Integrated Device Technology Inc IDT7006L15F, IDT7006L15G, IDT7006L20J, IDT7006L20JB, IDT7006L20PF Datasheet

...
Integrated Device Technology, Inc.
HIGH-SPEED 16K x 8 DUAL-PORT STATIC RAM
IDT7006S/L
FEATURES:
• True Dual-Ported memory cells which allow simulta­neous access of the same memory location
• High-speed access — Military: 20/25/35/55/70ns (max.) — Commercial: 15/17/20/25/35/55ns (max.)
• Low-power operation — IDT7006S
Active: 750mW (typ.) Standby: 5mW (typ.)
— IDT7006L
Active: 750mW (typ.) Standby: 1mW (typ.)
• IDT7006 easily expands data bus width to 16 bits or more using the Master/Slave select when cascading more than one device
•M/S = H for M/S = L for
BUSY
output flag on Master,
BUSY
input on Slave
• Busy and Interrupt Flags
FUNCTIONAL BLOCK DIAGRAM
OE
L
CE
L
R/
W
L
• On-chip port arbitration logic
• Full on-chip hardware support of semaphore signaling between ports
• Fully asynchronous operation from either port
• Devices are capable of withstanding greater than 2001V electrostatic discharge
• Battery backup operation—2V data retention
• TTL-compatible, single 5V (±10%) power supply
• Available in a 68-pin PGA, a 68-pin quad flatpack, a 68­pin PLCC, and a 64-pin TQFP
• Industrial temperature range (–40°C to +85°C) is avail­able, tested to military electrical specifications
DESCRIPTION:
The IDT7006 is a high-speed 16K x 8 Dual-Port Static RAM. The IDT7006 is designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER/SLAVE Dual­Port RAM for 16-bit-or-more word systems. Using the IDT MASTER/SLAVE Dual-Port RAM approach in 16-bit or wider
OE
R
CE
R
R/
W
R
I/O0L- I/O
NOTES:
1. (MASTER):
BUSY
is output; (SLAVE):
BUSY
2.
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
is input.
BUSY
outputs
and
INT
outputs are non-tri-stated push-pull.
BUSY
(1,2)
L
A
A
SEM
INT
13L
7L
Address
0L
L
(2)
L
Decoder
CE
OE
R/
W
L L L
14
I/O
Control
MEMORY
ARRAY
ARBITRATION
INTERRUPT
LOGIC
M/
S
I/O
Control
Address Decoder
14
CE
R
OE
R
R/
W
R
I/O0R-I/O
BUSY
A
13R
A
0R
SEM
R
(2)
INT
R
2739 drw 01
7R
(1,2)
R
MILITARY AND COMMERCIAL TEMPERATURE RANGES OCTOBER 1996
©1996 Integrated Device Technology, Inc. DSC-2739/5
For latest information contact IDT’s web site at www.idt.com or fax-on-demand at 408-492-8391.
6.07
1
IDT7006S/L
INDEX
IDT7006
PN-64
TQFP
TOP VIEW
(3)
8
9 10 11
12 13
14 15
16
1
2
3
4
5
6
7
46 45
44 43 42 41 40 39 38 37
36 35 34
47
48
33
17
18
19
20
32
31
30
29
28
27
26
25
24
23
22
21
49
50
51
52
63
62
61
60
59
58
57
56
55
54
53
64
I/O
2L
V
CC
GND
GND
A
4R
BUSY
L
BUSY
R
INT
R
INT
L
GND M/
S
OE
L
A
5L
I/O
1L
R/
W
L
CE
L
SEM
L
V
CC
OE
R
CE
R
R/
W
R
SEM
R
A
12R
GND
I/O
3L
I/O
4L
I/O
5L
I/O
6L
I/O
7L
I/O
0R
I/O
1R
I/O
2R
V
CC
I/O
3R
I/O
4R
I/O
5R
I/O
6R
I/O
7R
A
11R
A
10R
A
9R
A
8R
A
7R
A
6R
A
5R
A
3R
A
2R
A
1R
A
0R
A
0L
A
1L
A
2L
A
3L
A
4L
A
6L
A
7L
A
8L
A
9L
A
10L
A
11L
A
12L
I/O
0L
2739 drw 03
A
13R
A
13L
HIGH-SPEED 16K x 8 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
memory system applications results in full-speed, error-free operation without the need for additional discrete logic.
This device provides two independent ports with separate control, address, and I/O pins that permit independent, asynchronous access for reads or writes to any location in memory. An automatic power down feature controlled by
CE
permits the on-chip circuitry of each port to enter a very low standby power mode.
Fabricated using IDT’s CMOS high-performance technol­ogy, these devices typically operate on only 750mW of power.
L
L
L
W
SEM
CE
R/
IDT7006
J68-1
F68-1
TOP VIEW
R
N/C
CE
(1,2)
13R
A
N/C
GND
13L
A
(3)
12R
A
CC
V
11R
A
12L
A
10R
A
10L
11L
A
A
64 63 62 61
40 41 42 43
9R
8R
A
A
7R
A
6L
7L
8L
A
A
A
60
A
5L
59
4L
A
58
A
3L
57
A
2L
56
A
1L
55
A
0L
54
INT
53
BUSY
52
GND
51
M/
50
BUSY
49
INT
48
A
0R
47
A
1R
46
A
2R
45
A
3R
44
A
4R
2739 drw 02
5R
6R
A
A
9L
A
PIN CONFIGURATIONS
N/C
L
0L
OE
N/C
I/O
PLCC / FLATPACK
R
R
R
W
OE
R/
SEM
INDEX
I/O
2L
I/O
3L
I/O
4L
I/O
5L
GND I/O
6L
I/O
7L
V
CC
GND
I/O
0R
I/O
1R
I/O
2R
V
CC
I/O
3R
I/O
4R
I/O
5R
I/O
6R
1L
I/O
98765432168676665 10 11
12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
27 28 29 30 31 32 33 34 35 36 37 38 39
7R
I/O
Low-power (L) versions offer battery backup data retention capability with typical power consumption of 500µW from a 2V battery.
The IDT7006 is packaged in a ceramic 68-pin PGA, a 68­pin quad flatpack, a 68-pin PLCC, and a 64-pin TQFP (thin plastic quad flatpack) . Military grade product is manufactured in compliance with the latest revision of MIL-STD-883, Class B, making it ideally suited to military temperature applications demanding the highest level of performance and reliability.
L
L
S
R
R
NOTES:
1. All Vcc pins must be connected to the power supply.
2. All GND pins must be connected to the ground supply.
3. This text does not indicate orientation of the the actual part-marking.
6.07 2
IDT7006S/L HIGH-SPEED 16K x 8 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN CONFIGURATIONS (CONT'D)
11
10
09
08
07
06
05
04
03
02
01
51 50 48 46 44 42 40 38 36
A
A
5L
525449 39 37
53
A
7L
A
A
6L
55
A
9L
A
8L
56
57
A
11L
A
10L
58
59
V
CC
A
12L
60
61
N/C
A
13L
62
63
SEM
L
CE
L
64
65
OE
L
R/
W
L
676866
I/O
0L
N/C
13579
I/O
1L
I/O
I/O
2L
246810121416
I/O
I/O
3L
(1,2)
INT
A
1R
R
M/
4L
A
2L
A
0L
BUSY
S
L
47 45 43 41 34
GND
BUSY
R
A
2R
A
0R
INT
3L
A
1L
L
IDT7006
G68-1
68-PIN PGA
(3)
11 13 15
V
1R
CC
I/O
I/O
I/O2RI/O3RI/O
4R
5R
GND GND
4L
5L
I/O
6L
TOP VIEW
I/O
7L
I/O
V
CC
0R
A
3R
35
A
4R
33
32
A
7R
31
30
A
9R
29
28
A
11R
27
26
GND
25
24
N/C
23
22
SEM
R
21
20
R
OE
18 19 I/O
7R
17 I/O
6R
A
A
A
CE
R/
A
5R
A
6R
A
8R
10R
12R
13R
W
N/C
R
R
INDEX
ABCDEFGH JKL
NOTES:
CC pins must be connected to power supply.
1. All V
2. All GND pins must be connected to ground supply.
3. This text does not indicate orientation of the actual part-marking.
PIN NAMES
Left Port Right Port Names
CE
L
R/
W
L R/WR Read/Write Enable
OE
L
A
0L – A13L A0R – A13R Address
I/O
0L – I/O7L I/O0R – I/O7R Data Input/Output
SEM
L
INT
L
BUSY
L
CE
R Chip Enable
OE
R Output Enable
SEM
R Semaphore Enable
INT
R Interrupt Flag
BUSY
R Busy Flag
M/
S
V
CC Power
Master or Slave Select
GND Ground
2739 drw 04
2739 tbl 01
6.07 3
IDT7006S/L HIGH-SPEED 16K x 8 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
TRUTH TABLE I – NON-CONTENTION READ/WRITE CONTROL
Inputs
CECE
CE
CECE
R/
WW
W
WW
H X X H High-Z Deselected: Power-Down L L X H DATA L H L H DATA X X H X High-Z Outputs Disabled
NOTE: 2739 tbl 02
1. A0L — A13L is not equal to A0R — A13R.
(1)
OEOE
OE
OEOE
SEMSEM
SEM
SEMSEM
Outputs
0-7 Mode
I/O
IN Write to Memory
OUT Read Memory
TRUTH TABLE II – SEMAPHORE READ/WRITE CONTROL
Inputs Outputs
CECE
CE
CECE
H H L L DATA H L X X L Not Allowed
NOTE:
1. There are eight semaphore flags written to via I/O
ABSOLUTE MAXIMUM RATINGS
Symbol Rating Commercial Military Unit
V
TERM
T
A Operating 0 to +70 –55 to +125 °C
T
BIAS Temperature –55 to +125 –65 to +135 °C
STG Storage –55 to +125 –65 to +150 °C
T
I
OUT DC Output 50 50 mA
NOTES: 2739 tbl 04
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating condi­tions for extended periods may affect reliability.
TERM must not exceed Vcc + 0.5V for more than 25% of the cycle time
2. V or 10ns maximum, and is limited to + 0.5V.
WW
R/
W
WW
u
(2)
Terminal Voltage –0.5 to +7.0 –0.5 to +7.0 V
OEOE
SEMSEM
OE
OEOE
SEM
SEMSEM
I/O
X L DATA
0-7 Mode
OUT Read Data in Semaphore Flag Data Out
IN Write I/O0 into Semaphore Flag
0 and read from I/O0 - I/O15. These eight semaphores are addressed by A0 - A2.
(1)
with Respect to GND
Temperature
Under Bias
Temperature
Current
< 20mA for the period of VTERM < Vcc
RECOMMENDED OPERATING TEMPERATURE AND SUPPLY VOLTAGE
Grade Temperature GND V
Military –55°C to +125°C 0V 5.0V ± 10% Commercial 0°C to +70°C 0V 5.0V ± 10%
RECOMMENDED DC OPERATING CONDITIONS
Symbol Parameter Min. Typ. Max. Unit
CC Supply Voltage 4.5 5.0 5.5 V
V GND Supply Voltage 0 0 0 V
IH Input High Voltage 2.2 6.0
V V
IL Input Low Voltage –0.5
NOTES: 2739 tbl 06
1. VIL≥ -1.5V for pulse width less than 10ns.
TERM must not exceed Vcc + 0.5V.
2. V
CAPACITANCE
(TA = +25°C, f = 1.0MHz)TQFP PACKAGE
Symbol Parameter Conditions
IN Input Capacitance VIN = 3dV 9 pF
C
OUT Output VOUT = 3dV 10 pF
C
NOTES: 2739 tbl 07
1. This parameter is determined by device characterization, but is not production tested.
2. 3dv references the interpolated capacitance when the input and output signals switch from 0V to 3V or from 3V to 0V.
(1)
Capacitance
Ambient
(1)
(1)
0.8 V
(2)
2739 tbl 03
CC
2739 tbl 05
(2)
V
Max. Unit
6.07 4
IDT7006S/L HIGH-SPEED 16K x 8 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
DC ELECTRICAL CHARACTERISTICS OVER THE OPERATING TEMPERATURE AND SUPPLY VOLTAGE RANGE
Symbol Parameter Test Conditions Min. Max. Min. Max. Unit
LI| Input Leakage Current
|I
LO| Output Leakage Current
|I
OL Output Low Voltage IOL = 4mA 0.4 0.4 V
V
OH Output High Voltage IOH = -4mA 2.4 2.4 V
V
NOTE:
1. At Vcc
2.0V input leakages are undefined.
(1)
VCC = 5.5V, VIN = 0V to VCC —10—5µA
CE
= VIH, VOUT = 0V to VCC —10—5µA
(VCC = 5.0V ± 10%)
IDT7006S IDT7006L
2739 tbl 08
DC ELECTRICAL CHARACTERISTICS OVER THE OPERATING TEMPERATURE AND SUPPLY VOLTAGE RANGE
7006X15 7006X17 7006X20 7006X25
Test
Symbol Parameter Condition Version
CC Dynamic Operating
I
Current (Both Ports Active) f = f
SB1 Standby Current
I
(Both Ports — TTL Level Inputs f = f
SB2 Standby Current
I
CE
= VIL, Outputs Open MIL. S 160 370 155 340 mA
SEM
= V
IH L 150 320 145 280
(3)
MAX
CE
L = CER = VIH MIL. S 20 90 16 80 mA
SEM
R =
SEM
L = VIH L 10 70 10 65
(3)
MAX
CE
"A"=VIL and CE"B"=VIH
COM.
COM.
(5)
MIL. S 95 240 90 215 mA
(One Port — TTL Active Port Outputs Open Level Inputs) f = f
I
SB3 Full Standby Current Both Ports CEL and MIL. S 1.0 30 1.0 30 mA
(Both Ports — All CMOS Level Inputs) V
SB4 Full Standby CurrentCE"A" < 0.2V and MIL. S 90 225 85 200 mA
I
(One Port — All CMOS Level Inputs)
Active Port Outputs Open,
NOTES: 2739 tbl 09
1. "X" in part numbers indicates power rating (S or L).
2. V
CC = 5V, TA = +25°C, and are not production tested. ICC DC = 120mA (typ.).
3. At f = f
4. f = 0 means no address or control lines change.
5. Port "A"may be either left or right port. Port "B" is the port opposite port "A".
MAX, address and I/O'S are cycling at the maximum frequency read cycle of 1/tRC, and using “AC Test Conditions” of input levels of GND to 3V.
(3)
MAX
SEM
R =
SEM
L > VIH L 95 160 95 160 85 150 80 140
CE
R > VCC - 0.2V L 0.2 10 0.2 10
IN > VCC - 0.2V or
V
IN < 0.2V, f = 0
SEM
R =
SEM
CE
"B" > VCC - 0.2V
SEM
R =
SEM
IN > VCC - 0.2V or
V V
IN < 0.2v
(3)
f = f
MAX
(4)
L > VCC-0.2V
(5)
L > VCC-0.2V L 80 200 75 170
COM.
COM.
COM
Com'l. Only Com'l. Only
(2)
Typ.
S 170 310 170 310 160 290 155 265
L 160 260 160 260 150 240 145 220
S 20 60 20 60 20 60 16 60
L 10 50 10 50 10 50 10 50
L 85 210 80 180
S 105 190 105 190 95 180 90 170
S 1.0 15 1.0 15 1.0 15 1.0 15
L 0.2 5 0.2 5 0.2 5 0.2 5
.S100 170 100 170 90 155 85 145
L 90 140 90 140 80 130 75 120
Max.
(1)
(VCC = 5.0V ± 10%)
(2)
Typ.
Max. Typ.
(2)
Max. Typ.
(2)
Max.
Unit
6.07 5
IDT7006S/L HIGH-SPEED 16K x 8 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
DC ELECTRICAL CHARACTERISTICS OVER THE OPERATING TEMPERATURE AND SUPPLY VOLTAGE RANGE
Test Mil Only
Symbol Parameter Condition Version Typ.
CC Dynamic Operating
I
Current (Both Ports Active) f = f
SB1 Standby Current
I
(Both Ports — TTL Level Inputs) f = f
I
SB2 Standby Current
(One Port — TTL Active Port Outputs Open, L 75 160 75 160 70 160 Level Inputs) f = f
I
SB3 Full Standby Current Both Ports CEL and MIL. S 1.0 30 1.0 30 1.0 30 mA
(Both Ports — All CMOS Level Inputs) V
SEM
R =
SEM
L≥ VCC-0.2V
I
SB4 Full Standby Current CE"A" < 0.2V and MIL. S 80 175 80 175 75 175 mA
(One Port — All CMOS Level Inputs)
NOTES: 2739 tbl 10
1. "X" in part numbers indicates power rating (S or L).
CC = 5V, TA = +25°C, and are not production tested. ICC DC =120mA (typ).
2. V
3. At f = fMAX, address and I/O'S are cycling at the maximum frequency read cycle of 1/tRC, and using “AC Test Conditions” of input levels of GND to 3V.
4. f = 0 means no address or control lines change.
5. Port "A" may be either left or right port. Port "B"is the opposite from port "A".
CE
= VIL, Outputs Open MIL. S 150 300 150 300 140 300 mA
SEM
= V
IH L 140 250 140 250 130 250
(3)
MAX
COM’L. S 150 250 150 250
L 140 210 140 210
CE
L = CER = VIH MIL. S 13 80 13 80 10 80 mA
SEM
R =
SEM
L = VIH L10 65 10 65 8 65
(3)
MAX
COM’L. S 13 60 13 60
L10 50 10 50 — —
(5)
(5)
MIL. S 85 190 85 190 80 190 mA
COM’L. S 85 155 85 155
L 0.2 5 0.2 5
CE
"A"=VIL and CEL"B"=VIH
(3)
MAX
SEM
R =
SEM
L = VIH L 75 130 75 130
CE
R > VCC - 0.2V L 0.2 10 0.2 10 0.2 10
IN > VCC - 0.2V or COM’L. S 1.0 15 1.0 15
V
IN < 0.2V, f = 0
CE
"B" > VCC - 0.2V
SEM
R =
SEM
IN > VCC - 0.2V or COM’L. S 80 135 80 135
V V
IN < 0.2V
Active Port Outputs Open, L 70 110 70 110
(3)
f = f
MAX
(4)
L≥ VCC - 0.2V L 70 150 70 150 65 150
(1)
(Cont'd.) (VCC = 5.0V ± 10%)
7006X35 7006X55 7006X70
(2)
Max. Typ.
(2)
Max. Typ.
(2)
Max. Unit
DATA RETENTION CHARACTERISTICS OVER ALL TEMPERATURE RANGES (L Version Only)
(VLC = 0.2V, VHC = VCC - 0.2V)
Symbol Parameter Test Condition Min. Typ.
DR VCC for Data Retention VCC = 2V 2.0 V
V
CCDR Data Retention Current
I
(3)
CDR
t
(3)
R
t
NOTES: 2739 tbl 11
1. TA = +25°C, VCC = 2V, and are not production tested.
2. t
RC = Read Cycle Time
3. This parameter is guaranteed by characterization, but are not production tested.
4. At Vcc = 2V input leakages are undefined
Chip Deselect to Data Retention Time Operation Recovery Time tRC
(4)
(1)
Max. Unit
CE
VHC MIL. 100 4000 µA
IN VHC or VLC COM’L. 100 1500
V
SEM
VHC 0——ns
(2)
——ns
DATA RETENTION WAVEFORM
DATA RETENTION MODE
V
V
CC
CE
4.5V
t
CDR
V
IH
DR
2V
V
DR
6.07 6
4.5V t
R
V
IH
2739 drw 05
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