IEI Technology TANK-801, TANK-801-BTi-J1/2G/3A-R10, TANK-801-BTi-J1/2G/3B-R10, TANK-801-BTi-J1/2G/3C-R10 User Manual

TANK-801 Emb edded System

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MODEL:

Rev. 1.00 – 6 Nove mber, 2014

TANK-801

Fanless Embedded Sys tem with Intel® Celeron® J1900 processor,

DVI-I, Dis playPort, Two Gigabit Ethern et, RS -232/422/485,

Two USB 3.0, Two USB 2.0, RoHS Compliant

User Manual

TANK-801 Emb edded System

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Date Version Changes

6 November, 2014 1.00 Initial release

Revision

TANK-801 Emb edded System

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Copyright

COP YRIGHT NOTICE

The information in this document is subject to change without prior notice in order to
improve reliabilit y, design a nd functi on and d oes not r epresent a com mitm ent on the part
of the manufacturer.

In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.

This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, e lectronic, or
other means in any form without prior written permission of the manufacturer.

TRADEMARKS

All registered tradem ark s and produc t nam es ment ioned here in are us ed for identif icatio n
purposes only and m ay be trademarks and/or registe red trademarks of their respec tive
owners.

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WARNING

This dev ice complies with Part 15 o f the FCC Rules. Operation is subje ct to the following
two conditions:
(1) this device may not cause harmful interference, and(2) this device must accept any
interference received, including interference that may cause undesired operation.

NOTE: This equipment has been tested and found to comply with the limits fo r a Class
B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in ac cordance with the instr uctions, ma y cause harmful inter ference
to radio communications.
However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:

—

Reorient or relocate the receiving antenna.

—

Increase the separation between the equipment and receiver.

—

Connect the equipment into an outlet on a circuit different fro m that to which the

receiver is connected.

—

Consult the dealer or an experienced radio/ TV technician for help.

You are cautioned that any change or modifications to the equipment not expressly
approve by the party responsible fo r compliance could void your authority to operate
such equipment.

IMPO RTANT NOTE:

FCC Radiation Exposure State ment:
This equipment complies with FCC radiat ion exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated with
minimum distance 20cm between the radiator & your body

.

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Ta b le of Contents

1 INTRODUCTION .......................................................................................................... 1

1.1 OVERVIEW .................................................................................................................. 2

1.2 MODEL VARIATIONS ................................................................................................... 3

1.3 FEATURES ................................................................................................................... 3

1.4 TECHNICAL SPECIFICATIONS ...................................................................................... 4

1.5 CONNECTOR PANEL .................................................................................................... 6

1.6 LED INDICATORS ....................................................................................................... 7

1.7 BACKPLANE OPTIONS ................................................................................................ 8

1.8 DIMENSIONS ............................................................................................................. 10

2 UNPACKING ................................................................................................................ 11

2.1 ANTI-STATIC PRECAUTIONS ...................................................................................... 12

2.2 UNPACKING PRECAUTIONS ....................................................................................... 12

2.3 UNPACKING CHECKLIST ........................................................................................... 13

3 INSTALLATION ......................................................................................................... 15

3.1 INSTALLATION PRECAUTIONS ................................................................................... 16

3.2 CFAST INSTALLATION ............................................................................................... 16

3.3 HARD DISK DRIVE (HDD) INSTALLATION ................................................................ 18

3.4 SYSTEM FAN INSTALLATION ..................................................................................... 20

3.5 PLUGGABLE DC-IN TERMINAL BLOCK INSTALLATION ............................................. 21

3.6 MOUNTING THE SYSTEM WITH MOUNTING BRACKETS ............................................ 22

3.7 EXTERNAL PERIPHERAL INTERFACE CONNECTORS ................................................... 23

3.7.1 ACC Mode Selection ........................................................................................ 24

3.7.2 AT/ATX Power Mode Selection ........................................................................ 24

3.7.3 Audio Connector .............................................................................................. 25

3.7.4 CFast Socket .................................................................................................... 25

3.7.5 Digital Input/Output Connector ....................................................................... 25

3.7.6 DisplayPort Connector .................................................................................... 26

3.7.7 DVI Connector ................................................................................................. 27

3.7.8 LAN Connectors ............................................................................................... 28

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3.7.9 Power Input, 3-pin Terminal Block .................................................................. 30

3.7.10 Power Input, 4-pin DIN Connector ............................................................... 30

3.7.11 RS-232/422/485 Serial Ports .......................................................................... 31

3.7.12 RS-232 Serial Port Connectors ...................................................................... 33

3.7.13 USB Connectors ............................................................................................. 35

3.8 POWERING ON/OFF THE SYSTEM ............................................................................. 36

4 BIOS .............................................................................................................................. 38

4.1 INTRODUCTION ......................................................................................................... 39

4.1.1 Starting Setup ................................................................................................... 39

4.1.2 Using Setup ...................................................................................................... 39

4.1.3 Getting Help ..................................................................................................... 40

4.1.4 Unable to Reboot after Configuration Changes .............................................. 40

4.1.5 BIOS Menu Bar ................................................................................................ 40

4.2 MAIN ........................................................................................................................ 41

4.3 ADVANCED ............................................................................................................... 42

4.3.1 ACPI Settings ................................................................................................... 43

4.3.2 Super IO Configuration ................................................................................... 44

4.3.2.1 Serial Port n Configuration ....................................................................... 45

4.3.3 Hardware Monitor ........................................................................................... 49

4.3.3.1 Smart Fan Mode Configuration ................................................................ 50

4.3.4 RTC Wake Settings ........................................................................................... 53

4.3.5 Serial Port Console Redirection ...................................................................... 54

4.3.6 iEi Feature ........................................................................................................ 57

4.3.7 CPU Configuration .......................................................................................... 57

4.3.7.1 Socket 0 CPU Information ........................................................................ 58

4.3.8 IDE Configuration ........................................................................................... 59

4.3.9 T rusted Computing ........................................................................................... 61

4.3.10 USB Configuration ......................................................................................... 62

4.4 CHIPSET ................................................................................................................... 63

4.4.1 North Bridge Configuration ............................................................................. 64

4.4.2 South Bridge Configuration ............................................................................. 66

4.4.2.1 Azalia HD Audio ....................................................................................... 68

4.4.2.2 PCI Express Configuration ....................................................................... 69

4.5 SECURITY ................................................................................................................. 70

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4.6 BOOT ........................................................................................................................ 71

4.7 SAVE & EXIT ............................................................................................................ 73

4.8 SERVER MGMT ......................................................................................................... 74

4.8.1.1 System Event Log ..................................................................................... 75

4.8.1.2 BMC network configuration ..................................................................... 76

A SAFETY PRECAUTIONS ......................................................................................... 77

A.1 SAFETY PRECAUTIONS ............................................................................................ 78

A.1.1 General Safety Precautions ............................................................................. 78

A.1.2 Anti-static Precautions .................................................................................... 78

A.1.3 Product Disposal ............................................................................................. 79

A.2 MAINTENANCE AND CLEANING PRECAUTIONS ........................................................ 80

A.2.1 Maintenance and Cleaning .............................................................................. 80

A.2.2 Cleaning T ools ................................................................................................. 80

B DIGITAL I/O INTERFACE ....................................................................................... 82

B.1 INTRODUCTION ........................................................................................................ 83

B.2 ASSEMBLY LANGUAGE SAMPLE 1 ............................................................................ 84

B.3 ASSEMBLY LANGUAGE SAMPLE 2 ............................................................................ 84

C HAZARDOUS MATERIALS DISCLOSURE ......................................................... 85

C.1 HAZARDOUS MATERIALS DISCLOSURE TABLE FOR IPB PRODUCTS CERTIFIED AS

ROHS COMPLIANT UNDER 2002/95/EC WITHOUT MERCURY ....................................... 86

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List of Figures

Figure 1-1: TANK-801 ..................................................................................................................... 2

Figure 1-2: TANK-801 Peripheral Connectors
Figure 1-3: TANK-801 LED Indicators
Figure 1-4: 2P1E
Figure 1-5: 1P2E
Figure 1-6: 3P0E
Figure 1-7: Physical Dimensions (millimeters)
Figure 3-1: CFast Socket
Figure 3-2: CFast Socket Cover
Figure 3-3: CF Card Installation
Figure 3-4: Unscrew the Cover
Figure 3-5: Remove the Cover from TANK-801
Figure 3-6: HDD Installation
Figure 3-7: HDD Retention Screws
Figure 3-8: System Fan Installation
Figure 3-9: Pluggable DC-in Terminal Block Installation
Figure 3-10: Mounting Bracket Retention Screws
Figure 3-11: ACC Mode Switch

............................................................................. 6

........................................................................................... 7

.............................................................................................................................. 8

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Figure 3-12: AT/ATX Power Mode Switch
Figure 3-13: Au dio Connector
Figure 3-14: DIO Connector Pinout Location
Figure 3-15: RJ-45 to DB-9 Cable (P/N: 32005-000200-200-RS)
Figure 3-16: DisplayPort Connection
Figure 3-17: DVI Connector
Figure 3-18: LAN Connection
Figure 3-19: RJ-45 Ethernet Connector
Figure 3-20: 3-pin Terminal Block Pinout Location
Figure 3-21: Power Input Connector
Figure 3-22: Serial Device Connector
Figure 3-23: DB-9 Connector Pinout Location

..................................................................................24

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Figure 3-24: Serial Device Connector .........................................................................................34

Figure 3-25: Serial Port Pinout Location
Figure 3-26: USB Device Connection
Figure 3-27: Power Button

....................................................................................34

.........................................................................................36

...........................................................................................................37

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List of Tables

Table 1-1: TANK-801 Model Variations ......................................................................................... 3

Table 1-2: Technical Specifications
Table 1-3: Supported Signals
Table 1-4: Rated Voltage and Current
Table 3-1: DIO Connector Pinouts
Table 3-2: LAN Pinouts
Table 3-3: RJ-45 Ethernet Connector LEDs
Table 3-4: Power Input Pinouts
Table 3-5: RS-232/422/485 Connector Pinouts
Table 3-6: RS-232 Serial Port Pinouts
Table 3-7: USB Port Pinouts
Table 4-1: BIOS Navigation Keys

TANK-801

.............................................................................................. 5

........................................................................................................ 9

.......................................................................................... 9

..............................................................................................26

................................................................................................................29

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Chapter

1

1 Introduction

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1.1 Overview

Figure 1-1: TANK-801

The TANK-801 Series em bedded s ystem is a fanless system for wide range temperature
environments. It is powered b y the Intel® Celeron® J1900 2.0GHz quad core processor
and has 2.0 GB of DDR3L memory. The TANK-801 Series includes one DisplayPort, one
DVI-I port, two PCIe GbE LAN, two USB 2.0 ports, two USB 3.0 ports and four COM ports.

TANK-801 Emb edded System

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1.2 Model Variations

The model variations of the TANK-801 Series are listed below.

Model No. CPU Expansion Slots

TANK-801-BTi-J1/2G/3A-R10

TANK-801-BTi-J1/2G/3B-R10

TANK-801-BTi-J1/2G/3C-R10

Table 1-1: TANK-801 Model Variations

1.3 Features

The TANK-801 features are listed below:

 Intel® Celeron® J1900 2.0GHz quad core
 2.0 GB DDR3L memory
 Redundant dual DC input
 Flexible PCI/PCIe expansion slots
 Two Gigabit Ethernet ports

Intel® Celeron® J1900

2.0GHz quad core
Intel® Celeron® J1900

2.0GHz quad core
Intel® Celeron® J1900

2.0GHz quad core

two PCI and
one PCIe x 1

one PCI and
two PCIe x 1

three PCI

 Two USB 2.0 ports
 Two USB 3.0 ports
 Two RS-232 serial ports
 Two RS-232/422/485 serial ports
 One DisplayPort
 One DVI-I port
 One Line-out and one Mic-in audio jacks
 AT/ATX power mode supported
 RoHS compliant

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1.4 Technical Specifications

The TANK-801 technical specifications are listed in Table 1-2.

Specifications

Fanless

Processor

Memo ry

IPMI

Ethernet

Super I/O

USB

C OM Po r t

Display

Yes
Intel® Bay Trial-D J1900 22nm quad core Atom™ 2GHz processor

TDP 10W
One 204-pin 1333 DDR3L Single-Channel SDR AM SO DIMM

(max capacity 8G)
iRIS-2400 (Optional)
1 x RJ45 PCIe GbE by Intel I210 controller (LAN1)

1 x RJ45 PCIe GbE by Intel I211 controller (LAN2)
Fintek F81866
2 x USB 2.0 (Front)

2 x USB 3.0 (Front)
1 x internal USB 2.0 connector

2 x RS232 with DB9
2 x RS 232/422/485 with DB9 ( w/3KV isolation)

DVI-I + DisplayPort

Max Resolution

Digital IO

Audio

Indicators

Storage

2560 x 1600 MHz
2 x 8bit DIO(4 bit in，4bit out ) by 2 x RJ45

1 x Line-out / 1 x Mic

1.A T/ATX mode indicator

2.IPMI indicator

3.Power1 LED indicator

4.Power2 LED indicator
5,HDD indicator

6.CPU overheat indicator
1 x 2.5'' SATA II 2.5" HDD/SSD

1 x CFast

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Specifications

Interior Expensions

Backplane

Buttons

Antenna Port

Power Input

Power Consumption

Chassis Construction

Chassis Dimensions

Mini PCIe slot x 1 ,
SO-DIMM for IPMI

Follow TANK-800 BP
(1)2 x PCI + 1 x PCIe ( by1 signal )
(2)1 x PCI + 2 x PCIe ( by1 signal )
(3)3 x PCI

Power on, reset button
2 antenna holes
Dual Power input

(1)Phenix 3 terminal port 9~36 V input
(2)4 pin DC Jack-in 9~36 V input

19 V@1.8 A
(Intel® Celeron® J1900 with 2 GB DDR3 memory)

Extruded Aluminum Alloy for fanless support
247*191*136 (mm)

Operating Shock

Operating Vibration

Operation Temp.

Storage Temp.

Humidity

Table 1-2: Technical Specifications

Half-Sine Shock Test 5G/11ms, 3 shocks per axis
MIL-STD-810F 514.5 C-1(HDD),MIL-STD-810F 514.5 C-2(SSD)
From -20°C to 60°C (SATA SSD) with air flow
From -40°C to 85°C (SATA SSD) with air flow
5% to 95% no condensation

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1.5 Connector Panel

All external peripheral interface connectors are located on the rear panel of the TANK-801.
The peripheral interface connectors are shown in Figure 1-2.

Figure 1-2: TANK-801 Peripheral Connectors

Connectors and buttons on the rear panel include the following.

 1 x 4-pin power DC jack for 9V~ 36V power input
 1 x Power terminal block for 9V ~ 36V power input
 1 x Mic-in port (pink)
 1 x Line-out port (green)
 2 x DB-9 RS232 serial ports
 2 x DB-9 RS 232/422/485 ( w/3KV isolation)
 2 x Gigabit Ethernet ports
 2 x USB 3.0 ports

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 2 x USB 2.0 ports
 1 x Reset button
 6 x LED indicators (Section 1.6)
 1 x Power button
 1 x CFast
 1 x DisplayPort
 1 x DVI-I
 1 x To earth
 3 x Expansion slots
 2 x DIO ports
 1 x AT/ATX power mode switch
 1 x ACC mode switch

1.6 LED Indicators

There are several indicators on the rear panel of the TANK-801 as shown in Figure 1-3.

Figure 1-3: TANK-801 LED Indicators

WARNING:

The CPU Temperature Alert LED turns red when the CPU temperature
is too high. If this situation occurs, lower the enviro nment tem perature
or close some running applications to cool down the CPU.

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1.7 Backplane Options

The backplane options of the TANK-801 are shown below.

Figure 1-4: 2P1E

Figure 1-5: 1P2E

Figure 1-6: 3P0E

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The supported signals of the backplane slots are listed below.

Backplane Slot Signal

2P1E

1P2E

3P0E

Table 1-3: Supported Signals

The rated voltage and current of the backplanes are listed below.

Rated Voltage Rated Current

+5 V 7 A
+12 V 3.75 A

-12 V 0.1 A
+3.3 V 8 A

PCI PCI
PCIe x16 PCIe x1
PCI PCI
PCIe x4 PCIe x1
PCIe x16 PCIe x1

PCI PCI

Table 1-4: Rated Voltage and Current

WARNING:

The system default power is 96 W. The maxim um total power of the
backplane to support expansion cards is 45 W. The power of the
selected expansion cards can not exceed the max. power (45 W),
otherwise, the system may fail.

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NOTE:

When using an expansion card with high power consumption, it is
recommended to install an external power supply to the 12V power
input connector on the backplane.

The maximum dim ensions of the expa nsion car d shou ld be 19 0 mm in
length and 111 mm in width.

1.8 Dimensions

The physical dimensions are shown below:

Figure 1-7: Physical Dimensions (millimeters)

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Chapter

2

2 Unpacking

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may result in

2.1 Anti-static Precautions

WARNING:

Failure to take ESD precautions during installation
permanent damage to the TANK-801 and severe injury to the user.

Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the TANK-801. D ry climates are especially susceptible to ESD. It is therefore
critical that whenever the TANK-801 or any other electrical component is handled, the
following anti-static precautions are strictly adhered to.

 Wear an anti-static wristband: Wearing a simple anti-static wristband can

help to prevent ESD from damaging the board.

 Self-grounding: Before handling the board touch any grounded conducting

material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.

 Use an anti-static pad: When configuring the TANK-801, place it on an

antic-static pad. This reduces the possibility of ESD damaging the TANK-801.

2.2 Unpacking Precautions

When the TANK-801 is unpacked, please do the following:

 Follow the anti-static precautions outlined in Section 2.1.
 Make sure the packing box is facing upwards so the TANK-801 does not fall

out of the box.

 Make sure all the components shown in Section 2.3 are present.

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2.3 Unpacking Checklist

NOTE:

If some of the components listed in the checklist below are missing,
please do not proceed with the installation. Contact the IEI resel ler or
vendor you purchased the TANK-801 from or contact an IEI sales
representative direct ly. To contact an IEI s ales representati ve, please
send an email to

The TANK-801 is shipped with the following components:

Quantity Item and Part Number Imag e

Standard

1 TANK-801 Series

1 Power adapter

(P/N: 63040-010090-020-RS)

[e-mail].

1 Power cord

2 Mounting bracket

4 Mounting bracket screw

(P/N: 41020-0308C2-00-RS)

(P/N: 44033-040062-RS)