The IBM31T1100A is a multi-mode integrated
infrared (IR) transceiver module for data
communication systems. The transceiver supports
IrDA speeds up to 4 Mbps, HP-SIR and Sharp ASK
modes. Integrated into this tiny package is a
photodiode, LED and analog transceiver ASIC to
provide a total solution in a single package. A
current limiting resistor in series with the LED and
a Vcc bypass capacitor are the only external
components required to implement a complete
transceiver.
Pack a g e
Noise
Rejection
Circuit
TX
6
7
Control
logic
SD/BW
Block D ia g r a m
Amp
BW
SD
4
GND
3
Vcc
+
Comp
-
Driver
Driver
2
8
1
RX
Vcc
LEDA
LEDC
IBM31T1100A
Pin Assignm e nts and De s c riptions
LEDA
8
LED
LEDC
PinPin NameDescriptionI/OActive
1
2
3
4GNDConnect to ground of the pow er supply. A solid ground plane is recommended f or proper
5NCThis pin is res erved fo r sp e cial application use only. No signal shou ld b e connected to
6SD/BWThis CMOS input is used to put the IBM31T1 100A in shutdown mode. No m inal supply
7TXUsed to transmit serial data when SD/BW is low. This CMOS input controls the LED
8LEDAConnect this input to Vc c through a resistor to set the proper LE D current. Add an
LEDC
RX
V
cc
Guide Pins
(not shown above)
Ind icates the state o f the internal L ED cathode. Norm ally not connected.OLo w
Indicates received serial data. It is a push-pull CMOS driver capable of driving a
standard CMOS or TTL load. No external pull-up or pull-down resisto r is required. May
switch indeterminately when the IBM31T1100A is transmitting.
Connect to + 5 V power supply . Place a 1.0- 10 PF ceramic bypass capacitor as close as
possible to this pin.
operation.
this pin.
current draw in this mode is 35 PA versus 5 mA in normal mode. Together with th e T X
input, this pin also sets the receiver bandwidth. If TX is lo w w hen SD /BW transitions
from high to low, the re ceiver band width is optim ized for operation u p to 1.2 Mbps. If
TX is high when SD /BW transition s from high to low, the receiver b an d width is
optim ized for operation a t 4 Mb p s.
driver. A n on-chip protection c irc uit disables the LED driv er if TX is hig h f or more than
60 Psec. Th is pi n is a lso used to pr ogram th e b a n d width of th e receiver. See SD/B W pin
description.
external LED in series to increase output intensity if required.I
Two through-h ole guide pin s p rovide me chanical stab ility during boar d mounting. They
also improv e heat c onduction when the part is in operation.
TXSD/BW
7
1
2
RX
65
NC
Photodiode
V
CC
43
GND
OLow
IHigh
IHigh
NOTE: The IBM31T1100A is pin and plug com patible with the Temic TFDS6000D.
2
IBM31T1100A
Electrical and Timing Specifications
Absolute Maximum Ratings
SymbolParameterMinTypMaxUnitCondition
V
CC
P
D
T
J
I
LED
Recommended Operating Conditions
Supply Vo ltage R ange- 0.56V
Power Dissipation450mW
Junction Temperature125°C
Storage Temp erature Rang e- 2585°C
Solder ing Tempera tur e240°CSee application no te s
LED Current0.8A<2 µs, ton<10%
Voltage at An y Pin- 0.5Vcc+ 0.5V
SymbolParameterMinTypMaxUnitCondition
V
CC
T
A
DC Electrical C haracteristics
Supply Vo ltage4.555.5V
Operating Temperature Range070°C
TA = 0 - 70 qC, V
= 5 V r 10 %, unless otherwise specified
CC
SymbolParameterMinTy pMaxUnitCondition
I
V
V
I
I
LED
V
V
V
C
CC
CC
I
Dynam ic Supply Current57mASD = 0 V
Standby Supply C urrent35100uASD = V
Repetitiv e P u ls ed LED Curre nt0.55A< 60 µs, t
RX
OL
OH
IL
IH
IH
L
I
Output Voltage Low @ IOL = 2.5 mA0.30.5V
RX
Output Voltage High @ -IOH = 2.5 mAV
- 0.5V
CC
Input Voltage Low (TX, SD/BW)00.8V
Input Voltag e Hig h (TX )3.0V
Input Voltag e Hig h (SD /BW)V
0.4uW/srTx=Low or SD=High, R
=5.0, D=0 q, D=r15 q, TA=25 qC
V
CC
D
Output R ad ia n t Intensity Half Angle
O
Peak Wavelength880900nm
P
r
24
q
Optical Overshoot25%
1. Maximum intensity specified for class 1 operation of IEC 825-1
LED
LED
= 5.6
=5.6
:
:
4
IBM31T1100A
700
600
500
400
Min
Max
300
200
F
100
I Forward Current (mA)
2.02.22.4
VLEDA Forward Voltage (V) - T = 25°C
2.6
A
Figure 1. VLEDA to GND Voltage vs. peak LED current.
175
150
125
Typ
100
Min
75
50
25
Output Intensity in mW/Sr
0.20.40.6
I Forward Current in Amperes
F
0.8
700
600
500
Min
400
300
200
100
F
I LED Forward Current (mA)
1.51.71.9
V LED Forward Voltage (V) - T = 25°C
F
Figure 2. LED F orward Voltage vs . C u rre n t
1000
100
10.0
1.0
0.1
0.01
0.001
Input Irrad ia n c e in mW / cm **2
50
100150
RX pulse width in ns
Max
2.1
A
200
Figure 3. Output Intensity vs. Current
2.4
2.3
2.2
I =430mA
2.1
F
2.0
1.9
1.8
VLEDA to GND Voltage (V)
20
1030
5070
4060
Temperature in °C
Figure 5. VLEDA to GND Voltage vs. Temperature.
80
Figure 4.
RX
pulse width vs. Irradiance - 4 Mbps mode.
175
150
125
I =430mA
100
F
75
50
25
Output Intensity in mW/Sr
20
10305070
4060
Temperature in °C
Figure 6. Output Intensity vs. Tem perature
80
5
IBM31T1100A
Timing Diagrams
TX
RX
TX
LEDC
50%
50%
Figure 7.
t
L
Latency Timing
t
DIS_LED
50%
50%
V
V
V
V
V
V
Vcc
IH
IL
OH
OL
IH
V
IH
SD/BW
RX
Figure 8
t
PW
IL
RX
RX
.
valid after Shutdown.
50%
50%
t
RXEN
V
IL
50%
V
OH
V
OL
RX
Figure 11.
Figure 9.
t
PW
LED Protec tion T iming
t
RXH
50%50%
RX
Timing, SIR mode. The output is indeterminate in the
shaded area . S p u rious transition s may occur.
Figure 10.
V
OH
RX
V
OL
Figure 12.
RX
Timing, 1.2 and 4 Mbps mode
t
F
t
R
10%
RX
Rise and F a ll timing measu re ments.
90%
V
OH
V
OL
6
IBM31T1100A
Program m ing the Receiver Bandwidth
The IBM31T1100A powers on with the upper li mit of the receiver
bandwidth set to 1.2 Mbps operation. To set the bandwidth for
operation at 4 Mbps, apply timings as shown in Figure 14 to the
SD/BW and the TX inputs. Note that t he internal LED driver is
disabled when SD/BW is active and is not enabled until the next
rising edge of TX. This ensures that the LED(s) will not be active
during bandwidth adjustment. It is recommended that the SD/BW
pin be connected to GND i f bandwid th ad justme nt an d shut down
mode are not used.
To switch the IBM31T 1100A from the def ault state to 4 Mbps and
vice versa, the programming specific atio ns are as f ollows:
SD/BW
TX
(Setting high bandwidth mode)
TX
(Setting low bandwidth mode)
Figure 13. Bandwidth Programming
50%
t
S
50%50%
t
H
V
IH
V
IL
V
IH
V
IL
V
IL
Setting t h e receiver to 4 M bps m o de
1. Set the SD/BW input to logic hig h.
2. Set the TX input to logic high. Wait t
t 200 ns.
S
3. Set the SD/BW to logic lo w. (This high- to-low tran s ition
latches th e s ta te of TX, w h ich determines th e re ceiver
bandwidth.)
4. After w a itin g t
t 200 ns, set the TX input to logic low. The
H
receiver is now in h igh bandwid th mode, the optimal setting
for 4 Mbps operatio n.
Package Dim e ns ions
5.45 ± 0.5
3.75 ± 0.5
5 ± 3°
Setting t h e receiver to 9.6 kbps-to-1.2 Mbps mode
1. Set the SD/BW input to logic hig h.
2. Ensure that the TX input is at logic low. W ait t
3. Set the SD/BW to logic lo w. (This high- to-low tran s ition
latches th e s ta te of TX, w h ich determines th e re ceiver
bandwidth.)
4. Ensure that the TX input remains low for t
receiver is now in low bandw id th mode, which is the optimal
setting for data rates from 9.6 kbps to 1.2 Mbps.
13 ± 0.5
6.5 ± 0.5
A
0.5
3.3 ± 0.5
3.7 ± 0.5
t 200 ns.
S
t 200 ns. The
H
A
4.0±0.3
5.3 ± 0.3
B
6.7 ± 0.4
0.275 ± 0.075
2.35 ± 0.3
0.5
0.635
0.6 ± 0.2
0.9 ± 0.1
B
0.5 ± 0.1
(7X) 1.27
(2X) 1.45
1.5±0.2
Dimensions in mm.
7
IBM31T1100A
Revision History
The following changes have b e e n made in the spe cifications from
the IBM31T1100 data sheet.
1. Impro ved Irradiance values have been updated.
2. LED protec tio n circuit has been added.
3. The
rise time specification is 40 ns instea d of 35 ns.
RX
4. 200K internal pull-down resistor has been removed from the
SD/BW pin.
5. Output Intensity and
pulse width graphs have been
RX
updated.
Order ing I nf ormation
Order Part NumberQty/Reel
IBM31T1100A750 Pieces
£
¤
Inte rn ati o nal Bus i ne s s M ac h in e s Co rp o rat io n 1995
Printed in the Unite d States of A merica
5-97
All Rights Re se rved
£¥IBM and the IBM logo are registered trademarks of the IBM Corporation.
IBM Microelectronics is a trademark of the IBM Corporation.
Hewlett-Packard is a registered trademark of Hewlett-Packard Corporation.
Sharp is a trademark of Sharp Electronics Corporation.
All other registered trademarks and trademarks are the properties of their
respective companies.
The information provided is believed to be accurate and reliable. IBM
reserves the right to make changes to the product described without notice.
No liability is assumed as a result of its use nor f or any infring eme nt of the
rights of others.
This document may contain preliminary information and is subject to
change by IBM without notice. IBM assumes no responsibility of liability
for any use of the information contained herein. Nothing in this document
shall operate as an express or implied license or indemnity under the
intellectual property rights of IBM or third parties. The products described
in this document are not intended for use in implantation or other direct life
support applications where malfunction may result in direct physical harm
or injury to pe rso ns . NO W AR RANTIES OF ANY K IND, INCLU DING,
BUT NOT LIMITED TO, THE IMPLIED WARRA NTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR
PURPOSE ARE OFF ERED IN THIS DOCU MENT.
IBM Microelectronics Division
1580 Route 52, Bl dg . 504
Hopewell Junction, NY
12533-6531
The IBM home page can be found at http://www.ibm.com
The IBM Microelectronics Division home page can be found at
http://www.chips.ibm.com
GH45-5286-01
8
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