HyperX HX424C15FR2K2-16 User Manual

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Memory Module Specifications

HX424C15FR2K2/16

HX424C15FR2K2/1

16GB (8GB 1G x 64-Bit x 2 pcs.)

16GB (8GB 1G x 64-Bit x 2 pcs.
DDR4-2400 CL15 288-Pin DIMM

SPECIFICATIONS

DESCRIPTION

HyperX HX424C15FR2K2/16 is a kit of two 1G x 64-bit (8GB)
DDR4-2400 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory
module, based on eight 1G x 8-bit FBGA components per module.
Each module kit supports Intel® Extreme Memory Profiles
(Intel® XMP) 2.0.
been tested to run at DDR4-2400 at a low latency timing of 15-15-15
at 1.2V.
Plug-N-Play (PnP) Timing Parameters section below. The
JEDEC standard electrical and mechanical specifications are
as follows:

Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.

Additional timing parameters are shown in the

Total kit capacity is 16GB. Each module has

JEDEC/XMP TIMING PARAMETERS

• JEDEC/PnP: DDR4-2400 CL15-15-15 @1.2V
DDR4-2133 CL14-14-14 @1.2V

•XMP Profile #1: DDR4-2400 CL15-15-15 @1.2V

CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh

Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature

*Power will vary depending on the SDRAM used.

15 cycles

45.25ns(min.)
350ns(min.)

29.125ns(min.)
TBD W*
94 V - 0

o

C to +85o C

0

o

C to +100o C

-55

FEATURES

• Power Supply: VDD = 1.2V Typical

• VDDQ = 1.2V Typical

• VPP - 2.5V Typical

• VDDSPD = 2.2V to 3.6V

• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals

• Low-power auto self refresh (LPASR)

• Data bus inversion (DBI) for data bus

• On-die VREFDQ generation and calibration

• Single-rank

• On-board I2 serial presence-detect (SPD) EEPROM

• 16 internal banks; 4 groups of 4 banks each

• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)

• Selectable BC4 or BL8 on-the-fly (OTF)

• Fly-by topology

• Terminated control command and address bus

• Height 1.340” (34.04mm), w/heatsink

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Document No. 4808076-001.A00 03/16/17 Page 1

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continued

MODULE WITH HEAT SPREADER

7.08 mm

133.35 mm

34.04 mm

MODULE DIMENSIONS

All measurements are in millimeters.

(Tolerances on all dimensions are ±0.12 unless otherwise specified)

133.35

129.55

2.10

±±0.15

3.00

Detail A

Pin 1

0.15

3.35

2.70

28.90

Detail B Detail D Detail C

Pin 35 Pin 47

64.60

Detail E

FOR MORE INFORMATION, GO TO HYPERXGAMING.COM

All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers

the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.

faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.

HyperX is a division of Kingston.

©2017 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA.
All rights reserved. All trademarks and registered trademarks are the property of their respective owners.

Pin 105 Pin 117

56.10

31.25

11.00

8.00

17.60

14.60

22.95

Document No. 4808076-001.A00 Page 2

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