IBM zEnterprise EC12 Installation Manual

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zEnterprise EC12

Installation Manual for Physical Planning 2827 All Models

GC28-6914-01

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Level 01f

zEnterprise EC12

Installation Manual for Physical Planning 2827 All Models

GC28-6914-01

Note:

Level 01f

Before using this information and the product it supports, read the information in “Safety” on page v, Appendix G, “Notices,” on page 147, and IBM Systems Environmental Notices and User Guide, Z125–5823.

This edition, GC28-6914-01, applies to the IBM zEnterprise EC12 (zEC12). This edition replaces GC28-6914-00. There may be a newer version of this document in a PDF file available on Resource Link.Goto

http://www.ibm.com/servers/resourcelink and click Library on the navigation bar. A newer version is indicated by a lowercase, alphabetic letter following the form number suffix (for example: 00a, 00b, 01a, 01b).

US Government Users Restricted Rights – Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp.

Level 01f

Safety ...............v

Safety notices ..............v

Danger notices ............v

World trade safety information .......v

Laser safety information ..........v

Laser compliance ............v

About this publication ........vii

Revisions ...............vii

Related publications ...........vii

Licensed Machine Code ..........viii

Accessibility ..............viii

Accessibility features ..........viii

Keyboard navigation ..........viii

IBM and accessibility ..........viii

How to send your comments ........ix

Summary of changes .........xi

Chapter 1. Introduction ........1

System planning .............1

Planning for a new computer room.......1

Planning checklist ............2

Customized planning aid ..........6

ASHRAE declarations - radiator-cooled .....7

ASHRAE declarations - water-cooled ......9

Chapter 4. Guide for raised floor

preparation .............59

Casters ................60

Procedure for cutting and placement of floor panels 61

Raised floor with 610 mm (24 in) or 600 mm

(23.5 in) floor panels ..........62

Chapter 5. Power requirements ....65

Power installation considerations .......66

I/O units ...............67

Line cord/bulk power regulator (BPR) specifications 68

Power specifications ...........70

Power estimation tool ...........72

Power capping .............72

Customer circuit breakers (CBs) .......73

Internal battery feature (FC 3213) .......74

Unit emergency power off (UEPO) .....75

Computer room emergency power off (EPO) . . 76

Power plugs and receptacles.........77

Grounding specifications ..........80

Top exit power cords ...........81

Line cord wire specifications.........83

Wire colors for cut-end three-phase alternating

current cords .............85

Wire colors for cut-end direct current cords. . . 85

Line physical protection .........85

Service outlet (customer-supplied) .......85

Chapter 2. Environmental

specifications ............11

Conductive contamination .........15

Chapter 3. Models and physical

specifications............17

Physical dimensions ...........19

Shipping specifications .........20

zEnterprise zEC12 models ........22

I/O cages, I/O drawers, and PCIe I/O drawers 28

System upgrades ...........29

Differences between IBM servers .......30

Plan views...............31

Weight distribution ............33

System weight examples .........37

Weight distribution and multiple systems . . . 38

Machine and service clearance areas ......40

Cooling recommendations for the room .....42

Special cooling recommendations for water-cooled

machine ...............48

Water supply .............48

Supply hoses .............48

Materials used in the water cooling units . . . 53

Water specifications...........54

Considerations for multiple system installations . . 57

Chapter 6. Hardware Management Console and Support Element

communications ..........87

Support Element .............87

Hardware Management Console .......87

Ethernet LAN switch support ........88

Ethernet network connection requirements ....88

Hardware Management Console and Support

Element wiring options ..........90

Trusted Key Entry (TKE) ..........90

LAN connections ...........91

Planning for an ensemble..........92

Chapter 7. Remote Support Facility

(RSF) installation planning ......93

Choosing a communications method for remote

support................93

Using the internet for remote support ....93

Server address lists and host names .....94

Chapter 8. I/O cabling and connectivity 95

Top exit I/O cabling ...........95

IBM Site and Facilities Services ........97

Customer fiber optic cabling responsibilities . . . 98

FICON channel features ..........99

Configuration information ........99

FICON references ...........101

Level 01f

ISC-3 link feature ............102

Configuration information ........102

OSA-Express features...........104

Configuration information ........104

OSA-Express references .........108

I/O interconnect links ..........108

InfiniBand fiber optic link features ......109

Flash Express (FC 0402) ..........110

Native PCIe adapters ...........110

10GbE RoCE Express (FC 0411) ......111

zEnterprise Data Compression (zEDC) Express

(FC 0420) ..............111

Time synchronization...........113

Server Time Protocol (STP) ........113

Pulse per second ...........113

Connectivity information ........113

PPS/FSP location ...........113

Ordering PPS cables ..........114

Fiber Quick Connect (FQC) for FICON cabling . . 115

Preparing configuration definitions .....119

Chapter 9. Parallel sysplex planning 121

Appendix A. IBM standard symbols 125

Relevant international standards .......131

Appendix D. 3-phase dual power

installation ............133

Appendix E. Balancing power panel

loads ...............139

Appendix F. Frame tie-down .....141

Raised floor frame tie-down ........142

Installing the eyebolts .........142

Nonraised floor frame tie-down .......145

Appendix G. Notices ........147

Trademarks ..............148

Class A Notices.............148

Appendix B. Hardware Management Console physical specifications . . . 127

Appendix C. Acoustics .......131

Acoustical noise emission levels .......131

iv zEC12 IMPP

Safety

Level 01f

Safety notices

Safety notices may be printed throughout this guide. DANGER notices warn you of conditions or procedures that can result in death or severe personal injury. CAUTION notices warn you of conditions or procedures that can cause personal injury that is neither lethal nor extremely hazardous. Attention notices warn you of conditions or procedures that can cause damage to machines, equipment, or programs.

Danger notices

DANGER: Heavy equipment — personal injury or equipment damage might result if mishandled.

(D006)

World trade safety information

Several countries require the safety information contained in product publications to be presented in their translation. If this requirement applies to your country, a safety information booklet is included in the publications package shipped with the product. The booklet contains the translated safety information with references to the US English source. Before using a US English publication to install, operate, or service this IBM Systems Safety Notices, G229-9054. You should also refer to the booklet any time you do not clearly understand any safety information in the US English publications.

product, you must first become familiar with the related safety information in the

Laser safety information

All System z®models can use I/O cards such as FICON®, Open Systems Adapter (OSA), InterSystem Channel-3 (ISC-3), or other I/O features which are fiber optic based and utilize lasers (short wavelength or long wavelength lasers).

Laser compliance

All lasers are certified in the US to conform to the requirements of DHHS 21 CFR Subchapter J for Class 1 or Class 1M laser products. Outside the US, they are certified to be in compliance with IEC 60825 as a Class 1 or Class 1M laser product. Consult the label on each part for laser certification numbers and approval information.

CAUTION: Data processing environments can contain equipment transmitting on system links with laser modules that operate at greater than Class 1 power levels. For this reason, never look into the end of an optical fiber cable or open receptacle. (C027)

CAUTION: This product contains a Class 1M laser. Do not view directly with optical instruments. (C028)

Level 01f

vi zEC12 IMPP

About this publication

Level 01f

This publication contains information necessary for planning the physical installation of the IBM zEnterprise

Figures included in this document illustrate concepts and are not necessarily accurate in content, appearance, or specific behavior.

v Chapter 1, “Introduction,” on page 1 provides an introduction to planning for your system and a

planning checklist.

v Chapter 2, “Environmental specifications,” on page 11 contains important computer room

environmental information.

v Chapter 3, “Models and physical specifications,” on page 17 gives plan views, service clearances,

weight distribution, and cooling information for the system.

v Chapter 4, “Guide for raised floor preparation,” on page 59 contains information on preparation of the

raised floor.

v Chapter 5, “Power requirements,” on page 65 provides power and internal battery feature information. v Chapter 6, “Hardware Management Console and Support Element communications,” on page 87

includes information on hardware management console and support element communications.

v Chapter 7, “Remote Support Facility (RSF) installation planning,” on page 93 contains Remote Support

Facility installation planning.

v Chapter 8, “I/O cabling and connectivity,” on page 95 discusses cable connectivity information. v Chapter 9, “Parallel sysplex planning,” on page 121 provides information to build a Parallel Sysplex v The Appendices provide IBM standard symbols, environmental specifications, acoustics, power

installation and power loads, a sample cabling schematic and upgrade paths.

EC12 (zEC12).

Revisions

A technical change to the text is indicated by a vertical line to the left of the change.

Related publications

IBM publications that you will find helpful and that you should use along with this publication are in the following list. You can access these books from Resource Link®at http://www.ibm.com/servers/resourcelink, and click Library from the navigation bar on the left. Then select the server product.

v Systems Safety Notices, G229-9054 v IBM Systems Environmental Notices and User Guide, Z125-5823 v zEnterprise EC12 Installation Manual, GC28-6913 v System z Planning for Fiber Optic Links (FICON/FCP, Coupling Links, and Open System Adapters),

GA23-1406

v System z FICON Channel-to-Channel Reference, SB10-7157 v Open System Adapter-Express Integrated Console Controller User’s Guide , SA22-7990

v zEnterprise, System z10, System z9 and zSeries Open Systems Adapter-Express Customer's Guide and

Reference, SA22-7935

In addition to these references, there is also general computer room planning information on IBM's Resource Link (http://www.ibm.com/servers/resourcelink).

Licensed Machine Code

Level 01f

Licensed Machine Code is provided in accordance with the terms and conditions of the applicable IBM Customer Agreement or other applicable written agreement between the customer and IBM.

Licensed Machine Code (LMC) is a fundamental component of the zEC12 and is copyrighted and licensed by IBM. Each zEC12 is delivered with Licensed Machine Code that is customized to the specific machine ordered. The Licensed Machine Code enables the server to operate in accordance with its Official Published Specifications.

Model upgrades, feature additions, and system engineering changes may require updated Licensed Machine Code for the system. Updated Licensed Machine Code replaces the existing Licensed Machine Code.

Relocation of a zEC12 requires that the Licensed Machine Code be reinstalled in the server at the new location. Refer to the “Discontinuing the System” section of the zEnterprise EC12 Installation Manual for the procedure for relocating a zEC12.

Accessibility

IBM strives to provide products with usable access for everyone, regardless of age or ability.

Accessible publications for this product are offered in HTML format and can be downloaded from Resource Link at http://www.ibm.com/servers/resourcelink.

If you experience any difficulty with the accessibility of any System z information, go to Resource Link at http://www.ibm.com/servers/resourcelink and click Feedback from the navigation bar on the left. In the

Comments input area, state your question or comment, the publication title and number, choose General comment as the category and click Submit. You can also send an email to reslink@us.ibm.com providing

the same information.

When you send information to IBM, you grant IBM a nonexclusive right to use or distribute the information in any way it believes appropriate without incurring any obligation to you.

Accessibility features

The following list includes the major accessibility features in System z documentation:

v Keyboard-only operation v Interfaces that are commonly used by screen readers v Customizable display attributes such as color, contrast, and font size v Communication of information independent of color v Interfaces commonly used by screen magnifiers v Interfaces that are free of flashing lights that could induce seizures due to photosensitivity

Keyboard navigation

This product uses standard Microsoft Windows navigation keys.

IBM and accessibility

See the IBM Human Ability and Accessibility Center for more information about the commitment that IBM has to accessibility.

viii zEC12 IMPP

How to send your comments

Level 01f

Your feedback is important in helping to provide the most accurate and high-quality information. Send your comments by using Resource Link at http://www.ibm.com/servers/resourcelink. Click Feedback on the navigation bar on the left. You can also send an email to reslink@us.ibm.com. Be sure to include the name of the book, the form number of the book, the version of the book, if applicable, and the specific location of the text you are commenting on (for example, a page number, table number, or a heading).

About this publication ix

Level 01f

x zEC12 IMPP

Summary of changes

Level 01f

Summary of changes for the zEnterprise EC12 Installation Manual for Physical Planning, GC28-6914.

Table 1. Summary of changes

Release Level Date Changes in Level

01f 10/2014 This revision contains editorial changes and the following technical changes:

v Updated the weight values on pages 7-10, 20, 30, 33, and 37.

01e 06/2014 This revision contains editorial changes and the following technical changes:

v Updated the height of the top exit I/O cable towers to include the optional

cable management brackets

v Updated the weight of the top exit I/O cable towers v Updated the location of the installed Fiber Quick Connection mounting

brackets.

01d 04/2014 This revision contains editorial changes and the following technical changes:

v Added a note to “Procedure for cutting and placement of floor panels” on

page 61.

01c 01/2014 This revision contains editorial changes and the following technical changes:

v Corrected the host name URL. See“Host names” on page 94.

01b 01/2014 This revision contains editorial changes and the following technical changes:

v Updated the watertight receptacle information for the 415 VAC power cords.

See Table 32 on page 78 in “Power plugs and receptacles” on page 77.

01a 10/2013 This revision contains editorial changes and the following technical changes:

v In Chapter 5, “Power requirements,” on page 65, added information about

not allowing a mix of AC and DC power and reorganized information.

01 07/2013 This revision contains editorial changes and the following technical changes:

v Updated environmental specifications information v Added information about the 9" minimum requirement for a raised floor for

the zEC12 water-cooled models

v Added IFP (Integrated Firmware Processor) information v Added HMC 7382 (FC 0092) information v Added TKE 7.3 (FC 0842) information v Added OSA-Express5S information v Updated the Remote Support Facility (RSF) information v Added Flash Express (FC 0402), 10GbE RoCE Express (FC 0411), and zEDC

Express (FC 0420) information

v Updated Appendix D, “3-phase dual power installation,” on page 133.

00e 03/2013 This revision contains editorial changes and the following technical changes:

v Added information about customer cabling responsibilities. See “Customer

fiber optic cabling responsibilities” on page 98

00d 01/2013 This revision contains editorial changes and the following technical changes:

v Corrected information about the frame tie-down feature codes. See

Appendix F, “Frame tie-down,” on page 141.

00c 12/2012 This revision contains editorial changes and the following technical changes:

v Added information about Ethernet switch 1 Gb speed in sections “Hardware

Management Console” on page 87 and “Ethernet LAN switch support” on page 88.

Table 1. Summary of changes (continued)

Level 01f

Release Level Date Changes in Level

00b 10/2012 This revision contains editorial changes and the following technical changes:

v Changed the order number for the System z Planning for Fiber Optic Links

(FICON/FCP, Coupling Links, and Open System Adapters) document from

GA23-1353 to GA23-1406.

v Added relative humidity information to Table 2 on page 12. v Updated the BTA information in “Water specifications” on page 54. v Removed feature codes 4022, 4024, 4025, and 4026 from the Table 19 on page

67.

00a 09/2012 This revision contains editorial changes and the following technical changes:

v In the “Weight distribution” on page 33 section:

– Updated the weight values in Table 7 on page 33 and Table 8 on page 33. – Updated the floor loading data in four tables.

v In the “System weight examples” on page 37 section, updated the values in

Table 9 on page 37.

v In the “Customer circuit breakers (CBs)” on page 73 section, corrected the

circuit breaker value for 380-415 VAC.

v In the “Power plugs and receptacles” on page 77 section, added supported

power cord feature codes to the table.

xii zEC12 IMPP

Chapter 1. Introduction

Level 01f

This chapter is intended to help you prepare your physical site for the installation of a zEC12. Marketing and installation planning representatives are also available to help you with installation planning. Proper planning for your new system will facilitate a smooth installation and fast system startup.

The use of the terms, “server”, “processor”, “system” and “all models” in this publication refer to the IBM zEC12.

System planning

As part of your system planning activity, you will make decisions about where to locate your equipment, who will operate the system, and so on. A good plan ensures that the equipment and materials are ready to use when the zEC12 arrives.

The type of software (operating system and application programs) that you intend to use must support the features and devices on the system. You should already be familiar with your software requirements, but may want to contact your IBM marketing representative for information on planning for the software.

Planning for a new computer room

A detailed step-by-step procedure for physically planning a computer room installation is located on the General Information for Planning a Physical Site page on Resource Link (http://www.ibm.com/ servers/resourcelink). On the left navigation pane, click Planning, Physical Planning, and General

information for planning a physical site (located under zSeries & S/390

Planning checklist

Level 01f

The following checklist identifies installation tasks and responsibilities sequentially, and is designed for new installations. If you have to renovate your site, you may need a longer planning cycle.

Site Preparation Checklist

Task/Consideration Task Assigned Target Date Completed

CHECKPOINT 1

Designate a person in your organization with the responsibility

for all phases of site preparation for this system installation Review all site planning information with the designated person Determine who will actually perform each site preparation task

and who will control the marking of this checklist Identify communication needs, including Remote Support Facility

cables, switches, telephones, connection panels, etc In the Chapter titled, “I/O cabling and connectivity” (in this document)

read the information about planning now for future cabling needs.

In the same chapter, also read “IBM Site and Facilities Services” Identify channel needs including

cables, directors, switches, patch panels, etc Identify other machine/device needs including:

changes to any existing equipment Determine the schedule with your IBM marketing representative

and fill in the target dates on this checklist

CHECKPOINT 2

Lay out the floor plan. Include stationary obstacles, walls, all computer

equipment, locations for power, lighting, heating and cooling, water and

fire detection and extinguishing equipment If the level of acoustical noise is a concern, consider arranging the floor layout to

avoid areas of excessive noise exposure to employees, and possibly utilize noise

control screens or other treatments to reduce noise levels. Some IBM servers

have available acoustic doors to reduce noise. Check with your marketing

representative to see if your server has such options. If this is a new computer room, see the course,

for planning the physical site

on Resource Link ( ) Order

communication equipment cables, modems, switches,

telephones, connection panels, etc Order channel equipment cables, directors, switches, patch panels, etc.

In the Chapter titled, “I/O cabling and Connectivity” (in this document)

read the information about “IBM Site and Facilities Services”

and “Customer fiber optic cabling responsibilities” to

determine your cabling requirements and responsibilities. Your IBM

marketing representative can assist you with this task. Other parts

of this chapter include fiber optic channel and adapter descriptions

and information about the Fiber Quick Connect feature for FICON

channels. If you are planning for a system that will use FICON channels,

InfiniBand, coupling links, or Open System Adapters (OSA),

contact your IBM marketing representative to obtain the document,

System z Planning for Fiber Optic Links (FICON/FCP, Coupling Links,

and Open System Adapters)

Order other machines/devices, including changes to any existing

equipment

http://www.ibm.com/servers/resourcelink

General information

under “Planning / Physical Planning / zSeries”

, GA23-1406

( )

2 zEC12 IMPP

Site Preparation Checklist

Level 01f

Task/Consideration Task Assigned Target Date Completed

CHECKPOINT 3

The c

omputer room is prepared for computer equipment service clearance and floor loading, physical placement based on logical priority, cabling restrictions, and shock and vibration considerations, and electromagnetic compatibility/interference

Emergency and backup operations planning includes provisions for

fire detection, prevention, extinguishing, and control equipment, and storm protection and damage recovery procedures

There is workspace around equipment, including passageways for

movement of people and machines, and includes consideration for lighting and possible areas of high acoustic noise

Office equipment and space, including furniture, vending, meeting, and

entrance/exit areas have adequate lighting, heating/cooling, and acoustics

Material and data storage provisions have been satisfied Schedule and make changes to existing programs as required Schedule and make changes to existing machines/devices as required Arrange for installation of cables between work stations, controllers,

modems, switches, etc

Arrange for installation of new power receptacles and wiring Define a training program for employees

CHECKPOINT 4

Computer room power should be completed.

electrically clean, dedicated circuits for all computer equipment sufficient power provided to avoid outages caused by power transients protection from lightning damage

Backup power batteries or generators, if required Branch circuits, grounding, conduits, phase rotation, emergency controls,

to local electrical code and equipment guidelines

An adequate number of computer equipment and convenience outlets have

been provided in the locations where they are to be used

Computer room personnel are adequately trained in power procedures,

including emergency situations

Review the progress of the communications, channel, and adapter

cabling. Identify and resolve problems and schedule conflicts

Review the system configuration to make sure there are no physical

problems and that the configuration meets your needs.

( )

Chapter 1. Introduction 3

Site Preparation Checklist

Level 01f

Task/Consideration Task Assigned Target Date Completed

CHECKPOINT 5

Air conditioning installation is complete

capacity and controls provided for automatic temperature and humidity levels filtration system is adequate and maintenance plan established

regular monitoring and testing Training for computer room personnel If you have elected to do your own I/O cabling, as cables begin to

arrive, start installing and labeling them. Label power receptacles

as they are installed Complete the Systems Assurance Product Review with your IBM

marketing representative or Business Partner and the system installers Carefully measure the delivery path from the shipper drop-off point

to the raised floor install location. Accurate measurements now may

prevent installation delays later

CHECKPOINT 6

Complete communication equipment installation,

cables, modems, switches, telephones, connection panels, etc

Complete the Remote Support Facility installation

LAN and communication cables, switches, patch panels, etc

Prepare IOCP input statements or HCD definitions Use the CHPID Mapping Tool on Resource Link to help assign

PCHIDs to CHPIDs

If you have elected to do your own I/O cabling, complete the checkout

of system cables as much as possible. Verify that the cables are

properly routed, protective end caps are in place, that the processor

ends of the cables are safely out of the way for system installation,

and that cable safety procedures are followed

Complete the checkout of the power cables. Test for continuity and

polarity, proper grounding, correct phase wiring, and general power

safety considerations

Complete the required changes to the existing programs and data

processing units

Install communication facilities, such as telephone lines

( )

4 zEC12 IMPP

Site Preparation Checklist

Level 01f

Task/Consideration Task Assigned Target Date Completed

CHECKPOINT 7

Are there any new applications that must be installed/ tested before the

new system arrives?

Do you need to conduct training with computer room personnel:

- Safety?

- Security?

- Operations?

- Other?

Are there any outstanding hardware changes that need to be made

to existing:

- Computer equipment?

- Communications equipment?

- Site facilities?

Is the system configuration ready for installation:

- IOCP input?

- CHPIDs?

Do you have a comprehensive channel cabling plan in place:

- Are all cables either ordered or on hand?

- Do you have a reliable installer ready to go?

- Are plans in place for cable connection at remote devices?

- Is there a system test plan?

- Are you prepared to provide cable labels or labeling information?

- Are protective end cap devices in place on all cable connectors?

- Are cables routed and coiled out of the way for installation?

Is the path for moving the new equipment:

- Wide enough?

- High enough?

- Free of obstructions?

- Ramps ready, if necessary? Are floor panels ready? Is all furniture and miscellaneous equipment in place or out of the

way for installation? Is your setup team trained and ready for the arrival of the new equipment? Complete the site preparation

( )

ARRIVAL OF NEW EQUIPMENT

Move unit(s) to installation location. Place the units according to machine clearance dimensions provided in

“Machine and service clearance areas” (in this document). Unpack unit(s) according to instructions.

Call your service provider to install the unit(s).

Chapter 1. Introduction 5

Customized planning aid

Level 01f

A customized planning aid will be available for your system one day after receipt of your order in manufacturing. You may obtain access to this aid by registering on Resource Link. This planning aid will include unique physical planning requirements based on your system’s specific configuration.

It is important to note here that the planning aid is not intended to replace this manual. You should be familiar with the contents of this document before you attempt to use the planning aid.

6 zEC12 IMPP

ASHRAE declarations - radiator-cooled

Level 01f

ASHRAE Declarations (Metric) for 2827 (Radiator-cooled)

ASHRAE Class 1

Description

Minimum Configuration

Model

H20

FC 1095

Maximum Configuration

Model

HA1

FC 1106

ASHRAE Class 1

Description

Minimum Configuration

Model

H20

FC 1095

Maximum Configuration

Model

HA1

FC 1106

Typical

Heat

Release

kBTU

19.5

92.6

Airflow

Nominal

(1)

m3/hr

1801.8

4504.4

ASHRAE Declarations (English) for 2827 (Radiator-cooled)

Typical

Heat

Release

kBTU

19.5

92.6

Airflow

Nominal

(1)

cfm

1080

2700

Airflow

Maximum

(1)

m3/hr

2552.5

5839.1

Airflow

Maximum

(1)

cfm

1530

3500

Weight

(2, 5, 6, 7)

1357

2522

Weight

(2, 5, 6, 7)

lbs

2993

5559

Overall System

Maximum Dimensions

W D H (cm)

156.8 186.9 201.5

Overall System

Maximum Dimensions

W D H (in)

61.7 73.6 79.3

Maximum

Dry Bulb

Temperature

(3, 10)

Maximum

Dry Bulb

Temperature

(3, 10)

Maximum

Elevation

(8)

(4, 10)

3048

Maximum

Elevation

(4, 10)

10,000

Maximum

Dew Point

(10)

Maximum

Dew Point

(10)

62.6

Airflow Diagram Cooling Scheme

Front to Rear

Front of the Server

Figure 1. ASHRAE declarations - radiator-cooled

Notes:

1. Airflow is designed to increase as the local ambient room temperature increases. Nominal airflow assumes 25

C (77oF) ambient. Maximum airflow is based on an ambient of 32oC (89oF) for all

models.

2. Weights provided assume the optional Integrated Battery Features are installed.

3. For ambient temperatures exceeding 25

C (77oF), the acoustical noise levels of the system may increase significantly as the speeds of the air moving devices increase. See Appendix C, “Acoustics,” on page 131 for the declared acoustical noise emission levels for the system under nominal temperature conditions of 23

4. Maximum ambient reduces 1

C plus or minus 2oC (73.4oF plus or minus 3.6oF).

C (1.8oF) for every 300 m (984 ft) over 900 m (2953 ft).

5. Weights are approximately maximum for populated frames except where indicated below.

Chapter 1. Introduction 7

6. Weights do not include covers which add approximately 74.4 kg (164 lbs) to each frame.

Level 01f

7. The top exit I/O cable towers will add approximately 27.2 kg (60 lbs) to each frame.

8. The top exit I/O cable towers will add 305 mm (12 inches) to the width. If the optional cable

| | |

management brackets are used, the overall system height will increase. See “Top exit I/O cabling” on page 95 for details.

9. At inlet air temp 28

C (82.4oF), air cooling is 100%.

10. See the elevation label (

) or tropical climate label ( )intheSystems Safety Notices document to

determine if there are any elevation limitations or tropical climate limitations for your country.

8 zEC12 IMPP

ASHRAE declarations - water-cooled

Level 01f

ASHRAE Declarations (Metric) for 2827 (Water-cooled)

ASHRAE Class 1

Description

Minimum Configuration

Model

H20

FC 1099

Maximum Configuration

Model

FC 11

HA1

ASHRAE Declarations (English) for 2827 (Water-cooled)

ASHRAE Class 1

Description

Minimum Configuration

Maximum Configuration

Model

FCs 1099

Model

FCs 11

H20

HA1

Typical

Heat

Release

kBTU

18.5

89.3

Typical

Heat

Release

kBTU

18.5

89.3

(10)

Airflow

Nominal

(1)

m3/hr

1384.7

3570.2

Airflow

Nominal

(1)

cfm

830

2140

Airflow

Maximum

(1)

m3/hr

1968.6

4554.5

Airflow

Maximum

(1)

cfm

1180

2730

Weight

(2, 5, 6,

7, 9)

1407

2572

Weight

(2, 5, 6,

7, 9)

lbs

3103

5669

Maximum Dimensions

156.8 197.1 201.5

Maximum Dimensions

Overall System

(8)

W D H (cm)

Overall System

W D H (in)

61.7 77.7 79.3

(8)

Maximum

Elevation

(4, 11)

3048

Maximum

Elevation

(4, 11)

10,000

Maximum

Dry Bulb

Temperature

(3, 11)

Maximum

Dry Bulb

Temperature

(3, 11)

Maximum

Dew Point

(11)

Maximum

Dew Point

(3, 11)

62.6

Airflow Diagram Cooling Scheme

Front to Rear

Front of the Server

Figure 2. ASHRAE declarations - water-cooled

Notes:

1. Airflow is designed to increase as the local ambient room temperature increases. Nominal airflow assumes 25

C (77oF) ambient. Maximum airflow is based on an ambient of 32oC (89oF) for all

models.

2. Weights provided assume the optional Integrated Battery Features are installed.

3. For ambient temperatures exceeding 25

4. Maximum ambient reduces 1

C plus or minus 2oC (73.4oF plus or minus 3.6oF).

C (1.8oF) for every 300 m (984 ft) over 900 m (2953 ft).

5. Weights are approximately maximum for populated frames except where indicated below.

Chapter 1. Introduction 9

6. Weights do not include covers which add approximately 74.4 kg (164 lbs) to each frame.

Level 01f

7. The top exit I/O cable towers will add approximately 27.2 kg (60 lbs) to each frame.

8. The top exit I/O cable towers will add 305 mm (12 inches) to the width. If the optional cable

| | |

management brackets are used, the overall system height will increase. See “Top exit I/O cabling” on page 95 for details.

9. Weights for the water cooled option are dry weights. When filled, water will add 22.7 kg (50 lbs) to the total.

10. At inlet air temp 28

C (82.4oF) – water cooling for the H20 is 55% to 60%, water cooling for the

HA1 is 60% to 65%.

11. See the elevation label (

) or tropical climate label ( )intheSystems Safety Notices document to

determine if there are any elevation limitations or tropical climate limitations for your country.

10 zEC12 IMPP

Chapter 2. Environmental specifications

Level 01f

The System z family of IBM servers is among the most powerful group of mainframe processors ever built. Technology improvements have placed these servers in the top levels of Reliability, Availability, and Serviceability. But it takes more than premium computer equipment to achieve these goals. The data center environment must be able to support the demands that zEC12 capability requires. On the following pages, environmental specifications are presented in tabular and graphic forms to emphasize how important it is that you provide the conditions necessary to utilize all of the power the zEC12 offers.

Environmental specifications are presented in two categories: Required and Recommended. Obviously, meeting the required specifications is prerequisite to using the zEC12. IBM strongly suggests you strive for more than the minimum requirements. The powerful computing zEC12 provides generates heat that

must be removed from the server. Operating your data center most of the time within the recommended

specification ranges instead of the required range will enhance its reliability and efficiency.

Unless otherwise noted on individual specification pages, the following environmental specifications, based on an altitude from sea level to 900 meters (2953 feet), apply:

Table 2. Environmental specifications - table format

Level 01f

Environment, operating:

High ambient temperature

Low ambient temperature

Long-term recommended

27°C (80.6°F)

Long-term recommended

18° (64.4°F)

Low end humidity Long-term recommended

5.5°C (41.9°F) dew point

High end humidity Long-term recommended

60% relative humidity and 15°C (59°F)

dew point Gasious contamination Class G1 as per ANSI/ISA S71.04–1985 Particulate

contamination

1. Room air must be filtered continuously using appropriate filters.

2. The deliquescent relative humidity of the particulate contamination shall be more than

80% .

Environment, nonoperating:

1, 5

Maximum ambient allowed

32°C (89.6°F)

Minimum ambient allowed

15° (59°F)

Minimum relative humidity allowed

20% relative humidity

Maximum relative humidity allowed

80% relative humidity and 17°C (62.6°F) dew point

Temperature 5°C (45°F) to 41°C (113°F) Relative humidity 8% - 80% R/H Maximum dew point Less than 27°C (80.6°F) Gaseous contamination Class G1 as per ANSI/ISA S71.04–1985

Environment, shippings:

Temperature -40°C (-40°F) to 60°C (140°F) Relative humidity 5% - 100% R/H (no condensation) Web bulb Less than 29°C (84.2°F) Shipping package IBM-approved vapor barrier bag with desiccant

Environment, storage:

Temperature 1°C (33.8°F) to 60°C (140°F) Relative humidity 5% -80% R/H (no condensation) Web bulb Less than 29°C (84.2°F) Shipping package IBM-approved vapor barrier bag with desiccant

Notes:

1. Maximum ambient temperature reduces 1°C (1.8°F) for every 300 m (984 ft) over 900 m (2953 ft).

2. ANSI/ISA-S71.04. 1985. "Environmental conditions for process measurement and control systems: Airborne

contaminants." Instrument Society of America, Research Triangle Park, NC, 1985.

3. The deliquescent relative humidity of particulate contamination is the relative humidity at which dust absorbs

enough water to become wet and promote ionic conduction.

4. For ambient temperatures exceeding 25°C (77°F), the acoustical noise levels of the system may increase

significantly as the speeds of the air moving devices increase. See Appendix C, “Acoustics,” on page 131 for the declared acoustical noise emission levels for the system under nominal temperature conditions of 23°C plus or minus 2°C (73.4°F plus or minus 3.6°F).

5. The machine should be in an environment that satisfies the operating environment specifications for at least one

day before it is powered on.

12 zEC12 IMPP

The following illustrations reiterate the environmental specifications in graphic form.

Level 01f

Psychrometric Chart

SI (metric) units

Barometric pressure 101.325 kPa (sea level)

Curved lines represent % of Relative Humidity (RH)

Vertical lines represent Dry Bulb temperature in degrees Celeius ( C )

Points on saturation line (100% RH) represent Dew Point temperature in degrees Celcius ( C )

Dew Point Temperature, degree C

17.0

5.5

15.0

9.7

3.9

0.0

14.0

28.5

90%

26.8

24.9

22.7

20.3

17.4

25.020.010.05.0 15.0

80%

Dry Bulb Temperature, degree C

70%

60%

50%

40%

30%

20%

25.0

22.5

20.0

17.5

15.0

12.5

10.0

7.5

10%

Moisture Content, g/kg dry air

5.0

2.5

0.0

45.035.030.0 40.0

50.0

Figure 3. Environmental specifications - graph format

Chapter 2. Environmental specifications 13

Meets the ASHRAE recommended guidelines

Level 01f

Meets the ASHRAE allowable guidelines

Exceeds the ASHRAE environmental limits

Data center temperature in degrees Celsius (C)

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

15 C minimum, 32 C maximum

8 10 12 14 16 18 20 22 24

26 28 30 32 34 36 38 40

20% minimum, 80% maximum

42 44 46

48 50 52 54 56 58

60 62 64 66 68 70

Data center % Relative Humidity

72 74 76 78 80 82

Figure 4. Environmental specifications - bar graph format

It is very important the environmental specifications be met immediately in front of both frames of the zEC12. Ideally, it would be best if the temperature and humidity controls are good enough to

surround the service area of the zEC12. If you are able to exceed the required conditions, focus your efforts to provide the best quality air at the bottom front of the server.

14 zEC12 IMPP

Conductive contamination

Level 01f

Semiconductors and sensitive electronics used in current Information Technology equipment have allowed for the manufacture of very high density electronic circuitry. While new technology allows for significant increases or capacity in a smaller physical space, it is susceptible to contamination, especially contamination particles that will conduct electricity. Since the early 1990s, it has been determined that data center environments may contain sources of conductive contamination. Contaminants include; carbon fibers, metallic debris such as aluminum, copper and steel filings from construction, and zinc whiskers from zinc-electroplated materials used in raised floor structures.

Although very small, and at times not easily seen without the visual aide of magnifying lenses, this type of contamination can have disastrous impact on equipment availability and reliability. Errors, component damage and equipment outages caused by conductive contamination can be difficult to diagnose. Failures may be at first attributed to other more common factors such as lightning events or electrical power quality or even just presumed to be defective parts.

The most common conductive contamination in raised-floor data centers is what is known as zinc whiskers. It is the most common because it is frequently found on the underside of certain types of access floor tiles. Typically, the wood core style floor tile has a flat steel bottom. The steel may be coated with zinc either by a hot dip galvanize process or by zinc electroplate. The zinc electroplate steel exhibits a phenomena which appears as whisker-like growths on the surface. These small particles of approximately 1-2 mm (.04-.08 in.) in length, can break away from the surface and get pulled into the cooling air stream. Eventually they my be ingested by the equipment air, settle on a circuit board and create a problem. If you suspect that you may have this type of problem, contact your IBM service representative.

Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the zEC12 that is described in this document. Risks that are posed by the presence of excessive particulate levels or concentrations of harmful gases include damage that might cause the zEC12 to malfunction or cease functioning altogether. This specification sets forth limits for particulates and gases that are intended to avoid such damage. The limits must not be viewed or used as definitive limits because numerous other factors, such as temperature or moisture content of the air, can influence the impact of particulates or environmental corrosives and gaseous contaminant transfer. In the absence of specific limits that are set forth in this document, you must implement practices that maintain particulate or gas levels that are consistent with the protection of human health and safety. If IBM determines that the levels of particulates or gases in your environment have caused damage to the zEC12, IBM may condition provision of repair or replacement of zEC12 or parts on implementation of appropriate remedial measures to mitigate such environmental contamination. Implementation of such remedial measures is a customer responsibility.

Table 3. Contaminant descriptions

Contaminant Description

Gaseous contamination Severity level G1 as per ANSI/ISA 71.04-1985

of copper coupons shall be less than 300 Angstroms per month (Å/month, ≈ 0.0039

µg/cm

-hour weight gain).2In addition, the reactivity rate of silver coupons shall be less than 300 Å/month (≈ 0.0035 µg/cm monitoring of gaseous corrosivity should be conducted approximately 2 inches (5 cm) in front of the rack on the air inlet side at one-quarter and three-quarter frame height off the floor or where the air velocity is much higher.

which states that the reactivity rate

-hour weight gain).3The reactive

Chapter 2. Environmental specifications 15

Table 3. Contaminant descriptions (continued)

Level 01f

Contaminant Description

Particulate contamination Data centers must meet the cleanliness level of ISO 14644-1 class 8. For data

centers without airside economizer, the ISO 14644-1 class 8 cleanliness may be met simply by the choice of the following filtration:

v The room air may be continuously filtered with MERV 8 filters. Air entering a

data center may be filtered with MERV 11 or preferably MERV 13 filters.

v For data centers with airside economizers, the choice of filters to achieve ISO

class 8 cleanliness depends on the specific conditions present at that data center.

The deliquescent relative humidity of the particulate contamination should be more than 60% RH.

Data centers must be free of zinc whiskers.

Note:

1. ANSI/ISA-71.04.1985. “Environmental conditions for process measurement and control systems: Airborne contaminants.” Instrument Society of America, Research Triangle Park, NC, 1985.

2. The derivation of the equivalence between the rate of copper corrosion product thickness growth in Å/month and the rate of weight gain assumes that Cu

S and Cu2O grow in equal proportions.

3. The derivation of the equivalence between the rate of silver corrosion product thickness growth in Å/month and the rate of weight gain assumes that Ag

S is the only corrosion product.

4. The deliquescent relative humidity of particulate contamination is the relative humidity at which the dust absorbs enough water to become wet and promote corrosion and/or ion migration.

5. Surface debris is randomly collected from 10 areas of the data center on a 1.5-cm diameter disk of sticky electrically conductive tape on a metal stub. If examination of the sticky tape in a scanning electron microscope reveals no zinc whiskers, the data center is considered free of zinc whiskers.

6. If there is any question about potential corrosive gases or level of particulates, contact your IBM representative for assistance in monitoring the environment.

Beyond the specific information provided in this document, IBM recommends that the customer's facility meet the general guidelines published in the American Society of Heating, Refrigeration, and Air Conditioning Engineers (ASHRAE) Handbook.

16 zEC12 IMPP

Chapter 3. Models and physical specifications

Level 01f

This chapter provides the following detailed information for the zEC12.

v Model and frame descriptions v Shipping specifications v Plan view and specifications v Weight distribution data v Machine and service clearance areas v Cooling recommendations.

Facts you should know about the zEC12:

v zEC12 is always a two-frame system v zEC12 may have either two or four line cords, depending on the model you select. If you choose a

server that requires only two power cords, but want to be prepared for future growth, you may order the Plan Ahead for Line Cord feature, FC 2000, which ships all four line cords regardless of the model.

v zEC12 can be powered from either an AC or DC source. v The zEC12 can be either radiator cooled or water cooled.

The zEC12 water-cooled models can only be installed on a raised floor. To accommodate the bend

Level 01f

radius of the water hoses, the height of the raised floor (subfloor to top surface of floor tile) must be a

minimum of 228.6 mm (9 inches).

The zEC12 radiator-cooled models can be installed on a raised floor or a nonraised floor.

v The zEC12 can be installed on a nonraised floor. In a nonraised floor environment, where cables are

exposed, refer to local and national electric and safety codes for more information.

Note: If zEC12 is installed on a nonraised floor, the top exit I/O cable option (FC 7942) and the top exit power cable option (FC 7901) must be used.

v zEC12 provides an top exit I/O cable option (FC 7942). This consists of I/O cable towers installed at all

four corners of the server (two each on the A and Z frames). If selected, these towers and the side covers that go with them are shipped in separate containers.

zEC12 provides an top exit power cable option (FC 7901).

Note: If nonraised floor feature is selected, both the top exit I/O cable option (FC 7942) and the top exit power cable option (FC 7901) must be selected.

v The frames are shipped as separate units, fastened together at install time.

Important: zEC12, fully configured, can weigh in excess of 2494 kg (5500 lb). Be certain that the raised floor on which you are going to install the server is capable of supporting this weight.

DANGER: Heavy equipment — personal injury or equipment damage might result if mishandled.

(D006)

v Feature codes 8000 and 8001 provide tie-down hardware for various height raised floors. Feature code

8002 provides tie-down hardware for nonraised floors. See Appendix F, “Frame tie-down,” on page 141 for more information.

v There are separate shipping containers for the covers for each frame. v If you are planning an installation on a raised floor in Canada, the installation must be in accordance

with Section 12-020 of the CPC. In any country, refer to your national electric code if you have questions about routing data processing cables in exposed areas.

18 zEC12 IMPP

Physical dimensions

Level 01f

Note: For all combinations, if the top exit I/O cabling towers (FC 7942) are installed, each frame is 153 mm (6 in) wider. See “Plan views” on page 31 for a visual reference.

Width

A and Z frame/cover combination

Frames w/covers (radiator-cooled) 1565.8 (61.7) 1869.2 (73.6) 2015 (79.4)

Frames w/covers (radiator-cooled) with top exit I/O cable towers

Frames w/covers (water-cooled) 1565.8 (61.7) 1971.2 (77.6) 2015 (79.4)

Frames w/covers (water-cooled) with top exit I/O cable towers

Note:

1. If the top exit I/O cable towers are installed and the optional cable management brackets are used, the overall system height will increase. See “Top exit I/O cabling” on page 95 for details.

mm (in)

1871.8 (73.7) 1869.2 (73.6) 2015 (79.4)

1871.8 (73.7) 1971.2 (77.6) 2015 (79.4)

Depth

mm (in)

Height

mm (in)

Chapter 3. Models and physical specifications 19

Shipping specifications

Level 01f

zEC12 are shipped two ways: v Packaged systems are protected with an antistatic poly bag and heavy cardboard and roll on their own

casters. This packaging is used only in the 48 contiguous United States.

v Crated systems are protected with wooden shipping boxes and are mounted on pallets requiring

commercial lift transportation. This packaging is used for all servers shipped anywhere except the 48 contiguous United States.

Height reduction - FC 9975

If you have doorways with openings less than 2032 mm (80.0 in) high, you should order feature code

9975. This feature reduces the frame height to 1809 mm (71.2 in). The top portion of the frames are shipped in a separate carton, as are the frame side covers.

Internal battery - FC 3213

If you ordered feature code 3213, the internal batteries are shipped in their own packaging. The batteries must always be installed along with the server.

Dimensions

Note: The weight does not include the weight of any internal batteries.

Packaged frames Width mm (in) Depth mm (in) Height mm (in) Weight kg (lb)

Packaged frame A (radiator-cooled) 825 (32.5) 1435 (56.5) 2032 (80.0) 1023 (2256) Packaged frame A (radiator-cooled)

with height-reduced (FC 9975) Packaged frame A (water-cooled) 825 (32.5) 1600 (63.0) 2032 (80.0) 1080 (2381) Packaged frame A (water-cooled)

with height-reduced (FC 9975) Packaged frame Z (radiator-cooled) 813 (32.1) 1397 (55.0) 2032 (80.0) 887 (1956) Packaged frame Z (radiator-cooled)

with height-reduced (FC 9975) Packaged frame Z (water-cooled) 813 (32.1) 1499 (60.0) 2032 (80.0) 944 (2082) Packaged frame Z (water-cooled)

with height-educed (FC 9975)

825 (32.5) 1435 (56.5) 1803 (71.0) 991 (2185)

825 (32.5) 1600 (63.0) 1803 (71.0) 1048 (2311)

813 (32.1) 1397 (55.0) 1803 (71.0) 855 (1885)

813 (32.1) 1499 (60.0) 1803 (71.0) 912 (2011)

Crated frames Width mm (in) Depth mm (in) Height mm (in) Weight kg (lb)

Crated frame A (radiator-cooled) 937 (36.5) 1618 (63.4) 2302 (87.6) 1341 (2957) Crated frame A (water-cooled) 937 (36.5) 1727 (68.0) 2302 (87.6) 1398 (3083) Crated frame Z (radiator-cooled) 937 (36.5) 1618 (63.4) 2302 (87.6) 1183 (2609) Crated frame Z (water-cooled) 937 (36.5) 1727 (68.0) 2302 (87.6) 1239 (2732)

Cover set (front and rear doors) Width mm (in) Depth mm (in) Height mm (in) Weight kg (lb)

Frame A 997.0 (39.3) 610.0 (24.1) 2248.0 (88.6) 51.7 (114)

Frame Z 1092.2 (43.0) 1066.8 (42.0) 2171.7 (85.5) 51.7 (114)

20 zEC12 IMPP

Top exit I/O cable towers (FC 7942) Width mm (in) Depth mm (in) Height mm (in) Weight kg (lb)

Level 01f

Frame A (two top exit I/O cable towers per pack)

Frame Z (two top exit I/O cable towers per pack)

Important:

The zEC12 is comprised of some of the most sophisticated and complex electronic equipment ever integrated into one computer. As such, this hardware needs to be protected from negative environmental impacts to ensure the utmost reliability. One of the key factors affecting this reliability is moving the system from the loading dock into the controlled environment of your computer room on the day it is delivered.

To ensure that optimum environmental conditions are maintained, work with your marketing representative to schedule the delivery at a time when you can transport the system components from the point of delivery to the computer room destination without unnecessary delay. Prompt handling upon arrival will prevent any possibility of a problem caused by exposure to temperature extremes, severe weather, or high humidity.

762.0 (30.0) 431.8 (17.0) 2184.4 (86.0) 67.7 (149.0)

Chapter 3. Models and physical specifications 21

zEnterprise zEC12 models

Level 01f

There are five models zEC12 (machine type 2827) models: H20, H43, H66, H89 and HA1. Each model contains user-definable Processor Units (PUs), System Assist Processors (SAPs), and spare PUs (used to provide uninterrupted computing if there should be a problem with a working PU).

The following table lists the feature codes for each model. You will use the feature codes to place your zEC12 order.

Table 4. Processor descriptions

Feature code Description

1095 Model H20, radiator-cooled, 1 processor book 1096 Model H43, radiator-cooled, 2 processor books 1097 Model H66, radiator-cooled, 3 processor books 1098 Model H89, radiator-cooled, 4 processor books 1106 Model HA1, radiator-cooled, 4 processor books 1099 Model H20, water-cooled, 1 processor book 1100 Model H43, water-cooled, 2 processor books 1101 Model H66, water-cooled, 3 processor books 1102 Model H89, water-cooled, 4 processor books 1145 Model HA1, water-cooled, 4 processor books

The server models are shown in the following illustration with InfiniBand copper and InfiniBand optical ports installed. The actual number of ports for any model is dependent on total system configuration as ordered. Model specifications are described in Table 5 on page 24.

Notes:

1. InfiniBand copper cables are used only to connect the I/O cages and I/O drawers to the processor.

2. PCIe copper cables are used to connect PCIe I/O drawers to the processor.

22 zEC12 IMPP

H20

Level 01f

Slot 1 Slot 6 Slot 10 Slot 15

H43

Slot 1 Slot 6 Slot 10 Slot 15

H66

Slot 1 Slot 6 Slot 10 Slot 15

H89/HA1

Slot 1 Slot 6 Slot 10 Slot 15

Copper fanouts

PCIe

HCA2-C

InfiniBand optical fanouts

HCA3-O LR

HCA2-O LR

Chapter 3. Models and physical specifications 23

JR1

JT1

HCA3-O HCA2-O

JT2

JR2

Table 5. Model feature codes and options

Level 01f

Feature code Description - number of processor books I/O connectors

Model H20 FC 1095 (radiator-cooled) FC 1099 (water-cooled)

Model H43 FC 1096 (radiator-cooled) FC 1100 (water-cooled)

Model H66 FC 1097 (radiator-cooled) FC 1101 (water-cooled)

Model H89 FC 1098 (radiator-cooled) FC 1102 (water-cooled)

Model HA1 FC 1106 (radiator-cooled) FC 1145 (water-cooled)

FC 3213 v Internal Battery Feature

v 1 book v 0-20CPs v 0 - 20 IFLs v 0 - 19 uIFLs v 0 - 20 ICFs v 0 - 10 zAAPs v 0 - 10 zIIPs v 1 - IFP v 4 - base SAPs,0-4optional SAPs, v 2 - spares

v 2 books v 0-43CPs v 0 - 43 IFLs v 0 - 42 uIFLs v 0 - 43 ICFs v 0 - 21 zAAPs v 0 - 21 zIIPs v 1 - IFP v 8- base SAPs,0-8optional SAPs, v 2 - spares

v 3 books v 0-66CPs v 0 - 66 IFLs v 0 - 65 uIFLs v 0 - 66 ICFs v 0 - 33 zAAPs v 0 - 33 zIIPs v 1 - IFP v 12 - base SAPs,0-12optional SAPs, v 2 - spares

v 4 books v 0-89CPs v 0 - 89 IFLs v 0 - 88 uIFLs v 0 - 89 ICFs v 0 - 44 zAAPs v 0 - 44 zIIPs v 1 - IFP v 16 - base SAPs,0-16optional SAPs, v 2 - spares

v 4 books v 0 - 101 CPs v 0 - 101 IFLs v 0 - 100 uIFLs v 0 - 101 ICFs v 0 - 50 zAAPs v 0 - 50 zIIPs v 1 - IFP v 16 - base SAPs,0-16optional SAPs, v 2 - spares

v Available in all models v Up to three pairs of batteries are

provided, depending on system power configuration.

16 total connector positions available v 0 - 16 InfiniBand Optical

32 total connector positions available v 0 - 32 InfiniBand Optical

40 total connector positions available v 0 - 32 InfiniBand Optical

48 total connector positions available v 0 - 32 InfiniBand Optical

24 zEC12 IMPP

Table 5. Model feature codes and options (continued)

Level 01f

Feature code Description - number of processor books I/O connectors

Note:

1. CP - Central Processor

2. IFL - Integrated Facility for Linux

3. ICF - Integrated Coupling Facility

4. SAP - System Assist Processor

5. zAAP - IBM System z Application Assist Processor

6. zIIP - IBM System z Integrated Information Processor

7. IFP - Integrated Firmware Processor

Additionally, as shown in Figure 5 on page 26 and Figure 6 on page 27: v Internal batteries (for emergency backup power) are placed in the topmost positions in both frames. (In

the front ONLY on the A frame.)

v The system processor is located in the cage below the battery position in the A frame. v For radiator-cooled models, the processor cooling components are located below the processor in the

front of the A frame, and from the top of the frame to the top of the I/O cage in the rear of the A frame.

For water-cooled models, the processor cooling components are located at the bottom of the A frame below the I/O cage, and from the top of the frame to the top of the I/O cage in the rear of the A frame.

v The system power supply is contained in the top of the Z frame, below the battery positions. v Input/Output features are installed in Input/Output (I/O) cage, I/O drawers, and PCIe I/O drawers.

For radiator-cooled models: – An I/O cage or an I/O drawer and PCIe I/O drawers are installed in the empty space at the bottom

of the A frame, and

– I/O drawers and PCIe I/O drawers are installed in the area below the bulk power supply in the Z

frame.

For water-cooled models: – An I/O cage or an I/O drawer and PCIe I/O drawers are installed in the empty space above the

water-cooling equipment in the A frame, and

– I/O drawers and PCIe I/O drawers are installed in the area below the bulk power supply in the Z

frame.

Chapter 3. Models and physical specifications 25

Integrated

Level 01f

Batteries

System

Power

Supply

I/O Drawer or PCIe I/O Drawer

Support

Elements

I/O Drawer or I/O Drawer

PCIe

Front view - radiator-cooled

BATTERYENBLD

(CB Must be on)

BATTERYENBLD

(CB Must be on)

AC/DC Converter

IBM

IBF PWR

J01

unlock/off

BPR enbld

AC/DC Converter

IBM

AC/DC Converter

IBM

AC/DC Converter

IBM

AC/DC Converter

IBM

AC/DC Converter

IBM

J02

J01

J02

J01

J02

lock/on

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

lock/on

J03

J04

J10

J11

UEPO

PWR

J05

J07

J09

J08

J06

.....

GOOD

STBY

CMPLT

J09

J10

J08

J06

J05

J03

J07

J04

.....

GOOD

J09

J10

J08

J06

J05

J03

J07

J04

.....

GOOD

BATTERYENBLD

(CB Must be on)

BATTERYENBLD

(CB Must be on)

Integrated Batter

ies

Central Processor Complex (CPC)

Radiator Air Cooling Equipment

PCIe I/O Drawer

Integrated

Batteries

System

Power

Supply

PCIe I/O Drawer or I/O Drawer

Support

Elements

I/O Drawer or I/O Drawer

PCIe

PCIe I/O Drawer

Z Frame A Frame

Front view - water-cooled

BATTERYENBLD

(CB Must be on)

BATTERYENBLD

(CB Must be on)

AC/DC Converter

IBM

IBF PWR

J01

unlock/off

BPR enbld

lock/on

J01

J02

J03

J04

J05

AC/DC Converter

IBM

IBF PWR

J01

AC/DC Converter

IBM

IBF PWR

J01

AC/DC Converter

IBM

IBF PWR

J01

AC/DC Converter

IBM

IBF PWR

J01

AC/DC Converter

IBM

IBF PWR

J01

J03

J02

J04

J01

UEPO

PWR

J05

J07

J08

J06

STBY

CMPLT

J06

J08

J01

J05

J03

J07

J02

J04

J06

J08

J01

J05

J03

J07

J02

J04

Z Frame A Frame

J06

J07

J08

unlock/off

BPR enbld

lock/on

J09

J10

J12

J11

J14

J13

J16

J15

unlock/off

BPR enbld

lock/on

J17

J18

J19

J20

J21

J22

unlock/off

BPR enbld

lock/on

J23

J24

J25

J26

J27

J28

J29

J30

unlock/off

BPR enbld

lock/on

J31

J32

unlock/off

BPR enbld

lock/on

J10

J11

J09

.....

GOOD

J09

J10

.....

GOOD

J09

J10

.....

GOOD

I/O Cage or PCIe I/O Drawer

BATTERYENBLD

(CB Must be on)

BATTERYENBLD

(CB Must be on)

Integrated Batter

ies

Central Processor Complex (CPC)

I/O Cage

Chilled Water Cooling Equipment

Figure 5. zEC12 - front view

26 zEC12 IMPP

Backup Blowers

Level 01f

and MDAs

Primary Blowers

and MDAs

CPC DCAs

Radiator

Pump

Unit

Rear view - radiator-cooled

BATTERYENBLD

(CB Must be on)

BATTERYENBLD

(CB Must be on)

AC/DC Converter

IBM

AC/DC Converter

IBM

AC/DC Converter

IBM

AC/DC Converter

IBM

AC/DC Converter

IBM

AC/DC Converter

IBM

J03

J02

J01

J03

J02

J01

J03

J02

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

J04

UEPO

N O R M A L

J04

lock/on

J10

J11

PWR

J05

J07

J09

J08

J06

.....

Y P A S S

CMPLT

.....

W R

STBY

J06

J05

J06

J05

.....

GOOD

J09

J10

J08

J07

.....

GOOD

J09

J10

J08

J07

.....

GOOD

J01

J02

J03

J04

J05

J06

J07

J08

J09

J10

J12

J11

J14

J13

J16

J15

J17

J18

J19

J20

J21

J22

J23

J24

J25

J26

J27

J28

J29

J30

J31

J32

GOO

Integrated Batteries

System Power Supply

PCIe I/O Drawer or I/O Drawer

PCIe I/O Drawer

I/O Cage or PCIe I/O Drawer

Primary Blowers

and MDAs

CPC DCAs

I/O Cage

Water Cooling Unit

A Frame Z Frame

Rear view - water-cooled

BATTERYENBLD

(CB Must be on)

BATTERYENBLD

(CB Must be on)

AC/DC Converter

IBM

AC/DC Converter

IBM

AC/DC Converter

IBM

AC/DC Converter

IBM

AC/DC Converter

IBM

AC/DC Converter

IBM

J03

J02

J01

J03

J02

J01

J03

J02

PCIe I/O Drawer

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

lock/on

IBF PWR

J01

unlock/off

BPR enbld

J04

UEPO

N O R M A L

J04

lock/on

J10

J11

PWR

J05

J07

J09

J08

J06

.....

Y P A S S

STBY

CMPLT

J05

.....

W R

J06

.....

GOOD

J09

J10

J08

J07

.....

GOOD

J09

J10

J08

J07

.....

GOOD

J01

J02

J03

J04

J05

J06

J07

J08

J09

J10

J12

J11

J14

J13

J16

J15

J17

J18

J19

J20

J21

J22

J23

J24

J25

J26

J27

J28

J29

J30

J31

J32

GOOD

Integrated Batteries

System Power Supply

PCIe I/O Drawer or I/O Drawer

PCIe I/O Drawer

A Frame Z Frame

Figure 6. zEC12 - rear view

Chapter 3. Models and physical specifications 27

I/O cages, I/O drawers, and PCIe I/O drawers

Level 01f

The zEC12 provides I/O adapters in three different packages. v I/O cage - legacy packaging for I/O -14 EIA units tall - provides 28 adapters, with up to four ports per

adapter.

v I/O drawer - 5 EIA units tall - provides 8 adapters, with up to four ports per adapter. v PCIe I/O drawer - 7 EIA units tall - provides 32 adapters, with two ports per adapter.

I/O cage front view

PCIe I/O drawer front view

I/O drawer front view

I/O cage rear view

PCIe I/O drawer rear view

D109

I/O drawer rear view

D209

You can have a maximum of 44 legacy I/O cards in a zEC12. You cannot have more than one I/O cage and two I/O drawers.

28 zEC12 IMPP

System upgrades

Level 01f

You can carry out the following upgrades:

v 2097 (System z10 v 2817 (z196) air-cooled model to a zEC12 radiator-cooled or water-cooled model v 2817 (z196) water-cooled model to a zEC12 water-cooled model.

Conversions from a 2817 (z196) or 2827 (zEC12) water-cooled model to a zEC12 radiator-cooled model is not supported.

An upgrade includes all frames, cages, drawers, support cards, and new I/O features.

EC) model to a zEC12 radiator-cooled or water-cooled model

Chapter 3. Models and physical specifications 29

Differences between IBM servers

Level 01f

Although you cannot upgrade to a zEC12 from any previous IBM server except the z196 or z10™EC, minimum comparison information is provided here for those who may be placing a zEC12 on a raised floor with G5/G6, z900, z990, z9

Table 6. Differences between single-frame System z servers

System family Depth (with covers) Height (with covers) Weight (Maximum)

Generation 5/6 (9672) 1143 mm (45 in)

z900 (2064) 1666 mm (65.6 in) 2026 mm (79.8 in) 1866 kg (4114 lbs) z990 (2084) 1577 mm (62.1 in) 1941 mm (76.4 in) 2008 kg (4427 lbs) z9 EC (2094) 1577 mm (62.1 in) 1941 mm (76.4 in) 2003 kg (4415 lbs) z10 EC (2097) 1806 mm (71.1 in) 2027 mm (79.8 in) 2318 kg (5110 lbs) z196 (2817)

(air-cooled) z196 (2817)

(water-cooled)

zEC12 (2827) (radiator-cooled)

zEC12 (2827) (water-cooled)

Note:

1. All server frames are the same width, approximately 784 mm (30.9 in) with the side covers installed.

2. The zEC12 frames, with the optional I/O cabling top exit feature (FC 7942), are 937 mm (36.9 in) wide.

3. The zEC12, z196, z10 EC, z9 EC, and z990 always consist of two frames. G5/G6 and z900 servers may be either

one or two frames, depending on configuration. z900 servers may also have a third frame for Internal Battery Features.

4. Major differences in power and processor packaging, cooling, and I/O cages exist between zEC12, z196, z10 EC, z9 EC, z990, z900, and G5/G6 servers.

EC, or z10 EC, or z196 servers.

1785 mm (70.3 in) or 1447 mm (57 in)

1806 mm (71.1 in) 2027 mm (79.8 in) 2621 kg (5791 lbs)

1908 mm (75.1 in) 2027 mm (79.8 in) 2654 kg (5853 lbs)

1869 mm (73.6 in) 2015 mm (79.3 in) 2704 kg (5963 lbs)

1971 mm (77.6 in) 2015 mm (79.3 in) 2754 kg (6073 lbs)

2026 mm (79.75 in)

1502 kg (3312 lbs)

If you are replacing an existing IBM server, carefully read the Installation Manual for Physical Planning (available on the Resource Link web site) to determine actual differences between your installed IBM server and the zEC12. Plan views, physical dimensions, service clearances, aisle spacing, and power and cooling requirements may be substantially different.

30 zEC12 IMPP

Plan views

Level 01f

Note: In the following plan views, the top exit I/O cable towers (FC 7942) are shown as gray boxes at the outer corners of the A and Z frames in the bottom drawing. This is an optional feature.

Note: For installations planning to use top exit power cords, the frame openings for these cords are on the top of the left front and right rear corners of the Z frame.

Radiator cooling

17 mm

(0.7 in)

266.8 mm (10.5 in)

1273.2 mm (50.1 in)

329.1 mm (13.0 in)

153 mm

(6.0 in)

750 mm (29.5 in)

+ +

FRONT

34 mm

(1.3 in)

750 mm

(29.5 in)

17 mm (0.7 in)

260.9 mm (10.3 in)

+ +

1869.2 mm (73.6 in)

1273.2 mm (50.1 in)

1863.2 mm (73.4 in)

329.1 mm (13.0 in)

FRONT

254 mm (10.0 in)

762 mm (30.0 in)

+ +

1869.2 mm (73.6 in)

+ +

Frame

Entry/Exit

Cutout dimensions

for raised floor

(mm) (in)

1568 mm

(61.7 in)

Front Rear

94 x 655 94 x 655

3.7 x 25.8

1846 mm

(72.7 in)

FRONT

Chapter 3. Models and physical specifications 31

Chilled water cooling

Level 01f

17 mm (0.7 in)

266.8 mm (10.5 in)

1375.2 mm (54.2 in)

329.1 mm (13.0 in)

750 mm (29.5 in)

+ +

FRONT

34 mm

(1.3 in)

750 mm (29.5 in)

17 mm

(0.7 in)

260.9 mm

102 mm

+ +

(4.0 in)

(10.3 in)

1375.2 mm (54.2 in)

102 mm

(4.0 in)

329.1 mm (13.0 in)

FRONT

153 mm

(6.0 in)

1971.2 mm (77.7 in)

+ +

254 mm (10.0 in)

762 mm

+ +

(30.0 in)

Cutout dimensions

Frame

for raised floor

Entry/Exit

(mm) (in)

1568 mm

(61.7 in)

1846 mm

Front Rear

94 x 655 94 x 655

3.7 x 25.8

(72.7 in)

FRONT

32 zEC12 IMPP

Weight distribution

Level 01f

The following table shows weights and dimensions used to calculate floor loading for the zEC12. All floor loading calculations are intended for a raised floor environment. If you are using a nonraised floor environment, these floor loading calculations do not apply.

Table 7. Maximum weights with the Internal Battery Feature (IBF)

Maximum A and Z frames with Internal Battery Feature (3213) - Model HA1

Radiator-cooled

Weight kg (lbs) Width mm (in)

1,2,4

Depth mm (in) 1273 (50.2)

Water-cooled

Weight kg (lbs) Width mm (in)

1,2,4

Depth mm (in) 1377 (54.2)

Table 8. Maximum weights without the Internal Battery Feature (IBF)

Maximum A and Z frames without Internal Battery Feature (3213) - Model HA1

Radiator-cooled

Weight kg (lbs) Width mm (in)

1,2,4

Depth mm (in) 1273 (50.2)

Water-cooled

Weight kg (lbs)

Width mm (in)

1,2,4

Depth mm (in) 1377 (54.2)

2649 (5843)

1566 (61.7)

2770 (5953)

1566 (61.7)

2346 (5173)

1566 (61.7)

2396 (5283)

1566 (61.7)

Notes:

1. Weight includes covers. Width and depth are indicated without covers.

2. For two-frame systems, weight is based on maximum system configuration, not the addition of the

maximum weight of each frame.

3. Width increases to 1846 mm (72.7 in) if the top exit I/O feature (FC 7942) is installed.

4. Weight increases by 54.4 kg (120 lbs) if the top exit I/O feature is installed.

Chapter 3. Models and physical specifications 33

The following figure and tables show sample floor loading values for the zEC12, with and without the

Level 01f

Internal Battery Feature (3213), and without the top exit I/O feature (7942).

Floor loading for radiator-cooled servers without Internal Battery Feature

Floor load kg/m

Example # 'a' (sides) mm (in) 'b' (front) mm (in) 'c' (rear) mm (in)

1 25 (1.0) 254 (10.0) 254 (10.0) 892.69 (182.84) 2 25 (1.0) 508 (20.0) 508 (20.0) 722.32 (147.94) 3 25 (1.0) 762 (30.0) 762 (30.0) 613.83 (125.72) 4 254 (10.0) 254 (10.0) 254 (10.0) 723.16 (148.12) 5 254 (10.0) 508 (20.0) 508 (20.0) 590.41 (120.93) 6 254 (10.0) 762 (30.0) 762 (30.0) 505.88 (103.61) 7 508 (20.0) 254 (10.0) 254 (10.0) 605.48 (124.01) 8 508 (20.0) 508 (20.0) 508 (20.0) 498.84 (102.17) 9 508 (20.0) 762 (30.0) 762 (30.0) 430.94 (88.26)

10 762 (30.0) 254 (10.0) 254 (10.0) 526.48 (107.83)

11 762 (30.0) 508 (20.0) 508 (20.0) 437.38 (89.58)

12 762 (30.0) 762 (30.0) 762 (30.0) 380.65 (77.96)

(lbs/ft2)

Floor loading for radiator-cooled servers with Internal Battery Feature

Floor load kg/m

Example # 'a' (sides) mm (in) 'b' (front) mm (in) 'c' (rear) mm (in)

1 25 (1.0) 254 (10.0) 254 (10.0) 979.21 (200.56) 2 25 (1.0) 508 (20.0) 508 (20.0) 789.63 (161.73) 3 25 (1.0) 762 (30.0) 762 (30.0) 668.92 (137.01) 4 254 (10.0) 254 (10.0) 254 (10.0) 790.57 (161.92) 5 254 (10.0) 508 (20.0) 508 (20.0) 642.86 (131.67) 6 254 (10.0) 762 (30.0) 762 (30.0) 548.81 (112.40) 7 508 (20.0) 254 (10.0) 254 (10.0) 659.62 (135.10) 8 508 (20.0) 508 (20.0) 508 (20.0) 540.97 (110.80)

34 zEC12 IMPP

(lbs/ft2)

Floor load kg/m

Level 01f

Example # 'a' (sides) mm (in) 'b' (front) mm (in) 'c' (rear) mm (in)

9 508 (20.0) 762 (30.0) 762 (30.0) 465.42 (95.33) 10 762 (30.0) 254 (10.0) 254 (10.0) 571.73 (117.10) 11 762 (30.0) 508 (20.0) 508 (20.0) 472.59 (96.79) 12 762 (30.0) 762 (30.0) 762 (30.0) 409.46 (83.86)

Floor loading for water-cooled servers without Internal Battery Feature

Floor load kg/m

Example # 'a' (sides) mm (in) 'b' (front) mm (in) 'c' (rear) mm (in)

1 25 (1.0) 254 (10.0) 254 (10.0) 915.27 (187.46) 2 25 (1.0) 508 (20.0) 508 (20.0) 739.89 (151.54) 3 25 (1.0) 762 (30.0) 762 (30.0) 628.21 (128.67) 4 254 (10.0) 254 (10.0) 254 (10.0) 740.76 (151.72) 5 254 (10.0) 508 (20.0) 508 (20.0) 604.10 (123.73) 6 254 (10.0) 762 (30.0) 762 (30.0) 517.09 (105.91) 7 508 (20.0) 254 (10.0) 254 (10.0) 619.61 (126.91) 8 508 (20.0) 508 (20.0) 508 (20.0) 509.84 (104.42)

9 508 (20.0) 762 (30.0) 762 (30.0) 439.94 (90.11) 10 762 (30.0) 254 (10.0) 254 (10.0) 538.30 (110.25) 11 762 (30.0) 508 (20.0) 508 (20.0) 446.57 (91.47) 12 762 (30.0) 762 (30.0) 762 (30.0) 388.17 (79.50)

(lbs/ft2)

Floor loading for water-cooled servers with Internal Battery Feature

Floor load kg/m

Example # 'a' (sides) mm (in) 'b' (front) mm (in) 'c' (rear) mm (in)

(lbs/ft2)

1 25 (1.0) 254 (10.0) 254 (10.0) 1001.79 (205.18) 2 25 (1.0) 508 (20.0) 508 (20.0) 807.20 (165.33) 3 25 (1.0) 762 (30.0) 762 (30.0) 683.30 (139.95) 4 254 (10.0) 254 (10.0) 254 (10.0) 808.17 (165.53) 5 254 (10.0) 508 (20.0) 508 (20.0) 656.55 (134.47) 6 254 (10.0) 762 (30.0) 762 (30.0) 560.01 (114.70) 7 508 (20.0) 254 (10.0) 254 (10.0) 673.76 (138.00) 8 508 (20.0) 508 (20.0) 508 (20.0) 551.97 (113.05)

9 508 (20.0) 762 (30.0) 762 (30.0) 474.42 (97.17) 10 762 (30.0) 254 (10.0) 254 (10.0) 583.54 (119.52) 11 762 (30.0) 508 (20.0) 508 (20.0) 481.78 (98.68) 12 762 (30.0) 762 (30.0) 762 (30.0) 416.98 (85.40)

All measurements are taken from the outside edge of the machine frame, without covers, unless specifically described otherwise.

Chapter 3. Models and physical specifications 35

Minimum weight distribution is shown in the shaded area of Figure 7 on page 39.

Level 01f

v “a” = side dimension v “b” = front dimension v “c” = rear dimension

36 zEC12 IMPP

System weight examples

Level 01f

Following is a table that provides weight estimates for minimum, typical, and maximum configurations on all four models of the zEC12. The Power Estimator tool has been modified to include weight data and now has the capability to provide a more accurate weight for your particular configuration. See “Power estimation tool” on page 72.

Table 9. Weights for minimum, typical, and maximum server configurations

Weight (in lbs) for an radiator-cooled server Additional weights for features

Model

H20 2551 3000 3907 110 120 670 188

||||

H43 2813 3400 4684 110 120 670 112

||||

H66 3056 3600 4944 110 120 670 56

||||

H89/HA1 3293 4300 5117 110 120 670 56

Note:

1. Minimum weights include no listed features and no I/O.

2. Maximum weight includes five PCIe I/O drawers (FC 4009) and one I/O drawer (FC 4008) and no listed

features. All slots in the PCIe I/O drawers and I/O drawers contain an adapter.

3. Typical weights contain I/O considered typical in a balanced system for the respective model. Actual weight will vary and can only be determined by an exact specification of content.

Example: a typical radiator-cooled H43 with batteries and balanced power = 3400 + 670 + 112 = 4182 lbs

Minimum

weight

Typical

weight

Maximum

weight

Water

weight

addition

Top exit I/O

weight

Battery weight

Balanced

power

Chapter 3. Models and physical specifications 37

Weight distribution and multiple systems

Level 01f

Under typical conditions, service clearances of adjacent products may be overlapped but weight distribution areas should not be overlapped. If weight distribution clearances are overlapped, the customer should obtain the services of a qualified consultant or structural engineer to determine floor loading. Regardless of floor loading, minimum service and aisle clearances must be observed:

v Rear dimension “d” is 991 mm (39 in.) v Front dimension “e” is 1168 mm (46 in.) v Both “d” and “e” are measured from the frame edge (without covers) to the nearest obstacle v Cover opening dimensions are also shown.

Note: Aisle clearances are not the same between rows of front-facing and rear-facing covers. Front-facing rows require 1168 mm (46 in.) of clearance while rear-facing rows need a minimum of 991 mm (39 in.).

For physical planning purposes, you must verify system placement considering:

v Weight distribution v Power availability v Power access v Machine and service clearance area v Air conditioning delivery v Chilled water delivery v Thermal interaction v Cable locations v Floor tile cutouts.

38 zEC12 IMPP

329.1 mm

Level 01f

(13.0 in)

a a

Rear of Servers

Front of Servers

329.1 mm (13.0 in)

Aisle Width

(1168 mm 46 in)

Front of Servers

= Load Shedding Area

Figure 7. Aisle and service clearances

Rear of Servers

Aisle Width

(991 mm 39 in)

Rear of Servers

Front of Servers

Aisle Width

(1143 mm 45 in)

Wall

= Service Clearance Area

Chapter 3. Models and physical specifications 39

Machine and service clearance areas

Level 01f

Machine area is the actual floor space covered by the system. Service clearance area includes the machine area, plus additional space required to open the covers for service access to the system.

A and Z frames Machine area M2/ (ft2) Service clearance area M2/ (ft2)

Radiator-cooled 2.93 (31.6) 7.64 / (82.3)

Radiator-cooled plus top exit I/O

cable towers

Water-cooled 3.09 (33.3) 7.87 / (84.8)

Water-cooled plus top exit I/O

cable towers

Notes:

1. Machine area includes installed covers.

2. Service clearance area must be free of all obstacles. Units must be placed in a way that all service areas are

accessible. The weight distribution clearance area extending beyond the service clearance area, such as the area at the outside corners of the units, may contain support walls and columns.

3. The top exit I/O cable towers (FC 7942) are an optional feature. Service clearance not shown for these towers.

4. Front-to-front aisle spacing of at least 1168 mm (46.0 in) is required for water-cooled servers to provide

enough space in the front of the machine for fill and drain procedures.

3.45 (37.2) 7.64 / (82.3)

3.64 (39.2) 7.87 / (84.8)

Rear

Minimum Service Clearances

d = 1168 mm (46 in) - front

e = 991 mm (39 in) - rear

g = 2226.2 mm (87.7 in) - side to side

329.1 mm (13.0 in)

Front

Figure 8. Minimum service clearances

The front and rear doors access all of the serviceable area in the zEC12 server. The system requires specific service clearances to ensure the fastest possible repair in the unlikely event that a part may need to be replaced. Failure to provide enough clearance to open the front and rear covers will result in extended service time.

The following describes some service clearance conditions that must be followed (See Figure 9 on page

41.)

40 zEC12 IMPP

v The side cover of either an A or Z frame cannot be placed adjacent to a wall (Example A), but can be

Level 01f

positioned next to obstacles such as poles or columns (Example B).

v The front cover on frame A and both covers on frame Z open 329.1 mm (13.0 in) wider than the width

of the frame plus side cover (Example C).

v Service clearances cannot be achieved with a zEC12 server installed side-cover-to-side-cover.

Dimensions are given for zEC12 next to a zEC12. To calculate side-to-side clearance, add 329.1 mm (13.0 in) to the clearance required from the adjacent equipment (Example D).

Wall or

other obstacle

Example A

329.1 mm (13.0 in) frame Z to wall

Example C

Wall

Example B

OKOK

Column

Pole

329.1 mm (13.0 in) frame A to wall

Example D

468 mm (18.4 in)

Figure 9. Detailed service clearances

OKOK

Chapter 3. Models and physical specifications 41

Cooling recommendations for the room

Level 01f

The following illustration does not represent any particular server machine type, and is intended only to show hot and cold airflow and the arrangement of server aisles on the raised floor.

A typical zEC12 uses chilled air, provided from under the raised floor, to cool the system. As shown below, rows of servers must face front-to front. Chilled air is usually provided through perforated floor panels placed in rows between the fronts of servers (the cold aisles shown in the figure). Perforated tiles generally are not placed in the hot aisles. (If your particular computer room causes the temperature in the hot aisles to exceed limits of comfort for activities like system service, you may add as many perforated tiles as necessary to create a satisfactory comfort level.) Heated exhaust air exits the computer room above the computing equipment.

42 zEC12 IMPP

Wall

Level 01f

Figure 10. System airflow

Chapter 3. Models and physical specifications 43

The following table and chart illustrate how to determine the amount of chilled air your computer room

Level 01f

must provide to meet the environmental requirement for your zEC12.

Table 10. Cooling airflow graph codes - H20

Cooling

Model

H20 typical Radiator-cooled 5.4 - 5.4 B

H20 maximum Radiator-cooled 13.4 - 13.4 D

H20 typical Water-cooled 5.1 3.8 1.3 A

H20 maximum Water-cooled 13.1 9.8 3.3 A

Table 11. Cooling airflow graph codes - H43

Model

H43 typical Radiator-cooled 10.0 - 10.0 D

H43 maximum Radiator-cooled 19.8 - 19.8 G

H43 typical Water-cooled 9.4 7.0 2.4 A

H43 maximum Water-cooled 19.1 14.3 4.8 B

Table 12. Cooling airflow graph codes - H66

Model

H66 typical Radiator-cooled 14.2 - 14.2 F

H66 maximum Radiator-cooled 23.3 - 23.3 H

H66 typical Water-cooled 13.3 10.0 3.3 A

H66 maximum Water-cooled 22.5 16.9 5.6 B

method

Cooling

method

Cooling

method

Total power

(in kw)

Total power

(in kw)

Total power

(in kw)

Power to water

(in kw)

Power to water

(in kw)

Power to water

(in kw)

Power to air

(in kw)

Power to air

(in kw)

Power to air

(in kw)

Use cooling

curve

Use cooling

curve

Use cooling

curve

Table 13. Cooling airflow graph codes - H89

Cooling

Model

H89 typical Radiator-cooled 19.4 - 19.4 H

H89 maximum Radiator-cooled 26.9 - 26.9 I

H89 typical Water-cooled 18.4 13.8 4.6 B

H89 maximum Water-cooled 25.9 19.5 6.4 C

Table 14. Cooling airflow graph codes - HA1

Model

HA1 typical Radiator-cooled 19.4 - 19.4 H

HA1 maximum Radiator-cooled 27.6 - 27.6 I

HA1 typical Water-cooled 18.4 13.8 4.6 B

HA1 maximum Water-cooled 26.6 20.0 6.6 C

method

Cooling

method

Total power

(in kw)

Total power

(in kw)

Power to water

(in kw)

Power to water

(in kw)

Power to air

(in kw)

Power to air

(in kw)

Use cooling

curve

44 zEC12 IMPP

The values in the previous chart are for a typical computer room environment:

Level 01f

v Room inlet air = 24

v Customer water inlet = 14

C or cooler

v Altitude = up to 457 meters (1500 feet) above sea level.

Chapter 3. Models and physical specifications 45

Air Flow

Level 01f

CM/M (CF/M)

198.22 (7000)

169.90 (6000)

141.58 (5000)

113.27 (4000)

84.95 (3000)

56.63 (2000)

28.32 (1000)

Under floor temperature

Return air temperature air-cooled server

P O N

I H G

F E D C B A

10 12 14 16 18 20 22 24

50.0 53.6 57.2 60.8 64.4 68.0 71.6 75.2

33.3 33.3 33.3 33.3 33.3 33.9 34.4 35.0

92 92 92 92 92 93 94 95

Figure 11. Cooling airflow graph

If water-cooled, return air temperature is typically between 230C and 280C depending on room ambient, room dewpoint and actual heatload.

The proportion of server heatload removed to water is affected by the local ambient and dewpoint. For servers operating in 22

75% and 90% of input power. When the ambient is below 18 between exhaust air and cooling water temperature lessens rear heat exchangers’ effectiveness. Servers with ambient above 27

Cto270C ambient and under 110C dewpoint, water typically removes between

C are not recommended because blower speedup and warmer circuits increase

C, the small temperature difference

server power consumption and acoustic noise.

To maintain required cooling, it may be necessary to adjust the amount of open floor tile area to achieve adequate air flow. “Cooling recommendations for the room” on page 42 shows that, for each zEC12, the perforated tiles that cool that system are placed directly in front of the frame or frames, and occupy half of the aisle between system rows. Wider aisles between system rows, allowing more perforated tile area, may be necessary if your chilled air system cannot meet the air flow rate required to cool the system when the aisles are too narrow.

46 zEC12 IMPP

Beyond the specific information provided in this document, IBM recommends that the customer's facility

Level 01f

meet the general guidelines published in the American Society of Heating, Refrigeration, and Air Conditioning Engineers (ASHRAE) Handbook.

Chapter 3. Models and physical specifications 47

Special cooling recommendations for water-cooled machine

Level 01f

zEC12 will require four connections to the facility water, two feeds and two returns. These connections are made using hoses that are fixed to the facility plumbing and are routed up through the rear tailgate of the machine and terminate using quick connect couplings. Hoses and a means to fasten them to the facility plumbing are provided with the server.

zEC12 operates from two fully redundant water control units (WCUs). These water control units each have their own facility feed and return water connections. If water is interrupted to one of the water control units, the other water control unit will pick up the entire load and the server will continue to operate without interruption. Therefore each water connection to the facility plumbing must be able to support the entire flow requirement for the system. In the event of water being lost to both water control units, the system will attempt to reject heat using the inner door heat exchangers in each frame and increasing system blower speeds. The server may also run in a degraded mode during this event.

Water supply

Following are some general conditions that your facility must meet prior to installation of zEC12:

v Total Hardness must not exceed 200 mg/L as calcium carbonate. v pH must be between 7 and 9. v Turbidity must be less than 10 NTU (Nephelometric Turbidity Unit). v Bacteria must be less than 1000 CFUs (Colony Forming Unit)/ml. v Water to be as free of particulate matter as feasible.

v Allowable system inlet water temperature range is 6

chilled water (BCW). A special water system for 2827 is typically not required.

v Required flow rate to the frame is 3.7 - 79.4 lpm (1 -21 gpm), depending on inlet water temperature

and the number of nodes populated in the server. Colder inlet water temperatures require less flow then warmer water temperatures. Fewer nodes require less flow then maximum populated processors.

v Minimum water pressure required across the IBM hose ends is 0.34 - 2.32BAR (5 - 33.7 psi), depending

on the minimum flow required.

v Maximum water pressure supplied at the IBM hose connections to the customer water supply should

not exceed 6.89 BAR (100 psi).

v Table 17 on page 54 contains reference information to help you determine the facility water supply

conditions for your particular server.

-20oC (43o-68oF) using standard building

Supply hoses

Important:

Water hoses, hose barbs and hose clamps are shipped with the zEC12 in a kit, P/N 41U9918. Installation of these parts is the responsibility of the customer or their designated plumbing installer and additional materials such as plumbing fittings, valves, insulation and pipe sealant will be required. The

water hoses must be connected to the building water facility BEFORE installation of the server.

Although IBM does not make recommendations or suggestions on how to terminate the facilities side of the hose, we do provide parts that we have used successfully in our installations. If you have other preferred parts or termination methods, discard the parts provided with the server.

The server installer will connect the machine end of the hoses to the server. The customer or facility end of the hose is left open to allow you or your designated plumbing installer to adjust the length and terminate it to the appropriate fitting on the facility plumbing. For zEC12 under-floor water supply, IBM provides:

v 2 - each 4.2 m (14 ft) hoses, (P/N 41U9739 and 2 - hoses P/N 41U9738).

48 zEC12 IMPP

41U9739 - Hose, water supply, BLACK band

Level 01f

41U9738 - Hose, water return, WHITE band

v 4 - Stainless steel hose barbs, P/N 44V6056. v 1 - Locating fixture, P/N 74Y1090.

44V6056 - Stainless steel hose barb with 25.4 mm (1 in) male NPT

Server side

Side away from the server

v 4 - spare O-rings, for Aeroquip quick connect couplings, P/N 45D3158. v 6 - Oetiker hose clamps (2 are spares) P/N 15R8650. v 1 - Oetiker crimping tool P/N P/N 74Y0585 (Oetiker part number 14100082)

For zEC12, we strongly suggest, but do not require, shutoff valves in front of the hoses, in case there is a need to remove the hoses for a service procedure or relocation.

Although IBM does not make recommendations or suggestions on how to terminate the facilities side of the hose, IBM does have a released, stainless steel fitting, P/N 44V6056. This fitting is barbed on one side and has a 25.4 mm (1 in) male NPT on the other end which can be used to connect to your facilities. For the threaded NPT connection, IBM recommends using a thread-lock sealant (Loctite 554 creates a very reliable connection). Since the system end of the hose assembly has a 90 degree elbow, which has to be in a specified orientation, the locating fixture, P/N 74Y1090, provided with the system, should be used while

Chapter 3. Models and physical specifications 49

installing the hoses . This will position the quick connects in the proper orientation, with the faces of the

Level 01f

quick connects parallel to the rear of the frame and the correct height off the floor. If the hose barb P/N 44V6056 is being used, a clamp such as an Oetiker P/N 15R8650 should be used. Six of these are

provided, four to be used for installation, and two are spares. The clamp should be slid over the hose loosely and then the hose should be slid onto the barb until the end of the hose touches the hex flange on the hose barb fitting.

Hose clamp

44V6056 - Stainless steel hose barb with 25.4 mm (1 in) male NPT

Hose clamp

End of the hose should touch the hex flange on the fitting

The clamp is then to be positioned 2 to 4 mm (.08 in to .16 in) from the edge of the hose, prior to clamping. Oetiker clamping tool P/N 74Y0585 (their part number 14100082) must be used to crimp the clamp (the clamp is fully crimped when the gap at the base of the crimp is 3 mm (.12 in) wide, maximum). After installation of the hoses any exposed hose or plumbing fittings should be wrapped in insulation to avoid condensation forming.

The organizer is removed after the hoses are connected to the facility water supply. Save the organizer for future use in case this server should be relocated.

Water-cooled server hose connections, for the customer water supply, are located at the bottom rear of the A frame.

50 zEC12 IMPP

Rear view

Level 01f

A frame Z frame

Customer water hose connectors

BATTERYENBLDBATTERYENBLD

(CBMustbeon)(CBMust be on)

BATTERYENBLD

(CBMustbeon)(CBMust be on)

AC/DC

Converter

IBM

AC/DC

Converter

IBM

AC/DC

Converter

IBM

AC/DC

Converter

IBM

AC/DC

Converter

IBM

AC/DC

Converter

IBM

J03

J02

J01

J03

J02

J01

J03

J02

IBFPWR

/0 J01

J01

unlock/offunlock/off

BPRenbld

lock/on

J01

J02

J03

J04

J05

IBFPWR

/0 J01

J01

unlock/offunlock/off

lock/on

IBFPWR

/0 J01

J01

unlock/offunlock/off

lock/on

IBFPWR

/0 J01

J01

unlock/offunlock/off

lock/on

IBFPWR

/0 J01

J01

unlock/offunlock/off

lock/on

IBFPWR

/0 J01

J01

unlock/offunlock/off

J04

UEPO

PWR

CMPLT

J04

lock/on

J10

J09

J05J05

J07J07

J08

J06J06

.....

STBY

J09

J06J06

J08J08

J05

J07

.....

J09

J06J06

J08

J05

J07

.....

J06

BPRenbld

J07

J08

J09

J10

J12

J11

J14

J13

BPRenbld

J16

J15

J17

J18 J26

J17 J25

J18

J19

J20

BPRenbld

J21

J22

J23

J24

J27

J28

BPRenbld

J29

J30

J31

J32

GOOD

O O D

BPRenbld

J11

.....

GOODGOOD

J10

.....

GOOD

J10

.....

GOOD

S U P P

L A C K

E T U R N

T E

The water hoses are installed through the I/O cable tailgate at the rear of the A frame. This significantly reduces the space available for I/O cable exit from the A frame. One option to alleviate this situation is to consider routing some of the I/O cables from the rear of the A frame to the front of the frame. Another possibility is top exit I/O towers. If your facility has or is considering overhead cabling, the use of top exit I/O helps to solve the crowding of too many cables exiting the bottom of the frames.

The following illustration shows two water facilities: the upper diagram represents a typical chilled water installation where the supply and return runs are connected to a single chilled water source. To assure maximum, uninterrupted cooling, you may want to consider a high availability approach to the water supply. This would mean running a pair of supply and return lines from each of two different chilled water sources, as shown in the lower diagram. This would insure that, if one source should become unavailable, the other would continue to cool the server, with no degradation.

Chapter 3. Models and physical specifications 51

Facility chilled water supply

Level 01f

Facility chilled water return

Color of the band on the coupler

Hose Number 1 = black Hose Number 2 = white Hose Number 3 = black Hose Number 4 = white

Typical customer water facility

43 21

WCU connectors

High availability customer water facility

Facility chilled water supply #1

Facility chilled water supply #2

Facility chilled water return #1

Facility chilled water return#2

Color of the band on the coupler

Hose Number 1 = black Hose Number 2 = white Hose Number 3 = black Hose Number 4 = white

42 31

WCU connectors

52 zEC12 IMPP

Materials used in the water cooling units

Level 01f

The customer side of the zEC12 WCU is comprised of the following material set. Any chemicals that are added to the customer's chilled water must be compatible with the following materials.

Table 15. WCU materials

Description Material

Heat exchanger - plates Stainless steel Heat exchanger - braze material Copper Heat exchanger - hose barbs Stainless steel Pipes and fittings - inlet and outlet pipes Stainless steel (alternate - copper) Pipes and fittings - threaded fittings Copper Pipes and fittings - jog Aluminum bronze alloy (being qualified by IBM materials

dept.) Quick Connects - body castings Stainless steel Quick Connects - external O-ring ERP (Ethylene Propylene Rubber) Quick Connects - internal gaskets ERP (Ethylene Propylene Rubber) Control valve - stem Stainless steel Control valve - disc gasket Teflon Control valve - body (tee) Red brass Control valve - seat Bronze Thread sealant - adhesive Loctite 554 (red)

Table 16. Water hose materials

Description Material

Aeroquip quick-connect - C-ring ERP (Ethylene Propylene Rubber) Aeroquip quick-connect - body Stainless steel Aeroquip quick-connect - ball Stainless steel Aeroquip quick-connect - fitting O-ring Teflon Aeroquip quick-connect - face seal ERP (Ethylene Propylene Rubber) Aeroquip quick-connect - plastic face seal Polycarbonate (does not touch water) Pig tail casting Aluminum bronze C61400 Pig tail hose - cover Carboxylated nitrile Pig tail hose - reinforcement Synthetic, high tensile textile cord Pig tail hose - tube Nitrile

Chapter 3. Models and physical specifications 53

Water specifications

Level 01f

The following tables provide the requirements for the chilled water at the server connection.

Table 17. Required building chilled water conditions - (60C-130C)

Number

of nodes

Max kw to water

Chilled water per Water Conditioning Unit (Water-cooled)

Building chilled water in

Flow (LPM) 6.0 6.3 6.6 7.0 8.0 9.0 10.0 11.5

Pressure Drop (Bar) 0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34

Outlet temp

C 23 23 23 23 23 22 22 22

Flow (LPM) 8.5 9.5 10 11 12 13.5 15 17

210

Pressure Drop (Bar) 0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34

Outlet temp

C 23 22 22 22 22 22 22 21

Flow (LPM) 12.5 13.5 15 16.5 18 20 22 25

314

Pressure Drop (Bar) 0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34

Outlet temp

C 22 22 21 21 21 21 21 21

Flow (LPM) 17 18 20 22 24 27 30 35

418

Pressure Drop (Bar) 0.34 0.34 0.34 0.34 0.34 0.35 0.37 0.50

Outlet temp

C 21 21 21 21 21 21 21 20

Notes:

1. Units are liters/minute, bars, and

C. These conditions must be available to each of the water conditioning units.

2. Temperature of water out of WCU that cools the server is dependent on measured dew point as well as building water temperature. MCM performance is unaffected as long as dew point does not exceed 17 water does not exceed 20 in more humid environments or in cases with warm building chilled water. If building chilled water exceeds

C or room dew point exceeds 170C, the water to server temperature will continue to rise and at some point

C. However, the amount of heat removed by rear of frame heat exchangers is reduced

may lower processor frequency.

C and building

54 zEC12 IMPP

Table 18. Required building chilled water conditions - (140C-200C)

Level 01f

Number of nodes

Max kw to water

Chilled water per Water Conditioning Unit (Water-cooled)

Building chilled water in

Flow (LPM) 13.5 16 20 20 20 25 25

Pressure Drop (Bar) 0.34 0.34 0.34 0.34 0.34 0.34 0.34

Outlet temp

C 21 21 21 21 22 23 24

Flow (LPM) 20 24 27 30 30 35 35

210

Pressure Drop (Bar) 0.34 0.34 0.35 0.37 0.37 0.50 0.50

Outlet temp

C 21 21 21 22 23 23 24

Flow (LPM) 30 33 35 40 40 42 45

314

Pressure Drop (Bar) 0.37 0.44 0.50 0.63 0.63 0.70 0.80

Outlet temp

C 21 21 22 22 23 24 24

Flow (LPM) 40 45 50 50 50 50 55

418

Pressure Drop (Bar) 0.63 0.80 1.0 1.0 1.0 1.0 1.2

Outlet temp

C 20 21 21 22 23 24 24

Notes:

1. Units are liters/minute, bars, and

2. Temperature of water out of WCU that cools the server is dependent on measured dew point as well as building

water temperature. MCM performance is unaffected as long as dew point does not exceed 17 water does not exceed 20 in more humid environments or in cases with warm building chilled water. If building chilled water exceeds

C or room dew point exceeds 170C, the water to server temperature will continue to rise and at some point

C. However, the amount of heat removed by rear of frame heat exchangers is reduced

C. These conditions must be available to each of the water conditioning units.

C and building

may lower processor frequency.

Attention: IBM will supply and use a deionized (DI) water solution that is mixed with benzotriazole (BTA), a corrosion inhibitor, for use within the system side cooling loop of water cooled products. BTA is mixed with the deionized water to a concentration of 1000 parts per million by weight. The customer must dispose of the water solution in accordance with applicable laws and regulations and product characteristics at the time of disposal.

The Service Support Representative (SSR) will fill or drain the system of this solution as required for an install, uninstall, or some maintenance procedures, such as a book replace. The Fill and Drain kit and water container should be stored where the SSR can readily access it as needed, and it should be stored in a climate controlled environment with the other system service tools and equipments needed to install, service, relocate, or discontinue a system. The Fill and Drain kit is used for a water-cooled system or a radiator-cooled system. The water container holds 15.5 – 16.0 liters (4 gallons) of deionized water mixed with a concentration of 0.1% (900-1000 ppm) of Benzotriazole (BTA) by weight.

For detection and location reporting of potential fluid leaks, there are leak detection systems you can use beneath a raised floor. These systems are generally used to detect leaks from glycol, condenser water, and chilled water cooling piping, humidification feed water piping. If desired, these sensor detection systems can be used to monitor for potential product leaks, such as the BTA water solution, which is 99.9% deionized water.

Glycol will lower the thermal efficiency of heat exchangers. Its effect will vary by concentration and possibly heatload. Tables provided in this documentation show how much building chilled water to supply versus configuration for chilled water without glycol. Customers should be aware that glycol has a diluting effect on heat transfer properties versus pure water. That means if used in a rear door heat

Chapter 3. Models and physical specifications 55

exchanger, less heat will be removed from the exit air and, when used to cool the zEC12 WCU, the flow

Level 01f

rate must be increased when glycol is added. For example, adding 20% ethylene glycol to the building water supply will require a 10% increase in the flow rate to maintain the same cooling level as a 0% ethylene glycol water supply. Adding 40% ethylene glycol to the building water supply will require a 30% increase in the flow rate to maintain the same cooling level as a 0% ethylene glycol water supply.

Contact your IBM marketing specialist or installation planner if you need specific information regarding the use of glycol in your facility.

56 zEC12 IMPP

Considerations for multiple system installations

Level 01f

When integrating a zEC12 into an existing multiple-system environment, or when adding additional systems to an installed zEC12, consider the following factors:

v Thermal interactions

Although computer room floor space is valuable, for optimal cooling, it is recommended that zEC12 servers have a 1168 mm (46 in) aisle between rows of systems to reduce surrounding air temperature. See “Cooling recommendations for the room” on page 42.

v Floor placement

zEC12 must be precisely placed for the cable openings to match the floor cutouts. There is zero tolerance for variance from the frame positioning in relation to the floor tiles.

v Floor loading

When trying to optimize floor space utilization, floor loading weight distribution rules may be inadvertently violated by overlapping weight distribution areas of adjacent machines. Obtain the services of a qualified structural engineer if you are uncertain of the floor load assessment for your computer room.

Chapter 3. Models and physical specifications 57

Level 01f

58 zEC12 IMPP

Chapter 4. Guide for raised floor preparation

Level 01f

This chapter provides recommendations and requirements for making the necessary openings in the raised floor for installation.

The drawings on the following pages are intended only to show relative positions and accurate dimensions of floor cutouts. They are not machine templates and are not drawn to scale.

Raised floor cutouts should be protected by electrically non conductive molding, appropriately sized, with edges treated to prevent cable damage and to prevent casters from rolling into the floor cutouts.

Note: For a water-cooled model on a raised floor, the height of the raised floor (subfloor to top surface of

floor tile) must be a minimum of 228.6 mm 9 inches) to accommodate the bend radius of the water hoses.

Casters

Level 01f

The following illustration shows the physical dimensions around the casters. When planning for both the movement and positioning of the system, be aware that each caster swivels in a circle slightly larger than 130 mm (5.1 in) in diameter. Exercise caution when working around floor cutouts.

Front Front

49.6 mm (1.96 in)

15.5 mm (0.6 in)

222.3 mm (8.75 in)

130.2 mm (5.17 in)

127.0 mm (5.00 in)

Swivel diameter

Radiator-cooled models

157.5 mm (6.2 in)

Caster - frame

dimensions

100.2 mm (4.00 in)

Water-cooled models

100.2 mm (4.00 in)

60 zEC12 IMPP

47.6 mm (1.87 in) 28.7 mm (1.13)

Leveling foot - frame

dimensions

100.2 mm (4.00 in)

Increased frame dimension

on water-cooled models

( 100.2 mm (4 in) )

Procedure for cutting and placement of floor panels

Level 01f

Important:

zEC12, fully configured, can weigh in excess of 2494 kg (5500 lb). You must be certain that the raised floor on which you are going to install the server is capable of supporting this weight. Contact your floor tile

manufacturer and a structural engineer to verify that your raised floor is safe to support the zEC12.

Depending on the floor panel type, additional panel supports (pedestals) may be necessary to maintain the structural integrity of an uncut panel, or to restore the integrity of a cut floor panel. Consult the panel manufacturer and the structural engineer to ensure that the panel can sustain the concentrated loads.

Ensure adequate floor space is available to place the frames over the floor panels exactly as shown on the drawing.

Note: Frame template P/N 41T8506 can be ordered by your IBM service representative to assist in the system layout on your raised floor.

DANGER: Heavy equipment — personal injury or equipment damage might result if mishandled.

(D006)

__ 1. Identify the panels needed, and list the total quantity of each panel required for the installation. __ 2. Cut the required quantity of panels. Panels A1, A4, C1, and C4 are optional. If you have existing

equipment already installed over these panels, you do not have to cut them.

__ 3. Additional panel supports (pedestals) are recommended to restore the structural integrity of the

cut floor tile panels.

__ 4. When cutting the panels, you must adjust the size of the cut for the thickness of the edge molding

you are using. The dimensions shown are finished dimensions.

__ 5. For ease of installation, number each panel as it is cut as shown on the panel specification pages. __ 6. Use the raised floor diagram to install the panels in the proper positions. __ 7. You will need as many as eight uncut floor tiles to temporarily replace A1 through A4 and C1

through C4 during the physical placement of the frames. After frame placement, the uncut tiles can be removed and the cut tiles for A1 through A4 replaced in the floor.

Chapter 4. Guide for raised floor preparation 61

Raised floor with 610 mm (24 in) or 600 mm (23.5 in) floor panels

Level 01f

Cable exit cutouts

Rear

Front

545 mm (21.5 in)

94 mm

(3.7 in)

(Panels A2, C2)

Figure 12. Raised floor with floor panels

545 mm

(21.5 in)

(Panels A3, C3)

110 mm

(4.3 in)

(Panels A4, C4)

94 mm (3.7 in)

110 mm

(4.3 in)

(Panels A1, C1)

Frame

Entry/Exit

Front Rear

Cutout dimensions

for raised floor

(mm) (in)

94 x 655 94 x 655

3.7 x 25.8

62 zEC12 IMPP

Important:

Level 01f

Extra pedestals may be placed as shown in Figure 13:

1. Pedestals Bp1, Bp2, Bp3, Bp4, Cp1, Cp3, Cp4, and Cp6 may be placed approximately under each caster position to prevent floor tile panels from sagging.

2. Pedestals Cp2 and Cp5 may be used to support the cut corners of floor tiles C2 and C3.

3. Pedestals Ap1, Ap2, Ap3, Ap4, Ap5, and Ap6 may be used to support the cut corners of floor tiles A1, A2, A3

and A4. Although these four tiles are not load-bearing, equipment, moving in the row where these floor panels sit, may place high loads momentarily on the tiles.

4. If you are using either the frame tie-down features (FC 8000 or FC 8001), you may want to place additional pedestals under the bars that rest on the floor tile panels after the features have been installed.

All of these extra pedestals are recommendations. You must decide which, if any, of these recommendations to use.

Extra Pedestal Placement

Rear

Ap3

Ap1

Bp1

Ap2

Bp2

Cp1

Front

Figure 13. Extra pedestal placement

Cp3

Cp2

Ap4

Bp3

Cp4

Ap5

Cp5

Ap6

Bp4

Cp6

All pedestals should be adjusted to just contact the underside of each floor panel before the frames are rolled into place. Depending on your floor panel type, additional supports (pedestals) may be necessary to restore the structural integrity of cut panels.

Chapter 4. Guide for raised floor preparation 63

Level 01f

64 zEC12 IMPP

Chapter 5. Power requirements

Level 01f

The zEC12 requires the following: v System frame

– 50/60 Hz AC or high voltage DC – Voltage ranges:

- AC: 200V to 480V AC, three-phase wiring

- DC: 380V to 520V DC The system requires either: – For configurations using a total of six or less Bulk Power Regulators (BPRs) - Tw o power feeds, of

the types previously described, each with the same nominal voltage. One is connected to the front of

the Z frame, and one is connected to the rear of the Z frame. or – For all other configurations - Four power feeds, of the types previously described, each with the

same nominal voltage. Two are connected to the front of the Z frame, and two are ocnnected to the

rear of the Z frame. There are no power feeds to the A frame.

You cannot use a mix of DC power and AC power. The input power for the zEC12 must be

exclusively AC or exclusively DC.

Refer to the Appendix D, “3-phase dual power installation,” on page 133 for the correct wiring method for your particular power distribution equipment.

Read the following information about Plan Ahead feature codes. – If you choose a server that requires only two power cords, but want to be prepared for future

growth, you may order the Line Cord Plan Ahead feature (FC 2000), which ships all four line cords

regardless of the number of BPRs. – If you expect that your server may eventually be adding additional processors or PCIe I/O drawers,

I/O drawers or I/O cages, you may want to consider the Balanced Power Plan Ahead feature (FC

3003), which adds the maximum number of Bulk Power Regulators (BPRs) to your server's power

supplies. A fully-configured server uses twelve BPRs. So, for example, if your server configuration

would only require six BPRs, the Balanced Power feature would add six more BPRs to maximize

available power. If not already included in your order, the Line Cord Plan Ahead feature would also

automatically be added along with Balanced Power. Finally, if your server is going to use the

Internal Battery Feature (IBF) (FC 3213), Balanced Power Plan Ahead will automatically supply the

maximum number of batteries, six IBFs, with your server. – Balanced Power Plan Ahead (FC 3003) does not apply to servers using the DC power cord option. – The Balanced Power and Line Cord Plan Ahead features give you the chance to eliminate future

service downtime when upgrading your server.

v Hardware Management Console

A single-phase feed from a customer-supplied service outlet. The outlet must provide 100V to 130V or 200V to 240V 50/60Hz single-phase AC power.

Power installation considerations

Level 01f

zEC12 operates from two fully-redundant power supplies. These redundant power supplies each have their own line cords, or pair of line cords, allowing the system to survive the loss of customer power to either line cord or line cord pair. If power is interrupted to one of the power supplies, the other power supply will pick up the entire load and the system will continue to operate without interruption. Therefore, the line cord(s) for each power supply must be wired to support the entire power load of the system.

Note: The power cord set(s) provided are for use only with this product.

For the most reliable availability, the line cords in the front (A) and the rear (B) of the Z frame should be powered from different PDUs. The A line cord or cords exit the front of the Z frame and should be connected to one PDU. The B line cord or cords exit the rear of the Z frame and should be connected to a different PDU than the A cord or cords.

See Appendix D, “3-phase dual power installation,” on page 133 for examples of typical redundant wiring facilities.

The power supplies at the front end of the system use active resistive load synthesis. Harmonic distortion of the current waveform is small enough that it need not be considered in planning the installation. The power factor is typically 0.95 or higher.

The utility current distribution across the phase conductors (phase current balance) depends on the system configuration. Each front end power supply is provided with phase switching redundancy. The loss of an input phase is detected and the total input current is switched to the remaining phase pair without any power interruption. Depending on the configuration input power draw, the system can run from several minutes to indefinitely in this condition. Since most single phase losses are transients which recover in seconds, this redundancy provides protection against virtually all single phase outages.

Supply type Nominal voltage range (V) Voltage tolerance (V) Frequency range (Hz)

Two or four redundant

3-phase line cords

Two or four redundant

DC line cords

Source type Frequency Input voltage range (V) Rated input current (A)

Three-phase (60A plug) 50/60 Hz 200 - 240V 48A Three-phase (all except 60A plug) 50/60 Hz 380 - 415V 25A Three-phase (all except 60A plug) 50/60 Hz 480V 20A DC N/A 380 - 520V 44A

200-480 180-509 47-63

380-520 350-550 N/A

66 zEC12 IMPP

I/O units

Level 01f

Table 19. I/O unit descriptions and values

Feature code I/O unit description I/O unit value

4008 I/O drawer - 5 EIA units tall. Holds 8 I/O adapters installed horizontally. 1 4007 I/O cage - 14 EIA units tall. Holds 28 I/O adapters installed vertically. 2 4009 PCIe I/O drawer - 7 EIA units tall. Holds 32 I/O adapters installed vertically. 1

Chapter 5. Power requirements 67

Line cord/bulk power regulator (BPR) specifications

Level 01f

The following tables provide number of line cords and number of BPRs required based on the number of processor books and number of I/O units in the server configurations.

Table 20. Number of line cords required per side

3, 4

3 3 4 5 5

Number of I/O units

0123456

H20 (1 processor book) 1111111 H43 (2 processor books) 1111122 H66 (3 processor books) 1122222 H89 (4 processor books) 2222222

HA1 (4 processor books) 2222222

Note:

1. See “I/O units” on page 67 for I/O descriptions and values.

Table 21. Number of BPRs installed per side

Number of I/O units

0123456

H20 (1 processor book) 1 H43 (2 processor books) 2 H66 (3 processor books) 3 H89 (4 processor books) 4

HA1 (4 processor books) 4

Note:

1. Single-line power cord pair.

2. Two-line power cord pair.

3. See “I/O units” on page 67 for I/O descriptions and values.

4. Current balance on the phases is determined by the BPR count in this table. The balance (or imbalance) is

defined in Table 22 on page 69.

68 zEC12 IMPP

Table 22. Current balance per line cord

Level 01f

1st cord set 2nd cord set

1 BPR/side unbalanced A 2 BPRs/side unbalanced B 3 BPRs/side balanced

— —

— 4 BPRs/side balanced unbalanced A 5 BPRs/side balanced unbalanced B

6 BPRs/side

balanced balanced

Note:

1. Unbalanced A - only two phases carry equal current. The third phase carries zero.

2. Unbalanced B - two phases carry equal current. The third phase carries 1.73 times the current carried by the

other two.

3. Balanced - all phases carry the same current.

4. Only available with FC 3003 (balance power).

Table 23. Current balance Example

Example 1 - Model H20 with 1 I/O unit

From Table 21 on page 68, the number of BPRs per side = 1 From Table 22, the phase currents are unbalanced A on the first line cord set (there is no second line cord set.)

Table 24. Current balance Example

Example 1 - Model H43 with 4 I/O units

From Table 21 on page 68, the number of BPRs per side = 3 From Table 22, the phase currents are balanced on the first line cord set (there is no second line cord set.)

Table 25. Current balance Example

Example 1 - Model H66 with 3 I/O units

From Table 21 on page 68, the number of BPRs per side = 4 From Table 22, the phase currents are balanced on the first line cord set. The phase currents are unbalanced A on the

second line cord set.

Table 26. Current balance Example

Example 1 - Model H89 with 4 I/O units

From Table 21 on page 68, the number of BPRs per side = 5 From Table 22, the phase currents are balanced on the first line cord set. The phase currents are unbalanced B on the

second line cord set.

Table 27. Current balance Example

Example 1 - Model HA1 with 5 I/O units

From Table 21 on page 68, the number of BPRs per side = 5 From Table 22, the phase currents are balanced on the first line cord set. The phase currents are unbalanced B on the

second line cord set.

Chapter 5. Power requirements 69

Power specifications

Level 01f

The following tables provide system power consumption/heat load based on the number of processor books and number of I/O units in the server configurations. The data is shown for servers at sea level.

Real customer configurations will come out lower in the power estimator than the numbers in the table because the table numbers represent the maximum possible configuration which is unrealistic for an actual system. In addition, a warm room is assumed, which results in higher fan power, hopefully not the normal situation for most installations. Finally, the numbers below assume that batteries are present and charging.

Note: Power will be somewhat lower for DC input voltage.

As an example, a typical 4 book system in a typical data center would compute to about 17.6 kW for radiator-cooled and 16.7 kW for water-cooled in the estimator with data from the customer's eConfig output vs the absolute maximum of 27.6 kW for radiator-cooled and 26.6 kW for water-cooled in the table below.

Table 28. System power consumption - Radiator-cooled

Number of I/O units

0123456

Utility power - 1 processor book 5.8 7.7 9.7 11.3 13.2 13.4 13.4 Utility power - 2 processor books 9.7 11.6 13.4 15.2 17.1 19.0 19.8 Utility power - 3 processor books 13.2 15.0 16.9 18.8 20.5 22.4 23.3 Utility power - 4 processor books 17.6 19.5 21.4 23.2 24.9 26.8 27.6

Note:

1. See “I/O units” on page 67 for I/O descriptions and values

2. Assumes maximum supported configuration (maximum I/O adapters installed)

3. The power factor is approximately unity.

4. Input power (kVA) equals heat output (kW).

5. For heat output expressed in kBTU per hour, multiply table entries by 3.41.

6. See Appendix D, “3-phase dual power installation,” on page 133 for recommendations on utility connections

which better balance the current for installations where multiple systems are connected to the same power panel.

70 zEC12 IMPP

Table 29. System power consumption - Water-cooled

Level 01f

Number of I/O units

0123456

Utility power - 1 processor book 5.5 7.4 9.4 11.0 12.9 13.1 13.4 Utility power - 2 processor books 9.1 10.9 12.7 14.6 16.4 18.3 19.1 Utility power - 3 processor books 12.4 14.3 16.1 18.0 19.7 21.6 22.5 Utility power - 4 processor books 16.7 18.6 20.7 22.3 24.1 25.8 26.6

Note:

1. See “I/O units” on page 67 for I/O descriptions and values

2. Assumes maximum supported configuration (maximum I/O adapters installed)

3. The power factor is approximately unity.

4. Input power (kVA) equals heat output (kW).

5. For heat output expressed in kBTU per hour, multiply table entries by 3.4.

6. See Appendix D, “3-phase dual power installation,” on page 133 for recommendations on utility connections

which better balance the current for installations where multiple systems are connected to the same power panel.

7. The power advantage from using water cooling increases with the size of the system.

Chapter 5. Power requirements 71

Power estimation tool

Level 01f

The power estimator tool for the zEC12 allows you to enter your precise server configuration to produce an estimate of power consumption. In addition, the tool now can produce an estimate of the weight of your server.

Log on to Resource Link at http://www.ibm.com/servers/resourcelink. Navigate to Tools, then to Power and weight estimation. Specify the quantity for the features that are installed in your machine. This tool estimates the power consumption for the specified configuration. The tool does not verify that the specified configuration can be physically built.

Note: The exact power consumption for your machine will vary. The object of the tool is produce an estimation of the power requirements to aid you in planning for your machine installation.

Actual power consumption after installation can be confirmed using the HMC Monitors Dashboard task.

Power capping

zEC12 supports power capping, which gives the customer the ability to limit the maximum power consumption and reduce cooling requirements (especially with zBX). To use power capping, Automate Firmware Suite (FC 0020) must be ordered. This feature is used to enable the Automate suite of functionality associated with the IBM zEnterprise Unified Resource Manager. The Automate suite includes representation of resources in a workload context, goal-oriented monitoring and management of resources, and energy management. The Automate suite is included in the base zCPC at no charge for CPs, zIIPs, and zAAPs.

72 zEC12 IMPP

Customer circuit breakers (CBs)

Level 01f

The following table shows the maximum circuit breaker ratings based on input voltage.

Input voltage range (V) System rated current (A) Circuit breaker

208 - 240 VAC 48A 60A/63A W/T 380 - 415 VAC 25A 32A W/T

480 VAC 20A 30A

380 - 520 VDC 44A 60A DC/63A DC W/T

It is recommended, for simplicity and ease of upgrades, that the circuit breaker ratings in this table be used on all power cords for all installations. The actual power drawn (heat load) by any configuration will not be affected.

Note: System z server design incorporates Electromagnetic Interference filter capacitors required to block electrical noise from penetrating the power grid. A characteristic of filter capacitors, during normal operation, is high leakage currents. Depending on the server configuration, this leakage current can reach 350mA (350 milliamps). For most reliable operation, Ground Fault Circuit Interrupter (GFCI), Earth

Leakage Circuit Breaker (ELCB) or Residual Current Circuit Breaker (RCCB) type circuit breakers are not recommended for use with System z servers. By internal design and grounding, System z servers

are fully certified for safe operation (compliance with IEC, EN, UL, CSA 60950-1).

However, if leakage detection circuit breakers are required by local electrical practice, the breakers should be sized for a leakage current rating not less than 500mA in order to reduce the risk of server outage caused by erroneous and spurious tripping.

Chapter 5. Power requirements 73

Internal battery feature (FC 3213)

Level 01f

The Internal Battery Feature (IBF) (FC 3213) is optional on the zEC12. In the event of input power interruption to the system, the internal battery feature will provide sustained system operation for the times listed in the following table.

Table 30. IBF holdup times

Number of I/O units

0123456

1 processor node 7.7 min

5.0 min

2 processor nodes 9.7 min113.6 min111.0 min 3 processor nodes 11.1 min19.3 min 4 processor nodes 7.6 min

6.8 min

Note:

1. Single-line power cord pair.

2. Two-line power cord pair.

3. The holdup times in this table are valid for batteries 3 years old or less that have seen normal service life (2 or

less complete discharges per year) with the system input power at N+1 operation.

4. Batteries are only connected to the Bulk Power Regulators associated with the section 1 power cords.

5. These holdup times are estimates. Your particular battery holdup time for any given circumstance may be

different.

6. Holdup times vary depending on the number of BPRs installed. As the number of BPRs increases, the holdup time also increases until the maximum number of BPRs is reached. Once six BPRs (three per side) are installed no additional batteries are added so the time decreases from that point.

4.0 min

8.0 min

6.1 min

7.9 min111.9 min111.0 min111.0 min

9.1 min

7.1 min

5.0 min

7.9 min

6.4 min

4.4 min

7.0 min

5.2 min

4.0 min

6.7 min

4.9 min

3.8 min

74 zEC12 IMPP

Unit emergency power off (UEPO)

Level 01f

There is a unit emergency power off (UEPO) switch on the front of the primary frame (A frame) of each system. When tripped, the UEPO switch will immediately disconnect utility and battery power from the machine functional unit. Utility power is confined to the machine power compartment. All volatile data will be lost.

Unit EPO Panel

Mounting Screw

Unit EPO

Switch

Unit EPO Panel

Mounting Screw

Front View

Unit EPO Panel

BYPASS ACTIVE

Rear View

Unit EPO Panel

A Side

BPI

Cable

J01

B Side BPI Cable

J02

Customer

Supplied

Cable

J03

ACTIVE BYPASS

Room Disconnecting Means/ Emergency Power Off Actuator

Figure 14. UEPO panels

Room Disconnecting Means/

Emergency Power Off Actuator

Figure 14 illustrates both the front and the rear of the machine UEPO panel. The rear view shows where the room electrical power disconnecting means, or room Emergency Power Off, EPO, cable plugs into the machine. Notice the switch actuator. Once moved to make the cable connection possible, the room disconnecting means / EPO cable must be installed for the machine to power on.

Chapter 5. Power requirements 75

Computer room emergency power off (EPO)

Level 01f

When the internal battery backup feature is installed and the room disconnecting means / EPO is tripped, the batteries will engage and the computer will continue to run. It is possible to attach the computer room disconnecting means / EPO system to the machine UEPO switch. When this is done, tripping the room disconnecting means / EPO will disconnect all power from the line cords and the internal battery backup unit. In this event all volatile data will be lost.

To incorporate the IBF into the room disconnecting means / Emergency Power Off (EPO) systems, a cable must be made to connect to the back of the system UEPO panel. The following diagram illustrates how this connection is made.

4321

Room UEPO Switch Schematic

Figure 15. UEPO switch schematic

AMP Part Number -- 770019-1

Contact Number

2 Pole Normally-closed Pushbutton

In Figure 15, an AMP connector 770019-1 is needed to connect to the system UEPO panel. For room disconnecting means / EPO cables using wire sizes #20 AWG to #24 AWG use AMP pins part number 770010-4. The permissible resistance of the customer connection is 5 Ohms Maximum (~200' of #24 AWG).

76 zEC12 IMPP

Power plugs and receptacles

Level 01f

Plugs are shipped with the machine line cords in USA and Canada. The line cord length is 4250 mm (14 ft). Power plugs in the following table are approved for use with specified models and meet the relevant test laboratory or country/test-house standards. The power plug must be connected to a correctly wired and grounded receptacle. The customer is responsible for receptacle wiring.

For countries that require other types of plugs or receptacles, the system is shipped without plugs on the line cords, and you are responsible for supplying and installing both plugs and receptacles.

Important:

In a typical three-phase power cord, there are five wires inside the cut cord cable. There are the three phase wires, one ground wire and there is a fifth, small diameter wire, connected to the cable shield, that acts as a drain. This drain wire must be connected to the cable ground, NOT neutral.

DC power cord

The DC power cord is illustrated below.

Vdc2

Vdc1

Earth

GND plus minus

C GND B A

Customer DC source

DC Line cord

Machine plug

The DC feed is on the B line. The C and A lines are the DC return. The crimp between the C line and A line is internal on cords with a customer plug. For cut end cords, the C and A lines must both be tied to the negative side of the source because all four wires exit the cord body separately. Reference the following table for DC voltage information.

Table 31. Input voltage range

Parameter Absolute maximum Absolute minimum

Vdc1 + Vdc2 550V 330V

Vdc1 550V 0V Vdc2 420V 0V

Chapter 5. Power requirements 77

Table 32. Supported power cords

Level 01f

System location

USA, Canada, Japan (200-240 VAC)

USA, High Voltage (480 VAC)

USA, Canada

(380-415 VAC)

World Trade (208-240 VAC)

World Trade (380-415 VAC)

Supported power cord

feature codes

8952 8955 8993

8950 8983

8976 8977

8949 8982 8996

8951 8988 8998

Watertight plug Watertight receptacle

60A IEC-309 (provided as part of the cord)

30A IEC-309 (provided as part of the cord)

30A IEC-309 provided as part of the cord)

No plug provided. Cut end cord. Plug is provided by the customer and is electrician-installed.

60A IEC-309 460R9W (not provided)

30A IEC-309 430R7W (not provided)

30A HBL430R6V02 (not provided)

(not specified)

USA, Canada, Japan (380-520 VDC)

World Trade (380-520 VDC)

8947 8953 8963

8948 8965

60A (provided as part of the cord)

No plug provided. Cut end cord. Plug is provided by the customer and is electrician-installed.

360R8WDC (not provided)

(not specified)

Notes:

1. IBM continues to strongly recommend the use of a metal backbox (example shown below) with our line cords using IEC-309 plugs. Although in-line connectors and nonmetallic backboxes are available and compatible, they are not recommended. These recommendations are based on the metal backbox providing:

v An added level of protection against a mis-wired phase and ground reversal v In some cases, a metal backbox may be better for EMI mitigation

You may choose not to use a metal backbox. In this case, please check your local code for specific requirements.

2. The customer must obtain the appropriate plugs and receptacles, based on existing electrical codes, where those plugs and receptacles are not provided with the system.

3. See “Line cord wire specifications” on page 83 for descriptions of the power cord feature codes.

78 zEC12 IMPP

4. This plug is dual listed at 30A and 32A.

Level 01f

Chapter 5. Power requirements 79

Grounding specifications

Level 01f

Every three-phase circuit must contain three-phase conductors and an insulated equipment-grounding conductor. Every single-phase 120 volt branch circuit (used for the Hardware Management Console and service outlets) must contain one phase conductor, a neutral conductor, and an insulated equipment-grounding conductor.

For 208 VAC through 240 VAC installations worldwide, the equipment-grounding conductor must match local electrical codes and must be green with or without one or more yellow stripes on the insulation. IBM recommends that the ground wire be the same size as the phase conductor wires.

Conduit must not be used as the only grounding means. However, any conduit or cable shield must be connected at both ends in such a way that it is included in the grounding path in parallel with the grounding conductor it contains. Most electrical codes require that branch circuit wiring be located in metallic conduit, or be made from shielded cable, if located under a raised floor. Even when not required by local regulations, some form of shield around the branch circuit wiring is strongly recommended as a means of reducing coupling of high-frequency electrical noise into signal and control cables.

For information about additional recommendations and requirements for equipment grounding, go to Resource Link (http://www.ibm.com/servers/resourcelink). See General Information for Planning a

Physical Site.

80 zEC12 IMPP

Top exit power cords

Level 01f

zEC12 has the option of top exit power cord cabling. There are several power cord options specifically made for top exit, and you must chose one of these if you want to have the power cords exit through the top of the server. The top exit power cords are manufactured with additional hardware that mounts the cord to the frame of the machine and provides an EMC seal at the same time.

For power cord top exit, choose from the following power cord feature codes: 8947, 8948, 8949, 8950, 8951, 8952, 8953, 8955, and 8977.

For feature codes 8947, 8952, 8953, and 8955, these 60 amp IBM cords end directly at the top of the frame. Therefore, your cords must be long enough to reach the frame. See Figure 16.

plugged 60 amp connections

cut cords or 30 amp cords

A frame

Z frame

Figure 16. Top exit power cords - plugged 60 amps connection, cut cord or 30 amp cord connection

Z frame

A frame

For feature codes 8948, 8949, 8950, 8951, and 8977, your receptacle must drop to within 305 mm (1 ft) of the top of the frame and be no further than 305 mm (1 ft) from the front door or side cover of the frame. (See Figure 17 on page 82 and Figure 16.

Chapter 5. Power requirements 81

305 mm (1 ft)

Level 01f

305 mm (1 ft)

Front view

305 mm (1 ft)

Figure 17. Receptacles for top exit power cords

Top view

82 zEC12 IMPP

Line cord wire specifications

Level 01f

Line cord usage location Feature code AWG # / type

USA, Canada, Japan (380-520 VDC) 60A top exit cord ends at top of rack

World Trade (380-520 VDC) cut top exit cord 14 ft

World Trade, low voltage cut top exit cord 14 ft

USA (480 VAC) 30A top exit cord 6ft

World Trade, high voltage cut top exit cord 14 ft

USA, Canada, Japan (200 VAC) 60A top exit cord ends at top of rack

USA, Canada, Japan (380-520 VDC) 60A top exit cord ends at top of rack

USA, Canada, Japan (200 VAC) 60A top exit cord ends at top of rack

USA, Canada, Japan (380-520 VDC) 60A bottom exit cord 14 ft

World Trade (380-520 VDC) bottom exit cord 14 ft

USA, Canada (380-415 VAC) 30A bottom exit cord 14 ft

USA, Canada (380-415 VAC) 30A top exit cord 6ft

8947

8948

8949

8950

8951

8952

8953

8955

8963

8965

8976

8977

#6 AWG

Type PPE

#6 AWG

Type PPE

#6 AWG

Type PPE

#10 AWG

Type ST

#10 AWG

Type ST

#6 AWG

Type PPE

#6 AWG

Type PPE

#6 AWG

Type PPE

#6 AWG

Type PPE

#6 AWG

Type PPE

#10 AWG

Type ST

#10 AWG

Type ST

Number of

shields

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

Connector

supplied

Yes 28.5 (1.12)

No 28.5 (1.12)

Yes 18.54 (0.73)

No 18.54 (0.73)

Yes 28.5 (1.12)

No 28.5 (1.12)

Yes 18.54 (0.73)

Bulk outside diameter mm

(in)

Chapter 5. Power requirements 83

Line cord usage location Feature code AWG # / type

Level 01f

World Trade, low voltage (200-240 VAC) bottom exit cord 14 ft

USA, high voltage (480 VAC) 30A bottom exit cord 14 ft

World Trade, high voltage (380-415 VAC) bottom exit cord 14 ft

USA, Canada, Japan (200-240 VAC) 60A bottom exit cord 14 ft

World Trade, low voltage (200-240 VAC) bottom exit cord 14 ft low smoke, halogen-free

World Trade, high voltage (380-415 VAC) bottom exit cord 14 ft low smoke, halogen-free

Note:

1. Where plugs are provided, Hubbell is the plug supplier.

2. If you choose to use a Hubbell receptacle, do NOT use the Hubbell C-Series Light Industrial

3. The customer must obtain the appropriate plugs and receptacles, based on existing electrical codes, where those

plugs and receptacles are not provided with the system.

4. The power cord set(s) provided are for use only with this product.

5. FCs 8952 and 8955 are for top exit connections to a 200 to 240 VAC source in the US, Canada and Japan. They

have IEC-309 60A AC plugs hard connected to the top of the frame. They are coordinated as follows:

v For systems requiring 2 cords, order FC 8952. v For systems requiring 4 cords (or plan ahead to 4 cords), order both 8952 and 8955. v For an upgrade from a system with 2 cords to a system requiring 4 cords, order 8955.

6. FCs 8947 and 8953 are for top exit connections to a 380 to 520 VDC source in the US, Canada and Japan. They have IEC-309 60A DC plugs hard connected to the top of the rack. They are coordinated as follows:

v For systems requiring 2 cords, order FC 8947. v For systems requiring 4 cords (or plan ahead to 4 cords), order both 8947 and 8953. v For an upgrade from a system with 2 cords to a system requiring 4 cords, order 8953.

8982

8983

8988

8993

8996

8998

#6 AWG

Type DP-1

#10 AWG

Type DP-1

#10 AWG

Type DP-1

#6 AWG

Type PPE

#6 AWG

Type LSZH

#10 AWG

Type LSZH

Number of

shields

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

1 (overall gross

shield)

Connector

supplied

No 28.5 (1.12)

Yes 14.48 (0.57)

No 14.48 (0.57)

Yes 28.5 (1.12)

No 25.91 (1.02)

No 15.00 (0.59)

Bulk outside

diameter mm

(in)

84 zEC12 IMPP

Wire colors for cut-end three-phase alternating current cords

Level 01f

Wire Number Color Description

Line 1 Brown Phase 1 (labeled "PH-1" on the wire insulation Line 2 Black Phase 2 (labeled "PH-2" on the wire insulation Line 3 Gray Phase 3 (labeled "PH-3" on the wire insulation Ground Green/Yellow Ground (labeled "GND" on the wire insulation Drain clear or uninsulated Cable shield - must be connected to GROUND

Wire colors for cut-end direct current cords

Wire Number Color Description

Line 1 Black (labeled "-" on the wire insulation Line 2 Red (labeled "+" on the wire insulation Line 3 Black (labeled "-" on the wire insulation Ground Green/Yellow Ground (labeled "GND" on the wire insulation Drain clear or uninsulated Cable shield - must be connected to GROUND

Line physical protection

In US installations, the line cord must meet National Electric Code (NEC) requirements. When line cords are run on the surface of the floor, they must be protected against physical damage. (See NEC 645-5.) For other countries, local codes apply.

Service outlet (customer-supplied)

A duplex service tool outlet should be installed within 1.5 m (5 ft) of the system frame. The power requirement is 110V/120V for USA and Canada (other power requirements are country dependent). The service tool outlets should be fed from the same power source as the system. The service tool outlet should be placed on a separate circuit breaker so it can be used when the processor frame circuit breaker is off.

Chapter 5. Power requirements 85

Level 01f

86 zEC12 IMPP

IBM zEnterprise EC12 Installation Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Contents

Safety

Safety notices

Danger notices

World trade safety information

Laser safety information

Laser compliance

About this publication

Revisions

Related publications

Licensed Machine Code

Accessibility

Accessibility features

Keyboard navigation

IBM and accessibility

How to send your comments

Summary of changes

Chapter 1. Introduction

System planning

Planning for a new computer room

Planning checklist

Customized planning aid

ASHRAE declarations - radiator-cooled

ASHRAE declarations - water-cooled

Chapter 2. Environmental specifications

Conductive contamination

Chapter 3. Models and physical specifications

Physical dimensions

Shipping specifications

zEnterprise zEC12 models

I/O cages, I/O drawers, and PCIe I/O drawers

System upgrades

Differences between IBM servers

Plan views

Weight distribution

System weight examples

Weight distribution and multiple systems

Machine and service clearance areas

Cooling recommendations for the room

Special cooling recommendations for water-cooled machine

Water supply

Supply hoses

Materials used in the water cooling units

Water specifications

Considerations for multiple system installations

Chapter 4. Guide for raised floor preparation

Casters

Procedure for cutting and placement of floor panels

Raised floor with 610 mm (24 in) or 600 mm (23.5 in) floor panels

Chapter 5. Power requirements

Power installation considerations

I/O units

Line cord/bulk power regulator (BPR) specifications

Power specifications

Power estimation tool

Power capping

Customer circuit breakers (CBs)

Internal battery feature (FC 3213)

Unit emergency power off (UEPO)

Computer room emergency power off (EPO)

Power plugs and receptacles

Grounding specifications

Top exit power cords

Line cord wire specifications

Wire colors for cut-end three-phase alternating current cords

Wire colors for cut-end direct current cords

Line physical protection

Service outlet (customer-supplied)