IBASE IPPCXXA9-RE User Manual

www.ibase.com.tw
IBASE Technology Inc.
IPPCxxA9-RE Seri es
User Manual
2013 Nov V1
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IPPCxxA9-RE User Manual
Copyright © 2013 IBASE Technology Inc. All Rights Reserved.
No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system , or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of IBASE Technology INC. (“IBASE”).
Products and corporate names mentioned in this manual may or may not be registered trademarks or copyrights of their respective companies, and are used for identification purposes only. All trademarks are the property of their respective owners.
Every effort has been made to ensure that the contents of this manual are correct and up to date. However, the manufacturer makes no guarantee regarding the accuracy of its contents, and reserves the right to make changes without prior notice.
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IPPCxxA9-RE User Manual
Table of Contents
Safety Information .......................................................................................................... iii
Setting up your system ................................................................................................. v
Care during use ........................................................................................................... iv
Acknowledgments ........................................................................................................ v
CHAPTER 1 INTRODUCTION ................................................................................... 1
1.1 General Description ................................................................................................ 1
1.2 System Specification ............................................................................................... 2
1.2.1 Hardware Specifications ....................................................................................... 2
1.2.2 Dimensions .......................................................................................................... 3
1.2.3 I/O View .............................................................................................................. 5
1.3 Packing List ............................................................................................................. 6
1.4 Installation ............................................................................................................. 6
1.4.1 Installing Memory ................................................................................................ 6
1.4.2 Installing Storage ................................................................................................. 8
1.4.3 Installing CFast ................................................................................................... 10
1.4.4 Installing PCI slot ................................................................................................ 11
1.4.5 Installing WIFI module ....................................................................................... 13
CHAPTER 2 MOTHERBOARD INTRODUCTION ........................................................ 14
2.1 Introduction ......................................................................................................... 14
2.2 Installing the Memory ........................................................................................... 17
2.3 Setting Jumpers .................................................................................................... 18
2.4 Connectors ........................................................................................................... 20
CHAPTER 3 BIOS SETUP ........................................................................................ 25
3.1 BIOS Introduction ................................................................................................. 25
3.2 BIOS Setup............................................................................................................ 25
3.3 Main Settings ....................................................................................................... 26
3.4 Chipset Settings .................................................................................................... 38
CHAPTER 4 DRIVERS INSTALLATION ...................................................................... 49
4.1 Intel Chipset Software Installation Utility............................................................... 49
4.2 VGA Drivers Installation ........................................................................................ 52
4.3 Realtek HD Audio Driver Installation...................................................................... 55
4.4 LAN Drivers Installation......................................................................................... 57
4.5 Realtek LAN Controller Drivers Installation ............................................................ 61
4.6 Intel® Management Engine Interface ..................................................................... 63
4.7 Intel® USB 3.0 Drivers ........................................................................................... 65
4.8 ALTERA FPGA Driver Installation ............................................................................ 68
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Safety Information
Your IPPCxxA9-RE is designed and tested to meet the latest standards of safety for information technology equipment. However, to ensure your safety, it is important that you read the following safety instructions

Setting up your system

Read and follow all instructions in the documentation before you operate your system.
Do not use this product near water.
Set up the system on a stabl e surface. Do not secure the system on any unstable
plane.
Do not place this product on an unstable cart, stand, or table. The product may fall, causing serious damage to the product.
Slots and openings on the chassis are for ventilation. Do not block or cover these openings. Make sure you leave plenty of space ar ound the system for ventilation. Never insert objects of any kind into the ventilation openings.
This system should be operated from the type of power indicated on the marking label. If you are not sure of the type of power available, consult your dealer or local power company.
Use this product in environments with ambient temperatures between 0˚C and 45˚C.
If you use an extension cord, make sure that the total ampere rating of the devices plugged into the extension cord does not exceed its ampere rating.
DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT WHERE THESTORAGE TEMPERATURE MAY GO BELOW -10° C OR ABOVE 60° C. THIS COULD DAMAGE THE EQUIPMENT. THE EQUIPMENT SHOULD BE IN A CONTROLLED ENVIRONMENT.
Copyright © 2013 IBASE Technology Inc. All Rights Reserved.
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Care during use

Do not walk on the power cord or allow anything to rest on it.
Do not spill water or any other liquids on your system.
When the system is turned off, a small amount of electrical current still flows.
Always unplug all power, and network cables from the power outlets before cleaning the system.
If you encounter the following technical problems with the product, unplug the power cord and contact a qualified service technician or your retailer.
The power cord or plug is damaged.  Liquid has been spilled into the system.  The system does not function properly even if you follow the operating
instructions.
The system was dropped or the cabinet is damaged.
Lithium-Ion Battery Warning
CAUTION: Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer. Dispose of used batteries according to the manufacturer’s instructions.
NO DISASSEMBLY
The warranty does not apply to the products that have been disassembled by users.
WARNING
HAZARDOUS MOVING PARTS
KEEP FINGERS AND OTHER BODY PARTS AWAY
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Acknowledgments
AMI is a registered trademark of AMI Software International, Inc.
AMD and ATI are registered trademarks of AMD Corporation.
Microsoft Windows is a registered trademark of Microsoft Corporation.
FINTEK is a registered trademark of FINTEK Electronics Corporation.
REALTEK is a regist ered trademark of REALTEK Electronics Corporation.
All other product names or trademarks are properties of their respective owners.
Copyright © 2013 IBASE Technology Inc. All Rights Reserved.
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IPPCxxA9-RE User Manual

CHAPTER 1 INTRODUCTION

1.1 General Description

IPPCxxA9-RE series is a fanless-design panel pc, powered by 2nd Generation
®
Intel
Core i3-2340UE 1.3GHz and supports 2x SO-DIMM to fit up to 16GB DDRIII 1333MHz FSB, 4x USB connectors, 3x COM ports, support 1x SATA HDD space, 1x CFast slot, 2x PCI expansion slots and DC power 12~24V input. It is ideal for industrial and factory automation applications.
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IPPCxxA9-RE User Manual
1x DVI-I connector
1x CFast slot
(W)x(D)x(H) mm
Temperature

1.2 System Specification

1.2.1 Hardware Specifications

Model Name IPPC17A9-RE IPPC19A9-RE System Mainboard IB907 CPU 2nd Generation Intel® Core TM i3-2340UE Chipset Intel® HM76 PCH Memory 2x DDR3 1333 SO-DI MM u p to 16GB I/O Interface
3x DB9 for COM1/2(RS-232/422/485), COM 3 (RS-232 only) 1x 10-pin terminal block for Digital I/O 2x RJ45 for GbE LAN 4x USB connector; USB1/2 USB2.0 only, USB3/4 USB3.0 1x Line-out micro jack 1x Mic-in micro jack
Storage CFast / HDD Expansion Slots 2x PCI slots Power Supply 12~24V Wide Range DC input LCD Size 17” TFT LCD 19” TFT LCD LCD Color 16.7M colors LCD Resolution 1280 x 1024 LCD Brightness 350 cd/m2 LCD Viewing Angle 170(H)/170(V) 170(H)/160(V) Backlight MTBF 50,000 hrs Touch Screen Resistive Touch Screen Construction Aluminum & SPCC Mounting VESA Mount 75x75 and 100x100 mm
Dimensions
Operating
Storage Temperature -20°C ~ 80°C
430 x 365 x 109.5 465 x 390 x 109.5
0°C ~ 45°C
Relative Humidity 5~90% @45°C (non-condensing) Protection Class IP65 (Front panel with wall mount)
This specification is subject to change without prior notice.
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1.2.2 Dimensions

IPPC17A9-RE
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IPPCxxA9-RE User Manual
IPPC19A9-RE
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1.2.3 I/O View

Copyright © 2013 IBASE Technology Inc. All Rights Reserved.
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IPPCxxA9-RE User Manual

1.3 Packing List

Part No. Description Quantity
1 Driver CD 1 pc 2 Mounting Kits 1 set
3 Power Cord 1 pc

1.4 Installation

1.4.1 Installing Memory

1. Unlock and remove 10 screws as in the picture below.
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2. After opening the back cover, please note the mating fan cable as shown.
3. Put the memory module into the socket.
Copyright © 2013 IBASE Technology Inc. All Rights Reserved.
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IPPCxxA9-RE User Manual
4. Place the memory module into the socket and press it firmly.

1.4.2 Installing Storage

1. Unlock and remove 10 screws as shown.
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2. Unlock and remove 4 screws and SATA connector as shown.
3. Remove the four screws if you want to remove and change the HDD with a different storage capacity.
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IPPCxxA9-RE User Manual

1.4.3 Installing CFast

1. Unlock and remove the screw as shown.
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1.4.4 Installing PCI slot

1. Unlock and remove the 2 screws from PCI slot cover.
2. Remove the PCI slot cover and PCI cover bracket from inside.
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IPPCxxA9-RE User Manual
3. Install the PCI card.
4. Put on the PCI cover bracket and lock the screw.
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1.4.5 Installing WIFI module

1. Push the WIFI module into the slot and use a screwdriver to turn the screw to its unlocked position.
Copyright © 2013 IBASE Technology Inc. All Rights Reserved.
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IPPCxxA9-RE User Manual
Specifications – Mainboard
Model
IB907
Form Factor
Customized
Intel i3-2340UE 1.3G 17W BGA type default L3 cache 3MB (default)
Last Level Cache
CPU integrated
CPU Socket
FCBGA1023 31mmx24mm
Chipset
Intel® HM76 PCH (TDP=3.9W) , 25mm x25mm, 989-pin FCBGA
BIOS
AMI BIOS, supports ACPI Function
Memory
DRAM:
Unbuffered, 1.5V
Battery: CR2450
DVI
DVI-I x1
LAN
Intel® 82579V GbE LAN as 1st LAN Realtek® 8111E (GbE) as 2nd LAN
Audio
Intel® HM76 PCH built-in HD Audio controller + Realtek ALC662 Codec

CHAPTER 2 MOTHERBOARD INTRODUCTION

2.1 Introduction

The IB907 motherboard is based on the latest Intel® HM76 chipset. The platform supports 3rd generation Intel® Core processor family with BGA1023 packing and feature an integrated dual-channel DDR3 memory controller as well as a graphics core.
The HM76 platform is made with 22 nanometer technology that supports Intel’s first processor architecture to unite the CPU and the graphics core on the transistor level. The IB907 Embedded Flex Motherboard is utilizes the dramatic increase in performance provided this Intel’s latest cutting-edge technology. Measuring 190mm x 110mm, IB907 offers fast 6Gbps SATA support (2 ports), USB3.0 (4 ports) and interfaces for, DVI-I and LVDS. It features Intel Active Management Tec hnology 8.0
CPU Type Supports Intel® Sandy-Bridge and Ivy-Bridge mobile processors.
Ivy Bridge supports DDR3-1600 SO-DIMM, Max. 16GB (None-ECC) Sandy Bridge supports DDR3-1333 SO-DIMM, Max.16GB (None-ECC) Default CPU supports DDR3-1333. Two DDR3-1600/1333 SO-DIMM sockets [horizontal type],
SRAM: CPLD EPM1270 + ST M40SZ100W x 4 SRAM 2Mb (via ITE IT8892)
LVDS 24-bit dual channels LVDS interface from HM76
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USB 2.0
Intel® HM76 integrated USB 2.0 host controller:
**Total 11 x USB 2.0 ports**
USB 3.0
Intel® HM76 integrated USB 3.0 host controller:
**Total 4 x USB 3.0 ports**
Serial AT A Ports
Intel® HM76 built-in SATA controller
SATA power on mainboard
LPC I / O
Fintek F81866AD-I
2x Voltage monitoring
Expansion Slot
- Mini PCI-e socket x 1, Full-sized type, reserved one mounting hole
- Mini PCI-e socket x 1,Full-sized type [USB device support]
Digital IO
4 in (TTL)& 4 out (open collector) 5Vcc 1A and Ground [@ terminal block 1x10 180D.] ECH350R-10P/EC350V-10P
CFast slot x 1
Onboard
2 ports x SATA III
1x3 box header for system fan
1. 4ports in the rear panel (2x USB2.0; 2x USB3.0)
2. 2 ports (USB3.0) via edge golden-finger for connector ID912
3. 2 ports via onboard Mini-PCIE
4. 2 ports via edge golden-finger for connecting with ID912
5. 1 port (with open collector) via edge golden-finger for connecting with IP931
1. 2 ports in the rear panel
2. 2 ports
Supports 2x SATAIII for HDD Supports 1x SATAII for mini PCIE and mSATA Supports 1x SATAII for CFast slot
- COM #1 (RS232/422/485 jumper-less) support ring-in with power
@500 mA (selectable for 5V or 12V)
- COM #2 (RS232/422/485 jumper-less) support ring-in with power
@500 mA (selectable for 5V or 12V)
- COM #3 (RS232 only)
- COM #4 (TTL for daughter board usage) thru golden finger to
expansion module
- COM #5(TTL for MCU usage) thru golden finger to expansion
module [ Hard ware Mon itor ] 2x Thermal inputs
for half-sized type, [USB device and mSATA support]
Edge Connector DIV-I connector x1
DB9 x 3 for COM1/2(RS-232/422/485) COM 3 (RS-232 only) 10pin terminal block for Digital I/O x1 RJ45 x2 for GbE LAN USB connector x 4; USB1/2 USB2.0 only; USB3/4 USB3.0 Line-out microjack x 1 Mic-in microjack x 1
Header/Connector
4 pins power connector x 2 for SATA HDD 2x5 pins pitch 2.0mm header x 1 for LPC (Debug purpose only) Mini PCI-e(1x) connector x 1 [Full-sized] Mini PCI-e(1x) connector x 1 [Full-sized] Box header 5pins for smart battery interface x 1 2x10-pin for 12V 5V 3.3V ATX power connector right angel type x 1 1x3 box header for CPU fan
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