GRAND-BDE Series
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MODEL: MODEL:
GRAND-BDE Series
Rev. 1.00 – April 13, 2018
GRAND-BDE Industrial server
Storage Server with Intel® Xeon® D Processor, Up to 128 GB
DDR4 RAM, Quad GbE Port, PCIe 3.0 x8/x4 Slots,
2U Rack Mount Chassis, 450 W Redundant PSU, RoHS
User Manual
GRAND-BDE Series
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Date Version Changes
April 13, 2018 1.00 Initial release
Revision
GRAND-BDE Series
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Copyright
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.
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Manual Conventions
WARNING
Warnings appear where overlooked details may cause damage to the
equipment or result in personal injury. Warnings should be taken
seriously.
CAUTION
Cautionary messages should be heeded to help reduce the chance of
losing data or damaging the product.
NOTE
These messages inform the reader of essential but non-critical
information. These messages should be read carefully as any directions
or instructions contained therein can help avoid making mistakes.
HOT SURFACE
This symbol indicates a hot surface that should not be touched without
taking care.
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Table of Contents
1 INTRODUCTION .......................................................................................................... 1
1.1 OVERVIEW .................................................................................................................. 2
1.2 FEATURES ................................................................................................................... 2
1.3 FRONT PANEL ............................................................................................................. 3
1.3.1 LED Indicator Specifications ............................................................................. 4
1.4 REAR PANEL ............................................................................................................... 6
1.5 SPECIFICATIONS ......................................................................................................... 7
2 UNPACKING ................................................................................................................. 9
2.2 PACKING LIST ........................................................................................................... 10
2.3 OPTIONAL ITEMS ....................................................................................................... 11
3 INSTALLATION ......................................................................................................... 13
3.1 ANTI-ST AT IC PRECAUTIONS ...................................................................................... 14
3.2 INSTALLATION PRECAUTIONS ................................................................................... 14
3.2.1 High Surface Temperature ............................................................................... 15
3.3 MEM O RY MODULE INSTALLATION ........................................................................... 16
3.4 EXPANSION CARD INSTALLATION ............................................................................. 18
3.5 HARD DRIVE INSTALLATION ..................................................................................... 21
3.5.1 Hard Drive Bay Numbering ............................................................................. 22
3.5.2 Installing Hard Drive ....................................................................................... 24
3.6 POWER-ON PROCEDURE ........................................................................................... 26
3.6.1 Installation Checklist ....................................................................................... 26
3.6.2 Power-on Procedure ........................................................................................ 26
4 MAINTENANCE ......................................................................................................... 28
4.1 COMPONENT REPLACEMENT PROCEDURE ................................................................ 29
4.2 POWER SUPPLY UNIT REPLACEMENT ....................................................................... 30
5 INTERFACE CONNECTORS ................................................................................... 32
5.1 PERIPHERAL INTERFACE CONNECTORS ..................................................................... 33
5.1.1 CPLD Connector ............................................................................................. 34
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5.1.2 10Gbps Host Connector (PCIe Slot 5) ............................................................. 34
5.1.3 PCIe Power Connector (CON2) ...................................................................... 35
5.1.4 LPC Connector (CN8) ..................................................................................... 36
5.1.5 COM Connector (CN2, CN17, CON7) ............................................................ 36
5.1.6 Thermistor (RT7, RT9, RT10, RT11) ................................................................ 36
5.2 EXTERNAL INTERFACE PANEL CONNECTORS ............................................................ 37
5.2.1 Ethernet and USB 3.0 Combo Connectors ...................................................... 37
5.2.2 Console Port .................................................................................................... 38
5.2.3 EC GPIO .......................................................................................................... 38
5.2.4 SAS Connector ................................................................................................. 38
A REGULATORY COMPLIANCE .............................................................................. 40
B SAFETY PRECAUTIONS ......................................................................................... 45
B.1 SAFETY PRECAUTIONS ............................................................................................. 46
B.1.1 General Safety Precautions ............................................................................. 46
B.1.2 Anti-static Precautions .................................................................................... 47
B.1.3 Product Disposal ............................................................................................. 48
B.2 MAINTENANCE AND CLEANING PRECAUTIONS ........................................................ 48
B.2.1 Maintenance and Cleaning .............................................................................. 48
B.2.2 Cleaning Tools ................................................................................................. 49
C HAZARDOUS MATERIALS DISCLOSURE ......................................................... 50
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List of Figures
Figure 1-1: GRAND-BDE Series Storage Server .......................................................................... 2
Figure 3-1: Power Connection ..................................................................................................... 27
Figure 3-2: Power Button ............................................................................................................. 27
Figure 5-1: Jumper and Connector Locations ........................................................................... 33
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List of Tables
Table 1-1: Specifications ............................................................................................................... 8
Table 2-1: Package List ................................................................................................................ 10
Table 2-2: Optional Items ............................................................................................................. 12
Table 5-1: CPLD Connector Pinouts ........................................................................................... 34
Table 5-2: 10Gbps Host Connector (PCIe Slot 5) Pinouts ........................................................ 35
Table 5-3: PCIe Power Connector (CON2) Pinouts ................................................................... 35
Table 5-4: LPC Connector (CN8) Pinouts ................................................................................... 36
Table 5-5: COM Connector (CN2, CN17, CON7) Pinouts .......................................................... 36
Table 5-6: Ethernet Connector Pinouts ...................................................................................... 37
Table 5-7: USB 3.0 Connector Pinouts ....................................................................................... 37
Table 5-8: Console Port Pinouts ................................................................................................. 38
Table 5-9: EC GPIO Pinouts ......................................................................................................... 38
Table 5-10: SAS Connector Pinouts ........................................................................................... 39
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Chapter
1
1 Introduction
GRAND-BDE Series
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1.1 Overview
Figure 1-1: GRAND-BDE Series Storage Server
Powered by an advanced 14nm Intel® Xeon® D 64-bit SoC processor with an integrated
PCH, and up to 128 GB DDR4 ECC RDIMM RAM, the GRAND-BDE series storage server
delivers outstanding performance for data transmission and applications.
The GRAND-BDE supports SAS 12Gb/s 2.5” drives, allowing for SAS 12Gb/s and SATA
6Gb/s hard drives and SSDs. Businesses can create the most cost-effective storage by
implementing suitable drives based on their needs.
1.2 Features
The GRAND-BDE series has the following features
Dual Intel® Xeon® D processor (with 4-core, 6-core and 8-core
Supports four DDR4 RAM modules for UDIMM and ECC RDIMM (up to 64GB
Supports 12Gb/s SAS hard drives and SSDs for fast data transfer and
configurations)
UDIMM RAM, up to 128GB RDIMM RAM)
highly-reliable storage.
Four high-speed PCIe Gen.3 and one PCIe Gen.2; supports 10GbE/ 40GbE
adapters and PCIe NVMe SSD
Four Gigabit ports
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1.3 Front Panel
GRAND-BDE-18B:
GRAND-BDE-30B:
1 Power button
LED Indicator:
10 GbE
2
System status
LAN
Storage expansion port status
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1.3.1 LED Indicator Specifications
The LED indicators of the GRAND-BDE indicate the system status and information. The
following table lists the LED indicator behavior. Note that the following information is
applicable only when users have properly installed the hard drive, and connected the
system to the power supply.
LED Color LED Status Description
10 GbE Green
Green The 10GbE network expansion card is installed.
Off No 10GbE network expansion card is installed.
1. The hard drive is invalid.
2. The disk volume has reached its full capacity.
3. The disk volume is going to be full.
System Status Red/Green
LAN Orange
Storage
Expansion Port
Status
Orange
Red
Green The system is ready.
Deep flashes
of orange
Off All the hard drives are in standby mode.
Orange
Flashes
orange
Off No expansion enclosures are detected.
Orange Expansion enclosures are detected.
Red A hard drive read/write error occurs.
4. The system fan is out of function.
5. An error occurs when accessing (read/write) the
disk data.
6. A bad sector is detected on the hard drive.
The system is in sleep mode.
The disk data is being accessed from the network
and a read/write error occurs during the process.
The system is connected to the network.
HDD Red/ Green
Flashes
green
Green The hard drive can be accessed.
The disk data is being accessed.
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LED indicator locations:
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1.4 Rear Panel
1 Gigabit Ethernet port 3 6 USB 3.0 ports
2 Gigabit Ethernet port 1 7 Gigabit Ethernet port 2
3 Power supply unit 1 8 Gigabit Ethernet port 4
4 Power supply unit 2 9 EC GPIO
5 Console port
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1.5 Specifications
The specifications for the GRAND-BDE series are listed below.
GRAND-BDE-18B GRAND-BDE-30B
CPU Intel® Xeon® D series processor
Total memory slots: 4 x DDR4 RDIMM/UDIMM
Memory
Max. memory: DDR4 128 GB (4 x 32 GB RDIMM)
Front: 12 x 2.5" / 3.5"
Drive Tray
Rear: 6 x 2.5" SSD drive bay
Hard Drive
USB 2 x USB 3.0 port (rear)
LAN 4 x 10/100/1000 Mbps LAN port
PCIe Slot
Front: SAS 12Gb/s, SAS 6Gb/s, SATA 6Gb/s and SSD
Rear: SATA 6Gb/s and SSD
Slot 1: PCIe 3.0 x8
Slot 2: PCIe 2.0 x4
Slot 3: PCIe 3.0 x4
Slot 4: PCIe 3.0 x4 or PCIe 3.0 x8*
Slot 5: PCIe 3.0 x4**
* Slot 4 provides the bandwidth of PCIe 3.0 x8 when Slot 3 is not in
use. Slot 4 then provides the bandwidth of PCIe 3.0 x4 only when an
expansion board is installed in Slot 3.
Front: 24 x 2.5"
Rear: 6 x 2.5" SSD drive bay
LEDs 10 GbE network, system status, network, drive LED
Button Power button
Form Factor 2U, rack mount
Dimensions (HxWxD) 88 mm x 442.5 mm x 530.5 mm 88 mm x 439 mm x 484.5 mm
** Slot 5 is a reverse connector that supports a specific 10GbE LAN
card (LAN-10G2F-PHY-CS4227).
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3.46" x 17.42" x 20.89" 3.47" x 17.28" x 19.07"
Power Consumption In operation: 255.04 W In operation: 229.53 W
Power Supply Redundant power: input 90 to 264VAC; 2 x 450W
Operating Temperature 0~40˚C
Relative Humidity 5 to 95% non-condensing, wet bulb: 27˚C
Fan 4 x 6-cm high-efficiency cooling fan
Table 1-1: Specifications
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Chapter
2
2 Unpacking
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was purchased from or contact an IEI sales
2.2 Packing List
NOTE:
If any of the components listed in the checklist below are missing, do
not proceed with the installation. Contact the IEI reseller or vendor the
GRAND-BDE
representative directly by sending an email to sales@ieiworld.com.
The GRAND-BDE is shipped with the following components:
Quantity Item Image
4 Ethernet cable
2 Power cord
1 Screw pack for 2.5" HDD installation
1 Screw pack for 3.5" HDD installation
(GRAND-BDE-18B only)
Table 2-1: Package List
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2.3 Optional Items
The following are optional components which may be separately purchased:
Item and Part Number Image
Dual-port 40GbE QSFP+ network expansion card
(P/N: LAN-40G2SF-MLX)
Dual-port 10GbE SFP+ network expansion card
(P/N: LAN-10G2SF-MLX)
Dual-port 10GBASE-T network expansion card
(P/N: LAN-10G2T-X550)
Dual-port 10GbE LAN card
(P/N: LAN-10G2F-PHY-CS4227)
USB 3.1 Gen 2 10Gbps Type-A dual-port PCIe card
(P/N: USB-U31A2P01)
Dual-port storage expansion, SAS 12Gbps
(P/N: SAS-12G2E)
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Item and Part Number Image
MiniSAS cable (SFF-8644 to SFF-8644),1.0 m
(P/N: CAB-SAS10M-8644)
MiniSAS cable (SFF-8644 to SFF-8644), 0.5m
(P/N: CAB-SAS05M-8644)
Rail kit for rackmount, max. load 57 kg
(P/N: RAIL-A03-57)
Table 2-2: Optional Items
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Chapter
3
3 Installation
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Failure to take ESD precautions during the maintenance of the
3.1 Anti-static Precautions
WARNING:
GRAND-BDE may result in permanent damage to the GRAND-BDE and
severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER series motherboard and the power module. (Dry climates are
especially susceptible to ESD.) It is therefore critical that whenever the GRAND-BDE is
opened and any electrical component handled, the following anti-static precautions are
strictly adhered to.
Wear an anti-static wristband: Wearing a simple anti-static wristband can
help to prevent ESD from damaging the board.
Self-grounding: Before handling the board, touch any grounded conducting
material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad: When configuring the GRAND-BDE, place it on an
anti-static pad. This reduces the possibility of ESD damaging the
GRAND-BDE.
3.2 Installation Precautions
During installation, be aware of the precautions below:
Read the user manual: The user manual provides a complete description of
the GRAND-BDE, installation instructions and configuration options.
DANGER! Disconnect Power: Power to the GRAND-BDE must be
disconnected during the installation process. Failing to disconnect the power
may cause severe injury to the body and/or damage to the system.
Qualified Personnel: The GRAND-BDE must be installed and operated only
by trained and qualified personnel. Maintenance, upgrades, or repairs may
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only be carried out by qualified personnel who are familiar with the associated
dangers.
Air Circulation: Make sure there is sufficient air circulation when installing
the GRAND-BDE. The GRAND-BDE’s cooling vents must not be obstructed
by any objects. Blocking the vents can cause overheating of the GRAND-BDE.
Leave at least 5 cm of clearance around the GRAND-BDE to prevent
overheating.
Grounding: The GRAND-BDE should be properly grounded. The voltage
feeds must not be overloaded. Adjust the cabling and provide external
overcharge protection per the electrical values indicated on the label attached
to the back of the GRAND-BDE.
3.2.1 High Surface Temperature
WARNING:
Some surfaces of the equipment may become hot during operation.
The surface temperature may be up to several tens of degrees hotter
than the ambient temperature. Under these circumstances, the
equipment needs to be protected against accidental contact.
The equipment is intended for installation in a RESTRICTED ACCESS LOCATION.
Access can only be gained by SERVICE PERSONS or by USERS who have
been instructed about the reasons for the restrictions applied to the location
and about any precautions that shall be taken.
Access is through the use of a TOOL or lock and key, or other means of
security, and is controlled by the authority responsible for the location.
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3.3 Memory Module Installation
The GRAND-BDE has four memory slots and supports DDR4 RDIMMs and UDIMMs. To
install a memory module, follow the steps below:
Step 1: Turn off the GRAND-BDE. Disconnect the power adaptor, network cable(s), and
any other connectors or cables from the GRAND-BDE.
Step 2: Put on an antistatic wrist strap to prevent electrostatic discharge. The crocodile
clip should be connected to the ground.
Step 3: Loosen the 2 screws on the rear of the GRAND-BDE as shown below.
Step 4: Pull the handle outwards to remove the motherboard drawer.
Step 5: Release the ejector clips gently by pulling them out of the sides of the RAM slot.
Step 6: Grip the new RAM on the edges to avoid touching contacts or circuitry on the
module.
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Step 7: Line up the notch on the RAM to the break in the slot. Ensure that first RAM
module is inserted into slot 1 (see below for slot positioning).
Step 8: Set the stick into the slot and apply equal pressure onto both ends of the stick
until the clamps on the side click and fully lock the RAM in.
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The following instructions should only be performed by an authorized and
Strictly adhere to the instructions to install a network expansion card on the
Step 9: Slide the motherboard drawer back into the GRAND-BDE and pull the handle up
to close enclosure and insert screws on the handle.
Step 10: Reconnect all cables back into the GRAND-BDE.
3.4 Expansion Card Installation
WARNING!
trained technician.
system. Failure to do so could result in injury to human body or death.
The PCIe Slot 5 is a reverse connector that supports a specific 10GbE LAN
card (LAN-10G2F-PHY-CS4227).
The GRAND-BDE provides five low-profile PCIe expansion slots so that users can add
functionality to their system.
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To install expansion card, follow the steps below.
Step 1: Turn off the GRAND-BDE. Disconnect the power adaptor, network cable(s), and
any other connectors or cables from the GRAND-BDE.
Step 2: Before installing the network expansion card, put on an antistatic wrist strap to
prevent electrostatic discharge. The crocodile clip should be connected to the
ground.
Step 3: Loosen the 2 screws on the rear of the GRAND-BDE as shown below.
Step 4: Pull the handle outwards to remove the motherboard drawer.
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Step 5: Remove screw from the expansion slot cover and detach cover.
Step 6: Line up the notch on the expansion card to the break in the PCIe slot. Fully
insert the expansion card to the expansion slot. Fasten screw to lock in card.
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Step 7: Slide the motherboard drawer back into the GRAND-BDE and pull the handle up
to close enclosure and insert screws on the handle.
Step 8: Reconnect all cables back into the GRAND-BDE.
3.5 Hard Drive Installation
The GRAND-BDE series is compatible with 2.5-inch/3.5-inch SAS and SATA hard drives.
NOTE:
Before installing hard drives, ensure the disk drives (HDDs/SSDs) that
you use are compatible with the GRAND-BDE.
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3.5.1 Hard Drive Bay Numbering
GRAND-BDE-18B (front) bay numbering:
GRAND-BDE-18B (rear) bay numbering:
GRAND-BDE-18B
Front Rear
Supports 3.5-inch SAS/SATA Hard Drives Yes No
Supports 2.5-inch SAS/SATA Hard Drives Yes No
Supports 2.5-inch SSD Yes Yes
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GRAND-BDE-30B (front) bay numbering:
GRAND-BDE-30B (rear) bay numbering:
GRAND-BDE-30B
Front Rear
Supports 3.5-inch SAS/SATA Hard Drives No No
Supports 2.5-inch SAS/SATA Hard Drives Yes No
Supports 2.5-inch SSD Yes Yes
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3.5.2 Installing Hard Drive
To install hard drives in GRAND-BDE series, follow the steps below:
Step 1: Unlock drive tray and remove from enclosure.
Step 2: Install a 3.5" or 2.5" disk drive to the tray.
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Step 3: Insert the drive tray into the GRAND-BDE series, close and lock the latch. The
rear panel of the GRAND-BDE has 4 drive slots for installing 2.5" SATA SSD. To
install the hard drive into the system, please follow the steps below.
WARNING:
Users are strongly recommended to turn OFF the GRAND-BDE before
replacing the hard drive to reduce the risk of electric shock.
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loss/recovery due to misuse or improper installation of hard disks in any
Make sure a power supply with the correct input voltage is being fed into
CAUTION:
IEI disclaims any responsibility for product damage/malfunction or data
occasions for any reasons.
3.6 Power-On Procedure
3.6.1 Installation Checklist
WARNING:
the system. Incorrect voltages applied to the system may cause damage to
the internal electronic components and may also cause injury to the user.
To power on the GRAND-BDE, please make sure of the following:
The HDD/SSD is installed
The LAN cable is connected
The power cables are plugged in
The system is securely mounted
3.6.2 Power-on Procedure
To power-on the GRAND-BDE please follow the steps below:
Step 1: Connect the power source to the power input jacks.
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Figure 3-1: Power Connection
Step 2: Push the power button (Figure 3-2).
Figure 3-2: Power Button
Step 3: To turn off the GRAND-BDE, press the power button for 1.5 seconds.
To force turn off, press the power button for 5 seconds.
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Chapter
4
4 Maintenance
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The following instructions should only be performed by an authorized and
static precautions can cause
static precautions,
from or contact an IEI sales
WARNING:
trained technician.
Before starting, please ensure that you turn off the GRAND-BDE, disconnect
the power adaptor, network cable(s), and also remove any other device/cable
that is attached to the server.
Take Anti-Static precautions whenever maintenance is being carried out on
the system components. Failure to take anti-
permanent system damage. For more details on anti-
please refer to Section 3.1.
4.1 Component Replacement Procedure
WARNING!
Users are not advised to attempt to repair or replace any internal or external
components of the GRAND-BDE storage server other than those listed below.
If any other components fail or need replacement, contact the IEI reseller or
vendor you purchased the GRAND-BDE
representative directly. To contact an IEI sales representative, please send an
email to
The industrial server components listed below can all be replaced if they fail:
SO-DIMM module (see Section 3.3)
sales@ieiworld.com.
Expansion card (see Section 3.4)
Internal hard disk drive (see Section 3.5)
Power supply unit
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4.2 Power Supply Unit Replacement
To replace a failed power supply unit, please follow the steps below.
Step 1: Turn off the GRAND-BDE. Disconnect the power adaptor, network cable(s), and
any other connectors or cables from the GRAND-BDE.
Step 2: Firmly press and hold the orange button on back of PSU towards the black
handle. Pull out power supply by pulling black handle.
Step 3: Insert new power supply into the GRAND-BDE.
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Step 4: Connect the power adaptor and cables to the GRAND-BDE.
Step 5: Power on the system.
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Chapter
5
5 Interface Connectors
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5.1 Peripheral Interface Connectors
The GRAND-BDE system motherboard comes with a number of peripheral interface
connectors. The connector locations are shown in Figure 5-1. The connector pinouts for
these connectors are listed in the following sections.
Figure 5-1: Jumper and Connector Locations
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■
● ● ● ● ● ● ●
1 2 3 4 5 6 7
8
5.1.1 CPLD Connector
PIN NO. DESCRIPTION
1 +3V3_SB
2 CPLD_TDO
3 CPLD_TDI
4 NC
5 NC
6 CPLD_TMS
7 GND
8 CPLD_TCK
Table 5-1: CPLD Connector Pinouts
5.1.2 10Gbps Host Connector (PCIe Slot 5)
The PCIe Slot 5 (Gen 3, x4 @ x4) is a reverse connector that supports specific 10GbE
LAN card (LAN-10G2F-PHY-CS4227).
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
A1 10GBE_SPI_CS B1 +12V
A2 +12V B2 +12V
A3 +12V B3 +12V
A4 GND B4 GND
A5 LAN_MDC_LED1_1 B5 LAN_MDC_LED0_1
A6 LAN_MDC_LED1_0 B6 LAN_MDC_LED0_0
A7 +3V3_SB B7 GND
A8 10GBE_SPI_DI B8 +3.3V
A9 +3.3V B9 10GBE_SPI_CLK
A10 +3.3V B10 P1V05
A11 LAN_SDP1_0 B11 10GBE_SPI_DO
A12 GND B12 SEL_I2C
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PIN NO. DESCRIPTION PIN NO. DESCRIPTION
A13 LAN_SDP0_0 B13 GND
A14 LAN_SDP0_1 B14 RX1_P
A15 GND B15 RX1_N
A16 TX1_P B16 GND
A17 TX1_N B17 NC
A18 GND B18 GND
A19 NC B19 RX0_P
A20 GND B20 RX0_N
A21 TX0_P B21 GND
A22 TX0_N B22 GND
A23 GND B23 MDIO_DIR_CTL0
A24 GND B24 MDIO_DIR_CTL1
A25 NC B25 GND
A26 NC B26 GND
A27 GND B27 NC
A28 GND B28 NC
A29 10G_BaseT B29 GND
A30 10G_SFP+ B30 LAN_I2C_SCL
A31 GND B31 LAN_I2C_SDA
A32 NC B32 GND
Table 5-2: 10Gbps Host Connector (PCIe Slot 5) Pinouts
5.1.3 PCIe Power Connector (CON2)
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GND 4 +12V
2 GND 5 +12V
3 GND 6 +12V
Table 5-3: PCIe Power Connector (CON2) Pinouts
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5.1.4 LPC Connector (CN8)
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 LPC_CLK 2 LPC_AD1
3 LPC_RST 4 LPC_AD0
5 LPC_FRAME# 6 +3.3V
7 LPC_AD3 8 GND
9 LPC_AD2
Table 5-4: LPC Connector (CN8) Pinouts
5.1.5 COM Connector (CN2, CN17, CON7)
PIN NO. DESCRIPTION
1 SOUT
2 +3.3V
3 SIN
4 GND
Table 5-5: COM Connector (CN2, CN17, CON7) Pinouts
5.1.6 Thermistor (RT7, RT9, RT10, RT11)
Thermistor operating temperature range: -30℃ ~ 100℃
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5.2 External Interface Panel Connectors
The table below lists the rear panel connectors on the motherboard. Pinouts of these
connectors can be found in the following sections.
5.2.1 Ethernet and USB 3.0 Combo Connectors
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 MDI0+ 5 MDI2+
2 MDI0- 6 MDI2-
3 MDI1+ 7 MDI3+
4 MDI1- 8 MDI3-
Table 5-6: Ethernet Connector Pinouts
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 +5V 10 +5V
2 USB2P0_DM0 11 USB2P0_DM1
3 USB2P0_DP0 12 USB2P0_DP1
4 GND 13 GND
5 USB3P0_RXDN0 14 USB3P0_RXDN1
6 USB3P0_RXDP0 15 USB3P0_RXDP1
7 GND 16 GND
8 USB3P0_TXDN0 17 USB3P0_TXDN1
9 USB3P0_TXDP0 18 USB3P0_TXDP1
Table 5-7: USB 3.0 Connector Pinouts
GRAND-BDE Series
Page 38
5.2.2 Console Port
The console port supports COM signal.
PIN NO. DESCRIPTION
1 GND
2 SIN1
3 SOUT1
4 NC
5 NC
Table 5-8: Console Port Pinouts
5.2.3 EC GPIO
PIN NO. DESCRIPTION
1 GND
2 GND
3 L80LLAT/GPE7
4 GND
Table 5-9: EC GPIO Pinouts
5.2.4 SAS Connector
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
S1 GND P1 NC
S2 BP_SAS_TX_P P2 NC
S3 BP_SAS_TX_N P3 BP_HDD1_PWR_EN
S4 GND P4 GND
GRAND-BDE Series
Page 39
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
S5 BP_SAS_RX_N P5 GND
S6 BP_SAS_RX_P P6 GND
S7 GND P7 +5V_HDD
S8 GND P8 +5V_HDD
S9 NC P9 +5V_HDD
S10 NC P10 GND
S11 GND P11 HDD1_LED_ACT#
S12 NC P12 GND
S13 NC P13 +12V_PS
S14 GND P14 +12V_PS
P15 +12V_PS
Table 5-10: SAS Connector Pinouts
GRAND-BDE Series
Page 40
Appendix
A
A Regulatory Compliance
GRAND-BDE Series
Page 41
f the user modifies and/or install other devices in the equipment, the CE conformity
has telecommunications functionality, it also complies with the
IEI Integration Corp erklærer herved, at følgende udstyr overholder de væsentlige krav o
t dieses Gerät entspricht den grundlegenden Anforderungen
DECLARATION OF CONFORMITY
This equipment is in conformity with the following EU directives:
EMC Directive 2004/108/EC
Low-Voltage Directive 2006/95/EC
RoHS II Directive 2011/65/EU
I
declaration may no longer apply.
If this equipment
requirements of the R&TTE Directive 1999/5/EC.
English
IEI Integration Corp declares that this equipment is in compliance with the essential
requirements and other relevant provisions of Directive 1999/5/EC.
Български [Bulgarian]
IEI Integration Corp. деклаира, че този оборудване е в съответствие със
съществените изисквания и другите приложими правила на Директива 1999/5/ЕС.
Česky [Czech]
IEI Integration Corp tímto prohlašuje, že tento zařízení je ve shodě se základními
požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.
Dansk [Danish]
øvrige relevante krav i direktiv 1999/5/EF.
Deutsch [German]
IEI Integration Corp, erklä
und den weiteren entsprechenden Vorgaben der Richtlinie 1999/5/EU.
Eesti [Estonian]
IEI Integration Corp deklareerib seadme seadme vastavust direktiivi 1999/5/EÜ
põhinõuetele ja nimetatud direktiivist tulenevatele teistele asjakohastele sätetele.
GRAND-BDE Series
Page 42
Español [Spanish]
IEI Integration Corp declara que el equipo cumple con los requisitos esenciales y
cualesquiera otras disposiciones aplicables o exigibles de la Directiva 1999/5/CE.
Ελληνική [Greek]
IEI Integration Corp ΔΗΛΩΝΕΙ ΟΤΙ ΕΞΟΠΛΙΣΜΟΣ ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ
ΟΥΣΙΩΔΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ ΔΙΑΤΑΞΕΙΣ ΤΗΣ ΟΔΗΓΙΑΣ
1999/5/ΕΚ.
Français [French]
IEI Integration Corp déclare que l'appareil est conforme aux exigences essentielles et aux
autres dispositions pertinentes de la directive 1999/5/CE.
Italiano [Italian]
IEI Integration Corp dichiara che questo apparecchio è conforme ai requisiti essenziali ed
alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE.
Latviski [Latvian]
IEI Integration Corp deklarē, ka iekārta atbilst būtiskajām prasībām un citiem ar to
saistītajiem noteikumiem Direktīvas 1999/5/EK.
Lietuvių [Lithuanian]
IEI Integration Corp deklaruoja, kad šis įranga atitinka esminius reikalavimus ir kitas
1999/5/EB Direktyvos nuostatas.
Nederlands [Dutch]
IEI Integration Corp dat het toestel toestel in overeenstemming is met de essentiële eisen
en de andere relevante bepalingen van richtlijn 1999/5/EG.
Malti [Maltese]
IEI Integration Corp jiddikjara li dan prodott jikkonforma mal-ħtiġijiet essenzjali u ma
provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC.
Magyar [Hungarian]
IEI Integration Corp nyilatkozom, hogy a berendezés megfelel a vonatkozó alapvetõ
követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak.
Polski [Polish]
IEI Integration Corp oświadcza, że wyrobu jest zgodny z zasadniczymi wymogami oraz
pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC.
Português [Portuguese]
IEI Integration Corp declara que este equipamento est conforme com os requisitos
essenciais e outras disposições da Directiva 1999/5/CE.
GRAND-BDE Series
Page 43
Româna [Romanian]
IEI Integration Corp declară că acest echipament este i conformitate cu cerinţele
esenţiale şi cu celelalte prevederi relevante ale Directivei 1999/5/CE.
Slovensko [Slovenian]
IEI Integration Corp izjavlja, da je ta opreme v skladu z bistvenimi zahtevami in ostalimi
relevantnimi določili direktive 1999/5/ES.
Slovensky [Slovak]
IEI Integration Corp týmto vyhlasuje, že zariadenia spĺňa základné požiadavky a všetky
príslušné ustanovenia Smernice 1999/5/ES.
Suomi [Finnish]
IEI Integration Corp vakuuttaa täten ttä litteet on diretiivin 1999/5/EY oleellisten
vaatimusten ja sitä koskevien direktiivin muiden ehtojen mukainen.
Svenska [Swedish]
IEI Integration Corp förklarar att denna utrustningstyp står I överensstämmelse med de
väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv
1999/5/EG.
GRAND-BDE Series
Page 44
is equipment complies with Part 15 of the FCC Rules. Operation is subject to the
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
commercial environment. This equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in accordance with the instruction
s. Operation of this
frequency energy and, if not
FCC WARNING
Th
following two conditions:
This device may not cause harmful interference, and
This device must accept any interference received, including interference
that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class A digital
reasonable protection against harmful interference when the equipment is operated in a
manual, may cause harmful interference to radio communication
equipment in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.
Federal Communication Commission Interference Statement
This equipment has been assembled with components that comply with the limits for a
Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses and can radiate radio
installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur
in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which
the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
GRAND-BDE Series
Page 45
Appendix
B
B Safety Precautions
GRAND-BDE Series
Page 46
The precautions outlined in this chapter should be strictly followed.
WARNING:
Failure to follow these precautions may result in permanent damage to
the GRAND-BDE.
B.1 Safety Precautions
Please follow the safety precautions outlined in the sections that follow:
B.1.1 General Safety Precautions
Please ensure the following safety precautions are adhered to at all times.
Follow the electrostatic precautions outlined below whenever the
GRAND-BDE is opened.
Make sure the power is turned off and the power cord is disconnected
whenever the GRAND-BDE is being installed, moved or modified.
Do not apply voltage levels that exceed the specified voltage range.
Doing so may cause fire and/or an electrical shock.
Electric shocks can occur if the GRAND-BDE chassis is opened when the
GRAND-BDE is running.
If considerable amounts of dust, water, or fluids enter the GRAND-BDE,
turn off the power supply immediately, unplug the power cord, and contact the
GRAND-BDE vendor.
DO NOT:
o Drop the GRAND-BDE against a hard surface.
o In a site where the ambient temperature exceeds the rated temperature
GRAND-BDE Series
Page 47
Failure to take ESD precautions during the installation of the
B.1.2 Anti-static Precautions
WARNING:
GRAND-BDE may result in permanent damage to the GRAND-BDE
and severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the GRAND-BDE. Dry climates are especially susceptible to ESD. It is therefore
critical that whenever the GRAND-BDE is opened and any of the electrical components
are handled, the following anti-static precautions are strictly adhered to.
Wear an anti-static wristband: Wearing a simple anti-static wristband can
help to prevent ESD from damaging any electrical component.
Self-grounding: Before handling any electrical component, touch any
grounded conducting material. During the time the electrical component is
handled, frequently touch any conducting materials that are connected to the
ground.
Use an anti-static pad: When configuring or working with an electrical
component, place it on an antic-static pad. This reduces the possibility of ESD
damage.
Only handle the edges of the electrical component: When handling the
electrical component, hold the electrical component by its edges.
GRAND-BDE Series
Page 48
Dispose of used batteries according to instructions and local
B.1.3 Product Disposal
CAUTION:
Risk of explosion if battery is replaced by and incorrect type. Only
certified engineers should replace the on-board battery.
regulations.
Outside the European Union - If you wish to dispose of used electrical and
electronic products outside the European Union, please contact your local
authority so as to comply with the correct disposal method.
Within the European Union:
EU-wide legislation, as implemented in each Member State, requires that
waste electrical and electronic products carrying the mark (left) must be
disposed of separately from normal household waste. This includes
monitors and electrical accessories, such as signal cables or power
cords. When you need to dispose of your display products, please follow
the guidance of your local authority, or ask the shop where you purchased the product.
The mark on electrical and electronic products only applies to the current European Union
Member States.
Please follow the national guidelines for electrical and electronic product disposal.
B.2 Maintenance and Cleaning Precautions
When maintaining or cleaning the GRAND-BDE, please follow the guidelines below.
B.2.1 Maintenance and Cleaning
Prior to cleaning any part or component of the GRAND-BDE, please read the details
below.
GRAND-BDE Series
Page 49
The interior of the GRAND-BDE does not require cleaning. Keep fluids away
from the GRAND-BDE interior.
Be cautious of all small removable components when vacuuming the
GRAND-BDE.
Turn the GRAND-BDE off before cleaning the GRAND-BDE.
Never drop any objects or liquids through the openings of the GRAND-BDE.
Be cautious of any possible allergic reactions to solvents or chemicals used
when cleaning the GRAND-BDE.
Avoid eating, drinking and smoking within vicinity of the GRAND-BDE.
B.2.2 Cleaning Tools
Some components in the GRAND-BDE may only be cleaned using a product specifically
designed for the purpose. In such case, the product will be explicitly mentioned in the
cleaning tips. Below is a list of items to use when cleaning the GRAND-BDE.
Cloth – Although paper towels or tissues can be used, a soft, clean piece of
cloth is recommended when cleaning the GRAND-BDE.
Water or rubbing alcohol – A cloth moistened with water or rubbing alcohol
can be used to clean the GRAND-BDE.
Using solvents – The use of solvents is not recommended when cleaning the
GRAND-BDE as they may damage the plastic parts.
Vacuum cleaner – Using a vacuum specifically designed for computers is
one of the best methods of cleaning the GRAND-BDE. Dust and dirt can
restrict the airflow in the GRAND-BDE and cause its circuitry to corrode.
Cotton swabs - Cotton swaps moistened with rubbing alcohol or water are
excellent tools for wiping hard to reach areas.
Foam swabs - Whenever possible, it is best to use lint free swabs such as
foam swabs for cleaning.
GRAND-BDE Series
Page 50
Appendix
C
C Hazardous Materials
Disclosure
GRAND-BDE Series
Page 51
The details provided in this appendix are to ensure that the product is compliant with the
Peoples Republic of China (China) RoHS standards. The table below acknowledges the
presences of small quantities of certain materials in the product, and is applicable to China
RoHS only.
A label will be placed on each product to indicate the estimated “Environmentally Friendly
Use Period” (EFUP). This is an estimate of the number of years that these substances
would “not leak out or undergo abrupt change.” This product may contain replaceable
sub-assemblies/components which have a shorter EFUP such as batteries and lamps.
These components will be separately marked.
Please refer to the following table.
Part Name Toxic or Hazardous Substances and Elements
Lead
(Pb)
Housing
Display
Printed Circuit
Board
Metal Fasteners
Cable Assembly
Fan Assembly
Power Supply
Assemblies
Battery
O: This toxic or hazardous substance is contained in all of the homogeneous materials for the part is below the limit
requirement in SJ/T11363-2006 (now replaced by GB/T 26572-2011).
X: This toxic or hazardous substance is contained in at least one of the homogeneous materials for this part is above
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chromium
(CR(VI))
Polybrominated
Biphenyls
(PBB)
Polybrominated
Diphenyl Ethers
(PBDE)
the limit requirement in SJ/T11363-2006 (now replaced by GB/T 26572-2011).
GRAND-BDE Series
Page 52
部件名称
有毒有害物质或元素
铅
汞
镉
六价铬
多溴联苯
多溴二苯
醚
壳体
显示
印刷电路板
金属螺帽
电缆组装
风扇组装
电力供应组装
电池
此附件旨在确保本产品符合中国 RoHS 标准。以下表格标示此产品中某有毒物质的含量符
合中国 RoHS 标准规定的限量要求。
本产品上会附有”环境友好使用期限”的标签，此期限是估算这些物质”不会有泄漏或突变”的
年限。本产品可能包含有较短的环境友好使用期限的可替换元件，像是电池或灯管，这些元
件将会单独标示出来。
(Pb)
O: 表示该有毒有害物质在该部件所有物质材料中的含量均在 SJ/T 11363-2006 (现由 GB/T 26572-2011 取代)
标准规定的限量要求以下。
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
O O O O O O
(Hg)
(Cd)
(CR(VI))
(PBB)
(PBDE)
X: 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T 11363-2006 (现由 GB/T
26572-2011 取代) 标准规定的限量要求。
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