Mustang-V100-MX8
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MODEL:
Intel
®
Vision Accelerator Design with Intel® Movidius™ VPU
Rev. 1.00 - October 5, 2018
Mustang-V100-MX8
Mustang-V100-MX8 CPU Ca
Powered by Open Visual Inference & Neural Network Optimization (OpenVINO™) toolkit
User Manual
Mustang-V100-MX8
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Date Version Changes
October 5, 2018 1.00 Initial release
Revision
Mustang-V100-MX8
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Copyright
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibil ity of such damages.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.
Mustang-V100-MX8
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Manual Conventions
WARNING
Warnings appear where overlooked details may cause damage to the
equipment or result in personal injury. Warnings should be taken
seriously.
CAUTION
Cautionary messages should be heeded to help red uce the chance of
losing data or damaging the product.
NOTE
These messages inform the reader of essent ial but non-critical
information. These messages should be read carefully as any directions
or instructions contained therein can help avoid making mistakes.
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Table of Contents
1 INTRODUCTION .......................................................................................................... 1
1.1 INTRODUCTION ........................................................................................................... 2
1.2 FEATURES ................................................................................................................... 3
1.3 BLOCK DIAGRAM ....................................................................................................... 3
1.4 I/O AND DIMENSIONS ................................................................................................. 4
1.5 TECHNICAL SPECIFICATIONS ...................................................................................... 5
2 UNPACKING ................................................................................................................. 6
2.1 ANTI-STATIC PRECAUTIONS ........................................................................................ 7
2.2 UNPACKING PRECAUTIONS ......................................................................................... 7
2.3 PACKING LIST ............................................................................................................. 8
3 HARDWARE INSTALLATION ................................................................................... 9
3.1 ANTI-STATIC PRECAUTIONS ...................................................................................... 10
3.2 INSTALLATION CONSIDERATIONS .............................................................................. 10
3.3 HARDWARE INSTALLATION ....................................................................................... 12
4 SOFTWARE INSTALLATION (OPENVINO™ TOOLKIT ) ............................. 16
4.1 SYSTEM REQUIREMENTS .......................................................................................... 17
4.2 INSTALLATION .......................................................................................................... 17
A REGULATORY COMPLIANCE .............................................................................. 18
B PRODUCT DISPOSAL .............................................................................................. 20
C HAZARDOUS MATERIALS DISCLOSURE ......................................................... 22
Mustang-V100-MX8
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List of Figures
Figure 1-1: Mustang-V100-MX8 ..................................................................................................... 2
Figure 1-2: Block Diagram ............................................................................................................. 3
Figure 1-3: Dimensions (mm) ........................................................................................................ 4
Figure 3-1: Remove One Blank Bracket ..................................................................................... 12
Figure 3-2: Change to Full-height Bracket ................................................................................. 13
Figure 3-3: Change to Full-height Bracket ................................................................................. 13
Figure 3-4: Power Connector Location ...................................................................................... 14
Figure 3-5: Assign a Card ID ....................................................................................................... 14
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Chapter
1
1 Introduction
Mustang-V100-MX8
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1.1 Introduction
Figure 1-1: Mustang-V100-MX8
The Mustang-V100-MX8 is a deep learning convolutional neural network acceleration
card for speeding up AI inference , in a flexible and scalable way. Equipped with Intel®
Movidius™ Myriad™ X Vision Processing Unit (VPU), the Mustang-V100-MX8 PCIe card
can be used with the existing system, enabling high-performance computing without
costing a fortune. VPUs can run AI faster, and is well suited for low power consumption
applications such as surveillance, retail and transportation. With the advantage of power
efficiency and high performance to dedicate DNN topologies, it is perfect to be
implemented in AI edge computing device to reduce total power usage, providing longer
duty time for the rechargeable edge computing equipment.
"Open Visual Inference & Neural Network Opt imi zatio n (Op enVI NO ™) tool kit " is bas ed on
convolutional neural networks (CNN), the toolkit extends workloads across Intel®
hardware and maximizes performance. It can optimize pre-trained deep learning model
such as Caffe, MXNET, Tensorflow into IR binary file then execute the inference engine
across Intel®-hardware heterogeneously such as CPU, GPU, Intel® Movidius™ Neural
Compute Stick, and FPGA.
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1.2 Features
Mustang-V100-MX8 features are listed below:
Intel® Movidius™ Myriad™ X V i sion P rocessing Unit
Interface: PCIe 2.0 x4
Form factor: Standard half-height, half-length, single-width
Active fan
OpenVINO™ Toolkit, AI edge computi ng ready device
Eight Intel® Movidius™ Myriad™ X chips can execute eight topologies
Low power consumption, approximate 2.5W f or e ach Intel® Movidius™
12V external power
Equipped with rotary switch and LED indicator for card number identification
simultaneously
Myriad™ X
1.3 Block Diagram
Figure 1-2 shows the block diagram of the Mustang-V100-MX8.
Figure 1-2: Block Diagram
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1.4 I/O and Dimensions
The I/O interfaces and dimensions of the board are listed below:
Figure 1-3: Dimensions (mm)
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1.5 Technical Specifications
Mustang-V100-MX8 technical specifications are listed below.
Specification Mustang-V100-MX8
Main Chip
Operating Systems
Physical PCIe Interface
Indicator
Fan
External Power Connector
Power Consumption
Operating Temperature
Operating Humidity
Dimensions (WxHxD)
Table 1-1: Technical Specifications
Intel® Movidius™ Myriad™ X
Ubuntu* 16.04.3 (LTS), 64-bit
CentOS 65-bit
PCI Express x4
Compliant with PCI Express Specification v2.0
7-segment LED display for card ID
Active fan
12 V external power
<25 W
5°C ~ 60°C / 41°F ~ 140°F (ambient temperature)
5% ~ 90%
169.54 mm x 80.05 mm x 23.16 mm
Standard half-height, half-length, single-width
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Chapter
2
2 Unpacking
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2.1 Anti-static Precautions
WARNING!
Static electricity can destroy certain elect ronics. Make sur e to follow the
ESD precautions to prevent damage to the product, and injury to the
user.
Make sure to adhere to the following guidelines:
Wear an anti-static wristband: Wearing an anti-static wristband can prevent
electrostatic discharge.
Self-grounding: Touch a grounded conductor every few minutes to discharge
any excess static buildup.
Use an anti-static pad: When configuring any circuit board, place it on an
anti-static mat.
Only handle the edges of the PCB: Don't touch the surface of the
motherboard. Hold the motherboard by the edges when handling.
2.2 Unpacking Precautions
When the Mustang-V100-MX8 is unpacked, please do the following:
Follow the antistatic guidelines above.
Make sure the packing box is facing upwards when opening.
Make sure all the packing list items are present .
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2.3 Packing List
NOTE:
If any of the components listed in the checklist below are missing, do not
proceed with the installation. Contact the IEI reseller or vendor the
Mustang-V100-MX8 was purchased from or contact an IEI sales
representative directly by sending an email to sales@ieiworld.com
The Mustang-V100-MX8 is shipped with the followin g components:
Quantity Item and Part Number Image
1 Mustang-V100-MX8 AI acceleration card
1 PCIe power adapter
1 Full-height bracket
1 Quick Installation Guide
.
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Chapter
3
3 Hardware Installation
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Failure to take ESD precautions during the installation of the
may result in permanent damage to the
3.1 Anti-static Precautions
WARNING:
Mustang-V100-MX8
Mustang-V100-MX8 and severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the Mustang-V100-MX8. Dry climates are especially susceptible to ESD. It is
therefore critical that whenever the Mustang-V100-MX8 or any other electrical component
is handled, the following anti-static preca utions are strictly adhered to.
Wear an anti-static wristband: Wearing a simple anti-static wristband can
help to prevent ESD from damaging the board.
Self-grounding Before handling the board, touch any grounded conducting
material. During the time the board is handled, f requently touch any
conducting materials that are connected to the ground.
Use an anti-static pad: When configuring the Mustang-V100-MX8, place it
on an anti-static pad. This reduces the possibility of ESD damaging the
Mustang-V100-MX8.
Only handle the edges of the PCB: When handling the PCB, hold the PCB
by the edges.
3.2 Installation Considerations
NOTE:
The following installation notices and installation considerations should
be read and understood before installation. All instal l ation notices must
be strictly adhered to. Failing to adhere to these precautions may lead
to severe damage and injury to the person performing the installation.
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The installation instructions described in this manual should be carefully
WARNING:
followed in order to prevent damage to the Mustang-V100-MX8, its
components and injury to the user.
Before and during the installation please DO the following:
Read the user manual:
The user manual provides a complete descriptio n of the Mustang-V100-MX8
installation instructions and configuration options.
Wear an electrostatic discharge cuff (ESD):
Electronic components are easily damaged by E SD. Wearing an ESD cuff
removes ESD from the body and helps prevent ESD damage.
Turn off system:
When installing the Mustang-V100-MX8, make sure that the system to be
connected is disconnected from all power suppl i es and that no electricity is
being fed into the system.
Before and during the installation of the Mustang-V100-MX8 DO NOT:
Remove any of the stickers on the PCB board. T hese sti ckers are r equired f or
warranty validation.
Use the product before verifying all the cables and power connectors are
properly connected.
Allow screws to come in contact with the PCB circuit, connector pins, or its
components.
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3.3 Hardware Installation
To install the Mustang-V100-MX8, please follow the steps below.
Step 1: Prepare the computer. Turn off the computer, and remove the power cord from
the rear of the power supply.
WARNING:
Disconnect the computer from the power supply and from any networks
to which you will install the Mustang-V100-MX8, or you risk damaging
the system or experiencing electrical shock.
Step 2: Remove the cover from the chassis.
Step 3: Locate available PCIe slots and remove the blank brackets. The
Mustang-V100-MX8 is compatible with PCIe x4 slots, and only needs one PCIe
slot for installation. Remove a blank bracket panel on the back of the comput er
that aligns with the PCIe slot for installing t he Mustang-V100-MX8. Save the
bracket screw.
Low-profile bracket Full-height bracket
Figure 3-1: Remove One Blank Bracket
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Step 4: [Only needed for full-height installation] Change the bracket on the
Mustang-V100-MX8 from low-profile bracket to full-height bracket.
Figure 3-2: Change to Full-height Bracket
Step 5: Install and secure the Mustang-V100-MX8 to the system. Align the
Mustang-V100-MX8 to the PCIe slot. Press down gently, but firmly, to seat the
Mustang-V100-MX8 correctly in the slot. Install the bracket screw to secure the
Mustang-V100-MX8 to the system’ s chassis.
Low-profile bracket Full-height bracket
Figure 3-3: Change to Full-height Bracket
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Step 6: Connect a power cable to the Mustang-V100-MX8. The Mustang-V100-MX8
requires 12V DC power. Use a power cable with 6-pin connector from the
system, if applicable, or add the 4-pin to 6-pin PCIe power adapter to connect to
the power connector of the Mustang-V100-MX8.
Figure 3-4: Power Connector Location
Step 7: Assign a card ID to the Mustang-V100-MX8 by adjusting the rotary switch.
The card ID number assigned here will be shown on the LED display of the card
after power-up.
Figure 3-5: Assign a Card ID
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Step 8: Repeat Step 3 ~ Step 7 to install multiple Mustang-V100-MX8 into the
system if available.
Step 9: Re-install the cover of the chassis.
Step 10: Reconnect any power cords and any network cables to the system. Power
up the system. Step 0:
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Chapter
4
4 Software Installation
(OpenVINO™ Toolkit )
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4.1 System Requirements
Linux Ubuntu 16.04.3 LTS 64bit
CentOS 65-bit
OpenVINO™ Toolkit was pre-installed in TANK-870AI.
4.2 Installation
Go to https://software.intel.com/en-us/openvino-toolkit. Click “Get Started” then choose
your configuration from “Development Environment Installation Guides & Videos”. Follow
the instruction to complete the installation procedure.
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Appendix
A
A Regulatory Compliance
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is equipment complies with Part 15 of the FCC Rules. Operation is subject to the
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
commercial environment. This equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in accordance with the instruction
cause harmful interference to radio communications. Operation of this
DECLARATION OF CONFORMITY
This equipment has been tested and f ound to com ply with specifi cations for CE marking.
If the user modifies and/or installs other devices in the equipment, the CE conformity
declaration may no longer apply.
FCC WARNING
Th
following two conditions:
This device may not cause harmful interference, and
This device must accept any interference receiv ed, including interference
that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class A digital
reasonable protection against harmful interference when the equipment is operated in a
manual, may
equipment in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.
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B Product Disposal
Appendix
B
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CAUTION:
Risk of explosion if battery is replaced by an incorrect type. Only
certified engineers should replace the on-board battery.
Dispose of used batteries according to instructions and local
regulations.
Outside the European Union–If you wish to dispose of used electrical and
electronic products outside the Europea n Union, please contact your local
authority so as to comply with the correct dispo sal m ethod.
Within the European Union–The device that produces less waste and is
easier to recycle is classified as electronic device in terms of the E uropean
Directive 2012/19/EU (WEEE), and must not be disposed of as domestic
garbage.
EU-wide legislation, as implemented in each Membe r State, requires that
waste electrical and electronic products carrying the mark (left) must be
disposed of separately from normal household waste. This includes
monitors and electrical accessories, such as signal cables or power
cords. When you need to dispose of your device, please follow the
guidance of your local authority, or ask the shop where you purchased the product. The
mark on electrical and electronic products only applies to the current European Union
Member States.
Please follow the national guidelines for elect rical and electronic product disposal.
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Appendix
C
C Hazardous Materials
Disclosure
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The details provided in this appendix are to ensure that the product is compliant with the
Peoples Republic of China (China) RoHS standards. The table below acknowledges the
presences of small quantities of certain material s in the product, and is applicable t o China
RoHS only.
A label will be placed on each product to indicate the estimated “Environmentally Friendly
Use Period” (EFUP). This is an estimate of the number of years that these substances
would “not leak out or undergo abrupt change.” This product may contain replaceable
sub-assemblies/components which have a shorter EFUP such as batteries and lamps.
These components will be separately marked.
Please refer to the following table.
Part Name Toxic or Hazardous Substances and Elements
Lead
(Pb)
Housing
Display
Printed Circuit
Board
Metal Fasteners
Cable Assembly
Fan Assembly
Power Supply
Assemblies
Battery
O: This toxic or hazardous substance is contained in all of the homogeneo us materials for the part is below the li m it
requirement in SJ/T11363-2006 (now replaced by GB/T 26572-2011).
X: This toxic or hazardous substance is contained in at least one of the ho mogeneous materials for this part is above
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chromium
(CR(VI))
Polybrominated
Biphenyls
(PBB)
Polybrominated
Diphenyl Ethers
(PBDE)
the limit requirement in SJ/T11363-2006 (now replaced by GB/T 26572-2011).
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部件名称
有毒有害物质或元素
铅
汞
镉
六价铬
多溴联苯
多溴二苯
醚
壳体
显示
印刷电路板
金属螺帽
电缆组装
风扇组装
电力供应组装
电池
此附件旨在确保本产品符合中国 RoHS 标准。以下表格标示此产品中某有毒物质的含量符
合中国 RoHS 标准规定的限量要求。
本产品上会附有”环境友好使用期限”的标签，此期限是估算这些物质”不会有泄漏或突变”的
年限。本产品可能包含有较短的环境友好使用期限的可替换元件，像是电池或灯管，这些元
件将会单独标示出来。
(Pb)
O: 表示该有毒有害物质在该部件所有物质材料中的含量均在 SJ/T 11363-2006 (现由 GB/T 26572-2011 取代)
标准规定的限量要求以下。
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
(Hg)
(Cd)
(CR(VI))
(PBB)
(PBDE)
X: 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T 11363-2006 (现由 GB/T
26572-2011 取代) 标准规定的限量要求。
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