IBM Power 750, Power 760 Technical Overview And Introduction

Front cover

IBM Power 750 and 760 Technical Overview and Introduction

Features the 8408-E8D and 9109-RMD based on the latest POWER7+ processor technology

Discusses the dual chip module architecture

Describes the enhanced I/O subsystem

James Cruickshank

Sorin Hanganu

Volker Haug

Stephen Lutz

John T Schmidt

Marco Vallone

ibm.com/redbooks

Redpaper

International Technical Support Organization

IBM Power 750 and 760 Technical Overview and Introduction

May 2013

REDP-4985-00

Note: Before using this information and the product it supports, read the information in “Notices” on page vii.

First Edition (May 2013)

This edition applies to the IBM Power 750 (8408-E8D) and Power 760 (9109-RMD) Power Systems servers.

Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp.

Contents

Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vii

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viii

Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix

Authors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .x

Now you can become a published author, too! . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi

Comments welcome. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi

Stay connected to IBM Redbooks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xii

Chapter 1. General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 Systems overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.1.1 IBM Power 750 Express server. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.1.2 IBM Power 760 server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2 Operating environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.3 IBM Systems Energy Estimator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.4 Physical package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.5 System features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

1.5.1 Power 750 Express system features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

1.5.2 Power 760 system features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

1.5.3 Minimum features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

1.5.4 Power supply features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

1.5.5 Processor card features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

1.5.6 Memory features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

1.6 Disk and media features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

1.7 I/O drawers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

1.7.1 12X I/O Drawer PCIe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

1.7.2 EXP30 Ultra SSD I/O drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

1.7.3 EXP24S SFF Gen2-bay drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

1.7.4 EXP12S SAS drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

1.7.5 I/O drawers and usable PCI slots . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

1.8 Comparison between models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

1.9 Build to order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

1.10 IBM editions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

1.11 Model upgrades . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

1.12 Server and virtualization management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

1.13 System racks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

1.13.1 IBM 7014 Model T00 rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

1.13.2 IBM 7014 Model T42 rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

1.13.3 Feature code 0551 rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

1.13.4 Feature code 0553 rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

1.13.5 The AC power distribution unit and rack content . . . . . . . . . . . . . . . . . . . . . . . . 32

1.13.6 Useful rack additions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

1.13.7 OEM rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Chapter 2. Architecture and technical overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

2.1 The IBM POWER7+ processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

2.1.1 POWER7+ processor overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

2.1.2 POWER7+ processor core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

2.1.3 Simultaneous multithreading. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

2.1.4 Memory access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

2.1.5 On-chip L3 cache innovation and Intelligent Cache . . . . . . . . . . . . . . . . . . . . . . . 49

2.1.6 POWER7+ processor and Intelligent Energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

2.1.7 Comparison of the POWER7+, POWER7, and POWER6 processors . . . . . . . . . 51

2.2 POWER7+ processor card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

2.2.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

2.2.2 Processor interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

2.3 Memory subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

2.3.1 Registered DIMM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

2.3.2 Memory placement rules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

2.3.3 Memory bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

2.4 Capacity on Demand. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

2.4.1 Capacity Upgrade on Demand . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

2.4.2 Capacity Backup offering (applies only to IBM i). . . . . . . . . . . . . . . . . . . . . . . . . . 61

2.4.3 Software licensing and CoD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

2.5 System bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

2.5.1 I/O buses and GX++ card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

2.6 Internal I/O subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

2.6.1 Blind swap cassettes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

2.6.2 Integrated multifunction card. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

2.7 PCI adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

2.7.1 PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

2.7.2 PCI-X adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

2.7.3 IBM i IOP adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

2.7.4 PCIe adapter form factors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

2.7.5 LAN adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

2.7.6 Graphics accelerator adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

2.7.7 SCSI and SAS adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

2.7.8 iSCSI adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

2.7.9 Fibre Channel adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

2.7.10 Fibre Channel over Ethernet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

2.7.11 InfiniBand host channel adapter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

2.7.12 Asynchronous and USB adapters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

2.7.13 Cryptographic coprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

2.8 Internal Storage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

2.8.1 Dual split backplane mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

2.8.2 Triple split backplane mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

2.8.3 Dual storage I/O Adapter (IOA) configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

2.8.4 DVD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

2.9 External I/O subsystems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

2.9.1 PCI-DDR 12X expansion drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

2.9.2 12X I/O Drawer PCIe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

2.9.3 12X I/O Drawer PCIe configuration and cabling rules. . . . . . . . . . . . . . . . . . . . . . 82

2.10 External disk subsystems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

2.10.1 EXP30 Ultra SSD I/O drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

2.10.2 EXP24S SFF Gen2-bay drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

2.10.3 EXP12S SAS expansion drawer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

2.10.4 TotalStorage EXP24 disk drawer and tower . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

2.10.5 IBM 7031 TotalStorage EXP24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

2.10.6 IBM System Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

2.11 Hardware Management Console . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

2.11.1 HMC connectivity to the POWER7+ processor-based systems . . . . . . . . . . . . . 97

2.11.2 High availability HMC configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

iv IBM Power 750 and 760 Technical Overview and Introduction

2.12 Operating system support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100

2.12.1 IBM AIX operating system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

2.12.2 IBM i operating system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

2.12.3 Linux operating system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

2.12.4 Virtual I/O Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

2.12.5 Java versions that are supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

2.12.6 Boosting performance and productivity with IBM compilers . . . . . . . . . . . . . . . 103

2.13 Energy management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

2.13.1 IBM EnergyScale technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

2.13.2 Thermal power management device card. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

2.13.3 Energy consumption estimation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

Chapter 3. Virtualization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

3.1 POWER Hypervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

3.2 POWER processor modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

3.3 Active Memory Expansion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

3.4 PowerVM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

3.4.1 PowerVM editions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

3.4.2 Logical partitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

3.4.3 Multiple shared processor pools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

3.4.4 Virtual I/O Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

3.4.5 PowerVM Live Partition Mobility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

3.4.6 Active Memory Sharing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

3.4.7 Active Memory Deduplication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

3.4.8 Dynamic Platform Optimizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

3.4.9 Dynamic System Optimizer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143

3.4.10 Operating system support for PowerVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143

3.4.11 Linux support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144

3.5 System Planning Tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

3.6 New PowerVM Version 2.2.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147

Chapter 4. Continuous availability and manageability . . . . . . . . . . . . . . . . . . . . . . . . 149

4.1 Reliability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

4.1.1 Designed for reliability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

4.1.2 Placement of components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

4.1.3 Redundant components and concurrent repair. . . . . . . . . . . . . . . . . . . . . . . . . . 151

4.2 Availability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

4.2.1 Partition availability priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

4.2.2 General detection and deallocation of failing components . . . . . . . . . . . . . . . . . 152

4.2.3 Memory protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154

4.2.4 Cache protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156

4.2.5 Special Uncorrectable Error handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156

4.2.6 PCI Enhanced Error Handling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157

4.3 Serviceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158

4.3.1 Detecting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

4.3.2 Diagnosing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164

4.3.3 Reporting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165

4.3.4 Notifying . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167

4.3.5 Locating and servicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168

4.4 Manageability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

4.4.1 Service user interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

4.4.2 IBM Power Systems firmware maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176

4.4.3 Concurrent firmware update improvements with POWER7+ . . . . . . . . . . . . . . . 178

Contents v

4.4.4 Electronic Services and Electronic Service Agent . . . . . . . . . . . . . . . . . . . . . . . 179

4.5 POWER7+ RAS features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

4.6 Power-On Reset Engine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181

4.7 Operating system support for RAS features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181

Related publications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185

IBM Redbooks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185

Other publications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186

Online resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187

Help from IBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187

vi IBM Power 750 and 760 Technical Overview and Introduction

Notices

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viii IBM Power 750 and 760 Technical Overview and Introduction

Preface

This IBM® Redpaper™ publication is a comprehensive guide covering the IBM Power 750 (8408-E8D) and Power 760 (9109-RMD) servers that support IBM AIX®, IBM i, and Linux operating systems. The goal of this paper is to introduce the major innovative Power 750 and Power 760 offerings and their prominent functions:

򐂰 The IBM POWER7+™ processor, available at frequencies of 3.1 GHz, 3.4 GHz, 3.5 GHz,

򐂰 The larger IBM POWER7+ Level 3 cache provides greater bandwidth, capacity, and

򐂰 The newly introduced POWER7+ dual chip module (DCM). 򐂰 New 10 GBaseT options for the Integrated Multifunction Card that provides two USB ports,

򐂰 New IBM PowerVM® V2.2.2 features, such as 20 LPARs per core. 򐂰 The improved IBM Active Memory™ Expansion technology that provides more usable

򐂰 IBM EnergyScale™ technology that provides features such as power trending,

򐂰 Improved reliability, serviceability, and availability.

and 4.0 GHz.

reliability.

one serial port, and four Ethernet connectors for a processor enclosure and does not require a PCI slot.

memory than is physically installed in the system.

power-saving, capping of power, and thermal measurement.

򐂰 Dynamic Platform Optimizer. 򐂰 High-performance SSD drawer.

This publication is for professionals who want to acquire a better understanding of IBM Power Systems™ products. The intended audience includes the following roles:

򐂰 Clients 򐂰 Sales and marketing professionals 򐂰 Technical support professionals 򐂰 IBM Business Partners 򐂰 Independent software vendors

This paper expands the current set of IBM Power Systems documentation by providing a desktop reference that offers a detailed technical description of the Power 750 and Power 760 systems.

This paper does not replace the latest marketing materials and configuration tools. It is intended as an additional source of information that, together with existing sources, can be used to enhance your knowledge of IBM server solutions.

Authors

This paper was produced by a team of specialists from around the world working at the International Technical Support Organization, Poughkeepsie Center.

James Cruickshank works in the Power Systems Client Technical Specialist team for IBM in the UK. He holds an Honors degree in Mathematics from the University of Leeds. James has over 11 years of experience working with IBM pSeries®, IBM System p® and Power Systems products and is a member of the EMEA Power Champions team. James supports customers in the financial services sector in the UK.

Sorin Hanganu is an Accredited Product Services professional. He has eight years of experience working on Power Systems and IBM i products. He is an IBM Certified Solution Expert for IBM Dynamic Infrastructure® and also a IBM Certified Systems Expert for Power Systems, AIX, PowerVM virtualization, ITIL and ITSM. Sorin works as a System Services Representative for IBM in Bucharest, Romania.

Volker Haug is an Open Group Certified IT Specialist within IBM Germany supporting Power Systems clients and Business Partners as a Client Technical Specialist. He holds a diploma degree in Business Management from the University of Applied Studies in Stuttgart. His career includes more than 25 years of experience with Power Systems, AIX, and PowerVM virtualization; he has written several IBM Redbooks® publications about Power Systems and PowerVM. Volker is an IBM POWER7® Champion and a member of the German Technical Expert Council, an affiliate of the IBM Academy of Technology.

Stephen Lutz is a Certified Senior Technical Sales Professional for Power Systems working for IBM Germany. He holds a degree in Commercial Information Technology from the University of Applied Science Karlsruhe, Germany. He is POWER7 champion and has 14 years experience in AIX, Linux, virtualization, and Power Systems and its predecessors, providing pre-sales technical support to clients, Business Partners, and IBM sales representatives all over Germany. Stephen is also an expert in IBM Systems Director, its plug-ins, and IBM SmartCloud® Entry with a focus on Power Systems and AIX.

John T Schmidt is an Accredited IT Specialist for IBM and has twelve years experience with IBM and Power Systems. He has a degree in Electrical Engineering from the University of Missouri - Rolla and an MBA from Washington University in St. Louis. In addition to contributing to eight other Power Systems IBM Redpapers™ publications, in 2010, he completed an assignment with the IBM Corporate Service Corps in Hyderabad, India. He is currently working in the United States as a pre-sales Field Technical Sales Specialist for Power Systems in Boston, MA.

Marco Vallone is a certified IT Specialist at IBM Italy. He joined IBM in 1989 starting in the Power Systems production plant (Santa Palomba) as a product engineer and afterwords he worked for the ITS AIX support and delivery service center. For the last eight years of his career, he has worked as IT Solution Architect in the ITS Solution Design Compentence Center of Excellence in Rome, where he mainly designs infrastructure solutions on distributed environments with a special focus on Power System solution.

The project that produced this publication was managed by:

Scott Vetter

Executive Project Manager, PMP

x IBM Power 750 and 760 Technical Overview and Introduction

Thanks to the following people for their contributions to this project:

Larry L. Amy, Ron Arroyo, Hsien-I Chang, Carlo Costantini, Kirk Dietzman, Gary Elliott, Michael S. Floyd, James Hermes, Pete Heyrman, John Hilburn, Roberto Huerta de la Torre, Dan Hurlimann, Roxette Johnson, Sabine Jordan, Kevin Kehne, Robert Lowden, Jia Lei Ma, Hilary Melville, Hans Mozes, Thoi Nguyen, Mark Olson, Pat O’Rourke, Jan Palmer, Velma Pavlasek, Dave Randall, Robb Romans, Todd Rosedahl, Jeff Stuecheli, Madeline Vega IBM

Udo Sachs SVA Germany

Louis Bellanger Bull

Simon Higgins FIL Investment Management Limited

Tam ikia B arrow International Technical Support Organization, Poughkeepsie Center

Now you can become a published author, too!

Here’s an opportunity to spotlight your skills, grow your career, and become a published author—all at the same time! Join an ITSO residency project and help write a book in your area of expertise, while honing your experience using leading-edge technologies. Your efforts will help to increase product acceptance and customer satisfaction, as you expand your network of technical contacts and relationships. Residencies run from two to six weeks in length, and you can participate either in person or as a remote resident working from your home base.

Find out more about the residency program, browse the residency index, and apply online at:

ibm.com/redbooks/residencies.html

Comments welcome

Your comments are important to us!

We want our papers to be as helpful as possible. Send us your comments about this paper or other IBM Redbooks® publications in one of the following ways:

򐂰 Use the online Contact us review Redbooks form found at:

ibm.com/redbooks

򐂰 Send your comments in an email to:

redbooks@us.ibm.com

򐂰 Mail your comments to:

IBM Corporation, International Technical Support Organization Dept. HYTD Mail Station P099 2455 South Road Poughkeepsie, NY 12601-5400

Preface xi

Stay connected to IBM Redbooks

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xii IBM Power 750 and 760 Technical Overview and Introduction

Chapter 1. General description

The IBM Power 750 Express server (8408-E8D) and IBM Power 760 server (9109-RMD) use the latest POWER7+ processor technology that is designed to deliver unprecedented performance, scalability, reliability, and manageability for demanding commercial workloads.

The IBM Power 750 Express server and the Power 760 server deliver the outstanding performance of the POWER7+ processor. The performance, capacity, energy efficiency, and virtualization capabilities of the Power 750 or Power 760 make it an ideal consolidation, database or multi-application server. As a consolidation or highly virtualized multi-application server, the Power 750 Express and the Power 760 servers offer tremendous configuration flexibility to meet the most demanding capacity and growth requirements. Use the full capability of the system by leveraging industrial-strength PowerVM virtualization for AIX, IBM i, and Linux. PowerVM offers the capability to dynamically adjust system resources based on workload demands so that each partition gets the resources it needs. Active Memory Expansion is a technology, introduced with POWER7, that enables the effective maximum memory capacity to be much larger than the true physical memory. The POWER7+ processor includes built-in accelerators that increase the efficiency of the compression and decompression process, allowing greater levels of expansion up to 125%. This can enable a partition to do significantly more work or enable a server to run more partitions with the same physical amount of memory.

The Power 750 and Power 760 servers are 5U 19-inch rack-based systems. The Power 750 offers configurations of up to 32 POWER7+ cores and 1 TB of memory. The Power 760 offers configurations of up to 48 POWER7+ cores and 2 TB of memory. Both are able to contain internal I/O and also connections to additional drawers for external I/O. These systems contain a single processor planar board with up to four pluggable processor modules. The processor modules have eight installed cores (8404-E8D) or 12 installed cores (9109-RMD).

The POWER7+ module, built with 32 nm technology, dramatically increases the number of circuits available, supporting a larger L3 cache (80 MB: 2.5 times greater than its POWER7 predecessor), and new performance acceleration features for Active Memory Expansion and hardware-based data encryption. Power servers using this new module will be able to achieve higher frequencies within the same power envelope and improved performance per core when compared to POWER7 based offerings.

1.1 Systems overview

Power 760 (front views)

Power 750 Express (front views)

Detailed information about the Power 750 Express server and Power 760 systems is within the following sections. Figure 1-1 shows the front view of the Power 750 and Power 760.

Figure 1-1 Front view of the Power 750 Express and Power 760

1.1.1 IBM Power 750 Express server

The Power 750 Express server (8408-E8D) supports up to four POWER7+ processor dual chip modules (DCMs). Each of the four processor DCMs is an 8-core DCM packaged with 2 x 4-core chips. All 8-core processor DCMs are either 3.5 or 4.0 GHz mounted on a dedicated card. The Power 750 is in a 19-inch rack-mount, 5U (EIA units) drawer configuration. Each POWER7+ processor DCM is a 64-bit, 8-core processor packaged on a dedicated card with a maximum of 16 DDR3 DIMMs, 10 MB of L3 cache per core, and 256 KB of L2 cache per core. A Power 750 Express server can be populated with one, two, three, or four DCMs providing 8, 16, 24, or 32 cores. All the cores are active.

The Power 750 Express server supports a maximum of 64 DDR3 DIMM slots, 16 per 8-core DCM. Memory features (two DIMMs per memory feature) supported are 8, 16, and 32 GB and run at a speed of 1066 MHz. A system with four DCMs installed has a maximum memory of 1024 GB. The optional Active Memory Expansion feature enables the effective maximum memory capacity to be much larger than the true physical memory. Innovative compression and decompression of memory content using a new hardware accelerator can allow memory expansion up to 125% for AIX partitions. A server with a maximum of 1024 GB can effectively be expanded in excess of more than 2 TB. This can enhance virtualization and server consolidation by allowing more partitions or running more work with the same physical amount of memory.

The Power 750 Express server delivers great I/O expandability. In addition to the six PCIe Gen2 slots in the system unit, up to four 12X-attached I/O drawers (FC 5802 or FC 5877),

2 IBM Power 750 and 760 Technical Overview and Introduction

add up to 40 PCIe Gen1 slots. This set of PCIe slots can provide extensive connectivity to LANs, switches, SANs, asynchronous devices, SAS storage, tape storage, and more. For example, more than 64 TB of SAS disk storage is supported.

The Power 750 Express system unit includes six small form factor (SFF) SAS bays. This offers up to 5.4 TB HDD capacity or up to 3.6 TB SSD capacity. All SAS disks and SSDs are

2.5-inch SFF and hot swappable. The six SAS SFF bays can be split into two sets of three bays for additional configuration flexibility using just the integrated SAS adapters.

Two new SSD packages offer ordering convenience and price savings for a new server order. Each 6-pack SSD feature (FC ESR2 or FC ESR4) for the EXP30 Ultra SSD I/O Drawer can provide up to 140,000 I/O operations per second (IOPS) in just one-fifth of a 1U drawer. The 4-pack SSD features (FC ESRA, FC ESRB, FC ESRC, and FC ESRD) can provide up to 90,000 IOPS. The 6-pack or 4-pack SSD must be ordered with the server, not as a later miscellaneous equipment specification (MES) order.

Other integrated features include the following items: 򐂰 Enhanced I/O bandwidth with PCIe Gen2 slots compared to the PCIe Gen1 and PCI-X

slots of the POWER7-based Power 750 (8233-E8B)

򐂰 Enhanced I/O redundancy and flexibility with two new, integrated POWER7 I/O controllers 򐂰 One hot-plug, slim-line SATA media bay (optional) 򐂰 Choice of Integrated Multifunction Card options (maximum one per system):

– Dual 10 Gb Copper + Dual 1 Gb Ethernet (FC 1768) – Dual 10 Gb Optical + Dual 1 Gb Ethernet (FC 1769) – Dual 10 Gb Copper + Dual 1/10 Gb (RJ45) Ethernet (FC EN10) – Dual 10 Gb Optical + Dual 1/10 Gb (RJ45) Ethernet (FC EN11)

򐂰 One serial port on the Integrated Multifunction Card: two USB ports per each Integrated

Multifunction Card plus another USB port (maximum three usable USB ports per system)

򐂰 Service processor 򐂰 EnergyScale technology 򐂰 Two SPCN ports and two Hardware Management Console (HMC) ports (HMC is optional) 򐂰 Redundant and hot-swap AC power supplies 򐂰 Redundant and hot-swap cooling 򐂰 4-pack and 6-pack SSD features that can be ordered with a new server

1.1.2 IBM Power 760 server

The IBM Power 760 server (9109-RMD) supports up to four POWER7+ processor DCMs and is in a 5U (EIA units) drawer configuration. Each of the four processor DCMs is a 0/12-core Capacity Upgrade on Demand (CUoD) DCM packaged with 2 x 6-core chips. All 0/12-core CUoD processor DCMs are 64-bit, either 3.1 GHz or 3.4 GHz mounted on a dedicated card with a maximum of 16 DDR3 DIMMs, 10 MB of L3 cache per core, and 256 KB of L2 cache per core. A fully populated Power 760 server with four DCMs has a minimum of eight cores activated and up to a maximum of 48 cores with a CUoD granularity of one core.

Note: 0/12-core means 0-core through 12-core. For example, 16 slots per 0 to 12 core DCM is indicated as 16 per 0/12-core.

Chapter 1. General description 3

The Power 760 server supports a maximum of 64 DDR3 DIMM slots, 16 per 0/12-core processor DCM. Memory features (two memory DIMMs per feature) supported are 8, 16, 32, and 64 GB and run at a speed of 1066 MHz. A system with four DCMs installed has a maximum memory of 2048 GB. Also, the optional Active Memory Expansion can enable the effective maximum memory capacity to be much larger than the true physical memory. Innovative compression and decompression of memory content using processor cycles can enable memory expansion up to 125% for AIX partitions. A server with a maximum of 2048 GB can effectively be expanded to greater than 4 TB. This can enhance virtualization and server consolidation by allowing more partitions or running more work with the same physical amount of memory.

The Power 760 server offers great I/O expandability. In addition to the six PCIe Gen2 slots in the system unit, up to four 12X-attached I/O drawers (FC 5802 or FC 5877) add up to 40 PCIe Gen1 slots. This set of PCI slots can deliver extensive connectivity to LANs, switches, SANs, asynchronous devices, SAS storage, tape storage, and more. For example, more than 64 TB of SAS disk storage is supported.

The Power 760 server includes six SFF SAS bays. This offers up to 5.4 TB HDD capacity or up to 3.6 TB SSD capacity. All SAS disks and SSDs are 2.5-inch SFF and hot swappable. The six SAS or SSD bays can be split into two sets of three bays for additional configuration flexibility using just the integrated SAS adapters.

Two new SSD packages offer ordering convenience and price savings for a new server order. Each 6-pack SSD feature (FC ESR2 or FC ESR4) for the EXP30 Ultra SSD I/O Drawer can provide up to 140,000 I/O operations per second (IOPS) in just one-fifth of a 1U drawer. The 4-pack SSD feature (FC ESRA, FC ESRB, FC ESRC, and FC ESRD) can provide up to 90,000 IOPS. A 6-pack or 4-pack SSD must be ordered with the server, not as a later MES order.

Other integrated features include: 򐂰 Enhanced I/O bandwidth with PCIe Gen2 slots compared to the PCIe Gen1 and PCI-X

slots of the POWER7-based Power 750

򐂰 Enhanced I/O redundancy and flexibility with two new, integrated POWER7 I/O controllers 򐂰 One hot-plug, slim-line SATA media bay per enclosure (optional) 򐂰 Choice of Integrated Multifunction Card options (maximum one per system):

򐂰 One serial port on the Integrated Multifunction Card 򐂰 Two USB ports on the Integrated Multifunction Card plus another USB port on the base

system unit

򐂰 Service processor 򐂰 EnergyScale technology 򐂰 Two SPCN ports and two hardware management console (HMC) ports (HMC is optional) 򐂰 Redundant and hot-swap AC power supplies 򐂰 Redundant and hot-swap cooling 򐂰 4-pack and 6-pack SSD features that can be ordered with a new server

4 IBM Power 750 and 760 Technical Overview and Introduction

1.2 Operating environment

Table 1-1 lists the operating environment specifications for the servers.

Table 1-1 Operating environment for Power 750 Express and Power 760

Description Operating Non-operating

Temperature 5 - 35 degrees C

(41 - 95 degrees F)

Relative humidity 20 - 80% 8 - 80%

Maximum dew point 29 degrees C

(84 degrees F)

Operating voltage 200 - 240 V AC Not applicable

Operating frequency 50 - 60 ± 3 Hz Not applicable

Power consumption Power 750:

2400 watts maximum (system unit with 32 cores installed) Power 760: 2400 watts maximum (system unit with 48 cores active)

Power source loading Power 750:

2.45 kVA maximum (system unit with 32 cores installed) Power 760:

2.45 kVA maximum (system unit with 48 cores active)

Thermal output Power 750:

8,189 BTU/hr maximum (system unit with 32 cores installed) Power 760: 8,189 BTU/hr maximum (system unit with 48 cores active)

5 - 45 degrees C (41 - 113 degrees F)

28 degrees C (82 degrees F)

Not applicable

Maximum altitude 3048 m

Noise level for system unit Power 750 (system unit with 32 installed cores):

Not applicable

(10,000 ft)

򐂰 7.1 bels (operating or idle) 򐂰 6.6 bels (operating or idle) with acoustic rack doors

Power 760 (system unit with 48 active cores):

򐂰 7.1 bels (operating or idle) 򐂰 6.6 bels (operating or idle) with acoustic rack doors

Chapter 1. General description 5

1.3 IBM Systems Energy Estimator

Integrated Multifunction Card

PCIe Gen2

slots

GX++

slots

Power

Supplies

HMC

portsUSB port

SPCN

ports

USB ports

VPD card

External SAS

port

Ethernet

ports

Serial port

The IBM Systems Energy Estimator is a web-based tool for estimating power requirements for IBM Power Systems. You can use this tool to estimate typical power requirements (watts) for a specific system configuration under normal operating conditions:

http://www-912.ibm.com/see/EnergyEstimator/

1.4 Physical package

Table 1-2 lists the physical dimensions of an individual system unit. Both servers are available only in a rack-mounted form factor and each can take five EIA units (5U) of rack space.

Table 1-2 Physical dimensions of a Power 750 Express and Power 760 server

Dimension Power 750 (Model 8408-E8D) Power 760 (Model 9109-RMD)

Width 447 mm (17.6 in) 447 mm (17.6 in)

Depth 858 mm (33.8 in) 858 mm (33.8 in)

Height 217 mm (8.56 in), 5U (EIA units) 217 mm (8.56 in), 5U (EIA units)

Weight 70.3 kg (155 lb) 70.3 kg (155 lb)

Figure 1-2 shows the rear view of the Power 750 Express and Power 760.

Figure 1-2 Rear view of the Power 750 Express and Power 760

6 IBM Power 750 and 760 Technical Overview and Introduction

1.5 System features

This section describes the features available on the Power 750 and Power 760 systems.

1.5.1 Power 750 Express system features

The following features are available on the Power 750 Express:

򐂰 A 5U 19-inch rack-mount system enclosure 򐂰 One to four 8-core DCMs:

– 8-core (2 x 4-core) 3.5 GHz processor DCM (FC EPT8) – 8-core (2 x 4-core) 4.0 GHz processor DCM (FC EPT7)

Additional processor considerations:

򐂰 Each system must have a minimum of one processor DCM (eight cores). 򐂰 There is a maximum of four DCMs per system (32 cores). 򐂰 If you have more than one processor DCM in one server, then all processor DCM

features must be identical: All 3.5 GHz processor DCMs (FC EPT8) or all 4.0 GHz processor DCMs (FC EPT7).

򐂰 All the cores must be activated using FC EPTC, FC EPTD, FC EPTE or FC EPTF. 򐂰 A minimum of 8 GB per core is required to use FC EPTC or FC EPTD zero-priced

1-core activation features.

򐂰 POWER7+ DDR3 Memory DIMMs (two per feature):

– 8 GB (2 x 4 GB), 1066 MHz (FC EM08) – 16 GB (2 x 8 GB), 1066 MHz (FC EM4B) – 32 GB (2 x 16 GB), 1066 MHz (FC EM4C)

򐂰 Active Memory Expansion with POWER7+ hardware accelerator (FC 4792) 򐂰 Six hot-swappable, 2.5-inch, small form factor, SAS disks or SSD bays per system 򐂰 One hot-plug, slim-line, SATA media bay per system 򐂰 Redundant hot-swap 1,925 Watts AC power supplies 򐂰 Choice of Integrated Multifunction Card options (maximum one per system):

– Dual 10 Gb Copper and Dual 1 Gb Ethernet (FC 1768) – Dual 10 Gb Optical and Dual 1 Gb Ethernet (FC 1769) – Dual 10 Gb Copper and Dual 1/10 Gb (RJ45) Ethernet (FC EN10) – Dual 10 Gb Optical and Dual 1/10 Gb (RJ45) Ethernet (FC EN11)

򐂰 One serial port on the Integrated Multifunction Card 򐂰 Two USB ports on the Integrated Multifunction Card plus another USB port on the base

system unit

򐂰 DASD and Media backplane with 6 x 2.5-inch HDD or SSD (FC EPTS):

– One to six SFF SAS DASD or SSDs (mixing allowed) – Two integrated SAS controllers to run SAS bays – One slim bay for a DVD-RAM (required) – One integrated SATA controller to run the DVD-RAM

򐂰 Two HMC ports

Chapter 1. General description 7

򐂰 Eight I/O expansion slots per system

– Six Gen2 PCIe 8x slots plus two GX++ slots

򐂰 PowerVM (optional)

– IBM Micro-Partitioning® – Virtual I/O Server (VIOS) – Automated CPU and memory reconfiguration support for dedicated and shared

processor logical partition groups (dynamic LPAR)

– PowerVM Live Partition Migration (requires PowerVM Enterprise Edition)

򐂰 12X I/O drawer with PCIe slots for 16-core or larger Power 750 systems:

– Up to four PCIe I/O drawers (FC 5802 or FC 5877)

򐂰 Disk or SSD-only I/O drawers:

– Up to two EXP30 Ultra SSD I/O drawers (FC EDR1) with integrated, high-performance

SAS controllers

– Up to 51 EXP24S SFF SAS I/O drawers (FC 5887) on SAS PCIe controllers (optionally

one of the 51 drawers can be attached to the external SAS port of the system unit)

– Up to 27 EXP12S 3.5-inch SAS I/O drawers (FC 5886) on SAS PCIe controllers

(supported but not orderable)

1.5.2 Power 760 system features

The following features are available on the Power 760:

򐂰 A 5U 19-inch rack-mount system enclosure 򐂰 One to four 0/12-core CUoD processor DCMs:

– 0/12-core (2 x 6-core) 3.1 GHz processor DCM (FC EPT5) – 0/12-core (2 x 6-core) 3.4 GHz processor DCM (FC EPT6)

Additional processor considerations:

򐂰 Each system must have a minimum of one processor DCM (12 cores). 򐂰 There is a maximum of four DCMs per system (48 cores). 򐂰 If you have more than one processor DCM in one server, then all processor DCM

features must be identical: All 3.1 GHz processor DCMs (FC EPT5) or all 3.4 GHz processor DCMs (FC EPT6).

򐂰 Each system must have a minimum of eight processor activations (FC EPTA or

FC EPTB).

򐂰 All processor DCMs are placed on a mandatory processor and memory backplane

(FC EPT1).

򐂰 POWER7+ DDR3 Memory DIMMs (two per feature):

– 8 GB (2 x 4 GB), 1066 MHz (FC EM08) – 16 GB (2 x 8 GB), 1066 MHz (FC EM4B) – 32 GB (2 x 16 GB), 1066 MHz (FC EM4C) – 64 GB (2 x 32 GB), 1066 MHz (FC EM4D)

򐂰 Active Memory Expansion with POWER7+ hardware accelerator (FC 4792) 򐂰 Six hot-swappable, 2.5-inch, small form-factor SAS disks or SSD bays per system

8 IBM Power 750 and 760 Technical Overview and Introduction

򐂰 One hot-plug, slim-line SATA media bay per system 򐂰 Redundant hot-swap 1,925 Watts AC power supplies 򐂰 Choice of Integrated Multifunction Card options (maximum one per system):

– Dual 10 Gb Copper and Dual 1 Gb Ethernet (FC 1768) – Dual 10 Gb Optical and Dual 1 Gb Ethernet (FC 1769) – Dual 10 Gb Optical and Dual 1/10 Gb (RJ45) Ethernet (FC EN11) – Dual 10 Gb Copper and Dual 1/10 Gb (RJ45) Ethernet (FC EN10)

򐂰 One serial port on the Integrated Multifunction Card 򐂰 Two USB ports on the Integrated Multifunction Card plus another USB port on the base

system unit

򐂰 DASD and Media Backplane with 6 x 2.5-inch DASD or SSD (FC EPTS):

– One to six SFF SAS DASD or SSDs (mixing allowed) – Two integrated SAS controllers to run the SAS bays – One slim bay for a DVD-RAM (required) – One integrated SATA controller to run the DVD-RAM

򐂰 Eight I/O expansion slots per system

– Six Gen2 PCIe 8x slots plus two GX++ slots

򐂰 Two HMC ports 򐂰 Permanent Processor CUoD 򐂰 PowerVM (optional)

– Micro-Partitioning – Virtual I/O Server (VIOS) – Automated CPU and memory reconfiguration support for dedicated and shared

processor logical partition (LPAR) groups

– PowerVM Live Partition Mobility (requires PowerVM Enterprise Edition)

򐂰 12X I/O drawers with PCIe slots for 24-core or larger Power 760:

– Up to four PCIe I/O drawers (FC 5802 or FC 5877)

򐂰 Disk-only I/O drawers

– Up to two EXP30 Ultra SSD I/O drawers with integrated, high performance, SAS

controllers (FC EDR1)

– Up to 51 EXP24S SFF SAS I/O drawers (FC 5887) on SAS PCIe controller (optionally

one of the 51 drawers can be attached to the external SAS port of the system unit)

– Up to 27 EXP12S 3.5-inch SAS I/O drawers (FC 5886) on SAS PCIe controllers

Chapter 1. General description 9

1.5.3 Minimum features

Each system has a minimum feature set to be valid. Table 1-3 shows the minimum system configuration for a Power 750.

Table 1-3 Minimum features for Power 750 Express system

Power 750 minimum features

One system enclosure (5U) 򐂰 The base machine includes the bezels for the rack. No feature

Notes

code is required.

򐂰 One service processor (FC EPTR) 򐂰 Processor and memory backplane (FC EPT1) 򐂰 One DASD backplane (FC EPTS) 򐂰 Two power cords rated at 200-240 V and 10 A 򐂰 Two AC power supply (FC 5532) 򐂰 One Integrated Multifunction Card chosen from:

– Quad Ethernet 2 x 1 GB and 2 x 10 GB Optical (FC 1769) – Quad Ethernet 2 x 1 GB and 2 x 10 GB Copper (FC 1768) – Dual 10 Gb Copper + Dual 1/10 Gb (RJ45) Ethernet

(FC EN10)

– Dual 10 Gb Optical + Dual 1/10 Gb (RJ45) Ethernet

(FC EN11)

One primary operating system

One processor card 򐂰 8-core, 3.5 GHz processor card DCM (FC EPT8)

Eight processor activations For processor card FC EPT7, one of the following items:

32 GB minimum DDR3 memory. A minimum of two identical features from:

For AIX and Linux: One disk drive

򐂰 AIX (FC 2146) 򐂰 IBM i (FC 2145) 򐂰 Linux (FC 2147)

򐂰 8-core, 4.0 GHz processor card DCM (FC EPT7)

򐂰 8 X (FC EPTE) 򐂰 4 X (FC EPTC) plus 4 x (FC EPTE)

For processor card FC EPT8, one of the following items:

򐂰 8 X (FC EPTF) 򐂰 4 X (FC EPTD) plus 4 x (FC EPTF)

򐂰 8 GB (4 X 8 GB), 1066 MHz (FC EM08) 򐂰 16 GB (2 X 8 GB), 1066 MHz (FC EM4B) 򐂰 32 GB (2 X 16 GB), 1066 MHz (FC EM4C)

򐂰 900 GB 10K RPM SAS SFF Disk Drive (FC 1751) 򐂰 900 GB 10K RPM SAS SFF-2 Disk Drive (FC 1752) 򐂰 600 GB 10K RPM SAS SFF Disk Drive (FC 1790) 򐂰 600 GB 10K RPM SAS SFF-2 Disk Drive (FC 1964) 򐂰 300 GB 15K RPM SAS SFF Disk Drive (FC 1880) 򐂰 300 GB 15K RPM SAS SFF-2 Disk Drive (FC 1953) 򐂰 300 GB 10K RPM SFF SAS Disk Drive (FC 1885) 򐂰 300 GB 10K RPM SAS SFF-2 Disk Drive (FC 1925) 򐂰 146 GB 15K RPM SFF SAS Disk Drive (FC 1886) 򐂰 146 GB 15K RPM SAS SFF-2 Disk Drive (FC 1917) 򐂰 If SAN boot (FC 0837) is selected then no disk drive is required

10 IBM Power 750 and 760 Technical Overview and Introduction

Power 750 minimum features

Notes

For IBM i: Two disk drives

򐂰 856 GB 10K RPM SAS SFF Disk Drive (FC 1737) 򐂰 856 GB 10K RPM SAS SFF-2 Disk Drive (FC 1738) 򐂰 571 GB 10K RPM SAS SFF Disk Drive (FC 1916) 򐂰 571 GB 10K RPM SAS SFF-2 Disk Drive (FC 1962) 򐂰 283 GB 15K RPM SAS SFF Disk Drive (FC 1879) 򐂰 283 GB 15K RPM SAS SFF-2 Disk Drive (FC 1948) 򐂰 283 GB 10K RPM SFF SAS Disk Drive (FC 1911) 򐂰 283 GB 10K RPM SAS SFF-2 Disk Drive (FC 1956) 򐂰 139 GB 15K RPM SFF SAS Disk Drive (FC 1888) 򐂰 139 GB 15K RPM SAS SFF-2 Disk Drive (FC 1947) 򐂰 If SAN boot (FC 0837) is selected then no disk drive is required

One Language Group

FC 9300 or FC 97xx Language Group Specify

Specify

One removable media

SATA Slimline DVD-RAM Drive (FC 5771)

device

One HMC HMC is optional

Considerations: 򐂰 The no-charge processor core activations, FC EPTC and FC EPTD, have a minimum

prerequisite of 8 GB memory per core before they can be ordered. That is, a miniumum of 64 GB of active memory per DCM is a prerequisite before ordering the no-charge processor core activations. When either FC EPTC or FC EPTD are ordered, 50% of the DCM processor core activations can be no-charge FC EPTC or FC EPTD and at 50% must be priced FC EPTE or FC EPTF.

򐂰 The Ethernet ports and serial port of the Integrated Multifunction Card is not natively supported

by IBM i and thus cannot be used for IBM i LAN console support. The FC 5899 4-port Ethernet adapter is usually used with this function or an optional HMC can be used for IBM i console functions.

򐂰 If IBM i native support is required, choose an Ethernet card:

– 2-Port 10/100/1000 Base-TX Ethernet PCI Express Adapter (FC 5767) – 2-Port Gigabit Ethernet-SX PCI Express Adapter (FC 5768) – 10 Gigabit Ethernet-LR PCI Express Adapter (FC 5772) – PCIe2 4-Port 1 Gb Ethernet Adapter (FC 5899)

Table 1-4 shows the minimum system configuration for a Power 760 system.

Table 1-4 Minimum features for Power 760 system

Power 760 minimum features

One system enclosure (5U) 򐂰 The base machine includes the bezels for the rack. No feature

Notes

code is required.

򐂰 One service processor (FC EPTR) 򐂰 Processor and Memory Backplane (FC EPT1) 򐂰 One DASD Backplane (FC EPTS) 򐂰 Two Power Cords rated at 200-240 V and 10 A 򐂰 Two AC Power Supply (FC 5532) 򐂰 One Integrated Multifunction Card chosen from:

– Quad Ethernet 2 x 1 GB and 2 x 10 GB Optical (FC 1769) – Quad Ethernet 2 x 1 GB and 2 x 10 GB Copper (FC 1768) – Dual 10 Gb Copper + Dual 1/10 Gb (RJ45) Ethernet

(FC EN10)

– Dual 10 Gb Optical + Dual 1/10 Gb (RJ45) Ethernet

(FC EN11)

Chapter 1. General description 11

Power 760 minimum features

Notes

One primary operating system

򐂰 AIX (FC 2146) 򐂰 IBM i (FC 2145) 򐂰 Linux (FC 2147)

One processor card 򐂰 0/12-core, 3.1 GHz POWER7+ processor card (FC EPT5)

򐂰 0/12-core, 3.4 GHz POWER7+ processor card (FC EPT6)

Eight processor activations 򐂰 0/12-core, 3.1 GHz POWER7+ processor card (FC EPT5)

requires a minimum of eight FC EPTA

򐂰 0/12-core, 3.4 GHz POWER7+ processor card (FC EPT6)

requires a minimum of eight FC EPTB

32 GB minimum DDR3 memory. A minimum of two identical features from:

򐂰 8 GB (4 x 8 GB), 1066 MHz (FC EM08) 򐂰 16 GB (2 x 8 GB), 1066 MHz (FC EM4B) 򐂰 32 GB (2 x 16 GB), 1066 MHz (FC EM4C) 򐂰 64 GB (2 x 32 GB), 1066 MHz (FC EM4D)

For AIX and Linux: One disk drive

For IBM i: Two disk drives

One Language Group

FC 9300 or FC 97xx Language Group Specify

Specify

One HMC Required for the Power 760

Considerations:

򐂰 The Ethernet ports and serial port of the Integrated Multifunction Card is not natively supported

by IBM i and thus cannot be used for IBM i LAN console support. The FC 5899 4-port Ethernet adapter is usually used with this function or an optional HMC can be used for IBM i console functions.

򐂰 If IBM i inative support is required, choose an Ethernet card:

12 IBM Power 750 and 760 Technical Overview and Introduction

1.5.4 Power supply features

Two system AC power supplies (FC 5532) are required for each system enclosure. The second power supply provides redundant power for enhanced system availability. To provide full redundancy, the two power supplies must be connected to separate power distribution units (PDUs).

The system will continue to function with one working power supply. A failed power supply can be hot-swapped but must remain in the system until the replacement power supply is available for exchange.

The Power 750 and the Power 760 require 200-240 V AC for all configurations.

1.5.5 Processor card features

The Power 750 and Power 760 systems contain a processor planar board (FC EPT1) that has the following sockets:

򐂰 Four processor sockets 򐂰 Eight memory riser sockets (two per processor module) with eight DIMM sockets per riser 򐂰 Five power regulator sockets (one regulator socket is preinstalled on the planar)

The processor planar is populated with one, two, three, or four processor modules. The processor modules can be installed in field but must be installed by an IBM customer engineer.

The Power 750 has two types of processor cards:

򐂰 FC EPT8 offering 8-core POWER7+ processor card at 3.5 GHz 򐂰 FC EPT7 offering 8-core POWER7+ processor card at 4.0 GHz

The Power 760 has two types of processor cards:

򐂰 FC EPT5 offering 12-core POWER7+ processor card at 3.1 GHz 򐂰 FC EPT6 offering 12-core POWER7+ processor card at 3.4 GHz

Chapter 1. General description 13

Figure 1-3 shows the top view of the Power 750 and Power 760 system with four DCMs

PCIe slot #1

PCIe slot #3

PCIe slot #2

PCIe slot #4

PCIe slot #5

PCIe slot #6

Memory Riser #1

Memory Riser #2

Memory Riser #3

Memory Riser #4

Memory Riser #5

Memory Riser #6

Memory Riser #7

Memory Riser #8

Regulator #5

TPMD Slot

Regulator #1

Regulator #2

Regulator #3

Regulator #4

DCM1

DCM0

DCM4

DCM3

Fans

installed.

Figure 1-3 View of the Power 750 and Power 760 with four DCMs installed

The Power 750 server does not support Capacity Upgrade on Demand for processors, and must come fully activated.

The Power 760 supports Capacity Upgrade On Demand for processors only. A minimum of eight processor activations are required per system. Additional processor activations may be purchased with the initial configuration or at a later time. More information about Capacity Upgrade on Demand is in 2.4.1, “Capacity Upgrade on Demand” on page 61.

14 IBM Power 750 and 760 Technical Overview and Introduction

Summary of processor features

Table 1-5 summarizes the processor feature codes for the Power 750 Express server. Cells marked N/A indicate bulk ordering codes and Custom Card Identification Number (CCIN) are not applicable. A blank CCIN cell indicates CCIN not available.

Table 1-5 Summary of processor features for the Power 750 Express server

Feature code

EPT1 2B61 Processor & Memory Backplane + Base Memory VRM + Clock

EPT8 54A1 3.5 GHz, 8-core POWER7+ Processor DCM (2x4-core) AIX, IBM i,

EPT7 4.0 GHz, 8-core POWER7+ Processor DCM (2x4-core) AIX, IBM i,

EPTC N/A 1-core activation of FC EPT7 (No charge) AIX, IBM i,

EPTD N/A 1-core activation of FC EPT8 (No charge) AIX, IBM i,

EPTE N/A 1-core activation of FC EPT7 AIX, IBM i,

EPTF N/A 1-core activation of FC EPT8 AIX, IBM i,

EPTR 2B67 Service processor AIX, IBM i,

CCIN Description OS

support

AIX, IBM i,

Card

Linux

Table 1-6 summarizes the processor feature codes for the Power 760.

Table 1-6 Summary of processor features for the Power 760

Feature code

EPT1 2B61 Processor & Memory Backplane + Base Memory VRM + Clock

EPT5 3.1 GHz, Proc DCM, 0/12-core POWER7+ (2x6-core) AIX, IBM i,

EPT6 3.4 GHz, Proc DCM, 0/12-core POWER7+ (2x6-core) AIX, IBM i,

EPTA N/A 1-core activation of FC EPT5 AIX, IBM i,

EPTB N/A 1-core activation of FC EPT6 AIX, IBM i,

EPTR 2B67 Service processor AIX, IBM i,

CCIN Description OS

support

AIX, IBM i,

Card

Linux

Chapter 1. General description 15

1.5.6 Memory features

DCM

MC: Memory Controller BC: Memory Buffer

Memory Riser Card #2

DDR3 RDIMM Slot 2

DDR3 RDIMM Slot 1

DDR3 RDIMM Slot 8

DDR3 RDIMM Slot 7

DDR3 RDIMM Slot 4

DDR3 RDIMM Slot 3

DDR3 RDIMM Slot 6

DDR3 RDIMM Slot 5

BC-B

BC-A

POWER 7+

Chip 1

MC1 Channel D

MC1 Channel C

POWER 7+

Chip 0

MC0 Channel B

MC0 Channel A

Memory Riser Card #1

DDR3 RDIMM Slot 2

DDR3 RDIMM Slot 1

DDR3 RDIMM Slot 8

DDR3 RDIMM Slot 7

DDR3 RDIMM Slot 4

DDR3 RDIMM Slot 3

DDR3 RDIMM Slot 6

DDR3 RDIMM Slot 5

BC-B

BC-A

In POWER7+ systems, DDR3 memory is used throughout. There are four capacity memory features, each has two DIMMs: 8 GB, 16 GB, 32 GB, or 64 GB. The Power 760 supports all four memory features. The Power 750 does not support the 64 GB feature.

The POWER7+ DDR3 memory has been redesigned to provide greater bandwidth and capacity. The 16, 32 and 64 GB DIMMs use 4 GB DRAMs. This enables operating at a higher data rate for large memory configurations. All memory cards have eight memory DIMM slots running at speeds of 1066 MHz and must be populated with POWER7+ DDR3 Memory DIMMs. Each DCM supports two memory riser cards.

The DIMMs are plugged into memory riser cards (FC EM01) located on the processor and memory backplane (FC EPT1). Each riser card has eight DIMM slots.

Figure 1-4 outlines the general connectivity of a POWER7+ DCM and DDR3 memory DIMMs. The figure shows the eight memory channels (four per DCM).

Figure 1-4 Outline of POWER7+ processor connectivity to DDR3 DIMMs in Power 750 and Power 760

16 IBM Power 750 and 760 Technical Overview and Introduction

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IBM Power 750, Power 760 Technical Overview And Introduction

Specifications and Main Features

Frequently Asked Questions

User Manual