vi IBM ^ xSeries 450 Planning and Installation Guide
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viiiIBM ^ xSeries 450 Planning and Installation Guide
Preface
The IBM ^ xSeries™ 450 is IBM®’s new 64-bit Itanium Processor Family
(IPF) Architecture server and is the first implementation of the 64-bit IBM XA-64
chipset, as part of the Enterprise X-Architecture™ strategy. This IBM Redbook is
a comprehensive resource on the technical aspects of the server, and is divided
into five key subject areas:
Chapter 1, “Technical description” introduces the server and its subsystems
Chapter 2, “Positioning” examines the types of applications that would be
Chapter 3, “Planning” describes the considerations when planning to
Chapter 4, “Installation” covers the process of installing Windows Server
Chapter 5, “Management” describes how to use the Remote Supervisor
and describes the key features and how they work. This includes the new
Extensible Firmware Interface, which provides a powerful replacement to the
BIOS facility found on the IA-32 platform.
used on a server such as the x450.
purchase and planning to install the x450. It covers such topics as
configuration, operating system specifics, scalability, and physical site
planning.
2003, Enterprise Edition and SuSE Linux Enterprise Server on the x450.
Adapter to send alerts to an IBM Director management environment.
The team that wrote this redbook
This redbook was produced by a team of specialists from around the world
working at the International Technical Support Organization, Raleigh Center.
David Watts is a Consulting IT Specialist at the International Technical Support
Organization in Raleigh. He manages residencies and produces IBM
Redbooks™ on hardware and software topics related to IBM xSeries systems
and associated client platforms. He has authored over 20 Redbooks; his most
recent books include the
Guide
. He has a Bachelor of Engineering degree from the University of
Queensland (Australia) and has worked for IBM for over 14 years. He is an
IBM ^ Certified Specialist for xSeries and an IBM Certified IT
Specialist.
Gerry McGettigan is an Advanced Technical Support engineer in EMEA working
in Greenock, Scotland. Before joining ATS in the summer of 2002, he provided
pre-sale and post-sale technical training on high-end xSeries systems and
solutions as part of the xSeries Academy. He holds a Bachelor of Science in
Multimedia Technology from Glasgow Caledonian University and has been with
IBM for over five years. His area of expertise is xSeries systems and hardware.
Michael L. Nelson is a Performance Consultant in IBM ^ Solutions
Engineering working in Raleigh. He was previously an architect for many of the
xSeries Web-based sizing tools. He is a Microsoft Certified Systems Engineer on
both Windows NT 4.0 and 2000, a Lotus® Certified Professional, a Cisco
Certified Network Associate, a Citrix Certified Administrator, and an
IBM ^ Certified Expert for xSeries. He also holds a Bachelor of Arts
degree from Whittier College. He has five years of experience with Intel-based
server hardware, and has worked for IBM for six years. His areas of expertise
include xSeries hardware, Microsoft Windows, and Citrix.
Lubos Nikolini is a Systems Engineer working for HT Computers a.s. in
Bratislava, Slovak Republic. He has six years of experience with Microsoft
operating systems, Intel-based hardware (including IBM xSeries and Netfinity®),
networking, and storage technologies. He is a Microsoft MCSE, Citrix CCEA and
a Compaq Proliant ASE. His areas of expertise include Active Directory
deployments, thin-client technology, and groupware solutions.
Jose Rodriguez Ruibal is a Linux Specialist in the Advanced Technical Support
(ATS) Products and Solutions Support Center (PSSC) for EMEA in Montpellier,
France. Prior to joining the ATS team, he worked for Red Hat in Spain and for the
INRIA (National French Institute for Research in Computing and Robotics) in
Linux-related activities. He has four years of experience in Linux and UNIX-like
network operating systems. He holds a Bachelor’s degree with Honors in
Computer Science from the Universidad Antonio de Nebrija in Madrid, Spain,
and he is also Red Hat Certified Engineer. His areas of expertise include xSeries
hardware and storage, and Linux. He has also authored a white paper about
Oracle 9i RAC installation under Linux on xSeries x360 and x440 machines.
x IBM ^ xSeries 450 Planning and Installation Guide
The redbook team (l-r): David, Jose, Gerry, Mike, Lubos
Thanks to the following IBM employees for their contributions to this project:
Henry Artner, Service Education Curriculum Manager, Raleigh
Charlotte Brooks, ITSO Project Leader for Tivoli® Storage, San Jose
Pat Byers, Program Director, Linux xSeries Alliances & Marketing
Alex Candelaria, IBM Center for Microsoft Technologies, Seattle
Zeynep Dayar, xSeries Systems Management, Raleigh
Peter Figueroa, Technical Project Manager, Software Development, Raleigh
Amy Freeman, Manager Brand Communications, Linux on xSeries, Raleigh
Maynard Ferguson, x450 Product Development Team Lead, Raleigh
Mauro Gatti, EMEA xSeries Solution Architects, Italy
Barney Hallman, Server Development, Austin
Jim Hanna, xSeries Server Development, Austin
Roger Hellman, xSeries Global Product Manager, Raleigh
William L. Jones, IBM xSeries Preloads, Raleigh
Michael S Lee, IBM Center for Microsoft Technologies, Seattle
Grace Lennil, IBM Center for Microsoft Technologies, Seattle
Cecil Lockett, Senior Engineer, Engineering Software, Raleigh
John McAbel, Datacenter/Cluster Product Manager, Beaverton
Chris McDermott, Linux Technology Center, IA-64 Enablement, Beaverton
Willie Nathan, Systems Management Firmware Development, Raleigh
Charles Perkins, Course Developer, Service and Support Education, Raleigh
David Pfeffer, Global Service Planner, Beaverton
Steve Powell, Technical Advisor, Service & Support Education Team, Raleigh
Ajit Ravani, Firmware Project Manager, Austin
Mike Schiskey, Technical Support, x450 Development, Raleigh
Al Thomason, Senior Product Marketing Manager, Beaverton
Damon A. West, IBM ^ Technology Enablement Center
Bob Zuber, x450 World Wide Product Manager, Raleigh
Preface xi
Also, thanks to the following people from Intel:
Scott Diaz
Tim Farrell
Dave Myron
John F Stewart
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xii IBM ^ xSeries 450 Planning and Installation Guide
Chapter 1.Technical description
The IBM ^ xSeries 450 is the latest IBM top-of-the-line server and is the
first full implementation of the 64-bit IBM XA-64 chipset, code named “Summit”,
as part of the Enterprise X-Architecture strategy. The x450 completes the
xSeries product family, leveraging the proven Enterprise X-Architecture used in
the x440 to deliver commercially viable 64-bit systems.
The following are the key features of the x450:
One or two-way Intel Itanium 2 models, upgradable to four-way
1
4U rack-dense design
64 MB XceL4 Server Accelerator Cache providing an extra level of cache
1 GB or 2 GB RAM standard, up to 40 GB total using 512 MB, 1 GB, and
2 GB ECC SDRAM DIMMs
Memory enhancement such as memory mirroring, Chipkill™, and Memory
ProteXion
Six Active PCI-X slots: two 64-bit 133 MHz, two 64-bit 100 MHz, two 64-bit
66 MHz
Connectivity to an RXE-100 external PCI-X enclosure for an additional 12
Powered by XA-64 Enterprise X-Architecture and 64-bit Itanium 2 “Madison”
processors, xSeries 450 servers bring the future of 64-bit processing and
production-level reliability to your data centers today. Featuring
mainframe-inspired, advanced mission-critical function, you can depend on these
four-way-capable enterprise servers to run your complex business applications
around the clock.
The models of the x450 that will be available on July 1 are listed in Table 1-1.
IBM had ealier announced models that were based on the Itanium 2 “McKinley”
processor, but these have been withdrawn due to a bug in these processors.
These models are listed in Table 1-2.
The x450 models support one, two, three, and four processors.
The attachment of a single RXE-100 Remote Expansion Enclosure is also
supported using either a single or two remote I/O cables. The RXE-100 has six
PCI-X slots standard, upgradable to 12 PCI-X slots, giving the customer up to a
total of 12 PCI-X or 18 PCI-X slots respectively.
2IBM ^ xSeries 450 Planning and Installation Guide
1.2 IBM XA-64 chipset
The IBM XA-64 chipset is the product name describing the chipset developed
under the code name “Summit” and implemented on the IA-64 platform. A
product of the IBM Microelectronics Division, the XA-64 chipset leverages the
proven Enterprise X-Architecture chipset used in the x440 and applies those
same technologies to the IA-64 architecture. The XA-64 chipset is composed of
the following components:
Memory controller: a single memory controller, code named “Cyclone”,
located within the memory-board assembly.
Processor/cache controller: a single processor and cache controller, code
named “Tornado”, located within the processor-board assembly.
PCI bridges: two PCI bridges, code named “Winnipeg”, per x450 located on
the PCI-X board and the I/O board that control both the PCI-X and Remote
I/O.
Figure 1-1 on page 4 shows the various IBM XA-64 components in an x450
configuration.
Chapter 1. Technical description 3
CPU 1CPU 2
6.4 GBps
CPU 3CPU 4
400 MHz
64 MB
L4 cache
Processor-board assemblyMemory-board assembly
6.4 GBps
RXE
Expansion
Port A
(1 GBps)
Processor &
cache
controller
PCI bridgePCI bridge
33 MHz66 MHz
SDRAM
SDRAM
SMI-E
3.2 GBps
SDRAM
SDRAM
SMI-ESMI-ESMI-E
Port 1
3.2 GBps
Memory
controller
Bus A66 MHz
B-100
Port 2
3.2 GBps
1 GBps1 GBps
SDRAM
SDRAM
SDRAM
SDRAM
200 MHz
2-way or 4-way
interleaved DDR
RXE
Expansion
Port B
(1 GBps)
D-133C-133
Ultra320
SCSI
Gigabit
Ethernet
Video
3x USB
Serial
RSA
Figure 1-1 xSeries 450 system block diagram
What was called the SMP Expansion module in the x440 has been divided into
two components in the x450. The component that contains the CPUs,
processor/cache controller, and cache is called the
The component that contains the memory controller and memory is called the
memory-board assembly.
The CPUs are connected together with a 200 MHz frontside bus, but supply data
at an effective rate of 400 MHz using the “dual-pump” design of the Intel
Itanium 2 architecture as described in 1.4, “Intel Itanium 2 processor” on
page 10. To ensure the processors are optimally used, the x450 has a 64 MB
XceL4 Server Accelerator Cache, comprised of 200 MHz DDR memory. This L4
system cache services all CPUs.
64-bit
66 MHz
IBM XA-64
64-bit
100 MHz
64-bit
133 MHz
("Summit")
core chipset
processor-board assembly.
4IBM ^ xSeries 450 Planning and Installation Guide
Memory used in the x450 is standard PC2100 ECC DDR SDRAM DIMMs. With
g
2 GB DIMMs, up to 40 GB can be installed using 20 of the 28 DIMM sockets. The
memory is two-way interleaved; however, four-way interleaving is also supported
in order to ensure that the memory subsystem can supply data fast enough to
match the throughput of the CPUs. Two-way interleaving means that DIMMs
must be installed in matched pairs and in specific DIMM sockets (see 3.1.2,
“Memory” on page 41)
The two PCI bridges in the XA-64 chipset provide support for 33, 66, 100, and
133 MHz devices using four PCI-X buses (labeled A-D in Figure 1-1 on page 4).
This is discussed further in 1.8, “PCI subsystem” on page 21.
The PCI bridge also has two 1 GBps bi-directional Remote Expansion I/O (RXE)
ports for connectivity to the RXE-100 enclosure. The RXE-100 provides up to an
additional 12 PCI-X slots and can be connected by a single cable to port A.
The rear panel of the x450, indicating the location of the RXE Expansion Ports, is
shown in Figure 1-2.
RXE Expansion Port (B)
connector
SCSI connector
USB ports
RXE Mana
Figure 1-2 Rear view of the x450
ement Port
1.3 Extensible Firmware Interface
The Extensible Firmware Interface (EFI) specification describes an interface
between the operating system and platform firmware as shown in Figure 1-3 on
page 6. The interface offers platform-related information to the operating system
as well as boot and runtime service calls that are available to the operating
system and OS loader. Together, these makes a well-defined environment for
booting the operating system and running pre-boot applications, such as
diagnostics and system setup.
Serial connector
Remote Supervisor
Adapter connectors
Gigabit Ethernet
connectors
RXE Expansion
Port (A) connector
Video connector
Chapter 1. Technical description 5
In comparison to a BIOS-based, legacy system, the EFI is an additional layer
between the operating system and the firmware. In a legacy system, the OS
loader calls BIOS functions directly. Consequently, to provide a stable boot
environment, changes in the OS loader and the platform firmware must go
hand-in-hand.
Note: All operating systems supported on x450 are EFI-aware. The OS loader
communicates with the firmware and hardware through the EFI interface.
The primary goal of this specification is to provide an abstract model both for
operating system and hardware developers. With such a model in a place, OS
loader customizations are not required if there are changes in the platform
hardware or firmware (added new boot or input devices for instance). The EFI
breaks up a tight dependency between the operating system and the firmware,
thus speeding up the process of releasing the new products and introducing the
new features and functionality (both operating system and hardware).
Operating system
Legacy OS
loader
Platform-specific firm ware (BIOS)
Platform hardware
Figure 1-3 The EFI concept
EFI OS loader
EFI
Consider, for example, the situation where a new type of boot device, for example
a USB key, is to be implemented. First the BIOS would have to offer an option to
choose this new device for booting, then new USB key-specific functions would
have to be added to the firmware to support booting from a USB device, and
finally, the OS loader would have to be modified to use these functions.
6IBM ^ xSeries 450 Planning and Installation Guide
The same situation with the EFI would be dramatically simplified. The OS loader
calls unified (not vendor-specific) EFI API functions for booting. These functions
are not dependent on the boot device used, so when a new boot device type is
added to the platform and the firmware is modified to recognize it, the operating
system can immediately boot.
The EFI architecture is modular, extensible and offers backward compatibility for
the older systems by default. This means there is a way for non-EFI-aware
operating systems to communicate directly with system BIOS as shown in
Figure 1-3 on page 6.
Note: The EFI concept was originally introduced with Itanium
Architecture-based computers, but is not restricted to 64-bit platforms. There
is a gradual transition from BIOS to the EFI expected on the IA-32 platform as
well.
1.3.1 GUID Partition Table disk
The GUID Partition Table (GPT) was introduced as part of the EFI initiative.
Every disk is assigned a global unique identifier (GUID) to allow self-identification
of the disks. GPT replaces the older Master Boot Record (MBR) partitioning
scheme that has been common to PCs.
There are several reasons for introducing a new partitioning scheme:
MBR disks support only four partition table entries. If more partitions are
wanted, a secondary structure — an extended partition — is necessary.
Extended partitions are then subdivided into one or more logical disks. On
any given drive, only one extended partition can be present.
In theory, a GPT disk can have an unlimited number of partitions. The number
of partitions is limited only by the amount of space reserved for making
partition entries.
GPT disks use primary and backup partition tables for redundancy and
CRC32 fields for improved partition data structure integrity.
GPT disks can grow to a very large size. In theory, a GPT disk can be up to
64
2
logical blocks in length (logical blocks are typically 512 bytes). In practice,
the maximum is less. For example, Windows Server 2003 supports GPT disks
up to approximately 18 Exabytes in size.
For backward compatibility with legacy MBR disk tools, all GPT disks contain a
protective MBR. The protective MBR, beginning in sector 0, precedes the GUID
Partition Table on the disk and contains only one partition that appears to span
the disk. The legacy tools are not aware of GPT and do not know how to properly
access a GPT disk. The benefit of protective MBR is that these tools will view a
Chapter 1. Technical description 7
GPT disk as having a single encompassing (possibly unrecognized) partition,
rather than mistaking the disk for one that is unpartitioned. That is why
GPT-partitioned disk appears to have MBR.
Note: GPT disks can be converted to MBR disks and vice versa only if all
existing partitioning is first deleted, with associated loss of data.
In general, the structure of any GPT disk is as shown in Figure 1-4. The
protective MBR is followed by a theoretically unlimited number of data partitions.
Protective
MBR
Figure 1-4 General GPT disk structure
Note: Currently, only 64-bit operating systems have the ability to read, write,
and boot from GPT disks. 32-bit operating systems do not have built-in
support for GPT disks.
The specification for GPT disk partitioning can be found in Chapter 16 of the
Extensible Firmware Interface (EFI) specification. This document is available at:
A special partition on the GPT disk is EFISystem Partition (ESP). It contains the
OS loader files of all installed operating systems. These files are stored in the
EFI directory. The ESP may also contain other files necessary to boot the
system, such as drivers.
Data partition(s)
Note: The EFI System Partition is shareable among all installed operating
systems. To support multiple operating system installations, create multiple
data partitions.
8IBM ^ xSeries 450 Planning and Installation Guide
An example directory structure for an EFI System Partition present on a hard disk
with SuSE and Windows Server 2003 installed is as follows:
\EFI
\Microsoft
\WINNT50
\EFIDrivers
\SuSE
\MSUtils
There can be only one ESP on a single disk. The size of the ESP is determined
using the following algorithm:
ESP = max(100 MB, min(1% of physical disk, 1GB))
In other words, the size of the ESP must be the larger of these two numbers, 100
MB or 1% of the physical disk size (up to 1 GB). For example, for an 18 GB disk,
the size of the ESP is 184 MB. The value 1% of the physical disk is calculated at
the time that the ESP is created and does not change if the disk is extended later
(for example, via RAID).
Note: Each bootable GPT disk must contain an EFI System Partition.
The ESP should be the first partition on the disk, right after protective MBR as
shown in Figure 1-5.
EFI
Protective
MBR
Figure 1-5 Boot GPT disk structure
System
Partition
(ESP)
Data partition(s)
The EFI specification supports only FAT or FAT32 on the ESP partition.
Note: The ESP is not visible to the operating systems users by default but can
be accessed for read/write operations from within the operating system by
special commands. For Windows-specific information, see “Accessing EFI
System Partition from Windows” on page 96. For SuSE information, see
“Partitions on IA-64 Linux” on page 111.
Chapter 1. Technical description 9
1.3.3 EFI and legacy-free concept
The EFI complements legacy-free concept of PCs. Legacy-free refers to PC
system designs that eliminate certain hardware and firmware elements of the
original PC architecture while advancing the PC's stability and usability.
Specifically, we are talking about a set of I/O options that have been part of the
PC architecture for a very long time, for example parallel, serial and game port,
ISA slots or devices, floppy disk controller (FDC), PS/2® mouse, and keyboard.
BIOS interfaces require the OS loader to have a specific knowledge of the
workings of hardware devices. The EFI abstract concept makes it possible to
build code that works on a range of hardware devices without having explicit
knowledge of the specifics of these devices. This EFI feature allows a
replacement of legacy devices and adding new boot devices. The legacy devices
are replaced by USB devices in x450.
Tip: One key interface that is no longer supported is INT 13, disk I/O.
For more information about the EFI specification, see the following:
The Itanium 2 processor used in the x450 (code named “Madison”) uses a ZIF
socket design, although the socket is designed differently from the one on the
x440, for example. This small form factor is what permits the x450 to have up to
four processors in a 4U node.
Table 1-3 outlines some of the differences between the Itanium and Itanium 2
processors (both the “Madison” and the earlier “McKinley” processor):
Load and store units2 (total)2 load and 2 store2 load and 2 store
The Itanium 2 processor has three levels of cache, all of which are on the
processor die:
Level 3 cache is equivalent to L2 cache on the Pentium III Xeon, or the L3
cache on the Pentium Xeon MP processor. Itanium 2 processors in the x450
models contain either 3, 4 or 6 MB of L3 cache. Unlike the design of the
original Itanium processor, this L3 cache is now on the processor die, greatly
improving performance, up or 2 times greater than that of the original Itanium.
Level 2 cache is equivalent to L1 cache on the Pentium III Xeon and is 256 KB
in size.
A new level 1 cache, 32 KB in size, is “closest” to the processor and is used to
store micro-operations (that is, decoded executable machine instructions) and
serves those to the processor at rated speed. This additional level of cache
saves decode time on cache hits.
The x450 also implements a Level 4 cache as described in 1.6, “IBM XceL4
Server Accelerator Cache” on page 17.
Intel has also introduced a number of features associated with its Itanium
micro-architecture. These are available in the x450, including:
400 MHz frontside bus
The Pentium III Xeon processor had a 100 MHz frontside bus that equated to
a burst throughput of 800 MBps. With protocols such as TCP/IP, this had been
shown to be a bottleneck in high-throughput situations. The Itanium 2
processor improves on this by using a single 200 MHz clock and using both
edges of each clock to transmit data. This is shown in Figure 1-6 on page 12.
Chapter 1. Technical description 11
200 MHz clock
Figure 1-6 Dual-pumped frontside bus
This increases the performance of the frontside bus. The end result is an
effective burst throughput of 6.4 GBps (128-bit wide data path running at 400
MHz), which can have a substantial impact, especially on TCP/IP-based LAN
traffic. This is opposed to the Itanium processor, which had a burst throughput
of only 2.1 GBps (64-bit wide data path running at 266 MHz).
EPIC technology, developed by Intel and HP, leads to more efficient, faster
processors because it eliminates numerous processing inefficiencies in
current processors and attacks the perennial data bottleneck problems by
increasing parallelism, rather than simply boosting the raw “clock” speed of
the processor.
Specifically, in today's 32-bit processors, much of the instruction
scheduling--the order in which computing instructions are executed--is done
on the chip itself, leading to a great deal of overhead and slowing down overall
processor performance. Moreover, today's processors are plagued by
instruction flow problems since the processor often has to stop what it's doing
and reconstruct the instruction flow due to inherent inefficiencies in instruction
handling.
EPIC makes the instruction scheduling more intelligent and handles much of
the scheduling off-chip, in the compiler program, before feeding “parallelized”
instructions to the Itanium 2 processor for execution. The parallelized
instructions allow the chip to process a number of instructions simultaneously,
increasing performance. A compiler prepares instructions for execution on the
processor.
The Itanium 2 architecture is based on EPIC technology and has the following
features:
– Provides faster online transaction processing
– Has the capability to execute multiple instructions simultaneously,
processing more data and allowing more users
– Enables faster calculations and data analysis
– Allows for faster storage and movement of large models (CAD, CAE)
– Speeds up simulation and rendering times
12IBM ^ xSeries 450 Planning and Installation Guide
For more information about the features of the Itanium 2 processor, go to:
http://www.intel.com/design/itanium2
1.5 System assembly
Unlike the x440, then x450 does not use a single SMP Expansion Module, which
contains the processors, memory, XceL4 Server Accelerator Cache, and
respective controller. Instead, there are now two separate assemblies:
A single memory-board assembly, located at the top of the system, which
contains the physical DIMM’s as well as the memory and I/O controller
A single processor-board assembly, located at the bottom of the system,
which contains the processors, XceL4 Server Accelerator Cache, and L4
Cache/Scalability Controller
See Figure 1-7 on page 14 for the location of the memory-board and
processor-board assemblies.
Tip: Be careful when removing or installing either the memory-board
assembly or the processor-board assembly, because it is possible to damage
the midplane.
Chapter 1. Technical description 13
Memory-board
assembly
PCI-X
slots
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Processor-board
assembly
Figure 1-7 Memory-board and processor-board assembly locations
1.5.1 Memory-board assembly
The x450 memory-board assembly is installed from the top of the server and
mounts to the side of the midplane using two levers on the top. This location
allows for easy access to all memory DIMMs without having to remove any
components from the system.
14IBM ^ xSeries 450 Planning and Installation Guide
Memory Port 1
There are 14 DIMM slots in each
of the two ports, for a total of 28
DIMMs.
Memory Port 2
Figure 1-8 Memory-board assembly, showing the two memory ports
The memory-board assembly contains 28 DIMM slots. All DIMM slots can be
used when 512 MB or 1 GB DIMMs are used. If 2 GB DIMMs are used, up to 20
DIMMs slots can be used. The maximum installable memory is 40 GB (using 2
GB DIMMs).
The memory-board assembly is also equipped with LEDs for light path
diagnostics for each DIMM. In addition, the assembly is equipped with LEDs for
the following:
Power to memory port 1
Power to memory port 2
Hot-plug memory enabled
Restriction: The ability to hot-add or hot-replace memory is not available in
the x450.
For information about installing memory in the memory-board assembly, see
3.1.2, “Memory” on page 41.
1.5.2 Processor-board assembly
The x450 processor-board assembly is located under the memory-board
assembly, as shown in Figure 1-7 on page 14. It is installed from the top of the
server and mounts to the side of the midplane using two levers on the side, as
shown in Figure 1-9 on page 16.
Chapter 1. Technical description 15
Tip: Be careful when removing or installing either the memory-board
assembly or the processor-board assembly, since it is possible to damage the
midplane.
Processors 1 & 3
(processors 2 &
4 are on the
underside of the
circuit board)
Power modules
(“pods”) for each
processor
Figure 1-9 Processor-board assembly
x450 models have either one or two processors installed. The unused CPU
sockets will hold metal air baffles. The power pods shown in Figure 1-9 supply
power to the processors and are equivalent to VRMs in other systems.
Important: While processors should be installed in the order listed in
Figure 1-9, the bootstrap processor (BSP) may not necessarily be the
processor located in Processor Socket 1. The Intel Itanium Architecture
processors are initialized and tested in parallel. The first processor to
complete initialization becomes the BSP.
The processor-board assembly is also equipped with LEDs for light path
diagnostics for the following components:
Each processor
Each power module (“pod”)
In addition, a “remind” button is located on the upper side of the processor-board
assembly. Pressing this button while the processor-board assembly is not
attached to AC power will illuminate any light path LEDs that had been lit while
the system was under power for a total of 10 seconds.
16IBM ^ xSeries 450 Planning and Installation Guide
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