HyperX HX318LC11FBK2-16 User Manual
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Memory Module Specifications
HX318LC11FBK2/16
HX318LC11FBK2/1
16GB (8GB 1G x 64-Bit x 2 pcs.)
16GB (8GB 1G x 64-Bit x 2 pcs.
DDR3L-1866 CL11 240-Pin DIMM Kit
SPECIFICATIONS
selcyc 01)DDI(LC
Row Cycle Time (tRCmin) 44.75ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 32.125ns (min.)
Maximum Operating Power TBD W*
0 - V 49gnitaR LU
Operating Temperature 0
Storage Temperature -55
*Power will vary depending on the SDRAM used.
o
C to 85o C
o
C to +100o C
DESCRIPTION
HyperX HX318LC11FBK2/16 is a kit of two 1G x 64-bit (8GB)
DDR3L-1866 CL11 SDRAM (Synchronous DRAM) 2Rx8, low
voltage, memory modules, based on sixteen 512M x 8-bit DDR3
FBGA components. Total kit capacity is 16GB. Each module kit
supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0.
This module has been tested to run at DDR3L-1866 at a low
latency timing of 11-11-11 at 1.35V. Additional timing parame-
ters are shown in the PnP Timing Parameters section below.
The JEDEC standard electrical and mechanical specifications
areas follows:
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
PnP JEDEC TIMING PARAMETERS:
• JEDEC/PnP: DDR3L-1866 CL11-11-11 @1.35V/1.5V
DDR3L-1600 CL10-10-10 @1.35V/1.5V
DDR3L-1333 CL8-8-8 @1.35V/1.5V
• XMP Profile #1: DDR3L-1866 CL11-11-11 @1.35V
FEATURES
• JEDEC standard 1.35V and 1.5V Power Supply
• VDDQ = 1.35V and 1.5V
• 933MHz fCK for 1866Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE ≤ 95°C
• Asynchronous Reset
• Height 1.291” (32.80mm) w/heatsink, single sided
component
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Document No. 4807386-001.A00 08/24/15 Page 1
continued
MODULE WITH HEAT SPREADER
MODULE DIMENSIONS
FOR MORE INFORMATION, GO TO HYPERXGAMING.COM
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
HyperX is a division of Kingston.
©2015 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA.
All rights reserved. All trademarks and registered trademarks are the property of their respective owners.
Document No. 4807386-001.A00 Page 2
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