IDT Europe ZWIR4532 User Manual
Low Power 6LoWPAN
Communication Module
ZWIR4532
Advance Datasheet
© 2018 Integrated Device Technology, Inc. 1 November 13, 2018
Description
The ZWIR4532 is a programmable low-power secure IPv6
communication module for internet of things (IOT) device networks.
Sensors and devices can operate autonomously or connect to local
or global IPv6 networks using the ZWIR4532. The ZWIR4532
serves as a universal secure radio communication module for
applications with low bandwidth requirements.
The module incorporates an ultra-low-power ARM® Cortex™-M0+
32-bit microcontroller which is running the network stack. In
addition, the user application can run on the microcontroller. This
helps minimizing the size, complexity and overall BOM. A rich set
of digital and analog peripherals is available for interfacing with
external application components. Approximately 128kB of flash
and 4kB of RAM are available for user applications.
IDT offers the SensorShare user programmable royalty-free
6LoWPAN network stack with mesh routing capability for the
ZWIR4532. 6LoWPAN is an Internet Engineering Task Force (IETF)
standard for wireless low-power IPv6-based sensor and device
networks.
Secure communication is provided by a standard-compliant
implementation of the Internet Protocol Security (IPSec) protocol
suite.
Typical Applications
Industrial automation
Home and building automation
Health monitoring
Telemetry
Features
License-free 868/915 MHz frequency bands
4 channels in EU frequency band (865.3 – 868.3 MHz)
10 channels in US frequency band (906 – 924 MHz)
BPSK or O-QPSK modulation selectable
BPSK with 20kBps EU and 40kBps U
ARM
®
Cortex™-M0+ 32-bit ultra-low-power microcontroller
192kB flash and 20kB RAM
6kByte EEPROM
5 UART interfaces
1 SPI interface
3 I²C interfaces
10 PWM outputs
12 bit ADC with 10 input channels
2 analog comparators
31 GPIOs
Network Stack
UDP/IPv6 communication
Mesh networking with hundreds of nodes
Self-healing defective routes
Over-the-Air update capable
Network layer security
Ultra-low power stop mode: < 1µA with full RAM retention
Supply voltage: 1.8V to 3.3V
-40°C to +85°C ambient operating temperature
15.6 × 12 mm 43-LGA Package
Block Diagram
ZWIR4532 Advance Datasheet
© 2018 Integrated Device Technology, Inc. 2 November 13, 2018
Contents
1. Pin Assignments ...........................................................................................................................................................................................3
2. Pin Descriptions ............................................................................................................................................................................................3
3. Absolute Maximum Ratings ..........................................................................................................................................................................7
4. Recommended Operating Conditions ..........................................................................................................................................................8
5. Functional Overview .....................................................................................................................................................................................9
5.1 Low Power Modes .............................................................................................................................................................................10
5.2 Device Programming and Debugging ................................................................................................................................................10
6. Package Outline Drawing ...........................................................................................................................................................................11
7. Recommended Land Pattern ......................................................................................................................................................................12
8. Soldering Information .................................................................................................................................................................................13
9. Certification .................................................................................................................................................................................................14
9.1 European RED Statement .................................................................................................................................................................14
9.2 Federal Communication Commission Certification Statements .........................................................................................................14
9.2.1 Statements .........................................................................................................................................................................14
9.2.2 Requirements .....................................................................................................................................................................14
9.2.3 Supported Antennas ...........................................................................................................................................................15
9.3 Canada ..............................................................................................................................................................................................15
9.3.1 Statements .........................................................................................................................................................................15
9.3.2 Requirements .....................................................................................................................................................................15
9.3.3 Supported Antennas ...........................................................................................................................................................15
10. Ordering Information ...................................................................................................................................................................................16
11. Revision History ..........................................................................................................................................................................................16
List of Figures
Figure 1. Pin Assignments for 15.6mm 12.0mm LGA Package – Top View ...................................................................................................3
Figure 2. Serial Wire Debug Connection with Standard ARM Connectors .......................................................................................................10
Figure 3. Package Outline Drawing (Top, Left and Bottom View) ....................................................................................................................11
Figure 4. Recommended Land Pattern .............................................................................................................................................................12
Figure 5. Recommended Temperature Profile for Reflow Soldering (according to J-STD-020D) ....................................................................13
Figure 6. FCC Compliance Statement to be Printed on Equipment Incorporating ZWIR4532 Devices ............................................................15
List of Tables
Table 1. Pin Descriptions ...................................................................................................................................................................................3
Table 2. Module Pins Peripheral Function Mapping ..........................................................................................................................................6
Table 3. Absolute Maximum Ratings .................................................................................................................................................................7
Table 4. Recommended Operating Conditions .................................................................................................................................................8
Table 5. ZWIR4532 Physical Dimensions and Tolerances..............................................................................................................................11
Table 6. Soldering Profile Parameters (according to J-STD-020D) .................................................................................................................13
ZWIR4532 Advance Datasheet
© 2018 Integrated Device Technology, Inc. 3 November 13, 2018
1. Pin Assignments
Figure 1. Pin Assignments for 15.6mm 12.0mm LGA Package – Top View
PC14PC15
A5
A13
(DIO)
A14
(CLK) B5 VREF+
RST
GND
A10
A9
VDD
BSEL
GND
ANT
GND
DIG1
DIG3
DIG4
A0 A1 A2
A3 A4
A6
A7
A8
A11 A12
B0
B6
B1
B2
B3 B4
B9
PC13 VDDA
A15
B10
B8
B7
B14
7 6 5 4 3 2
27282930313233
1
4342
2019
41
1817
4039
16
38
15
37
14
8
9
34
10
35
36
11
12
13 21
22
26
23
24
25
2. Pin Descriptions
Table 1. Pin Descriptions
Pin
Number
Name
Type
5V
Description
1
VDDA
Supply
2
PC13
GPIO
Y
RTC Tamper, TRC Timestamp, RTC output, Wakeup 2.
3
PC14
GPIO
Y
OSC32 In.
4
PC15
GPIO
TC
OSC32 Out.
5
PA2
GPIO
Y
Timer21 Ch1, Timer2 Ch3, USRT2 TX, LPUART1 TX, COMP2 Output, COMP2 INM, ADC Ch2.
6
PA1 GPIO
Y
Event Out, Timer2 Ch2, USART2 RTS/DE, TIM21 ETR, USART4 RX, COMP1 Input, ADC Ch1.
7
PA0
GPIO
Timer 2 Ch1, Timer 2 ETR, USART2 CTS, USART4 TX, COMP1 OUT, COMP1 INM, ADC Ch 0, RTC
Tamper 2, Wakeup 1.
ZWIR4532 Advance Datasheet
© 2018 Integrated Device Technology, Inc. 4 November 13, 2018
Pin
Number
Name
Type
5V
Description
8
RST
I/O
Device reset, low active.
9
GND
Ground
10
PA10
GPIO
Y
USART1 RX, I2C1 SDA.
11
PA9
GPIO
Y
MCO, USART1 TX, I2C1 SCL, I2C3 SMBA.
12
VDD
Supply
13
BSEL I
14
PA3
GPIO
Y
Timer21 Ch2, Timer2 Ch4, USART2 RX, LPUART1 RX, COMP2 INP, ADC Ch3.
15
PA4
GPIO
N
SPI1 NSS, USART2 CK, Timer22 ETR, COMP1 INM, COMP2 INM, ADC Ch4.
16
PA5
GPIO
N
SPI1 SCK, Timer2 ETR, Timer2 Ch1, COMP1 INM, COMP2 INM, ADC Ch5.
17
PA13
GPIO
Y
SWDIO, LPUART1 RX.
18
PA14
GPIO
Y
SWCLK, USART2 TX, LPUART1 TX.
19
PB5
GPIO
Y
SPI1 MOSI, LPTimer1 In1, I2C1 SMBA, Timer3 Ch2, Timer22 Ch2, USART1 CK, USART5 CK,
USART5 RTS/DE, Comp2 INP.
20
VREF+
Supply
21
PA- O
Differential power amplifier control output, internally tied to ground if not used.
Leave unconnected if not used.
22
PA+ O
23
GND
Ground
24
ANT
Antenna
Antenna pin.
25
GND
Ground
26
DIG1 O
27
PB14
GPIO
Y
SPI2 MISO, I2S2 MCK, RTC Out, LPUART1 RTS/DE, I2C2 SDA, Timer21 Ch2.
28
PA15
GPIO
Y
SPI1 NSS, Timer2 ETR, Event Out, USART2 RX, Timer2 Ch1, USART4 RTS/DE.
29
PA12
GPIO
Y
SPI1 MOSI, Event Out, USART1 RTS/DE, COMP2 Out.
30
PA11
GPIO
Y
SPI1 MISO, Event Out, USART1 CTS, COMP1 Out.
31
PB9
GPIO
Y
Event Out, I2C1 SDA, SPI2 NSS, I2S2 WS.
32
PB8
GPIO
Y
I2C1 SCL.
33
PA6
GPIO
Y
SPI1 MISO, Timer3 Ch1, LPUART1 CTS, Timer22 Ch1, Event Out, COMP1 Out, ADC Ch6.
34
PA7
GPIO
Y
SPI1 MOSI, Timer3 Ch2, Timer22 Ch2, Event Out, COMP2 Out, ADC Ch7.
35
PB2
GPIO
Y
LPTimer 1 Out, I2C3 SMBA.
36
PB10
GPIO
Y
Timer 2 Ch3, LPUART1 TX, SPI2 SCK, I2C2 SCL, LPUART1 RX.
37
PB0
GPIO
Y
Event Out, Timer3 Ch3, ADC Ch8, VREF Out.
38
PB1
GPIO
Y
Timer3 Ch4, LPART1 RTS/DE, ADC Ch9, VREF Out.
39
PA8
GPIO
Y
MCO, Event Out, USART1 CK, I2C3 SCL.
40
PB3
GPIO
Y
SPI1 SCK, Timer2 Ch2, Event Out, USART2 RTS/DE, USART5 TX, COMP2 INM.
ZWIR4532 Advance Datasheet
© 2018 Integrated Device Technology, Inc. 5 November 13, 2018
Pin
Number
Name
Type
5V
Description
41
PB4
GPIO
Y
SPI1 MISO, Timer3 Ch1, Timer22 Ch1, USART1 CTS, USART5 RX, I2C3 SDA, COMP2 INP.
42
PB6
GPIO
Y
USART1 TX, I2C1 SCL, LPTimer1 ETR, COMP2 INP.
43
PB7
GPIO
Y
USART1 RX, I2C1 SDA, LPTimer1 In2, USART4 CTS, COMP2 INP, VREF PVD In.
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