ICSI IS41C16256, IS41LV16256 User Manual

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IS41C16256 IS41LV16256
256K x 16 (4-MBIT) DYNAMIC RAM WITH EDO PAGE MODE
FEATURES
• Extended Data-Out (EDO) Page Mode access cycle
• Refresh Interval: 512 cycles /8 ms
• Refresh Mode: RAS-Only, CAS-before-RAS (CBR), Hidden
• Single power supply: 5V ± 10% (IS41C16256)
3.3V ± 10% (IS41LV16256)
• Byte Write and Byte Read operation via two CAS
• Industrial Temperature Range -40oC to 85oC
DESCRIPTION
The ICSI IS41C16256 and IS41LV16256 is a 262,144 x 16­bit high-performance CMOS Dynamic Random Access Memo­ries. The IS41C16256 offer an accelerated cycle access called EDO Page Mode. EDO Page Mode allows 512 random accesses within a single row with access cycle time as short as 10 ns per 16-bit word. The Byte Write control, of upper and lower byte, makes the IS41C16256 ideal for use in 16-, 32-bit wide data bus systems.
These features make the IS41C16256and IS41LV16256 ideally suited for high-bandwidth graphics, digital signal processing, high-performance computing systems, and peripheral applications.
The IS41C16256 is packaged in a 40-pin 400mil SOJ and 400mil TSOP-2.
KEY TIMING PARAMETERS
Parameter -25(5V) -35 -50 -60 Unit
Max. RAS Access Time (tRAC) 25355060ns Max. CAS Access Time (tCAC) 10101415ns Max. Column Address Access Time (tAA) 12182530ns Min. EDO Page Mode Cycle Time (tPC) 10122025ns Min. Read/Write Cycle Time (tRC) 456090110ns
PIN CONFIGURATIONS
40-Pin TSOP-2
40-Pin SOJ
PIN DESCRIPTIONS
VCC
I/O0 I/O1 I/O2 I/O3
VCC
I/O4 I/O5 I/O6 I/O7
NC NC
WE
RAS
NC
A0 A1 A2 A3
VCC
1 2 3 4 5 6 7 8 9 10
11 12 13 14 15 16 17 18 19 20
40
GND
39
I/O15
38
I/O14
37
I/O13
36
I/O12
35
GND
34
I/O11
33
I/O10
32
I/O9
31
I/O8
30
NC
29
LCAS
28
UCAS
27
OE
26
A8
25
A7
24
A6
23
A5
22
A4
21
GND
VCC
I/O0 I/O1 I/O2 I/O3
VCC
I/O4 I/O5 I/O6 I/O7
NC NC
WE
RAS
NC
A0 A1 A2 A3
VCC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
GND I/O15 I/O14 I/O13 I/O12 GND I/O11 I/O10 I/O9 I/O8 NC LCAS UCAS OE A8 A7 A6 A5 A4 GND
A0-A8 Address Inputs
I/O0-15 Data Inputs/Outputs
WE Write Enable OE Output Enable RAS Row Address Strobe UCAS Upper Column Address Strobe LCAS Lower Column Address Strobe
Vcc Power GND Ground NC No Connection
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc.
Integrated Circuit Solution Inc. 1
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IS41C16256 IS41LV16256
FUNCTIONAL BLOCK DIAGRAM
OE WE
LCAS
UCAS
RAS
A0-A8
CAS
CLOCK
GENERATOR
RAS
CLOCK
GENERATOR
REFRESH COUNTER
ADDRESS
BUFFERS
WE
CAS WE
RAS
CONTROL
LOGICS
DATA I/O BUS
COLUMN DECODERS
SENSE AMPLIFIERS
MEMORY ARRAY
262,144 x 16
ROW DECODER
OE
CONTROL
LOGIC
OE
I/O0-I/O15
DATA I/O BUFFERS
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IS41C16256 IS41LV16256
TRUTH TABLE
Function
RASRAS
RAS
RASRAS
Standby H H H X X X High-Z Read: Word L L L H L ROW/COL DOUT Read: Lower Byte L L H H L ROW/COL Lower Byte, DOUT
Read: Upper Byte L H L H L ROW/COL Lower Byte, High-Z
Write: Word (Early Write) L L L L X ROW/COL DIN Write: Lower Byte (Early Write) L L H L X ROW/COL Lower Byte, DIN
Write: Upper Byte (Early Write) L H L L X ROW/COL Lower Byte, High-Z
Read-Write EDO Page-Mode Read
(1,2)
LLLH
(2)
1st Cycle: L H→LH→L H L ROW/COL DOUT 2nd Cycle: L H→LH→L H L NA/COL DOUT Any Cycle: L L→HL→H H L NA/NA DOUT
EDO Page-Mode Write
(1)
1st Cycle: L H→LH→L L X ROW/COL DIN 2nd Cycle: L H→LH→L L X NA/COL DIN
EDO Page-Mode 1st Cycle: L H→LH→LH→LL→H ROW/COL DOUT, DIN Read-Write
Hidden Refresh
(1,2)
2nd Cycle: L H→LH→LH→LL→H NA/COL DOUT, DIN
(2)
Read L→H→L L L H L ROW/COL DOUT
Write L→H→L L L L X ROW/COL DOUT RAS-Only Refresh L H H X X ROW/NA High-Z CBR Refresh
Notes:
1. These WRITE cycles may also be BYTE WRITE cycles (either LCAS or UCAS active).
2. These READ cycles may also be BYTE READ cycles (either LCAS or UCAS active).
3. At least one of the two CAS signals must be active (LCAS or UCAS).
(3)
H→L L L X X X High-Z
LCASLCAS
LCAS
LCASLCAS
UCASUCAS
UCAS
UCASUCAS
WEWE
WE
WEWE
OEOE
OE Address tR/tC I/O
OEOE
Upper Byte, High-Z
Upper Byte, DOUT
Upper Byte, High-Z
Upper Byte, DIN
LL→H ROW/COL DOUT, DIN
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IS41C16256 IS41LV16256
Functional Description
The IS41C16256 and IS41LV16256 is a CMOS DRAM optimized for high-speed bandwidth, low power applica­tions. During READ or WRITE cycles, each bit is uniquely addressed through the 18 address bits. These are en­tered 9 bits (A0-A8) at a time. The row address is latched by the Row Address Strobe (RAS). The column address is latched by the Column Address Strobe (CAS). RAS is used to latch the first nine bits and CAS is used the latter nine bits.
The IS41C16256 and IS41LV16256 has two CAS controls, LCAS and UCAS. The LCAS and UCAS inputs internally generates a CAS signal functioning in an identical man­ner to the single CAS input on the other 256K x 16 DRAMs. The key difference is that each CAS controls its corresponding I/O tristate logic (in conjunction with OE and WE and RAS). LCAS controls I/O0 through I/O7 and UCAS controls I/O8 through I/O15.
The IS41C16256 and IS41LV16256 CAS function is determined by the first CAS (LCAS or UCAS) transitioning LOW and the last transitioning back HIGH. The two CAS controls give the IS41C16256 both BYTE READ and BYTE WRITE cycle capabilities.
Memory Cycle
A memory cycle is initiated by bring RAS LOW and it is terminated by returning both RAS and CAS HIGH. To ensures proper device operation and data integrity any memory cycle, once initiated, must not be ended or aborted before the minimum tRAS time has expired. A new cycle must not be initiated until the minimum precharge time tRP, tCP has elapsed.
Read Cycle
A read cycle is initiated by the falling edge of CAS or OE, whichever occurs last, while holding WE HIGH. The column address must be held for a minimum time specified by tAR. Data Out becomes valid only when tRAC, tAA, tCAC and tOEA are all satisfied. As a result, the access time is dependent on the timing relationships between these parameters.
Write Cycle
A write cycle is initiated by the falling edge of CAS and WE, whichever occurs last. The input data must be valid
at or before the falling edge of CAS or WE, whichever occurs first.
Refresh Cycle
To retain data, 512 refresh cycles are required in each 8 ms period. There are two ways to refresh the memory.
1. By clocking each of the 512 row addresses (A0 through A8) with RAS at least once every 8 ms. Any read, write, read-modify-write or RAS-only cycle refreshes the addressed row.
2. Using a CAS-before-RAS refresh cycle. CAS-before­RAS refresh is activated by the falling edge of RAS, while holding CAS LOW. In CAS-before-RAS refresh cycle, an internal 9-bit counter provides the row ad­dresses and the external address inputs are ignored.
CAS-before-RAS is a refresh-only mode and no data access or device selection is allowed. Thus, the output remains in the High-Z state during the cycle.
Extended Data Out Page Mode
EDO page mode operation permits all 512 columns within a selected row to be randomly accessed at a high data rate.
In EDO page mode read cycle, the data-out is held to the next CAS cycle’s falling edge, instead of the rising edge. For this reason, the valid data output time in EDO page mode is extended compared with the fast page mode. In the fast page mode, the valid data output time becomes shorter as the CAS cycle time becomes shorter. Therefore, in EDO page mode, the timing margin in read cycle is larger than that of the fast page mode even if the CAS cycle time becomes shorter.
In EDO page mode, due to the extended data function, the CAS cycle time can be shorter than in the fast page mode if the timing margin is the same.
The EDO page mode allows both read and write opera­tions during one RAS cycle, but the performance is equivalent to that of the fast page mode in that case.
Power-On
After application of the VCC supply, an initial pause of 200 µs is required followed by a minimum of eight initial­ization cycles (any combination of cycles containing a RAS signal).
During power-on, it is recommended that RAS track with VCC or be held at a valid VIH to avoid current surges.
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IS41C16256 IS41LV16256
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Parameters Rating Unit
V
T Voltage on Any Pin Relative to GND 5V –1.0 to +7.0 V
3.3V –0.5 to +4.6
CC Supply Voltage 5V –1.0 to +7.0 V
V
3.3V –0.5 to +4.6 IOUT Output Current 50 mA PD Power Dissipation 1 W TA Commercial Operation Temperature 0 to +70 °C
Industrial Operationg Temperature –40 to +85 °C
TSTG Storage Temperature –55 to +125 °C
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
RECOMMENDED OPERATING CONDITIONS (Voltages are referenced to GND.)
Symbol Parameter Min. Typ. Max. Unit
VCC Supply Voltage 5V 4.5 5.0 5.5 V
3.3V 3.0 3.3 3.6
VIH Input High Voltage 5V 2.4 VCC + 1.0 V
3.3V 2.0 VCC + 0.3
VIL Input Low Voltage 5V –1.0 0.8 V
3.3V –0.3 0.8
TA Commercial Ambient Temperature 0 70 °C
Industrial Ambient Temperature –40 85 °C
CAPACITANCE
(1,2)
Symbol Parameter Max. Unit
CIN1 Input Capacitance: A0-A8 5 pF CIN2 Input Capacitance: RAS, UCAS, LCAS, WE, OE 7pF CIO Data Input/Output Capacitance: I/O0-I/O15 7 pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: TA = 25°C, f = 1 MHz.
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IS41C16256 IS41LV16256
ELECTRICAL CHARACTERISTICS
(1)
(Recommended Operating Conditions unless otherwise noted.)
Symbol Parameter Test Condition Speed Min. Max. Unit
I
IL Input Leakage Current Any input 0V < VIN < Vcc –10 10 µ A
Other inputs not under test = 0V
IIO Output Leakage Current Output is disabled (Hi-Z) –10 10 µA
0V < VOUT < Vcc VOH Output High Voltage Level IOH = –2.5 mA 2.4 V VOL Output Low Voltage Level IOL =+2.1mA 0.4 V ICC1 Standby Current: TTL RAS, LCAS, UCAS > VIH Commerical 5V 2 mA
Industrial 5V 3 Commerical 3.3V 1 Industrial 3.3V 2
ICC2 Standby Current: CMOS RAS, LCAS, UCAS > VCC – 0.2V 5V 1 mA
3.3V 0.5
ICC3 Operating Current: RAS, LCAS, UCAS, -25 260 mA
Random Read/Write
(2,3,4)
Address Cycling, tRC = tRC (min.) -35 230
Average Power Supply Current -50 180
-60 170
ICC4 Operating Current: RAS = VIL, LCAS, UCAS, -25 250 mA
EDO Page Mode
(2,3,4)
Cycling tPC = tPC (min.) -35 220
Average Power Supply Current -50 170
-60 160
ICC5 Refresh Current: RAS Cycling, LCAS, UCAS > VIH -25 260 mA
RAS-Only
(2,3)
tRC = tRC (min.) -35 230
Average Power Supply Current -50 180
-60 170
ICC6 Refresh Current: RAS, LCAS, UCAS Cycling -25 260 mA
(2,3,5)
CBR
tRC = tRC (min.) -35 230
Average Power Supply Current -50 180
-60 170
Notes:
1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycles (RAS-Only or CBR) before proper device operation is assured. The eight RAS cycles wake-up should be repeated any time the tREF refresh requirement is exceeded.
2. Dependent on cycle rates.
3. Specified values are obtained with minimum cycle time and the output open.
4. Column-address is changed once each EDO page cycle.
5. Enables on-chip refresh and address counters.
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IS41C16256 IS41LV16256
AC CHARACTERISTICS
(1,2,3,4,5,6)
(Recommended Operating Conditions unless otherwise noted.)
-25 -35 -50 -60
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Units
tRC Random READ or WRITE Cycle Time 45 60 90 11 0 ns tRAC Access Time from RAS tCAC Access Time from CAS tAA Access Time from Column-Address
(6, 7) (6, 8, 15)
—25—35 —50 —60 ns —10 —10 —14 —15 ns
(6)
—12 —18 —25 —30 ns tRAS RAS Pulse Width 25 10K 35 10K 50 10K 60 10K ns tRP RAS Precharge Time 15 20 30 40 n s
(21)
(26)
(9, 25)
(10, 20)
4 10K 6 10K 8 10K 10 10K ns
4— 5— 8—10—ns 25 35 50 60 ns 10 17 11 28 19 36 20 45 ns
tCAS CAS Pulse Width tCP CAS Precharge Time tCSH CAS Hold Time tRCD RAS to CAS Delay Time tASR Row-Address Setup Time 0 0 0 0 ns tRAH Row-Address Hold Time 6 6 8 10 ns
(20)
(20)
0— 0— 0— 0—ns
5— 6— 8—10—ns
tASC Column-Address Setup Time tCAH Column-Address Hold Time tAR Column-Address Hold Time 19 30 40 40 ns
(referenced to RAS)
tRAD RAS to Column-Address Delay Time
(11)
8201020 14251530ns
tRAL Column-Address to RAS Lead Time 12 18 25 30 ns tRPC RAS to CAS Precharge Time 0 0 0 0 ns tRSH RAS Hold Time tCLZ CAS to Output in Low-Z tCRP CAS to RAS Precharge Time tOD Output Disable Time tOE Output Enable Time
(27)
(15, 29)
(19, 28, 29)
(15, 16)
(21)
7— 8— 14—15—ns
3— 3— 3— 3—ns
5— 5— 5— 5—ns
2 12 3 12 3 12 3 12 ns
08 010 015—15ns
tOEHC OE HIGH Hold Time from CAS HIGH 10 10 10 10 ns tOEP OE HIGH Pulse Width 10 10 10 10 ns tOES OE LOW to CAS HIGH Setup Time 5 5 5 5 ns tRCS Read Command Setup Time
(17, 20)
0— 0— 0— 0—ns
tRRH Read Command Hold Time 0 0 0 0 ns
(referenced to RAS)
(12)
tRCH Read Command Hold Time 0 0 0 0 ns
(referenced to CAS)
tWCH Write Command Hold Time
(12, 17, 21)
(17, 27)
5— 5— 8—10—ns
tWCR Write Command Hold Time 19 30 40 50 ns
(referenced to RAS)
tWP Write Command Pulse Width
(17)
(17)
5— 5— 8—10—ns
tWPZ WE Pulse Widths to Disable Outputs 10 10 10 10 ns tRWL Write Command to RAS Lead Time tCWL Write Command to CAS Lead Time tWCS Write Command Setup Time
(14, 17, 20)
(17) (17, 21)
7— 8— 14—15—ns
5— 8— 14—15—ns
0— 0— 0— 0—ns
tDHR Data-in Hold Time (referenced to RAS)19— 30— 40— 40— ns
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IS41C16256 IS41LV16256
AC CHARACTERISTICS (Continued)
(1,2,3,4,5,6)
(Recommended Operating Conditions unless otherwise noted.)
-25 -35 -50 -60
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Units
tACH Column-Address Setup Time to CAS 15 15 15 15 ns
Precharge during WRITE Cycle
OEH OE Hold Time from WE during 5 8 10 15 ns
t
READ-MODIFY-WRITE cycle tDS Data-In Setup Time tDH Data-In Hold Time
(15, 22)
(15, 22)
(18)
0— 0— 0— 0—ns
5— 6— 8— 10—ns tRWC READ-MODIFY-WRITE Cycle Time 65 80 125 140 ns t
RWD RAS to WE Delay Time during 35 4 5 70 80 ns
READ-MODIFY-WRITE Cycle tCWD CAS to WE Delay Time tAWD Column-Address to WE Delay Time
(14, 20)
(14)
(14)
17 25 34 36 ns 21 30 42 49 ns
tPC EDO Page Mode READ or WRITE 10 12 20 25 ns
Cycle Time
(24)
tRASP RAS Pulse Width in EDO Page Mode 25 100K 35 100K 50 100K 50 100K ns tCPA Access Time from CAS Precharge
(15)
—14 —21 —27 —34 ns
tPRWC EDO Page Mode READ-WRITE 32 40 47 56 ns
Cycle Time
(24)
tCOH Data Output Hold after CAS LOW 5— 5— 5— 5—ns tOFF Output Buffer Turn-Off Delay from 3 15 3 1 5 3 15 3 15 ns
CAS or RAS
(13,15,19, 29)
tWHZ Output Disable Delay from WE 3 15 3 15 3 15 3 15 ns tCLCH Last CAS going LOW to First CAS 10 10 10 10 ns
returning HIGH tCSR CAS Setup Time (CBR REFRESH) tCHR CAS Hold Time (CBR REFRESH)
(23)
(30, 20)
(30, 21)
5— 8— 10— 10—ns 7— 8— 10— 10—ns
tORD OE Setup Time prior to RAS during 0 0 0 0 ns
HIDDEN REFRESH Cycle tREF Refresh Period (512 Cycles) 8 8 8 8 ms tT Transition Time (Rise or Fall)
(2, 3)
1 50 1 50 1 50 1 50 ns
AC TEST CONDITIONS
Output load: Two TTL Loads and 50 pF (Vcc = 5.0V
One TTL Load and 50 pF (Vcc = 3.3V
Input timing reference levels: VIH = 2.4V, VIL = 0.8V (Vcc = 5.0V
VIH = 2.0V, VIL = 0.8V (Vcc = 3.3V
Output timing reference levels: VOH = 2.0V, VOL = 0.8V (Vcc = 5V
8 Integrated Circuit Solution Inc.
±±
±10%)
±±
±±
±10%)
±±
±±
±10%);
±±
±±
±10%)
±±
±±
±10%, 3.3V
±±
±±
±10%)
±±
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IS41C16256 IS41LV16256
Notes:
1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycle (RAS-Only or CBR) before proper device operation is assured. The eight RAS cycles wake-up should be repeated any time the t
2. V
IH (MIN) and VIL (MAX) are reference levels for measuring timing of input signals. Transition times, are measured between VIH
and VIL (or between VIL and VIH) and assume to be 1 ns for all inputs.
3. In addition to meeting the transition rate specification, all input signals must transit between V in a monotonic manner.
4. If CAS and RAS = V
5. If CAS = V
IL, data output may contain data from the last valid READ cycle.
IH, data output is High-Z.
6. Measured with a load equivalent to one TTL gate and 50 pF.
7. Assumes that t by the amount that t
8. Assumes that t
RCD tRCD (MAX). If tRCD is greater than the maximum recommended value shown in this table, tRAC will increase
RCD exceeds the value shown.
RCD tRCD (MAX).
9. If CAS is LOW at the falling edge of RAS, data out will be maintained from the previous cycle. To initiate a new cycle and clear the data output buffer, CAS and RAS must be pulsed for t
10. Operation with the t
RCD (MAX) limit ensures that tRAC (MAX) can be met. tRCD (MAX) is specified as a reference point only; if tRCD
CP.
is greater than the specified tRCD (MAX) limit, access time is controlled exclusively by tCAC.
11. Operation within the t
RAD (MAX) limit ensures that tRCD (MAX) can be met. tRAD (MAX) is specified as a reference point only; if tRAD
is greater than the specified tRAD (MAX) limit, access time is controlled exclusively by tAA.
12. Either t
13. t
14. t
RCH or tRRH must be satisfied for a READ cycle. OFF (MAX) defines the time at which the output achieves the open circuit condition; it is not a reference to VOH or VOL. WCS, tRWD, tAWD and tCWD are restrictive operating parameters in LATE WRITE and READ-MODIFY-WRITE cycle only. If tWCS tWCS
(MIN), the cycle is an EARLY WRITE cycle and the data output will remain open circuit throughout the entire cycle. If tRWD tRWD (MIN), tAWD tAWD (MIN) and tCWD tCWD (MIN), the cycle is a READ-WRITE cycle and the data output will contain data read from the selected cell. If neither of the above conditions is met, the state of I/O (at access time and until CAS and RAS or OE go back to V
IH) is indeterminate. OE held HIGH and WE taken LOW after CAS goes LOW result in a LATE WRITE (OE-controlled) cycle.
15. Output parameter (I/O) is referenced to corresponding CAS input, I/O0-I/O7 by LCAS and I/O8-I/O15 by UCAS.
16. During a READ cycle, if OE is LOW then taken HIGH before CAS goes HIGH, I/O goes open. If OE is tied permanently LOW, a LATE WRITE or READ-MODIFY-WRITE is not possible.
17. Write command is defined as WE going low.
18. LATE WRITE and READ-MODIFY-WRITE cycles must have both t
OD and tOEH met (OE HIGH during WRITE cycle) in order to ensure
that the output buffers will be open during the WRITE cycle. The I/Os will provide the previously written data if CAS remains LOW and OE is taken back to LOW after t
19. The I/Os are in open during READ cycles once t
OEH is met.
OD or tOFF occur.
20. The first χCAS edge to transition LOW.
21. The last χCAS edge to transition HIGH.
22. These parameters are referenced to CAS leading edge in EARLY WRITE cycles and WE leading edge in LATE WRITE or READ­MODIFY-WRITE cycles.
23. Last falling χCAS edge to first rising χCAS edge.
24. Last rising χCAS edge to next cycle’s last rising χCAS edge.
25. Last rising χCAS edge to first falling χCAS edge.
26. Each χCAS must meet minimum pulse width.
27. Last χCAS to go LOW.
28. I/Os controlled, regardless UCAS and LCAS.
29. The 3 ns minimum is a parameter guaranteed by design.
30. Enables on-chip refresh and address counters.
REF refresh requirement is exceeded.
IH and VIL (or between VIL and VIH)
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IS41C16256 IS41LV16256
READ CYCLE
UCAS-LCAS
RAS
t
CRP
t
ASR
t
RAH
t
RAD
t
RCD
t
ASC
t
RC
t
RAS
t
CSH
t
RSH
t
CAS
t
CLCH
t
AR
t
RAL
t
CAH
t
RRH
t
RP
ADDRESS
Row Column Row
t
RCS
WE
t
RAC
I/O
Open Open
OE
Note:
OFF is referenced from rising edge of RAS or CAS, whichever occurs last.
1. t
t
AA
t
CAC
t
CLC
t
RCH
(1)
t
OFF
Valid Data
t
OE
t
OES
t
OD
Undefined Don’t Care
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IS41C16256 IS41LV16256
EARLY WRITE CYCLE (OE = DON'T CARE)
RAS
t
UCAS/LCAS
CRP
t
ASR
t
t
RAD
RAH
t
RCD
t
ASC
t
RC
t
RAS
t
CSH
t
RSH
t
CAS
t
CLCH
t
AR
t
RAL
t
CAH
t
ACH
t
RP
ADDRESS
WE
I/O
Row Column Row
t
CWL
t
RWL
t
WCR
t
t
WP
t
DH
WCH
t
WCS
t
DHR
t
DS
Valid Data
Don’t Care
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IS41C16256 IS41LV16256
READ WRITE CYCLE (LATE WRITE and READ-MODIFY-WRITE Cycles)
t
RWC
t
RAS
RAS
t
CSH
t
t
CAS
UCAS-LCAS
t
CRP
t
ASR
t
RAH
t
RAD
t
RCD
t
ASC
t
AR
t
CAH
RSH
t
RAL
t
ACH
t
CLCH
t
RP
ADDRESS
WE
I/O
OE
Row Column Row
t
RWD
t
t
RCS
t
AA
t
RAC
t
CAC
t
CLZ
Open Open
t
OE
CWD
t
AWD
Valid D
t
OD
t
OUT
DS
Valid D
t
CWL
t
RWL
t
WP
t
DH
IN
t
OEH
Undefined Don’t Care
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IS41C16256 IS41LV16256
EDO-PAGE-MODE READ CYCLE
RAS
t
UCAS/LCAS
CRP
t
ASR
t
RAD
t
RCD
t
ASC
t
AR
t
CSH
t
CAS,
t
CLCH
t
CAH
t
ASC
t
t
CP
RASP
t
RP
(1)
t
PC
t
CAS,
t
CLCH
t
CAH
t
ASC
t
CP
t
CAS,
t
CLCH
t
RAL
t
t
CAH
RSH
t
CP
ADDRESS
Row Row
t
RAH
Column Column
t
RCS
Column
t
RCH
t
RRH
WE
t
I/O
AA
t
RAC
t
CAC
t
CLZ
Open Open
t
OE
t
OES
t t
Valid Data
CAC COH
t
AA
t
CPA
t
OEHC
t
CAC
t
CLZ
Valid Data
t
OD
t
AA
t
CPA
t
OES
Valid Data
t
OE
t
OFF
t
OD
OE
t
OEP
Undefined Don’t Care
Note:
1. tPC can be measured from falling edge of CAS to falling edge of CAS, or from rising edge of CAS to rising edge of CAS. Both
measurements must meet the t
PC specifications.
Integrated Circuit Solution Inc. 13
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IS41C16256 IS41LV16256
EDO-PAGE-MODE EARLY-WRITE CYCLE
RAS
t
CSH
t
UCAS/LCAS
CRP
t
ASR
t
RAD
t
RCD
t
ASC
t
AR
t
ACH
t
CAS,
t
CLCH
t
CAH
t
ASC
t
CP
t
RASP
t
RP
t
PC
t
CAS,
t
CLCH
t
ACH
t
CAH
t
ASC
t
CP
t t
t
ACH
t
RAL
t
RSH
CAS, CLCH
t
CAH
t
CP
ADDRESS
WE
I/O
OE
Row Row
t
RAH
Column Column
t
CWL
t
WCS
t
WCH
t
WP
t
WCR
t
DHR
t
DS
t
DH
Valid Data
t
DS
Column
t
CWL
t
WCS
t
WCH
t
WP
t
DH
Valid Data
t
DS
t
WCH
t
DH
Valid Data
t
CWL
t
WCS
t
WP
t
RWL
Don’t Care
14 Integrated Circuit Solution Inc.
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IS41C16256 IS41LV16256
EDO-PAGE-MODE READ-WRITE CYCLE (LATE WRITE and READ-MODIFY WRITE Cycles)
t
RASP
RAS
/ t
PRWC
t
CAS, tCLCH
t
CAH
t
AWD
t
CWD
(1)
t
CP
t
ASC
t
CWL
t
WP
t
AA
t
t
CAC
t
CLZ
CPA
t
DH
t
DS
DINDOUT
t
OD
t
OE
t
AWD
t
t
CWD
t
RSH
t
CAS, tCLCH
t
RAL
CAH
t
RWL
t
CWL
t
WP
t
DH
t
DS
DINDOUT
t
OD
t
OEH
UCAS/LCAS
ADDRESS
WE
I/O
OE
t
t
t
CAC
t
CLZ
CP
t
Column
t
AA
CPA
t
OE
PC
t
RWD RCS
t
t
ASC
RCD
t
CSH
t
CAS, tCLCH
t
AR
t
CAH
t
ASC
Column Column
t
CWL
t
WP
t
AWD
t
CWD
t
RAC
t
CAC
t
CLZ
AA
t
DH
t
DS
DINDOUT
t
t
OE
OD
t
CRP
t
ASR
t
RAH
t
RAD
Row Row
t t
Open Open
t
RP
t
CP
Undefined Don’t Care
Note:
PC in this diagram is for LATE write cycles only, tPC can be measured from falling edge of CAS to falling edge of CAS, or from
1. t
rising edge of CAS to rising edge of CAS. Both measurements must meet the t
PC specifications.
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IS41C16256 IS41LV16256
EDO-PAGE-MODE READ-EARLY-WRITE CYCLE (Psuedo READ-MODIFY WRITE)
t
RASP
RAS
t
CSH
t
PC
t
CAS
t
CAH
t
RCH
t
WHZ
Valid Data (B)
t
ASC
t
t
DS
CP
t
WCS
t
RSH
t
CAS
t
ACH
t
RAL
t
CAH
t
WCH
t
DH
D
IN
UCAS/LCAS
ADDRESS
WE
I/O
OE
t
t
t
CAH
PC
CAS
Valid Data (A)
t
ASC
t
CP
t
t
CPA
t
CAC
COH
Column (B)
t
AA
t
CRP
t
ASR
t
RAH
Row Row
t
RAD
t
RCD
t
AR
t
ASC
Column (A) Column (N)
t
RCS
t
AA
t
RAC
t
CAC
Open Open
t
OE
t
RP
t
CP
Don’t Care
16 Integrated Circuit Solution Inc.
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IS41C16256 IS41LV16256
AC WAVEFORMS
READ CYCLE (With WE-Controlled Disable)
RAS
tCRP
UCAS/LCAS
tRAD
tRAHtASR
tCSH
tRCD tCP
tAR
tASC
tCAS
tCAH tASC
ADDRESS
Row Column
tRCS
WE
tAA
tRAC
tCAC
tCLZ
I/O
Open Open
OE
RASRAS
RAS-ONLY REFRESH CYCLE (OE, WE = DON'T CARE)
RASRAS
t
RAS
tRCH
tWHZ
tRCStWPZ
tCLZ
Valid Data
tOE tOD
Undefined Don’t Care
t
RC
t
RP
Column
RAS
t
CRP
t
RPC
UCAS/LCAS
t
RAH
Open
Don’t Care
ADDRESS
I/O
t
ASR
Row Row
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IS41C16256 IS41LV16256
CBRCBR
CBR REFRESH CYCLE (Addresses; WE, OE = DON'T CARE)
CBRCBR
t
t
CSR
RAS
t
RPC
RAS
UCAS/LCAS
t
RPC
t
CP
t
RP
t
CHR
t
CSR
RAS
t
CHR
t
RP
t
I/O
HIDDEN REFRESH CYCLE
RAS
t
CRP
UCAS/LCAS
t
ASR
ADDRESS
I/O
(1)
(WE = HIGH; OE = LOW)
t
RAS
t
RCD
t
AR
t
RAD
t
RAH
t
ASC
t
RAL
Row Column
t
RAC
t
CLZ
Open Open
t
OE
t
AA
t
CAC
Open
t
CAH
t
RSH
t
ORD
t
t
RP
RAS
t
CHR
t
OFF
(2)
Valid Data
t
OD
OE
Undefined Don’t Care
Notes:
1. A Hidden Refresh may also be performed after a Write Cycle. In this case, WE = LOW and OE = HIGH.
OFF is referenced from rising edge of RAS or CAS, whichever occurs last.
2. t
18 Integrated Circuit Solution Inc.
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IS41C16256 IS41LV16256
ORDERING INFORMATION IS41C16256 Commercial Range: 0°C to 70°C
Speed (ns) Order Part No. Package
25 IS41C16256-25K 400mil SOJ
IS41C16256-25T 400mil TSOP-2
35 IS41C16256-35K 400mil SOJ
IS41C16256-35T 400mil TSOP-2
50 IS41C16256-50K 400mil SOJ
IS41C16256-50T 400mil TSOP-2
60 IS41C16256-60K 400mil SOJ
IS41C16256-60T 400mil TSOP-2
Industrial Range: -40°C to 85°C
Speed (ns) Order Part No. Package
25 IS41C16256-25KI 400mil SOJ
IS41C16256-25TI 400mil TSOP-2
35 IS41C16256-35KI 400mil SOJ
IS41C16256-35TI 400mil TSOP-2
50 IS41C16256-50KI 400mil SOJ
IS41C16256-50TI 400mil TSOP-2
60 IS41C16256-60KI 400mil SOJ
IS41C16256-60TI 400mil TSOP-2
ORDERING INFORMATION: IS41LV16256 Commercial Range: 0°C to 70°C
Speed (ns) Order Part No. Package
35 IS41LV16256-35K 400mil SOJ
IS41LV16256-35T 400mil TSOP-2
50 IS41LV16256-50K 400mil SOJ
IS41LV16256-50T 400mil TSOP-2
60 IS41LV16256-60K 400mil SOJ
IS41LV16256-60T 400mil TSOP-2
Industrial Range: -40°C to 85°C
Speed (ns) Order Part No. Package
35 IS41LV16256-35K 400mil SOJ
IS41LV16256-35T 400mil TSOP-2
50 IS41LV16256-50KI 400mil SOJ
IS41LV16256-50TI 400mil TSOP-2
60 IS41LV16256-60KI 400mil SOJ
IS41LV16256-60TI 400mil TSOP-2
Integrated Circuit Solution Inc. 19
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IS41C16256 IS41LV16256
Integrated Circuit Solution Inc.
HEADQUARTER:
NO.2, TECHNOLOGY RD. V, SCIENCE-BASED INDUSTRIAL PARK,
HSIN-CHU, TAIWAN, R.O.C.
TEL: 886-3-5780333
Fax: 886-3-5783000
BRANCH OFFICE:
7F, NO. 106, SEC. 1, HSIN-TAI 5TH ROAD,
HSICHIH TAIPEI COUNTY, TAIWAN, R.O.C.
TEL: 886-2-26962140
FAX: 886-2-26962252
http://www.icsi.com.tw
20 Integrated Circuit Solution Inc.
DR001-0E 01/25/2002
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