figure 7-11: Installation Complete........................................................................................... 136
Figure 7-12: Finish Installation................................................................................................. 137
Figure 7-13: Chipset and Graphics.......................................................................................... 138
Figure 7-14: Integrated Graphics Drivers................................................................................ 138
Figure 7-15: 22.00.02a Folder................................................................................................... 139
Figure 7-16: Installation Type Selection.................................................................................. 139
Figure 7-17: Setup File.............................................................................................................. 140
Figure 7-18: VIA Hyperion Welcome Screen........................................................................... 140
Figure 7-19: S3 Taskbar Icon.................................................................................................... 141
Figure 7-20: Start Menu............................................................................................................. 141
Figure 7-21: Control Panel........................................................................................................ 142
Figure 7-22: System Properties................................................................................................ 142
Figure 7-23: Device Manager.................................................................................................... 143
Figure 7-24: Ethernet Controller Properties Window............................................................. 143
Figure 7-25: Hardware Update Wizard..................................................................................... 144
Figure 7-26: Driver Location................................................................................................... .. 144
Figure 7-27: Choose Audio Driver ........................................................................................... 145
Figure 7-28: Driver Selection.................................................................................................. .. 145
Figure 7-29: Default Network Drivers...................................................................................... 146
Figure 7-30: Install From Disk.................................................................................................. 146
Figure 7-31: Driver File Directory............................................................................................. 147
Figure 7-32: Select Operating System..................................................................................... 147
Figure 7-33: Windows Folder ................................................................................................... 147
Figure 7-34: InstallShield Folder.............................................................................................. 148
Figure 7-35: Operating System Folder .................................................................................... 148
Figure 7-36: Driver File.............................................................................................................. 148
Figure 7-37: Install From Disk.................................................................................................. 149
Figure 7-38: New Driver Found ................................................................................................ 149
Figure 7-39: Network Adapter Driver Installation Complete ................................................. 150
Figure 7-40: Audio Driver Folder.............................................................................................. 151
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Figure 7-41: Operating System Folder .................................................................................... 151
Figure 7-42: Operating System Version.................................................................................. 152
Figure 7-43: Select 32-bit or 64-bit........................................................................................... 152
Figure 7-44: Audio Driver Folder.............................................................................................. 153
Figure 7-45: Audio Driver Setup File ....................................................................................... 153
Figure 7-46: Audio Driver Setup Welcome Screen................................................................. 154
Figure 7-47: Audio Driver Selection......................................................................................... 154
Figure 7-48: ................................................................................................................................ 155
Figure 7-49: Audio Driver Installation Complete.................................................................... 156
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List of Tables

Table 1-1: Technical Specifications..............................................................................................8
Table 2-1: Supported HDD Specifications..................................................................................18
Table 2-2: Power Consumption...................................................................................................26
Table 3-1: Packing List Items......................................................................................................30
Table 4-1: Peripheral Interface Connectors...............................................................................34
Table 4-2: Rear Panel Connectors..............................................................................................34
Table 4-3: Audio Connector Pinouts (10-pin)............................................................................35
Table 4-4: Panel Backlight Connector Pinouts..........................................................................36
Table 4-5: Battery Connector Pinouts........................................................................................37
Table 4-6: CF Card Socket Pinouts.............................................................................................39
Table 4-7: Audio CD In Connector Pinouts................................................................................40
Table 4-8: DIO Connector Pinouts..............................................................................................41
Table 4-9: DVI Connector Pinouts...............................................................................................42
Table 4-10: +12V Fan Connector Pinouts...................................................................................43
Table 4-11: Front Panel Connector Pinouts...............................................................................44
Table 4-12: IDE Connector Pinouts.............................................................................................46
Table 4-13: LVDS LCD Port Connector Pinouts........................................................................47
Table 4-14: Mini PCI Slot Pinouts................................................................................................51
Table 4-15: Power Connector Pinouts........................................................................................51
Table 4-16: ATX Power Supply Enable Connector Pinouts......................................................52
Table 4-17: Reset Button Connector Pinouts............................................................................53
Table 4-18: SATA Drive Connector Pinouts...............................................................................54
Table 4-19: COM Connector Pinouts..........................................................................................55
Table 4-20: USB Port Connector Pinouts...................................................................................56
Table 4-21: LAN Pinouts ..............................................................................................................57
Table 4-22: RJ-45 Ethernet Connector LEDs.............................................................................58
Table 4-23: Keyboard Connector Pinouts..................................................................................58
Table 4-24: RS-232 Serial Port (COM 1) Pinouts .......................................................................59
Table 4-25: VGA Connector Pinouts...........................................................................................60
Table 5-1: Jumpers.......................................................................................................................70
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Table 5-2: AT/ATX Power Supply Selector Settings .................................................................70
Table 5-3: Clear CMOS Jumper Settings....................................................................................72
Table 5-4: LVDS Voltage Selection Jumper Settings................................................................73
Table 5-5: RS-232/422/485 Selection Jumper Settings.............................................................74
Table 5-6: IEI Provided Cables....................................................................................................74
Table 6-1: BIOS Navigation Keys................................................................................................87
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BIOS Menus

BIOS Menu 1: Main.......................................................................................................................88
BIOS Menu 2: Advanced..............................................................................................................90
BIOS Menu 3: CPU Configuration...............................................................................................91
BIOS Menu 4: IDE Configuration.................................................................................................92
BIOS Menu 5: IDE Master and IDE Slave Configuration...........................................................94
BIOS Menu 6: Super IO Configuration........................................................................................98
BIOS Menu 7: ACPI Configuration [Advanced Power Configuration].................................. 101
BIOS Menu 8:Advanced Power Management Configuration ................................................ 102
BIOS Menu 9: Remote Access Configuration [Advanced].................................................... 105
BIOS Menu 10: USB Configuration.......................................................................................... 108
BIOS Menu 11: USB Mass Storage Device Configuration..................................................... 110
BIOS Menu 12: PCI/PnP Configuration.................................................................................... 113
BIOS Menu 13: Boot.................................................................................................................. 115
BIOS Menu 14: Boot Settings Configuration.......................................................................... 116
BIOS Menu 15: Boot Device Priority Settings ........................................................................ 119
BIOS Menu 16: Removable Drives........................................................................................... 120
BIOS Menu 17: Security............................................................................................................ 121
BIOS Menu 18: Chipset............................................................................................................. 122
BIOS Menu 19:Northbridge Chipset Configuration................................................................ 123
BIOS Menu 20:Southbridge Chipset Configuration............................................................... 126
BIOS Menu 21: Exit.................................................................................................................... 127
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Chapter
1

1 Introduction

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1.1 Introduction

WAFER-CX700M 3.5" SBC
Figure 1-1: WAFER-CX700M
The WAFER-CX700M 3.5” motherboard is a VIA® Eden or VIA® C7 processor platform. The WAFER-CX700M features a VIA® CX700M system chipset, which combines both Southbridge and Northbridge into a single package fitting the size of a standard Northbridge. Support for VGA, LVDS and DVI displays provides diversified display functionalities. Two Realtek RTL8110SC Gigabit Ethernet controllers ensure secure network connectivity. Storage capabilities are provided by two SATA ports, an IDE port and a CompactFlash® slot. A Mini PCI expansion card is easily connected to the system through a Mini PCI expansion slot. Four USB 2.0 connectors, four serial ports provides additional expansion options to the system ensuring a variety of USB 2.0 devices can be connected to the WAFER-CX700M.

1.2 Benefits

Some of the benefits of the WAFER-CX700M include:
Ultra-low power consumption
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High data throughput and high-speed DDR2 Network connectivity Video outputs suitable for different applications
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WAFER-CX700M 3.5" SBC

1.3 Features

Some of the features of the WAFER-CX700M are listed below.
3.5” form factor VIA® Eden or VIA® C7 CPU VIA® CX700M system chipset Multiple display options including
o VGA o DVI o 24-bit dual-channel LVDS
Multiple serial port connectors including:
o Three RS-232 o One RS-232/422/485
Multiple storage options including:
o IDE hard drive slot o CompactFlash® type I/II slot o Two SATA II ports
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1.4 Overview

The WAFER-CX700M has a wide variety of peripheral interface connectors. Below is a labeled photo of the peripheral interface connectors on the front side of the WAFER-CX700M.
WAFER-CX700M 3.5" SBC
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Figure 1-2: WAFER-CX700M Overview (Front)
Below is a photo of the peripheral interface connectors on the solder side of the WAFER-CX700M.
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Figure 1-3: WAFER-CX700M Overview (Solder Side)

1.5 Peripheral Connectors and Jumpers

The WAFER-CX700M has the following connectors on-board:
1 x Audio connector 1 x Backlight inverter connector 1 x Battery connector 1 x CD audio input connector 1 x CompactFlash® Card socket (solder side) 1 x DDR2 SO-DIMM socket (solder side) 1 x Digital I/O connector 1 x DVI connector 1 x Fan connector 1 x Front panel connector
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1 x IDE connector 1 x LVDS LCD connector 1 x Mini PCI 1 x Power connector 1 x PS_ON connector 1 x Reset button connector 2 x RS-232 serial port connector 1 x RS-232/422/485 serial port connector 2 x SATA connector 2 x USB 2.0 connector
WAFER-CX700M 3.5" SBC
The WAFER-CX700M has the following external peripheral interface connectors on the board rear panel.
2 x RJ-45 Ethernet connectors 1 x RS-232 serial port connector 1 x PS-2 connector 1 x VGA connector
The WAFER-CX700M has the following on-board jumpers:
AT/ATX power mode select jumper COM2 RS-232/422/485 selection jumper Clear CMOS jumper LCD panel voltage selection jumper

1.6 Technical Specifications

WAFER-CX700M technical specifications are listed below. See Chapter 2 for details.
Specification WAFER-CX700M Form Factor
System CPU
3.5”
1.5 GHz VIA® C7 CPU (with cooling fan)
1.0 GHz VIA® Eden ULV CPU (fanless)
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System Chipset
VIA® CX700M
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Specification WAFER-CX700M Memory
Display
BIOS Audio LAN
COM
USB2.0
Hard Disk Drives
Digital I/O Expansion
One 200-pin 1.0 GB (max.) 400/533 MHz DDR2 SO-DIMM VGA through DB-15 connector
DVI through pin-header 24-bit dual-channel LVDS through 20-pin crimp connector
AMI BIOS VIA® VT1708A Dual Realtek RTL8110SC Gigabit Ethernet controllers Three RS-232 serial ports
One RS-232 or RS-422/485 serial port Four USB ports via pin header One 44-pin IDE connector
Two SATA II connectors One 8-bit digital I/0, 4-bit input/4-bit output Mini PCI expansion slot
Super I/O SSD
Watchdog Timer
Power Supply
Power Consumption
Ambient Temperature Humidity Dimensions (W x L)
Winbond W83627EHG CompactFlash® Type I/II slot Software programmable supports 1 sec. ~ 255 sec. system
reset. AT and ATX support 5 V @ 4.1 A, 12 V @ 0.55 A, 5VSB @ 0.07 A
(VIA® C7 1.5 GHz, 1.0 GB 533 MHz DDR2, 3DMARK2001) 0 °C ~ +60 °C 5% ~ 95% non-condensing 146 mm x 102 mm
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Specification WAFER-CX700M
WAFER-CX700M 3.5" SBC
Weight (GW/NW)
Table 1-1: Technical Specifications
600 g / 160 g
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WAFER-CX700M 3.5" SBC
Chapter
2

2 Detailed Specifications

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2.1 Dimensions

2.1.1 Board Dimensions

The dimensions of the WAFER-CX700M are listed below.
Length: 102 mm Width: 146 mm
WAFER-CX700M 3.5" SBC
Figure 2-1: WAFER-CX700M Dimensions (mm)
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WAFER-CX700M 3.5" SBC

2.1.2 External Interface Panel Dimensions

External interface panel connector dimensions are show below.
Figure 2-2: External Interface Panel Dimensions (mm)
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2.2 Data Flow

The diagram below shows the data flow between the onboard CPU, system chipset and other components installed on the motherboard and described in the following sections of this chapter.
WAFER-CX700M 3.5" SBC
Figure 2-3: Data Flow Block Diagram
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WAFER-CX700M 3.5" SBC

2.3 VIA® C7 CPU

The WAFER-CX700M has a VIA® C7 processor preinstalled.
Figure 2-4: VIA® C7 Processor
Some of the main specifications of the VIA® C7 CPU are listed below.
Full x86/x87 operating system and software application compatibili ty Processor frequencies up to 2.0 GHz VIA® V4 bus up to 800 MHz FSB 128 KB L2 cache Sophisticated branch prediction mechanism MMX, SSE, SSE2 and SSE3 instruction sets NX execute protection Two quantum -based random number generators

2.4 VIA® CX700M System Chipset

The VIA® CX700M combines a feature rich Southbridge and Northbridge into a single package the same size as a typical Northbridge. The VIA® CX700M offers a full multimedia experience with three different choices of graphical output including VGA, DVI and LVDS, audio output and dedicated decoding of MPEG-2/4 and WMV9.
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2.4.1 Graphics

WAFER-CX700M 3.5" SBC
Figure 2-5: Graphics
The following video outputs are implemented on the WAFER-CX700M.
VGA..........................................................................................14
DVI ...........................................................................................15
LVDS ........................................................................................15
2.4.1.1 VGA
The VIA® CX700M chipset supports RGB video output through a DB-15 connector on the external peripheral connector interface. The VGA port supports RGB output and HDTV output.
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WAFER-CX700M 3.5" SBC
2.4.1.2 DVI
The VIA® CX700M chipset supports DVI video output via pin header on the WAFER-CX700M. The DVI and LVDS video outputs share a video channel so only one can be used at a time.
2.4.1.3 LVDS
The VIA® CX700M chipset supports LVDS video output via a 15-pin crimp header on the WAFER-CX700M. The LVDS and DVI video outputs share a video channel so only one can be used at a time.

2.4.2 Memory

The VIA® CX700M system chipset on the WAFER-CX700M supports one 200-pin DDR2 SO-DIMM with the following features:
One 200-pin SO-DIMM DDR2 only (DO NOT install a DDR DIMM) Capacities of 256MB, 512MB or 1GB Transfer speeds of 400MHz or 533MHz 64-bit wide channel
The memory socket is shown below.
Figure 2-6: 200-pin DDR2 SO-DIMM Sockets
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2.4.3 SATA

WAFER-CX700M 3.5" SBC
The SATA controller supports two full duplex 3.0 Gbps dual channel SATA drives. The two SATA drive connectors are shown below.
Figure 2-7: 1.5Gbps SATA Drive Connectors

2.4.4 IDE Controller

Up to two IDE devices are supported on the IDE bus. A single IDE hard drive and CompactFlash® card can be installed on the system.
2.4.4.1 CompactFlash® Slot
The CompactFlash® socket supports standard CF Type I and CF Type II cards. The chipset flash interface is multiplexed with an IDE interface and can be connected to an array of industry standard NAND Flash or NOR Flash devices. The CompactFlash® card is connected to the IDE bus.
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WAFER-CX700M 3.5" SBC
Figure 2-8: CompactFlash® Slot
2.4.4.2 IDE Slot
The single IDE connector supports two ATA-6 HDDs. An ATA-6 (Ultra ATA/100) compliant IDE controller has a maximum transfer rate of 100MB/s. ATA-6 includes advancements in error checking and ATA-6 drives are compatible with future interface additions.
Figure 2-9: IDE Slot
The onboard ATA-6 controller is able to support the following IDE HDDs:
Ultra A T A/10 0, with data transfer rates up to 100MB/s Ultra A T A/66, with data transfer rates up to 66MB/s Ultra A T A/33, with data transfer rates up to 33MB/s
Specification Ultra ATA/100 Ultra ATA/66 Ultra ATA/33 IDE devices
2 2 2
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Specification Ultra ATA/100 Ultra ATA/66 Ultra ATA/33
WAFER-CX700M 3.5" SBC
PIO Mode PIO Max Transfer Rate DMA/UDMA designation DMA/UDMA Max Transfer Controller Interface
Table 2-1: Supported HDD Specifications
0 – 4 0 – 4 0 – 4
16.6 MB/s 16.6 MB/s 16.6 MB/s UDMA 5 UDMA 4 UDMA 2 100MB/s 66MB/s 33MB/s 5V 5V 5V

2.4.5 USB

Four USB pin headers on the WAFER-CX700M board are interfaced to the system chipset USB controller. Four USB 1.1 or USB 2.0 devices can be connected simultaneously to the WAFER-CX700M.
Page 18
Figure 2-10: USB Ports
The chipset USB controller has the following specifications:
o 4 USB ports
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WAFER-CX700M 3.5" SBC
o USB 1.1 and USB 2.0 compliant o 3 host ports o 1 host/device

2.4.6 PCI Bus

The PCI bus is connected to the components listed below:
Realtek RTL8110SC GbE Controller .......................................19
The PCI bus complies with PCI Local Bus Specification, Revision 2.2 and supports 33MHz PCI operations.
2.4.6.1 Realtek RTL8110SC GbE Controller
Two PCI lanes are connected to two Realtek RTL8110SC GbE controllers shown below.
Figure 2-11: Realtek PCI GbE Controllers
The Realtek RTL8110SC PCI GbE controllers combine a triple-speed IEEE 802.3 compliant Media Access Controller (MAC) with a triple-speed Ethernet transceiver, 32-bit
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WAFER-CX700M 3.5" SBC
PCI bus controller, and embedded memory. With state-of-the-art DSP technology and mixed-mode signal technology, they offer high-speed transmission over CAT 5 UTP cable or CAT 3 UTP (10Mbps only) cable. Functions such as Crossover Detection & Auto-Correction, polarity correction, adaptive equalization, cross-talk cancellation, echo cancellation, timing recovery, and error correction are implemented to provide robust transmission and reception capability at high speeds.
Some of the features of the Realtek RTL8110SC PCI GbE controllers are listed below.
Integrated 10/100/1000 transceiver Auto-Negotiation with Next Page capability Supports PCI rev.2.3, 32-bit, 33/66MHz Supports pair swap/polarity/skew correction Crossover Detection & Auto-Correction Wake-on-LAN and remote wake-up support Microsoft® NDIS5 Checksum Offload (IP, TCP, UDP) and largesend of fload
support
Supports Full Duplex flow control (IEEE 802.3x) Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab Supports IEEE 802.1P Layer 2 Priority Encoding Supports IEEE 802.1Q VLAN tagging Serial EEPROM 3.3/1.8/1.5 V signaling, 5 V PCI I/O tolerant 0.15µm CMOS process Transmit/Receive FIFO (8K/64K) support Supports power down/link down power saving Supports PCI Message Signaled Interrupt (MSI)

2.4.7 Keyboard/Mouse

The keyboard/mouse controller can execute the 8042 instruction set. Some of the keyboard controller features are listed below:
Page 20
The 8042 instruction is compatible with a PS/2 keyboard and PS/2 mouse Gate A20 and Keyboard reset output Supports multiple keyboard power on events
Page 43
WAFER-CX700M 3.5" SBC
Supports mouse double-click and/or mouse move power on events

2.4.8 LPC Bus

The LPC bus is connected to components listed below:
BIOS Chipset ...........................................................................21
Lattice Semiconductor LC4032V Digital I/O Chipset ...............22
Fintek F81216DG Serial Port Chipset......................................22
2.4.8.1 BIOS Chipset
The BIOS chipset has a licensed copy of AMI BIOS installed on the chipset.
Figure 2-12: BIOS Chipset
Some of the BIOS features are listed below:
AMI Flash BIOS SMIBIOS (DMI) compliant Console redirection function support PXE (Pre-boot Execution Environment) support USB booting support
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WAFER-CX700M 3.5" SBC
2.4.8.2 Lattice Semiconductor LC4032V Digital I/O Chipset
The Lattice Semiconductor digital I/O chipset enables a 24-bit Digital I/O. The LC4032V chipset consists of multiple 36-input, 16 macrocell Generic Logic Blocks interconnecte d by a Global Routing Pool. Output Routing Pools (ORPs) connect the GLBs to the I/O Blocks that contain multiple I/O cells.
Figure 2-13: Lattice Semiconductor LC4064V Digital I/O Chipset
Some of the features of the Lattice Semiconductor LC4032V chipset are listed below:
Up to four global clock pins with programmable clock polarity control 400MHz maximum operating frequency Operates with 3.3 V, 2.5 V or 1.8 V power
2.4.8.3 Fintek F81216DG LPC Serial Port Chipset
The Fintek F81216DG chipset enables the addition of four additional UART serial ports (COM1, COM2, COM3 and COM4). UART includes 16-byte send/receive FIFO. The Fintek serial port chipset is interfaced to the system chipset through the LPC bus.
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WAFER-CX700M 3.5" SBC
Figure 2-14: Fintek F81216DG LPC Serial Port Chipset
Some of the features of the Fintek chipset are listed below:
Supports LPC interface Totally provides 4 UART (16550 asynchronous) ports
o 3 x Pure UART o 1 x UART+IR
One Watch dog timer with WDTOUT# signal One Frequency input 24/48 MHz Powered by 3 Vcc

2.4.9 Audio

The High Definition Audio is interfaced to the onboard audio connector through the VIA® VT1708A audio chipset.
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WAFER-CX700M 3.5" SBC
2.4.9.1 VIA® VT1708A Audio Chipset
The VIA® VT1708A High Definition Audio chipset supports 8-channel, 24-bit, 192 KHz audio content. The audio chipset features a 100dB S/N ratio and complies with the Intel® High Definition Audio Rev. 1.0 specification. VIA® HD Audio codecs include a high quality headphone amplifier, enhanced recording support, and advanced power management features, ideal for mobile devices.
Figure 2-15: VIA® VT1708A High Definition Audio Chipset
Some of the features of the audio chipset are listed below:
Supports 44.1 KHz, 48 KHz, 96 KHz and 192 KHz DAC independent sample
rates
Built-in headphone amplifier 4 stereo DACs support 24-bit, 192 KHz samples DAC with 100dB S/N ratio 2 stereo ADCs suppo rt 24-bit, 192KHz samples ADC with 95dB S/N Ratio High quality differential CD input HPF in ADC path for DC removal Analog CD input path for compatibility Supports EAPD (External Amplifier Power Down) Power management and enhanced power saving features
Page 24
Digital: 3.3 V; Analog: 3.3 V / 5.0 V
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WAFER-CX700M 3.5" SBC

2.5 Environmental and Power Specifications

2.5.1 System Monitoring

The thermal inputs on the WAFER-CX700M monitor the following temperatures:
System temperature Power temperature CPU temperature
The voltage inputs on the WAFER-CX700M monitor the following voltages:
Vcore +2.5V +3.3V +5.0V +12.0V DDR Vtt +1.5V 5VSB
The following voltages are also monitored:
VBAT
The WAFER-CX700M also monitors the following fan speeds:
CPU Fan speed
The values for the above environmental parameters are all recorded in the BIOS Hardware Health Configuration menu.

2.5.2 Operating Temperature and Temperature Control

The maximum and minimum operating temperatures for the WAFER-CX700M are listed below.
Minimum Operating Temperature: 0ºC (32°F) Maximum Operating Temperature: 60°C (140°F)
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A cooling fan and heat sink must be installed on the system. Thermal paste must be smeared on the lower side of the heat sink before it is mounted. The stock heat sink and fan cover both the system chipset and CPU.

2.5.3 Power Consumption

The table below shows the power consumption parameters for the WAFER-CX700M running with a 1.5 GHz VIA® C7 and 1.0 GB of 533 MHz DDR2 memory.
Voltage Current
+5V 4.1 A +12V 0.55 A 5 VSB 0.07 A
Table 2-2: Power Consumption
WAFER-CX700M 3.5" SBC
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WAFER-CX700M 3.5" SBC
Chapter
3

3 Unpacking

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3.1 Anti-static Precautions

WARNING:
Failure to take ESD precautions during the installation of the WAFER-CX700M may result in permanent damage to the WAFER-CX700M and severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components, including the WAFER-CX700M. Dry climates are particularly susceptible to ESD. It is therefore critical that whenever the WAFER-CX700M or any other electronic component is handled, the following anti-static precautions are strictly adhered to:
Wear and anti-static wristband: - Wea ring a simple anti-st atic wristband can
WAFER-CX700M 3.5" SBC
help to prevent ESD from damaging the WAFER-CX700M.
Self-grounding: - Before handling the WAFER-CX700M touch any grounded
conducting material. During the time of handling, frequently touch any conducting materials that are connected to the ground.
Use an anti-static pad : - When configuring the WAFER-CX700M, place it on
an anti-static pad. This reduces the possibility of ESD damaging the WAFER-CX700M.
Only handle the PCB by the edges: - When handling the PCB, hold the PCB
by it’s edges.

3.2 Unpacking Precautions

When the WAFER-CX700M is unpacked, please do the following:
Follow the anti-static precautions outline in Section 3.1. Make sure the packing box if facing upwards so the WAFER-CX700M does
not fall out of the box.
Make sure all of the components shown in the next section are present.
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WAFER-CX700M 3.5" SBC

3.3 Package Contents

NOTE:
If any of the components listed in the checklist below are missing, do not proceed with the installation. Contact the IEI reseller or vendor that the WAFER-CX700M was purchased from, or contact and IEI sales representative directly by sending an email to
The WAFER-CX700M is shipped with the following components.
Quantity Item and Part Number Image
1 WAFER-CX700M
1 Audio cable
(P/N: 32000-072100-RS)
2 SATA cable
(P/N: 32000-062800-RS)
1 SATA power cable
(P/N: 32100-088600-RS)
sales@iei.com.tw.
2 Dual USB cable (wo bracket)
(P/N: 32000-070300-RS)
1 HDD cable (44-pin)
(P/N: 32200-000009-RS)
3 Single COM port (w/o bracket)
(P/N: 32200-000049-RS)
1 KB/MS PS/2 Y-cable
(P/N: 32000-000138-RS)
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Quantity Item and Part Number Image
1 Utility CD
1 Quick Installation Guide
1 Mini jumper pack (2.0mm)
(P/N: 33100-000033-RS)
Table 3-1: Packing List Items
WAFER-CX700M 3.5" SBC
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WAFER-CX700M 3.5" SBC

4 Connector Pinouts

Chapter
4
Page 31
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4.1 Peripheral Interface Connectors

Section 4.1.1 shows peripheral interface connector locations. Section 0 lists all the
WAFER-CX700M 3.5" SBC
peripheral interface connectors seen in Section
4.1.1.

4.1.1 Layout

The figures below show the on-board peripheral connectors, rear panel peripheral connectors and on-board jumpers.
Page 32
Figure 4-1: Connector and Jumper Locations
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WAFER-CX700M 3.5" SBC
Figure 4-2: Connector and Jumper Locations (Solder Side)

4.1.2 Peripheral Interface Connectors

Table 4-1 shows a list of the peripheral interface connectors on the WAFER-CX700M.
Connector Type Label
Audio connector 10-pin header CN3 Backlight inverter connector 6-pin wafer CN1 Battery connector 2-pin wafer CN5 CompactFlash® slot (solder side) CF card slot CN18 CD audio connector 4-pin wafer CN2 DDR2 SO-DIMM socket (solder side) 200-pin SO-DIMM slot J1 Digital I/O connector 10-pin header CN8 DVI connector 26-pin header DVI1 Fan connector 3-pin wafer FAN1 Front panel connector 8-pin header CN4
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Connector Type Label
IDE Interface connector 40-pin header CN6 LVDS connector 30-pin crimp header LVDS1 Mini PCI connector Mini PCI connector MINIPCI1 Power connector 4-pin Molex connector CN7 PS_ON connector 3-pin wafer CN9 Reset button connector 2-pin wafer CN13 Serial ATA drive connector 7-pin SATA SATA1 Serial ATA drive connector 7-pin SATA SATA2 Serial port connector 10-pin header CN10 Serial port connector 10-pin header CN11 Serial port connector 10-pin header CN12
WAFER-CX700M 3.5" SBC
USB connectors 8-pin header USB1 USB connectors 8-pin header USB2
Table 4-1: Peripheral Interface Connectors

4.1.3 External Interface Panel Connectors

Table 4-2 lists the rear panel connectors on the WAFER-CX700M.
Connector Type Label
Ethernet connector RJ-45 LAN1 Ethernet connector RJ-45 LAN2 Keyboard/Mouse connector PS/2 CN16 Serial port connector DB-9 CN17 VGA conne ctor 15-pin female VGA1
Table 4-2: Rear Panel Connectors
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WAFER-CX700M 3.5" SBC

4.2 Internal Peripheral Connectors

Internal peripheral connectors are found on the motherboard and are only accessible when the motherboard is outside of the chassis. T his se ction h as complet e d esc ription s of all the internal peripheral connectors on the WAFER-CX700M.

4.2.1 Audio Connector

CN Label: CN3 CN Type: CN Location: CN Pinouts:
The 10-pin audio header is connected to external audio devices. The audio pin header provides a connection for microphone input, line level stereo input and amplified stereo output.
10-pin header (2 x 5)
Figure 4-3
See
Table 4-3
See
Figure 4-3: Audio Connector Location (10-pin)
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 AUDIO OUT RIGHT 2 AUDIO OUT LEFT 3 GROUND 4 GROUND
5 LINE IN RIGHT 6 LINE IN LEFT 7 MIC IN RIGHT 8 MIC IN LEFT
9 GROUND 10 GROUND
Table 4-3: Audio Connector Pinouts (10-pin)
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4.2.2 Backlight Inverter Connector

CN Label: CN1
WAFER-CX700M 3.5" SBC
CN Type: CN Location: CN Pinouts:
The backlight inverter connector provides the backlight on the LCD display connected to the WAFER-CX700M with +12V of power.
6-pin header (1 x 6)
Figure 4-4
See
Table 4-4
See
Page 36
Figure 4-4: Panel Backlight Connector Pinout Locations
PIN NO. DESCRIPTION
1 12 V 2 12 V 3 BACKLIGHT ON 4 BACKLIGHT ADJUST 5 GROUND 6 GROUND
Table 4-4: Panel Backlight Connector Pinouts
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WAFER-CX700M 3.5" SBC

4.2.3 Battery Connector

CN Label: CN5 CN Type: CN Location: CN Pinouts:
The battery connector is connected to a backup battery. The battery connector is also used to reset the CMOS memory if the incorrect BIOS settings have been made and the system cannot boot up.
2-pin box header (1x2)
Figure 4-5
See
Table 4-5
See
Figure 4-5: Battery Connector Location
PIN NO. DESCRIPTION
1 Battery+ 2 Ground
Table 4-5: Battery Connector Pinouts

4.2.4 CompactFlash® Slot

CN Label: CN18 CN Type: CN Location: CN Pinouts:
50-pin header (2x25)
Figure 4-6
See
Table 4-6
See
Page 37
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WAFER-CX700M 3.5" SBC
A CF Type I or Type II memory card is inserted to the CF socket on the solder side of the WAFER-CX700M.
Figure 4-6: CF Card Socket Location
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GROUND 26 CD1# 2 DATA 3 27 DATA 11
3 DATA 4 28 DATA 12 4 DATA 5 29 DATA 13
5 DATA 6 30 DATA 14 6 DATA 7 31 DATA 15
7 CE# 32 CE2# 8 N/C 33 VS1#
9 OE# 34 IOR# 10 A9 35 IOW#
11 A8 36 WE# 12 A7 37 IRQ
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13 VCC1 38 VCC2 14 A6 39 CSEL#
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WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
15 A5 40 VS2#
16 A4 41 RESET# 17 A3 42 WAIT#
18 A2 43 INPACK# 19 A1 44 REG#
20 A0 45 BVD2 21 DATA 0 46 BVD1
22 DATA 1 47 DATA 8 23 DATA 2 48 DATA 9
24 IOCS16# 49 DATA 10 25 CD2# 50 GROUND
Table 4-6: CF Card Socket Pinouts

4.2.5 CD Audio Connector

CN Label: CN2 CN Type: CN Location: CN Pinouts:
4-pin header (1 x 4)
Figure 4-7
See
Table 4-7
See
The 4-pin audio CD in connector is connected to an external audio CD device for the input and output of audio signals from a CD player to the system.
Figure 4-7: Audio CD In Connector Pinouts (4-pin)
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PIN NO. DESCRIPTION
1 CD Signal (Right)
2 Ground 3 Ground
4 CD Signal (Left)
Table 4-7: Audio CD In Connector Pinouts

4.2.6 Digital Input/Output Connector

CN Label: CN8
WAFER-CX700M 3.5" SBC
CN Type: CN Location: CN Pinouts:
The digital input/output connector is managed through a Super I/O chip. The DIO connector pins are user programmable.
10-pin header (2x5)
Figure 4-8
See
Table 4-8
See
Page 40
Figure 4-8: DIO Connector Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GND 2 VCC 3 Output 3 4 Output 2
5 Output 1 6 Output 0
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WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
7 Input 3 8 Input 2 9 Input 1 10 Input 0
Table 4-8: DIO Connector Pinouts

4.2.7 DVI Connector

CN Label: DVI1 CN Type: CN Location: CN Pinouts:
26-pin header (2 x 13)
Figure 4-9
See
Table 4-9
See
The DVI connects to a monitor that is accepts DVI input signals.
Figure 4-9: DVI Connector Location
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 -DATA2 14 5 V 2 DATA2 15 GND 3 GND 16 DVI DETECT 4 N/C 17 -DATA0 5 N/C 18 DATA0 6 DDCCLK 19 GND 7 DDCDATA 20 N/C 8 N/C 21 N/C
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PIN NO. DESCRIPTION PIN NO. DESCRIPTION
9 -DATA1 22 GND 10 DATA1 23 CLOCK 11 GND 24 -CLOCK 12 -DATA3 25 GND 13 DATA3 26 N/C
Table 4-9: DVI Connector Pinouts

4.2.8 Fan Connector

CN Label: FAN1
WAFER-CX700M 3.5" SBC
CN Type: CN Location: CN Pinouts:
The cooling fan connector provides a 12V, 500mA current to a system cooling fan. The connector has a "rotation" pin to get rotation signals from fans and notify the system so the system BIOS can recognize the fan speed. Please note that only specified fans can issue the rotation signals.
3-pin wafer (1 x 3)
Figure 4-10
See
Table 4-10
See
Page 42
Figure 4-10: Fan Connector Location
Page 65
WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION
1 Rotation Signal 2 +12V 3 GND
Table 4-10: +12V Fan Connector Pinouts

4.2.9 Front Panel Connector

CN Label: CN4 CN Type: CN Location: CN Pinouts:
The front panel connector connects to external switches and indicators to monitor and controls the motherboard. These indicators and switches include:
Power button Reset button Power LED HDD LED
8-pin header (2 x 4)
Figure 4-11
See
Table 4-11
See
Figure 4-11: Front Panel Connector Location
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PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GND 2 PW_BN
3 GND 4 -EXTSMI 5 BUZZER- 6 BUZZER+
7 GND 8 AT_FUNCTION
Table 4-11: Front Panel Connector Pinouts

4.2.10 IDE Connector

CN Label: CN6
WAFER-CX700M 3.5" SBC
CN Type: CN Location: CN Pinouts:
One 40-pin IDE device connector on the WAFER-CX700M supports connectivity to two hard disk drives.
44-pin header (2 x 22)
Figure 4-12
See
Table 4-12
See
Page 44
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WAFER-CX700M 3.5" SBC
Figure 4-12: IDE Device Connector Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 RESET# 2 GROUND
3 DATA 7 4 DATA 8
5 DATA 6 6 DATA 9 7 DATA 5 8 DATA 10
9 DATA 4 10 DATA 11 11 DATA 3 12 DATA 12
13 DATA 2 14 DATA 13 15 DATA 1 16 DATA 14
17 DATA 0 18 DATA 15 19 GROUND 20 N/C
21 IDE DRQ 22 GROUND 23 IOW# 24 GROUND
25 IOR# 26 GROUND 27 IDE CHRDY 28 GROUND
29 IDE DACK 30 GROUND–DEFAULT 31 INTERRUPT 32 N/C
33 SA1 34 N/C
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PIN NO. DESCRIPTION PIN NO. DESCRIPTION
35 SA0 36 SA2
37 HDC CS0# 38 HDC CS1# 39 HDD ACTIVE# 40 GROUND
41 VCC 42 VCC 43 GROUND 44 N/C
Table 4-12: IDE Connector Pinouts

4.2.11 LVDS Connector

CN Label: LVDS1
WAFER-CX700M 3.5" SBC
CN Type: CN Location: CN Pinouts:
The 30-pin LVDS LCD connector can be connected to single channel or dual channel, 18-bit or 36-bit LVDS panel.
30-pin crimp (2 x 15)
Figure 4-13
See
Table 4-13
See
Page 46
Figure 4-13: LVDS LCD Connector Pinout Locations
Page 69
WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GROUND 2 GROUND 3 LVDSA_DATA0 4 LVDSA_DATA#0 5 LVDSA_DATA1 6 LVDSA_ DATA#1 7 LVDSA_DATA2 8 LVDSA_ DATA#2 9 LVDSA_CLK 10 LVDSA_CLK# 11 LVDSA_DATA3 12 LVDSA_DATA#3 13 GROUND 14 GROUND 15 LVDSB_DATA0 16 LVDSB_DATA0# 17 LVDSB_DATA1 18 LVDSB_DATA1# 19 LVDSB_DATA2 20 LVDSB_DATA2# 21 LVDSB_CLK 22 LVDSB_CLK# 23 LVDSB_DATA3 24 LVDSB_DATA3# 25 GROUND 26 GROUND 27 VCC/VCC3 28 VCC/VCC3 29 VCC/VCC3 30 VCC/VCC3
Table 4-13: LVDS LCD Port Connector Pinouts

4.2.12 Mini PCI Slot

CN Label: MINIPCI1 CN Type: CN Location: CN Pinouts:
The Mini PCI slot enables a Mini PCI expansion module to be connected to the board.
124-pin Mini PCI Slot
Figure 4-14
See
Table 4-14: Mini PCI Slot Pinouts
See
Page 47
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WAFER-CX700M 3.5" SBC
Page 48
Figure 4-14: Mini PCI Slot Location
Page 71
WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 NC 2 NC
3 NC 4 NC
5 NC 6 NC
7 NC 8 NC
9 NC 10 NC
11 NC 12 NC
13 NC 14 NC
15 GND 16 NC
17 PINTD# 18 VCC5
19 VCC3 20 PINTC#
21 NC 22 NC
23 GND 24 VCC3SB
25 CLK_MPCI 26 PCI_RST1#
27 GND 28 VCC3
29 PCI_REQ2# 30 PCI_GNT2#
31 VCC3 32 GND
33 PAD31 34 PPME#
35 PAD29 36 NC
37 GND 38 PAD30
39 PAD27 40 VCC3
41 PAD25 42 PAD28
43 NC 44 PAD26
45 PC/BE3# 46 PAD24
47 PAD23 48 PAD29
49 GND 50 GND
51 PAD21 52 PAD22
53 PAD19 54 PAD20
55 GND 56 PPAR
57 PAD17 58 PAD18
59 PC/BE2# 60 PAD16
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WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
61 PIRDY# 62 GND
63 VCC3 64 PFRAME#
65 NC 66 PTRDY#
67 SERR# 68 PSTOP#
69 GND 70 VCC3
71 PERR# 72 PDEVSEL#
73 PC/BE1# 74 GND
75 PAD14 76 PAD15
77 GND 78 PAD13
79 PAD12 80 PAD11
81 PAD10 82 GND
83 GND 84 PAD9
85 PAD8 86 PC/BE0#
87 PAD7 88 VCC3
89 VCC3 90 PAD6
91 PAD5 92 PAD4
93 NC 94 PAD2
95 PAD3 96 PAD0
97 VCC5 98 NC
99 PAD1 100 NC
101 GND 102 GND
103 NC 104 NC
105 NC 106 NC
107 NC 108 NC
109 NC 110 NC
111 NC 112 NC
113 NC 114 GND
115 NC 116 NC
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117 NC 118 NC
119 NC 120 NC
121 NC 122 NC
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WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
123 NC 124 VCC3SB
Table 4-14: Mini PCI Slot Pinouts

4.2.13 Power Connector

CN Label: CN7 CN Type: CN Location: CN Pinouts:
The 4-pin AT power connector is connected to an AT power supply.
Figure 4-15: AT Power Connector Location
4-pin AT power connector (1x4)
Figure 4-15
See
Table 4-15
See
PIN NO. DESCRIPTION
1 +12 V
2 GND 3 GND
4 +5 V
Table 4-15: Power Connector Pinouts

4.2.14 PS_ON Connector

CN Label: CN9
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WAFER-CX700M 3.5" SBC
CN Type: CN Location: CN Pinouts:
The ATX power supply enable connector enables the WAFER-CX700M to be connected to an ATX power supply. In default mode, the WAFER-CX700M can only us an AT power supply. To enable an ATX power supply the AT Power Select jumper must also be configured. Please refer to Chapter 3 for more details.
3-pin wafer (1x3)
Figure 4-16
See
Table 4-16
See
Figure 4-16: ATX Power Supply Enable Connector Location
PIN NO. DESCRIPTION
1 +5V Standby
2 GND 3 PS-ON
Table 4-16: ATX Power Supply Enable Connector Pinouts

4.2.15 Reset Button Connector

CN Label: CN13 CN Type: CN Location: CN Pinouts:
2-pin wafer (1x2)
Figure 4-17
See
Table 4-17
See
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The reset button connector is connected to a reset switch o n the syst em chassi s to enabl e users to reboot the system when the system is turned on.
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WAFER-CX700M 3.5" SBC
Figure 4-17: Reset Button Connector Locations
PIN NO. DESCRIPTION
1 Reset Switch
2 GND
Table 4-17: Reset Button Connector Pinouts

4.2.16 SATA Drive Connectors

CN Label: CN Type: CN Location: CN Pinouts:
The SATA drive connectors are each connected to second generation SATA drives. Second generation SATA drives transfer data at speeds as high as 3.0 Gb/s. The SATA drives can be configured in a RAID configuration.
SA TA1 and SATA2 7-pin SATA drive connectors
Figure 4-18
See
Table 4-18
See
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WAFER-CX700M 3.5" SBC
Figure 4-18: SATA Drive Connector Locations
PIN NO. DESCRIPTION
1 GND 2 TX+ 3 TX­4 GND 5 RX­6 RX+ 7 GND
Table 4-18: SATA Drive Connector Pinouts

4.2.17 Serial Port Connectors

CN Label: CN Type: CN Location: CN Pinouts:
CN10, CN11 and CN12
10-pin header (2x5)
Figure 4-19
See
Table 4-19
See
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The 10-pin serial port connectors provide RS-232 serial communications channels. The serial port connector can be connected to external RS-232 serial port devices.
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WAFER-CX700M 3.5" SBC
Figure 4-19: COM Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 Data Carrier Direct (DCD) 2 Data Set Ready (DSR) 3 Receive Data (RXD) 4 Request To Send (RTS) 5 Transmit Data (TXD) 6 Clear To Send (CTS) 7 Data Terminal Ready (DTR) 8 Ring Indicator (RI) 9 Ground (GND)
Table 4-19: COM Connector Pinouts

4.2.18 USB Connectors

CN Label: CN Type: CN Location: CN Pinouts:
The 2x4 USB pin connectors each provide connectivity to two USB 1.1 or two USB 2.0 ports. Each USB connector can support two USB devices. Additional external USB ports
USB1 and USB2 8-pin header (2x4)
Figure 4-20
See
Table 4-20
See
are found on the rear panel. The USB ports are used for I/O bus expansion.
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WAFER-CX700M 3.5" SBC
Figure 4-20: USB Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 VCC 2 GND 3 DATA- 4 DATA+ 5 DATA+ 6 DATA­7 GND 8 VCC
Table 4-20: USB Port Connector Pinouts

4.3 External Peripheral Interface Connector Panel

Figure 4-21 shows the WAFER-CX700M external peripheral interface connector (EPIC)
panel. The WAFER-CX700M EPIC panel consists of the following:
2 x RJ-45 LAN connectors 1 x PS/2 connector 1 x Serial port connector 1 x VGA connector
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WAFER-CX700M 3.5" SBC
Figure 4-21: WAFER-CX700M External Peripheral Interface Connector

4.3.1 LAN Connectors

CN Label: CN Type: CN Location: CN Pinouts:
The WAFER-CX700M is equipped with two built-in RJ-45 Ethernet controllers. The controllers can connect to the LAN through two RJ-45 LAN connectors. There are two LEDs on the connector indicating the status of LAN. The pin assignments are listed in the following table:
PIN DESCRIPTION PIN DESCRIPTION
1 TXA+ 5 TXC­2 TXA- 6 TXB-
3 TXB+ 7 TXD+ 4 TXC+ 8 TXD-
Table 4-21: LAN Pinouts
LAN1 and LAN2
RJ-45
Figure 4-21
See
Table 4-21
See
Figure 4-22: RJ-45 Ethernet Connector
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WAFER-CX700M 3.5" SBC
The RJ-45 Ethernet connector has two status LEDs, one green and one yello w. The green LED indicates activity on the port and the yellow LED indicates the port is linked. See
Table 4-22.
STATUS
GREEN Activity YELLOW Linked
DESCRIPTION STATUS DESCRIPTION
Table 4-22: RJ-45 Ethernet Connector LEDs

4.3.2 Keyboard/Mouse Connector

CN Label: CN16 CN Type: CN Location: CN Pinouts:
The keyboard and mouse connector is a standard PS/2 connector.
PS/2
Figure 4-21
See
Table 4-23
See
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Figure 4-23: PS/2 Pinout and Configuration
PIN DESCRIPTION
1 KB DATA 2 MS DATA 3 GND 4 VCC 5 KB CLOCK 6 MS CLOCK
Table 4-23: Keyboard Connector Pinouts
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WAFER-CX700M 3.5" SBC

4.3.3 Serial Port Connectors

CN Label: CN16 CN Type: CN Location: CN Pinouts:
The 9-pin DB-9 CN16 serial port connector is connected to RS-23 2 serial com munications devices.
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 DCD 6 DSR 2 RX 7 RTS 3 TX 8 CTS 4 DTR 9 RI 5 GND
Table 4-24: RS-232 Serial Port (COM 1) Pinouts
DB-9 connectors
Figure 4-21
See
Table 4-24 and Figure 4-24
See
Figure 4-24: COM1 Pinout Locations

4.3.4 VGA Connector

CN Label: VGA1 CN Type: CN Location: CN Pinouts:
15-pin Female
Figure 4-21
See
Figure 4-25 and Table 4-25
See
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The WAFER-CX700M has a single 15-pin female connector for connectivity to standard display devices.
WAFER-CX700M 3.5" SBC
Figure 4-25: VGA Connector
PIN DESCRIPTION PIN DESCRIPTION
1 RED 2 GREEN
3 BLUE 4 NC 5 GND 6 GND
7 GND 8 GND 9 VCC / NC 10 GND
11 NC 12 DDC DAT 13 HSYNC 14 VSYNC
15 DDCCLK
Table 4-25: VGA Connector Pinouts
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WAFER-CX700M 3.5" SBC
Chapter
5

5 Installation

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5.1 Anti-static Precautions

WARNING:
Failure to take ESD precautions during the installation of the WAFER-CX700M may result in permanent damage to the WAFER-CX700M and severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components, including the WAFER-CX700M. Dry climates are particularly susceptible to ESD. It is therefore critical that whenever the WAFER-CX700M or any other electronic component is handled, the following anti-static precautions are strictly adhered to:
Wear and anti-static wristband: - Wea ring a simple anti-st atic wristband can
WAFER-CX700M 3.5" SBC
help to prevent ESD from damaging the WAFER-CX700M.
Self-grounding: - Before handling the WAFER-CX700M touch any grounded
conducting material. During the time of handling, frequently touch any conducting materials that are connected to the ground.
Use an anti-static pad : - When configuring the WAFER-CX700M, place it on
an anti-static pad. This reduces the possibility of ESD damaging the WAFER-CX700M.
Only handle the PCB by the edges: - When handling the PCB, hold the PCB
by it’s edges.
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WAFER-CX700M 3.5" SBC

5.2 Installation Considerations

NOTE:
The following installation notices and installation considerations should be read and understood before the WAFER-CX700M in installed. All installation notices pertaining to the installation of the WAFER-CX700M should be strictly adhered to. Failing to adhere to these precautions may lead to severe damage of the WAFER-CX700M and injury to the person installing the motherboard.

5.2.1 Installation Notices

WARNING:
The installation instructions described in this manual should be carefully followed in order to prevent damage to the WAFER-CX700M and its accessories, and prevent injury to the user.
Before and during the installation please DO the following:
Read the user manual:
o The user manual provides a complete description of the
WAFER-CX700M installation instructions and configuration options.
Wear an electrostatic discharge cuff (ESD):
o Electronic components are easily damaged by ESD. Wearing an ESD cuff
removes ESD from the body and helps prevent ESD damage.
Place the WAFER-CX700M on an antistatic pad:
o When installing or configuring the motherboard, place it on an antistatic
pad. This helps to prevent potential ESD damage.
Turn all power to the WAFER-CX700M off:
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o When working with the WAFER-CX700M, make sure that it is
disconnected from all power supplies and that no electricity is being fed into the system.
Before and during the installation of the WAFER-CX700M DO NOT do the following:
DO NOT remove any of the stickers on the PCB board. These stickers are
required for warranty validation.
DO NOT use the product before verifying all the cables and power con nectors
are properly connected.
DO NOT allow screws to come in contact with the PCB circuit, con nector pins,
or its components.

5.2.2 Installation Checklist

The following checklist is provided to ensure the WAFER-CX700M is properly installed.
WAFER-CX700M 3.5" SBC
All the items in the packing list are present The CPU is installed The CPU cooling kit is properly installed A compatible memory module is properly inserted into the slot The jumpers have been properly configured The WAFER-CX700M is inserted into a chassis with adequate ventilation The correct power supply is being used The following devices are properly connected
o Primary and secondary IDE device o SATA drives o Keyboard and mouse cable o Audio kit o Power supply o USB cable o Serial port cable o Parallel port cable
The following external peripheral devices are properly connected to the
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chassis:
o DVI screen
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WAFER-CX700M 3.5" SBC
o Keyboard o Mouse o LAN

5.2.3 Airflow

WARNING:
Airflow is critical to the cooling of the CPU and other onboard components. The chassis in which the WAFER-CX700M is installed must have air vents to allow cool air into the system and hot air to move out.
The WAFER-CX700M must be installed in a chassis with ventilation holes on the sides allowing airflow to travel through the heat sink surface. In a system with an individual power supply unit, the cooling fan of a power supply can also help generate airflow through the board surface.

5.3 Unpacking Precautions

When the WAFER-CX700M is unpacked, please do the following:
Follow the anti-static precautions outlined above. Make sure the packing box is facing upwards so the WAFER-CX700M does
not fall out of the box.
Make sure all the components in the checklist shown in Chapter 3 are
present.
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WAFER-CX700M 3.5" SBC
NOTE:
If some of the components listed in the checklist in Chapter 3 are missing, please do not proceed with the installation. Contact the IEI reseller or vendor you purchased the WAFER-CX700M from or contact an IEI sales representative directly. To contact an IEI sales representative, please send an email to

5.4 Cooling Kit and DIMM Installation

WARNING:
A CPU should never be turned on without the specified cooling kit being installed. If the cooling kit (heat sink and fan) is not properly installed and the system turned on, permanent damage to the CPU, WAFER-CX700M and other electronic components attached to the system may be incurred. Running a CPU without a cooling kit may also result in injury to the user.
The CPU, CPU cooling kit and DIMM are the most critical components of the WAFER-CX700M. If one of these component is not installed the WAFER-CX700M cannot
sales@iei.com.tw.
run.

5.4.1 Cooling Kit Installation

The WAFER-CX700M comes with a cooling kit preinstalled. The cooling kit is attached to the WAFER-CX700M with three screws. The cooling fan is attached to the heatsink with two metal clips. Three wires attach the cooling fan to the cooling fan power connector on the board. The cooling kit is custom designed for the WAFER-CX700M and should not be replaced with an alternate cooling kit.
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WAFER-CX700M 3.5" SBC

5.4.2 SO-DIMM Installation

WARNING:
Using incorrectly specified SO-DIMM may cause permanent damage to the WAFER-CX700M. Please make sure the purchased SO-DIMM complies with the memory specifications of the WAFER-CX700M. SO-DIMM specifications compliant with the WAFER-CX700M are listed in Chapter 2.
To install a SO-DIMM into a SO-DIMM socket, please follow the steps below and refer to
Figure 5-1.
Figure 5-1: SO-DIMM Installation
Step 1: Locate the SO-DIMM socket. Place the WAFER-CX700M on an anti-static pad
with the solder side facing up.
Step 2: Align the SO-DIMM with the socket. The SO-DIMM must be oriented in such a
way that the notch in the middle of the SO-DIMM must be aligned with the plastic bridge in the socket.
Step 3: Insert the SO-DIMM. Push the SO-DIMM chip into the socket at an angle. (See
Figure 5-1)
Step 4: Open the SO-DIMM socket arms. Gently pull the arms of the SO-DIMM socket
out and push the rear of the SO-DIMM down. (See
Figure 5-1)
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Step 5: Secure the SO-DIMM. Release the arms on the SO-DIMM socket. They clip into
place and secure the SO-DIMM in the socket.Step 0:

5.4.3 CF Card Installation

NOTE:
The WAFER-CX700M can support both CF Type I cards and CF Type II cards. For the complete specifications of the supported CF cards please refer to Chapter 2.
To install the a CF card (Type 1 or Type 2) onto the WAFER-CX700M, please follow the steps below:
WAFER-CX700M 3.5" SBC
Step 1: Locate the CF card socket. Place the WAFER-CX700M on an anti-static pa d
with the solder side facing up. Locate the CF card slot.
Step 2: Align the CF card. Make sure the CF card is properly aligned with the CF cards
slot.
Step 3: Insert the CF card. Gently insert the CF card into the socket making sure the
socket pins are properly inserted into the socket. See
Figure 5-2. Step 0:
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WAFER-CX700M 3.5" SBC
Figure 5-2: CF Card Installation

5.5 Jumper Settings

NOTE:
A jumper is a metal bridge used to close an electrical circuit. It consists of two or three metal pins and a small metal clip (often protected by a plastic cover) that slides over the pins to connect them. To CLOSE/SHORT a jumper means connecting the pins of the jumper with the plastic clip and to OPEN a jumper means removing the plastic clip from a jumper.
Figure 5-3: Jumper Locations
Before the WAFER-CX700M is installed in the system, the jumpers must be set in accordance with the desired configuration. The jumpers on the WAFER-CX700M are listed below.
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Description Label Type
AT/ATX power selection CN4 (pins 7 & 8) 2-pin header Clear CMOS JP1 2-pin header LVDS voltage selection JP2 3-pin header RS-232/422/485 selector switch SW1 10 switch selector
Table 5-1: Jumpers

5.5.1 AT/ATX Power Supply Selector

Jumper Label: CN4 (pins 7 & 8)
WAFER-CX700M 3.5" SBC
Jumper Type: Jumper Settings: Jumper Location:
The AT/ATX Power Supply Selector switch chooses whether an AT or ATX power supply is used. ATX power supplies allow the motherboard to turn the computer off and offer power management features. AT power supplies are turned off directly at the power source
The AT/ATX Power Supply Selector jumper location is shown in Figure 5-4 below.
Table 5-2.
AT/ATX Power Selector Description
Open ATX power supply
Short 7 – 8 AT power supply Default
Table 5-2: AT/ATX Power Supply Selector Settings
2-pin header
Table 5-2
See
Figure 5-4
See
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WAFER-CX700M 3.5" SBC
Figure 5-4: AT/ATX Power Supply Selector Location

5.5.2 Clear CMOS Jumper

Jumper Label: JP1 Jumper Type: Jumper Settings: Jumper Location:
If the WAFER-CX700M fails to boot due to improper BIOS settings, the clear CMOS jumper clears the CMOS data and resets the system BIOS information. To do this, use the jumper cap to close pins 2 and 3 for a few seconds then reinstall the jumper clip back to pins 1 and 2.
If the “CMOS Settings Wrong” message is displayed during the boot up process, the fault may be corrected by pressing the F1 to enter the CMOS Setup menu. Do one of the following:
Enter the correct CMOS setting Load Optimal Defaults Load Failsafe Defaults.
3-pin header
Table 5-3
See
Figure 5-5
See
After having done one of the above, save the changes and exit the CMOS Setup menu.
The clear CMOS jumper settings are shown in Table 5-3.
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AT Power Select Description
Short 1 - 2 Keep CMOS Setup Default Short 2 - 3 Clear CMOS Setup
Table 5-3: Clear CMOS Jumper Settings
The location of the clear CMOS jumper is shown in Figure 5-5 below.
WAFER-CX700M 3.5" SBC
Figure 5-5: Clear CMOS Jumper

5.5.3 LVDS Voltage Selection

WARNING:
Permanent damage to the screen and WAFER-CX700M may occur if the wrong voltage is selected with this jumper. Please refer to the user guide that cam with the monitor to select the correct voltage.
Jumper Label: JP2 Jumper Type: Jumper Settings:
3-pin header
Table 5-4
See
Page 72
Jumper Location:
Figure 5-6
See
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WAFER-CX700M 3.5" SBC
The LVDS Voltage Selection jumper allows the LVDS screen voltage to be set. The LVDS Voltage Selection jumper settings are shown in
LVDS Voltage Select Description
Short 1-2 +3.3V LVDS
Short 2-3 +5V LVDS Default
Table 5-4.
Table 5-4: LVDS Voltage Selection Jumper Settings
The LVDS Voltage Selection jumper location is shown in Figure 5-6.
Figure 5-6: LVDS Voltage Selection Jumper Pinout Locations

5.5.4 RS-232/422/485 Selection Switch

Jumper Label: SW1 Jumper Type: Jumper Settings: Jumper Location:
The RS-232/422/485 Selection Switch allows the function of COM2 to be set. The RS-232/422/485 Selection Jumper settings are shown in
SW1 1 2 3 4 5 6 7 8 9 10
RS-232 ON OFF ON OFF ON OFF ON OFF ON OFF
RS-422 OFF ON OFF ON OFF ON OFF ON OFF ON
10-switch selector
Table 5-4
See
Figure 5-6
See
Table 5-4.
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SW1 1 2 3 4 5 6 7 8 9 10
RS-485 OFF ON OFF ON OFF ON OFF ON OFF ON
Table 5-5: RS-232/422/485 Selection Jumper Settings
The RS-232/422/485 Selection Jumper location is shown in Figure 5-6.
WAFER-CX700M 3.5" SBC
Figure 5-7: RS-232/422/485 Selection Jumper

5.6 Internal Peripheral Device Connections

The cables listed in Table 5-6 are shipped with the WAFER-CX700M.
Quantity Type
1 Audio cable 1 IDE cable (44-pin) 1 Keyboard/Mouse Y-cable 3 RS-232 cable 2 SATA drive cable 1 SATA drive power cable 2 USB cable
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Table 5-6: IEI Provided Cables
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WAFER-CX700M 3.5" SBC

5.6.1 Audio Cable Installation

The Audio Kit that came with the WAFER-CX700M connects to the 10-pin audio connector on the WAFER-CX700M. The audio kit consists of three audio jacks. One audio jack, Mic In, connects to a microphone. The remaining two audio jacks, Line-In and Line-Out, connect to two speakers. To install the audio kit, please refer to the steps b elow:
Step 1: Locate the audio connector. The location of the 10-pin audio connector is
shown in Chapter 3.
Step 2: Align pin 1. Align pin 1 on the on-board connector with pin 1 on the audio kit
connector. Pin 1 on the audio kit connector is indicated with a white dot. See
Figure 5-8.
Figure 5-8: Audio Cable Connection
Step 3: Connect the audio devices. Connect one speaker to the line-in audio jack, one
speaker to the line-out audio jack and a microphone to the mic-in audio jack.Step 0:

5.6.2 HDD Cable Connection

The 44-pin flat IDE cable connects the WAFER-CX700M to an IDE device. To connect an IDE HDD to the WAFER-CX700M please follow the instructions below.
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Step 1: Locate the IDE connector. The location/s of the IDE device connector/s is/are
shown in Chapter 3.
Step 2: Insert the connector. Connect the IDE cable connector to the on-board
WAFER-CX700M 3.5" SBC
connector. See can only be inserted in one direction.
Figure 5-9. A key on the front of the cable connector ensures it
Figure 5-9: IDE Cable Connection
Step 3: Connect the cable to an IDE device. Connect the two connectors on the other
side of the cable to one or two IDE devices. Make sure that pin 1 on the cable corresponds to pin 1 on the connector.Step 0:

5.6.3 Serial Port Cable Connection

The RS-232/422/485 cable consists of a D-sub 9-pin male connector attached to a single board connector. To install the RS-232/422/485 cable, please follow the steps below.
Step 1: Locate the connectors. The locations of the RS-232 connectors are shown in
Chapter 3.
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WAFER-CX700M 3.5" SBC
Step 2: Insert the cable connectors. Insert one connector into each serial port box
headers. A key on the front of the cable connectors ensures the connector can only be installed in one direction.
Figure 5-10: Single RS-232 Cable Installation
Step 3: Secure the connectors. Both single RS-232 connectors have two retention
screws that must be secured to a chassis or bracket.
Step 4: Connect the serial device. Once the single RS-232 connectors are connected
to a chassis or bracket, a serial communications device can be connecte d to the system.Step 0:

5.6.4 SATA Drive Connection

The WAFER-CX700M is shipped with two SATA drive cables and one SATA drive power cable. To connect the SATA drives to the connectors, please follow the steps below.
Step 1: Locate the connectors. The locations of the SATA drive connectors are shown
in Chapter 3.
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Step 2: Insert the cable connector. Press the clip on the connector at the end of the
SATA cable and insert the cable connector into the onboard SATA drive
WAFER-CX700M 3.5" SBC
connector. See
Figure 5-11.
Figure 5-11: SATA Drive Cable Connection
Step 3: Connect the cable to the SATA disk. Connect the connector on the other end
of the cable to the connector at the back of the SATA drive. See
Step 4: Connect the SATA power cable. Connect the SATA power connector to the
back of the SATA drive.Step 0:
Figure 5-12.
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