查询ICS2309供应商
ICS2309
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
Description
The ICS2309 is a low phase noise, high-speed PLL
based, low-skew zero delay buffer. Based on ICS’
proprietary low jitter Phase Locked Loop (PLL)
techniques, the device provides eight low skew outputs
at speeds up to 133 MHz at 3.3 V. The outputs can be
generated from the PLL (for zero delay), or directly
from the input (for testing), and can be set to tri-state
mode or to stop at a low level. The PLL feedback is
on-chip and is obtained from the CLKOUT pad.
The ICS2309 is available in two different versions. The
ICS2309-1 is the base part. The ICS2309-1H is a high
drive version with faster rise and fall times.
Block Diagram
VDD
2
Features
• Clock outputs from 10 to 133 MHz
• Zero input-output delay
• Eight low skew (<250 ps) outputs
• Device-to-device skew <700 ps
• Full CMOS outputs with 25 mA output drive
capability at TTL levels
• 5 V tolerant CLKIN
• Tri-state mode for board-level testing
• Advanced, low power, sub-micron CMOS process
• Operating voltage of 3.3 V
• Industrial temperature range available
• Packaged in 16-pin SOIC and TSSOP (-1H version
only)
• Pb (lead) free package available for -1H version
(16-pin TSSOP only)
CLKIN
S2, S1
MDS 2309 D 1 Revision 052405
2
PLL
Control
Logic
GND
0
CLKOUT
1
CLKA1
CLKA2
CLKA3
CLKA4
CLKB1
CLKB2
CLKB3
CLKB4
2
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
Pin Assignment
ICS2309
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
CLKIN
CLKA1
CLKA2
VDD
GND
CLKB1
CLKB2
S2
1
2
3
4
5
6
7
8
16 pin narrow (150 mil) SOIC
16
15
14
13
12
11
10
CLKOUT
CLKA4
CLKA3
VDD
GND
CLKB4
CLKB3
S1
9
Output Clock Mode Select Table
S2 S1 CLKA1:A4 CLKB1:B4 A & B Source PLL Status
0 0 Tri-state (note 1) Tri-state (note 1) PLL OFF
0 1 Running Tri-state (note 1) PLL ON
1 0 Running Running CLKIN (note 2) OFF
1 1 Running Running PLL ON
Note 1. Outputs are in high impedance state
Note 2. Buffer mode only; not zero delay between input and output
Pin Descriptions
Pin
Number
1 CLKIN Input Clock input (5 V tolerant).
2 - 3 CLKA1:A4 Output Clock outputs A1:A4. See table above.
4 VDD Power Power supply. Connect to 3.3 V.
5 GND Power Connect to ground.
6 - 7 CLKB1:B4 Output Clock outputs B1:B4. See table above.
8 S2 Input Select input 2. See table above. Internal pull-up.
9 S1 Input Select input 1. See table above. Internal pull-up.
10 - 11 CLKB1:B4 Output Clock outputs B1:B4. See table above.
12 GND Power Connect to ground.
13 VDD Power Power supply. Connect to 3.3 V.
14 - 15 CLKA1:A4 Output Clock outputs A1:A4. See table above.
16 CLKOUT Input Buffered output. Internall feedback on this pin.
MDS 2309 D 2 Revision 052405
Pin
Name
Pin Type Pin Description
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
External Components
The ICS2309 requires a minimum number of external components for proper operation. Decoupling
capacitors of 0.01 mF should be connected between VDD and GND on pins 4 and 5, and VDD and GND
on pins 13 and 12, as close to the device as possible. A series termination resistor of 33Ω may be used to
each clock output pin to reduce reflections.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS2309. These ratings,
which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of
the device at these or any other conditions above those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can
affect product reliability. Electrical parameters are guaranteed only over the recommended operating
temperature range.
Item Rating
Supply Voltage, VDD 7 V
All Inputs and Outputs -0.5 V to VDD+0.5 V
CLKIN and FBIN inputs -0.5 V to 5.5 V
Electrostatic Discharge (HBM) 2000 V
Ambient Operating Temperature (Commercial) 0 to +70°C
Ambient Operating Temperature (Industrial) -40 to +85°C
Storage Temperature -65 to +150°C
Junction Temperature 150°C
Soldering Temperature 260°C
ICS2309
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
Recommended Operation Conditions
Parameter Min. Typ. Max. Units
Ambient Operating Temperature (Industrial) -40 +85 °C
Ambient Operating Temperature (Commercial) 0 +70 °C
Power Supply Voltage (measured in respect to GND) +3.0 +3.6 V
MDS 2309 D 3 Revision 052405
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
DC Electrical Characteristics
ICS2309M-1, VDD = 3.3 V ±10%, Ambient Temperature -40 to +85°C(Industrial), (0-70°C Commercial)
Parameter Symbol Conditions Min. Typ. Max. Units
Operating Voltage VDD 3.0 3.6 V
Input High Voltage V
Input Low Voltage V
Input Low Current I
Input High Current I
Output High Voltage V
Output Low Voltage V
Operating Supply Current IDD No Load 32 mA
Power Down Supply
Current
Short Circuit Current I
Input Capacitance C
Note 1: When there is no clock signal present at CLKIN, the ICS2309 will enter power down mode. The
PLL is stopped and the outputs are tri-state.
IL
IH
OH
OL
OS
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
IH
IL
2V
VIN = 0V 50 µA
VIN = VDD 100 µA
I
= -12 mA 2.4 V
OH
I
= 12 mA 0.4 V
OL
CLKIN = 0, Note 1 12 µA
Each output ±50 mA
S2, S1, CLKIN 5 pF
IN
ICS2309
0.8 V
AC Electrical Characteristics
ICS2309M-1, VDD=3.3 V ±10%, Ambient temperature -40 to +85°C(Industrial), (0-70°C Commercial),
Parameter Symbol Conditions Min. Typ. Max. Units
Output Clock Frequency f
Output Clock Frequency 30 pF load, See table on page 2 10 100 MHz
Output Rise Time t
Output Fall Time t
Output Clock Duty Cycle t
Output Clock Duty Cycle t
Device to Device Skew rising edges at VDD/2 700 ps
Output to Output Skew rising edges at VDD/2 250 ps
Input to Output Skew rising edges at VDD/2 ±350 ns
Input to Output Skew rising edges at VDD/2, S2= 1,
Cycle to Cycle Jitter measured at 66.67M, outputs
PLL Lock Time Note 2 1.0 ms
Note 2: With VDD at a steady rate and valid input at CLKIN
IN
OR
OF
DC
DC
10 pF load, See table on page 2 10 133 MHz
0.8 to 2.0 V, outputs loaded 2.5 ns
2.0 to 0.8 V, outputs loaded 2.5 ns
measured at 1.4V, Fout=66.67
40 50 60 %
MHz
measured at 1.4V, Fout=50
45 50 55 %
MHz
158.7ns
S1 = 0
200 ps
loaded
MDS 2309 D 4 Revision 052405
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
ICS2309
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
ICS2309M-1H, VDD=3.3 V ±10%, Ambient temperature -40 to +85°C(Industrial), (0-70°C Commercial),
Parameter Symbol Conditions Min. Typ. Max. Units
Output Clock Frequency f
IN
Output Clock Frequency 30 pF load, See table on page 2 10 100 MHz
Output Rise Time t
Output Fall Time t
Output Clock Duty Cycle t
Output Clock Duty Cycle t
OR
OF
DC
DC
Device to Device Skew rising edges at VDD/2 700 ps
Output to Output Skew rising edges at VDD/2 250 ps
Input to Output Skew rising edges at VDD/2 ±350 ps
Input to Output Skew rising edges at VDD/2, S2= 1,
Cycle to Cycle Jitter measured at 66.67M, outputs
PLL Lock Time Note 3 1.0 ms
10 pF load, See table on page 2 10 133 MHz
0.8 to 2.0 V, outputs loaded 1.5 ns
2.0 to 0.8 V, outputs loaded 1.5 ns
measured at 1.4V, Fout=66.67
40 50 60 %
MHz
measured at 1.4V, Fout=50
45 50 55 %
MHz
158.7ns
S1 = 0
200 ps
loaded
Note 3: With VDD at a steady rate and valid input at CLKIN
MDS 2309 D 5 Revision 052405
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
ICS2309
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
Package Outline and Package Dimensions (16-pin TSSOP, 4.40 mm Body, 0.65 mm Pitch)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters Inches
INDEX
AREA
16
1 2
Symbol Min Max Min Max
A -- 1.20 -- 0.047
A1 0.05 0.15 0.002 0.006
E1
E
A2 0.80 1.05 0.032 0.041
b 0.19 0.30 0.007 0.012
C 0.09 0.20 0.0035 0.008
D 4.90 5.1 0.193 0.201
E 6.40 BASIC 0.252 BASIC
E1 4.30 4.50 0.169 0.177
e 0.65 Basic 0.0256 Basic
D
L 0.45 0.75 0.018 0.030
α 0° 8° 0° 8°
A
2
e
b
A
A
1
.10 (.004)
- C -
SEATING
PLANE
C
Thermal Characteristics for 16TSSOP
Parameter Symbol Conditions Min. Typ. Max. Units
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to Case θ
θ
JA
θ
JA
θ
JA
JC
c
L
Still air 78 °C/W
1 m/s air flow 70 °C/W
3 m/s air flow 68 °C/W
37 °C/W
MDS 2309 D 6 Revision 052405
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters Inches
ICS2309
16
E
A1
H
A
- C -
SEATING
PLANE
.10 (.004)
C
INDEX
AREA
1 2
D
e
B
Thermal Characteristics for 16SOIC
Symbol Min Max Min Max
A 1.35 1.75 .0532 .0688
A1 0.10 0.25 .0040 .0098
B 0.330.51.013.020
C 0.19 0.25 .0075 .0098
D 9.80 10.00 .3859 .3937
E 3.80 4.00 .1497 .1574
e 1.27 BASIC 0.050 BASIC
H 5.80 6.20 .2284 .2440
h 0.250.50.010.020
L 0.401.27.016.050
α 0° 8° 0° 8°
h x 45
C
L
Parameter Symbol Conditions Min. Typ. Max. Units
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to Case θ
MDS 2309 D 7 Revision 052405
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
θ
JA
θ
JA
θ
JA
JC
Still air 120 °C/W
1 m/s air flow 115 °C/W
3 m/s air flow 105 °C/W
58 °C/W
ICS2309
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
Ordering Information
Part / Order Number Marking Shipping Packaging Package Temperature
ICS2309MI-1 ICS2309MI-1 Tubes 16-pin SOIC -40 to +85° C
ICS2309MI-1T ICS2309MI-1 Tape and Reel 16-pin SOIC -40 to +85° C
ICS2309M-1 ICS2309M-1 Tubes 16-pin SOIC 0 to +70° C
ICS2309M-1T ICS2309M-1 Tape and Reel 16-pin SOIC 0 to +70° C
ICS2309MI-1H ICS2309MI-1H Tubes 16-pin SOIC -40 to +85° C
ICS2309MI-1HT ICS2309MI-1H Tape and Reel 16-pin SOIC -40 to +85° C
ICS2309M-1H ICS2309M-1H Tubes 16-pin SOIC 0 to +70° C
ICS2309M-1HT ICS2309M-1H Tape and Reel 16-pin SOIC 0 to +70° C
ICS2309GI-1H 2309GI1H Tubes 16-pin TSSOP -40 to +85° C
ICS2309GI-1HT 2309GI1H Tape and Reel 16-pin TSSOP -40 to +85° C
ICS2309GI-1HLF 309GI1HL Tubes 16-pin TSSOP -40 to +85° C
ICS2309GI-1HLFT 309GI1HL Tape and Reel 16-pin TSSOP -40 to +85° C
ICS2309G-1H 2309G-1H Tubes 16-pin TSSOP 0 to +70° C
ICS2309G-1HT 2309G-1H Tape and Reel 16-pin TSSOP 0 to +70° C
ICS2309G-1HLF 2309G1HL Tubes 16-pin TSSOP 0 to +70° C
ICS2309G-1HLFT 2309G1HL Tape and Reel 16-pin TSSOP 0 to +70° C
Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS) assumes no
responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other
circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as
those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without
additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant
any ICS product for use in life support devices or critical medical instruments.
MDS 2309 D 8 Revision 052405
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
Revision History
Rev. Originator Date Description of Change
A P. Griffith 12/01/04 New device/datasheet; Prelminary.
B P. Griffith 12/27/04 Add TSSOP package. Made corrections to IDD, IDDP, input capacitance and duty cycle
specs/test conditions. Removed jitter specs for CL=15 pF. Added I/O skew spec for
bypass mode and duty cycle spec for Fout=50 MHz.
C P. Griffith 1/25/05 Made corrections to test conditions for output rise time, fall time, duty cycle and
cycle-to-cycle jitter. Moved from Preliminary to Final.
D P. Griffith 5/24/05 Added LF ordering info to 16-pin TSSOP (-1H version only); added Thermal Chars for
16-pin TSSOP package
ICS2309
MDS 2309 D 9 Revision 052405
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
Loading...