Integrated Device Technology Inc. IDT7006S User Manual

CMOS Static RAM
I
I
,
256K (32K x 8-Bit)
IDT71256S
IDT71256L
Features
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◆◆
High-speed address/chip select time
◆◆
◆◆
Low-power operation
◆◆
◆◆
Battery Backup operation – 2V data retention
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Produced with advanced high-performance CMOS technology
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Input and output directly TTL-compatible
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◆◆
Available in standard 28-pin (300 or 600 mil) ceramic DIP, 28-pin (600 mil) plastic DIP, 28-pin (300 mil) SOJ and 32-pin LCC
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◆◆
Military product compliant to MIL-STD-883, Class B
Functional Block Diagram
Description
The IDT 71256 is a 262,144-bit high-speed static RAM organized as 32K x 8. It is fabricated using IDT's high-performance, high-reliability CMOS technology.
Address access times as fast as 20ns are available with power consumption of only 350mW (typ.). The circuit also offers a reduced power standby mode. When CS goes HIGH, the circuit will automatically go to and remain in, a low-power standby mode as long as CS remains HIGH. In the full standby mode, the low-power device consumes less than 15µW, typically. This capability provides significant system level power and cooling savings. The low-power (L) version also offers a battery backup data retention capability where the circuit typically consumes only 5µW when operating off a 2V battery.
The IDT71256 is packaged in a 28-pin (300 or 600 mil) ceramic DIP, a 28-pin 300 mil SOJ, a 28-pin (600 mil) plastic DIP, and a 32-pin LCC providing high board level packing densities.
The IDT71256 military RAM is manufactured in compliance with the latest revision of MIL-STD-883, Class B, making it ideally suited to military temperature applications demanding the highest level of performance and reliability.
A
0
ADDRESS DECODER
A
14
/O
0
INPUT
DATA
/O
7
CS
OE
WE
CONTROL
CIRCUIT
CIRCUIT
262,144 BIT
MEMORY ARRAY
I/O CONTROL
V
CC
GND
2946drw 01
©2000 Integrated Device Technology, Inc.
FEBRUARY 2001
1
DSC-2946/9
IDT71256S/L
2
G
,
CMOS Static RAM 256K (32K x 8-Bit) Military, Commercial, and Industrial Temperature Ranges
Pin Configurations
1
A
14
2
A
12
3
A
7
4
A
6
5
A
5
6 7 8
9 10 11 12 13 14
D28-3 P28-1 D28-1
SO28-5
I/O I/O I/O
ND
A
4
A
3
A
2
A
1
A
0 0 1 2
DIP/SOJ
Top View
28 27 26 25 24 23 22 21 20 19 18 17 16 15
2946 drw 0
V
CC
WE
13
A A
8
A
9
A
11
OE A
10
CS I/O I/O I/O I/O I/O
Truth Table
WE CS OE
X H X High-Z Standby (I XV
HC
H L H High-Z Output Disabled HLLD LLXD
7 6 5 4 3
NOTE:
IH, L = VIL, X = Don't care.
1. H = V
Absolute Maximum Ratings
Symbol Rating Com'l. Ind. Mil. Unit
TERM
V
Te rminal Voltage
(1)
I/O Function
X High-Z Standby (I
OUT
IN
Re ad Data Write Data
(1)
-0.5 to +7.0 -0.5 to +7.0 -0.5 to +7.0 V
SB
SB1
)
)
with Re s p e ct to GN D
INDEX
A
6
A
5
A
4
A
3
A
2
A
1
A
0
NC
0
I/O
2
1
A7A
4
3
5 6
7 8 9
10 11 12 13
14
15
1
2
O
O
/
/
I
I
32-Pin LCC
4
1
A
1,1
A
2
L32-1
16
D N G
1
C N
32 31
C N
C
3
E
C
1
V
W
A
V
A
30
29
A
8
28
A
9
27
A
11
26
NC
25
OE
24
10
A
23
CS
22 21
20191817
3
4
5
O
O
O
/
/
/
I
I
I
7
I/O I/O
8
2946drw03
T
T
T
P
I
OUT
NOTE:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS
Operating
A
0 to + 70 -40 to + 85 -55 to + 125oC
Temperature
BIAS
Temperature
-55 to + 125 -55 to +125 -65 to +135oC
Unde r Bias Storage
STG
T
Temperature
Power Dissipation
-55 to + 125 -55 to +125 -65 to +150
1.0 1.0 1.0 W
DC Output Current505050mA
may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Top View
2 9 46 t b l 02
o
C
29 46 tb l 03
Capacitance (TA = +25°C, f = 1.0MHz)
Pin Descriptions
Name Description
0
- A
14
A
0
- I/O
7
I/O
CS
WE
OE
Address Inputs
Data Inp ut/ Outp ut
Chip Se le ct
Write Enable
Output Enable
Symbol Parameter
C
IN
C
I/O
NOTE:
1. This parameter is determined by device characterization, but is not production tested.
Inp ut Cap ac ita nc e VIN = 0V 11 pF I/O Capaci tance V
GND Ground
CC
V
Power
2946 tbl 01
2
(1)
Conditions Max. Unit
OUT
= 0V 11 p F
2946 tbl 04
IDT71256S/L CMOS Static RAM 256K (32K x 8-Bit) Military, Commercial, and Industrial Temperature Ranges
Recommended Operating Temperature and Supply Voltage
Grade Temperature GND Vcc
O
Military -55 Industrial -40 Commercial 0
DC Electrical Characteristics
Symbol Parameter
I
CC
Dynamic Operating Current
VIL, Outputs Ope n
CS <
CC
= Max., f
V
SB
Stand by Po wer Supply Current
I
(TTL Le ve l), CS > Outputs Open, f = f
SB1
Full Standby Power Supply Current
I
(CMOS Le v e l), CS >
CC
= Max. , f = 0
V
C to +1 25OC 0V 5V ± 10%
O
C to +8 5OC 0V 5V ± 10%
O
C to +70OC 0V 5V ± 10%
(1,2)
(2)
MAX
VIH, VCC = Max.,
(2)
MAX
VHC,
Recommended DC Operating Conditions
Symbol Parameter Min. Typ. Max. Unit
CC
Supply Voltage 4.5 5.0 5.5 V
V
GND Ground 0 0 0 V
V
IH
Inp ut Hig h Vol tag e 2 .2
2 9 46 t b l 05
V
IL
Input Low Voltage -0.5
NOTE:
1. VIL (min.) = –3.0V for pulse width less than 20ns, once per cycle.
(VCC = 5.0V ± 10%, VLC = 0.2V, VHC = VCC - 0.2V)
71256S/L20 71256S/L25 71256S/L3 5 712 56S/L45
Power Com'l. Mil. Com'l
& In d
____ ____ ____
S L135 S L3 S L0.4
____
____ ____ ____
____
____ ____ ____
____
Mil. Com'l.
& In d
____
150
11 5 130 105 120
____
20
3333
____
20
0.4 1.5 0.4 1.5
____
(1)
____
6.0 V
0.8 V
Mil. Com'l. Mil.
____
140
20
20
____
____
____
____
____
135 115
20 mA
20 mA
1.5
2946 tb l 06
Unit
mA
3
2946 tbl 07
71256S/L55 71256S/L70 71256S/L85 71256S/L100
Symbol Parameter Power Mil. Mil. Mil. Mil. Unit
CC
I
SB
I
SB1
I
NOTES:
Dynamic Operating Current CS <
VIL, Outputs Open
V
CC
= Max ., f
MAX
(2)
Standby Power Supp ly Current (TTL Lev e l), CS > Ou tputs Open, f = f
VIH, VCC = Max.,
(2)
MAX
Full Standby Power Supply Current (CMOS Le v el ), CS >
CC
= Max. , f = 0
V
VHC,
S 135 135 135 135 mA L 115 115 115 115 S20202020 L3 3 3 3 S20202020 L 1.5 1.5 1.5 1.5
2946 tbl 08
1. All values are maximum guaranteed values.
2. fMAX = 1/tRC, all address inputs are cycling at fMAX; f = 0 means no address pins are cycling.
6.42
3
mA
mA
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