HyperX HX426C16FB2-8 User Manual

Memory Module Specifications

HX426C16FB2/8

HX426C16FB2/

8GB 1G x 64-Bit

B 1G x 64-Bi

DDR4-2666 CL16 288-Pin DIMM

SPECIFICATIONS

DESCRIPTION

HyperX HX426C16FB2/8 is a 1G x 64-bit (8GB) DDR4-2666 CL16 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 1G x 8-bit FBGA components per module. Each module supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. Each module has been tested to run at DDR4-2666 at a low latency timing of 16-18-18 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:

Note: The PnP feature offers a range of speed and timing options to support the widest variety of processors and chipsets. Your maximum speed will be determined by your BIOS.

JEDEC/XMP TIMING PARAMETERS

• JEDEC/PnP: DDR4-2666 CL16-18-18 @1.2V

• XMP Profile #1: DDR4-2666 CL16-18-18 @1.2V

CL(IDD) Row Cycle Time (tRCmin) Refresh to Active/Refresh

Command Time (tRFCmin) Row Active Time (tRASmin) Maximum Operating Power UL Rating Operating Temperature Storage Temperature

*Power will vary depending on the SDRAM used.

16 cycles

45.75ns(min.) 350ns(min.)

29.25ns(min.) TBD W* 94 V - 0

C to +85o C

C to +100o C

-55

FEATURES

• Power Supply: VDD = 1.2V Typical

• VDDQ = 1.2V Typical

• VPP - 2.5V Typical

• VDDSPD = 2.2V to 3.6V

• Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

• Low-power auto self refresh (LPASR)

• Data bus inversion (DBI) for data bus

• On-die VREFDQ generation and calibration

• Single-rank

• On-board I2 serial presence-detect (SPD) EEPROM

• 16 internal banks; 4 groups of 4 banks each

• Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)

• Selectable BC4 or BL8 on-the-fly (OTF)

• Fly-by topology

• Terminated control command and address bus

• Height 1.340” (34.04mm), w/o heatsink

kingston.com/hyperx

hyperxgaming.com

Continued >>

Document No. 4808016-001.B00 03/16/17 Page 1

continued

MODULE WITH HEAT SPREADER

7.08 mm

133.35 mm

34.04 mm

MODULE DIMENSIONS

All measurements are in millimeters.

(Tolerances on all dimensions are ±0.12 unless otherwise specified)

133.35

129.55

2.10

±±0.15

3.00

Detail A

Pin 1

0.15

3.35

2.70

28.90

Detail B Detail D Detail C

Pin 35 Pin 47

64.60

Detail E

FOR MORE INFORMATION, GO TO HYPERXGAMING.COM

All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers

the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.

faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.

HyperX is a division of Kingston.

Pin 105 Pin 117

56.10

31.25

11.00

8.00

17.60

14.60

22.95

Document No. 4808016-001.B00 Page 2

hyperxgaming.com