IBM POWER7 User Manual

POWER7
Technology Insight
Wayne Huang
Fang Shu Xin
IBM CONFIDENTIAL – FOR IBM AND BP USE ONLY – NOT FOR DISCLOSURE TO CUSTOMERS
© 2010 IBM Corporation
IBM Power Systems

Agenda….

POWER7 Product Family POWER7 Processor Active Memory Expansion POWER7 TPMD OS Support on POWER7 POWER7 Servers
Power 750Power 755Power 770Power 780
RAS Update I/O Update Summary
© 2010 IBM Corporation
IBM Power Systems
0
100
200
300
400
500
600
700
JS23 JS43 520 550 750 560 570/16 570/32 770 780 595

POWER7 System Highlights

Balance System Design
Cache, Memory, and IO
POWER7 Processor Technology
6thImplementation of multi-core design  On chip L2 & L3 caches
POWER7 System Architecture
Blades to High End offeringsEnhances memory implementationPCIe, SAS / SATA
Built in Virtualizatio n
Memory ExpansionVM Control
Green Technologies
Processor Nap & Sleep ModeMemory Power Down supportAggressive Power Save / Capping Modes
Availability
Processor Instruction RetryAlternate Process RecoveryConcurrent Add & Services
© 2010 IBM Corporation
IBM Power Systems
Power 2010 全新产品线
全新布的Power7线
Pow er 750 (8, 16,32 C ore)Pow er 755 ( 32 C or e) for HPCPow er 770 (12, 24,36,48 C ore)Pow er 780 (16, 32,48,64 C ore)
POWER6线2010继续支持
Pow er 520, Bl adesPow er 550Pow er 560Pow er 570Pow er 575Pow er 595
Power 750
Power 770
Power 755
Power 780
Power 7 Systems
Power 6 Systems
Power 520
Power Blades
Power 595
Power 570
Power 575
Power 560
Power 550
© 2010 IBM Corporation
IBM Power Systems

POWER7 Processor

POWER7
Pushing the
Limits
© 2010 IBM Corporation
IBM Power Systems
Challenge: Beating Physics to Realize Multi-core Potential
Need to Amplify Effective
Socket Throughput
to Close Gap and
Achieve Potential
Compute Throughput Potential
Socket Throughput Limitation
(Physical signal economics)
© 2010 IBM Corporation
IBM Power Systems
Single Image Virtualized/Cloud
Trends in Server Evolution
Emerging Entry Server
Virtualiz ed/Cloud Platform
- A simple matter of riding the multi-core trend?
- Ad d more core s to the die,
Enabled by:
8-core
8-core
- Technology
- Innovation
Driven by:
8-core
8-core
- IT Evolution
- Economics
Time
Traditi onal Entry Server
Single Image Platform
16 to 32-way SMP Server
2 to 4 socket
Traditional High-End Server
Virtualiz ed Consolidation Platform
beef up some interfaces, and scale to a large SMP?
2-core 2-core
2-core 2-core
2 to 4 socket
4 to 8-way SMP Server
8 to 32 socket
16 to 64-way SMP Server
* Statements regarding SMP servers
do not imply that IBM will introduce a system with this capability.
© 2010 IBM Corporation
IBM Power Systems
Single Image Virtualized/Cloud
Trends in Server Evolution
Emerging Entry Server
Virtualiz ed/Cloud Platform
- A simple matter of riding the multi-core trend?
- Ad d more core s to the die,
Enabled by:
- Technology
- Innovation
8-core
8-core
beef up some interfaces, and scale to a large SMP?
Not so simple:
Driven by:
8-core
- IT Evolution
- Economics
Time
Traditi onal Entry Server
Single Image Platform
16 to 32-way SMP Server
2 to 4 socket
8-core
- Emerging entry servers have characteristics similar to traditional high-end large SMP servers
Traditional High-End Server
Virtualiz ed Consolidation Platform
Achieving solid virtual machine performance
2-core 2-core
requires a Balanced
2-core 2-core
2 to 4 socket
4 to 8-way SMP Server
8 to 32 socket
16 to 64-way SMP Server
System Structure.
* Statements regarding SMP servers
do not imply that IBM will introduce a system with this capability.
© 2010 IBM Corporation
IBM Power Systems
Single Image Virtualized/Cloud UltraScale Cloud
Trends in Server Evolution
Enabled by:
Emerging Entry Server
Virtualiz ed/Cloud Platform
8-core
8-core
Emerging High-End Server
UltraScale Cloud Platform
- Technology
- Innovation
Driven by:
8-core
8-core
- IT Evolution
- Economics
Time
Traditi onal Entry Server
Single Image Platform
16 to 32-way SMP Server
2 to 4 socket
Traditional High-End Server
Virtualiz ed Consolidation Platform
8 to 32 socket
64 to 256-way SMP Server
Same enablers and driving factors apply at larger scale
2-core 2-core
2-core 2-core
2 to 4 socket
4 to 8-way SMP Server
8 to 32 socket
16 to 64-way SMP Server
* Statements regarding SMP servers
do not imply that IBM will introduce a system with this capability.
© 2010 IBM Corporation
IBM Power Systems
Challenge: How does POWER7 mai ntain the Bal ance?
Need to Amplify Effective
Socket Throughput
to Close Gap and
Achieve Potential
Compute Throughput Potential
Cache Hierarchy Technology
and Innovation
Socket Throughput Limitation
(Physical signal economics)
© 2010 IBM Corporation
IBM Power Systems
Challenge: How does POWER7 mai ntain the Bal ance?
Need to Amplify Effective
Socket Throughput
to Close Gap and
Achieve Potential
Compute Throughput Potential
Advances in Memory Subsystem
Cache Hierarchy Technology
and Innovation
Socket Throughput Limitation
(Physical signal economics)
© 2010 IBM Corporation
IBM Power Systems
Challenge: How does POWER7 mai ntain the Bal ance?
Need to Amplify Effective
Socket Throughput
to Close Gap and
Achieve Potential
Compute Throughput Potential
Advances in Off-Chip Signaling
Technology
Advances in Memory Subsystem
Cache Hierarchy Technology
and Innovation
Socket Throughput Limitation
(Physical signal economics)
© 2010 IBM Corporation
IBM Power Systems
Challenge: How does POWER7 mai ntain the Bal ance?
Need to Amplify Effective
Socket Throughput
to Close Gap and
Achieve Potential
Compute Throughput Potential
Exploit Long Ter m Investmen t
in Coherence Innovation
Advances in Off-Chip Signaling
Technology
Advances in Memory Subsystem
Cache Hierarchy Technology
and Innovation
Socket Throughput Limitation
(Physical signal economics)
© 2010 IBM Corporation
IBM Power Systems

POWER7 Processor

POWER7
Processor
© 2010 IBM Corporation
IBM Power Systems

20+ Years of POWER Processors

45nm
1.0um
POWER1
-AMERICA’s
Muskie A35
-Cobra A10
-64 bit
.72um
RSC
RS64IV Sstar
RS64III Pulsar
RS64II North Star
RS64I Apache BiCMOS
.5um
.35um
POWER2 P2SC
.6um
-601
.5um
.35um
TM
-603
.5um
.35um
.25um
604e
.25um
.22um
POWER3
-630
.18um
TM
180nm
POWER4
-Dual Core
TM
65nm
130nm
TM
POWER5
-SMT
POWER6
-Ultra High Frequency
TM
Major POWER® Innovation
-1990 RISC Architecture
-1994 SMP
-1995 Out of Order Execution
-1996 64 Bit Enterprise Architecture
-1997 Hardware Multi-Threading
-2001 Dual Core Processors
-2001 Large System Scaling
-2001 Shared Caches
-2003 On Chip Memory Control
-2003 SMT
-2006 Ultra High Frequency
-2006 Dual Scope Coherence Mgmt
-2006 Decimal Float/VSX
-2006 Processor Recovery/Sparing
-2009 Balanced Multi-core Pr ocesso r
-2009 On Chip EDRAM
Next Gen.
POWER7
-Multi-core
1990 1995 2000 2005 2010
* Dates represent approximate proc essor power-on dates, not sys tem availability
© 2010 IBM Corporation
IBM Power Systems
IBM risc processors have many innovations..
pSeries p640,
64bit P2,P3,P4
64bit
32bit
RS64
Apache
125
Power3
200+
RS64-II
Northstar
262.5
604e
332 / 375
1998
RS64-II
Northstar
340
1999 2000
p610
Power3-II
333 / 375 / 450
RS64-III
Pulsar
450
pSeries p620, p660, & p680
POWER4
1.1+GHz
RS64-IV
Sstar
600+ / 750
2001
POWER4
1.5GHz
Regatta
7450
800MHz/1.0GHz
2002
POWER4
1.8GHz
2003
Copper =
& SOI =
& low-k =
Σ
© 2010 IBM Corporation
IBM Power Systems

Processor Technology Roadmap

POWER6
65 nm
POWER5
130 nm
POWER4
180 nm
POWER8
POWER7
45 nm
Dual Core Chip Multi ProcessingDistributed SwitchShared L2Dynamic LPARs (32)
2001
Dual CoreEnhanced ScalingSMTDistributed Switch +Core Parallelism +FP Performance +Memory bandwidth +Virtualization
2004
Dual CoreHigh Frequencies Virtualization +Memory Subsystem +Altivec Instruction RetryDyn Energy MgmtSMT +Protection Keys
2007
Multi CoreOn-Chip eDRAM Power Optimized CoresMem Subsystem ++SMT++Reliability +VSM & VSX (AltiVec)Protection Keys+
2010
Concept Phase
© 2010 IBM Corporation
IBM Power Systems

Processor Designs contrast: 0.278nm H2O

POWER5 POWER5+ POWER6 POWER7
Technology 130 nm 90 nm 60 nm 45 nm
Size 389 mm
2
245 mm
2
341 mm
2
567 mm
Transistors 276 M 276 M 790 M 1.2 B
Cores 2 2 2 4 / 6 / 8
Frequencies 1.65 GHz 1.9 GHz 3-5 GHz 3-4 GHz
L2 Cache 1.9 MB Shared 1.9 MB Shared 4 MB / Core 256 KB / Core L3 Cache 36 MB 36 MB 32 MB 4 MB / Core
Memory Cntrl 1 1 2 / 1 2
LPAR 10 / Core 10 / Core 10 / Core 10 / Core
© 2010 IBM Corporation
2
IBM Power Systems

POWER6 / POWER7

POWER6
M
E M O
R
Y
L3
Mem
Ctrl
Alti
Vec
L3
Dir
SMT Core
4MB
SMT Core
4MB
L2
Bus Fabric Controller
GX Bus Cntrl
GX+ Bridge
Chip
to Chip
L2
to Chip
Alti
Vec
Chip
L3
Dir
Mem
Ctrl
L3
M
E M O
R
Y
© 2010 IBM Corporation
IBM Power Systems

POWER6 / POWER7

POWER7
POWER6
M
L3
E M O
R
Y
Mem
Ctrl
Alti
Vec
SMT Core
SMT Core
Alti
Vec
L3 Cache
L3
Dir
4MB
L2
Bus Fabric Controller
GX Bus Cntrl
GX+ Bridge
Chip
to Chip
eDRAM (Embedded D y namic RAM )
L3 — 6:1 latency improvement (vs. external L3) and 2x BW improvementsCapacitor vs transister1/3 space (vs 6Trn SRAM cell), 1/5 standby power of standard SRAMSoft error rated 250x lower than SRAMSavings of ~ 1.5B transistors over other RAM
4MB
L2
Chip
to Chip
L3
Dir
Mem
Ctrl
L3
M
E M O
R
Y
© 2010 IBM Corporation
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