IBM z10 User Guide

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IBM System z10™ Enterprise Class

Hardware Overview

CMG – April 15, 2008 Tom Russell – IBM Canada

Thanks to Harv Emery, John Hughes, WSC

IBM Systems

IBM System z

Trademarks

The following are trademarks of the International Business Machines Corporation in the United States and/or other countries.

AIX* APPN* Cell Broadband Engine DB2* DB2 Connect DirMaint DRDA* Distributed Relational Database Architecture e-business logo* ECKD Enterprise Storage Server* ESCON* FICON* GDPS*

* Registered trademarks of IBM Corporation

The following are trademarks or registered trademarks of other companies.

InfiniBand® is a registered trademark of the InfiniBand Trade Association (IBTA). Intel is a trademark of Intel Corporation in the United States, other countries, or both. Java and all Java-related trademarks and logos are trademarks of Sun Microsystems, Inc., in the United States and other countries Linux is a registered trademark of Linus Torvalds in the United States, other countries, or both. UNIX is a registered trademark of The Open Group in the United States and other countries. Microsoft, Windows and Windows NT are registered trademarks of Microsoft Corporation. Red Hat, the Red Hat "Shadow Man" logo, and all Red Hat-based trademarks and logos are trademarks or registered trademarks of Red Hat, Inc., in the United States and other countries. SET and Secure Electronic Transaction are trademarks owned by SET Secure Electronic Transaction LLC.

* All other products may be trademarks or registered trademarks of their respective companies.

Notes: Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput that

any user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage configuration, and the workload processed. Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to the performance ratios stated here.

IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply. All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the results they may

have achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions. This publication was produced in the United States. IBM may not offer the products, services or features discussed in this document in other countries, and the information may be

subject to change without notice. Consult your local IBM business contact for information on the product or services available in your area. All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. Information about non-IBM products is obtained from the manufacturers of those products or their published announcements. IBM has not tested those products and cannot confirm the

performance, compatibility, or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. Prices subject to change without notice. Contact your IBM representative or Business Partner for the most current pricing in your geography.

Geographically Dispersed Parallel Sysplex HiperSockets HyperSwap IBM* eServer IBM logo* IMS InfoPrint* Language Environment* MQSeries* Multiprise* NetView* On demand business logo

OS/390*

Parallel Sysplex* POWER6 PR/SM Processor Resource/Systems Manager RACF* Resource Link RMF

S/390* Sysplex Timer* System z System z9 System z10 TotalStorage*

Virtualization Engine VSE/ESA VTAM* WebSphere* z/Architecture z/OS* z/VM* z/VSE zSeries*

IBM Systems

IBM System z

System z10 EC New Functions and Features

Five hardware models

Faster Processor Unit (PU)

Up to 64 customer PUs

36 CP Subcapacity Settings

Star Book Interconnect

Up to 1,520 GB memory

Fixed HSA as standard

Large Page (1 MB)

HiperDispatch

Enhanced CPACF SHA 512, AES 192 and 256-bit keys

Hardware Decimal Floating Point

New Capacity on Demand architecture and enhancements

SOD: PSIFB for z9 EC & BC for

non-dedicated CF Models*

6.0 GBps InfiniBand HCA to I/O interconnect

FICON Enhancements

SCSI IPL included in Base LIC

OSA-Express3 10 GbE (2Q08)*

HiperSockets enhancements

InfiniBand Coupling Links (2Q08)* STP using InfiniBand (2Q08)*

Standard ETR Attachment

FICON LX Fiber Quick Connect

Power Monitoring support

Scheduled Outage Reduction

72 New Instructions

Capacity Provisioning

No support for Japanese Compatibility Mode (JCM) No support for MVS Assist instructions

Improved RAS

* All statements regarding IBM's plans, directions, and intent are subject to change or withdrawal without notice. Any reliance on these Statements of General Direction is at the relying party's sole risk and will not create liability or obligation for IBM.

IBM Systems

IBM System z

z10 EC System Upgrades

E64

z9 EC

E56

 z10 EC to higher z10 EC model

E40

E26

Concurrent Upgrade

z990

E12

► Concurrent upgrade of z10 EC

Models E26, E40 and E56. Upgrade to E64 is disruptive

► When upgrading to z10 EC E64,

unlike the z9 EC, the first Book is retained

 Any z9 EC to any z10 EC  Any z990 to any z10 EC

IBM Systems

IBM System z

IBM System z10 EC Key Dates

 IBM System z10 Announce – February 26, 2008

► First Day Orders ► Resource Link ► Capacity Planning Tools (zPCR, zTPM, zCP3000) ► SAPR Guide (SA06-016-00) and SA Confirmation Checklist available

 Availability – February 26, 2008

► z10 EC all Models ► Upgrades from z990, z9 EC to z10 EC

 Availability – May 26, 2008

► Model upgrades within z10 EC ► Feature Upgrades within the z10 EC – May 26, 2008

™

support available

 Planned Availability* – 2Q 2008

► OSA Express3 10 GbE LR – the first of a new OSA generation ► InfiniBand Coupling Links for any z10 EC and ICF-only z9 EC and BC machines

 New ITSO Redbooks (Draft versions)

● z10 EC Technical Introduction, SG24-7515 - February 26, 2008

● z10 EC Technical Guide, SG24-7516 - February 26, 2008

● z10 EC Capacity on Demand, SG24-7504 - March, 2008

● Getting Started with InfiniBand on z10 EC and System z9, SG24-7539 – May, 2008

* All statements regarding IBM's future direction and intent are subj ect to change or withdrawal without notice, and represent goals and objectives only.

IBM Systems

IBM System z

z10 EC Multi-Chip Module (MCM)

 96mm x 96mm MCM

► 103 Glass Ceramic layers ► 7 chip sites ► 7356 LGA connections ► 17 and 20 way MCMs

PU 1

S 2

PU 4 PU 3

S 3

 CMOS 11s chip Technology

► PU, SC, S chips, 65 nm ► 5 PU chips/MCM – Each up to 4 cores

● One memory control (MC) per PU chip

● 21.97 mm x 21.17 mm

● 994 million transistors/chip

● L1 cache/PU

– 64 KB I-cache – 128 KB D-cache

● L1.5 cache/PU

– 3 MB

PU 0PU 2

● 4.4 GHz

● Approx 0.23 ns Cycle Time

● 6 Km of wire

► 2 Storage Control (SC) chip

● 21.11 mm x 21.71 mm

SC 0SC 1

● 1.6 billion transistors/chip

● L2 Cache 24 MB per SC chip (48 MB/Book)

● L2 access to/from other MCMs

● 3 Km of wire

S 0

► 4 SEEPROM (S) chips

● 2 x active and 2 x redundant

S 1

● Product data for MCM, chips and other engineering

information

► Clock Functions – distributed across PU and SC chips

● Master Time-of-Day (TOD) and 9037 (ETR)

functions are on the SC

IBM Systems

IBM System z

z10 EC Chip Relationship to POWER6™

 Siblings, not identical twins  Share lots of DNA

► IBM 65nm Silicon-On-Insulator (SOI) technology

► Design building blocks:

● Latches, SRAMs, regfiles, dataflow elements

► Large portions of Fixed Point Unit (FXU), Binary Floating-

point Unit. (BFU), Hardware Decimal Floating-point Unit (HDFU), Memory Controller (MC), I/O Bus Controller (GX)

► Core pipeline design style

Enterprise Quad Core z10 Processor Chip

● High-frequency, low-latency, mostly-in-order

► Many designers and engineers

 Different personalities

► Very different Instruction Set Architectures (ISAs)

● very different cores

► Cache hierarchy and coherency model

► SMP topology and protocol

► Chip organization

► IBM z Chip optimized for Enterprise Data Serving Hub

POWER6 Dual Core Chip

IBM Systems

IBM System z

Orderable Processor Features

Books

/PUs

1/17

2/34

3/51

4/68

4/77

CPsModel

IFLs

uIFLs

0 - 12

0 - 12E12

0 - 11 0 - 26

0 - 26E26

0 - 25 0 - 40

0 - 40E40

0 - 39 0 - 56

0 - 56E56

0 - 55 0 - 64

0 - 64E64

0 - 63

zAAPs

ICFs

zIIPs

0 - 6

0-12

0 - 6

0 - 13

0-16

0 - 13 0 - 20

0-16

0 - 20 0 - 28

0-16

0 - 28 0 - 32

0-16

0 - 32

Opt

Saps

0-3

0-7

0-11

0-18

0-21

Std

Saps

Std

Spares

Note: A minimum of one CP, IFL, or ICF must be purchased on every model.

Note: One zAAP and one zIIP may be purchased for each CP purchased.

Note: System z10 EC is designed not to require Optional SAPs for production workloads except sometimes for TPF or z/TPF workloads.

IBM Systems

IBM System z

z9 vs z10 EC CEC Structure

z10 ECz9 EC

SMP Configuration

Topology

Max Memory

Cache Levels

S54

4 books, 64 PUs

Dual Ring

One or Two Hops

Up to 512GB

-HSA?

L1 per PU

L2 per Book

E64

4 books, 77 PUs

Fully Connected

NoYesJumper Books

Up to 1,520 GB

+ 16 GB HSA

L1 and L1.5 per PU

L2 per Book

4 KB and 1 MB4 KBPage Sizes

IBM Systems

IBM System z

z10 EC HiperDispatch

 HiperDispatch – z10 EC unique function

► Dispatcher Affinity (DA) - New z/OS Dispatcher

► Vertical CPU Management (VCM) - New PR/SM Support

 Hardware cache optimization occurs when a given unit of work is consistently

dispatched on the same physical CPU

► Up till now software, hardware, and firmware have had pride in the fact of how

independent they were from each other

► Non-Uniform-Memory-Access has forced a paradigm change

● CPUs have different distance-to-memory attributes

● Memory accesses can take a number of cycles depending upon cache level /

local or remote repository accessed

 The entire z10 EC hardware/firmware/OS stack now tightly collaborates to

obtain the hardware’s full potential

 All supported z/OS releases (z/OS 1.7 requires the zIIP web deliverable)

IBM Systems

IBM System z

System z9 EC CP Subcapacity (12 or Fewer CPs)

CP Capacity

Relative to Full Speed

Subcapacity CP settings

7nn = 100%

6nn

5nn

4nn

aa%

bb%

cc%

nn = 01 Through 12

1-CP through 12-CP only Available on any hardware model

409

509

609

709

410

510

610

710

411

511

611

401

501

601

701

402

502

602

702

403

503

603

703

404

504

604

704

405

505

605

705

406

506

606

706

407

507

607

707

408

508

608

708

1-way 2-way 3-way 4-way 5-way 6-way

7-way 8-way

9-way

10-way

 The System z10 EC will offer 36 CP subcapacity settings with the first twelve or fewer

CPs (general purpose) engines.

► All CPs must be the same capacity within one z10 EC

► On machines with 13 or more CPs, all CPs must run at full speed

711

11-way

412

512

612

12-way

712

 The entry point is approximately xx% of the capacity of the full speed CP

 All specialty engines run at full speed. The one for one entitlement to purchase one

zAAP and one zIIP for each CP purchased is the same for CPs of any speed.

IBM Systems

IBM System z

LSPR Ratios and MSU Values for System z10 EC

z10 EC to z9 EC

Ratios

z10 EC MSU

Values*

LSPR mixed workload average, multi-image for z/OS 1.8 with HiperDispatch active on z10 EC!

Uni-processor

16-way z10 EC to 16-way z9 EC

32-way z10 EC to 32-way z9 EC

56-way z10 EC to 54-way z9 EC

64-way z10 EC to 54-way z9 EC

1.62

1.49

1.54

1.70

115 for 701

1,264 for 716

2,200 for 732

3,395 for 756

3,739 for 764

* Reflects Mainframe Charter Technology Dividend.

IBM Systems

IBM System z

z10 EC Capacity Planning in a nutshell

GHz

MIPs

MSUs

tables

HiperDispatch

Don’t use “one number” capacity comparisons!

Work with IBM technical support for capacity planning!

Customers can now use zPCR

IBM Systems

IBM System z

Evolution of System z Specialty Engines

Building on a strong track record of

technology innovation with specialty

engines – DB Compression, SORT,

Encryption, Vector Facility

Cell Broadband Engine™

IBM System z9

Integrated

Information

Processor (IBM

zIIP) 2006

System z Application

Eligible for zIIP:

Assist Processor

 DB2 remote

(zAAP) 2004

access and BI/DW

Integrated Facility

for Linux (IFL)

2000

Internal Coupling

Facility (ICF) 1997

* All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.

*SOD: IBM plans to enhance z/VM in a future release to support the new System z10 EC capability to allow any combination of CP, zIIP, zAAP, IFL, and ICF processor-types to reside in the same z/VM LPAR

Eligible for zAAP:

 Java

™

execution

environment

 z/OS XML

 ISVs  New! IPSec

encryption

 z/OS XML  z/OS Global

Mirror*

IBM Systems

IBM System z

Large Page Support

 Issue: Translation Lookaside Buffer (TLB) Coverage shrinking as % of

memory size

► Over the past few years application memory sizes have dramatically increased due to

support for 64-bit addressing in both physical and virtual memory

► TLB sizes have remained relatively small due to low access time requirements and

hardware space limitations

► TLB coverage today represents a much smaller fraction of an applications working

set size leading to a larger number of TLB misses

► Applications can suffer a significant performance penalty resulting from an increased

number of TLB misses as well as the increased cost of each TLB miss

 Solution: Increase TLB coverage without proportionally enlarging the TLB

size by using large pages

► Large Pages allow for a single TLB entry to fulfill many more address translations ► Large Pages will provide exploiters with better TLB coverage

 Benefit:

► Designed for better performance by decreasing the number of TLB misses that an

application incurs

IBM Systems

IBM System z

New Instructions

 A large variety of facilities added in the System z10 EC

► General-Instructions Extension Facility (72 new) ► Execute-Extension Facility (1 new) ► Parsing-Enhancement Facility (2 new) ► Compare-and-Swap-and-Store Facility 2 (new function) ► Message-Security-Assist Extensions (new functions) ► Enhanced-DAT Facility (1 new, 3 changed) ► Configuration-Topology Facility (1 new, 1 changed)

 Potential for:

► Significant performance improvement ► Enhanced capabilities ► Simpler code

IBM Systems

IBM System z

Examples – New Instructions

 Compare and Branch

► Replaces Compare, followed by Branch on Condition

 Compare and Trap

► Program Check (Data Exception) if Compare is True

 New Immediate instructions

► Saves having storage references

 Primary motivation: Performance

► ARCH(8) TUNE(8) options in compilers ► I expect Java to get the most benefit

IBM Systems

IBM System z

IBM System z10 EC Capacity on Demand

(CoD)

IBM Systems

IBM System z

Removing Road Blocks

 A permanent upgrade cannot occur while CBU or On/Off CoD is active.  Only one solution can be active at a time  Limited to the permanent capacity

► After a permanent capacity upgrade, the old temporary contract may become useless.

 Cannot add temporary capacity while a Concurrent Book Add is in progress.  No CBU-like replacement capacity offering where a disaster is not involved.  When On/Off CoD or CBU records are activated/deactivated, all

processors

defined in those records must be activated/deactivated.

 The HMC requires connectivity to the IBM Support System to obtain temporary

records or verify passwords at the time of activation.

► HMC connectivity or response time is a potential inhibitor. ► The process to activate capacity can take too long.

 No way to determine which capacity is billable versus replacement  Drastic system slow down occurs if CBU or CBU test expires  Automation provides only limited control

IBM Systems

IBM System z

The Basics – Temporary Upgrades

 Capacity Backup (CBU)

► Predefined capacity for disasters on a other “lost” server(s) ► Concurrently add CPs, IFLs, ICFs, zAAPs, zIIPs, SAPs ► Pre-paid

 Capacity for Planned Events (CPE)

► CBU-like offering, when a disaster is not declared ► Example: System migration (push/pull) or relocation ( d ata center move) ► Predefined capacity for a fixed period of time (3 days) ► Pre-paid

 On/Off Capacity on Demand (On/Off CoD)

► Satisfy periods of peek demand for computing resources ► Concurrent 24 hour rental of CPs, IFLs, ICFs, zAAPs, zIIPs, SAPs ► Supported through a new software offering – Capacity Provisioning Manager (CPM) ► Post-paid

IBM Systems

IBM System z

System z10 EC Capacity on Demand Reinvented!

 Permanent and temporary offerings – with you in charge

► Permanent offerings – Capacity Upgrade on Demand (CUoD), Customer

Initiated Upgrade (CIU)

► Temporary offerings

● Additional capacity - On/Off Capacity on Demand (On/Off CoD)

● Replacement capacity - Backup Upgrade (CBU)

and a new one – Capacity for Planned Event (CPE)

 No customer interaction with IBM at time of activation

► Broader customer ability to order temporary capacity

 Multiple offerings can be in use simultaneously

► All offerings on Resource Link ► Each offering independently managed and priced

 Flexible offerings may be used to solve multiple situations

► Configurations based on real time circumstances ► Ability to dynamically move to any other entitled configuration

 Offerings can be reconfigured or replenished dynamically

► Modification possible even if offering is currently active ► Some permanent upgrades permitted while temporary offerings are active

 Policy based automation capabilities

► Using Capacity Provisioning Manager with z/OS 1.9 ► Using scheduled operations via HMC

IBM Systems

IBM System z

IBM System z10 EC Memory

IBM Systems

IBM System z

z10 EC – HSA considerations

 HSA of 16GB provided as standard outside of purchased memory  The HSA has been designed to eliminate planning for HSA. Preplanning

for HSA expansion for configurations is eliminated because HCD/IOCP will, via the IOCDS process, always reserves HSA space for:

►4 CSSs

►15 LPs in each CSS (total of 60 LPs)

►Subchannel set-0 with 63.75k devices in each CSS

►Subchannel set-1 with 64k devices in each CSS

►All the above are designed to be activated and used with dynamic I/O

changes

IBM Systems

IBM System z

z10 EC Memory Offering and Assignment

 Customer Memory Granularity for ordering:

►16 GB: Std - 16 to 256; Flex - 32 to 256

Model

Standard

Memory

Flexible Memory

NA16 - 352E12

32 - 35216 - 752E26

32 - 75216 - 1136E40

32 - 113616 - 1520E56

32 - 113616 - 1520E64

►32 GB: Std - 288 to 512; Flex - 288 to 512 ►48 GB: Std - 560 to 944; Flex - 560 to 944 ►64 GB: Std - 1008 to 1520; Flex - 1008 to 1136

 LIC CC controls purchased memory  Maximum Physical Memory:

384 GB per book, 1.5 TB per system

►Up to 48 DIMMs per book ►64 GB minimum physical memory in each book ►Physical Memory Increments:

● 32 GB – Eight 4GB DIMMs (FC #1604)

Preferred if can fulfill purchase memory

● 64 GB – Eight 8 GB DIMMs (FC #1608)

Used where necessary

 For Flexible, if required, 16 GB “Pre-planned

Memory” features (FC # 1996) are added to the configuration.

IBM Systems

IBM System z

IBM System z10 EC Cryptography

IBM Systems

IBM System z

z10 EC CP Assist for Cryptographic Functions (CPACF)

DES

TDES

AES-128

SHA-1, 224, 256

PRNG

Integrated Cryptographic Service Facility (ICSF)

PU PU PU PU PU PU PU PU

CP Assist for Cryptograph ic Function

Crypto Express2

z10 EC

DES

TDES

AES-128, 192, 256

SHA-1, SHA2:

(224, 256, 384, 512)

PRNG

High performance clear key symmetric encryption/decryption

IBM Systems

IBM System z

z10 EC Cryptographic Support

 CP Assist for Cryptographic Function (CPACF)

► Standard on every CP and IFL ► Supports DES, TDES, AES and SHA ► Pseudo Random Number Generation (PRNG) ► New to z10 EC

● Advanced Encryption Standard (AES) – 192 and 256

● Secure Hash Algorithm (SHA) – 384 and 512

 Crypto Express2

► Two configuration modes

● Coprocessor (default)

– Federal Information Processing Standard

(FIPS) 140-2 Level 4 certified

● Accelerator (configured from the HMC)

► Three configuration options

● Default set to Coprocessor

Coprocessor

Accelerator

► Concurrent Patch

 Dynamic Add Crypto to LPAR

► No recycling of LPAR ► No POR required

 TKE 5.0 workstation with TKE 5.2 LIC

► Diskette drive support – read only

Accelerator

IBM Systems

IBM System z

IBM System z10 EC Availability

IBM Systems

IBM System z

System z10 EC continues to focus on RAS

Keeping your system available is key to our total design

Sources of Outages - Pre z9

-Hrs/Year/Syst-

Scheduled (CIE+Disruptive Patches + ECs)

Planned - ( M ES + Dr iver Up g rad es)

Unscheduled (UIRA)

Impact of Outage

Unscheduled

Outages

Scheduled

Outages

Planned

Outages

Preplanning

requirements

Prior

Servers

z10 ECz9 EC

IBM Systems

IBM System z

z10 EC Enhancements designed to avoid Outages

 Continued Focus on Firmware Quality  Reduced Chip Count on MCM  Memory Subsystem Improvements

 DIMM FRU indicators  Single Processor Core Checkstop  Single Processor Core Sparing  Point to Point SMP Fabric (not a ring)  Rebalance PSIFB and I/O Fanouts  Redundant 100Mb Ethernet service

network w/ VLAN

 CoD – Flexible Acitvation/Deactivation  Elimination of unnecessary CBU passwords  Enhanced Driver Maintenance (EDM) Upgrades

► Multiple “from” sync point support

► Improved control of channel LIC levels

 Reduce Pre-planning to Avoid POR

► 16 GB for HSA

► Dynamic I/O Enabled by Default

► Add Logical Channel Subsystem (LCSS)

► Change LCSS Subchannel Sets

► Add/Delete Logical Partitions

 Reduce Pre-Planning to Avoid LPAR Deactivate

► Change Partition Logical Processor Config

► Change Partition Crypto Coprocessor Config

IBM Systems

IBM System z

IBM System z10 EC I/O Structure

IBM Systems

IBM System z

z10 EC Book Layout – Under the covers

Fanouts

MCM

Memory

DCA Power Supplies

HCA2-O (InfiniBand)

HCA2-C (I/O cages)

MBA (ICB-4)

MRU

Connections

IBM Systems

IBM System z

z10 EC – Under the covers (Model E56 or E64)

Internal

Batteries

(optional)

Processor Books,

Memory, MBA and

Power

Supplies

3x I/O cages

Fiber Quick Connect

(FQC) Feature

(optional)

HCA cards

InfiniBand I/O

Interconnects

Cooling

Units

2 x Support

Elements

FQC

IBM Systems

IBM System z

z10 EC Channel Type and Crypto Overview

 FICON/FCP

► FICON Express4 ► FICON Express2 (carry forward only) ► FICON Express (carry forward only)

 Networking

► OSA-Express3 (2Q2008)

● 10 Gigabit Ethernet LR

► OSA-Express2

● 1000BASE-T Ethernet

● Gigabit Ethernet LX and SX

● 10 Gigabit Ethernet LR

► HiperSockets (Define only)

● Layer 2 support

 Coupling Links

► InfiniBand (PSIFB) – 2Q2008 ► ISC-3 (Peer mode only) ► ICB-4 (Not available on Model E64) ► IC (Define only)

 Time Features

► STP - Optional ► ETR Attach – Standard

 Crypto

► Crypto Express2

● Configurable Coprocessor or Accelerator

 Channel types not supported:

 ESCON

Note: ICB-4 cables are available as features. All other cables are sourced separately

* All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.

► OSA-Express ► ICB-3 ► Features not supported on System z9

IBM Systems

IBM System z

Connectivity for Coupling and I/O

 Up to 8 fanout cards per book

► Up to 16 ports per book

– 48 Port System Maximum

 Fanout cards - InfiniBand pairs dedicated to

function

IFB

HCA2-C

IFB

 HCA2-C fanout – I/O Interconnect

► Supports all I/O, ISC-3 and Crypto Express2

cards in I/O cage domains

Up to 16 CHPIDs – across 2 ports

 HCA2-O fanout – InfiniBand Coupling*

IFB

HCA2-O

IFB

► New CHPID type – CIB for Coupling

– Fiber optic external coupling link

2 CHPIDs – 1 per port

 MBA fanout (Not available on Model E64)

ICB-4

MBA

* All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.

ICB-4

► ICB-4 ► New connector and cables

IBM Systems

IBM System z

SAPs, I/O Buses, Links, and I/O Connectivity

Model

E12

E26

E40

E56

E64

Books/

PUs

1/17

2/34

3/51

4/68

4/77

Std

SAPS

Opt

SAPs

0-3

0-7

0-11

0-18

0-21

Maximum

HCAs/ Buses

8/163

16/326

20/409

24/4810

24/4811

Maximum

PSIFB+ICB4

Links + I/O

cards

16 + 0 Cards

32 + 0 Cards ICB-4 limit 16

32 + 32 Cards ICB-4 limit 16

32 + 64 Cards ICB-4 limit 16

32 + 64 Cards No ICB-4

Maximum I/O

Cards +

PSIFB/ICB4

Links

64 + 0 PSIFB + ICB4

84 + 8 PSIFB + ICB4

84 + 16 PSIFB + ICB4

84 + 24 PSIFB + ICB4

84 + 24 PSIFB

Max

FICON/

ESCON

CHPIDs

256/

960

336/

1024

336/

1024

336/

1024

336/

1024

Note: Only TPF may need Opt SAPs for normal workload Note: PSIFB and ICB4 do not reside in I/O cages Note: Plan Ahead for up to 2 additional I/O cages

This assumes no PSC24V power sequence cards

a. 0 to 24 I/O cards – 1 cage b. 25 to 48 I/O cards – 2 cages c. 49 to 84 I/O cards – 3 cages

Note: Include Crypto Express2 cards in I/O card count Limits:

a. 4 LCSSs maximum b. 15 partitions maximum per LCSS, 60 maximum c. 256 CHPIDs maximum per LCSS, 1024 maximum

IBM Systems

IBM System z

InfiniBand glossary

DescriptionTerm

Gbps

12x SDR DDR

12x IB-SDR

12x IB-DDR

1x IB-DDR LR*

Gigabits per second

GigaBytes per secondGBps

One “lane”, one pair of fibers

12 “lanes”, 12 pairs of fiber

Single Data Rate – 2.5 Gbps per “lane” (0.3 GBps)

Double Data Rate – 5 Gbps per “lane” (0.5 GBps)

12 “lanes” (pairs) for a total link data rate of 3 GBps, 150 meters point-to-point Used with OM3, 2000 MHz-k 50 micron multimode fiber optic cabling with MPO connectors

12 “lanes” (pairs) for a total link data rate of 6 GBps, 150 meters point-to-point Used with OM3, 2000 MHz-k 50 micron multimode fiber optic cabling with MPO connectors

One “lane” (one pair), 5 Gbps link data rate, unrepeated distance of 10 km Used with 9 micron single mode fiber optic cabling with LC Duplex connectors

InfiniBand® is a registered trademark of the InfiniBand Trade Association (IBTA)

* All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.

IBM Systems

IBM System z

z9 EC and z10 EC System Structure for I/O

Processor

MBA Fanout

STI-MP

I/O Domain*

z9 EC

Memory

Up to16 x 2.7 GBps

Passive

Connection

Redundant I/O Interconnect

Processor

MBA Fanout

STIs

for

I/O Domain*

Memory

STI-MP

Processor

HCA2-C Fanout

IFB-MP

I/O Domain*

z10 EC

Memory

Up to16 x 6 GBps

I/O Interconnect

Passive

Connection

Redundant I/O Interconnect

Processor

HCA2-C Fanout

for

I/O Domain*

Memory

IFB-MP

Crypto

FICON/FCP

Crypto

ISC-3

Networking

ESCON

I/O Cage

FICON/FCP

*Note: Each I/O domain supports up to 4 features only

ISC -3

Networking

ESCON

Crypto

FICON/FCP

ISC-3

Networking

ESCON

I/O Cage

Crypto

FICON/FCP

ISC -3

Networking

ESCON

IBM Systems

IBM System z

System z10 EC FICON Enhancements

 Extended Distance FICON (CHPID type FC) performance enhancements

► Enhancement to the industry standard FICON architecture (FC-SB-3)

● Implements a new protocol for ‘persistent’ Information Unit (IU) pacing that can help

to optimize link utilization

● Requires supporting Control Unit(s) (e.g. DS8000 at new level)

► Designed to improve performance at extended distance

● May benefit z/OS Global Mirror (previously called XRC)

● May simplify requirements for channel extension equipment

► Transparent to operating systems

► Applies to FICON Express4 and Express2 channels

 Enhancements for Fibre Channel Protocol (FCP) performance

► Designed to support up to 80% more I/O operations per second compared to System z9

for small block (4 kB) I/O operations on a FICON Express4 channel

► Transparent to operating systems

► Applies to FICON Express4 and Express2 channels (CHPID type FCP) communicating

to SCSI devices. (Improvement on FICON Express2 is expected to be less than on FICON Express4)

IBM Systems

IBM System z

OSA-Express3 – 10 GbE (2Q2008)

 Double the port density compared to

10 GbE OSA-Express3

 Designed to Improve Performance for

standard and jumbo frames

 10 Gigabit Ethernet LR (Long Reach)

► Two ports per feature

► Small form factor connector (LC

Duplex) single mode

► CHPID type OSD (QDIO)

PCI-E

LC Duplex SM

PCI-E

LC Duplex SM

IBM Systems

IBM System z

z10 EC InfiniBand PSIFB* Coupling Connectivity (2Q2008)

Up to 16 CHPIDs – across 2 ports

12x IB-DDR

6 GBps

Minimum – 0

Maximum – 32 ports

Order increment – 2 ports

Distance – 150 meters

OM3 fiber optic cables

IFB

HCA2-O

 Point-to-point up to 150 m (492 ft)  Maximum of 16 HCA2-O fanouts

► 2 ports per HCA2-O fanout ► Up to 16 CHPIDs per HCA1-O fanout

● Distribute across 2 ports as desired

 12x IB-DDR (6 GBps)

► z10 EC to z10 EC

 12x IB-SDR (3 GBps)

► z10 EC to System z9 Dedicated Coupling Facility

 OS Support::

► z/OS 1.7 + zIIP Web Deliverable ► z/VM 5.3 – Dynamic I/O Suppoort

IFB

* All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.

IBM Systems

IBM System z

System z9 InfiniBand PSIFB* Coupling Connectivity (2Q2008 – Dedicated CF only; SOD – Any z9)

Up to 16 CHPIDs – across 2 ports

12x IB-SDR

3 GBps

Minimum – 0

Maximum – 16 ports

Order increment – 2 ports

Distance – 150 meters

OM3 fiber optic cables

IFB

HCA1-O

IFB

 Point-to-point up to 150 m (492 ft)  Maximum of 8 HCA1-O fanouts

► 2 ports per HCA1-O fanout ► Up to 16 CHPIDs per HCA1-O fanout

● Distribute across 2 ports as desired

 12x IB-SDR (3 GBps)

► z10 EC to System z9 Dedicated Coupling Facility

 OS Support for non-dedicated CFs

► Support: z/OS 1.7 + zIIP Web Deliverable ► Dynamic I/O configuration to define, modify and

query a CHPID when z/VM 5.3 is the controlling LPAR for I/O

* All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.

IBM Systems

IBM System z

System z – Supported Coupling Links

PSIFB**

(2Q2008)

16*

z10 EC

z9 Dedicated CF

Any z9

z990

z890

* Maximum of 32 PSIFB + ICB4 links on System z10 EC. ICB-4 not supported on Model E64. ** All statements regarding IBM's future direction and intent are subject to change or

withdrawal without notice and represent goals and objectives only.

32*

N/A

Except E64

Max # LinksISC-3ICB-3ICB-4System

6448N/A

64481616

64481616SOD**

64481616N/A

6448168

IBM Systems

IBM System z

z10 Parallel Sysplex Coexistence and Coupling Connectivity

2094

z9 EC

ISC-3, ICB-4

2094

2066

z800, z900

None!

2096

STI

z9 BC

ISC-3, ICB-4

z9 EC

Dedicated CF

PSIFB, ISC-3, ICB-4

z9 BC Dedicated CF

PSIFB, ISC-3, ICB-4

2094

IFB

STI

12x IB-SDR

3 GBps

2096

STI

IFB

12x IB-SDR

3 GBps

z10 EC

E64 no ICB-4

STI

IFB

STI

IFB

STI

12x IB-DDR

6 GBps

IFB

2064

STI

2084

STI

z990

ISC-3, ICB-4

IBM

2086

STI

z890

ISC-3, ICB-4

z10 EC

PSIFB, ISC-3, and

ICB-4 (Except E64)

Machine Types and Coupling Technologies Planned to be Supported by z10 EC Servers

IBM Systems

IBM System z

z10 EC Physical Planning

Top of machine must be clear to allow backup cooling airflow.

z9 ECz10 ECDimension

Change z9 EC to z10

Z Frame A Frame A Frame Z Frame

Front Back

(Cool Aisle) (Warm Aisle)

Check the latest IMPP!

Height

Full/Red

Width

Depth w/o Covers

Depth with Covers

Electrical Service Requirements:

79.3/72.1 in 2015/1832 mm

61.7 in 1568 mm

50 in 1270 mm

71 in 1803 mm

76.4/72.1 in 1941/1832 mm

61.6 in 1565 mm

46.1 in 1171 mm

62.1 in 1577 mm

I/O cage

+2.9/+0 in +74/+0 mm

+.1 in +3 mm

+3.9 in +99 mm

+8.9 in +226 mm

I/O cage

2x60A2x60A2x60A1 book 4x60A4x60A2x60A2 book 4x60A4x60A4x60A3 book

4x60A4x60A4x60A4 book

Same power plugs/service as z990 and z9 EC, but large configurations need 4.

15% better performance/kWh than z9 EC

IBM Systems

IBM System z

System z10 EC Exploitation: z/OS Support Summary

Release

z/OS 1.7

z/OS 1.7 w/zIIP

z/OS 1.8

InfiniBand Coupling

z10 GA1 Support

65535 MP Factors

Crypto Toleration

Links

W P

PPP

Decimal Floating Point **

Crypto Exploitation

HiperDispatch

Greater than 54 CPs (64)

Large Page Support

> 128GB (1TB)

Large Memory

Capacity Provisioning

Enhancements

RMF FICON

NNNPPWW

NNNNBPPWW

z/OS 1.9

Legend B – FMID in Base product (assumes service identified in z9 EC PSP Bucket is installed) W – FMIDs shipped in a Web Deliverable P – PTFs required N – Not Supported

** Level of decimal floating-point exploitation will vary by z/OS release and PTF level.

BBB

B P

IBM Systems

IBM System z

z/VSE & z/VM Support Summary

z990z890

z9 EC

z9 BC

(WdfM)

Note: z/VM requires Compatibility Support which allows z/VM to IPL and operate on the z10 providing z9 functionality for the base OS and Guests

*z/VSE V3 can execute in 31-bit mode only. It does not implement z/Architecture, and specifically does not implement 64-bit mode capabilities. z/VSE V3 is designed to exploit select features of IBM System z9 and zSeries hardware. Note: z/VSE V4 is designed to exploit 64 bit real memory addressing, but will not support 64-bit virtual memory addressing

z10

x x x x

End of

Market

End of

Service

Ship Date

3/05TBD5/08xxxx3.1z/VSE* 3/07TBDTBDxx4.1

12/054/09**6/07xxxx5.2 z/VM

6/079/10**TBDxx5.3

IBM Systems

IBM System z

Linux on System z – Plans for z10 EC

Program Support

 IBM Systems Director Active Energy Manager (AEM) for Linux on System z

Compatibility

 Existing Linux on System z distributions* (most recent service levels):

► Novell SUSE SLES9 ► Novell SUSE SLES10 ► Red Hat RHEL4 ► Red Hat RHEL5

Exploitation*

 IBM is working with its Linux distribution partners to include support in future

Linux on System z distribution releases or versions for:

► Capacity Provisioning ► Large Page Support ► CPACF Enhancements ► Dynamic Change of Partition Cryptographic Coprocessors ► HiperSockets Layer 2 Support

*For latest information and details contact your Linux distributor.

IBM Systems

IBM System z

IBM System z10 EC - TPF and z/TPF Support

z990z890

z9 EC

z9 BC

z10

End of

Service

4.1TPF

 z/TPF Migration Portal

► http://www.ibm.com/tpf/ztpfmigration

 A PRPQ for HLASM running on Linux on z is available

► z/TPF uses the GNU Cross Compiler (GCC) running under Linux for System z

– Supports up to 30 LPARs with PJ29309

Ship Date

2/01TBDx

9/05TBDxx1.1z/TPF

IBM Systems

IBM System z

Any Questions?

Tom_Russell@ca.ibm.com

IBM Systems

IBM z10 User Guide

Specifications and Main Features

Frequently Asked Questions

User Manual