IDT MicroClock 5x2503, 5X2503, 5L2503 User Manual

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MicroClock® 5x2503 Family Development Kit

User Guide

Introduction

The MicroClock development kit is designed to support the 5x2503 family of MicroClock devices. It provides a convenient way of verifying, configuring and programming the blank parts for all MicroClock devices. The IDT Timing Commander the devices for configuration and frequency validation on the USB mother board via an on-board USB interface. Using additional socket daughter boards, a validated configuration is used to program blank parts for any of the MicroClock devices.

Table 1. MicroClock Family Products

Product Description Package

5X2503 1.8V integrated with an internal 26M crystal. 12-DFN

5L2503 1.8V using an external 26M crystal. 12-DFN

For details of product operation, refer to the product datasheet.

™ GUI communicates to

Socket Daughter Board Overview

The MicroClock socket daughter board is ready with all of the necessary components and connections to test the functionality of the configuration. A blank device is placed in the socket for programming (see Figure 1).

Figure 1. Socket Daughter Board Overview (socket closed)

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MicroClock® 5x2503 Family Development Kit User Guide

Socket Daughter Board

USB Mother Board

Table 2. Socket Daughter Board Descriptions

Label Number Label Name Description

1 Device ID Define the evaluation board supports for 5X2503 or 5L2503.

2 Probing Notes

3 26MHz Crystal

4 Jumper

These are test points for single-ended outputs; SE1, SE2, SE3 and Reference with GND test points in between.

Crystal with 8pF load is populated for 5L2503. For 5X2503; the crystal is not populated.

A switch jumper to control OE1 function. The default setting is set for OTP burn

5 LEDs Two LED lights to indicate the OTP burn process.

6 SMA connector for OUT1 Additional frequency test connector using SMA for OUT1.

7 Socket 12-pin DFN socket for placing MicroClock blank parts.

8 SMA Connector for PPS Mode on OUT1 SMA connector for PPS mode validation.

9 Part Indication Indication for device orientation.

10 DIP Switch

Figure 2. Development Kit Boards

Used to configure the device in different modes (software mode as default

for I

C control; hardware mode as output pin control selection).

(Evaluation socket daughter board combined with a USB mother board)

The socket daughter board for 5x2503, combined with a USB mother board, is used for the purpose of validation and measurement on all outputs. After a configuration is validated on the USB mother board, the board can be connected along with the specific socket daughter board for programming on blank parts of MicroClock family devices. Note that blank parts can only be burnt once through the socket daughter board. The socket daughter board is bundled with a USB mother board. The following description and images are restricted to the socket daughter board.

On the footprint of the socket daughter board, a pin orientation identifies the position of Pin 1 as shown in Figure 3. Align the dot of the blank part in the socket as pointed. After placing the blank part, secure the socket cover.

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Figure 3. Socket Daughter Board (pin position)

Pin 1 Orientation

Programming Steps

MicroClock® 5x2503 Family Development Kit User Guide

Use programming steps 2 – 7 as described in the Table 3 to program a configuration into the blank part in the specified socket daughter board.

Table 3. Programming Steps

Step Number Step Description Comments

A configuration has been validated and completed on the development kit.

All intended outputs should be available for measurement on the USB development kit.

Plug the specified socket daughter board

onto the USB mother board (shown in

Figure 2).

Configurations should have been validated on the USB mother board and are ready to proceed for programming on blank parts.

Upon validation of the outputs, “Disconnect” the USB board and proceed for OTP burn as explained in the following sections.

USB mother board with the socket daughter board provides a communication channel between the GUI and a blank part in the socket daughter board.

Start Timing Commander software (this step

can be skipped if a configuration is ready in

Launch the Timing Commander GUI software. Load the personality file.

the personality).

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MicroClock® 5x2503 Family Development Kit User Guide

Table 3. Programming Steps (Cont.)

Step Number Step Description Comments

New settings file (this step can be skipped if a configuration is ready in the personality).

Using the Timing Commander GUI, start a new settings file or open a pre-optimized file.

Click on the chip symbol on the top right corner of the GUI window.

5 Connect to the development kit.

Once connected, new options will be available on a green background indicating that the USB mother board has successfully connected with the socket daughter board.

6—

The configuration will be programmed into the blank part in the socket.

7 Click the “write all” icon.

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MicroClock® 5x2503 Family Development Kit User Guide

Use the following steps to proceed with the OTP burn.

8. After the chip is connected to the Timing Commander, the main window of configuration is shown (see Figure 4). Click the OTP icon on the left side of personality window.

Figure 4. Personality Main Window

9. After clicking the icon, a new dialogue window will open up (see Figure 5). Click “Yes” to proceed with the OTP burn process. Please note that this process cannot be reverted back.

Figure 5. Proceed to Burn Dialog Window

10. If the OTP burn process is successful, a dialog window with “Success” will appear indicating that the process is completed and the part has been burnt based on the configuration.

Figure 6. Success Dialog Window

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D D

C C

B B

A A

FEMALE connector FEMALE connector

BURNDONE

GND for SE

outputs

1 inch traceline on

SE1, SE2 and, SE3

Drain (Pin3) Source (Pin2)

Gate (Pin1)

Drain (Pin3) Source (Pin2)

Gate (Pin1)

GND for Power

GND for SE

outputs

GND for SE

outputs

Silkscreen

as VPP

SSM3J338R

Pls make sure they match to the

location of connectors from USB

board

USB P2 connectorUSB P1 connector

USB P4 connector

No populated

unless for PPS

OTP burn

AADVARK

Header Alignment:

Single pin header above

and below the center pin

of 3-pin header so that

center pin can be jumped

with the surrounding 4

pins, shown as left

VDD1P8V

GND

This device is

placed as a symbol

for for socket

REG_COMP1

VDD33

Node#3

REG_COMP

Node#1

Node#2

6V5

Socket_GND_trace

6v5_en

LED_Burn

Node#4Node#5

LED_DONE

VDD33

6V5

VDD_USB1p8_J7

VDD_USB1p8_J6

6v5_en

LED_Burn

LED_DONE

SDA_DFC0SDA_DFC0_socket

VDD_SEx_BF-FET

Note#4

VDD_External VDD_1p8_BF-FET

OE1_12

TP_SE1

SE_2_12

Pin10_Vddout2

SE_3_12

INV_OE1

SMA_OE1

SE_1_12

TP_SE3

VDD_SEx

OE1

SW2

SW1

SW3

SDA_chip

SCL_chip

OE1

OE1_12

SMA_OE1

TP_SE2

OE_R1

INV_OE1

SW3

Pin6_Vddout1

VDD_1p8

SCL_chip

SDA_chip

SW_control

SCL_AADVAR

SDA_AADVAR

VDD_1p8_BF-FET

VDD33

Pin6_Vddout1

Pin4_Vdd-Xtal

SCL_chip

SDA_chip

Pin5_Vdd-Xtal OE1_12

SE_2_12

SE_3_12

SE_1_12

Pin10_Vddout2

CLKINB/X2

CLKIN/X1X1

GND

CLKIN/X1

Pin5_Vdd-Xtal

CLKINB/X2

Pin4_Vdd-Xtal

GND

VDD_External_TP

VDD_1p8

VDD_SEx

OE1

VDD_1p8

VDD_SEx VDD_SEx

GND

SCL_DFC_socket

Socket_GND_trace

LED_DONE

LED_Burn

6v5_en

Title

Size Document Number Rev

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1.5K

R170

TC7SZ125FE

2 4

LED_GREEN

5X2503

SDA1SCL2VSS33VSS44VDD185VDDOUT1

OUT1

OE1

OUT2

VDDOUT2

OUT3

VSS12

R34

2.2

1 2

200K

1 2

GNDGND

25 MHz 8 pF_NP

JP1

Header_3Pin

R24

2.2

1 2

R33

220

R43

0_NP

R38 100

1 2

TP9

C151 uF

R13

200K

10 uF

R21

1 2

TP1SE3_TP

C1010 uF

TP18

R35

1 2

C90.1 uF

R42

0_NP

TP11 VDD1P8

C13100pF_NP

R160

R370

R12

1 2

10uH

1 2

R20

1 2

C16

0.1 uF_NP

1 2

DIODE SCHOTTKY

1 2

C520.1 uF

R27

1 2

R14

0_NP

1 2

J2X

R44

1 2

TP12

R39 100

1 2

LT1317B

VIN

SHDN#

GND4SW

LBI

LBO

J1X

TP2

C12

0.1 uF_NP

MOS-P

2 3

TP5SE1_TP

R19

0_NP

1 2

R26

1 2

TP8

VDDSE2

LED_RED

1500pF

1 2

R300_NP

C111 uF

C74.7pF

R36

10k

R290

10K

LED

MOS-P

2 3

1 2

TP17

237K_1%

R11

0_NP

1 2

R32

220

TP16

TE_AMP_4-175638-0

112233445

6677889

DIP_SW8

VCC9VEE

s44s33s22s11s55s66s77s8

R45

1 2

20K

R40 10K

1 2

JP3

CON2

112

1M_1%

1 2

FB1

BLM18AG601SN1D

1 2

R23

1 2

C514.7pF

R47

0_NP

1 2

C14100pF_NP

TE_AMP_4-175638-0

112233445

6677889

R15

0_NP

1 2

JP4

Header_10Pin_NP

13579

246810

10 uF

JP2

CON2

R100

R46

0_NP

1 2

TP3SE2_TP

R180

TP7

VDDSE1

TE_AMP_4-175638-0

112233445

6677889910

C54NP

XU1

5X2503

SDA1SCL2VSS33VSS44VDD185VDDOUT1

OUT1

OE1

OUT2

VDDOUT2

OUT3

VSS12

TP6

R25

1 2

R41 10K

1 2

C504.7pF

TP4

C53NP

C50.1 uF

R28

10k

TP10

TP14

VP_I2C

TP15

10uH

1 2

C40.1 uF

R22

0_NP

1 2

TP13

R31

0_NP

1 2

Figure 7. Development Kit Board Schematic 1

MicroClock® 5x2503 Family Development Kit User Guide

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MicroClock® 5x2503 Family Development Kit User Guide

OTP Program Pin

GND Pin

Control by DIP Switch Pin

VDD Pin

OE1 pin on MicroClock socket daughter board provides multiple functions. To program OTP, please ensure to set the jumper (JP1) on OTP program pin (default setting). See Figure 8.

Figure 8. Jumper Setup

Termination Options

Table 4. Termination Options for Single-ended Output –1

Signal Type Series Resistor, R4

LVCMOS 33Ω

Table 5. Termination Options for Single-ended Output –2

Signal Type Series Resistor, R2

LVCMOS 33Ω

Table 6. Termination Options for Single-ended Output –3

Signal Type Series Resistor, R1

LVCMOS 33Ω

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MicroClock® 5x2503 Family Development Kit User Guide

Figure 9. 5X2503 Socket Daughter Board (board without crystal)

Figure 10. 5L2503 Socket Daughter Board (board populated with a 26MHz crystal)

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Revision History

Revision Date Description of Change

October 20, 2017 Initial release.

MicroClock® 5x2503 Family Development Kit User Guide

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DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time, without notice, at IDT’s sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties.

IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.

Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. Integrated Device Technology, Inc.. All rights reserved.

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