IBM L190(9329-AB9) Service Manual

COLOR MONITOR
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
MODEL: L190(9329-AB9)
1. LCD CHARACTERISTICS
Type : TFT Color LCD Module Active Display Area : 19inch Size : 396.0(H)x324.0(V)x15.5(D)mm Pixel Pitch : 0.294(H) x 0.294(V) Color Depth : 16.2M Colors Electrical Interface : LVDS Surface Treatment : Anti-Glare, Hard Coating(3H) Operating Mode : Transmissive mode
Normally White
Backlight Unit : 4-CCFL
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio 10
Left : -60° min., -70°(Typ) Right : +60° min., +70°(Typ)
Top :+65° min., +75°(Typ) Bottom : -55°min., -65°(Typ) 2-2. Luminance : 200(min), 250(Typ) 2-3. Contrast Ratio : 300(min), 500(Typ)
3. SIGNAL (Refer to the Timing Chart)
3-1. Sync Signal
• Type : Separate Sync. Composite, SOG
3-2. Video Input Signal
1) Type : R, G, B Analog
2) Voltage Level : 0~0.7 V
3) Input Impedance : 75
3-3. Operating Frequency
Horizontal(Analog) : 30 ~ 83kH Vertical : 55 ~ 76Hz
4. MAX. RESOLUTION
D-sub Analog : 1280 x 1024@76Hz
5. POWER SUPPLY
5-1. Power Adaptor(Built-in Power)
Input : AC 90~264V, 50/60Hz , 1.0A
5-2. Power Consumption
6. ENVIRONMENT
6-1. Operating Temperature: 10°C~35°C 6-2. Relative Humidity : 10%~80% 6-3. MTBF : 50,000 Hours
Lamp Life : 30,000 Hours(to 50% initial
luminance, Half luminance)
7. DIMENSIONS (with TILT/SWIVEL)
Width : 408 mm (16.06'') Depth : 222mm (8.74'') Height : 413mm (16.26'')
8. WEIGHT (with TILT/SWIVEL)
Net. Weight : 6.1kg (13.45 lbs) Gross Weight : 7.9kg (17.42 lbs)
CONTENTS
SPECIFICATIONS
- 2 -
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 3
TIMING CHART ....................................................... 7
DISASSEMBLY ........................................................ 8
BLOCK DIAGRAM...................................................10
DISCRIPTION OF BLOCK DIAGRAM ....................11
ADJUSTMENT .......................................................13
SERVICE OSD........................................................14
TROUBLESHOOTING GUIDE .............................. 15
WIRING DIAGRAM ............................................... 19
EXPLODED VIEW...................................................20
REPLACEMENT PARTS LIST ...............................22
SCHEMATIC DIAGRAM......................................... 24
MODE
ON MODE
SLEEP MODE
OFF MODE
H/V SYNC
ON/ON OFF/ON ON/OFF
OFF/OFF
-
POWER CONSUMPTION
less than 40 W
less than 2 W less than 2 W less than 2 W less than 1 W
LED COLOR
Green AMBER AMBER AMBER
OFF
VIDEO
ACTIVE
OFF OFF OFF
-
- 3 -
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD monitor that are important for safety. These parts are
marked on the schematic diagram and the replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged in four corners.
• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.
• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.
• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).
• Make certain that treatment person’s body are grounded through wrist band.
• Do not leave the module in high temperature and in areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within the module.
• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.
Leakage Current Hot Check Circuit
PRECAUTION
CAUTION
Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's exposed METALLIC PARTS
Good Earth Ground such as WATER PIPE, CONDUIT etc.
AC Volt-meter
- 4 -
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.
4. Do not spray chemicals on or near this receiver or any of its assemblies.
5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton­tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti­static" can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
- 5 -
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip
temperature within the range or 500¡£F to 600¡£F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal
temperature.
(500¡£F to 600¡£F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal
temperature (500¡£F to 600¡£F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
- 6 -
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
- 7 -
<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>
VIDEO
SYNC
B
C
E
A
D
MODE
H / V
Sync
Polarity
Frequency
Total
Period
( E )
Video
Active
Time ( A )
Sync
Duration
( D )
Front
Porch
( C )
Blanking
Time
( B )
Resolution
Dot
Clock
1 H(Pixels) + 25.175 31.469 800 640 16 96 48 640 x 350
V(Lines) - 70.8 449 350 37 2 60
2 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480
V(Lines) - 59.94 525 480 10 2 33
3 H(Pixels) - 30.240 35.00 864 640 64 64 96 640 x 480
V(Lines) - 66.667 525 480 3 3 39
4 H(Pixels) - 31.5 37.861 832 640 24 40 128 640 x 480
V(Lines) - 72.809 520 480 9 3 28
5 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480
V(Lines) - 75 500 480 1 3 16
6 H(Pixels) - 28.350 31.50 900 720 18 108 54 720 x 400
V(Lines) + 70.156 449 400 12 3 34
7 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600
V(Lines) + 60.317 628 600 1 4 23
8 H(Pixels) + 50 48.077 1040 800 56 120 64 800 x 600
V(Lines) + 72.188 666 600 37 6 23
9 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600
V(Lines) + 75.0 625 600 1 3 21
10 H(Pixels) +/- 57.283 49.725 1152 832 32 64 224 832 x 624
V(Lines) +/- 74.55 667 624 1 3 39
11 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768
V(Lines) - 60.0 806 768 3 6 29
12 H(Pixels) - 75 56.476 1328 1024 24 136 144 1024 x 768
V(Lines) - 70.069 806 768 3 6 29
13 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x 768
V(Lines) - 75.029 800 768 1 3 28
14 H(Pixels) +/- 100.0 68.681 1456 1152 32 128 144 1152 x 870
V(Lines) +/- 75.062 915 870 3 3 39
15 H(Pixels) +/- 92.978 61.805 1504 1152 18 134 200 1152 x 900
V(Lines) +/- 65.96 937 900 2 4 31
16 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024
V(Lines) + 60.02 1066 1024 1 3 38
17 H(Pixels) + 125.0 74.405 1680 1280 32 160 208 1280 x 1024
V(Lines) + 69.995 1063 1024 0 3 36
18 H(Pixels) - 135.0 78.125 1728 1280 64 192 192 1280 x 1024
V(Lines) - 72.005 1085 1024 3 3 55
19 H(Pixels) + 135.0 79.976 1688 1280 16 144 248 1280 x 1024
V(Lines) + 75.035 1066 1024 1 3 38
20 H(Pixels) - 135.0 81.1 1664 1280 32 64 288 1280 x 1024
V(Lines) - 76.1 1066 1024 2 8 32
TIMING CHART
- 8 -
DISASSEMBLY
Disassembly Hinge Cover.
Remove the screws.
# 1
Pull the Hinge Cover out From the Stand.
Remove the three screws from the Back cover.
Please remove the screw cover at the Back cabinet, then screw cover will be departed.
# 2
# 3
# 4
# 5
# 6
1. Pull the front cover upward.
2. Then, let the all latches are separated.
3. Put the front face down.
Disassemble back cover
Pull the rear cover assy out from stand.
# 7
# 8
- 9 -
Disassemble inverter shield something thin.
# 9
# 10
# 11
# 12
# 13
# 14
Detach Al-tape from panel.
Pull out the lamp cables
Remove the 4 screws from each side of metal frame
1. Lift downside of metal frame
2. Pull out the link cable
Remove te one screws for control pcb fix.
- 10 -
LIPS
5V
5V
Power +
+
Inverter
BRT-CTL
INV-CTL
gmZAN3SL
ADC
Scaling
PLL
OSD
LVDS
Transmitter
Panel
MCU
EEPROM
(System)
LVDS
Analog(R/G/B)
D-Sub
To Key Control
5V
3.3 V
1.8 V
Regulator
3.3 V
1.8 V
Switch
(System)
5V
MOD-ON
5V
BLOCK DIAGRAM
- 11 -
DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 135MHz. This part consists of the Scaler, ADC, LVDS transmitter. The Scaler gets the video signal converted analog to digital, interpolates input to 1280 X 1024 resolution signal and outputs 8-bit R, G, B signal to transmitter.
2. Power Part.
This part consists of the one 3.3V regulator, and one 1.8V regulator to convert power which is provided, 5V in Power board. 5V is provided for LCD panel and Micom. Also, 5V is converted 3.3V by regulator and 5V is converted 1.8V by regulator. Converted power is provided for IC in the main board.
3. MICOM Part.
This part consists of EEPROM IC which stores control data, Reset IC and the Micom. The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable. The controlled data of each modes is stored in EEPROM.
- 12 -
EMI
COMPONENTS
LINE
100 ~ 240V
INPUT RECTIFIER
AND FILTER
ENERGY
TRANSFER
OUTPUT RECTIFIER
AND FILTER
12V
5V
GND
SIGNAL
COLLECT-
ON
PHOTO
INVERTER CIRCUIT
High Voltage output
12V
-COUPLER
ISOLATION
PWM CONTROL
CIRCUIT
HVDC
100KHz
PRIMARY SECONDARY
50 ~ 60Hz
Operation description_LIPS
LIPS Board Block Diagram
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC, VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.
This part function is transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to adjust the duty cycle during different AC input and output loading condition to achive the dc output stablize, and also the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the dc output changing status through a photo transistor to primary controller to achieve the stabilized dc output voltage.
6. Signal collection.
This part function is to collect the any change from the dc output and feed back to the primary through photo transistor.
- 13 -
ADJUSTMENT
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Dont need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup a) Copy UserPort.sys file to
c:\WINNT\system32\drivers folder
b) Run Userport.exe
c) Remove all default number d) Add 300-3FF
e) Click Start button. f) Click Exit button.
2. EDID Read & Write
1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture, Serial Number (24C08 EEPROM) a) Input User Info Data b) Click Update button c) Click Write button
3) Repeat the above actions at 24C02 EEPROM. (Using DDC2B)
CAUTION
Check the state. Whether power S/W is ON or OFF. (You must turn off the power S/W)
- 14 -
Figure 1. Cable Connection
220
IBM Compatible PC
Video Signal Generator
PARALLEL PORT
Power inlet (required)
Power LED
ST Switch
Power Select Switch (110V/220V)
Control Line
Not used
RS232C
PARALLEL
V-SYNC
POWER
ST
VGS
MONITOR
E
E
V-Sync On/Off Switch (Switch must be ON.)
F
F
A
A
B
B
C
C
15
10
5
5
69
1
1
1
14
13
25
6
5V
5V
5V
4.7K
4.7K
4.7K
74LS06
74LS06
OFF ON
OFF
ON
11
SERVICE OSD
1) Turn off the power switch at the front side of the display.
2) Wait for about 5 seconds and press EXIT, POWER switch with 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a)Module select : Select applied module. b) NVRAM INIT : EEPROM initialize.(But the EDID data is not initialized. The EDID data keep original data.)
Press left and right swith at same time. c) ADC CAL. : W/B balance and Automatically sets the gain and offset value. d) AGING : Select Aging mode(on/off). e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
7200K : Allows you to set the R/G/B-7200K value manually. 6500K : Allows you to set the R/G/B-6500K value manually.
f) CLEAR ETI : To initialize using time.
- 15 -
TROUBLESHOOTING GUIDE
1. NO POWER
CHECK U801.
CHECK
U801 PIN 1& U803
PIN 3 VOLTAGE
(5V) ?
NO
NO POWER
(POWER INDICATOR OFF)
CHECK POWER BOARD, AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE
CHECK J705
VOLTAGE
PIN5, PIN6 (5V)?
NO
CHECK 5VR LINE
(OPEN CHECK)
CHECK
Q803 PIN 3(3.3V) &
U803 PIN 4 (1.8V)?
NO
CHECK IIC LINE CONNECTION
(U501, U502)
CHECK U201 VCC, XTAL, RESET
IS U201
PIN88
VOLTAGE REPEATED
AS PULSE
SHAPE ?
NO
YES
YES
YES
NO PROBLEM
YES
CHECK KEY CONTROL
CONNECTOR ROUTINE
1
1
1
2
1 2
Waveforms
J705-#5, 6 / U801-#1/U803-#3 U201-#88
- 16 -
2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS
CHECK MICOM INV ON/OFF PORT. (U501 PIN9)
J705 PIN2
2.5V?
NO
NO RASTER
(OSD IS NOT DISPLAYED)
CHECK LIPS
J705
PIN5, PIN 6
5V?
NO
1. CONFIRM BRIGHTNESS OSD CONTRL STATE.
2. CHECK MICOM DIM-ADJ PORT(U501 PIN41)
J705 PIN1
5V?
NO
LIPS
CHECK
PULSE AS
CONTACTING SCOPE
PROBE TO CAUTION LABEL.
(CONTACT PROBE TO
CAUTION LABEL.
CAN YOU SEE PULSE
AT YOUR
SCOPE?
NO
REPLACE CCFL LAMP
IN THE LCD MODULE
YES
YES
YES
YES
3 4
Waveforms
J705-#9 J705-#9
1
3 4
Inverter Off
Micom Port check
J705 Inverter output
Inverter On
Micom Port check
J705 Inverter output
1
J705-#5, 6 / U801-#1/U803-#3
- 17 -
1. CHECK PIN88 SOLDERING CONDITION
2. CHECK X501
3. TROUBLE IN U201
U201
POWER PINS
3.3V?
NO
CHECK U803, U801
U201
PIN88
OSCILLATE AS
12MHZ?
CHECK CONNECTION LINE FROM U201 TO U501
TROUBLE IN CABLE
OR LCD MODULE
CHECK 5VR LINE
U501 PIN8
5V?
YES
YES
YES
YES
3. NO RASTER (OSD IS NOT DISPLAYED) – gmZAN3SL
NO RASTER
(OSD IS NOT DISPLAYED)
U501
PIN43 IS 64KHz H-SYNC?
PIN44 IS 60Hz V-SYNC?
IS PULSE APPEARED
AT SIGNAL PINS?
NO
NO
NO
52
2
5 6
Waveforms
U501-#43
6
U501-#44U201-#88
- 18 -
CHECK U803, U801
U201
POWER PIN99(1.8V)
PIN33(3.3V)
?
NO
1. CHECK PC
2. CHECK SIGNAL CABLE & D-SUB CONNECTOR LINE
CHECK
R,G,B INPUT?
U201 PIN 70,74,77
NO
CHECK H-SYNC LINE (D-SUBU501 U201 PIN95)
CHECK
H-SYNC INPUT
U201 PIN 95?
NO
YES
YES
CHECK V-SYNC LINE (D-SUBU501 U201 PIN96)
CHECK
V-SYNC INPUT
U201 PIN 96?
NO
YES
NO RASTER
(OSD IS DISPLAYED)
4. NO RASTER (OSD IS DISPLAYED) – gmZAN3SL
TROUBLE IN
LCD MODULE
YES
- 19 -
WIRING DIAGRAM
Main Board
Power Board
Control Board
Connector Assy P/N:
6631T20023J
Connector Assy P/N:
6631T20022E
Connector Assy P/N:
6631T11020W
or 6631T11012W
- 20 -
010
020
030
110
100
080
070
060
050
090
130
120
040
EXPLODED VIEW
- 21 -
EXPLODED VIEW PARTS LIST
Description
Part No.Ref. No.
3090TKL147B CABINET ASSEMBLY, LL190N IBM 3090TKL 126A L190 LGENT 6304FLP159A
LCD(LIQUID CRYSTAL DISPLAY), LM190E04-A4 LG PHILPS TFT COLOR SUPER SLIM,15.5T,TN,SXGA,LVDS 3809TKL102B BACK COVER ASSEMBLY, LL190N L104A IBM L190 LGENT 3043TKK225B TILT SWIVEL ASSEMBLY, LL190N . IBM L190 LGENT 3680TKP116A LENS, POWER LED LENS LL190N 4940TKT240A KNOB, TACT CONTROL LL190N IBM L190 6871TST799B PWB(PCB) ASSEMBLY,SUB, LL190N CONTROL TOTAL IBM CKD-NT 6871TPT306A
PWB(PCB) ASSEMBLY,POWER, L190 & L170 POWER TOTAL IBM LIENCHANG LIPS FOR LPL & AUO 3313T19072B MAIN TOTAL ASSEMBLY, LL190N IBM CL-66 CKD-NT 4814TKK269A SHIELD, INVERTER LL170M 4951TKS197B METAL ASSEMBLY, FRAME LL190N IBM L190 LGENT 3550TKK773A COVER, LL190N HINGE VESA COVER IBM L190 3551TKK565B COVER ASSEMBLY, LL190N STAND . REAR ASSY IBM L190 LGENT
010 020 030 040 050 060 070 080 090 100 110 120 130
- 22 -
DATE: 2004. 11. 12.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
C204 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C205 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C206 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C207 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C208 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C210 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C213 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C214 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C215 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C216 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C217 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C218 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C219 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C220 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C221 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C222 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C223 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C224 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C225 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C226 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C227 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C231 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C232 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C233 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C234 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C503 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C504 0CE106CK610 "10UF SHL,SD 50V 20% BULK FL" C506 0CC030CK01A 3PF 1608 50V 0.25 PF R/TP NP C507 0CC180CK41A 18PF 1608 50V 5% R/TP NP0 C508 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C701 0CK105CD56A 1UF 1608 10V 10% R/TP X7R C703 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C708 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C709 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C717 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C718 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C720 0CC680CK41A 68PF 1608 50V 5% R/TP NP0 C721 0CC680CK41A 68PF 1608 50V 5% R/TP NP0 C727 0CK105CD56A 1UF 1608 10V 10% R/TP X7R C732 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C733 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C734 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C735 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C801 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C803 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C819 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C820 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK" C821 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C829 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C831 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK" C832 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK"
DATE: 2004. 11. 12.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
D701 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D702 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D706 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D707 0DD184009AA KDS184 TP KEC - 85V - - - 30 ZD701 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD702 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD703 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD704 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD705 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5. ZD711 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5.
U201 0IPRPGN016A "GMZAN3SL-BD GENESIS 128P,PQF" U501 0IZZTSZ603B MTV412MV128 MYSON 44 PINP . U502 0ISG240860B M24C08W6 SGS-THOMSON 8SOP R/ U702 0IMMRSG036A "M24C02-WMN6T SGS-THOMSON 8P," U801 0IPMGKE011A KIA78D33F KEC DPAK R/TP 3.3V U803 0IPMGSG019A LD1117S18TR STM SOT223 R/TP Q502 0IKE704200H KIA7042AP TO-92 TP 4.2 VOLT
Q503 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP Q504 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP Q505 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP Q703 0TR390609FA KST3906-MTF TP SAMSUNG SOT2 Q704 0TR390609FA KST3906-MTF TP SAMSUNG SOT2 Q803 0TR127309AA KTA1273-Y(KTA966A) TP KEC TO Q804 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP
R201 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R202 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R203 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R208 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/TP R209 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/TP R210 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/TP R211 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R213 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R214 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R220 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R221 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R222 0RJ1004D677 1000000 OHM 1/10 W 5% 1608 R R506 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R508 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R514 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R515 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R516 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R518 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R520 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R521 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
REPLACEMENT PARTS LIST
CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS,
READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.
* NOTE : S SAFETY Mark
AL ALTERNATIVE PARTS
MAIN BOARD
CAPACITORS
DIODEs
ICs
RESISTORs
TRANSISTOR
DATE: 2004. 11. 12.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
R522 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R523 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R534 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R535 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP R537 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP R541 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R542 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R543 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R544 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R545 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R547 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R548 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R549 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R555 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R557 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R560 0RJ1501D677 1.5K OHM 1/10 W 5% 1608 R/TP R561 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R566 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R701 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R703 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R706 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R708 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R709 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R716 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R717 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R720 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R721 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R722 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R723 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R724 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R726 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R727 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R728 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R744 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R747 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R769 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R775 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R779 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R780 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP R781 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP R782 0RJ0471D677 4.7 OHM 1/10 W 5% 1608 R/TP R803 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R805 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R806 0RJ3900D677 390 OHM 1/10 W 5% 1608 R/TP R807 0RJ3900D677 390 OHM 1/10 W 5% 1608 R/TP R809 0RJ3900D677 390 OHM 1/10 W 5% 1608 R/TP R810 0RJ3900D677 390 OHM 1/10 W 5% 1608 R/TP R813 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R814 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R815 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R816 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R817 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R818 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R819 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R820 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R821 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R822 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R823 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R824 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
X501 6212AA2004A HC-49U TXC 12.0MHZ +/- 30 PP
DATE: 2004. 11. 12.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
LED1 0DLLT0208AA LITEON LTST-C155KGJSKT R/TP SW1 140-058E SKHV10910B LGEC NON 12V 20A SW2 140-058E SKHV10910B LGEC NON 12V 20A SW3 140-058E SKHV10910B LGEC NON 12V 20A SW4 140-058E SKHV10910B LGEC NON 12V 20A SW5 140-058E SKHV10910B LGEC NON 12V 20A R1 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R2 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R3 0RJ8200D677 820 OHM 1/10 W 5% 1608 R/TP R4 0RJ8200D677 820 OHM 1/10 W 5% 1608 R/TP R5 0RJ1501D677 1.5K OHM 1/10 W 5% 1608 R/TP
- 23 -
OTHERs
CONTROL BOARD
SCHEMATIC DIAGRAM
- 24 -
1. ZAN3SL
1
2
2
U201-#88
Waveforms
- 25 -
2. MICOM
2
6
5
5
U501-#43
Waveforms
6
U501-#44
- 26 -
3. POWER
3
1
1
Waveforms
1
J705-#5, 6 / U801-#1/U803-#3
- 27 -
4. CONNECTOR & JACKS
4
Waveforms
1
J705-#5, 6 / U801-#1/U803-#3
3 4
J705-#9 J705-#9
Inverter Off
Micom Port check
J705 Inverter output
Inverter On
Micom Port check
J705 Inverter output
4 3
1
- 28 -
5. CONTROL
Nov . 2004 Printed in Korea
P/NO : 3828TSO049H
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