HyperX HX318C10FBK2-16 User Manual
HX318C10FBK2/16
16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR3-1866 CL10 240-Pin DIMM Kit
SPECIFICATIONS
selcyc 01)DDI(LC
Row Cycle Time (tRCmin) 44.75ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 32.125ns (min.)
Maximum Operating Power TBD W* (per module)
0 - V 49gnitaR LU
Operating Temperature 0
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.
o
C to 85o C
DESCRIPTION
HyperX HX318C10FBK2/16 is a kit of two 1G x 64-bit (8GB)
DDR3-1866 CL10 SDRAM (Synchronous DRAM) 2Rx8 memory
modules, based on sixteen 512M x 8-bit DDR3 FBGA components per module. Total kit capacity is 16GB. Each module kit
has been tested to run at DDR3-1866 at a low latency timing of
10-11-10 at 1.5V. Additional timing parameters are shown in
the PnP Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
PnP JEDEC TIMING PARAMETERS:
• DDR3-1866 CL10-11-10 @1.5V
• DDR3-1600 CL9-10-9 @1.5V
• DDR3-1333 CL8-9-8 @1.5V
FEATURES
• JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 933MHz fCK for 1866Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE
< 95°C
kingston.com/hyperx
• Asynchronous Reset
•
Height 1.291” (32.80mm) w/heatsink, double sided
component
Document No. 4807024-001.B00 04/23/15 Page 1
Continued >>
continued HyperX
MODULE WITH HEAT SPREADER
7.08 mm
133.35 mm
32.8 mm
MODULE DIMENSIONS
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
kingston.com/hyperx
Document No. 4807024-001.B00 Page 2
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