HyperX HX316C10FB-4 User Manual
HX318C10FB/4
HX316C10FB/4
4GB 512M x 64-Bit DDR3-1600
CL10 240-Pin DIMM
SPECIFICATIONS
selcyc 01)DDI(LC
Row Cycle Time (tRCmin) 48.125ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 37.5ns (min.)
Maximum Operating Power TBD W*
0 - V 49gnitaR LU
Operating Temperature 0
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.
o
C to 85o C
DESCRIPTION
HyperX HX316C10FB/4 is a 512M x 64-bit (4GB) DDR3-1600
CL10 SDRAM (Synchronous DRAM) 1Rx8 memory module,
based on eight 512M x 8-bit DDR3 FBGA components. This
module has been tested to run at DDR3-1600 at a low latency
timing of 10-10-10 at 1.5V. Additional timing parameters are
shown in the PnP Timing Parameters section below. The
JEDEC standard electrical and mechanical specifications are
as follows:
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
PnP JEDEC TIMING PARAMETERS:
• DDR3-1600 CL10-10-10 @1.5V
• DDR3-1333 CL9-9-9 @1.5V
• DDR3-1066 CL7-7-7 @1.5V
FEATURES
• JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE
< 95°C
kingston.com/hyperx
• Asynchronous Reset
•
Height 1.291” (32.80mm) w/heatsink, single sided
component
Document No. 4807006-001.B00 04/23/15 Page 1
Continued >>
continued HyperX
MODULE WITH HEAT SPREADER
7.08 mm
133.35 mm
32.8 mm
MODULE DIMENSIONS
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
kingston.com/hyperx
Document No. 4807006-001.B00 Page 2
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