hyperx HX318C9PB3K2-8 User Manual
8
8GB (4G
)
Memory Module Specifications
HX318C9PB3K2/8
HX318C9PB3K2/
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-1866 CL9 240-Pin DIMM Kit
B 512M x 64-Bit x 2 pcs.
-
-
SPECIFICATIONS
11 cycles)DDI(LC
Row Cycle Time (tRCmin) 48.125ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 35ns (min.)
Maximum Operating Power TBD W* (per module)
0 - V 49gnitaR LU
Operating Temperature 0
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.
o
C to 85o C
DESCRIPTION
HyperX HX318C9PB3K2/8 is a kit of two 512M x 64-bit (4GB)
DDR3-1866 CL9 SDRAM (Synchronous DRAM), 1Rx8
memory modules, based on eight 512M x 8-bit FBGA
components per module. Each module kit supports (Extreme
Intel XMP
module kit has been tested to run at DDR3-1866 at a low
latency timing of 9-10-11 at 1.5V. The SPDs are programmed
to JEDEC standard latency DDR3-1600 timing of 11-11-11 at
1.5V. Each 240-pin DIMM uses gold contact fingers. The
JEDEC standard electrical and mechanical specifications are
as follows:
® Memory Profiles). Total kit capacity is 8GB. Each
XMP TIMING PARAMETERS
• JEDEC: DDR3-1600 CL11-11-11 @1.5V
• XMP Profile #1: DDR3-1866 CL9-10-11 @1.5V
• XMP Profile #2: DDR3-1600 CL9-9-9 @1.5V
FEATURES
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11,10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE
< 95°C
• Asynchronous Reset
hyperxgaming.com
• Height 1.614” (41.00mm) w/heatsink, single sided
component
Continued >>
Document No. 4807769-001.A00 05/25/16 Page 1
continued
MODULE WITH HEAT SPREADER
8.3
41
133.35
MODULE DIMENSIONS
FOR MORE INFORMATION, GO TO HYPERXGAMING.COM
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
HyperX is a division of Kingston.
©2016 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA.
All rights reserved. All trademarks and registered trademarks are the property of their respective owners.
Document No. 4807769-001.A00 Page 2
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