POWER7
Technology Insight
Wayne Huang
Fang Shu Xin
IBM CONFIDENTIAL – FOR IBM AND BP USE ONLY – NOT FOR DISCLOSURE TO CUSTOMERS
© 2010 IBM Corporation
IBM Power Systems
Agenda….
POWER7 Product Family
POWER7 Processor
Active Memory Expansion
POWER7 TPMD
OS Support on POWER7
POWER7 Servers
Power 750
Power 755
Power 770
Power 780
RAS Update
I/O Update
Summary
Power your planet
© 2010 IBM Corporation
IBM Power Systems
0
100
200
300
400
500
600
700
JS23 JS43 520 550 750 560 570/16 570/32 770 780 595
POWER7 System Highlights
Balance System Design
Cache, Memory, and IO
POWER7 Processor Technology
6 thImplementation of multi-core design
On chip L2 & L3 caches
POWER7 System Architecture
Blades to High End offerings
Enhances memory implementation
PCIe, SAS / SATA
Built in Virtualizatio n
Memory Expansion
VM Control
Green Technologies
Processor Nap & Sleep Mode
Memory Power Down support
Aggressive Power Save / Capping Modes
Availability
Processor Instruction Retry
Alternate Process Recovery
Concurrent Add & Services
Power your planet
© 2010 IBM Corporation
IBM Power Systems
Power 2010 全新产品线
全新发布的Power7 产品 线
Pow er 750 (8, 16,32 C ore)
Pow er 755 ( 32 C or e) for HPC
Pow er 770 (12, 24,36,48 C ore)
Pow er 780 (16, 32,48,64 C ore)
POWER6 产品 线2010 年 继续支持
Pow er 520, Bl ades
Pow er 550
Pow er 560
Pow er 570
Pow er 575
Pow er 595
Power 750
Power 770
Power 755
Power 780
Power 7 Systems
Power 6 Systems
Power 520
Power Blades
Power your planet
Power 595
Power 570
Power 575
Power 560
Power 550
© 2010 IBM Corporation
IBM Power Systems
POWER7 Processor
POWER7
Pushing the
Limits
Power your planet
© 2010 IBM Corporation
IBM Power Systems
Challenge: Beating Physics to Realize Multi-core Potential
Need to Amplify Effective
Socket Throughput
to Close Gap and
Achieve Potential
Compute Throughput Potential
Socket Throughput Limitation
Power your p lanet
(Physical signal economics)
© 2010 IBM Corporation
IBM Power Systems
Single Image Virtualized/Cloud
Trends in Server Evolution
Emerging Entry Server
Virtualiz ed/Cloud Platform
- A simple matter of riding
the multi-core trend?
- Ad d more core s to the die,
Enabled by:
8-core
8-core
- Technology
- Innovation
Driven by:
8-core
8-core
- IT Evolution
- Economics
Time
Traditi onal Entry Server
Single Image Platform
16 to 32-way SMP Server
2 to 4 socket
Traditional High-End Server
Virtualiz ed Consolidation Platform
beef up some interfaces,
and scale to a large SMP?
2-core 2-core
2-core 2-core
2 to 4 socket
4 to 8-way SMP Server
Powe r y our pl a ne t
8 to 32 socket
16 to 64-way SMP Server
* Statements regarding SMP servers
do not imply that IBM will introduce
a system with this capability.
© 2010 IBM Corporation
IBM Power Systems
Single Image Virtualized/Cloud
Trends in Server Evolution
Emerging Entry Server
Virtualiz ed/Cloud Platform
- A simple matter of riding
the multi-core trend?
- Ad d more core s to the die,
Enabled by:
- Technology
- Innovation
8-core
8-core
beef up some interfaces,
and scale to a large SMP?
Not so simple:
Driven by:
8-core
- IT Evolution
- Economics
Time
Traditi onal Entry Server
Single Image Platform
16 to 32-way SMP Ser v er
2 to 4 socket
8 - co re
- Emerging entry servers
have characteristics similar
to traditional high-end
large SMP servers
Traditional Hig h - End Server
Virtualiz ed Conso l i d ation Platform
Achieving solid virtual
machine performance
2-core 2-core
requires a Balanced
2-core 2-core
2 to 4 socket
4 to 8-way SMP Server
Powe r y our pl a ne t
8 to 32 socket
16 to 64-way SMP Server
System Structure.
* Statements regarding SMP servers
do not imply that IBM will introduce
a system with this capability.
© 2010 IBM Corporation
IBM Power Systems
Single Image Virtualized/Cloud UltraScale Cloud
Trends in Server Evolution
Enabled by:
Emerging Entry Server
Virtualiz ed/Cloud Platform
8-core
8-core
Emerging High-End Server
UltraScale Cloud Platform
- Technology
- Innovation
Driven by:
8-core
8-core
- IT Evolution
- Economics
Time
Traditi onal Entry Server
Single Image Platform
16 to 32-way SMP Server
2 to 4 socket
Traditional High-End Server
Virtualiz ed Consolidation Platform
8 to 32 socket
64 to 256-way SMP Server
Same enablers and
driving factors apply
at larger scale
2-core 2-core
2-core 2-core
2 to 4 socket
4 to 8-way SMP Server
Powe r y our pl a ne t
8 to 32 socket
16 to 64-way SMP Server
* Statements regarding SMP servers
do not imply that IBM will introduce
a system with this capability.
© 2010 IBM Corporation
IBM Power Systems
Challenge: How does POWER7 mai ntain the Bal ance?
Need to Amplify Effective
Socket Throughput
to Close Gap and
Achieve Potential
Compute Throughput Potential
Cache Hierarchy Technology
and Innovation
Socket Throughput Limitation
Power your p lanet
(Physical signal economics)
© 2010 IBM Corporation
IBM Power Systems
Challenge: How does POWER7 mai ntain the Bal ance?
Need to Amplify Effective
Socket Throughput
to Close Gap and
Achieve Potential
Compute Throughput Potential
Advances in Memory Subsystem
Cache Hierarchy Technology
and Innovation
Socket Throughput Limitation
Power your p lanet
(Physical signal economics)
© 2010 IBM Corporation
IBM Power Systems
Challenge: How does POWER7 mai ntain the Bal ance?
Need to Amplify Effective
Socket Throughput
to Close Gap and
Achieve Potential
Compute Throughput Potential
Advances in Off-Chip Signaling
Technology
Advances in Memory Subsystem
Cache Hierarchy Technology
and Innovation
Socket Throughput Limitation
Power your p lanet
(Physical signal economics)
© 2010 IBM Corporation
IBM Power Systems
Challenge: How does POWER7 mai ntain the Bal ance?
Need to Amplify Effective
Socket Throughput
to Close Gap and
Achieve Potential
Compute Throughput Potential
Exploit Long Ter m Investmen t
in Coherence Innovation
Advances in Off-Chip Signaling
Technology
Advances in Memory Subsystem
Cache Hierarchy Technology
and Innovation
Socket Throughput Limitation
Power your p lanet
(Physical signal economics)
© 2010 IBM Corporation
IBM Power Systems
POWER7 Processor
POWER7
Processor
Power your planet
© 2010 IBM Corporation
IBM Power Systems
20+ Years of POWER Processors
45nm
1.0um
POWER1
-AMERICA’s
Muskie A35
-Cobra A10
-64 bit
.72um
RSC
RS64IV Sstar
RS64III Pulsar
RS64II North Star
RS64I Apache
BiCMOS
.5um
.35um
POWER2
P2SC
.6um
-601
.5um
.35um
TM
-603
.5um
.35um
.25um
604e
.25um
.22um
POWER3
-630
.18um
TM
180nm
POWER4
-Dual Core
TM
65nm
130nm
TM
POWER5
-SMT
POWER6
-Ultra High Frequency
TM
Major POWER® Innovation
-1990 RISC Architecture
-1994 SMP
-1995 Out of Order Execution
-1996 64 Bit Enterprise Architecture
-1997 Hardware Multi-Threading
-2001 Dual Core Processors
-2001 Large System Scaling
-2001 Shared Caches
-2003 On Chip Memory Control
-2003 SMT
-2006 Ultra High Frequency
-2006 Dual Scope Coherence Mgmt
-2006 Decimal Float/VSX
-2006 Processor Recovery/Sparing
-2009 Balanced Multi-core Pr ocesso r
-2009 On Chip EDRAM
Next Gen.
POWER7
-Multi-core
1990 1995 2000 2005 2010
Power your planet
* Dates represent approximate proc essor power-on dates, not sys tem availability
© 2010 IBM Corporation
IBM Power Systems
IBM risc processors have many innovations..
pSeries p640,
64bit
P2,P3,P4
64bit
32bit
RS64
Apache
125
Power3
200+
RS64-II
Northstar
262.5
604e
332 / 375
1998
RS64-II
Northstar
340
1999 2000
p610
Power3-II
333 / 375 / 450
RS64-III
Pulsar
450
pSeries p620, p660, & p680
POWER4
1.1+GHz
RS64-IV
Sstar
600+ / 750
2001
POWER4
1.5GHz
Regatta
7450
800MHz/1.0GHz
2002
POWER4
1.8GHz
2003
Copper =
Power your planet
& SOI =
& low-k =
Σ
© 2010 IBM Corporation
IBM Power Systems
Processor Technology Roadmap
POWER6
65 nm
POWER5
130 nm
POWER4
180 nm
POWER8
POWER7
45 nm
Dual Core
Chip Multi Processing
Distributed Switch
Shared L2
Dynamic LPARs (32)
2001
Power your planet
Dual Core
Enhanced Scaling
SMT
Distributed Switch +
Core Parallelism +
FP Performance +
Memory bandwidth +
Virtualization
2004
Dual Core
High Frequencies
Virtualization +
Memory Subsystem +
Altivec
Instruction Retry
Dyn Energy Mgmt
SMT +
Protection Keys
2007
Multi Core
On-Chip eDRAM
Power Optimized Cores
Mem Subsystem ++
SMT++
Reliability +
VSM & VSX (AltiVec)
Protection Keys+
2010
Concept Phase
© 2010 IBM Corporation
IBM Power Systems
Processor Designs contrast: 0.278nm H2O
POWER5 POWER5+ POWER6 POWER7
Technology 130 nm 90 nm 60 nm 45 nm
Size 389 mm
2
245 mm
2
341 mm
2
567 mm
Transistors 276 M 276 M 790 M 1.2 B
Cores 2 2 2 4 / 6 / 8
Frequencies 1.65 GHz 1.9 GHz 3-5 GHz 3-4 GHz
L2 Cache 1.9 MB Shared 1.9 MB Shared 4 MB / Core 256 KB / Core
L3 Cache 36 MB 36 MB 32 MB 4 MB / Core
Memory Cntrl 1 1 2 / 1 2
LPAR 10 / Core 10 / Core 10 / Core 10 / Core
Power your planet
© 2010 IBM Corporation
2
IBM Power Systems
POWER6 / POWER7
POWER6
M
E
M
O
R
Y
L3
Mem
Ctrl
Alti
Vec
L3
Dir
SMT
Core
4MB
SMT
Core
4MB
L2
Bus Fabric Controller
GX Bus Cntrl
GX+ Bridge
Chip
to Chip
L2
to Chip
Alti
Vec
Chip
L3
Dir
Mem
Ctrl
L3
M
E
M
O
R
Y
Power your planet
© 2010 IBM Corporation
IBM Power Systems
POWER6 / POWER7
POWER7
PO W ER 6
M
L3
E
M
O
R
Y
Power your planet
Mem
Ctrl
Alti
Vec
SMT
Core
SMT
Core
Alti
Vec
L3 Cache
L3
Dir
4MB
L2
Bus Fabric Controller
GX Bus Cntrl
GX+ Bridge
Chip
to Chip
eDRAM (Embedded D y namic RAM )
L3 — 6:1 latency improvement (vs. external L3) and 2x BW improvements
Capacitor vs transister
1/3 space (vs 6Trn SRAM cell), 1/5 standby power of standard SRAM
Soft error rated 250x lower than SRAM
Savings of ~ 1.5B transistors over other RAM
4MB
L2
Chip
to Chip
L3
Dir
Mem
Ctrl
L3
M
E
M
O
R
Y
© 2010 IBM Corporation