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Integrated Device Technology, Inc.
FAST CMOS 20-BIT
BUFFERS
IDT54/74FCT16827AT/BT/CT/ET
IDT54/74FCT162827AT/BT/CT/ET
FEATURES:
• Common features:
– 0.5 MICRON CMOS Technology
– High-speed, low-power CMOS replacement for
ABT functions
– Typical tSK(o) (Output Skew) < 250ps
– Low input and output leakage ≤1µA (max.)
– ESD > 2000V per MIL-STD-883, Method 3015;
> 200V using machine model (C = 200pF, R = 0)
– Packages include 25 mil pitch SSOP, 19.6 mil pitch
TSSOP, 15.7 mil pitch TVSOP and 25 mil pitch Cerpack
– Extended commercial range of -40°C to +85°C
–V
CC = 5V ±10%
• Features for FCT16827AT/BT/CT/ET:
– High drive outputs (-32mA IOH, 64mA IOL)
– Power off disable outputs permit “live insertion”
– Typical VOLP (Output Ground Bounce) < 1.0V at
VCC = 5V, TA = 25°C
• Features for FCT162827AT/BT/CT/ET:
– Balanced Output Drivers: ±24mA (commercial),
±16mA (military)
– Reduced system switching noise
– Typical VOLP (Output Ground Bounce) < 0.6V at
VCC = 5V,TA = 25°C
DESCRIPTION:
The FCT16827AT/BT/CT/ET and FCT162827AT/BT/CT/
ET 20-bit buffers are built using advanced dual metal CMOS
technology. These 20-bit bus drivers provide high-performance bus interface buffering for wide data/address paths or
busses carrying parity. Two pair of NAND-ed output enable
controls offer maximum control flexibility and are organized to
operate the device as two 10-bit buffers or one 20-bit buffer.
Flow-through organization of signal pins simplifies layout. All
inputs are designed with hysteresis for improved noise margin.
The FCT16827AT/BT/CT/ET are ideally suited for driving
high capacitance loads and low impedance backplanes. The
output buffers are designed with power off disable capability
to allow "live insertion" of boards when used as backplane
drivers.
The FCT162827AT/BT/CT/ET have balanced output drive
with current limiting resistors. This offers low ground bounce,
minimal undershoot, and controlled output fall times–reducing
the need for external series terminating resistors. The
FCT162827AT/BT/CT/ET are plug-in replacements for the
FCT16827AT/BT/CT/ET and ABT16827 for on-board interface applications.
FUNCTIONAL BLOCK DIAGRAM
1OE1
1OE2
1A1
TO 9 OTHER CHANNELS
1Y1
2773 drw 01
2OE1
2OE2
2A1
TO 9 OTHER CHANNELS
2Y1
2773 drw 02
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
MILITARY AND COMMERCIAL TEMPERATURE RANGES AUGUST 1996
1996 Integrated Device Technology, Inc. 5.17 DSC-2773/7
1
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IDT54/74FCT16827AT/BT/CT/ET, 162827AT/BT/CT/ET
FAST CMOS 20-BIT BUFFERS MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN CONFIGURATIONS
OE
1
1Y1
1Y2
GND
1Y3
1
Y
V
CC
1
Y
1
Y
1
Y
GND
1
Y
Y
1
1Y10
2Y1
2
Y
2
Y
GND
2Y4
Y
2
Y
2
V
CC
2
Y
2
Y
GND
Y
2
2
Y
2OE1
OE
2
1
1
2
3
4
5
4
6
7
5
6
7
8
9
10
11
8
9
2
3
12
13
14
15
16
17
SO56-1
SO56-2
SO56-3
18
19
5
6
20
21
22
7
8
23
24
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
3225
9
10
26
27
28
31
30
29
1
1
A
1
A
GND
1A3
1
A
V
CC
1
A
1
A
1
A
GND
1
A
A
1
1
A
2A1
2
A
A
2
GND
A
2
A
2
A
2
V
CC
2
A
2
A
GND
2A9
A
2
2
OE
1
OE1
1
2
1Y1
1
Y2
GND
1Y3
4
1
Y4
VCC
5
6
7
1
Y5
1
Y6
Y7
1
GND
8
9
10
2
3
1
Y8
1
Y9
1Y10
2
Y1
2
Y2
Y3
2
GND
4
5
6
7
8
2
2
2
V
2Y7
2
Y4
Y5
Y6
CC
Y8
GND
2Y9
10
2
2
Y10
2OE1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
E56-1
48
43
56
55
54
53
52
51
50
49
47
46
45
44
42
41
40
39
38
37
36
35
34
33
32
31
30
29
1
OE2
A1
1
1
A2
GND
1A3
1
A4
VCC
1
A5
1
A6
A7
1
GND
1
A8
1
A9
1
A10
A1
2
2
A2
2
A3
GND
2A4
A5
2
2
A6
VCC
2A7
A8
2
GND
2
A9
2
A10
2
OE2
SSOP/
TSSOP/TVSOP
TOP VIEW
2773 drw 03
CERPACK
TOP VIEW
2773 drw 04
5.17 2
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IDT54/74FCT16827AT/BT/CT/ET, 162827AT/BT/CT/ET
FAST CMOS 20-BIT BUFFERS MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN DESCRIPTION
Pin Names Description
xOEx Output Enable Inputs (Active LOW)
xAx Data Inputs
xYx 3-State Outputs
2773 tbl 01
ABSOLUTE MAXIMUM RATINGS
Symbol Description Max. Unit
(2)
VTERM
VTERM
TSTG Storage Temperature –65 to +150 °C
IOUT DC Output Current –60 to +120 mA
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
2. All device terminals except FCT162XXXT Output and I/O terminals.
3. Output and I/O terminals for FCT162XXXT.
Terminal Voltage with Respect to
GND
(3)
Terminal Voltage with Respect to
GND
(1)
–0.5 to +7.0 V
–0.5 to
CC +0.5
V
2773 lnk 03
V
FUNCTION TABLE
(1)
Inputs Outputs
x
OE
OE
1 x
OE
2 xAxxYx
OE
LLL L
LLH H
HXX Z
XHX Z
NOTE:
1. H = HIGH Voltage Level
L = LOW Voltage Level
X = Don’t Care
Z = High Impedance
CAPACITANCE (TA = +25°C, f = 1.0MHz)
Symbol Parameter
C
IN
Input
Capacitance
C
OUT
Output
Capacitance
NOTE:
1. This parameter is measured at characterization but not tested.
(1)
Conditions Typ. Max. Unit
VIN = 0V 3.5 6.0
V
OUT
= 0V 3.5 8.0
2773 tbl 02
pF
pF
2773 lnk 04
5.17 3