IBM Power 720, Power 740 Overview

Front cover

IBM Power 720 and 740 Technical Overview and Introduction

Features 8202-E4D and 8205-E6D servers based on POWER7+ processor technology

Describes the support of 20 partitions per core

Explores leading performance on entry servers

James Cruickshank

Sorin Hanganu

Volker Haug

Stephen Lutz

John T Schmidt

Marco Vallone

ibm.com/redbooks

Redpaper

International Technical Support Organization

IBM Power 720 and 740 Technical Overview and Introduction

May 2013

REDP-4984-00

Note: Before using this information and the product it supports, read the information in “Notices” on page vii.

First Edition (May 2013)

This edition applies to the IBM Power 720 (8202-E4D) and Power 740 (8205-E6D) Power Systems servers.

Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp.

Contents

Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vii

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viii

Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix

Authors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix

Now you can become a published author, too! . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi

Comments welcome. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi

Stay connected to IBM Redbooks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi

Chapter 1. General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 Systems overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.1.1 The Power 720 server. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.1.2 The Power 740 server. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2 Operating environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.3 Physical package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.3.1 Tower model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.3.2 Rack-mount model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.4 System features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

1.4.1 Power 720 system features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

1.4.2 Power 740 system features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

1.4.3 Minimum features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

1.4.4 Power supply features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

1.4.5 Processor module features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

1.4.6 Memory features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

1.5 Disk and media features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

1.6 I/O drawers for Power 720 and Power 740 servers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

1.6.1 12X I/O Drawer PCIe expansion units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

1.6.2 PCI-X DDR 12X Expansion Drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

1.6.3 I/O drawers and usable PCI slots . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

1.6.4 EXP30 Ultra SSD I/O Drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

1.6.5 EXP24S SFF Gen2-bay drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

1.6.6 EXP12S SAS drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

1.7 Comparison between models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

1.8 Build to order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

1.9 IBM Edition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

1.9.1 Express Editions for IBM i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

1.9.2 Express Editions for Power 720 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

1.10 IBM i Solution Editions for Power 720 and Power 740 . . . . . . . . . . . . . . . . . . . . . . . . 24

1.11 IBM i for Business Intelligence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

1.12 Model upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

1.12.1 Upgrade considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

1.12.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

1.13 Server and virtualization management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

1.14 System racks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

1.14.1 IBM 7014 Model S25 rack. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

1.14.2 IBM 7014 Model T00 rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

1.14.3 IBM 7014 Model T42 rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

1.14.4 Feature code 0555 rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

1.14.5 Feature code 0551 rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

1.14.6 Feature code 0553 rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

1.14.7 The AC power distribution unit and rack content . . . . . . . . . . . . . . . . . . . . . . . . 31

1.14.8 Rack-mounting rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

1.14.9 Useful rack additions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

1.14.10 OEM rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Chapter 2. Architecture and technical overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

2.1 The IBM POWER7+ processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

2.1.1 POWER7+ processor overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

2.1.2 POWER7+ processor core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

2.1.3 Simultaneous multithreading. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

2.1.4 Memory access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

2.1.5 On-chip L3 cache innovation and Intelligent Cache . . . . . . . . . . . . . . . . . . . . . . . 48

2.1.6 POWER7+ processor and Intelligent Energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

2.1.7 Comparison of the POWER7+, POWER7, and POWER6 processors . . . . . . . . . 50

2.2 POWER7+ processor modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

2.2.1 Modules and cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

2.2.2 Power 720 and Power 740 systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

2.3 Memory subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

2.3.1 Registered DIMM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

2.3.2 Memory placement rules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

2.3.3 Memory bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

2.4 Capacity on Demand and Capacity Backup offering. . . . . . . . . . . . . . . . . . . . . . . . . . . 60

2.5 System bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

2.6 Internal I/O subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

2.6.1 Slot configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

2.6.2 System ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

2.7 PCI adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

2.7.1 PCIe Gen1 and Gen2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

2.7.2 PCIe adapter form factors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

2.7.3 LAN adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

2.7.4 Graphics accelerator adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

2.7.5 SCSI and SAS adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

2.7.6 PCIe RAID and SSD SAS Adapter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

2.7.7 iSCSI adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

2.7.8 Fibre Channel adapters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

2.7.9 Fibre Channel over Ethernet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

2.7.10 InfiniBand Host Channel adapter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

2.7.11 Asynchronous and USB adapters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

2.7.12 Cryptographic coprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

2.8 Internal storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

2.8.1 RAID support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

2.8.2 External SAS port and split backplane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

2.8.3 Media bays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

2.9 External I/O subsystems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

2.9.1 PCI-DDR 12X expansion drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

2.9.2 12X I/O Drawer PCIe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

2.9.3 12X I/O Drawer PCIe configuration and cabling rules. . . . . . . . . . . . . . . . . . . . . . 83

2.10 External disk subsystems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

2.10.1 EXP30 Ultra SSD I/O drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

2.10.2 EXP24S SFF Gen2-bay drawer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

2.10.3 EXP12S SAS expansion drawer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

2.10.4 IBM System Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

iv IBM Power 720 and 740 Technical Overview and Introduction

2.11 Hardware Management Console . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

2.11.1 HMC connectivity to the POWER7+ processor-based systems . . . . . . . . . . . . 101

2.11.2 High availability HMC configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

2.12 Operating system support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

2.12.1 IBM AIX operating system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

2.12.2 IBM i operating system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

2.12.3 Linux operating system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

2.12.4 Virtual I/O Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

2.12.5 Java versions that are supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

2.12.6 Boosting performance and productivity with IBM compilers . . . . . . . . . . . . . . . 106

2.13 Energy management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

2.13.1 IBM EnergyScale technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

2.13.2 Thermal power management device card. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

2.13.3 Energy consumption estimation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

Chapter 3. Virtualization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

3.1 POWER Hypervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

3.2 POWER processor modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

3.3 Active Memory Expansion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

3.4 PowerVM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

3.4.1 PowerVM editions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

3.4.2 Logical partitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

3.4.3 Multiple shared processor pools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

3.4.4 Virtual I/O Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

3.4.5 PowerVM Live Partition Mobility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

3.4.6 Active Memory Sharing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

3.4.7 Active Memory Deduplication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

3.4.8 Dynamic Platform Optimizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145

3.4.9 Dynamic System Optimizer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

3.4.10 Operating system support for PowerVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

3.4.11 Linux support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147

3.5 System Planning Tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149

3.6 New PowerVM Version 2.2.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

Chapter 4. Continuous availability and manageability . . . . . . . . . . . . . . . . . . . . . . . . 151

4.1 Reliability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

4.1.1 Designed for reliability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

4.1.2 Placement of components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153

4.1.3 Redundant components and concurrent repair. . . . . . . . . . . . . . . . . . . . . . . . . . 153

4.2 Availability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153

4.2.1 Partition availability priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154

4.2.2 General detection and deallocation of failing components . . . . . . . . . . . . . . . . . 154

4.2.3 Memory protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155

4.2.4 Cache protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157

4.2.5 Special Uncorrectable Error handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158

4.2.6 PCI Enhanced Error Handling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

4.3 Serviceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160

4.3.1 Detecting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

4.3.2 Diagnosing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166

4.3.3 Reporting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167

4.3.4 Notifying . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169

4.3.5 Locating and servicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170

Contents v

4.4 Manageability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173

4.4.1 Service user interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173

4.4.2 IBM Power Systems firmware maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178

4.4.3 Concurrent firmware update improvements with POWER7+ . . . . . . . . . . . . . . . 180

4.4.4 Electronic Services and Electronic Service Agent . . . . . . . . . . . . . . . . . . . . . . . 181

4.5 POWER7+ RAS features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182

4.6 Power-On Reset Engine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183

4.7 Operating system support for RAS features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183

Related publications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187

IBM Redbooks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187

Other publications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188

Online resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189

Help from IBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189

vi IBM Power 720 and 740 Technical Overview and Introduction

Notices

This information was developed for products and services offered in the U.S.A.

IBM may not offer the products, services, or features discussed in this document in other countries. Consult your local IBM representative for information on the products and services currently available in your area. Any reference to an IBM product, program, or service is not intended to state or imply that only that IBM product, program, or service may be used. Any functionally equivalent product, program, or service that does not infringe any IBM intellectual property right may be used instead. However, it is the user's responsibility to evaluate and verify the operation of any non-IBM product, program, or service.

IBM may have patents or pending patent applications covering subject matter described in this document. The furnishing of this document does not grant you any license to these patents. You can send license inquiries, in writing, to:

IBM Director of Licensing, IBM Corporation, North Castle Drive, Armonk, NY 10504-1785 U.S.A.

The following paragraph does not apply to the United Kingdom or any other country where such provisions are inconsistent with local law: INTERNATIONAL BUSINESS MACHINES CORPORATION

PROVIDES THIS PUBLICATION "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some states do not allow disclaimer of express or implied warranties in certain transactions, therefore, this statement may not apply to you.

This information could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication. IBM may make improvements and/or changes in the product(s) and/or the program(s) described in this publication at any time without notice.

Any references in this information to non-IBM websites are provided for convenience only and do not in any manner serve as an endorsement of those websites. The materials at those websites are not part of the materials for this IBM product and use of those websites is at your own risk.

IBM may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to you.

Any performance data contained herein was determined in a controlled environment. Therefore, the results obtained in other operating environments may vary significantly. Some measurements may have been made on development-level systems and there is no guarantee that these measurements will be the same on generally available systems. Furthermore, some measurements may have been estimated through extrapolation. Actual results may vary. Users of this document should verify the applicable data for their specific environment.

Information concerning non-IBM products was obtained from the suppliers of those products, their published announcements or other publicly available sources. IBM has not tested those products and cannot confirm the accuracy of performance, compatibility or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products.

This information contains examples of data and reports used in daily business operations. To illustrate them as completely as possible, the examples include the names of individuals, companies, brands, and products. All of these names are fictitious and any similarity to the names and addresses used by an actual business enterprise is entirely coincidental.

This information contains sample application programs in source language, which illustrate programming techniques on various operating platforms. You may copy, modify, and distribute these sample programs in any form without payment to IBM, for the purposes of developing, using, marketing or distributing application programs conforming to the application programming interface for the operating platform for which the sample programs are written. These examples have not been thoroughly tested under all conditions. IBM, therefore, cannot guarantee or imply reliability, serviceability, or function of these programs.

Trademarks

IBM, the IBM logo, and ibm.com are trademarks or registered trademarks of International Business Machines Corporation in the United States, other countries, or both. These and other IBM trademarked terms are marked on their first occurrence in this information with the appropriate symbol (® or ™), indicating US registered or common law trademarks owned by IBM at the time this information was published. Such trademarks may also be registered or common law trademarks in other countries. A current list of IBM trademarks is available on the Web at http://www.ibm.com/legal/copytrade.shtml

The following terms are trademarks of the International Business Machines Corporation in the United States, other countries, or both:

Active Memory™ AIX® BladeCenter® DS8000® Dynamic Infrastructure® Electronic Service Agent™ EnergyScale™ Focal Point™ IBM® IBM Flex System™ IBM Systems Director Active Energy

Manager™ Micro-Partitioning® POWER®

POWER Hypervisor™ Power Systems™ Power Systems Software™ POWER6® POWER6+™ POWER7® POWER7+™ PowerHA® PowerPC® PowerVM® pSeries® PureFlex™ Rational® Rational Team Concert™

Real-time Compression™ Redbooks® Redpaper™ Redpapers™ Redbooks (logo) ® RS/6000® Storwize® System p® System Storage® System x® System z® Tivoli® XIV®

The following terms are trademarks of other companies:

Intel, Intel Xeon, Intel logo, Intel Inside logo, and Intel Centrino logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

ITIL is a registered trademark, and a registered community trademark of The Minister for the Cabinet Office, and is registered in the U.S. Patent and Trademark Office.

Linux is a trademark of Linus Torvalds in the United States, other countries, or both.

LTO, Ultrium, the LTO Logo and the Ultrium logo are trademarks of HP, IBM Corp. and Quantum in the U.S. and other countries.

Microsoft, and the Windows logo are trademarks of Microsoft Corporation in the United States, other countries, or both.

Java, and all Java-based trademarks and logos are trademarks or registered trademarks of Oracle and/or its affiliates.

UNIX is a registered trademark of The Open Group in the United States and other countries.

Other company, product, or service names may be trademarks or service marks of others.

viii IBM Power 720 and 740 Technical Overview and Introduction

Preface

This IBM® Redpaper™ publication is a comprehensive guide covering the IBM Power 720 (8202-E4D) and Power 740 (8205-E6D) servers that support IBM AIX®, IBM i, and Linux operating systems. The goal of this paper is to introduce the innovative Power 720 and Power 740 offerings and their major functions:

򐂰 The IBM POWER7+™ processor is available at frequencies of 3.6 GHz, and 4.2 GHz. 򐂰 The larger IBM POWER7+ Level 3 cache provides greater bandwidth, capacity, and

򐂰 The 4-port 10/100/1000 Base-TX Ethernet PCI Express adapter is included in the base

򐂰 The integrated SAS/SATA controller for HDD, SSD, tape, and DVD supports built-in

򐂰 New IBM PowerVM® V2.2.2 features, such as 20 LPARs per core. 򐂰 The improved IBM Active Memory™ Expansion technology provides more usable memory

򐂰 IBM EnergyScale™ technology provides features such as power trending, power-saving,

򐂰 High-performance SSD drawer.

reliability.

configuration and installed in a PCIe Gen2 x4 slot.

hardware RAID 0, 1, and 10.

than is physically installed in the system.

capping of power, and thermal measurement.

Authors

Professionals who want to acquire a better understanding of IBM Power Systems™ products can benefit from reading this publication. The intended audience includes the following roles:

򐂰 Clients 򐂰 Sales and marketing professionals 򐂰 Technical support professionals 򐂰 IBM Business Partners 򐂰 Independent software vendors

This paper complements the available set of IBM Power Systems documentation by providing a desktop reference that offers a detailed technical description of the Power 720 and Power 740 systems.

This paper does not replace the latest marketing materials and configuration tools. It is intended as an additional source of information that, together with existing sources, can be used to enhance your knowledge of IBM server solutions.

This paper was produced by a team of specialists from around the world working at the International Technical Support Organization, Poughkeepsie Center.

James Cruickshank works on the Power Systems Client Technical Specialist team for IBM in the UK. He holds an Honors degree in Mathematics from the University of Leeds. James has over 11 years of experience working with IBM pSeries®, IBM System p®, and Power Systems products and is a member of the EMEA Power Champions team. James supports customers in the financial services sector in the UK.

Sorin Hanganu is an Accredited Product Services professional. He has eight years of experience working on Power Systems and IBM i products. He is an IBM Certified Solution Expert for IBM Dynamic Infrastructure® and also an IBM Certified Systems Expert for Power Systems, AIX, PowerVM virtualization, ITIL, and ITSM. Sorin works as a System Services Representative for Power Systems in Bucharest, Romania.

Volker Haug is an Open Group Certified IT Specialist within IBM Germany, supporting Power Systems clients and Business Partners as a Client Technical Specialist. He holds a diploma degree in Business Management from the University of Applied Studies in Stuttgart. His career includes more than 25 years of experience with Power Systems, AIX, and PowerVM virtualization; he has written several Power Systems and PowerVM IBM Redbooks® publications. Volker is an IBM POWER7® Champion and a member of the German Technical Expert Council, an affiliate of the IBM Academy of Technology.

Stephen Lutz is a Certified Senior Technical Sales Professional for Power Systems, working for IBM Germany. He holds a degree in Commercial Information Technology from the University of Applied Science Karlsruhe, Germany. He is POWER7 champion and has 14 years experience in AIX, Linux, virtualization, and Power Systems and its predecessors, providing pre-sales technical support to clients, Business Partners, and IBM sales representatives all over Germany. Stephen is also an expert in IBM Systems Director, its plug-ins, and IBM SmartCloud® Entry with a focus on Power Systems and AIX.

John T Schmidt is an Accredited IT Specialist for IBM and has 12 years of experience with IBM and Power Systems. He has a degree in Electrical Engineering from the University of Missouri - Rolla, and an MBA from Washington University in St. Louis. In addition to contributing to eight other Power Systems IBM Redpapers™ publications, in 2010, he completed an assignment with the IBM Corporate Service Corps in Hyderabad, India. He is working in the United States as a pre-sales Field Technical Sales Specialist for Power Systems in Boston, MA.

Marco Vallone is a Certified IT Specialist at IBM, Italy. He joined IBM in 1989, starting in the Power Systems production plant (Santa Palomba) as a Product Engineer, and then worked for the ITS AIX support and delivery service center. For the last eight years of his career, he has worked as IT Solution Architect in the ITS Solution Design Compentence Center of Excellence in Rome, where he mainly designs infrastructure solutions on distributed environments with a special focus on Power System solution.

The project that produced this publication was managed by:

Scott Vetter

Executive Project Manager, PMP

Thanks to the following people for their contributions to this project:

Larry L. Amy, Ron Arroyo, Hsien-I Chang, Carlo Costantini, Kirk Dietzman, Gary Elliott, Michael S. Floyd, James Hermes, Pete Heyrman, John Hilburn, Roberto Huerta de la Torre, Dan Hurlimann, Roxette Johnson, Sabine Jordan, Kevin Kehne, Robert Lowden, Jia Lei Ma, Hilary Melville, Hans Mozes, Thoi Nguyen, Mark Olson, Robb Romans, Pat O’Rourke, Jan Palmer, Velma Pavlasek, Dave Randall, Todd Rosedahl, Edelgard Schittko, Hansjoerg Schneider, Jeff Stuecheli, Madeline Vega IBM

Udo Sachs SVA Germany

Tam ikia B arrow International Technical Support Organization, Poughkeepsie Center

x IBM Power 720 and 740 Technical Overview and Introduction

Now you can become a published author, too!

Here’s an opportunity to spotlight your skills, grow your career, and become a published author—all at the same time! Join an ITSO residency project and help write a book in your area of expertise, while honing your experience using leading-edge technologies. Your efforts will help to increase product acceptance and customer satisfaction, as you expand your network of technical contacts and relationships. Residencies run from two to six weeks in length, and you can participate either in person or as a remote resident working from your home base.

Find out more about the residency program, browse the residency index, and apply online at:

ibm.com/redbooks/residencies.html

Comments welcome

Your comments are important to us!

We want our papers to be as helpful as possible. Send us your comments about this paper or other IBM Redbooks publications in one of the following ways:

򐂰 Use the online Contact us review Redbooks form found at:

ibm.com/redbooks

򐂰 Send your comments in an email to:

redbooks@us.ibm.com

򐂰 Mail your comments to:

IBM Corporation, International Technical Support Organization Dept. HYTD Mail Station P099 2455 South Road Poughkeepsie, NY 12601-5400

Stay connected to IBM Redbooks

򐂰 Find us on Facebook:

http://www.facebook.com/IBMRedbooks

򐂰 Follow us on Twitter:

http://twitter.com/ibmredbooks

򐂰 Look for us on LinkedIn:

http://www.linkedin.com/groups?home=&gid=2130806

򐂰 Explore new Redbooks publications, residencies, and workshops with the IBM Redbooks

weekly newsletter:

https://www.redbooks.ibm.com/Redbooks.nsf/subscribe?OpenForm

򐂰 Stay current on recent Redbooks publications with RSS Feeds:

http://www.redbooks.ibm.com/rss.html

Preface xi

xii IBM Power 720 and 740 Technical Overview and Introduction

Chapter 1. General description

The IBM Power 720 (8202-E4D) and IBM Power 740 (8205-E6D) servers use the latest POWER7+ processor technology that delivers unprecedented performance, scalability, reliability, and manageability for demanding commercial workloads. The Power 720 and Power 740 servers provide enhancements that can be beneficial to customers who run applications that drive high I/O or memory requirements.

Performance, availability, and flexibility of the Power 720 server can enable companies to spend more time running their business by using a proven solution from thousands of ISVs that support the AIX, IBM i, and Linux operating systems. The Power 720 server is a high-performance, energy-efficient, reliable, and secure infrastructure and application server in a dense form factor. As a high-performance infrastructure or application server, the Power 720 contains innovative workload-optimizing technologies that maximize performance based on client computing needs, and Intelligent Energy features that help maximize performance and optimize energy efficiency, resulting in one of the most cost-efficient solutions for UNIX, IBM i, and Linux deployments.

As a distributed application server, the IBM Power 720 offers capabilities to deliver leading-edge application availability and enable more work to be processed with less operational disruption for branch-office and in-store applications. As a consolidation server, PowerVM Editions provide the flexibility to use leading-edge AIX, IBM i, Linux applications and offer comprehensive virtualization technologies to aggregate and manage resources, while helping to simplify and optimize your IT infrastructure and deliver one of the most cost-efficient solutions for UNIX, IBM i, and Linux deployments.

The Power 740 offers the performance, capacity, and configuration flexibility to meet the most demanding growth requirements, and combined with industrial-strength PowerVM virtualization for AIX, IBM i, and Linux, it can fully use the capability of the system. These capabilities can satisfy even the most demanding processing environments and can deliver business advantages and higher client satisfaction.

The Power 740 is designed with innovative workload-optimizing and energy management technologies to help clients get the most out of their systems (that is, running applications rapidly and energy efficiently to conserve energy and reduce infrastructure costs). It is fueled by outstanding performance of the POWER7+ processor, so applications can run faster with fewer processors, resulting in lower per-core software licensing costs.

1.1 Systems overview

You can find detailed information about the Power 720 and Power 740 systems within the following sections.

1.1.1 The Power 720 server

The Power 720 offers a choice of a 4-core, 6-core, or 8-core configuration running at 3.6 GHz, available in a 4U rack-mount or a tower form factor. The POWER7+ processor chip in this server is a 64-bit, 4-core, 6-core, or 8-core module with 10 MB of L3 cache per core and 256 KB of L2 cache per core.

The Power 720 server supports a maximum of 16 DDR3 DIMM slots, with eight DIMM slots included in the base configuration and eight DIMM slots available with an optional memory riser card. A system with the optionally installed memory riser card has a maximum memory of 512 GB.

The Power 720 system includes an integrated SAS controller, offering RAID 0, 1, and 10 support; two storage backplanes are available. The base configuration supports up to six small form factor (SFF) SAS hard-disk drives (HDDs) or solid-state drives (SSDs), an SATA DVD, and a half-high tape drive. A higher-function backplane is available as an option. This supports up to eight SFF SAS HDDs or SSDs, an SATA DVD, a half-high tape drive, Dual 175 MB Write Cache RAID with RAID 5 and 6 support, and an external SAS port.

All HDDs or SSDs are hot-swap and front accessible. If the internal storage capacity is not sufficient, additional disk I/O drawers can be attached to the system unit, providing large storage capacity and multiple partition support.

The Power 720 includes five Peripheral Component Interconnect (PCI) Express (PCIe) Gen2 full-height profile slots for installing adapters in the system. Optionally, an additional riser card with four PCIe Gen2 low-profile (LP) slots can be installed in a GX++ slot available on the backplane. This option extends the number of slots to nine. The system also includes a PCIe x4 Gen2 slot containing a PCIe2 4-Port 10/100/1000 Base-TX Ethernet adapter.

If additional PCIe slots are required, the Power 720 supports external I/O drawers in place of the riser card, allowing for a maximum of two PCIe drawers (feature codes: FC 5802 and FC 5877). This support increases the number of available slots by 20 to 25 PCIe slots in total.

Only the 6-core and 8-core systems support external I/O slots.

Unsupported: The Integrated Virtual Ethernet (IVE) adapter is not available for the Power 720.

The Power 720 also implements Light Path diagnostics, which provides an obvious and intuitive means to positively identify failing components. With Light Path diagnostics, system engineers and administrators can more easily and quickly diagnose hardware problems.

An upgrade is available from an IBM POWER6® processor-based IBM Power 520 server (8203-E4A) to the Power 720 (8202-E4D). A Power 520 (9408-M25) can be converted to a Power 520 (8203-E4A) and then be upgraded to a Power 720 (8202-E4D). You can also directly upgrade from a Power 520 (8203-E4A) to the Power 720 (8202-E4D), preserving the existing serial number.

2 IBM Power 720 and 740 Technical Overview and Introduction

The Capacity Backup (CBU) designation, offered for the Power 720 system, can help meet your requirements for a second system to use for backup, high availability, and disaster recovery. It enables you to temporarily transfer IBM i processor license entitlements and IBM i user license entitlements purchased for a primary machine to a secondary CBU-designated system. Temporarily transferring these resources instead of purchasing them for your secondary system might result in significant savings. Processor activations cannot be transferred.

Figure 1-1 shows the Power 720 rack and tower models.

Figure 1-1 Power 720 rack and tower models

1.1.2 The Power 740 server

The IBM Power 740 server is a 4U rack-mount with two processor sockets that offer 6-core

4.2 GHz, 8-core 3.6 GHz, and 8-core 4.2 GHz processor options. The POWER7+ processor chips in this server are 64-bit, 6-core, and 8-core modules with 10 MB of L3 cache per core and 256 KB of L2 cache per core.

The Power 740 server supports a maximum of 32 DDR3 DIMM slots, with eight DIMM slots included in the base configuration and 24 DIMM slots available with three optional memory riser cards. A system with three optional memory riser cards installed has a maximum memory of 1024 GB.

The Power 740 system includes an integrated SAS controller, offering RAID 0, 1, and 10 support, and two storage backplanes are available. The base configuration supports up to six SFF SAS HDDs or SSDs, an SATA DVD, and a half-high tape drive. A higher-function backplane is available as an option. This option supports up to eight SFF SAS HDDs or SSDs, an SATA DVD, a half-high tape drive, Dual 175 MB Write Cache RAID with RAID 5 and RAID 6 support, and an external SAS port.

Chapter 1. General description 3

The Power 740 includes five PCI Express (PCIe) Gen2 full-height profile slots for installing adapters in the system. Optionally, an additional riser card with four PCIe Gen2 low-profile slots can be installed in a GX++ slot available on the backplane. This option extends the number of slots to nine. The system also includes a PCIe x4 Gen2 slot containing a PCIe 2 or 4-Ports 10/100/1000 Base-TX Ethernet adapter.

If additional slots are required, the Power 740 supports external I/O drawers, allowing for a maximum of four FC 5802 and FC 5877 PCIe drawers. This increases the number of available slots by 40 to 45 PCIe slots in total. Note that the second processor card is necessary to support four I/O drawers. With one processor card, only two I/O drawers can be attached to the system.

Unavailable: The Integrated Virtual Ethernet (IVE) adapter is not available for the Power 740.

The Power 740 also implements Light Path diagnostics, which provides an obvious and intuitive means to positively identify failing components. With Light Path diagnostics, system engineers and administrators can more easily and quickly diagnose hardware problems.

The Capacity Backup (CBU) designation, offered for the Power 740 system, can help meet your requirements for a second system to use for backup, high availability, and disaster recovery. It enables you to temporarily transfer IBM i processor license entitlements and IBM i user license entitlements purchased for a primary machine to a secondary CBU-designated system. Temporarily transferring these resources instead of purchasing them for your secondary system might result in significant savings. Processor activations cannot be transferred.

Figure 1-2 shows the Power 740 rack model.

Figure 1-2 Power 740 rack model

4 IBM Power 720 and 740 Technical Overview and Introduction

1.2 Operating environment

Table 1-1 lists the operating environment specifications for the servers.

Table 1-1 Operating environment for Power 720 and Power 740

Power 720 and Power 740 operating environment

Description Operating Non-operating

Power 720 Power 740 Power 720 Power 740

Temperature 5 - 35 degrees C (41 - 95 degrees F)

Recommended: 18 - 27 degrees C (64 - 80 degrees F)

Relative humidity

Maximum dew point

Operating voltage

Operating frequency

Power consumption

Power source loading

Thermal output 3395 Btu/hour

Maximum altitude

Noise level reference point

8 - 80% 8 - 80%

28 degrees C (84 degrees F) 28 degrees C (84 degrees F)

100 - 127 VAC or 200 - 240 VAC

47 - 63 Hz N/A

995 Watts maximum

1.015 kVa maximum

maximum

3050 m (10,000 ft)

Tower system:

5.6 bels (operating)

5.5 bels (idle) Rack system:

5.6 bels (operating)

5.5 bels (idle)

200 - 240 V AC N/A

1630 Watts maximum

1.664 kVa maximum

5562 Btu/hour maximum

Rack system:

6.0 bels (operating)

5.9 bels (idle)

5 - 45 degrees C (41 to 113 degrees F)

N/A

Note: The maximum measured value is expected from a fully populated server under an intensive workload. The maximum measured value also accounts for component tolerance and operating conditions that are not ideal. Power consumption and heat load vary greatly by server configuration and utilization. Use the IBM Systems Energy Estimator to obtain a heat output estimate based on a specific configuration:

http://www-912.ibm.com/see/EnergyEstimator

Chapter 1. General description 5

1.3 Physical package

The Power 720 is available in both rack-mount and tower form factors. The Power 740 is available in rack-mount form factor only. The major physical attributes for each are discussed in the following sections.

1.3.1 Tower model

The Power 720 can be configured as tower models by selecting the features in Table 1-2.

Table 1-2 Features for selecting tower models

Cover set Power 720 (8202-E4D)

IBM Tower Cover Set FC 7567

OEM Tower Cover Set FC 7568

Table 1-3 shows the physical dimensions of the tower models.

Table 1-3 Physical dimensions of the Power 720 tower chassis

Dimension Power 720 (8202-E4D)

Width without tip plate 183 mm (7.2 in)

Width with tip plate 328.5 mm (12.9 in)

Depth 688 mm (27.1 in)

Height 541 mm (21.3 in)

Weight without tip plate 53.7 kg (118.1 lb)

Weight with tip plate 57.2 kg (125.8 lb)

1.3.2 Rack-mount model

The Power 720 and Power 740 can be configured as 4U (4 EIA) rack-mount models by selecting the features shown in Table 1-4.

Table 1-4 Features for selecting rack-mount models

Cover set Power 720

IBM Rack-mount Drawer Bezel and Hardware FC 7134 FC 7131

OEM Rack-mount Drawer Bezel and Hardware FC 7135 FC 7132

(8202-E4D)

Power 740 (8205-E6D)

6 IBM Power 720 and 740 Technical Overview and Introduction

Table 1-5 shows the physical dimensions of the rack-mount models.

External SAS Port

5 x PCIe x8 Gen2 slots

GX++ Slot 1 (shared with PCIe expansion feature)

System Ports

SPCN Por ts

HMC Por ts

Optional 4 x PCIe x8 Gen2 slots

USB Ports

Slot 2

GX++

4-port

1 Gb

Ethernet

Table 1-5 Physical dimensions of the Power 720 and Power 740 rack-mount chassis

Dimension Power 720 (8202-E4D) Power 740 (8205-E6D)

Width 440 mm (17.3 ) 440 mm (17.3 in)

Depth 610 mm (24.0 in) 610 mm (24.0 in)

Height 173 mm (6.81 in) 173 mm (6.81 in)

Weight 48.7 kg (107.4 lb) 48.7 kg (107.4 lb)

Figure 1-3 shows the rear view of a Power 740 with the optional PCIe expansion.

Figure 1-3 Rear view of a rack-mount Power 740 server

1.4 System features

The system chassis contains one processor module (Power 720) or up to two processor modules (Power 740). Each POWER7+ processor module is either 4-core, 6-core, or 8-core for the Power 720, and 6-core or 8-core for the Power 740. Each of the POWER7+ processor chips in the server has a 64-bit architecture, up to 2 MB of L2 cache (256 KB per core) and up to 80 MB of L3 cache (10 MB per core).

Chapter 1. General description 7

1.4.1 Power 720 system features

The standard features are as follows:

򐂰 Tower or rack-mount (4U) chassis 򐂰 Configuration of 4-core, 6-core, or 8-core, with one 3.6 GHz processor module 򐂰 Up to 512 GB of 1066 MHz DDR3 ECC memory 򐂰 An integrated SAS controller, offering RAID 0, 1, and 10 support 򐂰 Choice of two disk/media backplanes:

– Six 2.5-inch HDD/SSD/Media backplane with one tape drive bay and one DVD bay – Eight 2.5-inch HDD/SSD/Media backplane with one tape drive bay, one DVD bay, Dual

175 MB Write Cache RAID with RAID 5 and 6 support, and one external SAS port

򐂰 A PCIe x4 Gen2 slot containing PCIe2 4-Port 10/100/1000 Base-TX Ethernet adapter 򐂰 A maximum of nine PCIe Gen2 slots:

– Five PCIe x8 full-height short card slots – Optional four PCIe x8 low-profile short card slots

򐂰 One GX++ slot 򐂰 Integrated:

– Service processor – EnergyScale technology – Hot-swap and redundant cooling – Three USB ports and two system ports – Two HMC ports and two SPCN ports

򐂰 Optional redundant, 1925 Watt AC hot-swap power supplies

1.4.2 Power 740 system features

The standard features are as follows:

򐂰 Tower (4U) chassis 򐂰 Processors:

– Configuration of 6-core or 12-core, with one or two 4.2 GHz 6-core processor modules – Configuration of 8-core or 16-core, with one or two 8-core processor modules that are

running at 3.6 GHz or 4.2 GHz.

򐂰 Up to 1024 GB of 1066 MHz DDR3 ECC memory 򐂰 An integrated SAS controller, offering RAID 0, 1, and 10 support 򐂰 Choice of two disk/media backplanes:

– Six 2.5-inch HDD/SSD/Media backplanes with one tape drive bay and one DVD bay – Eight 2.5-inch HDD/SSD/Media backplanes with one tape drive bay, one DVD bay,

Dual 175 MB Write Cache RAID with RAID 5 and 6 support, and one external SAS port

򐂰 A PCIe x4 Gen2 slot containing a PCIe2 4-Port 10/100/1000 Base-TX Ethernet adapter 򐂰 A maximum of nine PCIe Gen2 slots:

– Five PCIe x8 full-height short card slots – Optional four PCIe x8 low-profile short card slots

8 IBM Power 720 and 740 Technical Overview and Introduction

򐂰 Two GX++ slots 򐂰 Integrated:

– Service processor – EnergyScale technology – Hot-swap and redundant cooling – Three USB ports and two system ports – Two HMC ports and two SPCN ports

򐂰 Redundant, 1925 watt AC hot-swap power supplies

1.4.3 Minimum features

Each system has a minimum feature set to be valid.

The minimum initial order must include a processor, processor activations, memory, a power supply, a power cord (two power supplies and two power cords for the Power 740), one HDD/SSD, a storage backplane, an operating system indicator, a cover set indicator and a Language Group Specify.

If IBM i is the primary operating system (FC 2145), the initial order must also include one additional HDD/SSD, a Mirrored System Disk Level Specify Code, and a System Console on HMC Indicator. A DVD-RAM on every order is installed by default but may be deselected.

Note: No internal HDD or SSD is required if FC 0837 (Boot from SAN) is selected. A Fibre Channel or Fibre Channel over Ethernet (FCoE) adapter must be ordered if FC 0837 is selected.

1.4.4 Power supply features

One 1925 watt AC power supply (FC 5532) is required for the Power 720. A second power supply is optional. Two 1925 Watt A/C power supplies are required for the Power 740. The second power supply provides redundant power for enhanced system availability. To provide full redundancy, the two power supplies must be connected to separate power distribution units (PDUs).

The server continues to function with one working power supply. A failed power supply can be hot-swapped but must remain in the system until the replacement power supply is available for exchange.

1.4.5 Processor module features

Each processor module in the system houses a single POWER7+ processor chip. The processor is either 4-core (Power 720 only), 6-core, or 8-core. The Power 720 supports one processor module. The Power 740 supports a second processor module that must be identical to the first.

The number of processor activation code features must be equal to the number of installed processor cores.

Chapter 1. General description 9

Table 1-6 lists the available processor features for the Power 720.

Table 1-6 Processor features for the Power 720

Feature code Processor module description

EPCK 4-core 3.6 GHz POWER7+ processor module

EPCL (CCIN 54B0) 6-core 3.6 GHz POWER7+ processor module

EPCM 8-core 3.6 GHz POWER7+ processor module

The Power 740 requires that one or two processor modules be installed. If two processor modules are installed, they must be identical. Table 1-7 lists the available processor features.

Table 1-7 Processor features for the Power 740

Feature code Processor module description

EPCP 6-core 4.2 GHz POWER7+ processor module

EPCQ 8-core 3.6 GHz POWER7+ processor module

EPCR 8-core 4.2 GHz POWER7+ processor module

1.4.6 Memory features

In POWER7+ processor-based systems, DDR3 memory is used for throughout. The POWER7+ DDR3 memory uses a memory architecture to provide greater bandwidth and capacity. This enables operating at a higher data rate for larger memory configurations.

Memory in the Power 720 and 740 systems is installed into memory riser cards. One memory riser card is included in the base system. The base memory riser card is not listed as a feature code in the configurator. Additional memory riser cards, feature FC EM01, can be installed up to a maximum of two per processor module. Each memory riser card provides eight DDR3 DIMM slots. DIMMs are available in capacities of 4 GB, 8 GB, 16 GB, and 32 GB at 1066 MHz and are installed in pairs.

Table 1-8 lists available memory features on the systems.

Table 1-8 Summary of memory features

Feature code Feature capacity Access rate DIMMs

EM08 8GB 1066MHz 2x4GB DIMMs

EM4B (CCIN 31FA) 16GB 1066MHz 2x8GB DIMMs

EM4C

EM4D

a. A Power 720 system with 4-core processor module feature FC EPCK cannot be ordered with

the 32 GB memory feature FC EM4C or 64 GB memory feature FC EM4D.

32 GB 1066 MHz 2 x 16 GB DIMMs

64 GB 1066 MHz 2 x 32 GB DIMMs

For performance optimization, install memory evenly across all memory riser cards in the system. Balancing memory across the installed memory riser cards allows memory access in a consistent manner and typically results in the best possible performance for your configuration. However, balancing memory fairly evenly across multiple memory riser cards, compared to balancing memory exactly evenly typically has a small difference in performance.

10 IBM Power 720 and 740 Technical Overview and Introduction

1.5 Disk and media features

The Power 720 and Power 740 systems feature an integrated SAS controller, offering RAID 0, 1, and 10 support with two storage backplane options:

򐂰 The FC 5618 option supports up to six SFF SAS HDDs or SSDs, a SATA DVD, and a

half-high tape drive for either a tape drive or USB removable disk. This feature does not provide RAID 5, RAID 6, a write cache, or an external SAS port. Split backplane functionality (3x3) is supported with the additional FC EJ02.

Remember:

򐂰 No additional PCIe SAS adapter is required for split-backplane functionality. 򐂰 FC 5618 is not supported with IBM i.

򐂰 The FC EJ01 option is a higher-function backplane that supports up to eight SFF SAS

HDDs or SSDs, a SATA DVD, a half-high tape drive for either a tape drive or USB removable disk, Dual 175 MB Write Cache RAID, and one external SAS port. The FC EJ01 supports RAID 5 and RAID 6; no split backplane is available for this feature.

All HDDs/SSDs are hot-swap and front accessible.

Table 1-9 shows the available storage configurations for the Power 720 and Power 740.

Table 1-9 Available storage configurations for Power 720 and Power 740

Feature code Split

backplane

JBOD RAID 0, 1,

and 10

RAID 5 and 6External

SAS port

5618 No Yes Yes No No

5618 and EJ02 Yes Yes Yes No No

EJ01 No No Yes Yes Yes

Table 1-10 shows the available disk drive feature codes for the installation a Power 720 and Power 740 server.

Table 1-10 Disk drive feature code description

Feature code Description OS support

1917 146 GB 15K RPM SAS SFF-2 Disk Drive AIX, Linux

1886 146 GB 15K RPM SFF SAS Disk Drive AIX, Linux

1775 177 GB SFF-1 SSD with eMLC AIX, Linux

1793 177 GB SFF-2 SSD with eMLC AIX, Linux

1995 177 GB SSD Module with eMLC AIX, Linux

1925 300 GB 10K RPM SAS SFF-2 Disk Drive AIX, Linux

1953 300 GB 10K RPM SAS SFF-2 Disk Drive AIX, Linux

1885 300 GB 10K RPM SFF SAS Disk Drive AIX, Linux

1880 300 GB 15K RPM SFF SAS Disk Drive AIX, Linux

ES0A 387 GB SFF-1 SSD with eMLC AIX, Linux

ES0C 387 GB SFF-2 SSD eMLC AIX, Linux

Chapter 1. General description 11

Feature code Description OS support

1790 600 GB 10K RPM SAS SFF Disk Drive AIX, Linux

1964 600 GB 10K RPM SAS SFF-2 Disk Drive AIX, Linux

1790 600 GB 10K RPM SAS SFF Disk Drive AIX, Linux

1751 900 GB 10K RPM SAS SFF Disk Drive AIX, Linux

1752 900 GB 10K RPM SAS SFF-2 Disk Drive AIX, Linux

1888 139.5 GB 15K RPM SFF SAS Disk Drive IBM i

1947 139 GB 15K RPM SAS SFF-2 Disk Drive IBM i

1787 177 GB SFF-1 SSD with eMLC IBM i

1794 177 GB SFF-2 SSD with eMLC IBM i

1996 177 GB SSD Module with eMLC IBM i

1956 283 GB 10K RPM SAS SFF-2 Disk Drive IBM i

1911 283 GB 10K RPM SFF SAS Disk Drive IBM i

1879 283 GB 15K RPM SAS SFF Disk Drive IBM i

1948 283 GB 15K RPM SAS SFF-2 Disk Drive IBM i

ES0B 387 GB SFF-1 SSD eMLC IBM i

ES0D 387 GB SFF-2 SSD eMLC IBM i

1916 571 GB 10K RPM SAS SFF Disk Drive IBM i

1962 571 GB 10K RPM SAS SFF-2 Disk Drive IBM i

1909 69 GB SFF SAS SSD IBM i

1737 856 GB 10K RPM SAS SFF Disk Drive IBM i

1738 856 GB 10K RPM SAS SFF-2 Disk Drive IBM i

Table 1-11 shows the available disk drive feature codes for the installation in an I/O enclosure external to a Power 720 and Power 740 server.

Table 1-11 Disk drive used in I/O drawer feature code description

Feature code Description OS support

3586 69 GB 3.5" SAS SSD AIX, Linux

3647 146 GB 15K RPM SAS Disk Drive AIX, Linux

3648 300 GB 15K RPM SAS Disk Drive AIX, Linux

3649 450 GB 15K RPM SAS Disk Drive AIX, Linux

3587 69 GB 3.5" SAS SSD IBM i

3677 139.5 GB 15K RPM SAS Disk Drive IBM i

3678 283.7 GB 15K RPM SAS Disk Drive IBM i

3658 428 GB 15K RPM SAS Disk Drive IBM i

12 IBM Power 720 and 740 Technical Overview and Introduction

Certain adapters are available for order in large quantities. Table 1-12 lists the Gen2 disk drives in a quantity of 150.

Table 1-12 Available disk drives in quantity of 150

Feature code Description

1817 Quantity 150 of FC 1962 (571 GB 10K RPM SAS SFF-2 Disk Drive)

1818 Quantity 150 of FC 1964 (600 GB 10K RPM SAS SFF-2 Disk Drive)

1844 Quantity 150 of FC 1956 (283 GB 10K RPM SAS SFF-2 Disk Drive)

1866 Quantity 150 of FC 1917 (146 GB 15K RPM SAS SFF-2 Disk Drive)

1868 Quantity 150 of FC 1947 (139 GB 15K RPM SAS SFF-2 Disk Drive)

1869 Quantity 150 of FC 1925 (300 GB 10K RPM SAS SFF-2 Disk Drive)

1887 Quantity 150 of FC 1793 (177 GB SFF-2 SSD with eMLC)

1927 Quantity 150 of FC 1948 (283 GB 15K RPM SAS SFF-2 Disk Drive)

1929 Quantity 150 of FC 1953 (300 GB 10K RPM SAS SFF-2 Disk Drive)

1958 Quantity 150 of FC 1794 (177 GB SFF-2 SSD with eMLC)

EQ0C Quantity 150 of FC ES0C (387 GB SAS SFF-2 SSD)

EQ0D Quantity 150 of FC ES0D (387 GB SAS SFF-2 SSD)

EQ38 Quantity 150 of FC 1738 (856 GB SFF-2 disk)

EQ52 Quantity 150 of FC 1752 (900 GB SFF-2 disk)

Chapter 1. General description 13

Additional considerations for SAS-bay-based SSDs (FC 1775, FC 1787, FC 1793, FC 1794, FC 1890, FC 1909, FC 3586, and FC 3587):

򐂰 SFF features FC ES0A, FC ES0B, FC 1775, FC 1787, FC 1793, FC 1794, FC 1890,

and FC 1909 are supported in the Power 720 and Power 740 system unit.

򐂰 The 3.5-inch feature codes FC 3586 and FC 3587 are not supported in the Power 720

and Power 740 system unit.

򐂰 SSDs and HDDs are not allowed to mirror each other. 򐂰 SSDs are not supported by feature codes FC 5278, FC 5900, FC 5901, FC 5902, and

FC 5912.

򐂰 When an SSD is placed in higher-function backplane (FC EJ01), no EXP12S

Expansion Drawer (FC 5886) or EXP24S SFF Gen2-bay Drawer (FC 5887) is supported to connect to the external SAS port of the system.

򐂰 When an SSD is placed in a EXP12S Expansion Drawer (FC 5886) or EXP24S SFF

Gen2-bay Drawer (FC 5887), the drawer is not allowed to connect to external SAS port of the system.

򐂰 A maximum of eight SSDs per EXP12S Expansion Drawer (FC 5886) is allowed. No

mixing of SSDs and HDDs is allowed in the EXP12S Expansion Drawer (FC 5886). A maximum of one FC 5886 EXP12S drawer containing SSDs that are attached to a single controller or pair of controllers is allowed. A EXP12S Expansion Drawer (FC 5886) containing SSD drives cannot be connected to other FC 5886s. An FC 5886 that contains SSD drives cannot be attached to the external SAS port on the Power 720 or Power 740.

򐂰 In a Power 720 or Power 740 with a split backplane (3 x 3), SSDs and HDDs can be

placed in either “split,” but no mixing of SSDs and HDDs within a split is allowed. IBM i does not support split backplane.

򐂰 In a Power 720 or Power 740 without a split backplane, SSDs and HDDs may be mixed

in any combination. However, they cannot be in the same RAID array.

򐂰 HDD/SSD Data Protection: If IBM i (FC 2145) is selected, one of the following items is

required:

– Disk mirroring (default), which requires feature code FC 0040, FC 0043, or FC 0308 – SAN boot (FC 0837) – RAID, which requires feature code FC 5630 – Mixed Data Protection (FC 0296)

If you need more disks than are available with the internal disk bays, you can attach additional external disk subsystems.

SCSI disks are not supported in the Power 720 and Power 740 disk bays. However, if you want to use SCSI disks, you can attach existing SCSI disk subsystems.

For more detailed information about the available external disk subsystems, see 2.9, “External I/O subsystems” on page 79.

The Power 720 and Power 740 have a slim media bay that can contain an optional DVD-RAM (FC 5762) and a half-high bay that can contain a tape drive or removable disk drive.

14 IBM Power 720 and 740 Technical Overview and Introduction

Table 1-13 lists the available media device feature codes for Power 720 and 740.

Table 1-13 Media device feature code description for Power 720 and 740

Feature code Description

1103 USB Internal Docking Station for Removable Disk Drive

1104 USB External Docking Station for Removable Disk Drive

5619 80/160 GB DAT160 Tape-SAS

5638 1.5 TB/3.0 TB LTO-5 Tape-SAS

5746 800 GB/1.6 TB LTO4 Tape-SAS

5762 SATA Slimline DVD-RAM Drive

Additional considerations for tape drives and USB disk drives: 򐂰 If tape device FC 5619, FC 5638, or FC 5746 is installed in the half-high media bay,

FC 3656 must be also selected.

򐂰 A half-high tape feature and a FC 1103 Removable USB Disk Drive Docking Station are

mutually exclusive. One or the other can be in the half-high bay in the system but not both. As for the tape drive, the FC 3656 is not required with FC 1103.

1.6 I/O drawers for Power 720 and Power 740 servers

The Power 720 and Power 740 servers support the following 12X attached I/O drawers, providing extensive capability to expand the overall server capacity and connectivity:

򐂰 The 12X I/O PCIe Drawer, SFF disk (FC 5802) provides 10 PCIe slots and 18 SFF SAS

disk slots.

򐂰 The 12X I/O PCIe Drawer, no disk (FC 5877) provides 10 PCIe slots. 򐂰 The PCI-X DDR 12X Expansion Drawer (FC 5796) provides six PCI-X slots (supported but

not orderable).

򐂰 The 7314-G30 drawer provides six PCI-X slots (supported but not orderable).

Three disk-only I/O drawers are also supported, providing large storage capacity and multiple partition support:

򐂰 The EXP30 Ultra SSD I/O Drawer (FC EDR1) holds up to 30 SSD drives. 򐂰 The EXP24S SFF Gen2-bay drawer (FC 5887) holds SAS hard disk drives. 򐂰 The EXP12S SAS drawer (FC 5886) holds a 3.5-inch SAS disk or SSD. 򐂰 The 7031-D24 holds a 3.5-inch SCSI disk (supported but not orderable).

The Power 720 provides one GX++ slot, offering one connection loop. The Power 740 has one GX++ slot if one processor module is installed, and two GX++ slots when two processor modules are installed. Therefore, the Power 740 provides one or two connection loops.

Chapter 1. General description 15

1.6.1 12X I/O Drawer PCIe expansion units

The 12X I/O Drawer PCIe, SFF disk (FC 5802) and 12X I/O Drawer PCIe, no disk (FC 5877) expansion units are 19-inch, rack-mountable, I/O expansion drawers that are designed to be attached to the system using 12x double date rate (DDR) cables. The expansion units can accommodate 10 generation 3 blind swap cassettes. These cassettes can be installed and removed without removing the drawer from the rack.

Figure 1-4 shows the front view of the FC 5802 12X I/O drawer.

Figure 1-4 The front view of the FC 5802 I/O drawer

The FC 5802 I/O drawer has the following attributes:

򐂰 Eighteen SAS hot-swap SFF disk bays 򐂰 Ten PCIe based I/O adapter slots (blind swap) 򐂰 Redundant hot-swappable power and cooling units

The FC 5877 drawer is the same as FC 5802 except that it does not support any disk bays.

A maximum of two FC 5802 or FC 5877 drawers can be placed on the same 12X loop. The FC 5877 I/O drawer can be on the same loop as the FC 5802 I/O drawer. A FC 5877 drawer cannot be upgraded to a FC 5802 drawer.

Note: Mixing FC 5802 or FC 5877 and FC 5796 on the same loop is not supported. Mixing FC 5802 and FC 5877 on the same loop is supported with a total maximum of two drawers per loop.

1.6.2 PCI-X DDR 12X Expansion Drawer

The PCI-X DDR 12X Expansion Drawer (FC 5796) and 7314-G30 are a 4-EIA unit tall drawer and mounts in a 19-inch rack. FC 5796 takes up half the width of the 4 EIA rack space and requires the use of a FC 7314 drawer mounting enclosure. The 4-EIA tall enclosure can hold up to two FC 5796 drawers mounted side by side in the enclosure. A maximum of four FC 5796 drawers can be placed on the same 12X loop.

16 IBM Power 720 and 740 Technical Overview and Introduction

+ 176 hidden pages

IBM Power 720, Power 740 Overview

Specifications and Main Features

Frequently Asked Questions

User Manual